Method for carrying out automatic laser by combining information of PCB (Printed Circuit Board)

Abstract

The invention relates to a method for performing automatic laser in combination with PCB information. The method comprises the following steps: S1, inputting various data to which a product belongs; s2, whether identity information exists on the target PCB or not is judged, if yes, S3 is executed, and if not, the process is ended; s3, picking up identity information; s4, determining information of a product to which the PCB belongs; s5, judging whether the PCB is subjected to a laser process or not, if so, ending the process, and if not, entering S6; s6, executing a matched laser process by a laser servo system according to the information determined in the step S4, so as to form a groove meeting the required depth and contour in the corresponding position of the PCB through laser; and S7, finishing laser. The method has the advantages that the grooves are formed in the corresponding positions of the PCB in a laser mode, then specific glue is dispensed subsequently, the to-be-bonded parts are placed at the positions where the glue is dispensed, the corresponding parts are firmly coupled to the accurate positions through interaction, and compared with bonding on a smooth plane, falling off is better prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of product production, and in particular to a method for automatically lasering in combination with PCB board information. Background Art

[0002] PCB boards need to bond parts of different materials, such as plastic parts and metal parts. Various parts have different classifications. For example, metal parts are divided into various subdivisions such as aluminum, iron, copper, and precious metals. In order to make parts of different material properties bonded to the surface of the PCB board as much as possible, the method adopted is to apply a small amount of specific glue at the corresponding position of the PCB board, and then place the parts to be bonded at the glue-dotting position. Finally, wait for the glue to dry thoroughly. In theory, the parts are firmly bonded to the PCB board. However, in the corresponding experimental links, product transportation links and other scenarios, the corresponding parts may still fall off. At the same time, the chemical properties of the glue will change after it dries. If the parts fall off, the product will be scrapped, which restricts the actual application scenarios of the product and reduces the product's qualification rate. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method for automatic laser marking in combination with PCB board information to overcome the deficiencies in the above-mentioned prior art.

[0004] The technical solution of the present invention to solve the above technical problems is as follows: A method for automatic laser marking in combination with PCB board information comprises the following steps:

[0005] S1. The product information management system inputs various data belonging to various products, and the input data at least includes: PCB board identity information, required adhesive components of the PCB board, the shape of the contact surface between each required adhesive component and the PCB board, the position information of each required adhesive component on the PCB board, and the material information of each required adhesive component;

[0006] S2, determine whether the target PCB board has identity information, if yes, go to S3, if no, go to S7;

[0007] S3, picking up the identity information on the target PCB board, and querying the product information to which the PCB board belongs in the product information management system;

[0008] S4, determining the product information to which the PCB board belongs;

[0009] S5, judging whether the PCB board has been subjected to the laser process, if yes, then entering S7, if no, then entering S6;

[0010] S6, executing the matched laser process by the laser servo system according to the information determined in S4, so as to form a groove meeting the required depth and profile at the corresponding position of the PCB board by laser;

[0011] S7, laser ends.

[0012] Based on the above technical solution, the present invention can also be improved as follows.

[0013] Furthermore, the PCB board identity information is: Data Matri ix code.

[0014] Furthermore, the entered data also includes: PCB board size, number of PCB board layers, circuit routing distance between PCB board layers, PCB board material, PCB board process, component name, component origin, component electrical characteristic parameters, component packaging information, various component characteristic information, auxiliary material information required for different components, time when the component was entered into the product information management system, and component production batch number.

[0015] Further, in S2, the image information of the target PCB is first obtained, and then it is determined whether the target PCB has identity information according to the image information.

[0016] Furthermore, the identity information of the target PCB board is picked up according to the image information of the target PCB board.

[0017] Furthermore, an industrial camera is used to obtain the image information of the target PCB board.

[0018] Furthermore, in S5, a visual system is used to determine whether the PCB board has been subjected to the laser process.

[0019] Further, S6 specifically includes: interacting with the laser servo system, the laser servo system parses the corresponding laser information according to the information determined in S4, the laser servo system matches the corresponding parameters, and first performs laser process preparation, and then executes the matched laser process to form a groove that meets the required depth and contour at the corresponding position of the PCB board by laser.

[0020] Furthermore, the corresponding parameters include: laser power, laser time, laser trajectory and the height of the laser emission port from the PCB board.

[0021] The beneficial effects of the present invention are as follows: firstly, various data belonging to the product are summarized, and then the target PCB board is identified to determine the bonding components required for the PCB board, the shape of the contact surface between each required bonding component and the PCB board, the position information of each required bonding component on the PCB board, and the material information of each required bonding component; then, the laser servo system executes the matched laser process according to the determined information to form a groove meeting the required depth and contour at the corresponding position of the PCB board by laser, so as to realize automatic laser; then, a specific glue is applied, and the bonding components are placed at the glue application position, and the corresponding components are firmly coupled in the accurate position by means of interaction, which is more effective in preventing the components from falling off than bonding on a smooth plane, that is, the components will not fall off in the corresponding experimental links, the transportation links of the products, and other scenarios, thereby effectively improving the product qualification rate; at the same time, according to different laser purposes, the electrical coupling between the electronic circuit lines on the corresponding circuit layer of the PCB board and the corresponding pins of the electronic components can be improved to perform laser grooves of a certain depth. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The figure is a flow chart of the method for automatically laser marking in combination with PCB board information in the present invention. DETAILED DESCRIPTION

[0023] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0024] Example 1

[0025] like Figure 1 As shown, a method for automatic laser marking in combination with PCB board information includes the following steps:

[0026] S1. The product information management system enters various data belonging to various products. The entered data at least includes: PCB board identity information, required bonding components of the PCB board (each PCB board may be bonded with one or more different or the same components, so all the components required to be bonded to the PCB board must be recorded), the shape of the contact surface between each required bonding component and the PCB board (the shapes and sizes of the bonded components are different, so the shapes of the contact surfaces with the PCB board are different or the same, so the shapes of the contact surfaces between each required bonding component and the PCB board must be recorded), the position information of each required bonding component on the PCB board (for example, if different or the same components are bonded at multiple different positions on the PCB board, then the components to be bonded at each position must be recorded) and the material information of each required bonding component (for example: plastic parts, metal parts, metal parts are divided into aluminum, iron, copper, precious metals, etc.);

[0027] S2, for the target PCB board, determine whether the target PCB board has identity information, if yes, then enter S3, if not, because the information of the PCB board has not been entered into the product information management system, it is an unknown PCB board, and the subsequent process cannot match it, so enter S7;

[0028] S3, picking up the identity information on the target PCB board, and querying the product information to which the PCB board belongs in the product information management system;

[0029] S4. Determine the product information to which the PCB board belongs, such as: determine the adhesive components required for the PCB board, the shape of the contact surface between each required adhesive component and the PCB board, the position information of each required adhesive component on the PCB board, and the material information of each required adhesive component;

[0030] S5, judging whether the PCB board has been subjected to the laser process, if yes, since the PCB board has been subjected to the laser process, it is not necessary to repeat the process, then entering S7, if no, then entering S6;

[0031] S6. Based on the information determined in S4, the laser servo system executes the matched laser process (for different identified PCB boards, different bonding components are required, different shapes of the contact surface between the bonding components and the PCB board are required, different positions of each required bonding component on the PCB board, and different materials of each required bonding component. Therefore, a matched laser process should be designed for the identified PCB board) to form a groove with the required depth and profile at the corresponding position on the PCB board by laser. The so-called corresponding position refers to the position of each component to be bonded on the PCB board, and the groove with the required depth and profile formed by the laser process is obtained through experiments in advance according to the required bonding component, the shape of the contact surface between the required bonding component and the PCB board, and the material information of the required bonding component;

[0032] S7, laser ends.

[0033] The present invention first summarizes various data belonging to the product, and then identifies the target PCB board to determine the bonding components required for the PCB board, the shape of the contact surface between each required bonding component and the PCB board, the position information of each required bonding component on the PCB board, and the material information of each required bonding component. Then, the laser servo system executes the matched laser process according to the determined information to form a groove that meets the required depth and contour at the corresponding position of the PCB board by laser, so as to realize automatic laser. Subsequently, specific glue is applied, and the components to be bonded are placed at the glue point position. With the help of interaction, the corresponding components are firmly coupled in the accurate position. Compared with bonding on a smooth plane, it is more effective to prevent the components from falling off, that is, in the corresponding experimental links, the transportation links of the product and other scenarios, the components do not fall off, and the product qualification rate is effectively improved. At the same time, according to different laser purposes, the electrical coupling between the electronic circuit line on the corresponding circuit layer of the PCB board and the corresponding pins of the electronic components can be improved to perform laser grooves of a certain depth.

[0034] Example 2

[0035] like Figure 1 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0036] The identity information of the PCB board is: Data Matrix code. Of course, in the actual process, it does not rule out other sequences, marks, patterns, etc. that can identify the identity information.

[0037] Example 3

[0038] like Figure 1 As shown, this embodiment is a further improvement on the basis of Embodiment 1 or 2, and the details are as follows:

[0039] The data entered into the product information management system also includes: PCB board size, number of PCB board layers, distribution of circuit layers inside PCB board, circuit routing distance between PCB board layers, PCB board material, PCB board process, component name, component origin, component electrical characteristic parameters, component packaging information, various component characteristic information, auxiliary material information required for different components, time of component entry into the product information management system, component production batch number. Similarly, combined with the above data, such as: number of PCB board layers, circuit routing distance between PCB board layers, PCB board material, PCB board process, etc., the laser process can also be appropriately adjusted to form a groove with the required depth and contour at the corresponding position on the PCB board by laser. Among them, the internal circuit layer distribution of the PCB board and the circuit routing distance between PCB board layers also have a certain influence on the groove depth in the laser process.

[0040] Example 4

[0041] like Figure 1 As shown, this embodiment is a further improvement on any one of Embodiments 1 to 3, and the details are as follows:

[0042] In S2, the target PCB board image information is first obtained, and then it is determined whether the target PCB board has identity information according to the image information, and then the identity information on the target PCB board is picked up according to the target PCB board image information.

[0043] Going a step further: using industrial cameras to obtain target PCB board image information.

[0044] Example 5

[0045] like Figure 1 As shown, this embodiment is a further improvement on any one of Embodiments 1 to 4, and the details are as follows:

[0046] In S5, a visual system is used to determine whether the PCB board has undergone laser processing.

[0047] Example 6

[0048] like Figure 1 As shown, this embodiment is a further improvement on any one of Embodiments 1 to 5, and the details are as follows:

[0049] S6 specifically includes: interacting with the laser servo system, the laser servo system parses the corresponding laser information according to the information determined in S4, and then the laser servo system matches the corresponding parameters, performs laser process preparation first, and then executes the matched laser process to form a groove meeting the required depth and contour at the corresponding position of the PCB board by laser.

[0050] The corresponding parameters matched by the laser servo system include: laser power, laser time, laser trajectory and the height of the laser emission port from the PCB board.

[0051] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A method for automatic laser marking in combination with PCB board information, characterized in that: The steps include: S1. The product information management system inputs various data belonging to various products, and the input data at least includes: PCB board identity information, required adhesive components of the PCB board, the shape of the contact surface between each required adhesive component and the PCB board, the position information of each required adhesive component on the PCB board, and the material information of each required adhesive component; S2, determine whether the target PCB board has identity information, if yes, go to S3, if no, go to S7; S3, picking up the identity information on the target PCB board, and querying the product information to which the PCB board belongs in the product information management system; S4, determining the product information to which the PCB board belongs; S5, judging whether the PCB board has been subjected to the laser process, if yes, then entering S7, if no, then entering S6; S6, executing the matched laser process by the laser servo system according to the information determined in S4, so as to form a groove meeting the required depth and profile at the corresponding position of the PCB board by laser; S7, laser ends.

2. The method for automatic laser marking in combination with PCB board information according to claim 1, characterized in that: The PCB board identity information is: Data Matrix code.

3. A method for automatic laser marking in combination with PCB board information according to claim 1 or 2, characterized in that: The entered data also includes: PCB board size, number of PCB board layers, circuit routing distance between PCB board layers, PCB board material, PCB board process, component name, component origin, component electrical characteristic parameters, component packaging information, various component characteristic information, auxiliary material information required for different components, component entry time into the product information management system, and component production batch number.

4. A method for automatic laser marking in combination with PCB board information according to claim 1, 2 or 3, characterized in that: In S2, the target PCB board image information is first obtained, and then it is determined whether the target PCB board has identity information according to the image information.

5. The method for automatic laser marking in combination with PCB board information according to claim 4, characterized in that: The identity information on the target PCB is picked up according to the image information of the target PCB.

6. The method for automatic laser marking in combination with PCB board information according to claim 4, characterized in that: An industrial camera is used to obtain the image information of the target PCB board.

7. The method for automatic laser marking in combination with PCB board information according to claim 1, characterized in that: In S5, a visual system is used to determine whether the PCB board has undergone laser processing.

8. The method for automatic laser marking in combination with PCB board information according to claim 1, characterized in that: S6 specifically includes: interacting with the laser servo system, the laser servo system parses the corresponding laser information according to the information determined in S4, and then the laser servo system matches the corresponding parameters, performs laser process preparation first, and then executes the matched laser process to form a groove meeting the required depth and contour at the corresponding position of the PCB board by laser.

9. The method for automatic laser marking in combination with PCB board information according to claim 8, characterized in that: The corresponding parameters include: laser power, laser time, laser trajectory and the height of the laser emission port from the PCB board.

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