Processing method of glass panel for touch screen and touch screen

Abstract

The embodiment of the invention provides a processing method of a glass panel for a touch screen and the touch screen. The processing method of the glass panel for the touch screen comprises the following steps: providing a glass substrate and an etching solution; the glass substrate comprises an opening area, and laser irradiation is carried out on the opening area of the glass substrate; the glass substrate is placed in the etching liquid to be soaked, the part, located in the hole opening area, of the glass substrate is etched away through the etching liquid, and the glass panel for the touch screen is obtained. According to the processing method of the glass panel for the touch screen and the touch screen provided by the embodiment of the invention, a traditional numerical control lathe physical cutting method is replaced by a chemical etching method, and higher precision and smaller feature size can be realized by chemical etching; the CNC cutting may cause micro-cracks or fragmentation on the edge of the hole, and the chemical etching can significantly reduce the micro-cracks on the edge of the hole due to the non-contact processing mode, thereby improving the strength and reliability of the glass.

Description

Technical Field

[0001] The present application belongs to the technical field of panel processing, and in particular, relates to a processing method of a glass panel for a touch screen and a touch screen. Background Art

[0002] With the rapid development of information technology and flat display technology, touch screens have become a symbol of the progress of the times and have been continuously introduced into all walks of life and thousands of households, such as business inquiry machines in telecommunications bureaus, tax bureaus, banks, power departments, industrial control, military command, electronic games, ordering food and songs, multimedia teaching and other touch screen display interfaces. Smart phones, tablet computers and other electronic products that can be seen everywhere in the streets and alleys have occupied most of the touch screen market share. The huge demand for touch screen products from consumers and the technological progress of the industry are driving the continuous development of touch screens.

[0003] Currently, holes in the glass panel of the touch screen are drilled by physical grinding using a CNC machine. Since the high-speed rotation of the drill will cause swings, the smaller the drill, the greater the swing amplitude, so the minimum hole that can be drilled is only φ0.8mm. In addition, the use of this physical grinding method will also cause micro cracks on the edge of the hole, which reduces the strength of the glass panel and makes the glass panel easy to break. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a method for processing a glass panel for a touch screen and a touch screen to solve the technical problem that the strength of the glass panel is reduced due to the existing hole-opening method.

[0005] In a first aspect, an embodiment of the present application provides a method for processing a glass panel for a touch screen, comprising the following steps:

[0006] Provide glass substrate and etching solution;

[0007] The glass substrate comprises an opening area, and the opening area of ​​the glass substrate is irradiated with laser;

[0008] The glass substrate is immersed in the etching solution, and the glass substrate located in the opening area is etched away by the etching solution to obtain the glass panel for the touch screen.

[0009] In some embodiments, the etching solution includes the following raw materials in parts by weight:

[0010] 10-20 parts of hydrofluoric acid;

[0011] 20-30 parts of concentrated sulfuric acid;

[0012] 10-20 parts of potassium fluoride;

[0013] 5-15 parts of active agent;

[0014] 30-40 parts of pure water.

[0015] In some embodiments, the active agent includes oxalic acid, glycerol, and a defoaming agent, and the weight ratio of the oxalic acid: the glycerol: the defoaming agent is 1:1:(1-2).

[0016] In some embodiments, the glass substrate further includes a non-perforated area, and a protective layer is disposed in the non-perforated area of ​​the glass substrate to prevent the laser from irradiating the glass substrate in the non-perforated area.

[0017] In some embodiments, the forming of the open area comprises:

[0018] A protective layer is disposed on both sides of the entire glass substrate, and a hole is opened in the protective layer to allow the glass substrate to leak out, thereby forming the opening area.

[0019] In some embodiments, the step of immersing the glass substrate in the etching solution further comprises:

[0020] Gas is introduced into the etching solution to generate bubbles to accelerate the etching process.

[0021] In some embodiments, the laser irradiation conditions include:

[0022] Using picosecond laser;

[0023] Laser energy is 5W~15w;

[0024] The spot size is 0.1mm~0.3mm;

[0025] The laser irradiation time is 10 seconds to 40 seconds.

[0026] In some embodiments, the glass substrate is immersed in the etching solution for a period of 15 minutes to 60 minutes.

[0027] In some embodiments, the processing method further comprises:

[0028] Cleaning the obtained glass panel with an alkaline cleaning agent;

[0029] Use CNC milling to remove burrs around the glass panel.

[0030] In a second aspect, an embodiment of the present application provides a touch screen, comprising a glass panel manufactured by the processing method described in the first aspect, a touch sensor, and a display module, wherein the touch sensor is arranged on one side of the display module, and the glass panel is arranged on a side of the touch sensor away from the display module.

[0031] The touch screen panel opening process and touch screen provided in the embodiment of the present application adopt a chemical etching method. Compared with the CNC physical cutting method in the prior art, the processing method of the present application has higher precision: chemical etching can achieve higher precision and smaller feature sizes, especially when it is necessary to manufacture small holes smaller than φ0.8mm; better edge quality: CNC cutting may cause microcracks or breakage at the edge of the hole, while chemical etching, as a non-contact processing method, can significantly reduce the microcracks at the edge of the hole, thereby improving the strength and reliability of the glass; less stress influence: the mechanical stress generated during CNC cutting may cause the glass to deform or break, while chemical etching will not introduce additional mechanical stress; high cost-effectiveness: in mass production, chemical etching is more cost-effective because once a suitable process flow is established , a large number of workpieces can be processed quickly and economically; reduce material waste: chemical etching can more finely control the amount of material removed, thereby reducing material loss and improving material utilization; strong flexibility: the chemical etching method can flexibly adjust the etching depth and width, and it is easy to modify the design without changing tools; high degree of automation: the chemical etching process is easy to realize automatic control, reducing the possibility of human error and improving production efficiency; suitable for complex geometric shapes: for complex geometric shapes or non-straight edges, chemical etching is easier to achieve than CNC cutting; reduce noise pollution: compared with the noise generated by CNC cutting, the chemical etching process is quieter, reducing noise pollution in the working environment; good surface finish: chemical etching can obtain better surface finish, which is especially important for touch screens with high optical performance requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 This is a schematic diagram of the process of the processing method of the glass panel for the touch screen provided in the embodiment of the present application. Figure 1 ;

[0034] Figure 2 This is a schematic diagram of the process of the processing method of the glass panel for the touch screen provided in the embodiment of the present application. Figure 2 ;

[0035] Figure 3 is a schematic structural diagram of an opening obtained by using the processing method for a glass panel for a touch screen provided in an embodiment of the present application;

[0036] Figure 4This is a schematic diagram of the structure of the opening obtained in Comparative Example 1;

[0037] Figure 5 This is a schematic diagram of the structure of the opening obtained in Comparative Example 2;

[0038] Figure 6 This is a schematic diagram of the structure of the opening obtained in Example 3. DETAILED DESCRIPTION

[0039] In the following description, specific details such as specific system structures, technologies, etc. are proposed for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the embodiments of the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from hindering the description of the embodiments of the present application.

[0040] It should also be understood that the term “and / or” used in the description of the embodiments of the present application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0042] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0043] In addition, in the description of the embodiments of the present application and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0044] References to "some embodiments" or "some embodiments" etc. described in the specification of the embodiments of the present application mean that one or more embodiments of the embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Thus, the statements "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in the different parts of this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. "Multiple" refers to two or more.

[0045] Touch screen panels are one of the common input devices in modern electronic devices, which allow users to interact directly with the graphical interface on the screen. The structure of the touch screen panel varies according to different technologies and designs, but in general, a typical touch screen usually includes: glass substrate, touch sensor, controller circuit, display module, adhesive layer, backlight unit and frame;

[0046] The glass substrate is a layer of transparent tempered glass located on the outermost layer of the touch screen, which plays a protective role and provides users with a hard and smooth operating surface;

[0047] Touch sensors are usually thin layers of transparent conductive material that detect user touch operations. Common technologies include resistive, capacitive, infrared, surface acoustic wave, etc. Among them, capacitive touch screens are one of the most common types. They use indium tin oxide or other conductive materials to form a grid or pattern, which changes the capacitance value of the area when a finger touches it;

[0048] The controller circuit is responsible for reading the data from the touch sensor and converting this information into digital signals to send to the device's main processor;

[0049] The display module can be a liquid crystal display, an organic light-emitting diode, or other types of displays. There are two ways to integrate the touch screen with the display module: one is to attach the touch sensor directly on top of the display; the other is to integrate the touch function inside the display;

[0050] The adhesive layer is used to tightly bond the touch sensor layer to the display module or other layers to ensure the overall stability and durability of the touch screen;

[0051] Backlight unit, which is necessary for non-self-emissive display technologies (such as LCDs) and provides light to make the screen readable in a variety of lighting conditions;

[0052] The frame is not only used to fix the position of the touch screen assembly, but also serves to enhance the overall structural strength of the screen.

[0053] Of course, different touch screen technologies may have different structural compositions. For example, some high-end devices may use more advanced materials and technologies to improve touch response speed, durability and visual effects. In addition, as technology advances, more and more devices are beginning to adopt so-called "in-cell" or "on-cell" technologies, which integrate touch functions directly into the display panel to reduce thickness and increase light transmittance.

[0054] In the prior art, display devices such as mobile phones and tablets need to make a hole in the glass substrate of the touch screen to expose the front camera, which is also called a water drop screen design. Currently, most of the hole making methods are through CNC physical cutting, which has the following disadvantages:

[0055] One is that the aperture is limited: physical cutting is usually limited by the tool diameter, so it is impossible to make very small apertures. As mentioned earlier, the smallest aperture can only be around φ0.8mm.

[0056] The second is that the hole wall quality is not high: the high-speed rotating tool may cause the hole wall to be rough, or even produce microcracks or debris, reducing the smoothness and integrity of the hole wall.

[0057] The third is stress concentration: the mechanical stress generated during the physical cutting process may be concentrated on the edge of the hole, causing the edge of the glass to crack or break easily, thus affecting the overall strength of the glass.

[0058] Fourth, processing speed: Due to the need to precisely control the tool path, CNC cutting is relatively slow, especially when multiple holes need to be processed, the production efficiency is low.

[0059] The fifth is tool wear and material loss: after long-term use, the cutting tool will need to be replaced regularly due to wear, which increases maintenance costs and downtime; during the cutting process, more glass fragments or dust may be generated, resulting in material waste.

[0060] Sixth, noise pollution: the interaction between high-speed rotating tools and glass will produce higher noise levels, causing interference to the working environment.

[0061] Seventh, flexibility is limited: changing the design or size of the hole usually requires reprogramming or replacing the tool, which is not as flexible as chemical etching.

[0062] Eighth, the scope of application is not wide enough: CNC cutting may encounter more difficulties for very hard or brittle glass materials because these materials are more likely to break during the physical cutting process.

[0063] Finally, the energy consumption is high: the physical cutting process usually requires a large amount of electricity consumption to drive the CNC machine tool and cooling system. In comparison, chemical etching may consume less energy.

[0064] Based on this, the processing method of the glass panel for the touch screen provided in the embodiment of the present application solves the above-mentioned disadvantages by replacing the chemical etching method, and the minimum hole diameter can be φ0.1mm, and there are no fine cracks on the edge of the hole, and the overall strength of the glass will not be reduced.

[0065] CNC, namely (Computerized Numerical Control, CNC lathe);

[0066] CF, namely (Color Filter Substrate);

[0067] TFT, that is (Thin Film Transistor, thin film field effect transistor).

[0068] In a first aspect, the present application provides a method for processing a glass panel for a touch screen. Figure 1 As shown, the processing method of the glass panel for a touch screen includes the following steps:

[0069] S10, providing a glass substrate and an etching solution;

[0070] S20, the glass substrate includes an opening area, and the opening area of ​​the glass substrate is irradiated with a laser;

[0071] S30, immersing the glass substrate in an etching solution, and etching away the glass substrate in the opening area by the etching solution to obtain a glass panel for a touch screen.

[0072] The processing method of the glass panel for touch screen provided in the embodiment of the present application adopts the chemical etching method. Compared with the CNC physical cutting method in the prior art, the processing method of the present application has higher precision: chemical etching can achieve higher precision and finer feature size, especially when it is necessary to manufacture small holes smaller than φ0.8mm; better edge quality: CNC cutting may cause microcracks or breakage at the edge of the hole, while chemical etching can significantly reduce the microcracks at the edge of the hole due to its non-contact processing method, thereby improving the strength and reliability of the glass; less stress influence: the mechanical stress generated during CNC cutting may cause the glass to deform or break, while chemical etching will not introduce additional mechanical stress; high cost-effectiveness: in mass production, chemical etching is more cost-effective because once a suitable process flow is established , a large number of workpieces can be processed quickly and economically; reduce material waste: chemical etching can more finely control the amount of material removed, thereby reducing material loss and improving material utilization; strong flexibility: the chemical etching method can flexibly adjust the etching depth and width, and it is easy to modify the design without changing tools; high degree of automation: the chemical etching process is easy to realize automatic control, reducing the possibility of human error and improving production efficiency; suitable for complex geometric shapes: for complex geometric shapes or non-straight edges, chemical etching is easier to achieve than CNC cutting; reduce noise pollution: compared with the noise generated by CNC cutting, the chemical etching process is quieter, reducing noise pollution in the working environment; good surface finish: chemical etching can obtain better surface finish, which is especially important for touch screens with high optical performance requirements.

[0073] In step S10, the glass substrate mentioned above can be a touch screen, or a CF substrate, a TFT substrate, and the material of the glass substrate includes but is not limited to soda-lime-silicon glass, borosilicate glass, aluminosilicate glass, chemically strengthened glass, conductive glass, etc.

[0074] Soda-lime-silica glass, which is the most common glass substrate, is low-cost and easy to process. It is often used in construction, packaging containers and other fields. However, in the field of electronic display screens, soda-lime-silica glass is usually used in low-end products because it may contain more alkali metal ions, which can easily migrate to the surface at high temperatures and affect the display effect. Borosilicate glass: It has high thermal stability, chemical corrosion resistance and low thermal expansion coefficient. It is suitable for applications that need to withstand high temperatures or chemical erosion, such as laboratory utensils, cookware, solar panels, etc. Aluminosilicate glass: It contains aluminum components and has very good mechanical strength, heat resistance and scratch resistance. It is often used in high-end displays, touch screen panels, car windshields, etc.

[0075] Chemically strengthened glass: By subjecting the glass surface to ion exchange treatment, its impact and scratch resistance are enhanced. This type of glass is commonly used in portable electronic devices such as mobile phone screens and tablets.

[0076] Conductive glass: Conductive materials (such as ITO, IZO, etc.) are coated on the surface of the glass to make it conductive. This type of glass is commonly used in electronic products such as liquid crystal displays (LCDs) and touch screens.

[0077] In some embodiments, in step S10, the etching solution includes the following raw materials in parts by weight:

[0078] 10-20 parts of hydrofluoric acid;

[0079] 20-30 parts of concentrated sulfuric acid;

[0080] 10-20 parts of potassium fluoride;

[0081] 5-15 parts of active agent;

[0082] 30-40 parts of pure water.

[0083] In application, hydrofluoric acid is one of the main components of etching solution, which can react with silicon dioxide in glass to dissolve glass. The concentration of hydrofluoric acid directly affects the etching rate and effect, so the embodiment of the present application controls its content between 10% and 20%, which is conducive to improving the etching efficiency and effect. Concentrated sulfuric acid mainly acts as a catalyst here to promote the etching reaction, and also helps to maintain the pH value of the solution and prevent too fast neutralization reaction. The mass percentage of concentrated sulfuric acid is greater than or equal to 97%. Potassium fluoride can increase the etching ability of the etching solution, help form a stable fluorosilicate complex, and improve etching efficiency. The activator can improve the wettability of the etching solution, ensure that the etching solution is evenly distributed on the glass surface, and help remove the precipitate generated during the etching process. Pure water is used to dilute the above chemical components to ensure that the concentration of the etching solution is moderate, and also serves as a solvent.

[0084] In a preferred embodiment, the etching solution comprises the following raw materials in parts by weight:

[0085] 15 parts of hydrofluoric acid; 25 parts of concentrated sulfuric acid; 15 parts of potassium fluoride; 10 parts of activator; 35 parts of pure water.

[0086] In the application, the weight ratio of hydrofluoric acid: concentrated sulfuric acid (concentration ≥ 97%): potassium fluoride: activator: pure water is 0.15: 0.25: 0.15: 0.10: 0.35. The etching solution prepared in the above ratio has the best etching effect.

[0087] In some embodiments, the active agent includes oxalic acid, glycerol and a defoamer, and the weight ratio of the oxalic acid: the glycerol: the defoamer is 1:1:(1-2). In a preferred embodiment, the weight ratio of the oxalic acid: the glycerol: the defoamer is 2:2:3. The benefit of using an active agent is to improve etching efficiency: by optimizing the wettability and viscosity of the etching solution, the active agent can improve the etching rate and consistency; reduce defects: by removing impurities and controlling foam, the active agent helps to reduce defects that may occur during the etching process. Extend the life of the etching solution: by maintaining the cleanliness and stability of the etching solution, the active agent can extend the effective service life of the etching solution.

[0088] In application, oxalic acid is an organic acid with strong reducing properties. In etching solution, oxalic acid can help remove metal ions and other impurities and keep the etching solution clean. Oxalic acid can also play a certain buffering role and adjust the pH value of the solution. Glycerin is a polyol, which is often used as a solvent and plasticizer. In etching solution, glycerin can increase the viscosity of the solution, which helps the etching solution to better adhere to the glass surface, thereby improving the etching effect. Glycerin also helps to improve the wettability of the etching solution and ensure that the etching solution is evenly distributed. Defoamers are used to eliminate foam generated during the etching process, which may affect the uniformity and efficiency of etching. Defoamers are usually composed of silicone oil or other surfactants, which can reduce the surface tension of the liquid and inhibit the formation of foam.

[0089] In step S20, the glass substrate includes an opening area, and the opening area of ​​the glass substrate is irradiated with laser. The conditions of the laser irradiation include:

[0090] Using picosecond laser;

[0091] Laser energy is 5W~15w;

[0092] The spot size is 0.1mm~0.3mm;

[0093] The laser irradiation time is 10 seconds to 40 seconds.

[0094] In applications, the use of picosecond lasers for precision processing on glass substrates, especially for opening holes, is an efficient and precise method. The advantage of choosing a picosecond laser as a laser type is that the pulse duration is short. Specifically, the pulse duration of a picosecond (ps) laser is very short, usually in the range of 10^-12 seconds. This short pulse can reduce the thermal impact on the material, thereby improving processing accuracy and edge quality. Compared with nanosecond lasers, picosecond lasers can generate less heat accumulation on the material surface, so they are particularly suitable for precision processing of heat-sensitive materials, such as glass.

[0095] The energy density of the laser determines the degree to which the material absorbs the energy. In the range of 5W to 15W, the energy output of the laser can be adjusted according to actual needs to achieve the desired etching depth and speed. Adjustment range: lower energy is suitable for fine processing, while higher energy can speed up the processing, but it needs to be carefully controlled to avoid material damage caused by overheating.

[0096] The spot size determines the diameter of the processing area. A smaller spot means higher focusing accuracy and is more suitable for processing tiny apertures. Adjustment range: A 0.1mm spot is suitable for very fine processing, while a 0.3mm spot can handle slightly larger apertures or wider lines.

[0097] Adjust the exposure time according to the desired processing depth and hole size. Shorter times are suitable for shallow etching or small hole processing, while longer times are suitable for deeper or larger holes.

[0098] In some embodiments, the glass substrate further includes a non-perforated area, and a protective layer is disposed in the non-perforated area of ​​the glass substrate to prevent the laser from irradiating the glass substrate in the non-perforated area. In applications, the protective layer is formed by photoresist, and there is no restriction on the type of photoresist, as long as it is resistant to acid corrosion (i.e., it will not be corroded by etching solution), thereby protecting the part of the glass substrate that does not need to be perforated from being damaged, thereby ensuring the integrity of the glass substrate.

[0099] In some embodiments, forming the open area includes:

[0100] A protective layer is provided on both sides of the entire glass substrate, and a hole is opened in the protective layer to allow the glass substrate to leak out, thereby forming an opening area. In another embodiment, by reserving an area where a hole is required on both sides of the glass substrate, no photoresist is provided, and photoresist is provided at other positions to form a protective layer, thereby ultimately forming an opening area without a protective layer and a non-opening area covered with a protective layer.

[0101] In step S30, the glass substrate is immersed in the etching solution, wherein the immersion time is 15 minutes to 60 minutes. In some embodiments, the immersion time can be any time within the range of 15 minutes to 60 minutes, such as 15 minutes, 20 minutes, 25 minutes, 30 minutes, 35 minutes, 40 minutes, 45 minutes, 50 minutes, 55 minutes, 60 minutes, etc. Influence of immersion time, etching depth: Longer immersion time usually leads to deeper etching depth. If deeper holes are required, a longer immersion time can be selected. Shorter immersion time is suitable for situations where a shallower etching depth is required. Etching uniformity: Long immersion may result in uneven etching, especially in the absence of good stirring or circulation. Therefore, when immersing for a long time, it is necessary to ensure uniform distribution of the etching solution. Edge quality: Too long immersion time may cause over-etching or irregularities at the edge of the hole, affecting the quality of the final product.

[0102] In some embodiments, before step S30, the glass substrate is further pre-treated, and the pre-treatment includes cleaning to ensure that the glass substrate is clean when immersed in the etching solution, thereby ensuring normal etching.

[0103] In some embodiments, in step S30, the glass substrate is immersed in an etching solution, and further includes:

[0104] Gas is introduced into the etching liquid to generate bubbles to accelerate the etching process. In applications, the gas introduced into the etching liquid is usually compressed gas to generate bubbles on the surface of the glass substrate to accelerate the etching process and ensure that the etching liquid acts evenly on the glass surface.

[0105] In application, bubbling is mainly done by introducing gas (usually air or inert gas such as nitrogen) into the etching solution to generate bubbles in the etching solution. The formation and movement of these bubbles will have many effects on the etching process:

[0106] Bubble formation: When gas is introduced into a liquid, bubbles are formed inside the liquid. The size of the bubbles depends on factors such as the pressure of the gas, the viscosity of the liquid, and the aeration rate.

[0107] Bubble Rise: Since bubbles are less dense than liquid, the bubbles that form rise and escape through the surface of the liquid. During the rise, the bubbles create disturbances in the surrounding liquid.

[0108] Convection effect: The rising of bubbles drives the flow of etching solution, forming a convection effect. This convection can promote the fresh supply of etching solution and reduce the accumulation of chemical products in the etching area.

[0109] The effects of bubbling include: the rise of bubbles drives the flow of etching solution, promotes the delivery of new etching solution to the area to be etched, and thus accelerates the etching rate. Bubbling can effectively reduce the accumulation of chemical products produced during the etching process in the area to be etched, and avoid the decrease in etching rate caused by product accumulation. The disturbance of bubbles helps the etching solution to be evenly distributed on the surface to be etched, thereby improving the uniformity of etching. The presence of bubbles enhances the mass transfer process in the etching solution, that is, the diffusion rate of the etchant from the solution to the glass surface is accelerated, thereby improving the etching efficiency. During the etching process, bubbles can also help take away by-products produced during the etching process, such as dissolved glass fragments, etc., reducing their impact on subsequent etching. Bubbling can prevent over-etching in local areas due to lack of fresh etching solution, thereby ensuring etching quality.

[0110] In some embodiments, Figure 2 As shown, the processing method of the glass panel for a touch screen also includes:

[0111] S40, cleaning the obtained glass panel with an alkaline cleaning agent;

[0112] S50, CNC milling is used around the glass panel to remove burrs.

[0113] In the application, in step S40, the main purpose of alkaline cleaning is to remove residues. After chemical etching, etching solution, etching products and other contaminants may remain on the glass panel. Alkaline cleaning agents can help remove these residues. In addition, the surface of the glass panel can be activated. Alkaline cleaning agents can activate the glass surface and improve its cleanliness to prepare for subsequent processes. It also plays a role in preventing corrosion. Proper cleaning can prevent residual chemicals from continuing to corrode the glass surface.

[0114] Typical alkaline cleaning agents include: sodium hydroxide, which is often used as a glass cleaning agent and can effectively remove grease and organic pollutants. Sodium carbonate also has good cleaning effects, especially in removing mineral deposits.

[0115] In the application, in step S40, CNC grinding removes burrs. During the cutting or etching process of the glass panel, burrs or irregular edges may be generated on the edge. CNC grinding can remove these burrs and make the edge smooth. Improve the surface quality. CNC grinding can improve the surface quality of the edge of the glass panel and make it look more beautiful. Enhance durability. By removing burrs and irregular edges, damage caused by edge problems during the use of the glass panel can be reduced.

[0116] In some embodiments of the present application, Figure 3As shown, the openings etched by the above processing method have a uniformity that meets the requirements. Compared with Comparative Examples 1 to 3, Figures 4 to 6 As shown, Figure 4 The schematic diagram of the opening is that no active agent is added, or the ratio of the active agent is less than that of the embodiment of the present application; Figure 5 It is a schematic diagram of the opening in which the ratio of concentrated sulfuric acid is reduced compared with the embodiment of the present application, Figure 6 This is a schematic diagram of other components with different ratios from the scope of the embodiment of the present application after the holes are opened. Figures 3 to 6 It can be seen that by adopting the etching solution formula and processing method provided in the embodiment of the present application, the aperture of the final opening obtained is uniform. However, if the etching solution formula is different from that in the embodiment of the present application, the aperture in the middle of the hole will be smaller than that at both ends, resulting in poor uniformity and unable to meet the requirements of glass panels for touch screens.

[0117] An embodiment of the present application also provides a touch screen (not shown in the figure), which includes a glass panel manufactured by the processing method of the first aspect, a touch sensor and a display module, wherein the touch sensor is arranged on one side of the display module, and the glass panel is arranged on a side of the touch sensor away from the display module.

[0118] The touch screen provided in the embodiment of the present application has all the beneficial effects described in the first aspect. Because of this, the touch screen provided in the present application effectively reduces production costs, improves brand reputation, and is conducive to increasing promotion and application.

[0119] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0120] The above-described embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application are described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the embodiments of the present application, and should all be included in the protection scope of the embodiments of the present application.

Claims

1. A method for processing a glass panel for a touch screen, characterized in that: The following steps are involved: Provide glass substrate and etching solution; The glass substrate comprises an opening area, and the opening area of ​​the glass substrate is irradiated with laser; The glass substrate is immersed in the etching solution, and the glass substrate located in the opening area is etched away by the etching solution to obtain the glass panel for the touch screen.

2. The processing method according to claim 1, characterized in that: The etching solution comprises the following raw materials in parts by weight: 10-20 parts of hydrofluoric acid; 20-30 parts of concentrated sulfuric acid; 10-20 parts of potassium fluoride; 5-15 parts of active agent; 30-40 parts of pure water.

3. The processing method according to claim 2, characterized in that: The active agent includes oxalic acid, glycerin and a defoaming agent, and the weight ratio of the oxalic acid: the glycerin: the defoaming agent is 1:1:(1-2).

4. The processing method according to claim 1, characterized in that: The glass substrate further includes a non-perforated area, and a protective layer is arranged in the non-perforated area of ​​the glass substrate to prevent the laser from irradiating the glass substrate in the non-perforated area.

5. The processing method according to claim 1, characterized in that: The formation of the open area comprises: A protective layer is disposed on both sides of the entire glass substrate, and a hole is opened in the protective layer to allow the glass substrate to leak out, thereby forming the opening area.

6. The processing method according to claim 1, characterized in that: The step of placing the glass substrate in the etching solution and immersing the glass substrate in the etching solution further comprises: Gas is introduced into the etching solution to generate bubbles to accelerate the etching process.

7. The processing method according to claim 1, characterized in that: The conditions of the laser irradiation include: Using picosecond laser; Laser energy is 5W~15w; The spot size is 0.1mm~0.3mm; The laser irradiation time is 10 seconds to 40 seconds.

8. The processing method according to any one of claims 1 to 7, characterized in that: The glass substrate is immersed in the etching solution for 15 minutes to 60 minutes.

9. The processing method according to claim 1, characterized in that: The processing method also includes: Cleaning the obtained glass panel with an alkaline cleaning agent; Use CNC milling to remove burrs around the glass panel.

10. A touch screen, characterized in that: It comprises a glass panel, a touch sensor and a display module manufactured by the processing method according to any one of claims 1 to 9, wherein the touch sensor is arranged on one side of the display module, and the glass panel is arranged on a side of the touch sensor away from the display module.

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