Chip-level super-hydrophobic nano insulating protective coating and preparation method thereof

Abstract

The invention provides a chip-level super-hydrophobic nano insulating protective coating and a preparation method thereof, the water contact angle of the super-hydrophobic insulating protective coating is greater than 150 degrees, and the super-hydrophobic insulating protective coating comprises the following components by mass: 0.1%-1% of a fluorine-containing polymer, 0.5%-1% of a nano filler, 13%-18% of ethanol, and the balance of a fluorocarbon solvent; wherein the nano filler is nano aluminum oxide or hydroxyl boron nitride which is subjected to surface chemical modification through fluorine-containing carboxylic acid or a fluorine-containing silane coupling agent. By adding the modified nano filler, the nano coating formed by spraying has high hydrophobicity, insulativity and wear resistance, and after the spraying process is completed, a film can be rapidly formed without subsequent treatment such as heating.

Description

Technical Field

[0001] The present application relates to the field of chemical technology, and in particular to a chip-level super-hydrophobic nano-insulating protective coating and a preparation method thereof. Background Art

[0002] Nowadays, portable electronic devices, precision instruments, metal plastics, and functional glass are increasingly used in daily life. During use, long-term touching and swiping with fingers will inevitably expose these substrates to water vapor, acidic and alkaline substances, sweat and grease, and these stains will affect the substrate's feel and the operating life of the internal equipment. Therefore, the requirements for the waterproof, anti-fouling and wear-resistant properties of these substrates are getting higher and higher; the current solution is to apply a protective coating on the surface of the substrate to improve the waterproof, anti-fouling and wear-resistant properties of the substrate.

[0003] There are a large number of fluorine atoms in perfluoropolyether, so it has performance advantages such as chemical inertness, stability, low surface tension, and high hydrophobicity, while the oxygen atoms give it good mobility and wear resistance, making it have important application value in waterproof and antifouling protective coating materials. At present, the existing technology uses perfluoropolyether antifouling agents to add to the protective coating to reduce the surface energy of the coating and improve its hydrophobic and oleophobic properties. However, there are three key problems with this technology: First, there is no strong interaction between perfluoropolyether and the substrate, the adhesion is poor, and it is easy to wear, fall off or scrape off; second, the hydrophobic and oleophobic properties of perfluoropolyether are not strong enough, which will affect the product's feel and internal equipment stability in a water vapor and oily environment; third, perfluoropolyether currently needs to be heated and dried, which not only increases the process flow but also increases production costs. Summary of the invention

[0004] In view of the above problems, the present application is proposed to provide a chip-level super-hydrophobic nano-insulating protective coating and a preparation method thereof that overcomes the above problems or at least partially solves the above problems, including:

[0005] A chip-level super-hydrophobic nano-insulating protective coating, wherein the water contact angle of the super-hydrophobic insulating protective coating is greater than 150°, and the super-hydrophobic insulating protective coating comprises, by mass, 0.1% to 1% of a fluorine-containing polymer, 0.5% to 1% of a nano-filler, 13% to 18% of ethanol, and the remainder is a fluorocarbon solvent;

[0006] Wherein, the nano filler is nano alumina or hydroxy boron nitride which is surface chemically modified by a fluorine-containing carboxylic acid or a fluorine-containing silane coupling agent.

[0007] Furthermore, the fluorine-containing polymer is one or more of a copolymer of acrylic acid, perfluoroacrylic acid, and acrylic acid oxafluoroalkane ester.

[0008] Further, the fluorine-containing carboxylic acid includes one or more of perfluorobutyric acid, 4-trifluoromethylbenzoic acid, 4-(1,1-difluoroethyl)benzoic acid or 4-(perfluoroethyl)benzoic acid, 9-methoxyperfluoro-2-methyl-3-oxononanoic acid, perfluoro-3,6,9-trioxatridecanoic acid, 3,3,3-trifluoro-2-(trifluoromethyl)propionic acid, 3-methoxytetrafluoropropionic acid, pentafluoropropionic acid, perfluoro-2,5,8,11-tetramethyl-3,6,9,12-tetraoxapentadecarboxylic acid, and perfluoro-2,5,8-trimethyl-3,6,9-trioxadodecanoic acid.

[0009] Furthermore, the fluorine-containing silane coupling agent includes one or more of heptadecafluorodecyltrimethyl(ethyl)oxysilane, triethoxy[5,5,6,6,7,7,7-heptafluoro-4,4-bis(trifluoromethyl)heptyl]silane, triethoxy[5,5-bis(trifluoromethyl)-6,6,7,7,8,8,8-heptafluorooctyl]silane, triethoxy(pentafluorophenyl)silane, and trifluoromethyltetrafluorophenyltriethoxysilane.

[0010] Furthermore, the fluorocarbon solvent is a perfluoropolyether with different structures and molecular weights.

[0011] Furthermore, the particle size of the nano-alumina and the hydroxy-boron nitride is 10-50 nanometers.

[0012] Furthermore, the crystal phases of the nano-aluminum oxide and the hydroxy boron nitride are α phase, β phase or γ phase.

[0013] A method for preparing a chip-level super-hydrophobic nano-insulating protective coating, the method being used to prepare any of the above-mentioned chip-level super-hydrophobic nano-insulating protective coatings, comprising the steps of:

[0014] Mixing raw materials according to preset contents and homogenizing to obtain a protective coating, wherein the raw materials include fluorine-containing polymers, nanofillers, fluorocarbon solvents and ethanol;

[0015] The protective coating is sprayed on the surface of the target substrate and allowed to stand for 10-20 minutes to form a chip-level super-hydrophobic nano-insulating protective coating.

[0016] This application has the following advantages:

[0017] In the embodiments of the present application, in view of the shortcomings of poor performance of perfluoropolyether coatings and complex coating processes in the prior art, the present application provides a chip-level super-hydrophobic nano-insulating protective coating, the water contact angle of the super-hydrophobic insulating protective coating is greater than 150°, and the super-hydrophobic insulating protective coating includes 0.1% to 1% of fluoropolymer, 0.5% to 1% of nanofiller, 13% to 18% of ethanol, and the balance is fluorocarbon solvent; wherein the nanofiller is nano-alumina or hydroxyboron nitride surface-chemically modified by fluorinated carboxylic acid or fluorinated silane coupling agent. By adding modified nanofillers, the nano-coating formed by spraying has strong hydrophobicity, insulation and wear resistance, and after the spraying process is completed, it can form a film quickly without subsequent treatment such as heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the description of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Figure 1 It is a step flow chart of a method for preparing a chip-level super-hydrophobic nano-insulating protective coating provided in one embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the objects, features and advantages of the present application more obvious and understandable, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0021] The inventors have found through analysis of the prior art that the prior art coating materials for perfluoropolyether have weak adhesion based on perfluoropolyether in some substrates, poor wear resistance, and insufficient hydrophobic and oleophobic properties, and are unable to form a film naturally, requiring artificial drying.

[0022] In the embodiments of the present application, in view of the shortcomings of poor performance of perfluoropolyether coating and complex coating process in the prior art, the present application provides a chip-level super-hydrophobic nano-insulating protective coating, the water contact angle of the super-hydrophobic insulating protective coating is greater than 150°, and the super-hydrophobic insulating protective coating includes 0.1% to 1% of fluoropolymer, 0.5% to 1% of nanofiller, 13% to 18% of ethanol, and the balance is fluorocarbon solvent; wherein the nanofiller is nano-alumina or hydroxyboron nitride with surface chemical modification by fluorinated carboxylic acid or fluorinated silane coupling agent. By adding modified nanofillers, the nano-coating formed by spraying has strong hydrophobicity, insulation and wear resistance, and after the spraying process is completed, it can form a film quickly without subsequent treatment such as heating.

[0023] Next, a chip-level super-hydrophobic nano-insulating protective coating in this exemplary embodiment will be further described.

[0024] In one embodiment of the present application, the fluorine-containing polymer is one or more of a copolymer of acrylic acid, perfluoroacrylic acid, and acrylic acid oxafluoroalkane ester.

[0025] In one embodiment of the present application, the fluorine-containing carboxylic acid includes one or more of perfluorobutyric acid, 4-trifluoromethylbenzoic acid, 4-(1,1-difluoroethyl)benzoic acid or 4-(perfluoroethyl)benzoic acid, 9-methoxyperfluoro-2-methyl-3-oxononanoic acid, perfluoro-3,6,9-trioxatridecanoic acid, 3,3,3-trifluoro-2-(trifluoromethyl)propionic acid, 3-methoxytetrafluoropropionic acid, pentafluoropropionic acid, perfluoro-2,5,8,11-tetramethyl-3,6,9,12-tetraoxapentadecarboxylic acid, and perfluoro-2,5,8-trimethyl-3,6,9-trioxadodecanoic acid.

[0026] In one embodiment of the present application, the fluorine-containing silane coupling agent includes one or more of heptadecafluorodecyltrimethyl(ethyl)oxysilane, triethoxy[5,5,6,6,7,7,7-heptafluoro-4,4-bis(trifluoromethyl)heptyl]silane, triethoxy[5,5-bis(trifluoromethyl)-6,6,7,7,8,8,8-heptafluorooctyl]silane, triethoxy(pentafluorophenyl)silane, and trifluoromethyltetrafluorophenyltriethoxysilane.

[0027] In one embodiment of the present application, the fluorocarbon solvent is a perfluoropolyether with different structures and molecular weights.

[0028] It should be noted that the fluorocarbon solvent is a perfluoropolyether, and perfluoropolyethers with the same molecular weight can be added, or perfluoropolyethers with different molecular weights can be mixed and added, or perfluoropolyethers with different structures can be added at the same time, or only perfluoropolyether with one structure can be added to suit different usage scenarios. Perfluoropolyethers with different structures and molecular weights can be used according to specific usage conditions.

[0029] In one embodiment of the present application, the particle sizes of the nano-aluminum oxide and the hydroxy-boron nitride are 10-50 nanometers.

[0030] In one embodiment of the present application, the crystal phases of the nano-aluminum oxide and the hydroxy boron nitride are α phase, β phase or γ phase.

[0031] In one embodiment of the present application, a method for preparing a chip-level super-hydrophobic nano-insulating protective coating is also provided. The method is used to prepare any of the above-mentioned chip-level super-hydrophobic nano-insulating protective coatings, comprising the steps of:

[0032] S110, mixing raw materials according to preset contents and homogenizing them to obtain a protective coating, wherein the raw materials include fluorine-containing polymer, nanofiller, fluorocarbon solvent and ethanol;

[0033] S120, spraying the protective coating on the surface of the target substrate and letting it stand for 10-20 minutes to form a chip-level super-hydrophobic nano-insulating protective coating.

[0034] In a specific implementation, the chip-level super-hydrophobic nano-insulating protective coating described above is prepared, and the raw material addition ratio is: by mass ratio, 0.5% of fluorine-containing polymer, 0.5% of modified nano-filler, 15% of ethanol, and 84% of fluorocarbon solvent;

[0035] The fluorinated carboxylic acid or fluorinated silane coupling agent in the modified nanofiller is perfluoro-3,6,9-trioxatridecanoic acid, the nano-alumina or hydroxyboron nitride is γ-phase nano-alumina with a particle size of 10 nanometers, and the fluorocarbon solvent is ethyl nonafluorobutyl ether.

[0036] In a specific implementation, the chip-level super-hydrophobic nano-insulating protective coating described above is prepared, and the raw material addition ratio is: by mass ratio, 0.4% of fluorine-containing polymer, 0.6% of modified nano-filler, 16% of ethanol, and 83% of fluorocarbon solvent;

[0037] The fluorinated carboxylic acid or fluorinated silane coupling agent in the modified nanofiller is perfluoro-3,6,9-trioxatridecanoic acid, the nano-alumina or hydroxyboron nitride is γ-phase hexagonal hydroxyboron nitride with a particle size of 10 nanometers, and the fluorocarbon solvent is perfluoropropylene oligomer.

[0038] In a specific implementation, the chip-level super-hydrophobic nano-insulating protective coating described above is prepared, and the raw material addition ratio is: by mass ratio, 0.3% of fluorine-containing polymer, 0.7% of modified nano-filler, 17% of ethanol, and 82% of fluorocarbon solvent;

[0039] The fluorinated carboxylic acid or fluorinated silane coupling agent in the modified nanofiller is heptadecafluorodecyltrimethoxysilane, the nano-alumina or hydroxyboron nitride is hexagonal hydroxyboron nitride with a particle size of 10 nanometers in the γ phase, and the fluorocarbon solvent is ethyl nonafluoroisobutyl ether.

[0040] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present application.

[0041] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0042] The above is a detailed introduction to a chip-level super-hydrophobic nano-insulating protective coating and a preparation method thereof provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technicians in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A chip-level super-hydrophobic nano-insulating protective coating, characterized in that: The water contact angle of the super hydrophobic insulating protective coating is greater than 150°, and the super hydrophobic insulating protective coating comprises, by mass, 0.1% to 1% of a fluorine-containing polymer, 0.5% to 1% of a nanofiller, 13% to 18% of ethanol, and the remainder is a fluorocarbon solvent; Wherein, the nano filler is nano alumina or hydroxy boron nitride which is surface chemically modified by a fluorine-containing carboxylic acid or a fluorine-containing silane coupling agent.

2. The chip-level super-hydrophobic nano-insulating protective coating according to claim 1, characterized in that: The fluorine-containing polymer is one or more of a copolymer of acrylic acid, perfluoroacrylic acid, and acrylic acid oxafluoroalkane ester.

3. The chip-level super-hydrophobic nano-insulating protective coating according to claim 1, characterized in that: The fluorine-containing carboxylic acid includes one or more of perfluorobutyric acid, 4-trifluoromethylbenzoic acid, 4-(1,1-difluoroethyl)benzoic acid or 4-(perfluoroethyl)benzoic acid, 9-methoxyperfluoro-2-methyl-3-oxononanoic acid, perfluoro-3,6,9-trioxatridecanoic acid, 3,3,3-trifluoro-2-(trifluoromethyl)propionic acid, 3-methoxytetrafluoropropionic acid, pentafluoropropionic acid, perfluoro-2,5,8,11-tetramethyl-3,6,9,12-tetraoxapentadecarboxylic acid, and perfluoro-2,5,8-trimethyl-3,6,9-trioxadodecanoic acid.

4. The chip-level super-hydrophobic nano-insulating protective coating according to claim 1, characterized in that: The fluorine-containing silane coupling agent includes one or more of heptadecafluorodecyltrimethyl(ethyl)oxysilane, triethoxy[5,5,6,6,7,7,7-heptafluoro-4,4-bis(trifluoromethyl)heptyl]silane, triethoxy[5,5-bis(trifluoromethyl)-6,6,7,7,8,8,8-heptafluorooctyl]silane, triethoxy(pentafluorophenyl)silane, and trifluoromethyltetrafluorophenyltriethoxysilane.

5. The chip-level super-hydrophobic nano-insulating protective coating according to claim 1, characterized in that: The fluorocarbon solvent is a perfluoropolyether with different structures and molecular weights.

6. The chip-level super-hydrophobic nano-insulating protective coating according to claim 1, characterized in that: The particle sizes of the nano-alumina and the hydroxyboron nitride are 10-50 nanometers.

7. The chip-level super-hydrophobic nano-insulating protective coating according to claim 1, characterized in that: The crystal phases of the nano-aluminum oxide and the hydroxy boron nitride are α phase, β phase or γ phase.

8. A method for preparing a chip-level super-hydrophobic nano-insulating protective coating, characterized in that: The method is used to prepare the chip-level super-hydrophobic nano-insulating protective coating according to any one of claims 1 to 7, comprising the steps of: Mixing raw materials according to preset contents and homogenizing to obtain a protective coating, wherein the raw materials include fluorine-containing polymers, nanofillers, fluorocarbon solvents and ethanol; The protective coating is sprayed on the surface of the target substrate and allowed to stand for 10-20 minutes to form a chip-level super-hydrophobic nano-insulating protective coating.

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