Humidity monitoring control system and monitoring control method based on industrial computer

Abstract

The invention provides a humidity monitoring control system and method based on an industrial computer, and the method comprises the steps: detecting a temperature value in the industrial computer in real time through a first temperature module, and taking the temperature value as a first measurement value; the measured first measurement value is compared with a preset temperature threshold value, and when the temperature value exceeds the threshold value, the system starts the cooling and dehumidifying module. The cooling and dehumidifying module starts to suck external air and carries out cooling and dehumidifying treatment, the treated air is blown into the installation space, the internal temperature is reduced, meanwhile, moisture is reduced, and it is ensured that internal electronic elements operate in the optimal working environment through temperature and humidity control. And through the cooling and dehumidifying module, the problems of short circuit and corrosion caused by moisture entering in the heat dissipation process of a traditional industrial computer are effectively avoided, and the reliability of equipment in a humid environment is enhanced. Temperature and humidity are monitored in real time, cooling and dehumidification are automatically controlled, long-time stable work of equipment is ensured, and the service life of an industrial computer is prolonged.

Description

Technical Field

[0001] The present application relates to the field of industrial computers, and in particular to a humidity monitoring and control system and a monitoring and control method based on industrial computers. Background Art

[0002] Industrial PC (IPC) is a computer designed and manufactured specifically for industrial environments. Compared with ordinary consumer-grade computers, industrial computers are significantly different in structure, performance, reliability and durability. They are usually used in environments that require high stability and durability, such as manufacturing, automation, transportation, energy, and medical treatment.

[0003] For industrial computers used in production environments with high humidity, moisture may enter the device through the fan port in a humid environment. Therefore, many industrial computers adopt a fanless design and use a passive heat dissipation structure (such as an aluminum alloy shell as a radiator). The passive heat dissipation structure will cause the internal temperature to be high, causing the components inside the industrial computer to work abnormally due to the high temperature.

[0004] When fans are used for heat dissipation, due to high humidity in the environment (for example, during the return of the south wind), as the fan dissipates heat for the industrial computer, moisture enters the industrial computer and may condense on the circuit board. Since water is conductive, this may cause a short circuit between circuit boards, disrupting normal electrical signal transmission and even paralyzing the entire system. Water vapor is particularly prone to accumulating in the small gaps between electronic components, increasing the risk of short circuits.

[0005] Secondly, moisture accelerates the oxidation and corrosion of metal parts on electronic components, connectors and circuit boards. Common metals such as copper and aluminum are prone to oxidation in a humid environment, and the generated oxides reduce electrical conductivity, resulting in poor contact and performance degradation.

[0006] Corrosion not only damages circuit components, but also affects the reliability of electronic connections, causing system instability or even failure.

[0007] In high humidity environments, the insulation materials inside industrial computers may absorb moisture, causing their insulation performance to deteriorate. This may cause current to "leak" between electronic components, affecting the normal operation of the system and causing electrical failures.

[0008] In a humid environment, the dielectric strength of the circuit will decrease and the electrical insulation capability will deteriorate, increasing the risk of equipment breakdown.

[0009] A Chinese patent discloses an industrial computer humidity monitoring control system and monitoring control method with patent number: CN112965559B, which achieves the drying effect by placing a drying box inside the industrial computer and absorbing the moisture in the air inside the industrial computer. However, in hot and humid weather with high humidity in the air, the temperature inside the computer is high, and the water absorption effect of the desiccant is greatly affected by the temperature, resulting in poor dehumidification effect, and still causing high humidity inside the industrial computer, which is inconvenient to use the industrial computer.

[0010] Secondly, many desiccants release a certain amount of heat during the moisture absorption process. When the desiccant absorbs moisture, the local temperature may rise, especially in a confined space. This temperature rise may affect its ability to continue to absorb moisture, which in turn causes the temperature in the industrial computer to rise further, causing the desiccant's moisture absorption capacity to weaken.

[0011] In the process of using existing semiconductor cooling chips for cooling, water-absorbing desiccant is generally placed at the air inlet, and then the semiconductor cooling chip is placed at the air outlet of the fan to cool the air blown into the industrial computer by the fan. This method of cooling has the following problems:

[0012] The cooling effect of the semiconductor refrigeration chip cannot adjust the power of the semiconductor refrigeration chip according to the temperature, cooling effect, and dehumidification effect, so it is impossible to better cool the industrial computer.

[0013] If the semiconductor cooling chip is kept working at high power for a long time, the cooling effect may be better, but the power consumption of the semiconductor cooling chip will increase significantly when it is running at high power for a long time. This will not only make the energy efficiency of the equipment worse, but may also cause the overall power consumption of the industrial computer to exceed the standard.

[0014] When working at high power for a long time, the temperature of the cold end of the refrigeration plate will continue to decrease, while the temperature of the hot end will increase. The accumulation of this temperature difference may cause the hot end to be unable to dissipate heat in time, causing heat to be reversely transferred to the cold end, ultimately reducing the cooling effect, and even making it impossible for the cold end temperature to be further reduced, affecting the overall cooling effect of the system.

[0015] If the air inside an industrial computer is overcooled, the water vapor in the air may condense into droplets, which in turn increases the humidity inside the equipment and affects the humidity control effect, thereby increasing the risk of short circuits and corrosion of electronic components.

[0016] When the cold end temperature is too low, the water vapor in the air may condense quickly to form condensed water. Even if the system is cooled by the refrigeration plate at the beginning, the water vapor remaining in the air will condense into droplets at low temperatures and adhere to the surface of circuit boards or other electronic components. This increases the risk of short circuits in electronic components and may even cause corrosion damage.

[0017] Long-term high-power operation of the refrigeration unit will cause the internal temperature to drop too quickly, and the relative humidity of the air inside the industrial computer system may increase. Although the temperature drops, the humidity level is not adjusted in time, resulting in condensation inside the equipment. This runs counter to the original intention, which was to reduce humidity, but moisture is formed due to the low temperature, affecting the humidity control effect. Summary of the invention

[0018] In view of this, it is necessary to provide an industrial computer-based humidity monitoring and control system and a monitoring and control method to solve the above problems.

[0019] The embodiment of the present application provides a humidity monitoring and control system based on an industrial computer, which is applied to humidity defects caused by the heat dissipation process of an industrial computer. The humidity monitoring and control system based on an industrial computer includes:

[0020] The main body of the industrial computer has an installation space formed inside, and the installation space is provided with electronic components;

[0021] A first temperature module is disposed in the installation space and is used to monitor the temperature of the internal environment of the industrial computer body;

[0022] A cooling and dehumidification module is arranged in the installation space, one end of which is connected to the outside and the other end of which is connected to the installation space;

[0023] The first temperature module obtains the temperature value in the installation space, records the temperature value in the installation space as a first measurement value, and compares the first measurement value with a temperature threshold. If the temperature threshold is greater than the first measurement value, the cooling and dehumidification module inhales external air, cools and dehumidifies the inhaled air, and blows the cooled and dehumidified air into the installation space to cool the electronic components in the installation space.

[0024] In at least one embodiment of the present application, the cooling and dehumidification module includes:

[0025] a communication duct, located in the installation space, the communication duct being provided with an air inlet channel and an air outlet channel, the air inlet channel being in communication with the outside, the air outlet channel being in communication with the installation space, and the air outlet channel being in communication with the air inlet channel;

[0026] An air suction member, one end of which is connected to the outside and the other end of which is connected to the air inlet channel;

[0027] A dehumidification and heat dissipation component is partially located in the air inlet channel and partially located in the air outlet channel to cool and dehumidify the air sucked into the connecting pipe.

[0028] In at least one embodiment of the present application, the dehumidification and heat dissipation component includes:

[0029] A heat conducting member, one end of which is disposed in the air inlet passage;

[0030] A cooling condensation component, one end of which is arranged in the air outlet channel;

[0031] A semiconductor refrigeration sheet is arranged in the installation space, the other end of the heat-conducting member is attached to the hot end of the semiconductor refrigeration sheet, and the other end of the cold-conducting condensing member is attached to the cold end of the semiconductor refrigeration sheet;

[0032] The air blown into the air inlet channel is heated by the heat-conducting component and then enters the air outlet channel. The heated air condenses when passing through the cooling condensation component, and water droplets generated by the condensation adhere to the cooling condensation component.

[0033] In at least one embodiment of the present application, the air outlet channel includes a condensation end, and the condensation end is formed by being inclined and bent in a vertically downward direction from an end of the air inlet channel away from the air suction member;

[0034] The cooling condensation member includes a cooling fin portion, which is arranged in the condensation end and is inclined relative to the bending direction of the condensation end. The cooling fin portion is inclined to the axis of the air inlet channel.

[0035] In at least one embodiment of the present application, the cooling condensation member further includes a cooling portion provided at one end of the cooling fin portion, and the cooling portion penetrates the condensation end and is in contact with the cold end of the semiconductor refrigeration sheet.

[0036] In at least one embodiment of the present application, the air outlet channel further includes an air outlet end connected to one end of the condensation end, and the air outlet end is formed by being inclined and bent from one end of the condensation end away from the air inlet channel and in a vertically upward direction;

[0037] The air outlet is communicated with the installation space;

[0038] The junction of the condensation end and the air outlet end forms a junction curve, and the farthest point of the junction curve away from the semiconductor refrigeration plate is recorded as the junction point. The air inlet channel is arranged parallel to the semiconductor refrigeration plate, and the maximum distance from the air inlet channel to the semiconductor refrigeration plate is recorded as a, and the maximum distance from the junction point to the semiconductor refrigeration plate is recorded as b, satisfying the relationship: a>b.

[0039] In at least one embodiment of the present application, a liquid outlet channel is provided on the gas outlet end, the liquid outlet channel is located at the junction of the condensation end and the gas outlet end, and the liquid outlet channel is arranged close to the semiconductor refrigeration sheet;

[0040] The dehumidification and heat dissipation component also includes a one-way flow valve, one end of which is connected to the liquid outlet channel, and the other end of which is connected to an external liquid outlet pipeline.

[0041] In at least one embodiment of the present application, the industrial computer-based humidity monitoring and control system further includes:

[0042] A first humidity module, disposed in the installation space, for obtaining a humidity value in the installation space;

[0043] A second temperature module is provided on the industrial computer body and is used to monitor the ambient temperature of the industrial computer body;

[0044] A second humidity module is provided on the industrial computer body and is used to detect the humidity value of the environment around the industrial computer body;

[0045] Among them, the second temperature module obtains the ambient temperature value of the industrial computer body to obtain a second measurement value; the first humidity module obtains the humidity value in the installation space to obtain a third measurement value, and the second humidity module obtains the humidity value of the ambient environment of the industrial computer body to obtain a fourth measurement value; the power of the semiconductor refrigeration plate is calculated based on the first measurement value, the second measurement value, the third measurement value and the fourth measurement value to obtain a cooling and dehumidification power value.

[0046] In at least one embodiment of the present application, the cooling and dehumidification power value is compared with the maximum power value of the semiconductor refrigeration chip. If the cooling and dehumidification power value is greater than the maximum power value of the semiconductor refrigeration chip, the semiconductor refrigeration chip is controlled to work at the maximum power value.

[0047] If the cooling and dehumidifying power value is less than the maximum power value of the semiconductor refrigeration plate, the semiconductor refrigeration plate is controlled to operate at the cooling and dehumidifying power value.

[0048] In at least one embodiment of the present application, the industrial computer-based humidity monitoring and control system further includes:

[0049] A heat conducting member, one end of which is arranged in the air outlet channel, and the other end of which is provided with a cold end bonding portion and a hot end bonding portion, wherein the cold end bonding portion is located on the cold end side close to the semiconductor cooling sheet, and the hot end bonding portion is located on the hot end side close to the semiconductor cooling sheet;

[0050] A magnetic attraction member is arranged on a side of the hot end bonding portion away from the semiconductor refrigeration sheet;

[0051] A magnetic induction component is disposed in the installation space and coupled with the magnetic attraction component;

[0052] Among them, the magnetic field direction of the magnetic induction component is controlled according to the temperature difference between the inside and outside of the industrial computer body, so that the magnetic attraction component is attracted or repelled by the magnetic induction component, so that the cold end bonding part is bonded to the cold end of the semiconductor refrigeration plate or the hot end bonding part is bonded to the hot end of the semiconductor refrigeration plate, so as to change the temperature of the air passing through the cooling condensation component and blown into the installation space.

[0053] A monitoring and control method is applied to any one of the above-mentioned humidity monitoring and control systems based on industrial computers, and the monitoring and control method comprises:

[0054] Acquire a real-time temperature value in the installation space through a first temperature module to obtain a first measurement value;

[0055] Compare the first measurement value with a temperature threshold, and generate a cooling and dehumidification signal if the temperature threshold is greater than the first measurement value;

[0056] The cooling and dehumidification signal is executed to control the cooling and dehumidification module to cool and dehumidify the installation space.

[0057] The implementation of the industrial computer-based humidity monitoring control system and monitoring control method of this embodiment will have at least the following beneficial effects:

[0058] 1. In the above-mentioned humidity monitoring and control system and monitoring and control method based on industrial computers, the first temperature module detects the temperature value inside the industrial computer in real time as the first measurement value; the measured first measurement value is compared with a preset temperature threshold. When the temperature value exceeds the threshold, the system will start the cooling and dehumidification module.

[0059] The cooling and dehumidification module starts to inhale external air and performs cooling and dehumidification processing. The processed air is blown into the installation space to lower the internal temperature and reduce humidity. By controlling the temperature and humidity, it ensures that the internal electronic components operate in the best working environment.

[0060] The cooling and dehumidification module effectively avoids the short circuit and corrosion problems caused by moisture entering during the heat dissipation process of traditional industrial computers, enhancing the reliability of the equipment in humid environments.

[0061] Real-time monitoring of temperature and humidity, and automatic control of cooling and dehumidification ensure long-term stable operation of the equipment, thus extending the service life of the industrial computer.

[0062] 2. When the temperature in the installation space is higher or lower than the ambient temperature, a magnetic induction element is used to adjust the thermal conductive element to fit the hot end or cold end of the semiconductor refrigeration plate, thereby adjusting the conduction temperature of the thermal conductive element. Multi-stage temperature regulation is used to avoid excessive temperature differences between the inside and outside. When approaching the target temperature, the cooling speed should be gradually slowed down to avoid a sharp drop in temperature and reduce thermal stress inside the equipment. Reduce the risk of moisture condensation and reduce the formation of condensed water in the installation space.

[0063] Using magnetic fields to control temperature can avoid the friction and wear problems caused by physical contact. The response speed of magnetic field control is very fast, and temperature can be adjusted in milliseconds. In industrial environments, especially when the temperature fluctuates violently, it can provide higher stability and real-time control.

[0064] Secondly, in a high humidity environment, motors and mechanical components are easily affected by moisture or jamming, while magnetic field control is not affected by moisture and dust and has high reliability.

[0065] The magnetic control system can control the adsorption or repulsion state between the cooling and heating components by adjusting the magnetic field strength to achieve precise temperature regulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 It is the structural block diagram of humidity monitoring and control system based on industrial computer;

[0067] Figure 2 It is a three-dimensional diagram of the humidity monitoring and control system based on industrial computers;

[0068] Figure 3 This is the exploded diagram of the humidity monitoring and control system based on industrial computers;

[0069] Figure 4 This is the exploded view of the cooling and dehumidification module;

[0070] Figure 5 This is a three-dimensional diagram of the cooling and dehumidification module;

[0071] Figure 6 This is the usage status of the cooling and dehumidification module Figure 1 (Cross-sectional view, where solid arrows represent hot air, dashed arrows represent cold air, and circles represent small water droplets);

[0072] Figure 7 This is the usage status of the cooling and dehumidification module Figure 2 (solid arrows represent heat conduction, and dashed arrows represent cold conduction);

[0073] Figure 8 It is a partial structural diagram of a humidity monitoring and control system based on an industrial computer in another embodiment;

[0074] Fig. 9 for Figure 8 Schematic diagram of the embodiment in use (cross-sectional view).

[0075] Main component symbols

[0076] 100. Humidity monitoring and control system based on industrial computers;

[0077] 110. Industrial computer main body; 110a. Installation space;

[0078] 120. A first temperature module;

[0079] 130, cooling and dehumidifying module; 131, connecting pipe; 1311, air inlet channel; 1312, air outlet channel; 132, air suction member; 133, dehumidification and heat dissipation component; 1331, heat conduction member; 1332, cold conduction condensation member; 13321, cooling fin part; 13322, cold conduction part; 1333, semiconductor cooling sheet; 13121, condensation end; 13122, air outlet end; 130a, junction point; 130b, liquid outlet channel; 134, one-way flow valve;

[0080] 140. A first humidity module;

[0081] 150. A second temperature module;

[0082] 160. A second humidity module;

[0083] 170, thermal conductive member; 171, cold end bonding portion; 172, hot end bonding portion; 173, thermal conductive fins; 174, thermal conductive portion; 175, thermal conductive rolling wheel; 176, thermal conductive vertical plate; 170a, groove;

[0084] 180, magnetic parts;

[0085] 190. Magnetic sensing parts. DETAILED DESCRIPTION

[0086] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0087] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0088] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0089] The embodiment of the present application provides an industrial computer humidity monitoring and control system 100, which is applied to humidity defects caused by the heat dissipation process of industrial computers. The industrial computer humidity monitoring and control system 100 includes:

[0090] The industrial computer body 110 has an installation space 110a formed therein, and the installation space 110a is provided with electronic components;

[0091] A first temperature module 120 is disposed in the installation space 110a and is used to detect the temperature of the internal environment of the industrial computer body 110;

[0092] The cooling and dehumidification module 130 is disposed in the installation space 110a, one end of which is connected to the outside and the other end of which is connected to the installation space 110a;

[0093] The first temperature module 120 obtains the temperature value in the installation space 110a, records the temperature value in the installation space 110a as a first measurement value, and compares the first measurement value with a temperature threshold. If the temperature threshold is greater than the first measurement value, the cooling and dehumidification module 130 inhales external air, cools and dehumidifies the inhaled air, and blows the cooled and dehumidified air into the installation space 110a to cool the electronic components in the installation space 110a.

[0094] Please refer to Figure 1-Figure 7 In this embodiment, the first temperature module 120 detects the temperature value inside the industrial computer in real time as the first measurement value; the measured first measurement value is compared with a preset temperature threshold. When the temperature value exceeds the threshold, the industrial computer humidity monitoring and control system 100 will start the cooling and dehumidification module 130.

[0095] The cooling and dehumidification module 130 starts to inhale external air and performs cooling and dehumidification processing. The processed air is blown into the installation space 110a to lower the internal temperature and reduce humidity. By controlling the temperature and humidity, it ensures that the internal electronic components operate in the best working environment.

[0096] The cooling and dehumidification module 130 effectively avoids the short circuit and corrosion problems caused by moisture entering during the heat dissipation process of traditional industrial computers, thereby enhancing the reliability of the equipment in a humid environment.

[0097] Real-time monitoring of temperature and humidity, and automatic control of cooling and dehumidification ensure long-term stable operation of the equipment, thus extending the service life of the industrial computer.

[0098] It should be noted that the first temperature module 120 is a digital thermometer. When the industrial computer is working, the internal electronic components will generate heat, causing the temperature in the installation space 110a to rise. The first temperature module 120 will monitor this temperature in real time, and the collected temperature value is the "first measurement value".

[0099] When the first temperature module 120 detects a temperature rise (higher than a set threshold), the cooling and dehumidification module 130 starts to work. It inhales external air, cools and dehumidifies the inhaled air, and then blows the treated cold air into the installation space 110a, thereby reducing the internal temperature of the industrial computer and reducing humidity.

[0100] It should be further explained that electronic components include: PCB boards, central processing units, graphics cards, resistors and other electronic components.

[0101] The installation space 110 a is a cavity inside the industrial computer body 110 . The industrial computer body 110 is a cubic structure in this embodiment.

[0102] In at least one embodiment of the present application, the cooling and dehumidification module 130 includes:

[0103] A communication duct 131 is located in the installation space 110a. The communication duct 131 is provided with an air inlet channel 1311 and an air outlet channel 1312. The air inlet channel 1311 is communicated with the outside, the air outlet channel 1312 is communicated with the installation space 110a, and the air outlet channel 1312 is communicated with the air inlet channel 1311.

[0104] The air suction member 132 has one end connected to the outside and the other end connected to the air inlet channel 1311;

[0105] The dehumidification and heat dissipation component 133 is partially located in the air inlet channel 1311 and partially located in the air outlet channel 1312 to cool and dehumidify the air sucked into the connecting pipe 131 .

[0106] Please refer to Figure 1-Figure 7 In this embodiment, the air suction member 132 sucks air from the outside and sends the air into the connecting pipe 131. The air is processed by the dehumidification and heat dissipation component 133 in the connecting pipe 131. The dehumidification and heat dissipation component 133 cools the air and removes moisture from the air.

[0107] The processed cooled and dried air enters the installation space 110a through the air outlet passage 1312, lowering the internal temperature and reducing humidity.

[0108] The entire industrial computer-based humidity monitoring and control system 100 dynamically adjusts the cooling and dehumidification operations according to the real-time monitored temperature and humidity conditions to ensure that the internal environment of the industrial computer-based humidity monitoring and control system 100 is suitable.

[0109] By providing the dehumidification and heat dissipation component 133, the industrial computer-based humidity monitoring and control system 100 can effectively process the air, ensuring that the air entering the installation space 110a is both cooled and dry, thereby avoiding short circuits and corrosion problems that may be caused by moisture condensation on the circuit board.

[0110] In a high humidity environment, moisture entering the interior of an industrial computer may cause serious short circuit and corrosion problems. The cooling and dehumidification module 130 not only reduces the internal temperature, but also reduces the impact of moisture on the device, greatly improving the operating stability and life of the device.

[0111] It should be noted that traditional industrial computers cannot effectively deal with moisture problems due to their heat dissipation design, while the industrial computer humidity monitoring and control system 100 significantly improves the environmental adaptability of industrial computers by introducing external air and processing it.

[0112] The humidity monitoring and control system 100 based on industrial computers can intelligently adjust the air handling process according to the actual detected temperature and humidity conditions, optimize the dehumidification and heat dissipation effects, and avoid unnecessary energy waste.

[0113] It should be further explained that the air suction member 132 is a fan, and is an air suction fan that draws external air into the industrial computer body 110. The air suction member 132 draws external air into the communication duct 131 by connecting with the external air. Through this process, the inhaled air can enter the dehumidification and heat dissipation component 133 for processing.

[0114] The dehumidification and heat dissipation component 133 not only dissipates heat, but also removes moisture from the air, which effectively solves the problem of short circuit and corrosion of electronic components caused by moisture entering when the industrial computer works in a humid environment.

[0115] Since the dehumidification and heat dissipation component 133 is partially located in the connecting pipe 131, the air has been fully processed before entering the installation space 110a, ensuring that the installation space 110a is always maintained within a suitable temperature and humidity range.

[0116] One end of the connecting pipe 131 is a horizontally arranged middle-through pipe (corresponding to the air inlet channel 1311), and the other end is a C-shaped middle-through elbow (corresponding to the air outlet channel 1312).

[0117] In at least one embodiment of the present application, the dehumidification and heat dissipation component 133 includes:

[0118] A heat conducting member 1331, one end of which is disposed in the air inlet passage 1311;

[0119] A cooling condensation member 1332, one end of which is disposed in the air outlet channel 1312;

[0120] The semiconductor refrigeration sheet 1333 is arranged in the installation space 110a, the other end of the heat-conducting member 1331 is attached to the hot end of the semiconductor refrigeration sheet 1333, and the other end of the cold-conducting condensing member 1332 is attached to the cold end of the semiconductor refrigeration sheet 1333;

[0121] The air blown into the air inlet channel 1311 is heated by the heat-conducting component 1331 and then enters the air outlet channel 1312 . The heated air condenses when passing through the cooling condensation component 1332 , and water droplets generated by the condensation adhere to the cooling condensation component 1332 .

[0122] Please refer to Figure 1-Figure 7 In this embodiment, the external air enters the industrial computer-based humidity monitoring and control system through the air inlet channel 1311, and first contacts the heat-conducting member 1331, heating the air to increase its water vapor content.

[0123] The heated air flows through the cooling condensation member 1332, and the cooling condensation member 1332 condenses the water vapor in the air into liquid water through the cold end of the semiconductor cooling plate 1333, and the liquid water adheres to the surface of the condensation member.

[0124] After the condensation process, moisture in the air is removed and dry air is delivered to the installation space 110a, ensuring that the temperature of the electronic components inside the industrial computer is lowered while the humidity is reduced.

[0125] Condensed water is discharged through a preset drainage mechanism based on an industrial computer humidity monitoring and control system to avoid internal water accumulation.

[0126] The use of heating-condensation cycle can effectively reduce the moisture content in the air, and the condensation component cools the air, improving the cooling effect. This is especially important for industrial computers in humid environments, which can effectively prevent moisture from corroding circuit boards and components.

[0127] Through precise temperature and humidity control, the humidity monitoring and control system based on industrial computers ensures that industrial computers can still operate normally in high humidity and high temperature working environments. Due to the effective control of moisture and heat, the aging rate of internal electronic components is slowed down, greatly extending the service life of the equipment.

[0128] It is especially suitable for high humidity and hot and humid environments, such as the rainy season or the return of the south in the south. Under these extreme conditions, the humidity monitoring and control system based on industrial computers automatically adjusts the cooling and dehumidification functions to maintain the stability of the internal environment, providing higher operating stability and reliability for industrial computers.

[0129] The humidity monitoring and control system based on industrial computers monitors the internal environment through temperature and humidity sensors, and automatically adjusts the power of the semiconductor cooling plate 1333 according to the monitoring results, realizing dynamic and intelligent temperature and humidity control. This intelligent control mechanism not only improves energy efficiency, but also reduces the maintenance frequency of equipment, further improving the practicality of the equipment in complex industrial environments.

[0130] It should be noted that the heat conducting member 1331 is provided with an aluminum heat sink fin group at one end, the heat sink fin group is composed of a plurality of parallel heat sink fins, and the other end is connected to the hot end of the semiconductor cooling plate 1333 through a heat-conducting aluminum plate for transferring heat.

[0131] It should be further explained that the humidity monitoring and control system based on industrial computers first heats the air to increase the water vapor content in the air; then, when passing through the condensation element, the temperature drops sharply, causing the water vapor to condense into liquid water. In this way, the moisture in the air can be removed more efficiently.

[0132] The heating process uses the principle of heat conduction to increase the concentration of water vapor in the air; the condensation process uses the dew point characteristics of the air to condense the water vapor into water droplets on the condensation element. The combination of the two can efficiently achieve dehumidification and cooling of the air.

[0133] The air is heated by the heat conducting member 1331 so that the moisture in the air exists in a gaseous form, thereby increasing the saturated vapor pressure of the air.

[0134] When the air comes into contact with the condensation element, the temperature drops suddenly, the water vapor condenses into water droplets, and is captured by the condensation element, effectively dehumidifying.

[0135] It should be further explained that the heat conduction part of the heat conductor is calculated using the following formula:

[0136] Q a =(kA a ΔT a ) / l;

[0137] Among them, Q a is the heat transferred through the heat conductor, k is the thermal conductivity of the heat conductor material; A a is the surface area of ​​the heat conductor, ΔT a is the temperature difference between the heat-conducting part and the air, and l is the distance from the heat-conducting part to the semiconductor refrigeration sheet.

[0138] The cold conduction part of the condenser is calculated by the following formula:

[0139] Q c =h c A c (ΔT c );

[0140] Among them, Q c is the heat removed by the cooling condenser during the condensation process, h c is the condensation heat transfer coefficient, A c is the surface area of ​​the cooling condenser; ΔT c It is the temperature difference between the air and the surface of the cooling condenser.

[0141] In at least one embodiment of the present application, the air outlet channel 1312 includes a condensation end 13121, and the condensation end 13121 is formed by being inclined and bent in a vertically downward direction from one end of the air inlet channel 1311 away from the air suction member 132;

[0142] The cooling condensation member 1332 includes a cooling fin portion 13321, which is disposed in the condensation end 13121 and is inclined relative to the bending direction of the condensation end 13121. The cooling fin portion 13321 is inclined to the axis of the air inlet channel 1311.

[0143] Please refer to Figure 1-Figure 7 In this embodiment, external air enters the industrial computer-based humidity monitoring and control system through the air inlet channel 1311, is first heated by the heat conductor 1331, and the moisture in the air exists in the form of water vapor and flows to the condensation end 13121 through the air inlet channel 1311.

[0144] When the air reaches the condensation end 13121, since the condensation end 13121 is inclined downward and curved, the air prolongs its residence time in this area and contacts the cooling fin portion 13321. The cooling fin portion 13321 is cooled by the cold end of the semiconductor refrigeration sheet, causing the water vapor to condense into water droplets on the cooling fin portion 13321.

[0145] The condensed water flows down naturally through the inclined structure of the condensation end 13121, preventing water droplets from being retained in the condensation end 13121, while ensuring that moisture does not affect the electronic components inside the industrial computer-based humidity monitoring and control system.

[0146] The inclined condensation end 13121 prolongs the contact time between the air and the condensation element. In addition, the inclined arrangement of the refrigeration fin portion 13321 further increases the surface area of ​​air flow, improves the condensation efficiency of water vapor in the air, and significantly enhances the dehumidification effect.

[0147] By tilting the cooling fin portion 13321 and the axis of the air inlet channel 1311, the heat dissipation effect of the cooling condensation component 1332 is greatly improved, and heat can be transferred to the air more evenly, while avoiding the phenomenon of excessive local condensation, ensuring that the air can be cooled more evenly.

[0148] It should be further explained that the condensation end 13121 is a downward-bent center-through elbow, so that after the heated air enters along the axis of the air inlet channel 1311, the heated air still hits the inner wall of the condensation end 13121 along the direction of the axis of the air inlet channel 1311, so that a part of the water droplets can adhere to the inner wall of the condensation end 13121, and the other part hits the aluminum fins on the refrigeration fin part 13321, so that most of the water vapor condenses on the refrigeration fin part 13321.

[0149] Secondly, since the axes of the cooling fin portion 13321, the air inlet channel 1311 and the condensation end 13121 are all inclined, the residence time of the hot air can be increased, thereby reducing the temperature of the hot air, and secondly increasing the condensation amount and condensation effect of water vapor.

[0150] It should be further explained that the refrigeration fin portion 13321 is composed of a plurality of parallel aluminum fins, and there is a gap between each adjacent aluminum fin. In the present embodiment, the inclination angle of the refrigeration fin portion 13321 is 30°, the angle of the axis of the air inlet channel 1311 is 0°, and the bending angle of the condensation end 13121 is 45° (all the above angles are relative to the angle of the horizontal line) to ensure that when the hot air reaches the condensation end 13121, it can stay there for a long time and condense most of the water vapor to avoid the water vapor in the cold air passing through the refrigeration fin portion 13321 being mostly condensed at the condensation end 13121.

[0151] It should be further explained that the heat conductive member 1331 and the cold conductive condensation member 1332 are both located at the bottom of the installation space 110a and are arranged close to the ground. The heat conductive member 1331 and the cold conductive condensation member 1332 are located between the ground and the connecting pipe 131, and the condensation end 13121 of the connecting pipe 131 is bent toward the side close to the ground.

[0152] It should be further explained that the heat conducting component 1331 and the cold conducting condensing component 1332 are both arranged on the side of the connecting pipe 131 close to the ground.

[0153] In at least one embodiment of the present application, the cooling condensation member 1332 also includes a cooling portion 13322 disposed at one end of the cooling fin portion 13321 , and the cooling portion 13322 penetrates the condensing end 13121 and is bonded to the cold end of the semiconductor refrigeration plate 1333 .

[0154] Please refer to Figure 1-Figure 7In this embodiment, when air passes through the cooling condensation member 1332, water vapor condenses into water droplets by contacting the cooling fin portion 13321. At this time, the cooling portion 13322 is responsible for conducting the cold from the semiconductor cooling sheet 1333 to the cooling fin portion 13321, ensuring that the fins can always be kept at a relatively low temperature.

[0155] The cooling portion 13322 enables the cold energy to be quickly transferred to the cooling fin portion 13321, thereby improving the cooling capacity and condensation efficiency of the fins.

[0156] By providing a cooling portion 13322 at one end of the first cooling fin, the cold can be transferred to the first cooling fin more efficiently, so that the first cooling fin always maintains a low temperature during the cooling and condensation process, effectively improving the condensation efficiency and avoiding poor condensation effect caused by excessively high fin temperature.

[0157] The cold end of the semiconductor cooling sheet 1333 provides continuous cooling, which is conducted to the cooling fin portion 13321 through the cooling conduction portion 13322. The cooling conduction portion runs through the condensation end 13121 to ensure that the cooling is evenly transferred to the entire cooling conduction condensation member 1332.

[0158] The air flows through the condensation end 13121 and contacts the low-temperature refrigeration fin portion 13321. The water vapor in the air condenses into water droplets on the surface of the fin, flows down along the surface of the fin, and is finally discharged based on the industrial computer humidity monitoring control system.

[0159] The condensed water droplets flow down naturally through the inclined condensation end 13121, preventing moisture from accumulating near the electronic components, thereby ensuring that the humidity inside the industrial computer-based humidity monitoring and control system is effectively controlled.

[0160] It should be noted that the cooling part 13322 is composed of a laminated aluminum plate and a connecting plate perpendicular to the laminated aluminum plate. The connecting plate is made of an aluminum plate. One end of the connecting plate is arranged on the laminated aluminum plate, and the other end passes through the condensation end 13121 and is accommodated in the internal space of the condensation end 13121, and is connected to each refrigeration fin part 13321 to fix the refrigeration fin part 13321.

[0161] The cold end of the cooling part 13322 and the semiconductor cooling sheet 1333 are attached to each other, so that the cooling condensation element 1332 can maintain a stable low temperature state, greatly improving the condensation efficiency of water vapor in the air. The condensed water is quickly discharged, effectively reducing the humidity inside the industrial computer and preventing moisture from condensing on the circuit board.

[0162] The problem of moisture accumulation is effectively solved. The cooling part 13322 ensures that the condensing parts always maintain a low temperature, quickly removes moisture from the air, avoids short circuits or corrosion caused by moisture condensation on the circuit board, and improves the operating reliability of industrial computers in high humidity environments.

[0163] It should be noted that there are two groups of cooling condensation components 1332 , one group of cooling condensation components 1332 is arranged in the condensation end 13121 , and the other group of cooling condensation components 1332 is arranged in the air outlet channel 1312 .

[0164] At the condensation end 13121, since the condensation end 13121 is a curved pipe, the condensed water and the cold-treated air are separated to achieve gas-liquid separation and avoid a large amount of moisture in the cold-treated air.

[0165] In at least one embodiment of the present application, the air outlet channel 1312 further includes an air outlet end 13122 connected to one end of the condensation end 13121, and the air outlet end 13122 is formed by being inclined and bent from one end of the condensation end 13121 away from the air inlet channel 1311 and in a vertically upward direction;

[0166] The air outlet 13122 is in communication with the installation space 110a;

[0167] The junction of the condensation end 13121 and the air outlet end 13122 forms a junction curve (not marked in the figure), and the farthest point of the junction curve away from the semiconductor refrigeration plate 1333 is recorded as the junction point 130a. The air inlet channel 1311 is arranged parallel to the semiconductor refrigeration plate, and the maximum distance from the air inlet channel 1311 to the semiconductor refrigeration plate is recorded as a, and the maximum distance from the junction point 130a to the semiconductor refrigeration plate is recorded as b, satisfying the relationship: a>b.

[0168] Please refer to Figure 1-Figure 7 In this embodiment, air is sucked in from the outside and enters the humidity monitoring and control system based on an industrial computer through the air inlet channel 1311. The air inlet channel 1311 is parallel to the semiconductor cooling plate. The air is heated by the heat conducting member 1331, the temperature rises, and the water vapor becomes easier to condense.

[0169] The heated air enters the condensation end 13121, contacts the semiconductor refrigeration sheet in the condensation end 13121, and the water vapor condenses into water droplets. The condensed water is discharged through the inclined design of the condensation end 13121, and the dry air enters the air outlet end 13122.

[0170] The dry air flows upward along the air outlet 13122 and finally enters the installation space 110a. The condensed water is blocked at the condensation end 13121 and will not enter the installation space 110a where the electronic components are located, thereby ensuring that the electronic components are kept in a dry environment.

[0171] By reasonably designing the inclined structure of the air outlet 13122 and the distance ratio a>b, the humidity monitoring and control system based on an industrial computer can effectively condense water vapor into liquid water and ensure that the humidity of the air is effectively controlled before entering the installation space 110a, thereby preventing moisture from entering the area where the electronic components are located.

[0172] The airflow flows smoothly in the industrial computer-based humidity monitoring and control system, avoiding the situation that the airflow is blocked or flows in reverse in the industrial computer-based humidity monitoring and control system. The bend of the air outlet 13122 further optimizes the flow of the airflow and prevents the condensed water from flowing back.

[0173] Dry, low-temperature air enters the installation space 110a through the air outlet 13122, helping to reduce the operating temperature of the electronic components, extend the life of the components and improve the stability of the equipment.

[0174] It should be noted that since the cooling part 13322 is in direct contact with the condensation end 13121, the temperature of the condensation end 13121 is reduced, the maximum distance from the air inlet channel 1311 to the semiconductor refrigeration plate is recorded as a, and the maximum distance from the intersection 130a to the semiconductor refrigeration plate is recorded as b, satisfying the relationship: a>b, so that the air in contact with the condensation end 13121 can attach the moisture it carries to the inner wall of the condensation end 13121 to reduce the moisture in the air.

[0175] It should be further explained that a waterproof gasket is provided between the cooling portion 13322 and the condensing end 13121 to prevent liquefied water from dripping into the installation space 110a.

[0176] In at least one embodiment of the present application, a liquid outlet channel 130b is provided on the gas outlet end 13122, the liquid outlet channel 130b is located at the junction of the condensation end 13121 and the gas outlet end 13122, and the liquid outlet channel 130b is arranged close to the semiconductor refrigeration sheet 1333;

[0177] The dehumidification and heat dissipation component 133 further includes a one-way circulation valve 134 , one end of which is connected to the liquid outlet channel 130 b , and the other end of which is connected to an external liquid outlet pipe.

[0178] Please refer to Figure 1-Figure 7 In this embodiment, when air flows through the condensation end 13121, water vapor condenses into water droplets. The condensed water naturally flows to the air outlet end 13122 due to the inclined design of the condensation end 13121.

[0179] A liquid outlet channel 130b is provided at the air outlet end 13122 near the condensation end 13121, through which condensed water is discharged from the interior of the industrial computer humidity monitoring and control system to prevent it from accumulating at the condensation end 13121 or entering the installation space 110a.

[0180] The condensed water flows through the one-way flow valve 134 through the liquid outlet channel 130b. The one-way flow valve 134 ensures that the condensed water can only be discharged from the inside of the industrial computer-based humidity monitoring and control system to the outside, and does not allow external moisture or gas to flow back. The one-way valve guides the condensed water to the external liquid outlet pipe, and the condensed water is finally discharged through the pipe.

[0181] It should be noted that the liquid outlet channel 130b is opened at the junction of the condensation end 13121 and the gas outlet end 13122 close to the semiconductor refrigeration plate 1333, and the liquid outlet channel 130b is opened at the lowest point of the gas outlet end 13122. The lowest point of the gas outlet end 13122 and the lowest point of the condensation end 13121 are both located at the junction between the two.

[0182] The liquid outlet pipe is located on a side of the one-way flow valve 134 away from the connecting pipe 131 .

[0183] The liquid outlet channel 130b and the one-way flow valve 134 ensure that the condensed water can be quickly discharged from the industrial computer-based humidity monitoring and control system, while preventing the backflow of external air or moisture, ensuring that the air at the condensation end 13121 and the installation space 110a remains dry, thereby improving the stability of the industrial computer-based humidity monitoring and control system.

[0184] The one-way flow valve 134 allows the condensed water to be discharged smoothly through the liquid outlet channel 130b, avoiding the secondary condensation problem caused by the condensed water backflow. At the same time, this design improves the drainage efficiency of the entire industrial computer-based humidity monitoring and control system, ensuring that the industrial computer-based humidity monitoring and control system can work stably in a high humidity environment for a long time.

[0185] By effectively draining condensed water and preventing external moisture from entering, the electronic components inside the industrial computer humidity monitoring and control system are protected from moisture erosion, reducing the risk of short circuits or component corrosion. It can significantly extend the service life of the equipment, especially in humid industrial environments.

[0186] In at least one embodiment of the present application, the industrial computer-based humidity monitoring and control system 100 further includes:

[0187] A first humidity module 140, disposed in the installation space 110a, for obtaining a humidity value in the installation space 110a;

[0188] The second temperature module 150 is provided on the industrial computer body 110 and is used to detect the ambient temperature value of the industrial computer body 110;

[0189] A second humidity module 160 is provided on the industrial computer body 110 and is used to detect the humidity value of the environment around the industrial computer body 110;

[0190] Among them, the second temperature module 150 obtains the ambient temperature value of the industrial computer body 110 to obtain a second measurement value; the first humidity module 140 obtains the humidity value in the installation space 110a to obtain a third measurement value, and the second humidity module 160 obtains the humidity value of the ambient environment of the industrial computer body 110 to obtain a fourth measurement value; the power of the semiconductor refrigeration plate 1333 is calculated based on the first measurement value, the second measurement value, the third measurement value and the fourth measurement value to obtain a cooling and dehumidification power value.

[0191] In at least one embodiment of the present application, the cooling and dehumidification power value is compared with the maximum power value of the semiconductor refrigeration plate 1333. If the cooling and dehumidification power value is greater than the maximum power value of the semiconductor refrigeration plate 1333, the semiconductor refrigeration plate 1333 is controlled to work at the maximum power value.

[0192] If the cooling and dehumidification power value is less than the maximum power value of the semiconductor refrigeration plate 1333, the semiconductor refrigeration plate 1333 is controlled to operate at the cooling and dehumidification power value.

[0193] Please refer to Figure 1-Figure 7 In this embodiment, the first temperature module 120, the second temperature module 150, the first humidity module 140 and the second humidity module 160 collect temperature and humidity data inside and outside the industrial computer humidity monitoring and control system, including internal temperature, external temperature, internal humidity and external humidity.

[0194] The humidity monitoring and control system based on an industrial computer calculates the current cooling and dehumidification demand according to the four measured values, and determines how much power is needed to drive the semiconductor refrigeration plate 1333.

[0195] The industrial computer-based humidity monitoring and control system compares the cooling and dehumidification power value with the maximum power value of the semiconductor refrigeration chip 1333 to determine the working power of the refrigeration component. If the demand exceeds the maximum power, the semiconductor refrigeration chip works at the maximum power; if the demand is lower than the maximum power, the semiconductor refrigeration chip works at the required power.

[0196] According to the changes in real-time environmental conditions, the industrial computer humidity monitoring and control system will dynamically adjust the power of the refrigeration components to ensure that the industrial computer can operate stably in different temperature and humidity environments.

[0197] By integrating internal and external temperature and humidity information, the industrial computer humidity monitoring and control system can dynamically adjust the power of the refrigeration components to ensure that the industrial computer maintains stable operation in various environments.

[0198] It effectively avoids moisture accumulation inside the equipment, prevents electronic components from being damaged by a humid environment, and improves the safety and reliability of the humidity monitoring and control system based on industrial computers.

[0199] By calculating the cooling and dehumidification power values, the humidity monitoring and control system based on industrial computers can reasonably allocate the working power of refrigeration components, reduce unnecessary power waste, and reduce energy consumption while ensuring the cooling and dehumidification effects.

[0200] It can adjust the cooling power according to different environmental conditions and keep the equipment running normally in complex industrial environments such as high humidity and high temperature, thereby extending the service life of industrial computers.

[0201] It should be noted that the first temperature module 120 and the second temperature module 150 are both digital thermometers, and the first humidity module 140 and the second humidity module 160 are both digital humidity measuring meters.

[0202] It should be further explained that the cooling and dehumidification power value is calculated according to the following formula:

[0203] P total =(ρ air V air L v (P water -P out ) / P atm )+(m air C air (T1-T2)); where P total is the cooling and dehumidification power value; ρ air is the density of air; V air is the volume flow rate of air; L v is the latent heat of vaporization of water; P water is the actual water vapor value in the installation space, i.e. the third measurement value; P out is the actual water vapor value outside the installation space, which is the fourth measurement value; atm is atmospheric pressure; m air is the air mass flow rate; c air is the specific heat capacity of air; T1 is the temperature inside the installation space, the first measured value; T2 is the temperature outside the installation space, the second measured value.

[0204] Please refer to Figure 8-9 In at least one embodiment of the present application, the industrial computer-based humidity monitoring and control system further includes:

[0205] Thermal Conductor 170 (Please refer to Fig. 9 The leftmost thermal conductive fin 173 in the figure has one end disposed in the air outlet channel 1312, and the other end is provided with a cold end fitting portion 171 and a hot end fitting portion 172, wherein the cold end fitting portion 171 is located on the cold end side close to the semiconductor cooling sheet 1333, and the hot end fitting portion 172 is located on the hot end side close to the semiconductor cooling sheet 1333;

[0206] Among them, the cooling condensation component 1332 is located between the temperature conductive component 170 and the heat conductive component 1331. In this embodiment, the air sucked into the connecting pipe 131 passes through the heat conductive component 1331 and then passes through the cooling condensation component 1332 for dehumidification and cooling, and finally passes through the temperature conductive fins 173 of the temperature conductive component 170 and is sent into the installation space 110a through the air outlet channel 1312 to cool the components in the industrial computer body 110, and the cooling condensation component 1332 is a group.

[0207] The magnetic attraction member 180 is disposed on a side of the hot end bonding portion 172 away from the semiconductor cooling sheet 1333;

[0208] The magnetic induction component 190 is disposed in the installation space 110a and coupled with the magnetic attraction component 180:

[0209] Among them, when the temperature difference between the first measurement value and the second measurement value of the industrial computer body is not within the difference threshold range, the magnetic field direction of the magnetic sensing component 190 is controlled according to the temperature difference between the inside and outside of the industrial computer body, so that the magnetic attraction component 180 and the magnetic sensing component 190 are adsorbed or repelled, so that the cold end bonding part 171 is bonded to the cold end of the semiconductor refrigeration plate 1333 or the hot end bonding part 172 is bonded to the hot end of the semiconductor refrigeration plate 1333, so as to change the temperature of the air passing through the cooling condensation component 1332 and blown into the installation space 110a.

[0210] Please refer to Figure 8-Figure 9 , calculating the temperature difference between the inside and outside of the industrial computer body according to the first measurement value and the second measurement value, if the temperature difference between the inside and outside of the industrial computer body is not within the difference threshold range, and the temperature difference between the inside and outside of the industrial computer body is greater than the difference threshold range, calculating the temperature value of the thermal conductive component 170 according to the maximum difference within the difference threshold range;

[0211] ΔT=T1-T2, where the temperature difference between the inside and outside of the industrial computer body is ΔT, the first measurement value is T1, and the second measurement value is T2;

[0212] Set the difference threshold range to: ΔT min and ΔT max , if ΔT exceeds the difference threshold range and ΔT>ΔT max, the temperature value T3 of the thermal conductive element 170 is calculated based on the maximum difference:

[0213] T3=T1-ΔT max ;

[0214] According to the third measurement value P water , the fourth measurement value P out Calculate the dehumidification amount Q1, and calculate the dehumidification temperature difference between the cold condensation part and the heat conduction part according to the dehumidification amount;

[0215] Dehumidification capacity Q1:

[0216] Q1=ρ air V air (P water -P out ) / P atm , where ρ air is the air density, V air is the air flow rate, P atm is atmospheric pressure;

[0217] Dehumidification temperature difference T4:

[0218] T4=Q1 / (m air c air ), where c air is the specific heat capacity of air; m air =ρ air V air is the mass flow rate of air;

[0219] Calculating output temperature values ​​of the cooling and condensing components and the heat conducting components according to the dehumidification temperature difference value and the second measurement value;

[0220] Output temperature T5 of the cooling condenser:

[0221] T5 = T2 - T4,

[0222] Output temperature T6 of heat conducting element:

[0223] T6=T2+T4,

[0224] The output power of the semiconductor refrigeration plate 1333 is calculated according to the output temperature value of the cold condensation element 1332, the output temperature value of the heat conduction element 1331 and the temperature value of the temperature conduction element 170;

[0225] Cooling capacity P of semiconductor refrigeration chip output , calculated based on the temperature difference between its hot end and cold end. The hot end temperature of the semiconductor cooling plate 1333 is T6, and the cold end temperature of the semiconductor cooling plate 1333 is T5, then

[0226] P output=K(T6-T5) / d, K is the thermal conductivity of the semiconductor cooling sheet 1333, and d is the thickness of the heat conducting member 1331;

[0227] The power P outputted by the semiconductor cooling plate 1333 is adjusted according to the output temperature value of the temperature conducting element 170. final :

[0228] P final =P output +α(T3-T5), α is the adjustment coefficient of the system, which represents the influence of the temperature of the thermal conductive component 170 on the power of the semiconductor refrigeration plate 1333.

[0229] At this time, the temperature in the installation space 110a is greater than the ambient temperature, and the air sucked into the outside by the air suction member 132 is first heated, and then condensed and cooled by the cooling condensation member 1332 to perform dehumidification and cooling, and then the condensed and cooled air is heated to the cooling temperature required by the installation space 110a through the thermal conductive member 170. The cooling temperature required by the installation space 110a is a temperature that reduces the temperature of the installation space 110a while preventing the water in the air in the installation space 110a from condensing, thereby dehumidifying and cooling the temperature in the installation space 110a; at the same time, the magnetic induction member 190 (which is a magnetic induction coil) generates a repulsive magnetic field, so that the magnetic suction member 180 drives the hot end bonding portion 172 to bond with the hot end of the semiconductor refrigeration plate 1333, so as to heat the air passing through the cooling condensation member 1332 to the required cooling temperature, thereby avoiding the relative humidity in the installation space 110a from increasing due to the rapid drop in temperature in the installation space 110a, thereby causing condensed water to form inside the device.

[0230] This solution adopts multi-stage temperature regulation to avoid excessive temperature difference between inside and outside. When approaching the target temperature, the cooling speed should be gradually slowed down to avoid a sharp drop in temperature and reduce the thermal stress inside the equipment. Reduce the risk of moisture condensation and reduce the formation of condensed water in the installation space.

[0231] It should be further explained that when the above method is applied to an environment where the temperature is lower than the temperature of the installation space of the industrial computer, the temperature is initially cooled to a very low temperature. Under the premise that the humidity in the installation space 110a has not changed, the sudden cooling will cause the temperature inside the installation space 110a to be much higher than the cooling temperature, thereby causing a temperature difference, causing water vapor to form in the installation space 110a, affecting the operation of the industrial computer body 110.

[0232] The present solution uses a hot-cold-hot method to perform multi-stage temperature adjustment in the early stage of cooling, thereby changing the humidity value of the inhaled air, and then cools down by heating to a temperature difference threshold lower than the temperature of the installation space 110a, so as to avoid sudden cooling that causes the humidity inside the installation space 110a to not be discharged, thereby affecting the operation inside the industrial computer body 110.

[0233] It should be further explained that when the temperature in the installation space 110a is higher than the ambient temperature, a heat-cold-heat method is used for cooling.

[0234] When the temperature in the installation space 110a drops to the ambient temperature or lower than the ambient temperature, a hot-cold-cold method is used for cooling. At this time, the magnetic sensing component 190 generates an adsorbing magnetic field. The magnetic sensing component 190 adsorbs the magnetic component 180 so that the cold end bonding portion 171 of the thermal conductive component 170 is bonded to the cold end side of the semiconductor refrigeration plate 1333 to achieve gradual multi-stage temperature regulation, thereby avoiding the generation of water vapor inside the industrial computer body 110 due to the temperature difference, thereby affecting the operation of the industrial computer body 110.

[0235] It needs to be explained again that the thermal conductive component 170 is divided into two parts, including a thermal conductive fin 173 and a thermal conductive portion 174 slidably connected to the thermal conductive fin 173, the thermal conductive portion 174 is connected to the slide groove of the industrial computer body 110, and one side of one end is rollingly connected to the thermal conductive fin 173 through a metal thermal conductive rolling wheel 175, and the other side is adhered to the thermal conductive fin 173 through a thermal conductive vertical plate 176, and the other end is provided with a parallel cold end bonding portion 171 and a hot end bonding portion 172, a groove 170a is formed between the cold end bonding portion 171 and the hot end bonding portion 172, and the semiconductor refrigeration plate is located in the groove 170a.

[0236] The magnetic attraction component 180 is a magnet; the magnetic induction component 190 is an induction coil; and the thermal conductive component 170 is made of aluminum.

[0237] A monitoring and control method is applied to the humidity monitoring and control system 100 based on an industrial computer as described in any one of the above, and the monitoring and control method includes:

[0238] Acquire a real-time temperature value in the installation space 110a through the first temperature module 120 to obtain a first measurement value;

[0239] Compare the first measurement value with a temperature threshold, and generate a cooling and dehumidification signal if the temperature threshold is greater than the first measurement value;

[0240] The cooling and dehumidification signal is executed to control the cooling and dehumidification module 130 to cool and dehumidify the installation space 110a.

[0241] In this embodiment, the first temperature module 120 continuously monitors the internal temperature of the industrial computer and obtains a first measurement value in real time.

[0242] The humidity monitoring and control system based on the industrial computer compares the first measurement value with a preset temperature threshold value. If the first measurement value exceeds the threshold value, the humidity monitoring and control system based on the industrial computer generates a cooling and dehumidification signal.

[0243] The cooling and dehumidification signal is transmitted to the cooling and dehumidification module 130, and the cooling and dehumidification module 130 starts to work, sucking in external air and cooling and dehumidifying it, and blowing cold and dry air into the installation space 110a.

[0244] The internal temperature gradually decreases, the moisture is effectively removed, and the environment in the installation space 110a is restored. The industrial computer-based humidity monitoring and control system dynamically adjusts the working state of the cooling and dehumidification module 130 according to the change of the internal temperature until the internal temperature drops to a safe range.

[0245] Through real-time temperature monitoring and threshold comparison, it can quickly respond to temperature rise and start cooling and dehumidification operations. Based on the humidity monitoring and control system of industrial computers, it can not only adjust the temperature, but also reduce the humidity in the air to ensure the stability of the internal environment of the industrial computer.

[0246] The humidity monitoring and control system based on industrial computers automatically responds to temperature changes, reducing manual intervention and improving the intelligence level of the equipment. Through the automatic generation and execution of cooling and dehumidification signals, the humidity monitoring and control system based on industrial computers can automatically adjust the environmental conditions inside the equipment.

[0247] Through intelligent temperature and humidity management, the environmental pressure inside the equipment is reduced, preventing failures caused by moisture and overheating, thereby effectively extending the service life of the industrial computer.

[0248] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.

Claims

1. A humidity monitoring and control system based on industrial computers, applied to humidity defects caused by the heat dissipation process of industrial computers, characterized in that: The industrial computer-based humidity monitoring and control system includes: The main body of the industrial computer has an installation space formed inside, and the installation space is provided with electronic components; A first temperature module is disposed in the installation space and is used to monitor the temperature of the internal environment of the industrial computer body; A cooling and dehumidification module is arranged in the installation space, one end of which is connected to the outside and the other end of which is connected to the installation space; The first temperature module obtains the temperature value in the installation space, records the temperature value in the installation space as a first measurement value, and compares the first measurement value with a temperature threshold. If the temperature threshold is greater than the first measurement value, the cooling and dehumidification module inhales external air, cools and dehumidifies the inhaled air, and blows the cooled and dehumidified air into the installation space to cool the electronic components in the installation space.

2. The industrial computer-based humidity monitoring and control system according to claim 1 is characterized in that: The cooling and dehumidification module comprises: a communication duct, located in the installation space, the communication duct being provided with an air inlet channel and an air outlet channel, the air inlet channel being in communication with the outside, the air outlet channel being in communication with the installation space, and the air outlet channel being in communication with the air inlet channel; An air suction member, one end of which is connected to the outside and the other end of which is connected to the air inlet channel; A dehumidification and heat dissipation component is partially located in the air inlet channel and partially located in the air outlet channel to cool and dehumidify the air sucked into the connecting pipe.

3. The industrial computer-based humidity monitoring and control system according to claim 2 is characterized in that: The dehumidification and heat dissipation component comprises: A heat conducting member, one end of which is disposed in the air inlet passage; A cooling condensation component, one end of which is arranged in the air outlet channel; A semiconductor refrigeration sheet is arranged in the installation space, the other end of the heat-conducting member is attached to the hot end of the semiconductor refrigeration sheet, and the other end of the cold-conducting condensing member is attached to the cold end of the semiconductor refrigeration sheet; The air blown into the air inlet channel is heated by the heat-conducting component and then enters the air outlet channel. The heated air condenses when passing through the cooling condensation component, and water droplets generated by the condensation adhere to the cooling condensation component.

4. The industrial computer-based humidity monitoring and control system according to claim 3 is characterized in that: The air outlet channel comprises a condensation end, and the condensation end is formed by being inclined and bent in a vertically downward direction from an end of the air inlet channel away from the air suction member; The cooling condensation member includes a cooling fin portion, which is arranged in the condensation end and is inclined relative to the bending direction of the condensation end. The cooling fin portion is inclined to the axis of the air inlet channel.

5. The industrial computer-based humidity monitoring and control system according to claim 4 is characterized in that: The cooling condensation component also includes a cooling portion provided at one end of the cooling fin portion, and the cooling portion penetrates the condensation end and is in contact with the cold end of the semiconductor refrigeration sheet.

6. The industrial computer-based humidity monitoring and control system according to claim 4 is characterized in that: The air outlet channel also includes an air outlet end connected to one end of the condensation end, and the air outlet end is formed by being inclined and bent from the condensation end away from one end of the air inlet channel and in a vertically upward direction; The air outlet is communicated with the installation space; The junction of the condensation end and the air outlet end forms a junction curve, and the farthest point of the junction curve away from the semiconductor refrigeration plate is recorded as the junction point. The air inlet channel is arranged parallel to the semiconductor refrigeration plate, and the maximum distance from the air inlet channel to the semiconductor refrigeration plate is recorded as a, and the maximum distance from the junction point to the semiconductor refrigeration plate is recorded as b, satisfying the relationship: a>b.

7. The industrial computer-based humidity monitoring and control system according to claim 6 is characterized in that: A liquid outlet channel is provided on the gas outlet end, the liquid outlet channel is located at the junction of the condensation end and the gas outlet end, and the liquid outlet channel is arranged close to the semiconductor refrigeration sheet; The dehumidification and heat dissipation component also includes a one-way flow valve, one end of which is connected to the liquid outlet channel, and the other end of which is connected to an external liquid outlet pipeline.

8. The industrial computer-based humidity monitoring and control system according to claim 3 is characterized in that: The industrial computer-based humidity monitoring and control system also includes: A first humidity module, disposed in the installation space, for obtaining a humidity value in the installation space; A second temperature module is provided on the industrial computer body and is used to monitor the ambient temperature of the industrial computer body; A second humidity module is provided on the industrial computer body and is used to detect the humidity value of the environment around the industrial computer body; The second temperature module obtains the ambient temperature value of the industrial computer body to obtain a second measurement value; the first humidity module obtains the humidity value in the installation space to obtain a third measurement value, and the second humidity module obtains the humidity value of the ambient environment of the industrial computer body to obtain a fourth measurement value; the power of the semiconductor refrigeration chip is calculated according to the first measurement value, the second measurement value, the third measurement value and the fourth measurement value to obtain a cooling and dehumidification power value; the cooling and dehumidification power value is compared with the maximum power value of the semiconductor refrigeration chip, and if the cooling and dehumidification power value is greater than the maximum power value of the semiconductor refrigeration chip, the semiconductor refrigeration chip is controlled to work at the maximum power value; If the cooling and dehumidifying power value is less than the maximum power value of the semiconductor refrigeration plate, the semiconductor refrigeration plate is controlled to operate at the cooling and dehumidifying power value.

9. The industrial computer-based humidity monitoring and control system according to claim 8 is characterized in that: The industrial computer-based humidity monitoring and control system also includes: A heat conducting member, one end of which is arranged in the air outlet channel, and the other end of which is provided with a cold end bonding portion and a hot end bonding portion, wherein the cold end bonding portion is located on the cold end side close to the semiconductor cooling sheet, and the hot end bonding portion is located on the hot end side close to the semiconductor cooling sheet; A magnetic attraction member is arranged on a side of the hot end bonding portion away from the semiconductor refrigeration sheet; A magnetic induction component is disposed in the installation space and coupled with the magnetic attraction component; Among them, the magnetic field direction of the magnetic induction component is controlled according to the temperature difference between the inside and outside of the industrial computer body, so that the magnetic attraction component and the magnetic induction component are attracted or repelled, so that the cold end bonding part is bonded to the cold end of the semiconductor refrigeration plate or the hot end bonding part is bonded to the hot end of the semiconductor refrigeration plate, so as to change the temperature of the air passing through the cooling condensation component and blown into the installation space.

10. A monitoring and control method, applied to the industrial computer-based humidity monitoring and control system as described in any one of claims 1 to 9, characterized in that: The monitoring and control method comprises: Acquire a real-time temperature value in the installation space through a first temperature module to obtain a first measurement value; Compare the first measurement value with a temperature threshold, and generate a cooling and dehumidification signal if the temperature threshold is greater than the first measurement value; The cooling and dehumidification signal is executed to control the cooling and dehumidification module to cool and dehumidify the installation space.

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