Method and device for evaluating safety of high-temperature and high-pressure material irradiation test loop

Abstract

The invention discloses a method and device for evaluating the safety of a high-temperature and high-pressure material irradiation test loop, and relates to the technical field of reactor irradiation research, and the method comprises the steps: determining a plurality of to-be-selected indexes, and setting a plurality of sample index parameters under a target to-be-selected index; based on each sample index parameter, controlling a sample high-temperature and high-pressure material irradiation test loop to perform irradiation test on the sample test material, and determining reactor core attribute change information, material attribute change information and device attribute change information of the sample high-temperature and high-pressure material irradiation test loop during irradiation test; based on the core attribute change information, the material attribute change information and the device attribute change information, determining a target evaluation index in the to-be-selected indexes; and determining index parameters of the to-be-evaluated high-temperature and high-pressure material irradiation test loop under the target evaluation index, and performing safety evaluation on the to-be-evaluated high-temperature and high-pressure material irradiation test loop based on the index parameters.

Description

Technical Field

[0001] The present invention relates to the field of irradiation technology for research reactors, and in particular to a method and device for evaluating the safety of a high-temperature and high-pressure material irradiation test loop. Background Art

[0002] The high-temperature and high-pressure material irradiation test loop is an irradiation test facility on the research reactor. By inserting the irradiation device carrying the test sample (test material) into the reactor pressure vessel, the test sample can be irradiated under the neutron field. Since the high-temperature and high-pressure material irradiation test loop has a high temperature and pressure, it poses a safety risk to the low-temperature and low-pressure research reactor. It is necessary to fully evaluate the safety of the test loop through safety analysis, so as to optimize and improve the design scheme and ensure the safety of the loop itself and the research reactor.

[0003] At present, the safety analysis of nuclear fuel irradiation test circuit is usually carried out, mainly based on hypothetical accidents such as power loss to analyze the safety of the irradiation test circuit. However, in this hypothetical accident analysis method, the hypothetical accident may not necessarily affect the safety of the irradiation test circuit, and there may be omissions in the analysis of other accidents that affect the safety of the irradiation test circuit, resulting in low accuracy of the safety analysis of the irradiation test circuit. At the same time, due to the different properties of nuclear fuel and high-temperature and high-pressure materials, the safety analysis method of the nuclear fuel irradiation test circuit cannot be applied to the high-temperature and high-pressure material irradiation test circuit. If the safety analysis method of the nuclear fuel irradiation test circuit is used to analyze the safety of the high-temperature and high-pressure material irradiation test circuit, the safety analysis of the high-temperature and high-pressure material irradiation test circuit will be low in accuracy. Summary of the invention

[0004] The present invention provides a method and device for evaluating the safety of a high-temperature and high-pressure material radiation test circuit, which is mainly capable of improving the evaluation accuracy of the safety of a high-temperature and high-pressure material radiation test circuit.

[0005] According to a first aspect of the present invention, there is provided a method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit, comprising:

[0006] Determine a plurality of candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and use each of the candidate indicators as a target candidate indicator, and set a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated;

[0007] Based on each of the sample indicator parameters under the target candidate indicator, the sample high temperature and high pressure material irradiation test circuit is controlled to perform irradiation test on the sample test material. During the irradiation test, the core property information of the sample research reactor corresponding to the sample high temperature and high pressure material irradiation test circuit under each of the sample indicator parameters, the material property information of the sample test material under each of the sample indicator parameters, and the device property information of the sample irradiation device under each of the sample indicator parameters are determined for the target candidate indicator.

[0008] Based on the core property information under each of the sample index parameters, determine the core property change information corresponding to the sample research reactor; based on the material property information under each of the sample index parameters, determine the material property change information corresponding to the sample test material; based on the device property information under each of the sample index parameters, determine the device property change information corresponding to the sample irradiation device;

[0009] Based on the core property change information, material property change information, and device property change information under each of the target candidate indicators, determine the target evaluation indicator for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated from each of the candidate indicators;

[0010] Determine the index parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation index, and based on the index parameters, perform a safety assessment on the high-temperature and high-pressure material irradiation test circuit to be evaluated.

[0011] According to a second aspect of the present invention, there is provided a device for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit, comprising:

[0012] A setting unit is used to determine a plurality of candidate indicators corresponding to a sample high-temperature and high-pressure material irradiation test circuit, and use each of the candidate indicators as a target candidate indicator, and set a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated;

[0013] A first determination unit is used to control the sample high temperature and high pressure material irradiation test circuit to perform irradiation test on the sample test material based on each of the sample indicator parameters under the target candidate indicator, and during the irradiation test, determine the core property information of the sample research reactor corresponding to the sample high temperature and high pressure material irradiation test circuit under each of the sample indicator parameters, the material property information of the sample test material under each of the sample indicator parameters, and the device property information of the sample irradiation device under each of the sample indicator parameters for the target candidate indicator;

[0014] A second determination unit is used to determine core property change information corresponding to the sample research reactor based on the core property information under each of the sample index parameters, determine material property change information corresponding to the sample test material based on the material property information under each of the sample index parameters, and determine device property change information corresponding to the sample irradiation device based on the device property information under each of the sample index parameters;

[0015] A third determination unit is used to determine, from each of the target candidate indicators, a target evaluation indicator for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated based on the core property change information, material property change information, and device property change information under each of the target candidate indicators;

[0016] The evaluation unit is used to determine the index parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation index, and based on the index parameters, perform a safety evaluation on the high-temperature and high-pressure material irradiation test circuit to be evaluated.

[0017] According to a third aspect of the present invention, there is provided a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the above method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit.

[0018] According to a fourth aspect of the present invention, there is provided a computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the above method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit when executing the program.

[0019] According to a method and device for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit provided by the present invention, compared with the current method of estimating the safety of a high-temperature and high-pressure material irradiation test circuit based only on the working time of the high-temperature and high-pressure material irradiation test circuit, the present invention determines a plurality of candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and takes each of the candidate indicators as a target candidate indicator, and sets a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated; and based on each of the sample indicator parameters under the target candidate indicator, the sample high-temperature and high-pressure material irradiation test circuit is controlled to perform irradiation test on the sample test material, and during the irradiation test process, the core property information and sample test material of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit under each of the sample indicator parameters are determined for the target candidate indicator. respectively, the material property information under each of the sample index parameters, and the device property information of the sample irradiation device under each of the sample index parameters; at the same time, based on the core property information under each of the sample index parameters, the core property change information corresponding to the sample research reactor is determined, based on the material property information under each of the sample index parameters, the material property change information corresponding to the sample test material is determined, and based on the device property information under each of the sample index parameters, the device property change information corresponding to the sample irradiation device is determined; then, based on the core property change information, material property change information, and device property change information under each of the target selected indicators, the target evaluation indicator for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated is determined in each of the selected indicators; finally, the indicator parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation indicators are determined, and based on the indicator parameters, the safety of the high-temperature and high-pressure material irradiation test circuit to be evaluated is evaluated. Therefore, the present invention controls the sample high-temperature and high-pressure material irradiation test circuit to perform irradiation test under multiple indicator parameters corresponding to different candidate indicators, and determines which candidate indicators can affect the safety of the high-temperature and high-pressure material irradiation test circuit according to the actual changes of the research reactor, the actual changes of the test material, and the actual changes of the irradiation device during the irradiation test process. That is, among all the candidate indicators that may affect the safety of the high-temperature and high-pressure material irradiation test circuit, the target evaluation indicator that truly affects the safety of the high-temperature and high-pressure material irradiation test circuit is selected, and finally the safety of the high-temperature and high-pressure material irradiation test circuit is evaluated using the target evaluation indicator. That is, in the process of evaluating the safety of the high-temperature and high-pressure material irradiation test circuit, the present invention can ensure that all indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit are comprehensively analyzed, thereby improving the evaluation accuracy of the safety of the high-temperature and high-pressure material irradiation test circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0021] Figure 1 A flow chart of a method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit provided by an embodiment of the present invention is shown;

[0022] Figure 2 A schematic diagram showing the connection between an irradiation device and a research reactor provided by an embodiment of the present invention is shown;

[0023] Figure 3 A flow chart of another method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit provided by an embodiment of the present invention is shown;

[0024] Figure 4 A schematic structural diagram of a device for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit provided by an embodiment of the present invention is shown;

[0025] Figure 5 A schematic structural diagram of another device for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit provided by an embodiment of the present invention is shown;

[0026] Figure 6 A schematic diagram of the physical structure of a computer device provided by an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0027] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict.

[0028] At present, the safety of a high-temperature and high-pressure material irradiation test circuit is usually estimated based only on the working time of the high-temperature and high-pressure material irradiation test circuit, which leads to low accuracy in the assessment of the safety of the high-temperature and high-pressure material irradiation test circuit.

[0029] In order to solve the above problems, an embodiment of the present invention provides a method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit. Figure 1 As shown, the method includes:

[0030] 101. Determine multiple candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and use each candidate indicator as a target candidate indicator, and set multiple sample indicator parameters under the target candidate indicator.

[0031] 102. Based on the sample indicator parameters under the target candidate indicators, the sample high-temperature and high-pressure material irradiation test circuit is controlled to perform irradiation test on the sample test material. During the irradiation test, the core property information of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit under each sample indicator parameter, the material property information of the sample test material under each sample indicator parameter, and the device property information of the sample irradiation device under each sample indicator parameter are determined for the target candidate indicators.

[0032] 103. Based on the core property information under each sample index parameter, determine the core property change information corresponding to the sample research reactor; based on the material property information under each sample index parameter, determine the material property change information corresponding to the sample test material; based on the device property information under each sample index parameter, determine the device property change information corresponding to the sample irradiation device.

[0033] 104. Based on the core property change information, material property change information, and device property change information under each target candidate indicator, determine the target evaluation indicator for conducting a safety evaluation on the high-temperature and high-pressure material irradiation test circuit to be evaluated from among the candidate indicators.

[0034] Among them, the structure of the high temperature and high pressure material irradiation test circuit (the connection relationship between the irradiation device and the research reactor) is as follows Figure 2 As shown, Figure 2In the table, 1-1 indicates the research reactor pressure vessel; 1-2 indicates the low-temperature and low-pressure cooling water of the research reactor; 2-1 indicates the irradiation device insulation pipe; 2-2 indicates the air gap between the irradiation device insulation pipe and the pressure pipe; 2-3 indicates the irradiation device pressure pipe; 2-4 indicates the high-temperature and high-pressure cooling water inside the irradiation device pressure pipe; 2-5 indicates the irradiation device cooling water inlet connected to the irradiation circuit; 2-6 indicates the irradiation device cooling water outlet connected to the irradiation circuit; 3-1 indicates the test material sample (test material). The structural properties of the sample high-temperature and high-pressure material irradiation test circuit are the same as those of the high-temperature and high-pressure material irradiation test circuit to be evaluated; multiple candidate indicators refer to indicators that may affect the safety of the high-temperature and high-pressure material irradiation test circuit; multiple candidate indicators include: circuit flow index, circuit power index, circuit main pipeline index, irradiation device insulation pipe index, irradiation device pressure pipe index, etc.; multiple sample indicator parameters refer to parameters with different values ​​under a certain target candidate indicator. The core attribute information includes: the core physics information, thermal information, reactivity information, and heterogeneity of the research reactor; the material attribute information includes: the test material temperature and other information; the device attribute information includes: the loop cooling water temperature of the irradiator, the pressure tube temperature and pressure of the irradiator, the insulation tube temperature and force information of the irradiator, the temperature of the research reactor cooling water outside the insulation tube of the irradiator, etc. The core attribute change information refers to the changes in the core physics information, thermal information, reactivity information, and heterogeneity of the research reactor core under different indicator parameters corresponding to the same target candidate indicator; the material attribute change information refers to the change in the test material temperature under different indicator parameters corresponding to the same target candidate indicator; the device attribute change information refers to the change in the loop cooling water temperature of the irradiator or irradiation loop under different indicator parameters corresponding to the same target candidate indicator, the change in the temperature and pressure of the pressure tube of the irradiator, the change in the temperature and force information of the insulation tube of the irradiator, and the change in the temperature of the research reactor cooling water outside the insulation tube of the irradiator. Target evaluation indicators refer to indicators that affect the safety of high-temperature and high-pressure material irradiation test circuits.

[0035] With respect to the embodiments of the present invention, all the candidate indicators that may affect the safety of the high-temperature and high-pressure material irradiation test circuit are determined, and each candidate indicator is determined as a target candidate indicator. For each target candidate indicator, multiple indicator parameters under each target candidate indicator are set according to actual needs. For example, if the target candidate indicator is a circuit flow indicator, multiple circuit cooling water flow rates are set under the circuit flow indicator. Then, according to the multiple circuit cooling water flow rates, the sample high-temperature and high-pressure material irradiation test circuit is controlled to perform a simulated test on the sample test material. During the test, the influence of the change in the circuit cooling water flow rate on the material property information such as the sample test material temperature, and the device property information of the sample irradiation device such as the circuit cooling water temperature, the pressure pipe temperature of the irradiation device, and the insulation pipe temperature of the irradiation device are determined. The impact on the safety of the irradiation test circuit of high-temperature and high-pressure materials is determined based on the above-mentioned various impacts, and the target evaluation index that affects the safety of the irradiation test circuit of high-temperature and high-pressure materials is finally determined among various candidate indicators. Finally, the safety of the irradiation test circuit of high-temperature and high-pressure materials is evaluated based on the target evaluation index, so that irradiation simulation is carried out on different indicator parameters of the sample high-temperature and high-pressure material irradiation test circuit under different candidate indicators, and the target evaluation index that affects the safety of the irradiation test circuit of high-temperature and high-pressure materials is selected according to the simulation results. Finally, a comprehensive analysis is conducted on the target evaluation index, and the safety of the irradiation test circuit of high-temperature and high-pressure materials is determined according to the analysis results, which can improve the evaluation accuracy of the safety of the irradiation test circuit of high-temperature and high-pressure materials.

[0036] 105. Determine the index parameters of the irradiation test circuit of the high-temperature and high-pressure material to be evaluated under the target evaluation index, and based on the index parameters, conduct a safety assessment on the irradiation test circuit of the high-temperature and high-pressure material to be evaluated.

[0037] Among them, the target evaluation index includes at least one of the following: loop flow index, loop power index, loop main pipeline index, irradiation device insulation pipe index, and irradiation device pressure pipe index. The index parameters under the loop flow index include: irradiation device loop cooling water flow, etc. The index parameters under the loop power index refer to the power information in the irradiation device loop, the index parameters under the loop main pipeline index refer to the shape information of the irradiation device loop main pipeline, the index parameters under the irradiation device insulation pipe index refer to the insulation pipe weld information, and the index parameters under the irradiation device pressure pipe index refer to the pressure pipe weld information.

[0038] For the embodiment of the present invention, after determining the target evaluation index that affects the safety of the high-temperature and high-pressure material irradiation test circuit, the index parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the circuit flow index, circuit power index, circuit main pipeline index, irradiation device insulation pipe index, and irradiation device pressure pipe index are obtained, and finally, according to the relationship between the index parameters and the expected numerical values, it is judged whether the high-temperature and high-pressure material irradiation test circuit to be evaluated is safe. Therefore, the present invention simulates the test of the sample high-temperature and high-pressure material irradiation test circuit under various selected indicators, and selects all target evaluation indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit through the simulation results, which can provide The accuracy of selecting high-target evaluation indicators is improved, and then all target evaluation indicators are used to conduct safety evaluation on the high-temperature and high-pressure material irradiation test circuit. That is, the safety of the high-temperature and high-pressure material irradiation test circuit is determined by conducting a comprehensive analysis of all evaluation indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit. This can avoid the problem of inaccurate safety evaluation of the high-temperature and high-pressure material irradiation test circuit due to omission of certain evaluation indicators, and at the same time avoid the time wasted on analyzing indicators that have no impact on the safety of the high-temperature and high-pressure material irradiation test circuit. Therefore, the embodiment of the present invention can improve the evaluation accuracy and evaluation efficiency of the safety of the high-temperature and high-pressure material irradiation test circuit and save evaluation resources.

[0039] According to a method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit provided by the present invention, compared with the current method of estimating the safety of a high-temperature and high-pressure material irradiation test circuit based only on the working time of the high-temperature and high-pressure material irradiation test circuit, the present invention determines a plurality of candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and takes each of the candidate indicators as a target candidate indicator, and sets a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated; and based on each of the sample indicator parameters under the target candidate indicator, the sample high-temperature and high-pressure material irradiation test circuit is controlled to perform irradiation test on the sample test material, and during the irradiation test process, the core attribute information and sample test material classification of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit under each of the sample indicator parameters are determined for the target candidate indicator. The material property information under each of the sample index parameters and the device property information of the sample irradiation device under each of the sample index parameters are determined respectively; at the same time, based on the core property information under each of the sample index parameters, the core property change information corresponding to the sample research reactor is determined, based on the material property information under each of the sample index parameters, the material property change information corresponding to the sample test material is determined, and based on the device property information under each of the sample index parameters, the device property change information corresponding to the sample irradiation device is determined; then, based on the core property change information, material property change information and device property change information under each of the target selected indicators, the target evaluation indicators for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated are determined in each of the selected indicators; finally, the indicator parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation indicators are determined, and based on the indicator parameters, the safety of the high-temperature and high-pressure material irradiation test circuit to be evaluated is evaluated. Therefore, the present invention controls the sample high-temperature and high-pressure material irradiation test circuit to perform irradiation test under multiple indicator parameters corresponding to different candidate indicators, and determines which candidate indicators can affect the safety of the high-temperature and high-pressure material irradiation test circuit according to the actual changes of the research reactor, the actual changes of the test material, and the actual changes of the irradiation device during the irradiation test process. That is, among all the candidate indicators that may affect the safety of the high-temperature and high-pressure material irradiation test circuit, the target evaluation indicator that truly affects the safety of the high-temperature and high-pressure material irradiation test circuit is selected, and finally the safety of the high-temperature and high-pressure material irradiation test circuit is evaluated using the target evaluation indicator. That is, in the process of evaluating the safety of the high-temperature and high-pressure material irradiation test circuit, the present invention can ensure that all indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit are comprehensively analyzed, thereby improving the evaluation accuracy of the safety of the high-temperature and high-pressure material irradiation test circuit.

[0040] Further, in order to better illustrate the process of evaluating the safety of the high-temperature and high-pressure material irradiation test circuit, as a refinement and extension of the above embodiment, the embodiment of the present invention provides another method for evaluating the safety of the high-temperature and high-pressure material irradiation test circuit, such as Figure 3 As shown, the method includes:

[0041] 201. Determine multiple candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and take each candidate indicator as a target candidate indicator, and set multiple sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated.

[0042] 202. Based on the sample indicator parameters under the target candidate indicators, the sample high-temperature and high-pressure material irradiation test circuit is controlled to perform irradiation test on the sample test material. During the irradiation test, the core property information of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit under each sample indicator parameter, the material property information of the sample test material under each sample indicator parameter, and the device property information of the sample irradiation device under each sample indicator parameter are determined for the target candidate indicators.

[0043] 203. Based on the core property information under each sample index parameter, determine the core property change information corresponding to the sample research reactor; based on the material property information under each sample index parameter, determine the material property change information corresponding to the sample test material; based on the device property information under each sample index parameter, determine the device property change information corresponding to the sample irradiation device.

[0044] 204. Based on the core property change information, material property change information, and device property change information under each target candidate indicator, determine the target evaluation indicator for conducting a safety evaluation on the high-temperature and high-pressure material irradiation test circuit to be evaluated from among the candidate indicators.

[0045] For the embodiment of the present invention, multiple candidate indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit are determined, and multiple indicator parameters are set for each candidate indicator according to the test requirements. For example, if the candidate indicator is a circuit power indicator, multiple irradiation device circuit powers are set for the circuit power indicator (wherein the irradiation device circuit power refers to the energy rate processed or transmitted by the high-temperature and high-pressure material irradiation test circuit system), such as 20w, 50w, 80w, 110w, etc. Further, in order to select the target evaluation indicator that affects the safety of the high-temperature and high-pressure material irradiation test circuit from the candidate indicators, it is necessary to simulate the irradiation test process of the sample high-temperature and high-pressure material irradiation test circuit according to the different indicator parameters under each candidate indicator. Based on this, step 202 specifically includes: obtaining the three-dimensional structure information, material property information, operation parameter information, fluid parameter information, and expected working condition information of the sample high-temperature and high-pressure material irradiation test circuit; based on the three-dimensional structure information, material property information, operation parameter information, fluid parameter information, and expected working condition information, simulating the irradiation test process of the sample high-temperature and high-pressure material irradiation test circuit. A test circuit is modeled to obtain a digital high-temperature and high-pressure material irradiation test circuit model; based on the sample indicator parameters under the target selected indicators, the irradiation test process of the digital high-temperature and high-pressure material irradiation test circuit model under transient solar conditions is simulated using a preset transient thermal-hydraulic program; based on the simulation results, the core attribute information of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit under each of the sample indicator parameters, the material attribute information of the sample test material under each of the sample indicator parameters, and the device attribute information of the sample irradiation device under each of the sample indicator parameters are determined.

[0046] Among them, three-dimensional structural information refers to the structural composition information of the sample high-temperature and high-pressure material irradiation test circuit, the connection relationship of each structure, the size information of each structure, etc., material property information refers to the material type of each structure in the sample high-temperature and high-pressure material irradiation test circuit, etc., operating parameter information refers to the operating parameters of each mechanism that ensures the normal operation of the high-temperature and high-pressure material irradiation test circuit, fluid parameter information refers to the cooling water flow rate, cooling water inlet temperature, outlet temperature, and the temperature of each key component in the circuit that ensures the normal operation of the high-temperature and high-pressure material irradiation test circuit, expected operating condition information refers to the normal operating conditions of the high-temperature and high-pressure material irradiation test circuit, the conditions that are expected to occur during the operation process, etc., and the preset transient thermal-hydraulic program is a calculation program used to simulate and analyze transient processes (i.e., non-steady-state processes) during the irradiation test process.

[0047] Specifically, basic information such as the three-dimensional structure information, operating conditions, material properties, etc. of the sample high-temperature and high-pressure material irradiation test loop, as well as relevant experimental data and research results are collected as input data and verification basis for modeling. Then, the modeling tool is used to establish a geometric model of the sample high-temperature and high-pressure material irradiation test loop according to the actual structure of the high-temperature and high-pressure material irradiation test loop, that is, a digital high-temperature and high-pressure material irradiation test loop model. The model includes the geometric dimensions and relative positions of key components such as pipes, heat exchangers, pumps, valves, etc. in the loop. Under the premise of keeping the main physical phenomena unchanged, appropriate simplified assumptions can be made to the digital high-temperature and high-pressure material irradiation test loop model to reduce computational complexity and improve computational efficiency. For example, it can be assumed that the fluid flows in one dimension in the pipe, and the thermal resistance of the pipe wall can be ignored. At the same time, it is also necessary to define the thermal-hydraulic properties of fluids and solid materials in the high-temperature and high-pressure material irradiation test loop, such as thermal conductivity, density, specific heat capacity, viscosity, etc. These properties are crucial for accurately simulating heat exchange and fluid flow in the loop. At the same time, reasonable boundary conditions should be set, such as the temperature, pressure, and flow rate of the cooling water inlet and outlet of the high-temperature and high-pressure material irradiation test loop. Then, an appropriate transient thermal-hydraulic program should be selected to describe the flow, heat transfer, and mass transfer processes of the fluid in the high-temperature and high-pressure material irradiation test loop. These programs usually include continuity equations, momentum equations, energy equations, and possible radiation heat transfer equations. Furthermore, according to the established digital high-temperature and high-pressure material irradiation test loop model, the selected Select appropriate numerical methods to discretize and solve the equations, and mesh the established digital high-temperature and high-pressure material irradiation test loop model, discretize the continuous space region into a series of control volumes or grid units. The mesh division should fully consider the balance between calculation accuracy and calculation efficiency, and discretize the continuous equations in the digital high-temperature and high-pressure material irradiation test loop model into differential equations or algebraic equations suitable for numerical calculation. In this process, programming languages ​​such as Fortran, C++, Python and other languages ​​can be used to write transient thermal hydraulic analysis programs, convert the discretized mathematical model into computer executable code, and select appropriate solution algorithms to solve the discretized equations. In the solution process, it is necessary to set reasonable initial conditions and boundary conditions, and consider the selection of time steps and number of iterations to ensure the stability and accuracy of the solution results. After the digital high-temperature and high-pressure material irradiation test loop model is established, it is also necessary to experimentally verify the digital high-temperature and high-pressure material irradiation test loop model.That is, by comparing with the experimental data of the actual high temperature and high pressure material irradiation test circuit, the accuracy and reliability of the digital high temperature and high pressure material irradiation test circuit model are verified. The verification process involves experimental verification and error analysis of the model output results. According to the verification results, the parameters of the digital high temperature and high pressure material irradiation test circuit model are adjusted and optimized to make the working process of the digital high temperature and high pressure material irradiation test circuit model closer to the working process of the actual high temperature and high pressure material irradiation test circuit, thereby further improving the accuracy of determining the target evaluation indicators that affect the safety of the high temperature and high pressure material irradiation test circuit, and further improving the accuracy of evaluating the safety of the high temperature and high pressure material irradiation test circuit.

[0048] Furthermore, after the digital high-temperature and high-pressure material irradiation test loop model is established, the preset transient thermal-hydraulic program is used to simulate the irradiation test process of the digital high-temperature and high-pressure material irradiation test loop model under transient conditions of different index parameters. According to the simulation results, the core property information of the sample research reactor under different sample index parameters, the material property information of the sample test material under different sample index parameters, and the device property information of the sample irradiation device under different sample index parameters are obtained. For example, a preset transient thermal-hydraulic program is used to simulate the working process of the digital high-temperature and high-pressure material irradiation test loop model under different cooling water flow rates corresponding to the loop flow index. Through the simulation results, the core property information of the sample research reactor under different cooling water flow rates, the material property information of the sample test material under different cooling water flow rates, and the device property information of the sample irradiation device under different cooling water flow rates can be obtained. Finally, according to the core property information, material property information, and device property information under different indicator parameters corresponding to the same candidate indicator, the core property changes, material property changes, and device property changes under the candidate indicator are determined. Finally, according to the core property changes, material property changes, and device property changes, the target evaluation indicator that affects the safety of the high-temperature and high-pressure material irradiation test loop is determined in each candidate indicator. For example, if the core property change under a certain candidate indicator is that the core physical property changes greatly, or the thermal impact is large, it is determined that the candidate indicator will affect the safety of the high-temperature and high-pressure material irradiation test loop, so that the candidate indicator can be determined as the target evaluation indicator. Furthermore, a method for determining a target evaluation index for safety evaluation of a high-temperature and high-pressure material irradiation test circuit to be evaluated from among various candidate indicators specifically based on core property change information, material property change information, and device property change information includes: respectively determining a core change feature vector corresponding to the core property change information, a material change feature vector corresponding to the material property change information, and a device change feature vector corresponding to the device property change information under each of the target candidate indicators; respectively cross-processing the core change feature vector, the material change feature vector, and the device change feature vector under each of the target candidate indicators to obtain a cross feature vector under each of the target candidate indicators; respectively inputting the cross feature vector under each of the target candidate indicators into a preset indicator scoring model for score prediction to obtain an indicator score corresponding to each of the candidate indicators; and determining a target evaluation index for safety evaluation of a high-temperature and high-pressure material irradiation test circuit to be evaluated from among each of the candidate indicators based on the indicator scores.Among them, the method for cross-processing the core change feature vector, the material change feature vector, and the device change feature vector includes: multiplying the elements in the same position in the core change feature vector, the material change feature vector, and the device change feature vector to obtain each vector product, and respectively determining the transformation coefficient corresponding to each vector product, based on the transformation coefficient, performing linear transformation on the each vector product to obtain a fused feature vector; horizontally splicing the core change feature vector, the material change feature vector, and the device change feature vector to obtain a spliced ​​feature vector, and determining the splicing coefficient corresponding to the spliced ​​feature vector, based on the splicing coefficient, performing linear transformation on the spliced ​​feature vector to obtain a spliced ​​feature vector; based on the fused feature vector and the spliced ​​feature vector, determining the cross feature vector under each of the target selected indicators.

[0049] Among them, the transformation coefficient and the splicing coefficient are set according to actual needs. Specifically, the pre-trained neural network model can be used to analyze the core property change information, material property change information, and device property change information, and determine the target evaluation indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit based on the analysis results, so as to improve the determination efficiency and accuracy of the target evaluation indicators, and then improve the evaluation efficiency and accuracy of the safety of the high-temperature and high-pressure material irradiation test circuit. When using the model to predict the target evaluation indicators, the core change feature vector corresponding to the core property change information, the material change feature vector corresponding to the material property change information, and the device change feature vector corresponding to the device property change information can be determined in advance by using word embedding and other methods. Since the core change feature vector, the material change feature vector, and the device change feature vector are vectors of different fields and dimensions, in order to extract more invisible feature information from the core change feature vector, the material change feature vector, and the device change feature vector, and then improve the prediction accuracy of the model, it is necessary to cross-process the core change feature vector, the material change feature vector, and the device change feature vector. The cross-processing process is: if the core change feature vector is f(a 1 ,a 2 ), the material change characteristic vector is f(b 1 ,b 2 ), the device change characteristic vector is f(c 1 ,c 2 ), perform feature-level crossover between features of different filed, that is, perform Hadamard product on all elements between vectors, and then assign different transformation coefficients w to each product 1 、w 2 、w 3 , and then perform linear transformation under a certain transformation coefficient to obtain the fused feature vector: f(w 1 ×a 1 ×b1 ×c 1 ,w 2 ×a 2 ×b 2 ×c 2 ,w 3 ×a 3 ×b 3 ×c 3 ); At the same time, the core change characteristic vector, material change characteristic vector, and device change characteristic vector are horizontally spliced, and then linearly transformed under a certain splicing coefficient λ to obtain the splicing characteristic vector: f(λ(a 1 ,a 2 ,b 1 ,b 2 ,c 1 ,c 2)), finally, the above fused feature vectors and spliced ​​feature vectors are combined together, and the preset transformation function is used for transformation processing to obtain a cross feature vector, thereby, through the above method, the cross feature vector under each selected indicator can be obtained. It should be noted that the preset transformation function here can be set according to the actual situation, and the present embodiment does not limit this. It should be noted that the above examples are only illustrative and do not limit the embodiments of the present application. Therefore, by cross-processing the core change feature vector, the material change feature vector, and the device change feature vector, the relationship between different features can be fully utilized, and more implicit features can be extracted. At the same time, both high-order and low-order processing are taken into account, so that the feature data can be more fully utilized, and the target evaluation indicators obtained later are more accurate, meeting the needs of actual application scenarios. Furthermore, after obtaining the cross-feature vectors under each candidate indicator, the cross-feature vectors under each candidate indicator are respectively input into the preset indicator scoring model for score prediction. The indicator scoring model can output the indicator score corresponding to each candidate indicator. The candidate indicator score represents the degree of influence on the safety of the high-temperature and high-pressure material irradiation test circuit. The higher the indicator score, the greater the degree of influence on the safety of the high-temperature and high-pressure material irradiation test circuit. Then, among the indicator scores corresponding to each candidate indicator, the target indicator score whose indicator score is greater than the preset threshold is determined, and finally the candidate indicator corresponding to the target indicator score is determined as the target evaluation indicator that affects the safety of the high-temperature and high-pressure material irradiation test circuit. It should be noted that in order to further improve the prediction accuracy of the preset indicator scoring model, before using the preset indicator scoring model to predict the indicator score, the preset indicator scoring model can be trained and constructed. For example, a preset initial model can be pre-constructed and sample data can be obtained, wherein the sample data includes sample core property change information, sample material property change information, sample device property change information, and actual indicator scores corresponding to the sample indicators corresponding to the sample indicators; based on the number of preset initial models, the sample data is divided into multiple groups of training data and test data; each group of training data is used to train the corresponding preset initial model to obtain the trained preset initial model; each group of test data is used to test the prediction accuracy of the corresponding trained preset initial model, and finally the preset initial model with the highest prediction accuracy is selected as the preset indicator scoring model.

[0050] 205. If the target evaluation indicators include loop flow index, loop power index, loop main pipeline index, irradiation device insulation pipe index, and irradiation device pressure pipe index, then obtain the loop cooling water property information of the irradiation loop under the loop flow index, the loop physical information of the irradiation loop under the loop power index, the main pipeline shape information of the loop main pipeline under the loop main pipeline index, the insulation pipe weld information of the irradiation device insulation pipe under the irradiation device insulation pipe index, and the pressure pipe weld information of the irradiation device pressure pipe under the irradiation device pressure pipe index.

[0051] Among them, the structure and composition of the high temperature and high pressure material irradiation test circuit to be evaluated are Figure 2 The structural composition of the medium sample high temperature and high pressure material irradiation test circuit is the same, including: irradiation circuit, circuit main pipeline, irradiation device insulation pipe, irradiation device pressure pipe, test material, research reactor, and research reactor cooling water.

[0052] 206. Based on the loop cooling water property information, loop physical information, main pipeline shape information, insulation pipe weld information, and pressure pipe weld information, a safety assessment is performed on the high-temperature and high-pressure material irradiation test loop to be assessed, and a safety assessment result corresponding to the high-temperature and high-pressure material irradiation test loop to be assessed is obtained.

[0053] Among them, the loop cooling water attribute information includes the loop cooling water flow rate, the loop physical information includes the loop power, the main pipeline shape information includes whether there is a rupture in the main pipeline of the irradiation device, the insulation pipe weld information refers to whether the insulation pipe weld of the irradiation device is broken, and the pressure pipe weld information refers to whether the pressure pipe weld of the irradiation device is broken, etc.

[0054] For the embodiment of the present invention, after determining that the target evaluation indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit are the circuit flow index, the circuit power index, the circuit main pipeline index, the irradiation device insulation pipe index, and the irradiation device pressure pipe index, the indicator parameters under the previous evaluation indicators are obtained, and then the safety of the high-temperature and high-pressure material irradiation test circuit is evaluated according to the indicator parameters under each evaluation indicator. Based on this, step 206 specifically includes: based on the circuit cooling water attribute information, judging whether the cooling water flow of the irradiation circuit is less than the preset flow threshold; or, based on the circuit physical information, judging whether the power of the irradiation circuit is greater than the preset power threshold; or, based on the main pipeline shape information, judging whether there is a gap in the pipe wall of the circuit main pipeline; or, based on the insulation pipe weld information, judging whether the insulation pipe weld on the insulation pipe of the irradiation device is broken; or, based on the pressure pipe weld information, to determine whether the pressure tube weld on the pressure tube of the irradiation device is broken; if the cooling water flow rate is less than a preset flow rate threshold, or the power is greater than a preset power threshold, or a notch appears in the tube wall, or the insulation tube weld is broken, or the pressure tube weld is broken, then the cooling water pressure in the irradiation loop, the material temperature on the surface of the test material, the water temperature of the research reactor cooling water, and the core distribution information of the research reactor are obtained, and based on the cooling water pressure, material temperature, the water temperature of the research reactor cooling water, and the core distribution information, the safety of the irradiation test loop of the high-temperature and high-pressure material to be evaluated is evaluated; if the cooling water flow rate is greater than or equal to the preset flow rate threshold, and the power is less than or equal to the preset power threshold, and there is no notch in the tube wall, and there is no break in the insulation tube weld, and there is no break in the pressure tube weld, then it is determined that the irradiation test loop of the high-temperature and high-pressure material to be evaluated is safe.Wherein, based on the cooling water pressure, material temperature, water temperature of the research reactor cooling water, and core distribution information, the method for evaluating the safety of the irradiation test circuit of the high-temperature and high-pressure material to be evaluated includes: judging whether the cooling water pressure is greater than a preset pressure threshold; judging whether the material temperature is greater than a preset temperature threshold; judging whether the water temperature of the research reactor cooling water is greater than a preset water temperature threshold; judging whether the power distribution in the core distribution information meets the distribution requirements, and judging whether the core reactivity change in the core distribution information meets the change requirements; if the cooling water pressure is greater than the preset pressure threshold, or the material temperature is greater than the preset temperature threshold, or the water temperature of the research reactor cooling water is greater than the preset water temperature threshold, or the power distribution does not meet the distribution requirements, or the core reactivity change does not meet the change requirements, then it is judged that the irradiation test circuit of the high-temperature and high-pressure material to be evaluated is unsafe; if the cooling water pressure is less than or equal to the preset pressure threshold, the material temperature is less than or equal to the preset temperature threshold, the water temperature of the research reactor cooling water is less than or equal to the preset water temperature threshold, the power distribution meets the distribution requirements, and the core reactivity change meets the change requirements, then it is judged that the irradiation test circuit of the high-temperature and high-pressure material to be evaluated is safe.

[0055] Among them, the preset flow threshold, preset power threshold, preset pressure threshold, preset temperature threshold, preset water temperature threshold, distribution requirements, and change requirements are set according to actual needs. Specifically, if the cooling water flow is less than the preset flow threshold, or the power of the irradiation loop is greater than the preset power threshold, for example, for the two accident conditions where the loop cooling water flow is reduced to less than 80% of the initial rated flow and the loop power is increased to more than 120% of the initial rated power, the high-temperature and high-pressure material irradiation test loop system is modeled through a transient thermal-hydraulic program to analyze the changes in the temperature of the test material and the loop cooling water temperature when the above-mentioned cooling water flow or power parameters change, and to evaluate the impact of the above-mentioned changes on the core physics and thermal engineering of the research reactor, that is, to determine whether the cooling water pressure in the loop exceeds the preset pressure threshold, whether the material surface temperature of the test material exceeds the preset temperature threshold, such as whether it exceeds the zirconium-water reaction temperature, and whether the water temperature of the research reactor cooling water exceeds If the cooling water pressure in the loop does not exceed the preset pressure threshold, the material surface temperature of the test material does not exceed the preset temperature threshold, the water temperature of the cooling water of the research reactor does not exceed the preset water temperature threshold, and the power distribution and reactivity changes in the research reactor core meet the required limits, the high-temperature and high-pressure material irradiation test loop is judged to be safe. If the cooling water pressure in the loop exceeds the preset pressure threshold, the material surface temperature of the test material exceeds the preset temperature threshold, the water temperature of the cooling water of the research reactor exceeds the preset water temperature threshold, and the power distribution and reactivity changes in the research reactor core do not meet the required limits, any of the following conditions are met, the high-temperature and high-pressure material irradiation test loop is judged to be unsafe.

[0056] Furthermore, if a hole appears in the wall of the loop main pipeline, the high-temperature and high-pressure water inside the irradiator will be completely vaporized. At this time, the heat is extracted through radiation heat exchange between the pressure pipe and the insulation pipe of the irradiator, and the outer surface of the insulation pipe is cooled by the research reactor cooling water. At this time, a steady-state thermal hydraulic program is used to model this condition. The heat of the test material and the pressure pipe of the irradiator is transferred to the insulation pipe through radiation heat exchange, and the insulation pipe is cooled by the cooling water flowing on its outer surface. The changes in the test material temperature, the pressure pipe temperature, the insulation pipe temperature, and the research reactor cooling water temperature outside the insulation pipe under this condition are calculated, and the impact on the reactivity and non-uniformity coefficient of the research reactor core is evaluated. That is, if the test sample When the surface temperature of the sample does not exceed the specified value (preset temperature threshold), the pressure tube can maintain structural integrity, the research reactor cooling water temperature rise does not exceed the operating limit temperature (preset water temperature threshold), and the research reactor core power distribution change and reactivity change do not exceed the operating limit (meeting the distribution requirements and change requirements), it is determined that the high temperature and high pressure material irradiation test circuit is safe under this condition. If any of the following situations occurs: the surface temperature of the test sample exceeds the specified value, the pressure tube cannot maintain structural integrity, the research reactor cooling water temperature rises above the operating limit temperature, and the research reactor core power distribution changes and reactivity changes exceed the operating limit, the high temperature and high pressure material irradiation test circuit is determined to be unsafe.

[0057] Furthermore, if the insulation pipe weld on the insulation pipe of the irradiation device is broken, the research reactor cooling water is in direct contact with the irradiation device pressure pipe in a high temperature state. Under this operating condition, the maximum temperature difference that may occur in the pressure pipe is analyzed, the stress condition of the pressure pipe under the maximum temperature difference is calculated, and the impact on the physics and thermal engineering of the research reactor core is evaluated. That is, if the pressure pipe can maintain structural integrity, the research reactor cooling water temperature rise does not exceed the operating limit temperature, and the research reactor core power distribution changes and reactivity changes do not exceed the operating limits, then under this operating condition, the high-temperature and high-pressure material irradiation test circuit is safe. If the pressure pipe cannot maintain structural integrity, the research reactor cooling water temperature rises above the operating limit temperature, and the research reactor core power distribution changes and reactivity changes exceed the operating limits, if any of the above conditions are met, it is determined that the high-temperature and high-pressure material irradiation test circuit is unsafe.

[0058] Furthermore, if the pressure tube weld on the pressure tube of the irradiation device is broken, for the rupture accident of the pressure tube of the irradiation device, firstly, the maximum temperature and pressure generated by the high-temperature and high-pressure cooling water in the pressure tube after vaporization on the insulation tube are analyzed, and then the impact force generated on the insulation tube after the pressure tube is ejected is analyzed. Finally, the stress condition of the insulation tube is evaluated after superimposing the temperature, pressure and impact loads, and the impact on the physics and thermal engineering of the research reactor core is evaluated. That is, if the insulation tube can maintain structural integrity, the temperature rise of the research reactor cooling water does not exceed the operating limit temperature, and the power distribution change and reactivity change of the research reactor core do not exceed the operating limit, then it is determined that under the rupture accident of the irradiation device pressure tube, the high-temperature and high-pressure material irradiation test circuit is safe. If the insulation tube cannot maintain structural integrity, the temperature rise of the research reactor cooling water exceeds the operating limit temperature, and the power distribution change and reactivity change of the research reactor core exceed the operating limit, if any of the above conditions are met, then it is determined that the high-temperature and high-pressure material irradiation test circuit is unsafe.

[0059] Further, if the cooling water flow is greater than or equal to the preset flow threshold, the power is less than or equal to the preset power threshold, there is no gap in the pipe wall, there is no fracture in the insulation pipe weld, and there is no fracture in the pressure pipe weld, then the high temperature and high pressure material irradiation test circuit to be evaluated is determined to be safe. Therefore, the benchmark accident for accident analysis is determined in combination with the characteristics of the high temperature and high pressure material irradiation test circuit, and the analysis method for various benchmark accidents is formulated, and the safety judgment basis for different benchmark accidents is formulated. Through this method, the safety of the high temperature and high pressure material irradiation test circuit can be fully evaluated, and the accuracy of the evaluation of the safety of the high temperature and high pressure material irradiation test circuit can be improved. If the circuit is not safe, in order to optimize and improve the design scheme and ensure the safety of the circuit itself and the research reactor, at the same time, the benchmark accidents selected by the embodiment of the present invention include reduced circuit flow, increased circuit power, circuit main pipeline rupture, irradiation device insulation pipe rupture, irradiation device pressure pipe rupture, and the benchmark accident covers various accidents that have an impact on the safety of the high temperature and high pressure material irradiation test circuit, ensuring the accuracy of the safety analysis.

[0060] According to another method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit provided by the present invention, compared with the current method of estimating the safety of a high-temperature and high-pressure material irradiation test circuit based only on the working time of the high-temperature and high-pressure material irradiation test circuit, the present invention determines a plurality of candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and takes each of the candidate indicators as a target candidate indicator, and sets a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated; and based on each of the sample indicator parameters under the target candidate indicator, the sample high-temperature and high-pressure material irradiation test circuit is controlled to perform irradiation test on the sample test material, and during the irradiation test process, the core attribute information and sample test material classification of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit are determined for the target candidate indicator. The material property information under each of the sample index parameters and the device property information of the sample irradiation device under each of the sample index parameters are determined respectively; at the same time, based on the core property information under each of the sample index parameters, the core property change information corresponding to the sample research reactor is determined, based on the material property information under each of the sample index parameters, the material property change information corresponding to the sample test material is determined, and based on the device property information under each of the sample index parameters, the device property change information corresponding to the sample irradiation device is determined; then, based on the core property change information, material property change information and device property change information under each of the target selected indicators, the target evaluation indicators for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated are determined in each of the selected indicators; finally, the indicator parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation indicators are determined, and based on the indicator parameters, the safety of the high-temperature and high-pressure material irradiation test circuit to be evaluated is evaluated. Therefore, the present invention controls the sample high-temperature and high-pressure material irradiation test circuit to perform irradiation test under multiple indicator parameters corresponding to different candidate indicators, and determines which candidate indicators can affect the safety of the high-temperature and high-pressure material irradiation test circuit according to the actual changes of the research reactor, the actual changes of the test material, and the actual changes of the irradiation device during the irradiation test process. That is, among all the candidate indicators that may affect the safety of the high-temperature and high-pressure material irradiation test circuit, the target evaluation indicator that truly affects the safety of the high-temperature and high-pressure material irradiation test circuit is selected, and finally the safety of the high-temperature and high-pressure material irradiation test circuit is evaluated using the target evaluation indicator. That is, in the process of evaluating the safety of the high-temperature and high-pressure material irradiation test circuit, the present invention can ensure that all indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit are comprehensively analyzed, thereby improving the evaluation accuracy of the safety of the high-temperature and high-pressure material irradiation test circuit.

[0061] Further, as Figure 1 In a specific implementation, an embodiment of the present invention provides a device for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit, such as Figure 4 As shown, the device includes: a setting unit 31, a first determining unit 32, a second determining unit 33, a third determining unit 34, and an evaluating unit 35.

[0062] The setting unit 31 can be used to determine multiple candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and take each of the candidate indicators as a target candidate indicator, and set multiple sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated.

[0063] The first determination unit 32 can be used to control the sample high-temperature and high-pressure material irradiation test circuit to perform irradiation test on the sample test material based on each of the sample indicator parameters under the target selected indicator. During the irradiation test, the core attribute information of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit under each of the sample indicator parameters, the material attribute information of the sample test material under each of the sample indicator parameters, and the device attribute information of the sample irradiation device under each of the sample indicator parameters are determined for the target selected indicator.

[0064] The second determination unit 33 can be used to determine the core property change information corresponding to the sample research reactor based on the core property information under each of the sample index parameters, determine the material property change information corresponding to the sample test material based on the material property information under each of the sample index parameters, and determine the device property change information corresponding to the sample irradiation device based on the device property information under each of the sample index parameters.

[0065] The third determination unit 34 can be used to determine the target evaluation index for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated in each of the target candidate indicators based on the core property change information, material property change information, and device property change information under each of the target candidate indicators.

[0066] The evaluation unit 35 can be used to determine the index parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation index, and based on the index parameters, perform a safety evaluation on the high-temperature and high-pressure material irradiation test circuit to be evaluated.

[0067] In specific application scenarios, in order to conduct safety assessment on the irradiation test circuit of high temperature and high pressure materials to be evaluated, such as Figure 5 As shown, the evaluation unit 35 includes: a first acquisition module 351 and an evaluation module 352 .

[0068] The first acquisition module 351 can be used to obtain the loop cooling water property information of the irradiation loop under the loop flow index, the loop physical information of the irradiation loop under the loop power index, the main pipeline shape information of the loop main pipeline under the loop main pipeline index, the insulation pipe weld information of the irradiation device insulation pipe under the irradiation device insulation pipe index, and the pressure pipe weld information of the irradiation device pressure pipe under the irradiation device pressure pipe index.

[0069] The evaluation module 352 can be used to perform a safety evaluation on the high-temperature and high-pressure material irradiation test circuit to be evaluated based on the circuit cooling water property information, circuit physical information, main pipeline shape information, insulation pipe weld information, and pressure pipe weld information, and obtain a safety evaluation result corresponding to the high-temperature and high-pressure material irradiation test circuit to be evaluated.

[0070] In a specific application scenario, in order to conduct a safety assessment on the irradiation test circuit of the high-temperature and high-pressure material to be assessed, the assessment module 352 can be specifically used to determine whether the cooling water flow of the irradiation circuit is less than a preset flow threshold based on the cooling water property information of the circuit; or, based on the physical information of the circuit, determine whether the power of the irradiation circuit is greater than a preset power threshold; or, based on the main pipeline shape information, determine whether a gap appears in the pipe wall of the main pipeline of the circuit; or, based on the insulation pipe weld information, determine whether the insulation pipe weld on the insulation pipe of the irradiation device is broken; or, based on the pressure pipe weld information, determine whether the pressure pipe weld on the pressure pipe of the irradiation device is broken; if the cooling water flow is less than the preset flow threshold, or the power is greater than A preset power threshold is met, or a notch appears in the tube wall, or a fracture appears in the insulation tube weld, or a fracture appears in the pressure tube weld, then the cooling water pressure in the irradiation loop, the material temperature on the surface of the test material, the water temperature of the research reactor cooling water, and the core distribution information of the research reactor are obtained, and based on the cooling water pressure, material temperature, the water temperature of the research reactor cooling water, and the core distribution information, the safety of the irradiation test loop for the high-temperature and high-pressure material to be evaluated is evaluated; if the cooling water flow rate is greater than or equal to the preset flow rate threshold, and the power is less than or equal to the preset power threshold, and there is no notch in the tube wall, and there is no fracture in the insulation tube weld, and there is no fracture in the pressure tube weld, then it is determined that the irradiation test loop for the high-temperature and high-pressure material to be evaluated is safe.

[0071] In a specific application scenario, in order to evaluate the safety of the irradiation test circuit of the high-temperature and high-pressure material to be evaluated, the evaluation module 352 can be specifically used to determine whether the cooling water pressure is greater than a preset pressure threshold; determine whether the material temperature is greater than a preset temperature threshold; determine whether the water temperature of the research reactor cooling water is greater than a preset water temperature threshold; determine whether the power distribution in the core distribution information meets the distribution requirements, and determine whether the core reactivity change in the core distribution information meets the change requirements; if the cooling water pressure is greater than the preset pressure threshold, or the material temperature is greater than the preset temperature threshold, or the water temperature of the research reactor cooling water is greater than the preset water temperature threshold, or the power distribution does not meet the distribution requirements, or the core reactivity change does not meet the change requirements, then the irradiation test circuit of the high-temperature and high-pressure material to be evaluated is determined to be unsafe; if the cooling water pressure is less than or equal to the preset pressure threshold, the material temperature is less than or equal to the preset temperature threshold, the water temperature of the research reactor cooling water is less than or equal to the preset water temperature threshold, the power distribution meets the distribution requirements, and the core reactivity change meets the change requirements, then the irradiation test circuit of the high-temperature and high-pressure material to be evaluated is determined to be safe.

[0072] In a specific application scenario, in order to determine the changes in the sample high-temperature and high-pressure material irradiation test circuit under various target indicators, the first determination unit 32 includes a second acquisition module 321, a modeling module 322, and a simulation module 323.

[0073] The second acquisition module 321 can be used to obtain the three-dimensional structure information, material property information, operation parameter information, fluid parameter information, and expected operating condition information of the sample high-temperature and high-pressure material irradiation test circuit.

[0074] The modeling module 322 can be used to model the sample high-temperature and high-pressure material irradiation test circuit based on the three-dimensional structure information, material property information, operating parameter information, fluid parameter information, and expected operating condition information to obtain a digital high-temperature and high-pressure material irradiation test circuit model.

[0075] The simulation module 323 can be used to simulate the irradiation test process of the digital high-temperature and high-pressure material irradiation test loop model under transient solar conditions based on each of the sample indicator parameters under the target selected indicators, and based on the simulation results, determine the core attribute information of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test loop under each of the sample indicator parameters, the material attribute information of the sample test material under each of the sample indicator parameters, and the device attribute information of the sample irradiation device under each of the sample indicator parameters.

[0076] In a specific application scenario, in order to determine the target evaluation index for the safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated, the third determination unit 34 includes a determination module 341, a cross module 342, and a prediction module 343.

[0077] The determination module 341 may be used to respectively determine the core change feature vector corresponding to the core property change information, the material change feature vector corresponding to the material property change information, and the device change feature vector corresponding to the device property change information under each of the target selected indicators.

[0078] The cross module 342 can be used to cross-process the core change feature vector, material change feature vector, and device change feature vector under each of the target candidate indicators, respectively, to obtain a cross feature vector under each of the target candidate indicators.

[0079] The prediction module 343 can be used to input the cross-feature vectors under each of the target candidate indicators into a preset indicator scoring model for score prediction, so as to obtain the indicator scores corresponding to each of the candidate indicators.

[0080] The determination module 341 can be used to determine the target evaluation index for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated from among the candidate indicators based on the scores of the indicators.

[0081] In a specific application scenario, in order to cross-process the core change feature vector, the material change feature vector, and the device change feature vector, the cross module 342 can be specifically used to multiply the elements in the same position in the core change feature vector, the material change feature vector, and the device change feature vector to obtain each vector product, and respectively determine the transformation coefficient corresponding to each vector product, and based on the transformation coefficient, perform a linear transformation on the each vector product to obtain a fused feature vector; horizontally splice the core change feature vector, the material change feature vector, and the device change feature vector to obtain a spliced ​​feature vector, and determine the splicing coefficient corresponding to the spliced ​​feature vector, and based on the splicing coefficient, perform a linear transformation on the spliced ​​feature vector to obtain a spliced ​​feature vector; based on the fused feature vector and the splicing feature vector, determine the cross feature vector under each of the target selected indicators.

[0082] It should be noted that for other corresponding descriptions of the functional modules involved in the high-temperature and high-pressure material irradiation test circuit safety assessment device provided in the embodiment of the present invention, reference can be made to Figure 1 The corresponding description of the method shown will not be repeated here.

[0083] Based on the above Figure 1The method shown, accordingly, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the following steps are implemented: determining a plurality of candidate indicators corresponding to a sample high-temperature and high-pressure material irradiation test circuit, and taking each of the candidate indicators as a target candidate indicator, and setting a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated; based on each of the sample indicator parameters under the target candidate indicator, respectively controlling the sample high-temperature and high-pressure material irradiation test circuit to perform irradiation test on the sample test material, and during the irradiation test process, determining the core attribute information of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit under each of the sample indicator parameters, and the sample test material under each of the sample indicators respectively. The material property information under the target indicator parameters and the device property information of the sample irradiation device under each of the sample indicator parameters respectively; based on the core property information under each of the sample indicator parameters, the core property change information corresponding to the sample research reactor is determined; based on the material property information under each of the sample indicator parameters, the material property change information corresponding to the sample test material is determined; based on the device property information under each of the sample indicator parameters, the device property change information corresponding to the sample irradiation device is determined; based on the core property change information, material property change information and device property change information under each of the target selected indicators, the target evaluation indicator for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated is determined; the indicator parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation indicators are determined, and based on the indicator parameters, the safety of the high-temperature and high-pressure material irradiation test circuit to be evaluated is evaluated.

[0084] Based on the above Figure 1 The method shown and Figure 4 The embodiment of the device shown in the figure, the embodiment of the present invention also provides a physical structure diagram of a computer device, such as Figure 6As shown, the computer device includes: a processor 41, a memory 42, and a computer program stored in the memory 42 and executable on the processor, wherein the memory 42 and the processor 41 are both arranged on a bus 43, and the processor 41 implements the following steps when executing the program: determining a plurality of candidate indicators corresponding to the sample high temperature and high pressure material irradiation test circuit, and taking each of the candidate indicators as a target candidate indicator, and setting a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high temperature and high pressure material irradiation test circuit has the same structural properties as the high temperature and high pressure material irradiation test circuit to be evaluated; based on each of the sample indicator parameters under the target candidate indicator, controlling the sample high temperature and high pressure material irradiation test circuit to perform irradiation test on the sample test material, and during the irradiation test, determining the core property information of the sample research reactor corresponding to the sample high temperature and high pressure material irradiation test circuit under each of the sample indicator parameters for the target candidate indicator. information, material property information of sample test materials under each of the sample index parameters, and device property information of sample irradiation devices under each of the sample index parameters; based on the core property information under each of the sample index parameters, determine the core property change information corresponding to the sample research reactor, based on the material property information under each of the sample index parameters, determine the material property change information corresponding to the sample test materials, and based on the device property information under each of the sample index parameters, determine the device property change information corresponding to the sample irradiation device; based on the core property change information, material property change information, and device property change information under each of the target selected indicators, determine the target evaluation indicator for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated in each of the selected indicators; determine the index parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation indicators, and based on the index parameters, perform safety evaluation on the high-temperature and high-pressure material irradiation test circuit to be evaluated.

[0085] Through the technical scheme of the present invention, the present invention determines a plurality of candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and takes each of the candidate indicators as a target candidate indicator, and sets a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated; and based on each of the sample indicator parameters under the target candidate indicator, controls the sample high-temperature and high-pressure material irradiation test circuit to perform irradiation test on the sample test material, and during the irradiation test, determines the core attribute information of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test circuit under each of the sample indicator parameters, the material attribute information of the sample test material under each of the sample indicator parameters, and the sample irradiation device under each of the sample device property information under the indicator parameters; at the same time, based on the core property information under each of the sample indicator parameters, the core property change information corresponding to the sample research reactor is determined, based on the material property information under each of the sample indicator parameters, the material property change information corresponding to the sample test material is determined, and based on the device property information under each of the sample indicator parameters, the device property change information corresponding to the sample irradiation device is determined; then, based on the core property change information, material property change information, and device property change information under each of the target selected indicators, the target evaluation indicators for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated are determined in each of the selected indicators; finally, the indicator parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation indicators are determined, and based on the indicator parameters, the safety of the high-temperature and high-pressure material irradiation test circuit to be evaluated is evaluated. Therefore, the present invention controls the sample high-temperature and high-pressure material irradiation test circuit to perform irradiation test under multiple indicator parameters corresponding to different candidate indicators, and determines which candidate indicators can affect the safety of the high-temperature and high-pressure material irradiation test circuit according to the actual changes of the research reactor, the actual changes of the test material, and the actual changes of the irradiation device during the irradiation test process. That is, among all the candidate indicators that may affect the safety of the high-temperature and high-pressure material irradiation test circuit, the target evaluation indicator that truly affects the safety of the high-temperature and high-pressure material irradiation test circuit is selected, and finally the safety of the high-temperature and high-pressure material irradiation test circuit is evaluated using the target evaluation indicator. That is, in the process of evaluating the safety of the high-temperature and high-pressure material irradiation test circuit, the present invention can ensure that all indicators that affect the safety of the high-temperature and high-pressure material irradiation test circuit are comprehensively analyzed, thereby improving the evaluation accuracy of the safety of the high-temperature and high-pressure material irradiation test circuit.

[0086] Obviously, those skilled in the art should understand that the above modules or steps of the present invention can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, and optionally, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order than here, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present invention is not limited to any specific combination of hardware and software.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit, characterized in that: include: Determine a plurality of candidate indicators corresponding to the sample high-temperature and high-pressure material irradiation test circuit, and use each of the candidate indicators as a target candidate indicator, and set a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated; Based on each of the sample indicator parameters under the target candidate indicator, the sample high temperature and high pressure material irradiation test circuit is controlled to perform irradiation test on the sample test material. During the irradiation test, the core property information of the sample research reactor corresponding to the sample high temperature and high pressure material irradiation test circuit under each of the sample indicator parameters, the material property information of the sample test material under each of the sample indicator parameters, and the device property information of the sample irradiation device under each of the sample indicator parameters are determined for the target candidate indicator. Based on the core property information under each of the sample index parameters, determine the core property change information corresponding to the sample research reactor; based on the material property information under each of the sample index parameters, determine the material property change information corresponding to the sample test material; based on the device property information under each of the sample index parameters, determine the device property change information corresponding to the sample irradiation device; Based on the core property change information, material property change information, and device property change information under each of the target candidate indicators, determine the target evaluation indicator for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated from each of the candidate indicators; Determine the index parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation index, and based on the index parameters, perform a safety assessment on the high-temperature and high-pressure material irradiation test circuit to be evaluated.

2. The method according to claim 1, characterized in that The irradiation test circuit of the high-temperature and high-pressure material to be evaluated includes an irradiation circuit, a circuit main pipeline, an irradiation device insulation pipe, an irradiation device pressure pipe, a test material, a research reactor, and research reactor cooling water; if the target evaluation index includes a circuit flow index, a circuit power index, a circuit main pipeline index, an irradiation device insulation pipe index, and an irradiation device pressure pipe index; based on the index parameters, the safety evaluation of the irradiation test circuit of the high-temperature and high-pressure material to be evaluated includes: Obtaining loop cooling water property information of the irradiation loop under the loop flow index, loop physical information of the irradiation loop under the loop power index, main pipeline shape information of the loop main pipeline under the loop main pipeline index, thermal insulation pipe weld information of the irradiation device thermal insulation pipe under the irradiation device thermal insulation pipe index, and pressure pipe weld information of the irradiation device pressure pipe under the irradiation device pressure pipe index; Based on the loop cooling water property information, loop physical information, main pipeline shape information, insulation pipe weld information, and pressure pipe weld information, a safety assessment is performed on the high-temperature and high-pressure material irradiation test loop to be evaluated, and a safety assessment result corresponding to the high-temperature and high-pressure material irradiation test loop to be evaluated is obtained.

3. The method according to claim 2, characterized in that Based on the loop cooling water property information, loop physical information, main pipeline shape information, insulation pipe weld information, and pressure pipe weld information, a safety assessment is performed on the high-temperature and high-pressure material irradiation test loop to be assessed, and a safety assessment result corresponding to the high-temperature and high-pressure material irradiation test loop to be assessed is obtained, including: Based on the loop cooling water property information, determining whether the cooling water flow rate of the irradiation loop is less than a preset flow rate threshold; or, Based on the circuit physical information, determining whether the power of the irradiation circuit is greater than a preset power threshold; or, Based on the main pipeline shape information, determine whether there is a gap in the pipe wall of the loop main pipeline; or, Based on the insulation pipe weld information, determine whether the insulation pipe weld on the insulation pipe of the irradiation device is broken; or, Based on the pressure pipe weld information, determining whether a pressure pipe weld on the pressure pipe of the irradiation device is broken; If the cooling water flow rate is less than a preset flow rate threshold, or the power is greater than a preset power threshold, or a notch appears in the tube wall, or a fracture appears in the insulation tube weld, or a fracture appears in the pressure tube weld, then the cooling water pressure in the irradiation loop, the material temperature on the surface of the test material, the water temperature of the research reactor cooling water, and the core distribution information of the research reactor are obtained, and based on the cooling water pressure, material temperature, the water temperature of the research reactor cooling water, and the core distribution information, the safety of the irradiation test loop of the high-temperature and high-pressure material to be evaluated is evaluated; If the cooling water flow rate is greater than or equal to the preset flow rate threshold, and the power is less than or equal to the preset power threshold, and there is no gap in the pipe wall, and there is no break in the insulation pipe weld, and there is no break in the pressure pipe weld, then the irradiation test circuit of the high-temperature and high-pressure material to be evaluated is determined to be safe.

4. The method according to claim 3, characterized in that: The safety of the irradiation test loop of the high-temperature and high-pressure material to be evaluated is evaluated based on the cooling water pressure, the material temperature, the water temperature of the research reactor cooling water, and the core distribution information, including: Determining whether the cooling water pressure is greater than a preset pressure threshold; Determining whether the temperature of the material is greater than a preset temperature threshold; Determine whether the temperature of the research reactor cooling water is greater than the preset water temperature threshold; Determining whether the power distribution in the core distribution information meets the distribution requirement, and determining whether the core reactivity change in the core distribution information meets the change requirement; If the cooling water pressure is greater than a preset pressure threshold, or the material temperature is greater than a preset temperature threshold, or the water temperature of the research reactor cooling water is greater than a preset water temperature threshold, or the power distribution does not meet the distribution requirements, or the core reactivity change does not meet the change requirements, then it is determined that the irradiation test circuit of the high-temperature and high-pressure material to be evaluated is unsafe; If the cooling water pressure is less than or equal to the preset pressure threshold, the material temperature is less than or equal to the preset temperature threshold, the water temperature of the research reactor cooling water is less than or equal to the preset water temperature threshold, the power distribution meets the distribution requirements, and the core reactivity change meets the change requirements, then the irradiation test circuit of the high-temperature and high-pressure material to be evaluated is determined to be safe.

5. The method according to claim 1, characterized in that Based on each of the sample indicator parameters under the target candidate indicator, the sample high temperature and high pressure material irradiation test circuit is controlled to perform irradiation test on the sample test material. During the irradiation test, the core property information of the sample research reactor corresponding to the sample high temperature and high pressure material irradiation test circuit under each of the sample indicator parameters, the material property information of the sample test material under each of the sample indicator parameters, and the device property information of the sample irradiation device under each of the sample indicator parameters are determined for the target candidate indicator, including: Obtaining three-dimensional structure information, material property information, operating parameter information, fluid parameter information, and expected operating condition information of the sample high-temperature and high-pressure material irradiation test circuit; Based on the three-dimensional structure information, material property information, operation parameter information, fluid parameter information, and expected operating condition information, the sample high temperature and high pressure material irradiation test circuit is modeled to obtain a digital high temperature and high pressure material irradiation test circuit model; Based on each of the sample indicator parameters under the target candidate indicator, the preset transient thermal-hydraulic program is used to simulate the irradiation test process of the digital high-temperature and high-pressure material irradiation test loop model under transient conditions. Based on the simulation results, the core attribute information of the sample research reactor corresponding to the sample high-temperature and high-pressure material irradiation test loop under each of the sample indicator parameters, the material attribute information of the sample test material under each of the sample indicator parameters, and the device attribute information of the sample irradiation device under each of the sample indicator parameters are determined.

6. The method according to claim 1, characterized in that Based on the core property change information, material property change information, and device property change information under each of the target candidate indicators, determining the target evaluation indicator for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated from each of the candidate indicators includes: Respectively determine a core change feature vector corresponding to the core property change information, a material change feature vector corresponding to the material property change information, and a device change feature vector corresponding to the device property change information under each of the target selected indicators; Cross-processing the core change feature vector, the material change feature vector, and the device change feature vector under each of the target candidate indicators respectively to obtain a cross feature vector under each of the target candidate indicators; Inputting the cross-feature vectors of each target candidate indicator into a preset indicator scoring model for score prediction to obtain the indicator scores corresponding to each candidate indicator; Based on the scores of each of the indicators, a target evaluation indicator for conducting a safety evaluation on the high-temperature and high-pressure material irradiation test circuit to be evaluated is determined from among the candidate indicators.

7. The method according to claim 6, characterized in that The cross-processing of the core change feature vector, the material change feature vector, and the device change feature vector under each of the target candidate indicators to obtain the cross-feature vector under each of the target candidate indicators includes: Multiplying the elements at the same position in the core change feature vector, the material change feature vector, and the device change feature vector to obtain each vector product, and respectively determining the transformation coefficients corresponding to each vector product, and performing a linear transformation on each vector product based on the transformation coefficients to obtain a fused feature vector; Transversely splicing the core change characteristic vector, the material change characteristic vector, and the device change characteristic vector to obtain a spliced ​​characteristic vector, and determining a splicing coefficient corresponding to the spliced ​​characteristic vector, and performing a linear transformation on the spliced ​​characteristic vector based on the splicing coefficient to obtain a spliced ​​characteristic vector; Based on the fused feature vector and the concatenated feature vector, a cross feature vector under each of the target selected indicators is determined.

8. A device for evaluating the safety of a high-temperature and high-pressure material irradiation test circuit, characterized in that: include: A setting unit is used to determine a plurality of candidate indicators corresponding to a sample high-temperature and high-pressure material irradiation test circuit, and use each of the candidate indicators as a target candidate indicator, and set a plurality of sample indicator parameters under the target candidate indicator, wherein the sample high-temperature and high-pressure material irradiation test circuit has the same structural properties as the high-temperature and high-pressure material irradiation test circuit to be evaluated; A first determination unit is used to control the sample high temperature and high pressure material irradiation test circuit to perform irradiation test on the sample test material based on each of the sample indicator parameters under the target candidate indicator, and during the irradiation test, determine the core property information of the sample research reactor corresponding to the sample high temperature and high pressure material irradiation test circuit under each of the sample indicator parameters, the material property information of the sample test material under each of the sample indicator parameters, and the device property information of the sample irradiation device under each of the sample indicator parameters for the target candidate indicator; A second determination unit is used to determine core property change information corresponding to the sample research reactor based on the core property information under each of the sample index parameters, determine material property change information corresponding to the sample test material based on the material property information under each of the sample index parameters, and determine device property change information corresponding to the sample irradiation device based on the device property information under each of the sample index parameters; A third determination unit is used to determine, from each of the target candidate indicators, a target evaluation indicator for safety evaluation of the high-temperature and high-pressure material irradiation test circuit to be evaluated based on the core property change information, material property change information, and device property change information under each of the target candidate indicators; The evaluation unit is used to determine the index parameters of the high-temperature and high-pressure material irradiation test circuit to be evaluated under the target evaluation index, and based on the index parameters, perform a safety evaluation on the high-temperature and high-pressure material irradiation test circuit to be evaluated.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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