Coil structure and magnetic piece structure

Abstract

The invention discloses a coil structure and a magnetic piece structure, and the coil structure comprises a coil assembly which is formed by stacking a plurality of coil layers from top to bottom, and a first welding layer is arranged between every two adjacent coil layers; the leading-out end assembly is formed by stacking a plurality of leading-out layers from top to bottom, and a second welding layer is arranged between every two adjacent leading-out layers; the coil assembly is electrically connected with the leading-out end assembly through a leading-out electrode, and a connecting gap is formed between the coil assembly and the leading-out end assembly in the area where the leading-out electrode is located; the spacing distance between the coil layer and the lead-out layer at the connecting gap is a first spacing distance, the spacing distance between the first welding layer and the second welding layer at the connecting gap is a second spacing distance, and the second spacing distance is greater than or equal to the first spacing distance. By adjusting the distance between the coil assembly and the welding layer on the leading-out end assembly, the risk of overall short circuit of the structure is effectively reduced, and the stability of the structure function is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a coil structure and a magnetic component structure. Background Art

[0002] As an important passive component, inductors usually play the role of filtering, screening signals, stabilizing current, and suppressing electromagnetic interference in circuits. They are usually used in combination with capacitors to form LC tuned circuits. The LC resonant circuit has the function of selecting frequency and can select AC signals of a certain frequency f.

[0003] With the continuous development of electronic technology, power inductors, as a widely used inductor, are increasingly being applied to the production of power inductors. The existing coil forming technology involves the use of solder. These solutions have problems with the reliability of electronic devices such as coil structures, such as short circuit failures caused by melting of solder at high temperatures. Summary of the invention

[0004] In view of the above problems, the present invention is proposed to provide a coil structure and a magnetic component structure that overcome the above problems or at least partially solve the above problems.

[0005] Other features and advantages of the present invention will become apparent from the following detailed description, or may be learned in part by practice of the present invention.

[0006] According to a first aspect of an embodiment of the present invention, there is provided a coil structure, the coil structure comprising:

[0007] The coil assembly is composed of a plurality of coil layers stacked from top to bottom, and a first welding layer is arranged between two adjacent coil layers;

[0008] The lead-out terminal assembly is composed of a plurality of lead-out layers stacked from top to bottom, and a second welding layer is provided between two adjacent lead-out layers, and the layers of the lead-out terminal assembly are matched one by one with the layers of the coil assembly;

[0009] Wherein, the coil assembly is electrically connected to the lead-out terminal assembly via a bendable lead-out electrode, and a connection gap is formed between the coil assembly and the lead-out terminal assembly in the area where the lead-out electrode is located;

[0010] The spacing distance between the coil layer and the lead-out layer at the connection gap is a first spacing, which is greater than or equal to 50um; the spacing distance between the first welding layer and the second welding layer at the connection gap is a second spacing, which is greater than or equal to the first spacing.

[0011] In some embodiments of the present invention, the coil layer includes a first conductive layer, a first insulating layer and a second conductive layer stacked in sequence, at least one first connecting electrode is embedded in the first insulating layer, and the first conductive layer and the second conductive layer are electrically connected through the first connecting electrode.

[0012] In some embodiments of the present invention, the lead-out layer includes a third conductive layer, a second insulating layer and a fourth conductive layer stacked in sequence, at least one second connecting electrode is embedded in the second insulating layer, and the third conductive layer and the fourth conductive layer are electrically connected through the second connecting electrode.

[0013] In some embodiments of the present invention, the first connecting electrode is a solid structure or a hollow ring structure, and the first connecting electrode has the same structure as the second connecting electrode.

[0014] In some embodiments of the present invention, the first insulating layer is a thermosetting adhesive or a thermosetting adhesive film, and the second insulating layer is made of the same material as the first insulating layer.

[0015] In some embodiments of the present invention, the bending angle of the lead-out electrode at the connection gap is 5-40°.

[0016] In some embodiments of the present invention, the connection gap is filled with a filling magnetic layer.

[0017] In some embodiments of the present invention, the material of the filling magnetic layer is a combination of one or more of Sendust Aluminum, Sendust Chromium or Iron Nickel.

[0018] According to a second aspect of an embodiment of the present invention, a magnetic structure is provided, which includes: an end electrode, a main magnetic layer and a coil structure, wherein the lead-out end component of the coil structure is connected to the end electrode, and the main magnetic layer is coated on the outside of the coil structure.

[0019] In some embodiments of the present invention, a protective layer is provided on the outer side of the magnetic structure.

[0020] The technical solution provided in the embodiments of the present invention has at least the following technical effects or advantages:

[0021] The embodiments of the present invention provide a coil structure and a magnetic component structure. The coil structure described in the embodiments of the present invention effectively reduces the risk of overall short circuit of the structure and improves the stability of the structural function by adjusting the spacing between the coil assembly and the welding layer on the lead-out terminal assembly.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic structural diagram of a coil structure provided by an embodiment of the present invention;

[0025] Figure 2 for Figure 1 Cross-sectional view along the aa direction;

[0026] Figure 3 A schematic structural diagram of a magnetic structure provided in an embodiment of the present invention.

[0027] Description of reference numerals:

[0028] 1. Coil assembly; 2. Lead-out terminal assembly; 3. Lead-out electrode; 4. Connection gap; 5. Terminal electrode; 6. Main magnetic layer; 11. First conductive layer; 12. First insulating layer; 13. Second conductive layer; 14. First welding layer; 21. Third conductive layer; 22. Second insulating layer; 23. Fourth conductive layer; 24. Second welding layer. DETAILED DESCRIPTION

[0029] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings.

[0030] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. These figures are not drawn to scale, and some details are magnified and some details may be omitted for the purpose of clear expression. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships therebetween are only exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and those skilled in the art may further design regions / layers with different shapes, sizes, and relative positions according to actual needs.

[0031] In the context of the present disclosure, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intervening layer / element therebetween. Additionally, if a layer / element is "on" another layer / element in one orientation, the layer / element may be "below" the other layer / element when the orientation is reversed. In the context of the present disclosure, similar or identical components may be denoted by the same or similar reference numerals.

[0032] In order to better understand the above-mentioned technical scheme, the above-mentioned technical scheme will be described in detail below in combination with specific implementation methods. It should be understood that the embodiments of the present disclosure and the specific features in the embodiments are detailed descriptions of the technical scheme of the present invention, rather than limitations on the technical scheme of the present invention. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0033] Figure 1 is a schematic structural diagram of a coil structure provided by an embodiment of the present invention, Figure 2 for Figure 1 The cross-sectional view in the aa direction is as follows: Figure 1-2 As shown, the coil structure includes a coil assembly 1 and a lead-out terminal assembly 2; the coil assembly 1 is composed of a plurality of coil layers stacked from top to bottom, and a first welding layer 14 is arranged between two adjacent coil layers; the lead-out terminal assembly 2 is composed of a plurality of lead-out layers stacked from top to bottom, and a second welding layer 24 is arranged between two adjacent lead-out layers.

[0034] The coil assembly 1 is electrically connected to the lead-out terminal assembly 2 via a bendable lead-out electrode 3. Figure 1 As shown, the coil assembly 1 is located at the top layer and the bottom layer of the coil layer, and is respectively electrically connected to the lead-out layer of the lead-out terminal assembly 2 located at the top layer and the bottom layer through the lead-out electrode 3, and a connection gap 4 is formed between the coil assembly 1 and the lead-out terminal assembly 2 in the area where the lead-out electrode 3 is located.

[0035] In an embodiment of the present invention, the hierarchy may be the total number of layers of the coil assembly 1 and the lead-out terminal assembly 2 and the number of layers at which the structures of each layer are located. For example, the hierarchy of the lead-out terminal assembly 2 includes the number of layers of multiple stacked lead-out layers, the various levels of the structure of a single lead-out layer itself and the number of layers at which it is located. The hierarchy of the coil assembly 1 includes the number of layers of multiple stacked coil layers, the various levels of the structure of a single coil layer itself and the number of layers at which it is located.

[0036] In the embodiment of the present invention, the levels of the lead-out terminal assembly 2 match the levels of the coil assembly 1 one by one, that is, the levels of the multiple coil layers and the first welding layer 14 correspond one by one to the levels of the multiple lead-out layers and the second welding layer 24, respectively. In the embodiment of the present invention, level matching refers to equal-height setting, so that the coil structure can maintain the same setting height as a whole, which facilitates assembly when it is subsequently assembled with other components, reducing the difficulty of processing.

[0037] The number of stacked layers of the multiple coil layers in the coil assembly 1 or the number of stacked layers of the lead-out layers in the lead-out terminal assembly 2 is set according to actual needs, and the embodiment of the present invention has no limitation on this.

[0038] Specifically, in an embodiment of the present invention, the levels of a single coil layer include at least a first conductive layer 11, a first insulating layer 12 and a second conductive layer 13 stacked in sequence, at least one first connecting electrode (not shown) is embedded in the first insulating layer 12, and the first conductive layer 11 and the second conductive layer 13 are electrically connected through the first connecting electrode.

[0039] The material of the first insulating layer 12 is a thermosetting adhesive or a thermosetting film. Specifically, the first insulating layer 12 can be a blend of one or more of polyimide, epoxy resin, bismaleimide, and triazine. The first insulating layer 12 is preferably epoxy resin. The first insulating layer 12 is embedded with the first connecting electrode by opening a through hole. The number and cross-sectional area of ​​the through holes set on the first insulating layer 12 match the number and cross-sectional area of ​​the first connecting electrode.

[0040] In an embodiment of the present invention, a single lead-out layer includes a third conductive layer 21, a second insulating layer 22 and a fourth conductive layer 23 stacked in sequence, at least one second connecting electrode (not shown) is embedded in the second insulating layer 22, and the third conductive layer 21 is electrically connected to the fourth conductive layer 23 via the second connecting electrode.

[0041] The material of the second insulating layer 22 is a thermosetting adhesive or a thermosetting film. Specifically, the second insulating layer 22 can be a blend of one or more of polyimide, epoxy resin, bismaleimide, and triazine. The second insulating layer 22 is preferably epoxy resin. The second insulating layer 22 is embedded with the second connecting electrode by opening a through hole. The number and cross-sectional area of ​​the through holes set on the second insulating layer 22 match the number and cross-sectional area of ​​the second connecting electrode.

[0042] Optionally, the first connecting electrode has the same structure as the second connecting electrode. Taking the first connecting electrode as an example, the first connecting electrode may be a solid structure to obtain better current flow capacity. Of course, in order to reduce material consumption and reduce weight, the first connecting electrode may also be a hollow ring structure. According to actual application requirements and process control effect requirements, the embodiment of the present invention may select a suitable method.

[0043] In other embodiments of the present invention, the structures of the first connecting electrode and the second connecting electrode may also be different; for example, the first connecting electrode is a solid structure, and the second connecting electrode is a hollow ring structure; or, the second connecting electrode is a solid structure, and the first connecting electrode is a hollow ring structure; or, multiple first connecting electrodes are solid structures, hollow ring structures, or a combination of the two, and multiple second connecting electrodes are solid structures, hollow ring structures, or a combination of the two; according to actual application requirements, the embodiments of the present invention can select a suitable method.

[0044] In the embodiment of the present invention, the material of the first welding layer 14 can be one of tin, lead, silver, bismuth, antimony, indium or cadmium, or any combination of solder alloys, which have better conductivity.

[0045] The second solder layer 24 may be a solder alloy of tin, lead, silver, bismuth, antimony, indium or cadmium, or any combination thereof.

[0046] Optionally, in an embodiment of the present invention, the second welding layer 24 and the first welding layer 14 may be made of the same material, so as to avoid additional steps when processing different materials and save costs.

[0047] The spacing distance between the coil layer and the lead-out layer at the connection gap 4 is a first spacing A, and the spacing distance between the first welding layer 14 and the second welding layer 24 at the connection gap 4 is a second spacing B, and the second spacing B is greater than or equal to the first spacing A.

[0048] Specifically, in the embodiments of the present invention, referring to Figure 1-2As shown, the spacing distance between the coil layer and the lead-out layer at the connection gap 4 is the spacing distance between the second conductive layer 13 and the fourth conductive layer 23 at the connection gap 4, then the spacing distance between the second conductive layer 13 and the fourth conductive layer 23 at the connection gap 4 is the first spacing A, and the spacing distance between the first welding layer 14 and the second welding layer 24 at the connection gap 4 is the second spacing B. Since the coil structure heats up when working, the first welding layer 14 and the second welding layer 24 are in a high temperature environment when the current is conducted, and flow deformation may occur, forming lateral overflow deformation. In order to avoid the overflow parts of the lateral deformation of the first welding layer 14 and the second welding layer 24 from contacting each other and causing a short circuit when the flow deformation occurs, in an embodiment of the present invention, the second spacing B is greater than or equal to the first spacing A.

[0049] Specifically, the setting size of the second spacing B can be determined according to the size of the first spacing A. For example, when the first spacing A is small, the possibility of the overflowing parts of the first welding layer 14 and the second welding layer 24 being in contact due to the lateral deformation is large. At this time, the second spacing B needs to be as large as possible from the first spacing A. If the first spacing A itself is large, the possibility of the overflowing parts of the first welding layer 14 and the second welding layer 24 being in contact due to the lateral deformation becomes small. Then, the second spacing B can be the same as the first spacing A, or the second spacing B can be slightly larger than the first spacing A. The first spacing A and the second spacing B can be selected according to the actual application requirements and the control effect requirements in the process. The embodiment of the present invention can select appropriate numerical values. For example, in the embodiment of the present invention, the first spacing A is greater than or equal to 50um.

[0050] It should be noted that, when the coil assembly 1 is connected to the lead-out end assembly 2 through the lead-out electrode 3, based on the actual processing technology and the actual application scenario, the lead-out electrode 3 may be deformed. When the connection gap 4 is used as an avoidance space, the embodiment of the present invention uses a bendable material to prepare the lead-out electrode 3. For example, the material of the lead-out electrode 3 can be copper. At the same time, in order to limit the breakage of the lead-out electrode 3 caused by excessive bending, the bending angle of the lead-out electrode 3 at the connection gap 4 is 5 to 40°. Of course, in other embodiments of the present invention, the lead-out electrode 3 can also be made of other materials. Accordingly, the bending angle of the lead-out electrode 3 at the connection gap 4 can also be selected according to the selected material and the size of the first spacing A. A suitable value can also be selected.

[0051] In an embodiment of the present invention, a filling magnetic layer (not shown) is provided at the connection gap 4, and the material of the filling magnetic layer is a combination of one or more of sendustine, iron-silicon-chromium or iron-nickel; the filling magnetic layer provides physical support on the one hand, and on the other hand, compared with the resin filling method in the prior art, the present method embodiment improves the inductance of the inductor, and can further avoid the short-circuit failure problem caused by the melting of the solder layer.

[0052] The coil structure described in the embodiment of the present invention effectively reduces the risk of overall short circuit of the structure and improves the stability of the structural function by adjusting the spacing between the coil assembly 1 and the welding layers on the lead-out terminal assembly 2.

[0053] Based on the above embodiments, the present invention provides an embodiment of a magnetic component structure, which can be specifically applied to various electronic devices. Figure 3 As shown, the magnetic structure includes an end electrode 5, a main magnetic layer 6 and a coil structure as described in any of the above embodiments, the lead-out terminal component 2 of the coil structure is connected to the end electrode 5, and the main magnetic layer 6 is coated on the outside of the coil structure.

[0054] In the embodiment of the present invention, the material of the main magnetic layer 6 is the same as that of the filling magnetic layer, which reduces the processing difficulty and cost and improves the consistency of the overall structure.

[0055] In the embodiment of the present invention, in order to improve the protection of the magnetic structure, the outer side of the magnetic structure is covered with a protective layer, and the protective layer is, for example, a resin, and the thickness of the resin can be 5-30 um.

[0056] The magnetic structure described in the embodiment of the present invention has the functional components and beneficial effects corresponding to the coil structure described in the above embodiment. Please refer to the embodiment of the above coil structure for details, and the embodiment of the present invention will not be described in detail here.

[0057] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0058] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those expressly recited in each claim. Rather, as reflected in the claims, inventive aspects lie in less than all of the features of the individual embodiments previously disclosed. Therefore, the claims that follow the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present invention.

[0059] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A coil structure, characterized in that: The coil structure comprises: The coil assembly is composed of a plurality of coil layers stacked from top to bottom, and a first welding layer is arranged between two adjacent coil layers; The lead-out terminal assembly is composed of a plurality of lead-out layers stacked from top to bottom, and a second welding layer is provided between two adjacent lead-out layers, and the layers of the lead-out terminal assembly are matched one by one with the layers of the coil assembly; Wherein, the coil assembly is electrically connected to the lead-out terminal assembly via a bendable lead-out electrode, and a connection gap is formed between the coil assembly and the lead-out terminal assembly in the area where the lead-out electrode is located; The spacing distance between the coil layer and the lead-out layer at the connection gap is a first spacing, which is greater than or equal to 50um; the spacing distance between the first welding layer and the second welding layer at the connection gap is a second spacing, which is greater than or equal to the first spacing.

2. The coil structure according to claim 1, characterized in that: The coil layer includes a first conductive layer, a first insulating layer and a second conductive layer which are stacked in sequence, at least one first connecting electrode is embedded in the first insulating layer, and the first conductive layer and the second conductive layer are electrically connected via the first connecting electrode.

3. The coil structure according to claim 2, characterized in that: The lead-out layer includes a third conductive layer, a second insulating layer and a fourth conductive layer stacked in sequence, at least one second connecting electrode is embedded in the second insulating layer, and the third conductive layer is electrically connected to the fourth conductive layer through the second connecting electrode.

4. The coil structure according to claim 3, characterized in that: The first connecting electrode is a solid structure or a hollow ring structure, and the first connecting electrode has the same structure as the second connecting electrode.

5. The coil structure according to claim 3, characterized in that: The first insulating layer is a thermosetting adhesive or a thermosetting adhesive film, and the second insulating layer is made of the same material as the first insulating layer.

6. The coil structure according to claim 1, characterized in that: The bending angle of the lead-out electrode at the connection gap is 5 to 40 degrees.

7. The coil structure according to claim 1, characterized in that: The connection gap is filled with a filling magnetic layer.

8. The coil structure according to claim 7, characterized in that: The material of the filling magnetic layer is one or more combinations of sendust, iron-silicon-aluminum, iron-silicon-chromium or iron-nickel.

9. A magnetic structure, characterized in that: The magnetic structure comprises: an end electrode, a main magnetic layer and a coil structure as described in any one of claims 1 to 8, wherein the lead-out terminal assembly of the coil structure is connected to the end electrode, and the main magnetic layer is also coated on the outside of the coil structure.

10. The magnetic component structure according to claim 9, characterized in that: The outer side of the magnetic structure is covered with a protective layer.

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