Conductive treatment method for surface of package carrier

Abstract

The invention is applicable to the technical field of surface treatment, and provides a surface conductive treatment method for a package carrier, which comprises the following steps of: performing oil removal and charge adjustment treatment on the package carrier at the temperature of 30-60 DEG C; carrying out five-stage countercurrent DI water washing treatment on the packaging carrier plate subjected to oil removal and charge adjustment treatment under the temperature condition of 10-40 DEG C; the packaging carrier plate subjected to water washing treatment is placed under the temperature condition of 20-40 DEG C, conductive deposition treatment is conducted through a zero-dimensional material treating agent, the pressure of a water jet is 5-30 Kg, and the linear speed is 2-4 M / min; placing the packaging carrier plate subjected to the conductive deposition treatment under the temperature condition of 80-100 DEG C for drying treatment; full-board conduction is achieved through deposition of the zero-dimensional conductive material, improvement and optimization of the technological process of leadless nickel thick gold plating are achieved, the quality is improved, the cost is reduced, flash plating is not needed in the manufacturing process, the process is simplified, and environmental pollution is reduced.

Description

Technical Field

[0001] The present application belongs to the field of surface treatment technology, and in particular, relates to a method for conducting the surface of a packaging carrier. Background Art

[0002] The process flow of the traditional leadless nickel-gold (NPL) plating process for packaging substrates mainly involves the following aspects: leadless selective plating must achieve full-board conductivity on the selectively plated product, generally using sputtered copper or chemical copper followed by flash copper plating to achieve full-board conductivity; the selectively plated pads or gold fingers are exposed through the image transfer technology of the photosensitive dry film; the positions are plated with thick nickel gold or other precious metals; the other photosensitive dry film layers on the board are removed through the film stripping process; the original flash-plated copper is flash-etched through the flash etching process, so that the original circuit is flash-etched again, thereby completing the NPL process of the entire packaging substrate.

[0003] At present, this type of products all use vacuum magnetron sputtering copper or chemical copper technology. Among them, the chemical copper process mainly involves alkaline whole-pore degreasing, three-stage countercurrent water washing, micro-etching, two-stage countercurrent water washing, pre-impregnation, activation, chemical copper plating and other processes; while the flash plating process mainly involves acid degreasing, acid pre-impregnation, copper sulfate electroplating and other processes; the sputtering process has expensive target materials and high costs, and mainly involves cleaning base materials, evaporating the bottom layer, creating a vacuum environment, cold trap cooling, argon injection, sputtering and other processes; graphic transfer mainly involves substrate surface cleaning, film pasting, alignment exposure, development and other processes; the flash etching process mainly involves selective nickel-gold plating, film stripping, two-stage countercurrent water washing, flash etching and other processes. Specifically, the chemical copper process is a catalytic redox reaction, which will produce more by-products, and the vertical copper deposition process takes 60-90 minutes, and the horizontal copper deposition process takes 30-50 minutes. It has the problems of long process, low efficiency, and severe environmental pollution. It is not resistant to acid and alkali, not resistant to oxidation, and the main material has a certain service life. The sputtering copper process is to sputter a copper film layer after evaporation treatment. The process takes 20-30 minutes. It has the problems of high cost, long process, low efficiency, and severe environmental pollution. It is not resistant to acid and alkali, not resistant to oxidation, and the target material cannot be recycled.

[0004] It can be seen that traditional sputtering or chemical copper processes generally have problems such as long process, low efficiency, acid and alkali resistance, oxidation resistance, severe environmental pollution, and low yield rate. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a method for conductive treatment of the surface of a packaging carrier, aiming to solve the problems commonly existing in traditional sputtering or chemical copper processes, such as long process, low efficiency, acid and alkali resistance, oxidation resistance, severe environmental pollution, and low yield rate.

[0006] The embodiment of the present application is implemented as follows: a method for conducting the surface of a package carrier, comprising: Place the package substrate at a temperature of 30-60°C for degreasing and charge adjustment; The package substrate after degreasing and charge adjustment is placed in a five-stage countercurrent DI water washing process at a temperature of 10-40°C, with a water change frequency of 1-10S / m conductivity and a water flow rate of 5-30 L / min; The washed packaging substrate is placed under a temperature of 20-40°C, and a conductive deposition treatment is performed using a zero-dimensional material treatment agent, with a water jet pressure of 5-30 kg and a line speed of 2-4 M / min; the zero-dimensional material is one or both of graphene quantum dots or carbon particles with a diameter of less than 100 nm; The package substrate after the conductive deposition treatment is placed at a temperature of 80-100°C for drying; Remove the unnecessary conductive layer of the circuit pattern on the surface of the package carrier by plasma or ultrasonic wave; The package carrier with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing process and a drying process.

[0007] Preferably, the zero-dimensional material processing agent is composed of the following raw materials in percentage by mass: 0.5-1.5% of zero-dimensional material, 0.01%-0.2% of stabilizer, 95-98% of deionized water, and the remainder is pH regulator, and the pH value of the system is adjusted to 6-9 by the pH regulator.

[0008] Preferably, the pH value of the zero-dimensional material treatment agent is 6-9, and the solid content is 0.01-1%.

[0009] Preferably, the stabilizer is one or more of PVP, PVR, PEG, and PCR; the pH adjuster is one or more of sulfuric acid, hydrochloric acid, sodium hydroxide, potassium hydroxide, and ammonia water.

[0010] Preferably, the packaging carrier is degreased and charge adjusted using a degreasing and charge adjusting agent, the concentration of the degreasing and charge adjusting agent is 1-10%, the pH value is 10-14, the alkali equivalent is 0.01-0.25N, and the service life is a copper content of 15-25 mg / L.

[0011] Preferably, the package carrier after the conductive deposition treatment is placed in a drying process at a temperature of 80-100° C., and the air knife pressure is 300-1000 Pa.

[0012] Preferably, in the step of removing the excess conductive layer on the surface of the packaging carrier by plasma, the equipment power is 600~1000W, the vacuum degree is -75~-30KPa, the temperature is 80~200°C, and the time is 60~120s.

[0013] Preferably, in the step of removing excess conductive layer on the surface of the packaging carrier by using ultrasound, the equipment power is 300~1000W, the frequency is 20~60 Hz, the concentration of the solution is 2~10%, the temperature is 25~45°C, the pH value is 9~15, and the line speed is 2~4M / min.

[0014] Preferably, the step of performing a five-stage countercurrent DI water washing treatment and a drying treatment on the package carrier from which the excess conductive layer is removed comprises: The package substrate with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 10-40°C, with a water change frequency of 1-10S / m and a water flow rate of 5-30 L / min; The package carrier is dried at a temperature of 80~100℃ and the air knife pressure is 300~1000pa.

[0015] The surface conductivity treatment method of the packaging carrier provided in the embodiment of the present application realizes full-board conductivity through the deposition of zero-dimensional conductive material, solves the improvement and optimization of the process flow of leadless nickel thick gold plating, improves quality and reduces cost, and the process does not require flash plating, simplifies the process and reduces environmental pollution; in addition, the present application effectively replaces the original vacuum magnetron sputtering copper or chemical copper process, and makes selective electroplating easier to achieve through the conductive properties of zero-dimensional conductive materials; in addition, after the selective electroplating is completed, the present application cancels the flash etching process of the original process, and the excess 0-dimensional conductive material conductive layer can be effectively removed by physical and chemical methods that do not damage the circuit electroplated copper, thereby further simplifying the process and reducing the quality risks and environmental pollution caused by the flash etching process of the original process. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the present application more clear, the present application is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0017] The embodiment of the present application provides a method for treating the surface of a package carrier to be conductive, and the process flow replaced in the NPL process includes: if there is no lead selective plating, the selective plating product must achieve full-board conductivity, and 0-dimensional conductive material deposition conduction achieves full-board conductivity. This process does not require flash plating, simplifies the process, and reduces environmental pollution; the selectively plated pads or gold fingers are exposed through the image transfer technology of the photosensitive dry film, and the position is electroplated with nickel thick gold or other precious metals, and the other photosensitive dry film layers on the board are removed through the film stripping process. The original deposited 0-dimensional conductive material conductive layer is removed through physical plasma and ultrasonic technology, so that the original 0-dimensional conductive material conductive layer between the lines is completely removed, the process is optimized and simplified, and environmental pollution is reduced, thereby completing the NPL process of the entire package substrate.

[0018] Specifically, an embodiment of the present application provides a method for conducting the surface of a package carrier, comprising: Place the package substrate at a temperature of 30-60°C for degreasing and charge adjustment; The package substrate after degreasing and charge adjustment is placed in a five-stage countercurrent DI water washing process at a temperature of 10-40°C, with a water change frequency of 1-10S / m conductivity and a water flow rate of 5-30 L / min; The washed packaging substrate is placed at a temperature of 20-40°C and subjected to conductive deposition treatment using a zero-dimensional material treatment agent. The water jet pressure is 5-30 kg and the line speed is 2-4 M / min. The package substrate after the conductive deposition treatment is placed at a temperature of 80-100°C for drying; Remove the unnecessary conductive layer of the circuit pattern on the surface of the package carrier by plasma or ultrasonic wave; The package carrier with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing process and a drying process.

[0019] Among them, the degreasing and charge adjustment treatment, five-stage countercurrent DI water washing treatment, conductive deposition treatment, and drying treatment in the above process can be implemented based on existing equipment on the market, such as the TGM-NPL-H-000 horizontal 0-dimensional conductive material processing and production equipment produced by Symene Gold in conjunction with Julong, Dongwei, and Universe. The 0-dimensional conductive material layer can be degraded by plasma or ultrasonic wave by TGM-NPL-H-000 horizontal ultrasonic cleaning equipment produced by Symene Gold in conjunction with Julong, Dongwei, and Universe; or by vacuum plasma cleaning equipment of brands such as Chengfengzhi Model: CRF-VP0-8L-M, Jinbolilai VP120L, etc.

[0020] Among them, the degreasing and charge adjusting agent is used to degreasing and charge adjusting the packaging carrier, and the line speed is 2~4M / min (the working time of the workpiece is about 1-4min). The concentration of the degreasing and charge adjusting agent is 1~10%, the pH value is 10~14, the alkali equivalent is 0.01~0.25N, and the service life is 15~25mg / L of copper content. The purpose of this process is to remove the pollution on the surface of the organic packaging substrate after the whole hole, and to adjust the charge so that the adsorption of the zero-dimensional conductive material layer is more firm. The degreasing and charge adjusting agent can be the TGM-NPL-001 model product purchased from Symene Gold.

[0021] Among them, the package carrier after degreasing and charge adjustment is placed in a temperature condition of 10~40℃ for five-stage countercurrent DI water washing, the water change frequency conductivity is 1~10S / m, the water flow rate is 5~30 L / min, and the line speed is 2~4M / min (the operation time of the workpiece is about 1-4min). The purpose of this process is to clean the excess degreasing and charge adjustment agent to avoid contamination of the subsequent process solution caused by residues.

[0022] Among them, the package carrier after water washing is placed at a temperature of 20~40℃, and conductive deposition treatment is carried out using a zero-dimensional material processing agent. The water jet pressure is 5~30Kg and the line speed is 2~4M / min (the operation time of the workpiece is approximately 6-8min). This process is the most critical core process for depositing 0-dimensional conductive materials to form a conductive layer, which replaces the flash plating process in the traditional process.

[0023] Among them, the zero-dimensional material treatment agent is composed of zero-dimensional material, stabilizer, pH regulator and deionized water; the zero-dimensional material is one or two of graphene quantum dots with a diameter of less than 100nm (graphene material with three-dimensional dimensions all below 100 nanometers) or carbon particles; the stabilizer can be a small molecule or a polymer such as one or more of PVP, PVR, PEG, PCR, etc.; the pH value adjuster can be an inorganic acid or alkali, such as one or more solutions of sulfuric acid, hydrochloric acid, sodium hydroxide, ammonia water, potassium hydroxide, etc.

[0024] Preferably, the pH value of the zero-dimensional material treatment agent is 6-9, and the solid content is 0.01-1%. The zero-dimensional material treatment agent is composed of the following raw materials in percentage by mass: 0.5-1.5% of zero-dimensional material, 0.01%-0.2% of stabilizer, 95-98% of deionized water, and the remainder is pH regulator, and the pH value of the system is adjusted to 6-9 by the pH regulator.

[0025] Among them, the packaging carrier after the conductive deposition treatment is placed at a temperature of 80~100℃ for drying, with a line speed of 2~4M / min (the working time of the workpiece is about 2-4min). It is a process of fixing and removing moisture by depositing 0-dimensional conductive materials to form a conductive layer.

[0026] Among them, the redundant conductive layer on the surface of the package carrier that does not require the circuit pattern is removed by plasma or ultrasound. In the step of removing the redundant conductive layer on the surface of the package carrier by plasma, the equipment power is 600~1000W, the vacuum degree is -75~-30KPa, the temperature is 80~200℃, and the time is 60~120s. In the step of removing the redundant conductive layer on the surface of the package carrier by ultrasound, the equipment power is 300~1000W, the frequency is 20~60 Hz, the concentration of the solution is 2~10%, the temperature is 25~45℃, the pH value is 9~15, and the line speed is 2~4M / min (the operation time of the workpiece is about 2-4min). This is the process of removing the redundant 0-dimensional conductive material layer, which replaces the flash etching process in the original process.

[0027] The step of performing a five-stage countercurrent DI water washing treatment and a drying treatment on the package carrier from which the excess conductive layer is removed comprises: The package substrate with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 10-40°C, with a water change frequency of 1-10S / m conductivity, a water flow of 5-30 L / min, and a line speed of 2-4M / min (the workpiece operation time is approximately 2-4min); The package carrier is placed at a temperature of 80~100℃ for drying, the air knife pressure is 300~1000pa, and the line speed is 2~4M / min (the working time of the workpiece is about 2-4min). This is the process of drying the moisture of the package carrier to ensure that the carrier will not cause oxidation on the board surface due to moisture.

[0028] The following is a detailed description of the method for treating the non-metallic surface of the organic packaging substrate of the present application with specific embodiments, as shown below. The experimental methods used in the following embodiments are conventional methods unless otherwise specified; the materials, reagents, etc. used can be obtained from commercial channels unless otherwise specified.

[0029] Equipment used: TGM-NPL-H-000 horizontal 0-dimensional conductive material processing and production equipment, TGM-NPL-H-000 horizontal ultrasonic cleaning equipment, and Jinbolilai VP120L vacuum plasma cleaning equipment produced by Symene Gold in conjunction with Julong, Dongwei, and Yuzhou.

[0030] Reagents used: oil removal and charge adjustment agent (model: TGM-NPL-001), ultrasonic agent (model: TGM-NPL-003).

[0031] The selected workpiece is a PCB or IC substrate product that needs to be gold-plated with leadless gold fingers.

[0032] Embodiment 1: Conductive treatment method for packaging substrate surface Zero-dimensional material treatment agent is composed of the following raw materials in percentage by mass: Graphene quantum dots 1.0%, PVP 0.03%, deionized water 95%, and the balance potassium hydroxide solution, and the pH value of the system is adjusted to 6 by potassium hydroxide solution.

[0033] Process 1: Use a degreasing and charge adjusting agent to degreasing and charge adjusting the package carrier after the whole hole, the temperature is 40°C, the line speed is 2M / min, and the time is 4min; the concentration of the degreasing and charge adjusting agent is 3%, the pH value is 10, the alkali equivalent is 0.1N, and the service life is 15mg / L of copper content.

[0034] Process 2: The package carrier after degreasing and charge adjustment is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 20°C, a water change frequency of 5 S / m, a water flow rate of 6 L / min, a line speed of 2M / min, and a time of 4 minutes.

[0035] Step 3: Place the washed packaging carrier at a temperature of 30°C and perform conductive deposition treatment using a zero-dimensional material treatment agent. The water jet pressure is 10Kg, the line speed is 2M / min, and the time is 8min. The pH value of the zero-dimensional material treatment agent is 6 and the solid content is 0.03%.

[0036] Step 4: Place the package carrier after the conductive deposition treatment at a temperature of 80°C for a drying treatment, with an air knife pressure of 400pa, a line speed of 2M / min, and a drying time of 4min.

[0037] Step 5: Use plasma to remove the unnecessary conductive layer on the surface of the package carrier obtained by the above treatment. The equipment power is 600W, the vacuum degree is -30KPa, the temperature is 120℃, and the time is 70s.

[0038] Step 6: The package carrier with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 20°C, a water change frequency of 3S / m, a water flow rate of 6 L / min, a line speed of 2M / min, and a time of 3min.

[0039] Step 7: Dry the washed packaging substrate at a temperature of 80°C, a wind knife pressure of 400 pa, a line speed of 2 M / min, and a time of 3 min.

[0040] Embodiment 2: Conductive treatment method for packaging substrate surface Zero-dimensional material treatment agent is composed of the following raw materials in percentage by mass: 0.5% zero-dimensional carbon particles, 0.04% PVR, 96% deionized water, and the balance is potassium hydroxide solution, and the pH value of the system is adjusted to 7 by potassium hydroxide solution.

[0041] Process 1: Use a degreasing and charge adjusting agent to degreasing and charge adjusting the package carrier after the whole hole, the temperature is 45°C, the line speed is 2.5M / min, and the time is 3.5min; the concentration of the degreasing and charge adjusting agent is 4%, the pH value is 10.5, the alkali equivalent is 0.12N, and the service life is 15mg / L of copper content.

[0042] Process 2: The package substrate after degreasing and charge adjustment is subjected to five-stage countercurrent DI water washing at a temperature of 22°C, a water change frequency of 6 S / m, a water flow rate of 20 L / min, a line speed of 3.5 M / min, and a time of 3 minutes.

[0043] Step 3: Place the washed packaging carrier at a temperature of 25°C and perform conductive deposition treatment using a zero-dimensional material treatment agent. The water jet pressure is 25Kg, the line speed is 2.5M / min, and the time is 7.5min. The pH value of the zero-dimensional material treatment agent is 7 and the solid content is 0.06%.

[0044] Step 4: Place the package carrier after the conductive deposition treatment at a temperature of 90°C for a drying treatment, with an air knife pressure of 700pa, a line speed of 3M / min, and a drying time of 3.5min.

[0045] Step 5: Use plasma to remove the unnecessary conductive layer on the surface of the package carrier obtained by the above treatment. The equipment power is 600W, the vacuum degree is -75KPa, the temperature is 100°C, and the time is 60s.

[0046] Step 6: The package carrier with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 30°C, a water change frequency of 2 S / m, a water flow rate of 5 L / min, a line speed of 2.5 M / min, and a time of 3.5 min.

[0047] Step 7: Dry the washed packaging substrate at a temperature of 90°C, a wind knife pressure of 700 pa, a line speed of 2.5 M / min, and a time of 3.5 min.

[0048] Embodiment 3: Conductive treatment method for packaging substrate surface Zero-dimensional material treatment agent is composed of the following raw materials in percentage by mass: Graphene quantum dots 0.7%, PEG 0.08%, deionized water 96.5%, the balance is potassium hydroxide solution, and the pH value of the system is adjusted to 7.5 by potassium hydroxide solution.

[0049] The selected workpiece is a PCB or IC substrate product that needs to be gold-plated with leadless gold fingers.

[0050] Process 1: Use a degreasing and charge adjusting agent to degreasing and charge adjusting the package carrier after the whole hole, the temperature is 30°C, the line speed is 3M / min, and the time is 3min; the concentration of the degreasing and charge adjusting agent is 5%, the pH value is 11, the alkali equivalent is 0.16N, and the service life is 20mg / L of copper content.

[0051] Process 2: The package substrate after degreasing and charge adjustment is subjected to five-stage countercurrent DI water washing at a temperature of 25°C, a water change frequency of 1 S / m, a water flow rate of 15 L / min, a line speed of 3 M / min, and a time of 3 minutes.

[0052] Step 3: Place the washed packaging carrier at a temperature of 25°C and perform conductive deposition treatment using a zero-dimensional material treatment agent. The water jet pressure is 20Kg, the line speed is 3M / min, and the time is 7min. The pH value of the zero-dimensional material treatment agent is 7.5 and the solid content is 0.07%.

[0053] Step 4: Place the package carrier after the conductive deposition treatment at a temperature of 95°C for a drying treatment, with an air knife pressure of 500pa, a line speed of 3M / min, and a drying time of 3min.

[0054] Step 5: Use plasma to remove the unnecessary conductive layer on the surface of the package carrier obtained by the above treatment. The equipment power is 800W, the vacuum degree is -45KPa, the temperature is 100°C, and the time is 100s.

[0055] Step 6: The package carrier with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 26°C, a water change frequency of 5 S / m, a water flow rate of 12 L / min, a line speed of 3 M / min, and a time of 3 min.

[0056] Step 7: Dry the washed packaging substrate at a temperature of 95°C, a wind knife pressure of 500 pa, a line speed of 2 M / min, and a time of 3 min.

[0057] Embodiment 4: Conductive treatment method for packaging substrate surface Zero-dimensional material treatment agent is composed of the following raw materials in percentage by mass: Graphene quantum dots 0.8%, PCR 0.05%, deionized water 95-98%, and the balance is potassium hydroxide solution, and the pH value of the system is adjusted to 7.8 by potassium hydroxide solution.

[0058] Process 1: Use a degreasing and charge adjusting agent to degreasing and charge adjusting the package carrier after the whole hole, the temperature is 50°C, the line speed is 3.5M / min, and the time is 2.8min; the concentration of the degreasing and charge adjusting agent is 8%, the pH value is 12, the alkali equivalent is 0.18N, and the service life is 22mg / L of copper content.

[0059] Process 2: The package substrate after degreasing and charge adjustment was subjected to five-stage countercurrent DI water washing at a temperature of 28°C, a water change frequency of 9 S / m, a water flow rate of 25 L / min, a line speed of 3.5 M / min, and a time of 2.8 min.

[0060] Step 3: Place the washed packaging carrier at a temperature of 38°C and perform conductive deposition treatment using a zero-dimensional material treatment agent. The water jet pressure is 26Kg, the line speed is 3.5M / min, and the time is 7min. The pH value of the zero-dimensional material treatment agent is 7.8 and the solid content is 0.09%.

[0061] Step 4: Place the package carrier after the conductive deposition treatment at a temperature of 96°C for a drying treatment, with an air knife pressure of 900 pa and a line speed of 3.5 M / min for 3.5 min.

[0062] Step 5: Use ultrasound to remove the unnecessary conductive layer on the surface of the package carrier obtained by the above treatment. The equipment power is 800W, the frequency is 40 Hz, the concentration of the solution is 5%, the temperature is 20°C, the pH value is 10, the line speed is 3M / min, and the time is 3.5min.

[0063] Step 6: The package carrier with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 28°C, a water change frequency of 9 S / m, a water flow rate of 25 L / min, a line speed of 3.5 M / min, and a time of 2.8 min.

[0064] Process 7: Dry the washed packaging substrate at a temperature of 96°C, a wind knife pressure of 900 pa, a line speed of 3.5 M / min, and a time of 3.5 min.

[0065] Embodiment 5: Conductive treatment method for packaging substrate surface Zero-dimensional material treatment agent is composed of the following raw materials in percentage by mass: Graphene quantum dots 1.5%, PVP 0.2%, deionized water 98%, the balance is potassium hydroxide solution, and the pH value of the system is adjusted to 9 by potassium hydroxide solution.

[0066] Process 1: Use a degreasing and charge adjusting agent to degreasing and charge adjusting the package carrier after the whole hole, the temperature is 60°C, the line speed is 4M / min, and the time is 2min; the concentration of the degreasing and charge adjusting agent is 10%, the pH value is 14, the alkali equivalent is 0.25N, and the service life is 25mg / L of copper content.

[0067] Process 2: The package substrate after degreasing and charge adjustment is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 40°C, a water change frequency of 10 S / m, a water flow rate of 30 L / min, a line speed of 4 M / min, and a time of 2 min.

[0068] Step 3: Place the washed packaging carrier at a temperature of 40°C and perform conductive deposition treatment using a zero-dimensional material treatment agent. The water jet pressure is 30Kg, the line speed is 4M / min, and the time is 6min. The pH value of the zero-dimensional material treatment agent is 9 and the solid content is 1%.

[0069] Step 4: Place the package carrier after the conductive deposition treatment at a temperature of 100° C. for a drying treatment, with an air knife pressure of 1000 Pa, a line speed of 4 M / min, and a drying time of 2 min.

[0070] Step 5: Use ultrasound to remove the unnecessary conductive layer on the surface of the package carrier obtained by the above treatment. The equipment power is 1000W, the frequency is 60 Hz, the concentration of the solution is 10%, the temperature is 45°C, the pH value is 15, the line speed is 4M / min, and the time is 2min.

[0071] Step 6: The package carrier with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 40°C, a water change frequency of 10 S / m, a water flow rate of 30 L / min, a line speed of 4 M / min, and a time of 2 min.

[0072] Process 7: Dry the washed packaging substrate at a temperature of 100°C, a wind knife pressure of 1000 Pa, a line speed of 4 M / minn, and a time of 2 min.

[0073] Using a test piece (the test piece is a 60*100mm FR-4 insulating board material), the 0-dimensional conductive material layer was deposited according to the process of the above Examples 1-5. The resistance of the produced test piece with a long side of 100mm was measured to be between 100Ω and 1000Ω, which indicates that the deposition effect of the 0-dimensional conductive material in Examples 1-5 is good.

[0074] Furthermore, the package carriers obtained by processing in Examples 1-5 were subjected to acid resistance, alkali resistance, carbonic acid solution resistance, oxidation resistance and tensile test, and the test results are shown in Table 1 below: Table 1 Furthermore, qualified deposition test pieces for detecting the deposition effect of 0-dimensional conductive materials (the test pieces are 60*100mm FR-4 insulating board materials) were produced according to the normal process of removing 0-dimensional conductive materials in the above embodiments 1-5. The resistance value of the produced test pieces measured at the long side of 100mm was infinite, indicating that the material was removed completely.

[0075] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

[0076] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for conducting the surface of a packaging substrate, characterized in that: include: Place the package substrate at a temperature of 30-60°C for degreasing and charge adjustment; The package substrate after degreasing and charge adjustment is placed in a five-stage countercurrent DI water washing process at a temperature of 10-40°C, with a water change frequency of 1-10S / m conductivity and a water flow rate of 5-30 L / min; The washed packaging substrate is placed under a temperature of 20-40°C, and a conductive deposition treatment is performed using a zero-dimensional material treatment agent, the water jet pressure is 5-30Kg, and the line speed is 2-4M / min; the zero-dimensional material treatment agent is composed of a zero-dimensional material, a stabilizer, a pH regulator, and deionized water; the zero-dimensional material is one or both of graphene quantum dots or carbon particles with a diameter of less than 100nm; The package substrate after the conductive deposition treatment is placed at a temperature of 80-100°C for drying; Remove the unnecessary conductive layer of the circuit pattern on the surface of the package carrier by plasma or ultrasonic wave; The package carrier with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing process and a drying process.

2. The method for conducting the surface of a package carrier according to claim 1, characterized in that: The zero-dimensional material processing agent is composed of the following raw materials in percentage by mass: 0.5-1.5% of zero-dimensional material, 0.01%-0.2% of stabilizer, 95-98% of deionized water, and the remainder is pH regulator, and the pH value of the system is adjusted to 6-9 by the pH regulator.

3. The method for conducting the surface of a package carrier according to claim 1, characterized in that: The pH value of the zero-dimensional material treatment agent is 6-9, and the solid content is 0.01-1%.

4. The method for conducting the surface of a package carrier according to claim 1, characterized in that: The stabilizer is one or more of PVP, PVR, PEG and PCR.

5. The method for conducting the surface of a package carrier according to claim 1, characterized in that: The pH regulator is one or more solutions of sulfuric acid, hydrochloric acid, sodium hydroxide, potassium hydroxide, and ammonia water.

6. The method for conducting the surface of a package carrier according to claim 1, characterized in that: The packaging carrier is degreased and charge adjusted using a degreasing and charge adjusting agent, wherein the concentration of the degreasing and charge adjusting agent is 1-10%, the pH value is 10-14, the alkali equivalent is 0.01-0.25N, and the service life is 15-25mg / L of copper content.

7. The method for conducting the surface of a package carrier according to claim 1, characterized in that: The package carrier after the conductive deposition treatment is placed in a temperature condition of 80-100° C. for drying, and the air knife pressure is 300-1000 Pa.

8. The method for conducting the surface of a package carrier according to claim 1, characterized in that: In the step of removing the redundant conductive layer on the surface of the packaging carrier board that does not require the circuit pattern by plasma, the equipment power is 600~1000W, the vacuum degree is -75~-30KPa, the temperature is 80~200℃, and the time is 60~120s.

9. The method for conducting the surface of a package carrier according to claim 1, characterized in that: In the step of removing the excess conductive layer on the surface of the packaging carrier board that does not require the circuit pattern by ultrasonic wave, the equipment power is 300~1000W, the frequency is 20~60 Hz, the concentration of the solution is 2~10%, the temperature is 25~45°C, the pH value is 9~15, and the line speed is 2~4M / min.

10. The method for conducting the surface of a package carrier according to claim 1, characterized in that: The step of performing a five-stage countercurrent DI water washing treatment and a drying treatment on the package carrier from which the excess conductive layer is removed comprises: The package substrate with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 10-40°C, with a water change frequency of 1-10S / m and a water flow rate of 5-30 L / min; The package carrier is dried at a temperature of 80~100℃ and the air knife pressure is 300~1000pa.

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