Semiconductor processing system and processing method thereof

Abstract

The invention provides a semiconductor processing system and a processing method thereof.The semiconductor processing system comprises a transfer device, a front processing chamber, at least two process chambers, a main control device and a consignment device, the at least two process chambers contain bases of different sizes, and the consignment device comprises a temporary storage device used for bearing the bases; the caching device comprises a bearing area with the adjustable size. The processing method of the semiconductor processing system comprises the following steps: after judging a process chamber needing to be transferred into a base according to acquired and received information of a transfer device or information of at least one process chamber, controlling a cache device to adjust the size of a bearing area according to base size information that the process chamber to be transferred into the base can accommodate the base, and then the corresponding bases are placed on the bearing areas, the main control device controls the consignment device to drive the bases to enter the pre-treatment chamber, the process of transferring the bases of different sizes to the pre-treatment chamber is integrated on one production line, and the integration degree of the production line is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular, to a semiconductor processing system and a processing method thereof. Background Art

[0002] As an important component for carrying wafers, the pedestal plays a key role in the semiconductor manufacturing process. In order to improve integration and reduce space occupation, the existing technology usually sets a shipping device that is compatible with a pedestal of a specific size to ship the pedestal. The shipping device carries the pedestal, and after the pedestal is cleaned and purged, the pedestal is transferred to the pre-processing chamber to load the wafers to be processed, and then transferred to the corresponding process chamber to complete semiconductor processes such as vapor deposition processes.

[0003] For a semiconductor processing system with multiple reaction chambers, some reaction chambers are set to have different pedestal sizes than those that can be accommodated by other reaction chambers according to process requirements. Different pedestals carry different sizes of wafers, or carry wafers of the same size but different quantities, which is conducive to parallel processing of multi-sized wafers and improving production capacity. For such a semiconductor processing system, if a corresponding shipping device is set separately for each size of pedestal, it will involve the integrated design of multiple shipping devices in the system, which will inevitably increase the space occupied and easily affect other related devices in the system. For example, other related devices need to be redesigned to adapt to multiple shipping devices, which increases costs. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a semiconductor processing system and a processing method thereof, which can be applicable to a semiconductor processing system with multiple process chambers that accommodate bases of different sizes, and is conducive to improving the integration of production lines.

[0005] The semiconductor processing system provided in the present application includes: a transfer device, a pre-processing chamber, at least two process chambers, a main control device and a shipping device. The shipping device is provided with a cache device for supporting a base. The cache device includes a bearing area with an adjustable size. At least some of the process chambers are used to accommodate bases of different sizes. The main control device is communicatively connected with each process chamber, the shipping device and the cache device.

[0006] The semiconductor processing system processing method provided by the present application includes:

[0007] S0. Provide the aforementioned semiconductor processing system;

[0008] S1, the main control device obtains and determines the process chamber that needs to be transferred to the base according to the received information of the transfer device or the information of at least one process chamber;

[0009] S2, the main control device obtains and controls the buffer device of the consignment device to adjust the size of the carrying area according to the base size information that can accommodate the base in the process chamber to be transferred into the base;

[0010] S3, placing a corresponding base that matches the size of the bearing area on the bearing area;

[0011] S4, the main control device controls the shipping device to transport the base to the front processing room;

[0012] S5. The main control device controls the transfer device to transfer the base to the corresponding process room.

[0013] Optionally, in step S1, the main control device obtains and determines that the number of process chambers that need to be transferred into the base is at least 2 based on the received information of the transfer device or the information of at least one process chamber; repeats steps S2 to S4, so that at least two bases enter the pre-processing chamber in sequence, and then executes step S5.

[0014] Optionally, a visual device is provided in the pre-processing chamber and is communicatively connected to the main control device.

[0015] Optionally, in step S1, the main control device obtains and determines the order of transferring bases into each process chamber based on the received information of the transfer device or the information of at least one process chamber; in step S5, the step of transferring the bases to the corresponding process chamber by controlling the transfer device through the main control device includes the main control device controlling the transfer device to transfer each base to the corresponding process chamber in sequence according to the size and position information of each base in the pre-processing chamber sent by the visual device and the order of transferring the bases.

[0016] Optionally, the cache device includes a plurality of linear displacement mechanisms distributed radially, each linear displacement mechanism is slidably provided with a support seat, and the cache device also includes a driving mechanism that is communicatively connected to the main control device and connected to each support seat.

[0017] Optionally, the step of the main control device acquiring and controlling the cache device of the shipping device to adjust the size of the carrying area according to the base size information that the process chamber to be transferred into the base can accommodate the base includes:

[0018] The main control device obtains and sends a load-bearing area size adjustment instruction to the driving mechanism based on the base size information. The driving mechanism drives at least one support seat to slide along the extension direction of the corresponding linear displacement mechanism in response to the load-bearing area size adjustment instruction until the top of each support seat forms a load-bearing area for supporting the base.

[0019] Optionally, the cache device includes a positioning device communicatively connected to the main control device.

[0020] Optionally, in step S2, the step of the main control device acquiring and sending a bearing area size adjustment instruction to the driving mechanism according to the base size information includes:

[0021] The positioning device obtains and sends the position information of each support seat to the main control device;

[0022] The main control device sends a load-bearing area size adjustment instruction to the driving mechanism according to the position information of each support seat and the base size information.

[0023] Optionally, the main control device stores a first load-bearing lower limit threshold and a load-bearing difference threshold range, and the cache device includes a plurality of radially distributed linear displacement mechanisms, each of which is slidably arranged on a support seat, each support seat is a liftable support seat and is provided with a load-bearing sensor device that is communicatively connected to the main control device.

[0024] Optionally, in step S3, the step of placing a corresponding base that matches the size of the bearing area on the bearing area includes:

[0025] S31, the main control device controls the transfer device to place the base on the cache device of the consignment device whose carrying area size has been adjusted, and enables the transfer device to maintain a holding relationship with the base;

[0026] S32, the main control device obtains and determines, based on the received load-bearing values ​​sent by each load-bearing sensor device, that the load-bearing value of each support seat is greater than or equal to the first load-bearing lower limit threshold, and the difference in the load-bearing values ​​of any two support seats is within the range of the load-bearing difference minus the threshold;

[0027] S33, the main control device controls the transfer device to release the holding relationship with the base.

[0028] Optionally, the main control device further stores a second load-bearing lower limit threshold value that is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value.

[0029] Optionally, after step S31 is executed, the main control device obtains and determines, based on the received load-bearing values, that the load-bearing values ​​of the M support seats are greater than or equal to the second load-bearing lower limit threshold and less than the first load-bearing lower limit threshold, and the load-bearing values ​​of the remaining support seats are greater than or equal to the first load-bearing lower limit threshold, and executes step S33. The main control device then performs micro-motion lifting and lowering adjustments on the M support seats until step S32 is met; wherein M is an integer greater than or equal to 1 and less than the number of support seats.

[0030] Optionally, after step S31 is executed, the main control device obtains and determines, based on the received load-bearing values, that the load-bearing value of at least one support seat is less than the second load-bearing lower limit threshold, and then controls the transfer device to carry the base away from the consignment device, and then the main control device adjusts the lifting and lowering of at least one support seat.

[0031] Optionally, the support seat includes a lifting body and a supporting body movably mounted around the lifting body, the heights of the supporting bodies are consistent, and each lifting body is provided with a load-bearing sensing device. Each lifting body and each load-bearing sensing device are communicatively connected to the main control device.

[0032] Optionally, the step of the main control device performing lifting and lowering adjustment on at least one support seat includes:

[0033] The main control device controls the lifting of each lifting body until the height of each lifting body is consistent with the corresponding supporting body, or is accommodated in the corresponding supporting body.

[0034] Optionally, the semiconductor processing system further includes a transfer chamber, which is provided with at least one cache device.

[0035] Optionally, the semiconductor processing system processing method further includes:

[0036] The main control device obtains and determines the process chamber that needs to perform the susceptor transfer-out step according to the information sent by at least one process chamber;

[0037] The main control device controls the transfer device to transfer the susceptor in the process chamber to the transfer chamber, and the main control device obtains and controls the buffer device in the transfer chamber to adjust the size of the bearing area to match the size of the susceptor according to the size information of the susceptor;

[0038] The main control device controls the transfer device to place the base on the cache device with the load-bearing area size adjusted in the transfer room.

[0039] Compared with the prior art, the beneficial effects of the present application include at least the following:

[0040] In the semiconductor processing system and processing method thereof of the present application, the shipping device of the semiconductor processing system includes a cache device for carrying a base, and the cache device includes a carrying area with adjustable size. After the main control device determines the process chamber where the base needs to be transferred based on the information of the transfer device or the information of at least one process chamber obtained and received, the cache device is controlled to adjust the size of the carrying area based on the base size information that can accommodate the base in the process chamber to be transferred, and then the corresponding base is placed on the carrying area. The main control device controls the shipping device to drive the base to enter the pre-processing chamber, and the transfer process of bases of different sizes to the pre-processing chamber can be integrated on one production line, thereby reducing the number of production lines, site occupancy and equipment cost expenditure. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 A schematic flow chart of a semiconductor processing system processing method according to an embodiment of the present application.

[0043] Figure 2 A schematic diagram of the composition of a semiconductor processing system shown in an embodiment of the present application.

[0044] Figure 3 This is a schematic diagram of the structure of a process chamber shown in an embodiment of the present application.

[0045] Figure 4 A three-dimensional structural diagram of a cache device shown in an embodiment of the present application.

[0046] Figure 5 for Figure 4 A top view of the cache device is shown.

[0047] Figure 6 for Figure 4 A schematic diagram of a working state in which the size of the load-bearing area of ​​the cache device becomes larger.

[0048] Figure 7 for Figure 4 A schematic diagram of a working state in which the size of the load-bearing area of ​​the cache device becomes smaller is shown.

[0049] Figure 8 This is a structural diagram of a cache device with a positioning device according to an embodiment of the present application.

[0050] Fig. 9 A schematic diagram of the composition of a semiconductor processing system with a transfer chamber shown in an embodiment of the present application.

[0051] Fig.10 It is a schematic diagram of the working status of each cache device in the transfer room when there is no base.

[0052] Fig.11 This is a schematic diagram of the working status of some cache devices in the transfer room when they are already carrying the base.

[0053] The reference numerals in the figure are as follows: 1. Transfer device; 11. Clamping device; 2. Pre-processing chamber; 3. Process chamber; 31. Gas injection device; 32. Heating device; 33. Rotating device; 34. Isolation device; 35. Exhaust device; 4. Visual device; 5. Main control device; 6. Transfer chamber; 7. Consignment device; 100. Cache device; 101. Linear displacement mechanism; 102. Support seat; 1021. Lifting body; 1022. Support body; 103. Positioning device; S. Carrying area; 01. Base; 02. Wafer. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0055] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0056] The embodiments of the present application provide a susceptor transfer method and a semiconductor processing system. The technical solution of the present application will be described in detail below in conjunction with the accompanying drawings of the specification.

[0057] Embodiment 1

[0058] like Figure 2 As shown, this embodiment provides a semiconductor processing system, including a transfer device 1, a pre-processing chamber 2, at least two process chambers 3, a shipping device 7 and a main control device 5, the shipping device 7 is provided with a cache device 100 for supporting a base, and the cache device includes a load-bearing area with an adjustable size; at least part of the process chambers 3 accommodates bases of different sizes; the main control device 5 is connected to each process chamber 3, the shipping device 7 and the cache device 100 for communication. Specifically, Figure 2 The two process chambers 3 shown in the figure can accommodate different sizes of susceptors 01. After the susceptor 01 enters the pre-processing chamber 2 to install the wafer 02, the main control device 5 controls the transfer device 1 to transfer it to the process chamber 3 corresponding to the susceptor 01 to be transferred.

[0059] In some embodiments, the number of process chambers 3 is at least 2, and some process chambers 3 are used to accommodate pedestals 01 of different sizes. Pedestals 01 of different sizes carry wafers 02 of different sizes, or carry wafers 02 of the same size but different quantities, which is conducive to parallel processing of multiple quantities or multiple sizes of wafers and improves production capacity.

[0060] When the semiconductor processing system of this embodiment is used, if the process chamber 3 needs to transfer the pedestal 01, the main control device 5 adjusts the size of the carrying area of ​​the cache device 100 according to the pedestal size information of the pedestal 01 to be transferred into the process chamber 3, so as to carry the corresponding pedestal 01. The pedestal size information may be information pre-stored in the main control device 5, or imported from a preset database or data file, or sent by other controllers.

[0061] In this embodiment, if Figure 2 As shown, the transfer device 1 may include a clamping device 11 for clamping the side wall of the base 01 and having an adjustable clamping size. The transfer device 1 realizes the transfer of the base 01 through the base of the clamping device 11. For example, the clamping device 11 may include two clamping arms and a driving structure arranged opposite to each other. The driving structure may be a combination of one or more of a motor, a servo, a linear module, a cylinder, a connecting rod mechanism, etc. The driving structure may make the distance between the two clamping arms move away from or close to each other, and change the clamping size of the clamping device 11, so that it is suitable for clamping bases of different sizes. The specific implementation method is a conventional technical means in this field. In other embodiments, the transfer device 1 may also transfer the base 01 by supporting it. The specific implementation method is a conventional technical means in this field.

[0062] In some embodiments, a visual device 4 is provided in the pre-processing chamber 2, and the main control device 5 is in communication with the visual device 4. The visual device 4 obtains and feeds back information in the pre-processing chamber 2 to the main control device 5, including whether there is a base 01, and the size and position information of each base 01.

[0063] In some embodiments, the visual device 4 may include at least a camera, which captures an image of the base 01 in the pre-processing chamber 2 and sends it to the main control device 5, which analyzes the image and obtains the base size information. Alternatively, the visual device 4 may include a camera and a visual processing device, which has an independent image processing capability, and can analyze the image captured by the camera, calculate the base size information, and then send the base size information to the main control device 5.

[0064] In this embodiment, the main control device 5 can be a programmable logic controller (PLC), an industrial personal computer (IPC), a single board computer (SBC), an embedded system, a digital signal processor (DSP), a field programmable gate array (FPGA), a microcontroller (MCU), a cloud server, etc.

[0065] In this embodiment, a load-bearing sensor device (not shown in the figure) for sensing the mass of the object carried on the cache device 100 may be provided in the cache device 100, and the load-bearing sensor device is in communication connection with the main control device 5. The main control device 5 determines whether the base 01 has been placed on the cache device 100 and whether a stable support is achieved, or determines whether the base 01 has been removed from the cache device 100 through the load-bearing signal of the load-bearing sensor device. Specifically, the load-bearing sensor device may be a weighing sensor.

[0066] In this embodiment, if Figure 4 and Figure 5 As shown, the cache device 100 may include linear displacement mechanisms 101 radially distributed around a central position O, and at least one support seat 102 that can slide and change its position is installed on each linear displacement mechanism 101. The cache device 100 also includes a driving mechanism that is communicatively connected to the main control device 5, and the cache device 100 controls the driving mechanism to work so as to change the position of the support seat 102 on the linear displacement mechanism 101.

[0067] like Figure 5 As shown, the bearing plane formed by the surfaces of the support seats 102 on all the linear displacement mechanisms 101 is the bearing area S (the bearing area S includes at least a portion of the top surface of each support seat 102). Figure 6 As shown, the support seats 102 on all linear displacement mechanisms 101 move away from the center position O, and the size of the bearing area S becomes larger, as shown in FIG. Figure 7 As shown, the bearing area S becomes smaller as it moves closer to the center position O. Preferably, the position, movement direction and movement distance of each support seat 102 on the linear displacement mechanism 101 remain consistent, that is, each support seat 102 is adjusted synchronously on the linear displacement mechanism 101 .

[0068] In this embodiment, the linear displacement mechanism 101 can be a screw module or a synchronous belt module. In this case, the driving mechanism can be a servo motor that drives the screw module, the synchronous belt module, etc. The driving mechanism drives the linear displacement mechanism 101 to work, so that the support seat 102 installed on the linear displacement mechanism 101 is displaced to change its position.

[0069] In this embodiment, the linear displacement mechanism 101 may also be a guide rail, and the support seat 102 may be provided with a slide groove, and the support seat 102 is mounted on the guide rail through the cooperation between the slide groove and the guide rail. The driving mechanism may include a motor and a running wheel driven by the motor, the driving mechanism is mounted on the support seat 102, and the running wheel contacts the guide rail or a surface near the guide rail, and the motor controls the running wheel to rotate, thereby causing the support seat 102 to slide along the guide rail to change its position.

[0070] In this embodiment, if Figure 8 As shown, the buffer device 100 may also include a positioning device 103, which is arranged next to each linear displacement mechanism 101. The positioning device 103 is used to detect the position of the support seat 102 in the linear displacement mechanism 101, and the positioning device 103 is connected to the main control device 5 for communication; the main control device 5 determines whether the size of the bearing area is compatible with the size of the base to be transported through the position signal fed back by the positioning device 103. The positioning device 103 can be, but is not limited to, a grating sensor, an ultrasonic sensor, a proximity switch, etc.

[0071] In some embodiments, the pre-processing chamber 2 can also be used to clean and purge the base 01. After the base 01 is cleaned and purged in the pre-processing chamber 2, the cleaned wafer 02 is installed on the base. Since the cache device 100 supports the base 01 through the supporting area S, most of the surface of the base is exposed, which improves the cleaning and purging effect.

[0072] In some embodiments, after the wafer 02 is loaded on the cleaned and purged pedestal 01 , the pedestal 01 may be transported to the pre-processing chamber 2 via the transporting device 7 . In this case, the pedestal 01 is the pedestal carrying the wafer 02 .

[0073] In this embodiment, if Fig. 9 As shown, the semiconductor processing system may further include a transfer chamber 6. A cache device 100 with an adjustable carrying area size is provided in the transfer chamber 6, so when faced with the cache requirements of bases 01 of different sizes, the carrying area size of the cache device 100 can be adaptively adjusted to carry bases 01 of different sizes.

[0074] In one embodiment, the number of cache devices 100 in the transfer chamber 6 is 1. When a base 01 to be transferred in a process chamber 3 is transferred to the cache device 100 and cooled to room temperature, the base 01 is transferred out of the transfer chamber 6. At this time, the size of the carrying area of ​​the cache device 100 is adapted to the base 01. When a base 01 of a different size to be transferred in another process chamber 3 needs to be transferred to the cache device 100, because the carrying area of ​​the cache device 100 can be flexibly adjusted, the size of the carrying area of ​​the cache device 100 can be adjusted so that the cache device 100 can still be used to cache the bases 01 of different sizes transferred out of another process chamber 3, thereby making full use of the cache device 100 and improving the flexibility of caching bases 01 of different sizes.

[0075] In this embodiment, if Fig. 9 , 10 As shown in Figure 11, the number of cache devices 100 in the transfer room 6 is at least 2, which further improves the cache capacity of the transfer room 6. Since the size of the load-bearing area of ​​the unloaded cache device 100 can be adaptively adjusted according to the size of the base to be transferred, the cache device 100 has more flexible adaptability and improves the utilization rate. At the same time, the cache device 100 with adjustable load-bearing area size cooperates with the transfer device 1 and the main control device 5 to integrate the transfer process of bases of different sizes on one production line, reduce the number of production lines, reduce space occupancy and equipment cost expenditure, reduce the idle rate of the cache device 100, and improve the utilization rate.

[0076] In some embodiments, the pre-treatment chamber 2 , the transfer chamber 6 , and the process chamber 3 are arranged around the transfer device 1 .

[0077] In some embodiments, the main control device 5 receives information that the process in the process chamber 3 has ended, and determines that the pedestal carrying the wafer needs to be transferred from the process chamber 3 to the transfer chamber 6. The main control device 5 controls the transfer device 1 to transfer the corresponding pedestal carrying the coated wafer from the process chamber 3 to the transfer chamber 6 for storage, and after each pedestal carrying the coated wafer is cooled to a suitable temperature (such as room temperature), the pedestal carrying the coated wafer is moved out of the transfer chamber 6, and the coated wafer is removed.

[0078] In some embodiments, a visual device 4 may also be provided in each process chamber 3. The main control device 5 may obtain the size information of the pedestal to be transferred through the visual device 4 in a process chamber 3, and obtain and determine the need to perform the pedestal transfer step from the process chamber 3 based on the received information sent by the process chamber 3. The main control device 5 controls the unloaded cache device 100 in the transfer chamber 6 to adjust the size of the carrying area to match the size of the pedestal to be transferred based on the pedestal size information. The main control device 5 controls the transfer device 1 to transfer the pedestal in the process chamber 3 to the transfer chamber 6, and place it on the cache device 100 with the adjusted carrying area size.

[0079] In this embodiment, if Fig.10 and Fig.11 As shown, the support base 102 of the cache device 100 can be configured as a liftable structure.

[0080] In some embodiments, the cache device 100 is configured as a liftable cache device. Fig.11 As shown, in the transfer room 6, after the buffer device 100 carries the base to be transferred, the main control device 5 controls the corresponding buffer device 100 to rise so that the support base 102 rises to the set upper limit position. After the support base 102 rises to the set upper limit position, the height of the free space on the top of the base can prevent other bases from entering again.

[0081] Furthermore, Fig.11 As shown, each support seat 102 includes a lifting body 1021 and a supporting body 1022, the supporting body 1022 is movably mounted around the lifting body 1021 and outside the lifting body 1021, the supporting body 1022 is mounted on the linear displacement mechanism 101 in a form that can slide and change its position, each lifting body 1021 is connected to the main control device 5 for communication, and the top of the lifting body 1021 is used to support the base 01. The main control device 5 controls the lifting body 1021 to perform lifting and lowering motion relative to the supporting body 1022.

[0082] Embodiment 2

[0083] like Figure 1 As shown, an embodiment of the present application provides a semiconductor processing system processing method, which is implemented using the semiconductor processing system in embodiment one.

[0084] The semiconductor processing system processing method of this embodiment at least includes:

[0085] S1, the main control device obtains and determines the process chamber that needs to be transferred to the base according to the received information of the transfer device or the information of at least one process chamber;

[0086] S2, the main control device obtains and controls the buffer device of the consignment device to adjust the size of the carrying area according to the base size information that can accommodate the base in the process chamber to be transferred into the base;

[0087] S3, placing a corresponding base that matches the size of the bearing area on the bearing area;

[0088] S4, the main control device controls the shipping device to transport the base to the front processing room;

[0089] S5. The main control device controls the transfer device to transfer the base to the corresponding process room.

[0090] In step S1 of this embodiment, the main control device 5 obtains and determines the process chamber 3 that needs to be transferred to the base according to the information of at least one process chamber 3 received. Figure 3 The process chamber 3 is provided with a gas injection device 31, a heating device 32, a pressure control device (not shown in the figure), an exhaust device 35, a rotating device 33 and an isolation device 34 which are all connected to the main control device 5 in communication. The main control device 5 pre-stores the process program information. The base 01 is arranged on the rotating device 33 in the process chamber 3, the heating device 32 is arranged below the base 01, the gas injection device 31 is arranged at the top of the process chamber 3 and is opposite to the surface of the base 01 carrying the substrate, and the exhaust device 35 is arranged at the bottom of the process chamber 3. The main control device 5 controls the isolation device 34 to be closed according to the process program information, the heating device 32 to generate heat so that the temperature in the process chamber 3 meets the process temperature requirement, controls the pressure control device (not shown in the figure) and the exhaust device (not shown in the figure) so that the pressure in the process chamber 3 meets the process pressure requirement, and controls the gas injection device 31 to provide the type and flow rate of the process gas into the process chamber 3 so that the substrate surface undergoes a vapor deposition reaction, and controls the rotating device 33 to drive the substrate to rotate so as to grow a semiconductor material layer that meets the process requirements. After the vapor deposition reaction is completed, the main control device 5 controls the gas injection device 31 to inject an inert purge gas (such as nitrogen) into the process chamber 3, controls the rotating device 33 to gradually decelerate to a stop state and then move along the axial direction of the process chamber 3 to a suitable position to facilitate the subsequent transfer device 1 entering the process chamber 3 to transfer the base 01, and controls the pressure control device and the exhaust device 35 to make the pressure difference between the inside and outside of the process chamber 3 meet the transfer requirements (for example, the pressure in the process chamber 3 is consistent with the pressure in the area where the transfer device 1 is located), and then controls the isolation device to be in an open state. The main control device 5 can judge the process chamber that needs to be transferred to the base according to the time node when the gas injection device 31 is controlled to inject an inert purge gas (such as nitrogen) into the corresponding process chamber 3, and controls the rotating device 33 to gradually decelerate to a stop state and then move along the axial direction of the process chamber 3 to a suitable position, or it can judge the process chamber that needs to be transferred to the base according to the time node when the pressure control device and the exhaust device 35 are controlled to make the pressure difference between the inside and outside of the process chamber 3 meet the transfer requirements. The specific judgment node can be reasonably set according to the efficiency requirements of the process for different batches of materials.

[0091] In step S1 of some embodiments, the main control device obtains and makes a judgment based on the information received from the transfer device. Specifically, after the main control device 5 controls the transfer device 1 to move the base 01 in the process chamber 3 out of the process chamber 3, the main control device 5 will receive corresponding information fed back by the transfer device 1. The main control device 5 judges that the process chamber 3 needs to be transferred into the base 01 based on the corresponding information fed back by the transfer device 1.

[0092] In some embodiments, Figure 4As shown, the cache device 100 includes a plurality of linear displacement mechanisms 101 distributed radially, each linear displacement mechanism 101 is slidably provided with a support seat 102 , and the cache device 100 also includes a driving mechanism that is communicatively connected to the main control device 5 and connected to each support seat 102 .

[0093] In step S2 of this embodiment, the main control device 5 obtains and controls the cache device 100 of the shipping device 7 to adjust the size of the carrying area according to the base size information that the process chamber 3 to be transferred into the base can accommodate the base, including:

[0094] The main control device 5 obtains and sends a load-bearing area size adjustment instruction to the driving mechanism according to the base size information. The driving mechanism drives at least one support seat 102 to slide along the extension direction of the corresponding linear displacement mechanism 101 in response to the load-bearing area size adjustment instruction until the top of each support seat 102 forms the load-bearing area of ​​the base.

[0095] In one embodiment, the "until the top of each support seat 102 forms a bearing area of ​​the base" means that the main control device 5 obtains the bottom surface size information of the base 01 to be transferred, and adjusts the bearing area S of the cache device 100 according to the size information (such as Figure 6 and Figure 7 The size of the bearing area S is smaller than or equal to the bottom surface size of the base 01 to achieve stable bearing.

[0096] In some embodiments, such as Figure 8 As shown, the cache device 100 may include a positioning device 103 that is in communication with the main control device 5, and a positioning device 103 is arranged next to each linear displacement mechanism 101. Therefore, in step S2, the main control device 5 obtains and sends a bearing area size adjustment instruction to the driving mechanism according to the base size information, including:

[0097] The positioning device 103 obtains and sends the position information of each support base 102 to the main control device 5;

[0098] The main control device 5 sends a load-bearing area size adjustment instruction to the driving mechanism according to the position information of each support base 102 and the base size information.

[0099] In some embodiments, the main control device 5 may pre-store the base size information of the base 01 adapted to each process chamber 3. Then, before the step S2 of "the main control device 5 sends a bearing area size adjustment instruction to the driving mechanism according to the position information and base size information of each support base 102", the following may be included:

[0100] The main control device 5 obtains the susceptor size information of the susceptor 01 adapted to the process chamber 3 according to the information of the process chamber 3 into which the susceptor 01 needs to be transferred in step S1 .

[0101] In some embodiments, each support seat 102 of the cache device 100 may be a liftable support seat, and a load-bearing sensor device may be provided on each support seat 102 of the cache device 100 of the shipping device 7, and the load-bearing sensor device is in communication connection with the main control device 5. The main control device 5 pre-stores a first load-bearing lower limit threshold and a load-bearing difference threshold range. In step S3 of some embodiments, the step of placing the base 01 adapted to the size of the load-bearing area on the load-bearing area includes:

[0102] S31, the main control device 5 controls the transfer device 1 to place the base to be transferred on the buffer device 100 of the consignment device 7 whose carrying area size has been adjusted, and enables the transfer device 1 to maintain the holding relationship with the base 01;

[0103] S32, the main control device 5 obtains and determines, based on the received load-bearing values ​​sent by each load-bearing sensor device, that the load-bearing value of each support seat 102 is greater than or equal to the first load-bearing lower limit threshold, and the difference between the load-bearing values ​​of any two support seats 102 is within the range of the load-bearing difference minus the threshold;

[0104] S33 , the main control device 5 controls the transfer device 1 to release the holding relationship with the base 01 .

[0105] Since each support seat 102 of the cache device 100 of the present application involves height adjustment and size adjustment of the bearing area in the plane direction, in order to further ensure that after the main control device 5 controls the transfer device 1 to transfer the base 01 to the bearing area, the bearing area can achieve stable support for the base 01, in step S31 of the present application, the main control device 5 controls the transfer device 1 to place the base 01 to be transferred on the cache device 100 with the bearing area size adjusted, and also enables the transfer device 1 to maintain a holding relationship with the base 01, which is equivalent to forming a target bearing position relationship on the cache device 100 by holding the base 01 through the transfer device 1, and judging through step S32 whether the bearing area meets the condition of stable support for the base 01 under the condition of S31.

[0106] In some embodiments, the first load lower limit threshold N0 is calculated based on the base 01 with the smallest weight carried by the cache device 100, that is, the value of the weight carried by each support base 102 when the load-bearing device with the smallest weight is stably placed on the cache device 100.

[0107] In some embodiments, the first load lower limit threshold N0 is related to the weight of the base 01 held by the transfer device. The main control device 5 pre-stores the correspondence data between each process chamber 3 that can accommodate the base 01 and its weight and the first load lower limit threshold N0. After the main control device 5 determines the information of the base 01 accommodated in the corresponding process chamber 3 that needs to transfer the base 01 through step S2, the first load lower limit threshold N0 is obtained in the correspondence data based on the information.

[0108] In some embodiments, a load-bearing sensor device is provided on the transfer device 1, which can obtain and feed back the weight of the held base 01 to the main control device 5. The main control device 5 obtains and obtains the corresponding first load-bearing lower limit threshold value based on the base weight sent by the transfer device 1 and the corresponding relationship data between the pre-stored base weight and the first load-bearing lower limit threshold value.

[0109] In order to reduce or avoid the instability of the center of gravity of the base 01 due to the large height difference between the support seats 102, the main control device 5 controls the transfer device 1 through step S31 to place the base 01 to be transferred on the buffer device 100 with the adjusted load area size in the consignment device 7, and after the transfer device 1 maintains the holding relationship with the base 01, step S32 is executed to determine the first load lower limit threshold and the load-bearing difference threshold range to ensure that the center of gravity of the base 01 is stable after step S33 is executed. Specifically, Figure 4 The first lower limit threshold of the bearing capacity of each of the four support seats 102 is N0 and the height is consistent. When the base 01 is stably supported by the support seats 102, the load borne by each support seat 102 is N1, N2, N3 and N4, N1, N2, N3 and N4 are all greater than or equal to N0, and the difference between the load-bearing values ​​of any two support seats 102, such as the absolute value of (N1-N2), (N4-N1) and the like are all within the range of the load-bearing difference threshold, it is considered that the bearing area has played a role in stably supporting the base 01.

[0110] Furthermore, the stable support of the base 01 by each support seat 102 is the result of the joint action of each support seat 102, and the base 01 is not completely flat in some cases. Therefore, it is more time-saving and safer and more reliable to judge and adjust each support seat 102 to jointly achieve stable support for the base 01 through the load-bearing value.

[0111] In some embodiments, the main control device 5 also stores a second load-bearing lower limit threshold value that is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value. After step S31 is executed, the main control device 5 obtains and determines, based on each load-bearing value, that the load-bearing values ​​of the M support seats 102 are greater than or equal to the second load-bearing lower limit threshold value and less than the first load-bearing lower limit threshold value, and after the load-bearing values ​​of the remaining support seats 102 are greater than or equal to the first load-bearing lower limit threshold value, step S33 is executed, and then the main control device 5 performs micro-motion lifting and lowering adjustment on the M support seats 102 until step S32 is satisfied. Wherein, M is an integer greater than or equal to 1 and less than the number of support seats. Since the load-bearing value of each support seat 102 is greater than or equal to the second load-bearing lower limit threshold, and the second load-bearing lower limit threshold is not less than 5% of the first load-bearing lower limit threshold, it means that each support seat 102 forms a load-bearing relationship with the bottom surface of the load-bearing device, and there will be no risk of the base 01 falling due to placement failure after being placed toward the load-bearing area due to the mismatch between the load-bearing area area and the bottom surface size of the loaded base 01, or the risk of sliding due to significant unevenness after placement. In this case, only the support seats 102 of the first load-bearing lower limit threshold and the second load-bearing lower limit threshold need to be adjusted. Therefore, the transfer device 1 can first release the holding relationship with the base 01 through step S33, at which time the base 01 can be supported by each support seat 102 without falling. In this case, in order to further facilitate the stable support of the base 01, the main control device 5 is used to perform micro-lifting and adjustment until the main control device 5 determines that the load-bearing value of each support seat 102 meets the requirements of step S32. The micro-motion lifting adjustment can use the height of one of the support seats 102 whose load-bearing value is greater than the first load-bearing lower limit threshold as the reference height, and adjust the heights of the M support seats 102 to be adjusted in sequence. In some embodiments, the height adjustment order of the support seats 102 is based on the diagonal principle. For example, the height of one of the support seats 102 (recorded as the first support seat) is used as the reference, and the next support seat 102 to be adjusted is the support seat that is diagonally related to the first support seat. In some embodiments, in the process of micro-adjusting the target support seat 102, appropriate step-by-step control can be performed, that is, adjusting part of the height each time, which is more conducive to the stable placement of the base 01 during the micro-adjustment process without slipping.

[0112] In some embodiments, after step S31 is executed, the main control device 5 obtains and determines that the load-bearing value of at least one support seat 102 is less than the second load-bearing lower limit threshold value based on the load-bearing value of each support seat, and then controls the transfer device 1 to maintain the holding relationship with the base 01, and controls the transfer device 1 to clamp the base 01 and move away from the consignment device 7, and then the main control device 5 performs lifting and lowering adjustment on at least one support seat 102. When the main control device 5 determines that the load-bearing value of a support seat 102 is less than the second load-bearing lower limit threshold value, it means that the bearing relationship between the support seat 102 and the base 01 is not strong or there is no contact relationship, which makes it easy for the base 01 to fall from the bearing area due to the inability to support stably. In this case, if the base 01 is placed first and then the lifting and lowering adjustment is performed directly, it is easy for the base 01 to be unable to be stably supported on the bearing area.

[0113] In some embodiments, Fig.11 As shown, the support seat 102 includes a lifting body 1021 and a support body 1022 movably mounted around the lifting body 1021, the heights of the support bodies 1022 are consistent, and each lifting body 1021 is provided with a load-bearing sensor device, and each lifting body 1021 is in communication with the main control device 5. The step of the main control device 5 performing lifting and adjusting at least one support seat 102 includes: the main control device 5 performs lifting and adjusting on each lifting body 1021 on the cache device 100 until each lifting body 1021 is in the same height as the corresponding support body 1022. In another embodiment, the step of the main control device 5 performing lifting and adjusting on at least one support seat 102 includes: the main control device 5 performs lifting and adjusting on each lifting body 1021 on the cache device 100 until each lifting body 1021 is accommodated in the corresponding support body 1022, so that the base 01 can be stably supported by each support body 1022 of the same height. Compared with the solution of re-adjusting the heights of the lifting bodies 1021 to be consistent, the above control method does not need to judge whether the heights of the lifting bodies 1021 are consistent, which is more time-saving for achieving stable support of the base 01.

[0114] In step S4 of some embodiments, the main control device 5 controls the transporting device 7 to transport the base 01 to the pre-processing chamber 2. In some more specific embodiments, the transporting device 7 is a movable tray, such as a tray supported by a robot arm.

[0115] In step S5 of some embodiments, the wafer 02 is placed on the susceptor 01 in the pre-processing chamber 2, and then the main control device 5 controls the transfer device 1 to transfer the susceptor to the corresponding process chamber 3. In some specific embodiments, the pre-processing chamber 2 is a glove box.

[0116] In step S5 of some embodiments, the main control device 5 controls the shipping device 7 to carry the base 01 to the pre-processing chamber 2.

[0117] In some embodiments, Fig. 9 As shown, the semiconductor processing system may further include at least one transfer chamber 6 .

[0118] In some embodiments, the pre-treatment chamber 2 , the transfer chamber 6 , and the process chamber 3 are arranged around the transfer device 1 .

[0119] In some embodiments, the semiconductor processing system processing method further includes:

[0120] The main control device 5 obtains and determines the process chamber 3 that needs to perform the susceptor transfer-out step according to the information received from at least one process chamber 3;

[0121] The main control device 5 controls the transfer device 1 to transfer the susceptor in the process chamber 3 to the transfer chamber 6. The main control device 5 obtains and controls the cache device 100 in the transfer chamber 6 to adjust the size of the bearing area to match the size of the susceptor according to the size information of the susceptor;

[0122] The main control device 5 controls the transfer device 1 to place the base on the buffer device 100 with the adjusted bearing area size in the transfer chamber 6 .

[0123] In some embodiments, reference Figure 3 As shown, after the vapor deposition reaction is completed, the main control device 5 controls the gas injection device 31 to inject an inert purge gas (such as nitrogen) into the process chamber 3, controls the rotating device 33 to gradually slow down to a stop state, and then moves axially along the process chamber 3 to a suitable position to facilitate the subsequent transfer device 1 to enter the process chamber 3 to transfer the base 01, and controls the pressure control device and the exhaust device 35 to make the pressure difference between the inside and outside of the process chamber 3 meet the transfer requirements (for example, the pressure in the process chamber 3 is consistent with the pressure in the area where the transfer device 1 is located), and then controls the isolation device 34 to be in an open state.

[0124] After the main control device 5 receives the process information of the completion of the current wafer processing in the process chamber 3 and determines that the step of transferring the pedestal 01 to be transferred to the transfer chamber 6 needs to be executed, the main control device 5 obtains the pedestal size information of the pedestal 01 to be transferred through the visual device 4 in the process chamber 3. Specifically, after the main control device 5 determines that the isolation device 34 is in the open state, it confirms that the corresponding process chamber 3 needs to transfer out the pedestal 01.

[0125] In some embodiments, each process chamber 3 is provided with a visual device 4. The main control device 5 determines the process chamber 3 that needs to be transferred into the pedestal 01 according to the information sent by the visual device 4 of each process chamber 3. Specifically, after the transfer device 1 transfers the pedestal 01 out of the process chamber 3, the main control device 5 obtains the image information in the process chamber 3 through the visual device 4 in the process chamber 3; when the main control device 5 determines that the process chamber 3 does not contain the pedestal 01 according to the image information obtained by the visual device 4, the process chamber 3 is determined to be the process chamber that needs to be transferred into the pedestal 01.

[0126] In some embodiments, the main control device 5 can inject an inert purge gas (such as nitrogen) into the corresponding process chamber 3 according to the control gas injection device 31, and control the rotating device 33 to gradually decelerate to a stop state and then move along the axial direction of the process chamber 3 to a suitable position to determine the process chamber 3 that needs to be transferred to the base 01 at the time node, or can control the pressure control device and the exhaust device 35 to make the pressure difference between the inside and outside of the process chamber 3 meet the transfer requirements to determine the process chamber 3 that needs to be transferred to the base 01 at the time node, that is, when the supporting base 01 of the process chamber 3 has not been transferred out, it is judged in advance according to the process beat that the process chamber 3 needs to be transferred to other supporting bases 01 later, so that the time node of the subsequent execution of transferring the supporting base 01 from the process chamber 3 coincides with or is not much different from the time node of the above-mentioned S04 execution, thereby improving efficiency. The specific judgment node can be reasonably set according to the efficiency requirements of the process for different batches of material processing.

[0127] In step S3 of some embodiments, the main control device 5 controls the transfer device 1 to place the pedestal to be transferred on the buffer device 100 of the carrier device 7 whose carrying area size has been adjusted. The transfer device 1 that performs step S3 and the transfer device 1 that transfers the pedestal 01 in the pre-processing chamber 2 to the corresponding process chamber 3 can be the same transfer device or different transfer devices. The specific selection is necessary to facilitate the production line efficiency of the semiconductor processing system.

[0128] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor processing system processing method, characterized in that: include: S0. Provide semiconductor processing system; The semiconductor processing system at least includes a transfer device, a pre-processing chamber, at least two process chambers, a main control device and a shipping device, wherein a cache device for supporting a base is provided on the shipping device, and the cache device includes a bearing area with an adjustable size, and at least some of the process chambers are used to accommodate bases of different sizes; the main control device is in communication connection with each of the process chambers, the shipping device and the cache device; S1, the main control device obtains and determines the process chamber that needs to be transferred to the base according to the received information of the transfer device or the information of at least one of the process chambers; S2, the main control device obtains and controls the cache device of the shipping device to adjust the size of the carrying area according to the base size information of the process chamber that can accommodate the base to be transferred into; S3, placing the corresponding base adapted to the size of the bearing area on the bearing area; S4, the main control device controls the shipping device to transport the base into the pre-processing chamber; S5. The main control device controls the transfer device to transfer the base to the corresponding process chamber.

2. The semiconductor processing system processing method according to claim 1, characterized in that: In the step S1, the main control device obtains and determines, based on the received information of the transfer device or the information of at least one of the process chambers, that the number of the process chambers that need to be transferred to the base is at least 2; Repeat the steps S2 to S4 to allow at least two susceptors to enter the pre-processing chamber in sequence, and then perform step S5.

3. The semiconductor processing system processing method according to claim 2, characterized in that: The pre-processing chamber is provided with a visual device which is in communication with the main control device; In the step S1, the main control device obtains and determines the order of transferring the process chambers that need to be transferred into the base according to the received information of the transfer device or the information of at least one process chamber; In step S5, the step of controlling the transfer device to transfer the susceptor to the corresponding process chamber by the main control device includes: the main control device controls the transfer device to transfer each susceptor to the corresponding process chamber in sequence according to the size and position information of each susceptor in the pre-processing chamber sent by the visual device and the order of the transferred susceptors.

4. The semiconductor processing system processing method according to claim 1, characterized in that: The cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, and the cache device also includes a driving mechanism that is communicatively connected to the main control device and connected to each of the support seats; In step S2, the main control device acquires and controls the cache device of the shipping device to adjust the size of the carrying area according to the base size information that the process chamber to be transferred into the base can accommodate the base, including: The main control device obtains and issues a bearing area size adjustment instruction to the driving mechanism based on the base size information. The driving mechanism drives at least one of the support seats to slide along the extension direction of the corresponding linear displacement mechanism in response to the bearing area size adjustment instruction until the top of each support seat forms a bearing area for supporting the base.

5. The semiconductor processing system processing method according to claim 4, characterized in that: The cache device includes a positioning device that is communicatively connected to the main control device; In step S2, the main control device acquires and issues a bearing area size adjustment instruction to the driving mechanism according to the base size information, including: The positioning device obtains and sends the position information of each support seat to the main control device; The main control device sends the bearing area size adjustment instruction to the driving mechanism according to the position information of each support seat and the base size information.

6. The semiconductor processing system processing method according to claim 1, characterized in that: The main control device stores a first load-bearing lower limit threshold and a load-bearing difference threshold range, and the cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, each of the support seats is a liftable support seat and is provided with a load-bearing sensor device that is communicatively connected to the main control device; In step S3, the step of placing the corresponding base adapted to the size of the bearing area on the bearing area includes: S31, the main control device controls the transfer device to place the base on the cache device of the consignment device with the load-bearing area size adjusted, and enables the transfer device to maintain a holding relationship with the base; S32, the main control device obtains and determines, based on the received load-bearing values ​​sent by each load-bearing sensor device, that the load-bearing value of each support seat is greater than or equal to the first load-bearing lower limit threshold, and the difference between the load-bearing values ​​of any two support seats is within the range of the load-bearing difference minus the threshold; S33, the main control device controls the transfer device to release the holding relationship with the base.

7. The semiconductor processing system processing method according to claim 6, characterized in that: The main control device further stores a second load-bearing lower limit threshold value which is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value; After the step S31 is executed, the main control device obtains and determines, based on the received load-bearing values, that the load-bearing values ​​of the M support seats are greater than or equal to the second load-bearing lower limit threshold and less than the first load-bearing lower limit threshold, and the load-bearing values ​​of the remaining support seats are greater than or equal to the first load-bearing lower limit threshold, and executes the step S33. Then the main control device performs micro-motion lifting and lowering adjustments on the M support seats until the step S32 is satisfied; wherein M is an integer greater than or equal to 1 and less than the number of support seats.

8. The semiconductor processing system processing method according to claim 6, characterized in that: The main control device further stores a second load-bearing lower limit threshold value which is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value; After the step S31 is executed, the main control device obtains and determines, based on the received load-bearing values, that the load-bearing value of at least one of the support seats is less than the second load-bearing lower limit threshold, and then controls the transfer device to carry the base away from the consignment device, and then the main control device adjusts the lifting and lowering of at least one of the support seats.

9. The semiconductor processing system processing method according to claim 8, characterized in that: The support seat includes a lifting body and a supporting body movably mounted around the lifting body, the heights of the supporting bodies are consistent, and each lifting body is provided with the load-bearing sensor device, and each lifting body and each load-bearing sensor device are connected to the main control device for communication; The step of the main control device adjusting the lifting and lowering of at least one of the support bases comprises: The main control device controls the lifting of each lifting body until the height of each lifting body is consistent with the corresponding supporting body, or is accommodated in the corresponding supporting body.

10. The semiconductor processing system processing method according to claim 1, characterized in that: The semiconductor processing system further comprises a transfer room, wherein the transfer room is provided with at least one buffer device, and the semiconductor processing system processing method further comprises: The main control device obtains and determines the process chamber that needs to perform the susceptor transfer-out step according to the received information sent by at least one of the process chambers; The main control device controls the transfer device to transfer the susceptor in the process chamber to the transfer chamber, and the main control device obtains and controls the cache device in the transfer chamber to adjust the size of the bearing area to match the size of the susceptor according to the size information of the susceptor; The main control device controls the transfer device to place the base on the cache device with the bearing area size adjusted in the transfer room.

11. A semiconductor processing system, characterized in that: It includes a transfer device, a pre-processing chamber, at least two process chambers, a main control device and a shipping device, wherein the shipping device is provided with a cache device for supporting a base, and the cache device includes a bearing area with an adjustable size; at least part of the process chambers accommodates bases of different sizes; the main control device is communicatively connected with each of the process chambers, the shipping device and the cache device.

12. The semiconductor processing system according to claim 11, characterized in that: The cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, and the cache device also includes a driving mechanism that is communicatively connected to the main control device and connected to each of the support seats.

13. The semiconductor processing system according to claim 11, wherein: The cache device includes a positioning device that is communicatively connected to the main control device.

14. The semiconductor processing system according to claim 12, wherein: The support seat includes a lifting body and a supporting body movably mounted around the lifting body. Each lifting body is provided with a load-bearing sensor device, and each lifting body is communicatively connected with the main control device.

15. The semiconductor processing system according to claim 11, wherein: The pre-processing room is provided with a visual device which is in communication connection with the main control device.

16. The semiconductor processing system according to claim 11, wherein: It also includes at least one transfer room provided with the cache device.

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