Light-emitting device

Abstract

The invention discloses a light-emitting device. The light-emitting device comprises a light-emitting panel; the temperature adjusting layer is located on one side of the light-emitting panel; wherein the temperature adjusting layer has thermal conductivity, and the temperature adjusting layer is used for dissipating heat of the light-emitting panel; the temperature adjusting layer further has electrical conductivity and is further used for heating the light-emitting panel under the condition that voltage is connected. According to the technical scheme, the service life of the light-emitting device is prolonged, and the performance of the light-emitting device is improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of light emitting devices, and in particular to a light emitting device. Background Art

[0002] OLED (Organic Light Emitting Diodes) refers to devices that can emit light through carrier injection and recombination when organic semiconductor materials and luminescent materials are driven by an electric field. They can be used in lighting and display technology and have excellent characteristics such as self-luminescence, low power consumption, fast response speed, high luminous efficiency and simple process.

[0003] However, since the heat generated by the heating element in the current light-emitting device is not easy to volatilize and dissipate, the continuously accumulated heat will affect the performance and service life of the light-emitting device; in addition, when the light-emitting device is placed in a low-temperature environment, the impact of the low temperature will also affect the performance and service life of the product. Therefore, how to improve the service life and performance of the light-emitting device is one of the technical problems that need to be solved urgently at this stage. Summary of the invention

[0004] The embodiment of the present invention provides a light emitting device to improve the service life and performance of the light emitting device.

[0005] An embodiment of the present invention provides a light emitting device, including:

[0006] Illuminated panels;

[0007] A temperature regulating layer, located on one side of the light emitting panel;

[0008] The temperature adjustment layer has thermal conductivity, and is used to dissipate heat from the light-emitting panel; the temperature adjustment layer also has electrical conductivity, and is used to heat the light-emitting panel when a voltage is connected.

[0009] Optionally, the resistivity of the temperature regulating layer is greater than or equal to 3×10 -8 Ω·m, and / or the thermal conductivity of the temperature regulating layer is greater than or equal to 200 W / m·k.

[0010] Optionally, the light emitting device further includes:

[0011] A temperature sensing unit, the temperature sensing unit is used to detect the temperature of the light emitting panel;

[0012] A control unit and a power module; the control unit is electrically connected to the temperature sensing unit and the power module; the control unit is used to control the voltage output by the power module to the temperature regulating layer according to the detected temperature of the light-emitting panel;

[0013] The temperature adjustment layer includes a plurality of temperature adjustment bars arranged at intervals, and the conduction state between each of the temperature adjustment bars and the power module is independently controlled.

[0014] Optionally, the light emitting device further includes:

[0015] a thermal expansion layer, the thermal expansion layer being located between the temperature adjustment layer and the light emitting panel and in contact with the light emitting panel;

[0016] The distance between the thermal expansion layer and the temperature adjustment layer in a non-expanded state is greater than 0 um and less than or equal to 100 um.

[0017] Optionally, the thermal expansion layer includes a plurality of thermal expansion structures arranged at intervals, and the thermal expansion structures are in strip or block shape;

[0018] Wherein, the thermal expansion coefficients of different thermal expansion structures are the same; or, the light-emitting panel includes a plurality of sub-areas, the thermal expansion coefficients of the thermal expansion structures located in two adjacent sub-areas are different, and the heat dissipation speed of the temperature adjustment layer is greater than the heat conduction speed of the thermal expansion structure;

[0019] When the thermal expansion layer includes a plurality of strip-shaped thermal expansion structures disposed at intervals, and the temperature adjustment layer includes a plurality of temperature adjustment strips disposed at intervals, the extension direction of the strip-shaped thermal expansion structures is intersecting with the extension direction of the temperature adjustment strips.

[0020] Optionally, the thermal expansion coefficient of the thermal expansion structure is greater than or equal to 20×10 -6 / K, and the thermal expansion structure has thermal conductivity;

[0021] Wherein, the material of the thermal expansion structure includes a metal material, and the metal material includes one or more of Al, Cr, Mg, and Mn.

[0022] Optionally, the thermal expansion structure comprises a thermal expansion portion and a heat conducting portion, and the thermal expansion portion is used to support the heat conducting portion;

[0023] Wherein, the thermal expansion portion is fixed on the light-emitting panel; the heat-conducting portion is arc-shaped, and the arc-shaped heat-conducting portion includes a first end close to the light-emitting panel and a second end close to the temperature adjustment layer;

[0024] During the process of the heat expansion part expanding toward the temperature adjustment layer, the angle between the first end and the second end of the heat conductive part and the light emitting panel gradually increases under the support of the heat expansion part, so that the two ends of the heat conductive part are in contact with the temperature adjustment layer and the light emitting panel respectively.

[0025] Optionally, the first end is a fixed end, fixed on the light-emitting panel, and located on one side of the thermal expansion portion;

[0026] The second end is a free end, and when the thermal expansion portion is in a non-expanded state, a distance between the second end and the temperature regulating layer is greater than zero; in the process in which the thermal expansion portion is heated and expands toward the temperature regulating layer, the second end moves toward the temperature regulating layer driven by the thermal expansion portion.

[0027] Optionally, the material of the thermal expansion portion includes one or more of polymethyl methacrylate, polyamide, polyethylene, polyvinyl chloride, and polystyrene;

[0028] The material of the heat conducting part includes one or more of graphene, graphite and metal.

[0029] Optionally, the light emitting panel includes:

[0030] substrate;

[0031] A light emitting device layer, located on one side of the substrate;

[0032] A protective layer, located on a side of the light-emitting device layer away from the substrate;

[0033] Wherein, the temperature regulating layer is located on a side of the protective layer away from the substrate.

[0034] The embodiment of the present invention provides a light-emitting device, including: a light-emitting panel, including a light-emitting side and a non-light-emitting side that are arranged opposite to each other; a temperature adjustment layer, located on the non-light-emitting side of the light-emitting panel; wherein the temperature adjustment layer has thermal conductivity, and the temperature adjustment layer is used to dissipate heat from the light-emitting panel; the temperature adjustment layer also has electrical conductivity, and the temperature adjustment layer is also used to heat the light-emitting panel when a voltage is connected. The technical solution provided by the embodiment of the present invention realizes the heat dissipation and temperature increase functions of the light-emitting panel only through a layer of temperature adjustment layer, improves the influence of temperature on the light-emitting device, and improves the service life and performance of the light-emitting device.

[0035] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 is a structural schematic diagram of a light emitting device provided by an embodiment of the present invention;

[0038] Figure 2 is a top view of a light emitting device provided by an embodiment of the present invention;

[0039] Figure 3 is a schematic structural diagram of another light emitting device provided by an embodiment of the present invention;

[0040] Figure 4 is a schematic structural diagram of another light emitting device provided by an embodiment of the present invention;

[0041] Figure 5 is a top view of another light emitting device provided by an embodiment of the present invention;

[0042] Figure 6 is a top view of another light emitting device provided by an embodiment of the present invention;

[0043] Figure 7 is a schematic structural diagram of another light emitting device provided by an embodiment of the present invention;

[0044] Figure 8 is a schematic structural diagram of another light emitting device provided by an embodiment of the present invention;

[0045] Fig. 9 is a schematic structural diagram of another light-emitting device provided by an embodiment of the present invention when the expansion portion is in a non-expanded state;

[0046] Fig.10 It is a structural schematic diagram of another light-emitting device provided by an embodiment of the present invention when the expansion part is in an expanded state. DETAILED DESCRIPTION

[0047] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0048] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0049] An embodiment of the present invention provides a light emitting device, Figure 1 is a schematic diagram of a light emitting device provided by an embodiment of the present invention, with reference to Figure 1 , the light emitting device comprises:

[0050] A light emitting panel 10;

[0051] The temperature adjustment layer 20 is located on one side of the light emitting panel 10;

[0052] The temperature adjustment layer 20 has thermal conductivity, and is used to dissipate heat from the light-emitting panel 10 ; the temperature adjustment layer 20 also has electrical conductivity, and is used to heat the light-emitting panel 10 when a voltage is connected.

[0053] Specifically, the light-emitting panel 10 includes a substrate and a light-emitting device layer located in the light-emitting area of ​​the substrate. The substrate may be a flexible substrate, and the material of the flexible substrate is an organic polymer such as PET, PEN, PI, or ultra-thin glass. The substrate may also be a rigid substrate, such as a glass substrate. The substrate may be transparent, translucent, or opaque. The substrate includes a light-emitting area and a non-light-emitting area, and a light-emitting device layer is provided in the light-emitting area of ​​the substrate, and the light-emitting device layer includes a plurality of light-emitting devices arranged at intervals. The non-light-emitting area may have a binding area, and the binding area includes an electrode lead with a certain width. One end of the electrode lead in the binding area is connected to the electrode layer in the light-emitting device, and the other end is connected to the flexible circuit board bound to the substrate, and the flexible circuit board can receive a voltage signal provided by an external power supply, thereby realizing the electrical connection between the light-emitting device layer and the external power supply. That is, the electrode lead can transmit the light-emitting drive signal input by the flexible circuit board to the light-emitting structure, so that the light-emitting device can be lit up to emit light for illumination or display.

[0054] The temperature adjustment layer 20 can be located on the non-light-emitting side of the light-emitting panel 10 to prevent the temperature adjustment layer 20 from blocking the normal light emission of the light-emitting panel 10. Optionally, the light emitted by the light-emitting device layer is emitted from the substrate, and the temperature adjustment layer 20 is arranged on the side of the light-emitting device layer away from the substrate. By arranging a temperature adjustment layer 20 with a higher thermal conductivity on one side of the light-emitting panel 10, the heat generated by the light-emitting panel 10 can be dissipated through the temperature adjustment layer 20 to prevent the temperature of the light-emitting panel 10 from being too high and affecting the service life and performance of the light-emitting panel 10; in a low temperature environment, the power supply module 3 is controlled to supply power to the temperature adjustment layer 20, so that the temperature adjustment layer 20 with a higher resistivity can convert electrical energy into thermal energy, heat up the light-emitting panel 10, reduce the influence of temperature on the operation of the screen, cope with temperature shock, and extend the service life of the screen.

[0055] The light-emitting device provided by the embodiment of the present invention comprises: a light-emitting panel 10; a temperature adjustment layer 20, which is located on one side of the light-emitting panel 10; wherein the temperature adjustment layer 20 has thermal conductivity, and is used to dissipate heat from the light-emitting panel 10; the temperature adjustment layer 20 also has electrical conductivity, and is also used to heat the light-emitting panel 10 when a voltage is connected. The technical solution provided by the embodiment of the present invention achieves the heat dissipation and temperature increase of the light-emitting panel 10 only through a layer of the temperature adjustment layer 20, improves the influence of temperature on the light-emitting device, and improves the service life and stability of the light-emitting device.

[0056] Based on the above embodiments, optionally, the resistivity of the temperature adjustment layer 20 is greater than or equal to 3×10 -8 Ω·m, so as to improve the heating effect of the temperature adjustment layer 20 on the light-emitting panel 10; the thermal conductivity of the temperature adjustment layer 20 is greater than or equal to 200W / m·k, so as to improve the heat dissipation effect of the temperature adjustment layer 20 on the light-emitting panel 10.

[0057] Exemplarily, the material of the temperature adjustment layer 20 may include one or more of molybdenum, zinc, graphene, and carbon nanotubes. Among them, for graphene materials, in terms of mechanics: the carbon-carbon bond of graphene is only 1.42A, and the connection between the carbon atoms inside it is relatively flexible. When an external force is applied to graphene, the carbon atom plane will bend and deform, so that the carbon atoms do not have to rearrange to adapt to the external force, thereby maintaining a stable structure. In terms of electricity: the resistivity of graphene is about 1×10 -6 Ω·cm; in optics: a single layer of graphene absorbs 2.3% of visible light, that is, the transmittance is 97.7%, so the temperature adjustment layer 20 can be set on the light-emitting side of the light-emitting panel 10. In thermal terms: its room temperature thermal conductivity is about 5300W / m·K, which is higher than carbon nanotubes and diamonds, and more than 10 times the thermal conductivity of copper at room temperature.

[0058] Based on the above embodiments, please continue to refer to Figure 1 Optionally, the light emitting device further comprises:

[0059] A temperature sensing unit 1, the temperature sensing unit 1 is used to detect the temperature of the light emitting panel 10;

[0060] Control unit 2 and power module 3; control unit 2 is electrically connected to temperature sensing unit 1 and power module 3; control unit 2 is used to control the voltage output by power module 3 to temperature regulating layer 20 according to the detected temperature of light emitting panel 10.

[0061] Specifically, the substrate includes a light-emitting area and a non-light-emitting area, the light-emitting device layer is located in the light-emitting area of ​​the substrate, and the temperature sensing unit can be arranged in the non-light-emitting area of ​​the substrate. The temperature sensing unit 1 includes a temperature sensor that can sense temperature and convert it into a usable output signal. The control unit 2 and the power module 3 can be arranged in the non-light-emitting area of ​​the substrate, and the control unit 2 is electrically connected to the temperature sensing unit 1 and the power module 3 respectively; the control unit 2 can determine whether the light-emitting device is in a low-temperature environment (the low-temperature environment refers to the temperature of the environment in which the light-emitting device is located is lower than the preset temperature value, and the preset temperature value can be set according to actual needs) and the specific temperature of the low-temperature environment according to the temperature signal of the light-emitting panel 10 detected by the temperature sensing unit 1, so as to control the power module 3 to output a suitable voltage to the temperature regulating layer 20 according to the temperature, so that the temperature regulating layer 20 converts electrical energy into thermal energy, heats up the light-emitting panel 10, reduces the influence of low temperature on the operation of the screen, copes with temperature shock, and extends the service life of the screen.

[0062] On the basis of the above embodiments, optionally, the temperature adjustment layer 20 may be a whole film layer structure; the temperature adjustment layer 20 may also be patterned to include a plurality of temperature adjustment strips arranged at intervals.

[0063] Preferably, Figure 2 is a top view of a light emitting device provided by an embodiment of the present invention, referring to Figure 2 The temperature adjustment layer 20 includes a plurality of temperature adjustment strips 21 arranged at intervals, and the conduction state between each temperature adjustment strip 21 and the power module 3 is independently controlled. The temperature adjustment layer 20 is configured as a plurality of long strip structures, and each temperature adjustment strip 21 corresponds to a different area of ​​the light-emitting panel 10, so that the temperature rise of different areas of the light-emitting panel 10 can be independently controlled.

[0064] Based on the above embodiments, Figure 3 is a schematic diagram of the structure of another light emitting device provided by an embodiment of the present invention, referring to Figure 3 Optionally, the light emitting device further comprises:

[0065] A thermal expansion layer 30 , wherein the thermal expansion layer 30 is located between the temperature adjustment layer 20 and the light emitting panel 10 and is in contact with the light emitting panel 10 ;

[0066] The distance between the thermal expansion layer 30 and the temperature adjustment layer 20 in the non-expanded state is greater than 0um and less than or equal to 100um, and can be 5um, 10um, 20um, 30um, 40um, 50um, 60um, 70um, 80um, 90um, or 100um.

[0067] Specifically, a thermal expansion layer 30 is disposed between the temperature adjustment layer 20 and the light emitting panel 10. By utilizing the thermal expansion property of the thermal expansion layer 30 material, when the local temperature rises, the thermal expansion layer 30 will be thermally expanded and then contact the temperature adjustment layer 20, transferring heat to the temperature adjustment layer 20, thereby reducing the temperature of the light emitting panel 10. The distance between the thermal expansion layer 30 and the temperature adjustment layer 20 in the non-expanded state can be set according to the expansion coefficient of the thermal expansion layer 30. The thermal expansion coefficient of the thermal expansion layer 30 is greater than or equal to 20×10 -6 / K, preferably a metal material, such as Al, Cr, Mg, Mn, etc., which not only has a high expansion coefficient but also a high thermal conductivity, and can quickly transfer the heat generated by the light-emitting panel 10 to the temperature adjustment layer 20 for dissipation.

[0068] The distance between the thermal expansion layer 30 and the temperature adjustment layer 20 in the non-expanded state is set to be greater than 0um. When the heat generated by the light-emitting panel 10 is not enough for the thermal expansion layer 30 to expand or the expansion degree is low, the thermal expansion layer 30 does not contact the temperature adjustment layer 20, thereby reducing the heat dissipation effect of the temperature adjustment layer 20, or even preventing the temperature adjustment layer 20 from dissipating heat. The distance between the thermal expansion layer 30 and the temperature adjustment layer 20 in the non-expanded state is set to be less than or equal to 100um, so that it can contact the temperature adjustment layer 20 after expansion. Preferably, the distance between the thermal expansion layer 30 and the temperature adjustment layer 20 in the non-expanded state is less than 30um, so as to further facilitate the thermal expansion layer 30 to contact the temperature adjustment layer 20 after expansion.

[0069] On the basis of the above embodiments, optionally, the thermal expansion layer 30 may be a whole film layer structure; or, the thermal expansion layer 30 may also be patterned to include a plurality of thermal expansion structures disposed at intervals.

[0070] Preferably, Figure 4 is a schematic diagram of the structure of another light emitting device provided by an embodiment of the present invention, referring to Figure 4 The thermal expansion layer 30 is patterned to include a plurality of thermal expansion structures 31 disposed at intervals. The thermal expansion layer 30 is arranged to include a plurality of thermal expansion structures 31 disposed at intervals, so that a heat dissipation space can be formed between the thermal expansion structures 31, and the fluidity of the gas can be used to dissipate heat for the light-emitting panel 10.

[0071] Among them, reference Figure 5 and Figure 6The thermal expansion structure 31 can be in the form of strips or blocks. The thermal expansion coefficient of the thermal expansion structure 31 is greater than or equal to 20×10 -6 / K, and the thermal expansion structure 31 has thermal conductivity; the material of the thermal expansion structure 31 includes a metal material, and the metal material includes one or more of Al, Cr, Mg, and Mn. Optionally, the vertical projection shape of the block-shaped thermal expansion structure 31 on the light-emitting panel can be circular, elliptical or polygonal, Figure 6 The example shows that the vertical projection shape of the block-shaped thermal expansion structure 31 on the light-emitting panel is a quadrilateral.

[0072] Optional, reference Figure 2 and Figure 5 When the thermal expansion layer 30 includes a plurality of strip-shaped thermal expansion structures 31 disposed at intervals, and the temperature adjustment layer 20 includes a plurality of temperature adjustment strips 21 disposed at intervals, the extension direction of the strip-shaped thermal expansion structures 31 is intersected with the extension direction of the temperature adjustment strips 21 .

[0073] Specifically, the thermal expansion layer 30 includes a plurality of thermal expansion structures 31 extending along the first direction X and arranged at intervals along the second direction Y. The temperature adjustment layer 20 includes a plurality of temperature adjustment strips 21 extending along the second direction Y and arranged at intervals along the first direction X. The first direction X and the second direction Y are arranged to intersect, for example, to be perpendicular.

[0074] Since the middle area of ​​the light emitting panel 10 is more difficult to dissipate heat than the edge area of ​​the light emitting panel 10, the embodiment of the present invention sets the extension direction of the strip-shaped heat expansion structure 31 to be cross-arranged with the extension direction of the temperature adjustment strip 21, so that the vertical projection of each strip-shaped heat expansion structure 31 on the light emitting panel 10 can overlap with the vertical projections of multiple temperature adjustment strips 21 on the light emitting panel 10. With respect to the extension direction of the strip-shaped heat expansion structure 31 being the same as the extension direction of the temperature adjustment strip 21, the technical solution provided by the embodiment of the present invention can make each temperature adjustment strip 21 contact with multiple strip-shaped heat expansion structures 31, and each strip-shaped heat expansion structure 31 contact with multiple temperature adjustment strips 21, that is, each temperature adjustment strip 21 located in the middle area of ​​the light emitting panel 10 can contact with multiple strip-shaped heat expansion structures 31, and each strip-shaped heat expansion structure 31 located in the middle area of ​​the light emitting panel 10 can contact with multiple temperature adjustment strips 21, thereby facilitating the heat dissipation of the middle area of ​​the light emitting panel 10 and preventing the temperature of the middle area of ​​the light emitting panel 10 from being too high to affect the service life and performance of the light emitting device.

[0075] On the basis of the above embodiments, optionally, different thermal expansion structures 31 have the same thermal expansion coefficient, thereby simplifying the difficulty of preparing the thermal expansion structure 31 .

[0076] or, Figure 7is a schematic diagram of the structure of another light emitting device provided by an embodiment of the present invention, referring to Figure 7 The light-emitting panel 10 includes a plurality of sub-areas, and the thermal expansion coefficients of the thermal expansion structures 31 located in two adjacent sub-areas are different, so that the expansion conditions of the thermal expansion structures 31 in the two adjacent sub-areas at the same temperature are different; and the heat dissipation speed of the temperature adjustment layer 20 is set to be greater than the heat conduction speed of the thermal expansion structure 31, so as to realize the reciprocating movement of the thermal expansion structure 31 between the light-emitting panel 10 and the temperature adjustment layer 20, so as to facilitate the generation of airflow in the heat dissipation space, thereby improving the heat dissipation effect of the light-emitting panel 10.

[0077] Furthermore, Figure 8 is a schematic diagram of the structure of another light emitting device provided by an embodiment of the present invention, referring to Figure 8 The end of the thermal expansion structure 31 close to the temperature adjustment layer 20 can be designed into an umbrella shape or a cap shape to facilitate the generation of airflow, thereby further accelerating the flow of airflow and improving the heat dissipation effect of the light-emitting panel 10.

[0078] Based on the above embodiments, Fig. 9 is a schematic structural diagram of another light emitting device provided by an embodiment of the present invention when the expansion portion is in a non-expanded state, Fig.10 is a schematic structural diagram of another light emitting device provided by an embodiment of the present invention when the expansion portion is in an expanded state, with reference to Fig. 9 and Fig.10 Optionally, the thermal expansion structure 31 includes a thermal expansion portion 311 and a heat conducting portion 312 , and the thermal expansion portion 311 is used to support the heat conducting portion 312 .

[0079] The heat expansion part 311 is fixed on the light emitting panel 10; the heat conduction part 312 is arc-shaped, and the arc-shaped heat conduction part 312 includes a first end close to the light emitting panel 10 and a second end close to the temperature adjustment layer 20. In the process of the heat expansion part 311 expanding toward the temperature adjustment layer 20, the heat conduction part 312 is supported by the heat expansion part 311, and the angle between the first end and the second end of the heat conduction part 312 and the light emitting panel 10 gradually increases, so that the two ends of the heat conduction part 312 are in contact with the temperature adjustment layer 20 and the light emitting panel 10 respectively.

[0080] Specifically, the thermal expansion structure 31 is configured to include a thermal expansion portion 311 and a heat conducting portion 312, so that the heat conducting function and the heat expansion function of the thermal expansion structure 31 can be separately configured, thereby preventing the heat conducting function and the heat expansion function from being integrated into one, thereby limiting the type of materials used to prepare the thermal expansion structure 31, as well as limiting the heat conducting capacity and the heat expansion capacity of the thermal expansion structure 31. The material of the thermal expansion portion 311 is a material with a high thermal expansion coefficient, without considering the thermal conductivity of the material; the material of the heat conducting portion 312 is a material with a high thermal conductivity, without considering the expansion coefficient of the material. The material of the thermal expansion portion 311 may include one or more of polymethyl methacrylate, polyamide, polyethylene, polyvinyl chloride and polystyrene; the material of the heat conducting portion 312 may include one or more of graphene, graphite and metal.

[0081] The heat expansion part 311 is fixed on the light emitting panel 10 to prevent the heat expansion part 311 from falling off. The heat conduction part 312 is arc-shaped, and the arc-shaped heat conduction part 312 includes a first end close to the light emitting panel 10 and a second end close to the temperature adjustment layer 20. The heat expansion part 311 is used to support the heat conduction part 312. When the heat expansion part 311 is in a non-expanded state (refer to Fig. 9 ), the distance between the second end of the heat-conducting portion 312 and the temperature-adjusting layer 20 is greater than 0, and the heat-conducting portion 312 can be placed horizontally or tilted on the heat-expanding portion 311. During the expansion of the heat-expanding portion 311 toward the temperature-adjusting layer 20 (refer to Fig.10 ), under the support of the thermal expansion part 311, the angle between the line connecting the first end and the second end of the heat conducting part 312 and the light emitting panel 10 gradually increases, so that the arc-shaped heat conducting part 312 gradually stands up (the direction from the first end of the heat conducting part 312 to the second end gradually approaches the direction perpendicular to the light emitting panel 10), so that the two ends of the heat conducting part 312 are respectively in contact with the temperature regulating layer 20 and the light emitting panel 10, thereby realizing heat conduction of the heat conducting part 312.

[0082] On the basis of the above embodiments, optionally, the first end of the heat conducting portion 312 is a fixed end, fixed on the light-emitting panel 10, and located on one side of the thermal expansion portion 311; the second end of the heat conducting portion 312 is a free end, and when the thermal expansion portion 311 is in a non-expanded state, the distance from the second end to the temperature regulating layer 20 is greater than zero; in the process of the thermal expansion portion 311 expanding toward the temperature regulating layer 20 due to heat, the second end moves toward the temperature regulating layer 20 driven by the thermal expansion portion 311.

[0083] The first end of the heat conducting part 312 is set as a fixed end, fixed to one side of the thermal expansion part 311, so that the heat conducting part 312 is not easy to fall off from the surface of the light-emitting panel during the thermal expansion of the thermal expansion part 311, and always maintains contact with the light-emitting panel 10. The middle area of ​​the heat conducting part 312 is in contact with one side of the top of the thermal expansion part 311, so as to achieve support for the heat conducting part 312; the second end of the heat conducting part 312 is a free end. In the process of the thermal expansion part 311 expanding toward the temperature adjustment layer 20 due to heat, the second end moves toward the temperature adjustment layer 20 driven by the thermal expansion part 311 and contacts with the temperature adjustment layer 20, so as to achieve the transfer of heat generated by the light-emitting panel 10 to the temperature adjustment layer 20 for heat dissipation.

[0084] Furthermore, the heat dissipation rate of the temperature regulating layer 20 can be set to be relatively large and greater than the heat conduction rate of the thermal expansion structure 31, for example, greater than 200 W / m·k, so as to enable the thermal expansion portion 311 to move back and forth between the light-emitting panel 10 and the temperature regulating layer 20, thereby facilitating the generation of airflow in the heat dissipation space and improving the heat dissipation effect.

[0085] Furthermore, the heat conducting portion 312 is designed to be in an umbrella shape or a cap shape, etc., which is convenient for generating airflow, thereby further accelerating the flow of airflow and improving the heat dissipation effect on the light emitting panel 10 .

[0086] Based on the above embodiments, Figure 3 , Figure 4 as well as Figure 7 to Figure 10 The light emitting panel 10 includes: a substrate 11; a light emitting device layer located on one side of the substrate 11; a protective layer 15 located on a side of the light emitting device layer away from the substrate 11; wherein the temperature regulating layer 20 is located on a side of the protective layer 15 away from the substrate 11.

[0087] Specifically, the light-emitting device layer includes a first electrode layer 12, a second electrode layer 14, and a light-emitting layer 13 located between the first electrode layer 12 and the second electrode layer 14. The first electrode layer 12 is located on one side of the substrate 11, and the first electrode layer 12 includes a plurality of first electrodes, each of which is electrically connected to a first electrode lead. The light-emitting layer 13 is located on the side of the first electrode layer 12 away from the substrate 11; the second electrode layer 14 is located on the side of the light-emitting layer 13 away from the substrate 11. Each first electrode and the light-emitting layer 13 and the second electrode layer 14 above each first electrode constitute a light-emitting device.

[0088] The first electrode (as the anode of the light-emitting device) can be formed as a transparent electrode or a reflective electrode according to its purpose. In an embodiment of the present invention, the first electrode is formed as a transparent electrode, and the first electrode may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium oxide (In2O3), etc. The light-emitting layer 13 can be formed of a low molecular weight organic material or a high molecular weight organic material. The second electrode layer 14 (as the cathode of the light-emitting device) is located on the light-emitting layer 13. The second electrode layer 14 can be formed as a transparent electrode or a reflective electrode according to its purpose. In an embodiment of the present invention, the second electrode layer 14 is a reflective electrode layer, and the second electrode layer 14 can be formed of Ag, magnesium (Mg), Al, Pt, Pd, Au, Ni, Nd, iridium (Ir), Cr or a mixture thereof.

[0089] The protective layer 15 is located between the second electrode layer 14 and the thermal expansion layer 30, and is used to protect the second electrode layer 14 to prevent the second electrode layer 14 from being damaged by the thermal expansion layer 30. The protective layer 15 can be an inorganic layer, or an organic layer, or a laminated structure of an inorganic layer and an organic layer. The protective layer 15 is also used to play the role of thin film encapsulation to ensure that the organic light-emitting material and the electrode are not corroded by water vapor and oxygen in the external environment, further improving the service life and reliability of the light-emitting device.

[0090] On the basis of the above embodiments, optionally, the light-emitting device also includes a packaging cover plate, which is located on the side of the protective layer 15 away from the substrate 11, the edge of the packaging cover plate contacts the edge of the substrate 11 in the light-emitting panel 10, and the distance between the area outside the edge of the packaging cover plate and the light-emitting panel 10 is greater than zero; the temperature regulating layer 20 can be formed on the surface of the packaging cover plate on the side close to the protective layer 15, and the packaging cover plate plays a supporting role for the temperature regulating layer 20, so that there is a accommodating space between the temperature regulating layer 20 and the light-emitting panel 10 to set the thermal expansion layer 30.

[0091] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A light emitting device, characterized in that: include: Illuminated panels; A temperature regulating layer, located on one side of the light emitting panel; The temperature adjustment layer has thermal conductivity, and is used to dissipate heat from the light-emitting panel; the temperature adjustment layer also has electrical conductivity, and is used to heat the light-emitting panel when a voltage is connected.

2. The light emitting device according to claim 1, characterized in that: The resistivity of the temperature adjustment layer is greater than or equal to 3×10 -8 Ω·m, and / or the thermal conductivity of the temperature regulating layer is greater than or equal to 200 W / m·k.

3. The light emitting device according to claim 1, characterized in that: The light emitting device further comprises: A temperature sensing unit, the temperature sensing unit is used to detect the temperature of the light emitting panel; A control unit and a power module; the control unit is electrically connected to the temperature sensing unit and the power module respectively; the power module is electrically connected to the temperature regulating layer; the control unit is used to control the voltage output by the power module to the temperature regulating layer according to the detected temperature of the light-emitting panel; The temperature adjustment layer includes a plurality of temperature adjustment bars arranged at intervals, and the conduction state between each of the temperature adjustment bars and the power module is independently controlled.

4. The light emitting device according to claim 1 or 3, characterized in that: Also includes: a thermal expansion layer, the thermal expansion layer being located between the temperature adjustment layer and the light emitting panel and in contact with the light emitting panel; The distance between the thermal expansion layer and the temperature adjustment layer in a non-expanded state is greater than 0 um and less than or equal to 100 um.

5. The light emitting device according to claim 4, characterized in that: The thermal expansion layer comprises a plurality of thermal expansion structures arranged at intervals, and the thermal expansion structures are in strip or block shape; Wherein, the thermal expansion coefficients of different thermal expansion structures are the same; or, the light-emitting panel includes a plurality of sub-areas, the thermal expansion coefficients of the thermal expansion structures located in two adjacent sub-areas are different, and the heat dissipation speed of the temperature adjustment layer is greater than the heat conduction speed of the thermal expansion structure; When the thermal expansion layer includes a plurality of strip-shaped thermal expansion structures disposed at intervals, and the temperature adjustment layer includes a plurality of temperature adjustment strips disposed at intervals, the extension direction of the strip-shaped thermal expansion structures is intersecting with the extension direction of the temperature adjustment strips.

6. The light emitting device according to claim 5, characterized in that: The thermal expansion coefficient of the thermal expansion structure is greater than or equal to 20×10 -6 / K, and the thermal expansion structure has thermal conductivity; Wherein, the material of the thermal expansion structure includes a metal material, and the metal material includes one or more of Al, Cr, Mg, and Mn.

7. The light emitting device according to claim 5, characterized in that: The thermal expansion structure comprises a thermal expansion portion and a heat conducting portion, wherein the thermal expansion portion is used to support the heat conducting portion; Wherein, the thermal expansion portion is fixed on the light-emitting panel; the heat-conducting portion is arc-shaped, and the arc-shaped heat-conducting portion includes a first end close to the light-emitting panel and a second end close to the temperature adjustment layer; During the process of the heat expansion part expanding toward the temperature adjustment layer, the angle between the first end and the second end of the heat conductive part and the light emitting panel gradually increases under the support of the heat expansion part, so that the two ends of the heat conductive part are in contact with the temperature adjustment layer and the light emitting panel respectively.

8. The light emitting device according to claim 7, characterized in that: The first end is a fixed end, fixed on the light-emitting panel and located at one side of the thermal expansion portion; The second end is a free end, and when the thermal expansion portion is in a non-expanded state, a distance between the second end and the temperature regulating layer is greater than zero; in the process in which the thermal expansion portion is heated and expands toward the temperature regulating layer, the second end moves toward the temperature regulating layer driven by the thermal expansion portion.

9. The light emitting device according to claim 7, characterized in that: The material of the thermal expansion part includes one or more of polymethyl methacrylate, polyamide, polyethylene, polyvinyl chloride, and polystyrene; The material of the heat conducting part includes one or more of graphene, graphite and metal.

10. The light emitting device according to claim 1, characterized in that: The light emitting panel comprises: substrate; A light emitting device layer, located on one side of the substrate; A protective layer, located on a side of the light-emitting device layer away from the substrate; Wherein, the temperature regulating layer is located on a side of the protective layer away from the substrate.

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