Production process and application of ENF-grade adhesive

Abstract

The invention belongs to the technical field of adhesives, and relates to a production process of an ENF-grade adhesive, which comprises the following steps: adding diethylenetriamine into a reaction kettle, heating to 110-130 DEG C, adding oxalic acid, uniformly stirring, adding maleic acid, continuously stirring, heating to 160-190 DEG C, keeping the temperature for 2.5-5 hours, stopping heating, cooling to 100 DEG C or below, and adding water to dilute until the solid content is 50% to obtain a 50% intermediate; adding a modifier into the intermediate, stirring, adding water to dilute to 20-35%, adding epoxy chloropropane, heating to 60-90 DEG C, stirring, keeping the temperature and reacting until the coating 4 cup viscosity is 14-20 seconds, adjusting the pH to 4-5 after the reaction is completed, cooling to 40 DEG C or below, and discharging glue. The prepared adhesive has good bonding strength, synthetic raw materials do not contain formaldehyde, the adhesive is applied to manufacturing of ENF-grade artificial boards, and manufactured boards have good strength and water resistance and extremely low formaldehyde emission.

Description

Technical Field

[0001] The present invention belongs to the technical field of adhesives, and relates to an adhesive, and in particular to an E NF Production process and application of grade adhesive. Background Art

[0002] Nowadays, the concept of healthy and green life is becoming more and more popular, and consumers are more and more strict about the environmental protection level of decoration materials. NF Grade boards have gradually become the first choice for consumers in decoration. If the existing boards are produced by the method of urea-formaldehyde resin and MDI combined sizing, it is very difficult to ensure that the formaldehyde emission of the finished boards can stably reach E NF The use of formaldehyde-free adhesives such as soybean glue and lignin glue will affect the performance of the board and may increase other problems such as mold and poor weather resistance.

[0003] Therefore, a new type of E NF Grade adhesive for use in E NF The production of high-grade fiberboard has important practical significance. Summary of the invention

[0004] The purpose of the present invention is to provide a NF The production process of grade adhesive is applied to the production of fiberboard to solve the current production of E NF The dilemma faced by grade fiberboard.

[0005] Technical Solution

[0006] A kind of E NF The production process of grade adhesive includes the following steps:

[0007] (1) Add diethylenetriamine to a reaction kettle, heat to 110-130°C, add oxalic acid, stir evenly, add maleic acid, continue stirring and heat to 160-190°C, keep warm for 2.5-5h, stop heating, cool to below 100°C, and dilute with water to a solid content of 50% to obtain a 50% intermediate; wherein the mass ratio of diethylenetriamine: oxalic acid: maleic acid is 90-110: 40-55: 45-75, preferably 100: 47: 56;

[0008] (2) adding a modifier to the intermediate, stirring and diluting with water to 20-35%, adding epichlorohydrin, heating to 60-90°C, stirring and keeping warm to react until the viscosity of 4 cups is 14-20s, adjusting the pH to 4-5 after the reaction is completed, cooling to below 40°C, and producing a glue; wherein the mass ratio of intermediate: modifier: epichlorohydrin is 90-110:5-20:10-30, preferably 100:15:20, and the modifier is one or more of PVA, CMC, and EVA.

[0009] In a preferred embodiment of the present invention, the concentration of the intermediate in step (2) is diluted to 25%.

[0010] In a preferred disclosed embodiment of the present invention, the modifier in step (2) is PVA.

[0011] In a preferred embodiment of the present invention, the viscosity at the end of the reaction in step (2) is 17-18s.

[0012] In the preparation steps of the present invention, the viscosity measured is measured at 25°C.

[0013] In the preparation steps of the present invention, all materials are expressed in parts by mass.

[0014] The second object of the present invention is to prepare the E NF Grade adhesive used in the production of man-made fiberboard.

[0015] Beneficial Effects

[0016] The adhesive prepared by the present invention has good bonding strength, and the synthetic raw materials do not contain formaldehyde, and can be used for E NF The production of grade artificial boards produces boards with good strength, water resistance and extremely low formaldehyde emission. DETAILED DESCRIPTION

[0017] The present invention is described in detail below in conjunction with the embodiments so that those skilled in the art can better understand the present invention, but the present invention is not limited to the following embodiments.

[0018] Example 1

[0019] A kind of E NF The preparation of the first-grade adhesive comprises the following steps:

[0020] (1) Add 100 parts of diethylenetriamine to a reaction kettle, heat to 120°C, add 47 parts of oxalic acid, stir evenly, add 56 parts of maleic acid, continue stirring and heat to 180°C, keep warm for 2.5-5 hours, stop heating, cool to below 100°C, add water to dilute to a solid content of 50%, and obtain 50% of an intermediate;

[0021] (2) Add 15 parts of PVA (8% aqueous solution) to every 100 parts of the intermediate, dilute to 25% with water after stirring, add 20 parts of epichlorohydrin, heat to 80°C, stir and keep warm to react until the viscosity of 4 cups is 17-18s. After the reaction is completed, adjust the pH to 4-5, cool to below 40°C, and produce the glue.

[0022] Example 2

[0023] A kind of E NF The preparation of the first-grade adhesive comprises the following steps:

[0024] (1) Add 100 parts of diethylenetriamine to a reaction kettle, heat to 120° C., add 50 parts of oxalic acid, stir evenly, add 44 parts of maleic acid, continue stirring and heat to 180° C., keep warm for 2.5-5 hours, stop heating, cool to below 100° C., add water to dilute to a solid content of 50%, and obtain 50% of an intermediate;

[0025] (2) Add 8 parts of PVA (8% aqueous solution) and 6 parts of CMC (8% aqueous solution) to every 100 parts of the intermediate, dilute with water to 25% with stirring, add 18 parts of epichlorohydrin, heat to 75°C, stir and keep warm to react until the viscosity of 4 cups is 17-18s. After the reaction is completed, adjust the pH to 4-5, cool to below 40°C, and produce the glue.

[0026] The adhesive prepared in the above embodiment was used to test-produce a fiberboard sample, and the main properties measured are shown in Table 1 below.

[0027] Table 1 List of physical and chemical properties of the prepared board

[0028]

[0029] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the specification of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A kind of E NF The method for preparing a grade adhesive is characterized in that: The following steps are involved: (1) Add diethylenetriamine to a reaction kettle, heat to 110-130°C, add oxalic acid, stir evenly, add maleic acid, continue stirring and heat to 160-190°C, keep warm for 2.5-5h, stop heating, cool to below 100°C, add water to dilute to a solid content of 50%, and obtain a 50% intermediate; wherein the mass ratio of diethylenetriamine: oxalic acid: maleic acid is 90-110: 40-55: 45-75; (2) Add modifier to the intermediate, stir and dilute with water to 20-35%, add epichlorohydrin, heat to 60-90℃, stir and keep warm to react until the viscosity of 4 cups is 14-20s@25℃, adjust pH to 4-5 after the reaction is completed, cool to below 40℃, and produce glue; in, The mass ratio of intermediate: modifier: epichlorohydrin is 90-110:5-20:10-30, and the modifier is one or more of PVA, CMC and EVA.

2. E according to claim 1 NF The preparation method of the grade adhesive is characterized by: In step (1), the mass ratio of diethylenetriamine: oxalic acid: maleic acid is 100:47:

56.

3. E according to claim 1 NF The preparation method of the grade adhesive is characterized by: In step (2), the intermediate concentration is diluted to 25%.

4. E according to claim 1 NF The preparation method of the grade adhesive is characterized by: In step (2), the mass ratio of the intermediate:modifier:epichlorohydrin is 100:15:

20.

5. E according to claim 1 NF The preparation method of the grade adhesive is characterized by: In step (2), the modifier is PVA.

6. E according to claim 1 NF The preparation method of the grade adhesive is characterized by: In step (2), the viscosity at the end of the reaction is 17-18s.

7. E prepared by the method according to any one of claims 1 to 6 NF The application of grade adhesive is characterized by: It is applied to the production of wood-based panels.

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