Automobile diode panel packaging detection method

Abstract

The invention belongs to the technical field of diode panel packaging, and particularly discloses an automobile diode panel packaging detection method, which comprises the following steps of: analyzing a welding spot qualification index, an appearance qualification index and an internal qualification index of a target diode panel by detecting welding spot information, appearance information and an internal bubble image of the target diode panel; confirming the qualification index of the target diode panel, further confirming the unqualified guide factor item of the target diode panel, and performing corresponding feedback; according to the invention, the packaging detection analysis of the target diode is carried out according to the three dimensions of the welding spot, the appearance and the interior after the packaging of the target diode panel, the analysis comprehensiveness of the packaging detection analysis of the target diode is ensured, and the internal qualification index of the target diode panel is analyzed according to the three aspects of the number, the area and the position of the bubbles, so that the detection accuracy is improved. And the influence of the bubbles on the packaging of the target diode panel is comprehensively evaluated.

Description

Technical Field

[0001] The invention belongs to the technical field of diode panel packaging, and relates to a method for detecting automobile diode panel packaging. Background Art

[0002] Automotive diode panel packaging generally refers to the packaging form of diode components used in automotive electronic systems. This packaging is designed to protect the diode from physical damage and environmental factors, and to ensure that it works stably in the complex environment inside the car. Therefore, automotive diode panel packaging needs to be tested.

[0003] The current inspection of automotive diode packaging is mainly to inspect the integrity of its packaging, and there are still the following deficiencies: 1. When conducting packaging inspection of automotive diodes, the main focus is on the inspection of the packaging area, and no further inspection and analysis of the solder joints after packaging is performed. The potential defects of the solder joints cannot be discovered in time, and the comprehensiveness of the automotive diode packaging inspection and analysis cannot be guaranteed, which leads to potential quality and safety risks and increases the subsequent maintenance costs.

[0004] 2. Currently, the impact of bubbles on automotive diode panels is only analyzed based on the number and area of ​​bubbles. The location of the bubbles is not combined to further analyze the impact of bubbles on the automotive diode panel. It is impossible to fully evaluate the impact of bubbles on the packaging of automotive diode panels, and it is difficult to determine potential failure risk points, resulting in insufficient accuracy in the assessment of automotive diode packaging quality. Summary of the invention

[0005] In view of this, in order to solve the problems raised in the above background technology, a method for detecting the packaging of an automobile diode panel is now proposed.

[0006] The purpose of the present invention can be achieved through the following technical solutions: The present invention provides a method for packaging and detecting automobile diode panels, including: step one, inputting diode panel information: recording the automobile diode panel to be packaged and detected as a target diode panel, and inputting the standard information of the target diode panel.

[0007] Step 2: Detection of solder joints of diode panel: Detection of solder joint information of target diode panel, including shape profile, size, surface flatness and gap length of corresponding welding parts of each solder joint.

[0008] Step 3: Diode panel solder joint analysis: Analyze the solder joint qualification index of the target diode panel based on the solder joint information of the target diode panel.

[0009] Step 4: Detect the appearance of the diode panel: Detect the appearance information of the target diode panel, which includes the number of scratches, the length of each scratch, the number of colors, and the chromaticity value corresponding to each color.

[0010] Step 5: Diode panel appearance analysis: Analyze the apparent qualification index of the target diode panel based on the appearance information of the target diode panel.

[0011] Step 6: Internal detection of diode panel: Detect the internal bubble image of the target diode panel.

[0012] Step 7: Internal analysis of the diode panel: Analyze the internal qualified index of the target diode panel based on the internal bubble image of the target diode panel.

[0013] Step 8. Diode panel confirmation feedback: According to the solder joint qualification index, apparent qualification index and internal qualification index of the target diode panel, confirm the qualification index of the target diode panel, and then confirm the unqualified cause items of the target diode panel, and provide corresponding feedback.

[0014] Preferably, the analyzing the solder joint qualification index of the target diode panel includes: A1, extracting the standard shape contour of the solder joint from the standard information of the target diode panel.

[0015] A2. Overlap and compare the shape contours of each solder joint in the target diode panel with the standard shape contour to obtain the overlapped shape contours of each solder joint.

[0016] A3. The ratio of the overlapped shape contour of each solder joint to the shape contour is used as the shape contour qualification index of each solder joint in the target diode panel, recorded as , Number the solder joints. .

[0017] A4. According to the size of each solder joint in the target diode panel, the size qualification index of each solder joint in the target diode panel is calculated. .

[0018] A5. Record the surface flatness of each solder joint in the target diode panel as , the appropriate surface flatness of the solder joint is extracted from the standard information of the target diode panel and recorded as .

[0019] A6. Count the surface flatness pass index of each solder joint in the target diode panel , .

[0020] A7. According to the gap length of each solder joint corresponding to the welding part in the target diode panel, the gap qualification index of each solder joint in the target diode panel is calculated. .

[0021] A8. Count the solder joint qualification index of the target diode panel , , , , and They are the weight of the set shape profile qualified index, the weight of the set size qualified index, the weight of the set surface flatness qualified index and the weight of the set gap qualified index, , .

[0022] Preferably, the statistical size qualification index of each solder joint in the target diode panel comprises: extracting the diameter and height of each solder joint from the size of each solder joint in the target diode panel, and recording them as and .

[0023] The standard diameter and standard height of the solder joint are extracted from the standard information of the target diode panel and recorded as and .

[0024] Statistical size qualification index of each solder joint in the target diode panel , , and Set the reference diameter difference and height difference respectively.

[0025] Preferably, the statistical calculation of the gap qualification index of each welding point in the target diode panel includes: comparing the gap length of the welding component corresponding to each welding point in the target diode panel with a set reference gap length.

[0026] If the gap length of the welding component corresponding to a certain welding point in the target diode panel is greater than the set reference gap length, 0 is used as the gap qualification index of the welding point in the target diode panel.

[0027] If the gap length of the welding component corresponding to a certain welding point in the target diode panel is less than or equal to the set reference gap length, 1 is used as the gap qualification index of the welding point in the target diode panel, and then the gap qualification index of each welding point in the target diode panel is obtained, which is recorded as , The value is 0 or 1.

[0028] Preferably, the analysis of the apparent qualified index of the target diode panel includes: selecting the maximum scratch length from the lengths of the scratches in the target diode panel, and recording it as , the length of each scratch is averaged to obtain the average scratch length, which is recorded as .

[0029] The number of scratches on the target diode panel is recorded as .

[0030] Statistical scratch difference index in target diode panel , , and Set the allowable scratch length and allowable number of scratches for reference respectively.

[0031] The number of colors on the target diode panel and the chromaticity value corresponding to each color are recorded as and , is the chromaticity value number corresponding to the color, , is the number of chromaticity values ​​corresponding to the color.

[0032] Statistical color difference index in target diode panel , , , and Set the allowed number of colors, chromaticity values, and chromaticity value differences respectively.

[0033] Statistical evaluation of the apparent qualified index of the target diode panel , , and are the scratch difference index and color difference index for setting references, is a natural constant.

[0034] Preferably, the analysis of the internal qualified index of the target diode panel includes: B1, extracting the number of bubbles and the area of ​​each bubble from the internal bubble image of the target diode panel, and then calculating the bubble influence index of the target diode panel .

[0035] B2. Extract the position of each bubble from the internal bubble image of the target diode panel, and then set the bubble influence factor of the target diode panel .

[0036] B3. Count the internal qualified index of the target diode panel , , To set the bubble influence index for reference.

[0037] Preferably, the counting of the bubble influence index of the target diode panel includes: extracting the maximum bubble area from the area of ​​each bubble in the target diode panel, recorded as .

[0038] The areas of the bubbles in the target diode panel are summed up, and the sum is taken as the total bubble area of ​​the target diode panel, which is recorded as .

[0039] The package area of ​​the target diode panel is extracted from the standard information of the target diode panel and recorded as .

[0040] The number of bubbles on the target diode panel is recorded as , and then calculate the bubble impact index of the target diode panel , , , and They are the set permitted area of ​​a single bubble, permitted bubble area ratio and permitted number of bubbles respectively.

[0041] Preferably, the setting of the bubble influence factor of the target diode panel includes: extracting the chip area and edge area of ​​the target diode panel from standard information of the target diode panel.

[0042] The center point of each bubble is extracted from the position of each bubble in the target diode panel, and then the straight-line distance between the center point of each bubble and the chip area and edge area is located from the bubble image, and recorded as and , Number the bubbles. , is the number of bubbles.

[0043] Statistical analysis of the position influence of each bubble in the target diode panel , , and The straight-line distances between the bubble and the chip area and the straight-line distances between the bubble and the edge area are set as references. and are the weights of the chip area distance impact index and the edge area distance impact index, respectively. , .

[0044] The position influence of each bubble in the target diode panel is compared with the position influence of the set reference. If the position influence of a bubble in the target diode panel is greater than the position influence of the set reference, the bubble is recorded as an abnormal position bubble, and the number of abnormal position bubbles is counted.

[0045] The ratio of the number of bubbles in the abnormal position to the number of bubbles is taken as the bubble impact factor of the target diode panel and recorded as .

[0046] Preferably, the step of confirming the qualified index of the target diode panel comprises: extracting the qualified index of the solder joints of the target diode panel , the apparent qualification index of the target diode panel and the internal qualification index of the target diode panel .

[0047] Count the qualified index of the target diode panel , , , and are the weights of the set solder joint qualification index, apparent qualification index and internal qualification index, respectively. , .

[0048] Preferably, the confirming of the unqualified cause item of the target diode panel includes: comparing the qualified index of the target diode panel with a set reference qualified index.

[0049] When the qualified index of the target secondary surface pipe is less than the qualified index of the set reference, if , then the unqualified solder joints of the target diode panel are taken as the unqualified cause of the target diode panel. To set the reference solder joint qualification index.

[0050] like , then the apparent unqualified of the target diode panel is taken as the unqualified cause item of the target diode panel, To set the apparent qualification index for reference.

[0051] like , then the internal non-conformity of the target diode panel is taken as the non-conformity cause item of the target diode panel, To set the internal qualification index for reference.

[0052] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The present invention performs packaging detection and analysis of the target diode based on the three dimensions of solder joints, appearance and interior after packaging of the target diode panel, breaking the current deficiency of no further detection and analysis of the solder joints after packaging, improving the timeliness of discovering potential defects in solder joints, and further ensuring the comprehensiveness of the target diode packaging detection and analysis, thereby reducing potential quality and safety risks and reducing subsequent maintenance costs.

[0053] (2) The present invention analyzes the internal qualified index of the target diode panel according to the number, area and position of the bubbles, thereby avoiding the deficiency of further analyzing the influence of bubbles on the target diode panel without combining the position of the bubbles. The influence of bubbles on the packaging of the target diode panel is evaluated more comprehensively, thereby improving the accuracy of determining the potential fault risk points, thereby improving the accuracy of evaluating the packaging quality of the target diode.

[0054] (3) When analyzing the internal qualified index of the target diode panel, the present invention improves the accuracy of the analysis of the impact of bubbles on the performance of the target diode panel by setting the bubble impact factor of the target diode panel, thereby improving the detection targeting of the target diode panel packaging detection.

[0055] (4) When conducting target diode panel packaging inspection and analysis, the present invention promptly discovers potential problems by confirming the unqualified cause items of the target diode panel, thereby improving the pertinence of tracing the quality problems of automobile diode panel packaging, thereby improving product quality, reducing production costs, and enhancing production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0057] Figure 1 It is a schematic diagram of the connection of each step of the method of the present invention.

[0058] Figure 2 It is a connection diagram of the solder joint qualification index analysis steps of the target diode panel of the present invention.

[0059] Figure 3 It is a connection diagram of the internal qualification index analysis steps of the target diode panel of the present invention. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0061] See also Figure 1As shown, the present invention provides a method for packaging and detecting automobile diode panels, the method comprising: step one, inputting information of the diode panel: recording the automobile diode panel to be packaged and detected as a target diode panel, and inputting standard information of the target diode panel.

[0062] It should be added that the standard information of the target diode panel includes: standard shape contour of the solder joint, suitable surface flatness, standard diameter, standard height, and the package area, chip area and edge area of ​​the target diode panel.

[0063] Step 2: Detection of solder joints of diode panel: Detection of solder joint information of target diode panel, including shape profile, size, surface flatness and gap length of corresponding welding parts of each solder joint.

[0064] It should be added that the shape contours of each solder joint in the target diode panel are obtained by photographing the solder joints with a high-resolution camera and analyzing the images using image processing software, for example, by identifying the edges of the solder joints using an edge detection algorithm.

[0065] It should be added that the size of each solder joint in the target diode panel can be obtained by performing edge detection and contour extraction on the image of the solder joint using an image measuring instrument, and then calculating the actual size based on the pixel size and magnification, wherein the size includes diameter and height, etc.

[0066] It should be added that the surface flatness of each solder joint in the target diode panel is determined by measuring the displacement of the probe to determine the surface contour of the solder joint, thereby calculating the surface flatness. For example, a profilometer can collect height data of multiple points by moving the probe on the surface of the solder joint, and then calculate the surface flatness through software.

[0067] It should also be added that the gap length between each solder joint and the welding component in the target diode panel is measured by observing the gap between the solder joint and the welding component through a high-power optical microscope, and then using a measuring eyepiece or image analysis software to measure the gap length. For example, under a microscope, the gap between the solder joint and the welding component can be clearly seen, and then measured using the scale on the eyepiece or the measuring tool in the software.

[0068] Step 3: Diode panel solder joint analysis: Analyze the solder joint qualification index of the target diode panel based on the solder joint information of the target diode panel.

[0069] See also Figure 2 As shown, exemplarily, the analyzing the solder joint qualification index of the target diode panel includes: A1, extracting the standard shape contour of the solder joint from the standard information of the target diode panel.

[0070] A2. Overlap and compare the shape contours of each solder joint in the target diode panel with the standard shape contour to obtain the overlapped shape contours of each solder joint.

[0071] A3. The ratio of the overlapped shape contour of each solder joint to the shape contour is used as the shape contour qualification index of each solder joint in the target diode panel, recorded as , Number the solder joints. .

[0072] A4. According to the size of each solder joint in the target diode panel, the size qualification index of each solder joint in the target diode panel is calculated. .

[0073] Furthermore, the statistical size qualification index of each solder joint in the target diode panel includes: A4-1, extracting the diameter and height of each solder joint from the size of each solder joint in the target diode panel, and recording them as and .

[0074] A4-2. Extract the standard diameter and standard height of the solder joint from the standard information of the target diode panel and record them as and .

[0075] A4-3. Count the size qualification index of each solder joint in the target diode panel , , and Set the reference diameter difference and height difference respectively.

[0076] It should be added that and All are extracted from the automotive diode panel packaging inspection technical specification table.

[0077] A5. Record the surface flatness of each solder joint in the target diode panel as , the appropriate surface flatness of the solder joint is extracted from the standard information of the target diode panel and recorded as .

[0078] A6. Count the surface flatness pass index of each solder joint in the target diode panel , .

[0079] A7. According to the gap length of each solder joint corresponding to the welding part in the target diode panel, the gap qualification index of each solder joint in the target diode panel is calculated. .

[0080] Furthermore, the statistical calculation of the gap qualification index of each welding point in the target diode panel includes: A7-1, comparing the gap length of the welding component corresponding to each welding point in the target diode panel with the set reference gap length.

[0081] A7-2. If the gap length of the welding part corresponding to a certain welding point in the target diode panel is greater than the set reference gap length, 0 is used as the gap qualification index of the welding point in the target diode panel.

[0082] A7-3. If the gap length of a welding part corresponding to a welding point in the target diode panel is less than or equal to the set reference gap length, 1 is used as the gap qualification index of the welding point in the target diode panel, and then the gap qualification index of each welding point in the target diode panel is obtained, which is recorded as , The value is 0 or 1.

[0083] A8. Count the solder joint qualification index of the target diode panel , , , , and They are the weight of the set shape profile qualified index, the weight of the set size qualified index, the weight of the set surface flatness qualified index and the weight of the set gap qualified index, , .

[0084] It should be added that the size is directly related to the conductive area and current carrying capacity of the solder joint. The appropriate size can ensure sufficient contact area so that the current can stably pass through the solder joint, and thus the weight of the size qualification index is the largest. The shape contour will affect the heat dissipation performance of the solder joint, and indirectly affect the current carrying capacity of the solder joint. Therefore, the weight of the shape contour qualification index is smaller than the weight of the size qualification index. Although the surface flatness has a certain effect on the electrical performance and mechanical strength of the solder joint, it is relatively small. Therefore, the weight of the surface flatness qualification index is smaller than the weight of the shape contour qualification index. The gap mainly refers to the tiny gap between the solder joint and the diode pin and the panel pad. The gap within a certain range usually does not have a significant impact on the electrical performance and mechanical strength of the solder joint. Therefore, the weight of the gap qualification index is the smallest, so it is set , in order to facilitate analysis, The specific value can be 0.3. The specific value can be 0.4. The specific value can be 0.2. The specific value can be 0.1.

[0085] Step 4: Detect the appearance of the diode panel: Detect the appearance information of the target diode panel, which includes the number of scratches, the length of each scratch, the number of colors, and the chromaticity value corresponding to each color.

[0086] It should be added that the number of scratches in the target diode panel and the length of each scratch are obtained by photographing the target diode panel with a high-resolution camera, and the image analysis software identifies the edges of the scratches through edge detection and other algorithms, and then unifies the number of scratches and calculates the length of each scratch based on the edge coordinate information.

[0087] It should also be added that the chromaticity value corresponding to each color in the target diode panel is obtained by detection with a spectrophotometer, and the number of colors is obtained by counting the colors.

[0088] Step 5: Diode panel appearance analysis: Analyze the apparent qualification index of the target diode panel based on the appearance information of the target diode panel.

[0089] Exemplarily, the analysis of the apparent qualified index of the target diode panel includes: selecting the maximum scratch length from the lengths of the scratches in the target diode panel, and recording it as , the length of each scratch is averaged to obtain the average scratch length, which is recorded as .

[0090] The number of scratches on the target diode panel is recorded as .

[0091] Statistical scratch difference index in target diode panel , , and Set the allowable scratch length and allowable number of scratches for reference respectively.

[0092] It should be added that and All are extracted from the automotive diode panel packaging inspection technical specification table.

[0093] The number of colors on the target diode panel and the chromaticity value corresponding to each color are recorded as and , is the chromaticity value number corresponding to the color, , is the number of chromaticity values ​​corresponding to the color.

[0094] Statistical color difference index in target diode panel , , , and Set the allowed number of colors, chromaticity values, and chromaticity value differences respectively.

[0095] It should be added that , and All are extracted from the automotive diode panel packaging inspection technical specification table.

[0096] Statistical evaluation of the apparent qualified index of the target diode panel , , and are the scratch difference index and color difference index for setting references, is a natural constant.

[0097] It should be added that and All are extracted from the automotive diode panel packaging inspection technical specification table.

[0098] Step 6: Internal detection of diode panel: Detect the internal bubble image of the target diode panel.

[0099] It should be added that the internal bubble image of the target diode panel is obtained by detection by an X-ray detector.

[0100] Step 7: Internal analysis of the diode panel: Analyze the internal qualified index of the target diode panel based on the internal bubble image of the target diode panel.

[0101] See also Figure 3 As shown, exemplarily, the analysis of the internal qualified index of the target diode panel includes: B1, extracting the number of bubbles and the area of ​​each bubble from the internal bubble image of the target diode panel, and then calculating the bubble influence index of the target diode panel .

[0102] It should be added that the specific extraction process of extracting the number of bubbles and the area of ​​each bubble is as follows: a clear diode panel image is obtained using a camera, and an edge detection algorithm is used to detect the edges in the image. The edges of the bubbles usually show obvious changes, and then the position and shape of the bubbles are determined by detecting these edges. The diode panel image is marked, and different bubble areas are marked with different numbers, so that the number of marks is counted to obtain the number of bubbles. At the same time, according to the proportional relationship between the resolution of the diode panel image and the actual size, the pixel area is converted into an actual area unit to obtain the area of ​​each bubble.

[0103] Furthermore, the bubble influence index of the target diode panel is calculated, including: B1-1, extracting the maximum bubble area from the area of ​​each bubble of the target diode panel, recorded as .

[0104] B1-2. Sum the areas of the bubbles in the target diode panel and use the sum as the total bubble area of ​​the target diode panel, recorded as .

[0105] B1-3. Extract the package area of ​​the target diode panel from the standard information of the target diode panel and record it as .

[0106] B1-4. Record the number of bubbles on the target diode panel as , and then calculate the bubble impact index of the target diode panel , , , and They are the set permitted area of ​​a single bubble, permitted bubble area ratio and permitted number of bubbles respectively.

[0107] It should be added that and They are all extracted from the automotive diode panel packaging inspection technical specification table. The standard area of ​​a single bubble is extracted from the automotive diode panel packaging inspection technical specification table. The permitted bubble area ratio is obtained by the same analysis method as the bubble area ratio. For the convenience of analysis, The specific value can be 0.01.

[0108] B2. Extract the position of each bubble from the internal bubble image of the target diode panel, and then set the bubble influence factor of the target diode panel .

[0109] Further, the setting of the bubble influence factor of the target diode panel includes: B2-1, extracting the chip area and edge area of ​​the target diode panel from the standard information of the target diode panel.

[0110] B2-2. Extract the center point of each bubble from the position of each bubble in the target diode panel, and then locate the straight-line distance between the center point of each bubble and the chip area and edge area from the bubble image, and record them as and , Number the bubbles. , is the number of bubbles.

[0111] It should be supplemented that the straight-line distance between the center point of each bubble and the chip area and the edge area refers to the shortest straight-line distance between the center point of each bubble and the chip area and the edge area.

[0112] B2-3. Statistical influence of the position of each bubble in the target diode panel , , and The straight-line distances between the bubble and the chip area and the straight-line distances between the bubble and the edge area are set as references. and are the weights of the chip area distance impact index and the edge area distance impact index, respectively. , .

[0113] It should be added that and All are extracted from the automotive diode panel packaging inspection technical specification table.

[0114] It should be added that bubbles near the chip area will cause uneven local electric field, which will directly affect the electrical performance of the diode. Bubbles near the edge area will reduce the sealing of the package. If the sealing of the package is not good, external impurities such as moisture and dust may enter the package, which will indirectly affect the electrical performance of the diode. Therefore, it is necessary to set , in order to facilitate analysis, The specific value can be 0.6. The specific value can be 0.4.

[0115] B2-4. Compare the position influence of each bubble in the target diode panel with the position influence of the set reference. If the position influence of a bubble in the target diode panel is greater than the position influence of the set reference, the bubble is recorded as an abnormal position bubble, and the number of abnormal position bubbles is counted.

[0116] B2-5. The ratio of the number of bubbles in the abnormal position to the number of bubbles is used as the bubble influence factor of the target diode panel and recorded as .

[0117] When analyzing the internal qualified index of the target diode panel, the embodiment of the present invention improves the accuracy of the analysis of the impact of bubbles on the performance of the target diode panel by setting the bubble impact factor of the target diode panel, thereby improving the detection targeting of the target diode panel packaging detection.

[0118] B3. Count the internal qualified index of the target diode panel , , To set the bubble influence index for reference.

[0119] It should be added that It is extracted from the automotive diode panel packaging inspection technical specification table.

[0120] The embodiment of the present invention analyzes the internal qualification index of the target diode panel according to the number, area and position of the bubbles, thereby avoiding the deficiency of further analyzing the influence of bubbles on the target diode panel without combining the position of the bubbles, and more comprehensively evaluates the influence of bubbles on the packaging of the target diode panel, thereby improving the accuracy of determining the potential fault risk points, thereby improving the accuracy of the evaluation of the target diode packaging quality.

[0121] Step 8. Diode panel confirmation feedback: According to the solder joint qualification index, apparent qualification index and internal qualification index of the target diode panel, confirm the qualification index of the target diode panel, and then confirm the unqualified cause items of the target diode panel, and provide corresponding feedback.

[0122] Exemplarily, the step of confirming the qualified index of the target diode panel includes: extracting the qualified index of the solder joint of the target diode panel , the apparent qualification index of the target diode panel and the internal qualification index of the target diode panel .

[0123] Count the qualified index of the target diode panel , , , and are the weights of the set solder joint qualification index, apparent qualification index and internal qualification index, respectively. , .

[0124] It should be added that bubbles inside the diode panel will affect its electrical performance and stability. The presence of bubbles may lead to uneven local electric fields, increase reverse leakage current, reduce the voltage resistance and reliability of the diode panel, and thus directly affect the electrical performance of the diode panel. The solder joint is the key part of the connection between the diode and the circuit. Good solder joints can ensure stable electrical connections and ensure the normal flow of current, thereby indirectly affecting the electrical performance of the diode panel. Therefore, the weight of the solder joint qualified index is smaller than the weight of the internal qualified index. The apparent color and scratches mainly affect the appearance of the diode and have almost no effect on its electrical performance. Therefore, the weight of the apparent qualified index is the smallest, so it is set , in order to facilitate analysis, The specific value can be 0.35. The specific value can be 0.45. The specific value can be 0.2.

[0125] The embodiment of the present invention performs packaging detection and analysis of the target diode based on the three dimensions of solder joints, appearance and interior after the target diode panel is packaged, which breaks the current deficiency of no further detection and analysis of the solder joints after packaging, improves the timeliness of discovering potential defects in solder joints, and further ensures the comprehensiveness of the target diode packaging detection and analysis, thereby reducing potential quality and safety risks and reducing subsequent maintenance costs.

[0126] Exemplarily, the confirming of the unqualified cause item of the target diode panel includes: comparing the qualified index of the target diode panel with a set reference qualified index.

[0127] It should be added that when the qualified index of the target secondary surface tube is greater than or equal to the qualified index of the set reference, it indicates that there is no unqualified cause item in the target diode panel at this time.

[0128] When the qualified index of the target secondary surface pipe is less than the qualified index of the set reference, if , then the unqualified solder joints of the target diode panel are taken as the unqualified cause of the target diode panel. To set the reference solder joint qualification index.

[0129] like , then the apparent unqualified of the target diode panel is taken as the unqualified cause item of the target diode panel, To set the apparent qualification index for reference.

[0130] like , then the internal non-conformity of the target diode panel is taken as the non-conformity cause item of the target diode panel, An internal qualification index for setting reference.

[0131] When analyzing the internal qualified index of the automobile diode panel, the embodiment of the present invention sets the automobile diode panel to confirm the unqualified cause items of the target diode panel when performing the target diode panel packaging detection and analysis, so as to timely discover potential problems, thereby improving the pertinence of tracing the quality problems of the automobile diode panel packaging, thereby improving product quality, reducing production costs, and enhancing production efficiency.

[0132] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, they shall all fall within the protection scope of the present invention.

Claims

1. A method for detecting the packaging of an automobile diode panel, characterized in that: The method includes: Step 1: Input diode panel information: record the automotive diode panel to be packaged and tested as the target diode panel, and input the standard information of the target diode panel; Step 2: Diode panel solder joint detection: Detect the solder joint information of the target diode panel, the solder joint information includes the shape profile, size, surface flatness of each solder joint and the gap length of the corresponding welding component; Step 3: Diode panel solder joint analysis: Analyze the solder joint qualification index of the target diode panel based on the solder joint information of the target diode panel; Step 4: Detect the appearance of the diode panel: Detect the appearance information of the target diode panel, which includes the number of scratches, the length of each scratch, the number of colors, and the chromaticity value corresponding to each color; Step 5: Diode panel appearance analysis: Analyze the appearance qualification index of the target diode panel based on the appearance information of the target diode panel; Step 6: Internal detection of diode panel: Detect the internal bubble image of the target diode panel; Step 7: Internal analysis of the diode panel: Analyze the internal qualified index of the target diode panel based on the internal bubble image of the target diode panel; Step 8. Diode panel confirmation feedback: According to the solder joint qualification index, apparent qualification index and internal qualification index of the target diode panel, confirm the qualification index of the target diode panel, and then confirm the unqualified cause items of the target diode panel, and provide corresponding feedback.

2. The automotive diode panel packaging detection method according to claim 1, characterized in that: The analysis of the solder joint qualification index of the target diode panel includes: A1. Extract the standard shape contour of the solder joint from the standard information of the target diode panel; A2. Overlap and compare the shape contours of each solder joint in the target diode panel with the standard shape contour to obtain the overlapped shape contours of each solder joint; A3. The ratio of the overlapped shape contour of each solder joint to the shape contour is used as the shape contour qualification index of each solder joint in the target diode panel, recorded as , Number the solder joints. ; A4. According to the size of each solder joint in the target diode panel, the size qualification index of each solder joint in the target diode panel is calculated. ; A5. Record the surface flatness of each solder joint in the target diode panel as , the appropriate surface flatness of the solder joint is extracted from the standard information of the target diode panel and recorded as ; A6. Count the surface flatness pass index of each solder joint in the target diode panel , ; A7. According to the gap length of each solder joint corresponding to the welding part in the target diode panel, the gap qualification index of each solder joint in the target diode panel is calculated. ; A8. Count the solder joint qualification index of the target diode panel , , , , and They are the weight of the set shape profile qualified index, the weight of the set size qualified index, the weight of the set surface flatness qualified index and the weight of the set gap qualified index, , .

3. The automotive diode panel packaging detection method according to claim 2, characterized in that: The statistical size qualification index of each solder joint in the target diode panel includes: The diameter and height of each solder joint are extracted from the size of each solder joint in the target diode panel and recorded as and ; The standard diameter and standard height of the solder joint are extracted from the standard information of the target diode panel and recorded as and ; Statistical size qualification index of each solder joint in the target diode panel , , and Set the reference diameter difference and height difference respectively.

4. The automotive diode panel packaging detection method according to claim 2, characterized in that: The statistically analyzing the gap qualification index of each solder joint in the target diode panel includes: Comparing the gap length of the welding parts corresponding to each welding point in the target diode panel with the gap length of the set reference; If the gap length of the welding component corresponding to a certain welding point in the target diode panel is greater than the set reference gap length, 0 is used as the gap qualification index of the welding point in the target diode panel; If the gap length of the welding component corresponding to a certain welding point in the target diode panel is less than or equal to the set reference gap length, 1 is used as the gap qualification index of the welding point in the target diode panel, and then the gap qualification index of each welding point in the target diode panel is obtained, which is recorded as , The value of is 0 or 1.

5. The automotive diode panel packaging detection method according to claim 1, characterized in that: The apparent qualified index of the target diode panel to be analyzed includes: The maximum scratch length is selected from the lengths of the scratches in the target diode panel and recorded as , the length of each scratch is averaged to obtain the average scratch length, which is recorded as ; The number of scratches on the target diode panel is recorded as ; Statistical scratch difference index in target diode panel , , and They are the allowable scratch length and allowable number of scratches for setting reference respectively; The number of colors on the target diode panel and the chromaticity value corresponding to each color are recorded as and , is the chromaticity value number corresponding to the color, , is the number of chromaticity values ​​corresponding to the color; Statistical color difference index in target diode panel , , , and The permitted number of colors, chromaticity values ​​and chromaticity value differences are set respectively; Statistical evaluation of the apparent qualified index of the target diode panel , , and are the scratch difference index and color difference index for setting references, is a natural constant.

6. The automotive diode panel packaging detection method according to claim 1, characterized in that: The internal qualification index of the target diode panel is analyzed, including: B1. Extract the number of bubbles and the area of ​​each bubble from the internal bubble image of the target diode panel, and then calculate the bubble influence index of the target diode panel ; B2. Extract the position of each bubble from the internal bubble image of the target diode panel, and then set the bubble influence factor of the target diode panel ; B3. Count the internal qualified index of the target diode panel , , To set the bubble influence index for reference.

7. The automotive diode panel packaging detection method according to claim 6, characterized in that: The bubble impact index of the statistical target diode panel includes: The maximum bubble area is extracted from the area of ​​each bubble on the target diode panel and recorded as ; The areas of the bubbles in the target diode panel are summed up, and the sum is taken as the total bubble area of ​​the target diode panel, which is recorded as ; The package area of ​​the target diode panel is extracted from the standard information of the target diode panel and recorded as ; The number of bubbles on the target diode panel is recorded as , and then calculate the bubble impact index of the target diode panel , , , and They are the set permitted area of ​​a single bubble, permitted bubble area ratio and permitted number of bubbles respectively.

8. The automotive diode panel packaging detection method according to claim 6, characterized in that: The step of setting the bubble influence factor of the target diode panel includes: Extracting a chip area and an edge area of ​​the target diode panel from standard information of the target diode panel; The center point of each bubble is extracted from the position of each bubble in the target diode panel, and then the straight-line distance between the center point of each bubble and the chip area and edge area is located from the bubble image, and recorded as and , Number the bubbles. , is the number of bubbles; Statistical analysis of the position influence of each bubble in the target diode panel , , and The straight-line distances between the bubble and the chip area and the straight-line distances between the bubble and the edge area are set as references. and are the weights of the chip area distance impact index and the edge area distance impact index, respectively. , ; The position influence of each bubble in the target diode panel is compared with the position influence of the set reference. If the position influence of a bubble in the target diode panel is greater than the position influence of the set reference, the bubble is recorded as an abnormal position bubble, and the number of abnormal position bubbles is counted; The ratio of the number of bubbles in the abnormal position to the number of bubbles is taken as the bubble impact factor of the target diode panel and recorded as .

9. The automotive diode panel packaging detection method according to claim 1, characterized in that: The confirmation of the qualified index of the target diode panel includes: Extract the solder joint qualification index of the target diode panel , the apparent qualification index of the target diode panel and the internal qualification index of the target diode panel ; Count the qualified index of the target diode panel , , , and are the weights of the set solder joint qualification index, apparent qualification index and internal qualification index, respectively. , .

10. The automotive diode panel packaging detection method according to claim 9, characterized in that: The confirmation of the unqualified cause items of the target diode panel includes: Comparing the qualified index of the target diode panel with the qualified index of the set reference; When the qualified index of the target secondary surface pipe is less than the qualified index of the set reference, if , then the unqualified solder joints of the target diode panel are taken as the unqualified cause of the target diode panel. To set the reference solder joint qualification index; like , then the apparent unqualified of the target diode panel is taken as the unqualified cause item of the target diode panel, To set the apparent qualified index for reference; like , then the internal non-conformity of the target diode panel is taken as the non-conformity cause item of the target diode panel, To set the internal qualification index for reference.

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