Pressure detection device and electronic equipment

Abstract

The invention discloses a pressure detection device and electronic equipment, and belongs to the technical field of electronic equipment. The pressure detection device comprises a flexible circuit board, the flexible circuit board comprises a wiring layer and a touch control layer, the touch control layer is arranged on the wiring layer, and the touch control layer is electrically connected with the wiring layer; the electromagnetic interference thin film layer is arranged on the flexible circuit board, and the electromagnetic interference thin film layer is electrically connected with the wiring layer; the elastic filling layer is arranged on the flexible circuit board; the grounding layer is arranged on the elastic filling layer, and the elastic filling layer is located between the grounding layer and the electromagnetic interference thin film layer.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a pressure detection device and an electronic equipment. Background Art

[0002] Capacitive pressure sensors contain a pair of conductive plates or electrodes. When an object applies pressure, the distance between the conductive plates changes, causing a change in capacitance. The change in capacitance can be measured and converted into an electrical signal, which can then be analyzed and identified by a processor or circuit.

[0003] In the related art, touch detection and pressure detection of the capacitive pressure sensor need to be performed on different layers on the FPC (Flexible Printed Circuit), and it is necessary to design a multi-layer FPC for detection or divide it into multiple FPCs for detection, resulting in high hardware and design costs. Summary of the invention

[0004] The present application aims to provide a pressure detection device and electronic equipment, which can solve the problem of needing to design a multi-layer FPC for detection or dividing the FPC into multiple layers for detection, resulting in high hardware cost and design cost.

[0005] In a first aspect, an embodiment of the present application proposes a pressure detection device, comprising: a flexible circuit board, the flexible circuit board comprising a wiring layer and a touch layer, wherein the touch layer is arranged on the wiring layer, and the touch layer is electrically connected to the wiring layer; an electromagnetic interference film layer, arranged on the flexible circuit board, and the electromagnetic interference film layer is electrically connected to the wiring layer; an elastic filling layer, arranged on the flexible circuit board; and a grounding layer, arranged on the elastic filling layer, and the elastic filling layer is located between the grounding layer and the electromagnetic interference film layer.

[0006] In a second aspect, an embodiment of the present application proposes an electronic device, comprising: a housing; and a pressure detection device, which is arranged in the housing, and the pressure detection device is the pressure detection device in the first aspect.

[0007] In an embodiment of the present application, an electromagnetic interference film layer is provided on a flexible circuit board for capacitive touch detection, so that when the pressure detection device is touched, the touch layer can generate a touch detection signal, and when the pressure detection device is pressed, the capacitance value of the flat capacitor formed between the electromagnetic interference film layer and the ground layer changes to generate a pressure detection signal, thereby enabling the pressure detection device to perform touch detection and pressure detection through a flexible circuit board with fewer layers, thereby reducing the hardware cost and design cost of the pressure detection device.

[0008] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0010] Figure 1 One of the structural schematic diagrams of the pressure detection device provided in some embodiments of the present application is shown;

[0011] Figure 2 A second structural schematic diagram of a pressure detection device provided in some embodiments of the present application is shown;

[0012] Figure 3 A schematic diagram of the structure of the routing layer provided in some embodiments of the present application is shown;

[0013] Figure 4 One of the schematic diagrams of sub-film arrangement provided in some embodiments of the present application is shown;

[0014] Figure 5 The second schematic diagram of the arrangement of sub-films provided in some embodiments of the present application is shown;

[0015] Figure 6 The third schematic diagram of the arrangement of sub-films provided in some embodiments of the present application is shown;

[0016] Figure 7 A schematic diagram of the structure of a touch layer provided in some embodiments of the present application is shown;

[0017] Figure 8 One of the structural schematic diagrams of an electronic device provided in some embodiments of the present application is shown;

[0018] Fig. 9 A second structural schematic diagram of an electronic device provided in some embodiments of the present application is shown.

[0019] Reference numerals:

[0020] 100 pressure detection device, 110 flexible circuit board, 112 routing layer, 1121 first routing, 1122 connecting window, 1123 second connecting end, 1124 second routing, 114 touch layer, 1141 capacitance detection unit, 1142 first connecting end, 120 electromagnetic interference film layer, 122 sub-film, 130 elastic filling layer, 140 grounding layer, 150 capacitance detection chip, 200 electronic device, 201 housing. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0022] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0023] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] Combine the following Figures 1 to 9 A pressure detection device and an electronic device according to an embodiment of the present application are described.

[0026] In some embodiments of the present application, a pressure detection device is provided. Figure 1 One of the structural schematic diagrams of the pressure detection device provided in some embodiments of the present application is shown, Figure 2 FIG. 2 shows a second structural diagram of a pressure detection device provided in some embodiments of the present application. Figure 1 and Figure 2 As shown, the pressure detection device 100 includes: a flexible circuit board 110, the flexible circuit board 110 includes a wiring layer 112 and a touch layer 114, wherein the touch layer 114 is arranged on the wiring layer 112, and the touch layer 114 is electrically connected to the wiring layer 112; an electromagnetic interference film layer 120, which is arranged on the flexible circuit board 110, and the electromagnetic interference film layer 120 is electrically connected to the wiring layer 112; an elastic filling layer 130, which is arranged on the flexible circuit board 110; and a grounding layer 140, which is arranged on the elastic filling layer 130, and the elastic filling layer 130 is located between the grounding layer 140 and the electromagnetic interference film layer 120.

[0027] In the embodiment of the present application, the pressure detection device 100 includes a flexible circuit board 110, and the flexible circuit board 110 includes two circuit board layers, specifically a wiring layer 112 and a touch layer 114, wherein the touch layer 114 is used to detect the pressure caused by the user on the touch layer 114 to generate a touch detection signal, and the wiring layer 112 is used to transmit the touch detection signal generated by the touch layer 114 to the outside, that is, the touch layer 114 is used to detect the signal, and the wiring layer 112 is used to transmit the signal. The pressure detection device 100 also includes an electromagnetic interference film layer 120 arranged on the flexible circuit board 110, and the electromagnetic interference film layer 120, the elastic filling layer 130 and the grounding layer 140 can be used to generate a pressure detection signal in response to the pressure received. Among them, an elastic filling layer 130 is arranged between the electromagnetic interference film layer 120 and the grounding layer 140, and the elastic filling layer 130 can be deformed when the user presses, thereby changing the distance between the electromagnetic interference film layer 120 and the grounding layer 140. A parallel plate capacitor is formed between the electromagnetic interference film layer 120 and the ground layer 140. When the distance between the electromagnetic interference film layer 120 and the ground layer 140 changes, the capacitance value of the formed parallel plate capacitor changes, thereby outputting a pressure detection signal to realize the detection of the pressing action.

[0028] Exemplarily, the elastic filling layer 130 is an interlayer filled with elastic insulating material, such as foam glue.

[0029] Exemplarily, the electromagnetic interference film layer 120 is selected as an EMI (Electromagnetic Interference) film, which includes an insulating layer, a metal deposition layer and a conductive adhesive layer. The conductive adhesive layer is adhered to the wiring layer 112 of the flexible circuit board 110, and the EMI film is electrically connected to the wiring layer 112 through the conductive adhesive layer.

[0030] Specifically, the top layer of the double-layer flexible circuit board 110 is used as the touch layer 114, wherein a plurality of capacitance detection units 1141 are provided, the top layer of the double-layer flexible board is used as the routing layer 112, the electromagnetic interference film layer 120 is provided to fit the routing layer 112, the electromagnetic interference film layer 120 is electrically connected to the routing layer 112, the electromagnetic interference film layer 120 is closely fitted to the ground layer 140 through the elastic filling layer 130, the ground layer 140 is fitted to the device housing, and the elastic filling layer 130 can produce deformation and rebound in response to the user's pressing action. When the user's fingers pinch the device housing and apply pressure, the distance between the electromagnetic interference film layer 120 and the ground layer 140 is compressed, so that the capacitance of the parallel plate capacitor formed by the electromagnetic interference film layer 120 and the ground layer 140 increases, and the detection of the pressing action can be achieved by detecting the change in the capacitance.

[0031] Exemplarily, the grounding layer 140 can be implemented by steel pipe grounding, conductive cloth grounding, etc.

[0032] like Figure 1 As shown, exemplarily, the pressure detection device 100 can be arranged flat on the equipment.

[0033] like Figure 2 As shown, exemplarily, the pressure detection device 100 may be ring-shaped and arranged around the device.

[0034] In the embodiment of the present application, an electromagnetic interference film layer 120 is provided on the flexible circuit board 110 for capacitive touch detection, so that when the pressure detection device 100 is touched, the touch layer can generate a touch detection signal, and when the pressure detection device 100 is pressed, the capacitance value of the flat capacitor formed between the electromagnetic interference film layer 120 and the ground layer 140 changes to generate a pressure detection signal, thereby enabling the pressure detection device 100 to perform touch detection and pressure detection through a flexible circuit board 110 with fewer layers, thereby reducing the hardware cost and design cost of the pressure detection device 100.

[0035] In some embodiments of the present application, the electromagnetic interference film layer 120 includes: N sub-films 122, where N is a positive integer. In one embodiment, N can be 1, 2, 3, etc. When N is 2, two sub-films 122 are arranged in parallel with each other. When N is 3, three sub-films are arranged in parallel with each other. The routing layer 112 is located between the touch layer 114 and the electromagnetic interference film layer 120, and M connection windows 1122 are provided on the routing layer 112, and the M connection windows 1122 are connected to the N sub-films 122, where M is a positive integer. In one embodiment, M can be 1, 2, 3, etc. Among them, each sub-film 122 of the N sub-films 122 is connected to P connection windows 1122, where P is a positive integer, and M=P×N. In other words, each sub-film can have one or more connection windows.

[0036] In an embodiment of the present application, the electromagnetic interference film layer 120 includes N sub-films 122, and each sub-film 122 serves as a pressure detection unit. By setting multiple sub-films 122 in the electromagnetic interference film layer 120, the pressure detection device 100 includes multiple pressure detection units, and the multiple pressure detection units are distributed at different positions of the pressure detection device 100, so as to detect pressure at different positions.

[0037] In the embodiment of the present application, the routing layer 112 is arranged between the touch layer 114 and the electromagnetic interference film layer 120, that is, the electromagnetic interference film layer 120 is arranged to fit the routing layer 112, and a connecting window 1122 is opened on the routing layer 112, so that the electromagnetic interference film layer 120 is electrically connected to the routing layer 112 through the conductive glue and the connecting window 1122.

[0038] Specifically, the connection window 1122 is a window opened on the wiring layer 112, and the wiring layer 112 leaks copper through the window. The electromagnetic interference film layer 120 includes sub-films 122, each of which is an EMI film, and the EMI film includes a conductive adhesive layer. The conductive adhesive layer of the EMI film is attached to the connection window 1122 of the wiring layer 112, so that the EMI film is electrically connected to the wiring layer 112 through the connection window 1122 and the conductive adhesive.

[0039] In the embodiment of the present application, M≥N, that is, the number M of the connecting windows 1122 is greater than or equal to the number N of the sub-films 122, and each sub-film 122 corresponds to at least one connecting window 1122, thereby improving the connection stability between the electromagnetic interference film layer 120 and the routing layer 112.

[0040] Exemplarily, the number of sub-films 122 is 10, and 10 connection windows 1122 are opened on the routing layer 112, that is, P=1, the opening positions of the 10 connection windows 1122 match the distribution positions of the 10 sub-films 122, and the sub-films 122 correspond to the connection windows 1122 one by one.

[0041] Exemplarily, the number of sub-films 122 is 6, and 12 connection windows 1122 are opened on the routing layer 112, that is, P=2, 1 sub-film 122 corresponds to 2 connection windows 1122, and the opening positions of the 2 connection windows 1122 corresponding to the sub-film 122 match the distribution positions of the corresponding sub-films 122.

[0042] In an embodiment of the present application, a plurality of sub-films 122 are arranged in the electromagnetic interference film layer 120, and corresponding connecting windows 1122 are opened on the wiring layer 112. The plurality of sub-films 122 are electrically connected to the wiring layer 112 through the corresponding connecting windows 1122, so that each sub-film 122 can be used as a pressure detection unit to detect pressing pressure independently, and by setting the number of connecting windows 1122 corresponding to each sub-film 122 to at least one, the stability of the electrical connection between each sub-film 122 and the wiring layer 112 can be improved.

[0043] Figure 3 Schematic diagram of the structure of the routing layer provided in some embodiments of the present application is shown, such as Figure 3 As shown, in some embodiments of the present application, the routing layer 112 includes: M first routing lines 1121, the first ends of the M first routing lines 1121 are respectively connected to M connection windows 1122, and the second ends of the M first routing lines 1121 are used to output pressure detection signals.

[0044] In the embodiment of the present application, the routing layer 112 includes a first routing 1121 , which is used to transmit the pressure detection signal output by the electromagnetic interference film layer 120 to the outside, that is, to transmit the pressure detection signal output by the electromagnetic interference film layer 120 to the capacitance detection chip 150 .

[0045] Specifically, the N sub-films 122 in the electromagnetic interference film layer 120 transmit the collected pressure detection signal to the wiring layer 112, and the wiring layer 112 transmits the pressure detection signal to the capacitance detection chip 150 through the first wiring 1121, so as to determine the pressing pressure. The number of first wirings 1121 is M, and the first end of each first wiring 1121 is connected to the connection window 1122, and the second end of each first wiring 1121 is connected to the capacitance detection chip 150, so as to transmit the pressure detection signal to the capacitance detection chip 150 through the first wiring 1121.

[0046] In an embodiment of the present application, a plurality of first routing lines 1121 are arranged in the routing layer 112, and the plurality of first routing lines 1121 correspond one-to-one to the plurality of connecting windows 1122. The collected pressure detection signals can be transmitted to the capacitive detection chip 150 through the first routing lines 1121, thereby improving the stability and accuracy of the pressure detection device 100 in detecting the user's pressing operation.

[0047] In some embodiments of the present application, the N sub-films 122 are arranged along the first direction.

[0048] In the embodiment of the present application, the N sub-films 122 are arranged in an N×1 array, and the arrangement direction of the N sub-films 122 is a first direction.

[0049] Exemplarily, when the pressure detection device 100 has a quadrilateral structure, the first direction may be the width direction of the routing layer 112 , the first direction may be the length direction of the routing layer 112 , the first direction may be the diagonal direction of the routing layer 112 , etc.

[0050] Figure 4 One of the schematic diagrams of sub-film arrangement provided in some embodiments of the present application is shown, such as Figure 4 As shown, arrow A shows a first direction, which is the length direction of the routing layer 112. N sub-films 122 are arranged along the length direction of the routing layer 112. The width of each sub-film 122 is the same as the width of the routing layer 112, and the length of each sub-film 122 is less than or equal to 1 / N of the length of the flexible circuit board 110.

[0051] Figure 5 FIG. 2 shows a second schematic diagram of sub-film arrangement provided in some embodiments of the present application, such as Figure 5 As shown, arrow B indicates a first direction, which is the width direction of the routing layer 112. N sub-films 122 are arranged along the width direction of the routing layer 112. The length of each sub-film 122 is the same as the length of the routing layer 112, and the width of each sub-film 122 is less than or equal to 1 / N of the width of the flexible circuit board 110.

[0052] Exemplarily, when the pressure detection device 100 is a ring structure, the first direction may be the axial direction of the wiring layer 112 , and the first direction may also be the circumferential direction of the wiring layer 112 .

[0053] In the embodiment of the present application, the sub-films 122 are arranged along the first direction so that the sub-films 122 can be distributed on the wiring layer 112 along the first direction, thereby improving the stability of the connection between each sub-film 122 and the wiring layer 112.

[0054] In some embodiments of the present application, N sub-films 122 are arranged according to a target array, wherein the number of rows of the target array is X, and the number of columns of the target array is Y, X and Y are both integers greater than 1, and N=X×Y.

[0055] In the embodiment of the present application, N sub-films 122 are arranged in an X×Y rectangular array, and the product of X and Y is N.

[0056] Figure 6 FIG. 3 shows a third schematic diagram of sub-film arrangement provided in some embodiments of the present application, such as Figure 6 As shown, N sub-films 122 are arranged along the width direction of the routing layer 112, the length of each sub-film 122 is less than or equal to 1 / X of the length of the flexible circuit board 110, and the width of each sub-film 122 is less than or equal to 1 / Y of the width of the flexible circuit board 110.

[0057] Exemplarily, the number of sub-films 122 is 8, the number of rows of the target array is 2, the number of columns of the target array is 4, or the number of rows of the target array is 4, the number of columns of the target array is 2.

[0058] Exemplarily, the number of sub-films 122 is 9, and the number of rows and columns of the target array is 3.

[0059] In the embodiment of the present application, when there are multiple sub-films 122 , the sub-films 122 can be arranged on the flexible circuit board 110 according to an X×Y target array to further improve the detection sensitivity of the pressure detection device 100 .

[0060] Figure 7 FIG. 4 shows a schematic diagram of the structure of the touch layer provided in some embodiments of the present application. Figure 3 and Figure 7 As shown, in some embodiments of the present application, the touch layer 114 includes: Q capacitance detection units 1141, the Q capacitance detection units 1141 are arranged in an array, and the Q capacitance detection units 1141 are provided with a first connection terminal 1142, Q is a positive integer; Q second connection terminals 1123 are provided on the routing layer 112, and each capacitance detection unit 1141 is connected to the routing layer 112 via the first connection terminal 1142 and the second connection terminal 1123.

[0061] In the embodiment of the present application, the touch layer 114 includes a plurality of capacitance detection units 1141, which are arranged in an array on the flexible circuit board 110, and the touch detection signal is capacitively detected by the plurality of capacitance detection units 1141. A first connection terminal 1142 is provided on each capacitance detection unit 1141, and the wiring layer 112 is provided with the same number of second connection terminals 1123 as the capacitance detection units 1141, and the first connection terminal 1142 and the second connection terminal 1123 can be connected by a connection line, so that the wiring layer 112 and the touch layer 114 are electrically connected.

[0062] Specifically, the Q capacitance detection units 1141 are arranged in an array, the arrangement array of the Q capacitance detection units 1141 is an array in the form of J×K, and the number of rows and the number of columns of the arrangement array of the Q capacitance detection units 1141 are both positive integers.

[0063] Exemplarily, the first connection end 1142 and the second connection end 1123 are both blind hole structures, and the plane where the first connection end 1142 is disposed on the touch layer 114 is disposed opposite to the plane where the second connection end 1123 is disposed on the routing layer 112 .

[0064] In an embodiment of the present application, a plurality of capacitance detection units 1141 are arranged on the touch layer 114, so that the touch layer 114 can identify and detect touch operations of different touch tracks performed by the user, and a corresponding first connection terminal 1142 is arranged on each capacitance detection unit 1141, and is connected to the wiring layer 112 through the second connection terminal 1123, which can improve the stability of the touch detection signal transmitted from the touch layer 114 to the wiring layer 112.

[0065] like Figure 3 As shown, in some embodiments of the present application, the routing layer 112 includes: Q second routing lines 1124, the first ends of the Q second routing lines 1124 are respectively connected to the Q second connection ends 1123, and the second ends of the Q second routing lines 1124 are used to output touch detection signals.

[0066] In the embodiment of the present application, a second routing line 1124 is disposed in the routing layer 112 , and the second routing line 1124 is used to transmit the touch detection signal output by the touch layer 114 to the outside, that is, to transmit the touch detection signal output by the touch layer 114 to the capacitance detection chip 150 .

[0067] Specifically, the number of the second wirings 1124 matches the number of the capacitance detection units 1141 in the touch layer 114, so that the touch detection signal output by each capacitance detection unit 1141 can be transmitted to the capacitance detection chip 150 through the wiring layer 112. The first end of each second wiring 1124 is respectively connected to the corresponding second connection end 1123, and the second end of each second wiring 1124 is connected to the capacitance detection chip 150, so that the touch detection signal output by each capacitance detection unit 1141 is transmitted to the capacitance detection chip 150.

[0068] In an embodiment of the present application, a plurality of second routing lines 1124 are arranged in the routing layer 112, and the plurality of second routing lines 1124 correspond one-to-one to the plurality of second connection terminals 1123. The touch detection signals collected by the touch layer 114 can be transmitted to the capacitive detection chip 150 through the second routing lines 1124, thereby improving the stability and accuracy of the pressure detection device 100 in detecting the user's touch operation.

[0069] like Figure 3 As shown, in some embodiments of the present application, the pressure detection device 100 further includes: a capacitance detection chip 150 , and the capacitance detection chip 150 is electrically connected to the wiring layer 112 .

[0070] In the embodiment of the present application, a capacitance detection chip 150 is also provided in the pressure detection device 100. The touch detection signal output by the touch layer 114 and the pressure detection signal output by the electromagnetic interference film layer 120 can be transmitted to the capacitance detection chip 150 through the wiring layer 112, so that the capacitance detection chip 150 monitors the capacitance values ​​of the touch layer 114 and the electromagnetic interference film layer 120.

[0071] like Figure 2 As shown, in some embodiments of the present application, the pressure detection device 100 is ring-shaped, wherein the touch layer 114 is located at the outer circle of the pressure detection device 100 , and the ground layer 140 is located at the inner circle of the pressure detection device 100 .

[0072] In the embodiment of the present application, the pressure detection device 100 can be set on a cylindrical device, that is, the pressure detection device 100 can be set to a ring shape, and the touch layer 114 is located on the outer circle of the pressure detection device 100, which can ensure the accuracy and sensitivity of the pressure detection device 100 in sampling the touch detection signal.

[0073] Exemplarily, the annular pressure detection device 100 includes, from inside to outside, a ground layer 140 , an elastic filling layer 130 , an electromagnetic interference film layer 120 , a wiring layer 112 , and a touch layer 114 .

[0074] In some embodiments of the present application, an electronic device is provided. Figure 8 One of the structural schematic diagrams of the electronic device provided in some embodiments of the present application is shown, Fig. 9 FIG. 2 shows a second structural diagram of an electronic device provided in some embodiments of the present application, such as Figure 8 and Fig. 9 As shown, the electronic device 200 includes a housing 201 and a pressure detection device 100. The pressure detection device 100 is the pressure detection device 100 in any of the above-mentioned embodiments, and thus has all the beneficial technical effects of the pressure detection device 100 in any of the above-mentioned embodiments, which will not be elaborated herein.

[0075] like Figure 8 As shown, exemplarily, the electronic device 200 is a wireless headset, and the pressure detection device 100 is arranged on the headset rod of the wireless headset.

[0076] like Fig. 9 As shown, exemplarily, the electronic device 200 is a stylus pen, and the housing 201 of the stylus pen is cylindrical, then the pressure detection device 100 is annular, and the annular pressure detection device 100 is arranged inside the housing 201 of the stylus pen.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0078] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A pressure detection device, characterized in that: include: A flexible circuit board, the flexible circuit board comprising a wiring layer and a touch layer, wherein the touch layer is arranged on the wiring layer, and the touch layer is electrically connected to the wiring layer; An electromagnetic interference film layer is arranged on the flexible circuit board, and the electromagnetic interference film layer is electrically connected to the wiring layer; An elastic filling layer, arranged on the flexible circuit board; The grounding layer is arranged on the elastic filling layer, and the elastic filling layer is located between the grounding layer and the electromagnetic interference film layer.

2. The pressure detection device according to claim 1, characterized in that: The electromagnetic interference film layer comprises: N sub-films, where N is a positive integer; The wiring layer is located between the touch layer and the electromagnetic interference film layer, and M connection windows are opened on the wiring layer, and the M connection windows are connected to the N sub-films, where M is a positive integer; Wherein, each of the N sub-films is connected to P connection windows, P is a positive integer, and M=P×N.

3. The pressure detection device according to claim 2, characterized in that: The routing layer includes: There are M first wirings, and first ends of the M first wirings are respectively connected to the M connection windows, and second ends of the M first wirings are used to output pressure detection signals.

4. The pressure detection device according to claim 2, characterized in that: The N sub-films are arranged along a first direction.

5. The pressure detection device according to claim 2, characterized in that: The N sub-films are arranged according to a target array, wherein the number of rows of the target array is X, and the number of columns of the target array is Y, X and Y are both integers greater than 1, and N=X×Y.

6. The pressure detection device according to any one of claims 1 to 5, characterized in that: The touch layer comprises: Q capacitance detection units, the Q capacitance detection units are arranged in an array, and the Q capacitance detection units are provided with a first connection terminal, and Q is a positive integer; The routing layer is provided with Q second connection terminals, and each of the capacitance detection units is connected to the routing layer via the first connection terminal and the second connection terminal.

7. The pressure detection device according to claim 6, characterized in that: The routing layer includes: There are Q second routing lines, first ends of the Q second routing lines are respectively connected to the Q second connecting ends, and second ends of the Q second routing lines are used to output touch detection signals.

8. The pressure detection device according to any one of claims 1 to 5, characterized in that: Also includes: A capacitance detection chip is electrically connected to the wiring layer.

9. The pressure detection device according to any one of claims 1 to 5, characterized in that: The pressure detection device is ring-shaped, wherein the touch layer is located at the outer circle of the pressure detection device, and the ground layer is located at the inner circle of the pressure detection device.

10. An electronic device, characterized in that: include: shell; The pressure detection device according to any one of claims 1 to 9 is arranged on the housing.

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