Heat dissipation mode determination method and device, storage medium and electronic equipment
By obtaining the temperature, power and heat dissipation characteristic parameters in the chip heat dissipation device, determining the target temperature difference and junction thermal resistance, the problem of difficult to guarantee the chip heat dissipation performance is solved, and more efficient and reliable chip heat dissipation is achieved.
Patent Information
- Application Number
- CN202411554534.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-01
- Publication Date
- 2025-02-11
AI Technical Summary
The prior art is difficult to effectively ensure the heat dissipation performance of the chip, which affects the reliability of the chip.
By obtaining the temperature of the temperature measuring element, chip power and heat dissipation characteristic parameters in the chip heat dissipation device, the target temperature difference and the thermal resistance of the junction are determined, and the heat dissipation method of the chip is determined.
It improves the reliability and rationality of the chip's heat dissipation performance to ensure effective heat dissipation of the chip in actual working conditions.
Smart Images
Figure CN119416518A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to chip technology, and in particular to a method, device, storage medium and electronic device for determining a heat dissipation mode. Background Art
[0002] At present, the application of chips is becoming more and more extensive. It should be noted that the heat dissipation performance of the chip is very important for the chip and will greatly affect the reliability of the chip. How to ensure the heat dissipation performance of the chip is a problem worthy of attention for those skilled in the art. Summary of the invention
[0003] In order to solve the above technical problems, the present disclosure provides a method, device, storage medium and electronic device for determining a heat dissipation method.
[0004] According to one aspect of an embodiment of the present disclosure, a method for determining a heat dissipation mode is provided, including:
[0005] Acquire a first temperature of a first temperature measuring element disposed in a chip in a chip heat dissipation device, and a second temperature of a second temperature measuring element disposed on a surface of a heat dissipation boss in the chip heat dissipation device facing away from the chip;
[0006] obtaining the power of the chip;
[0007] Acquire heat dissipation characteristic parameters of the chip heat dissipation device; wherein the heat dissipation characteristic parameters are characteristic parameters that characterize the heat dissipation performance of the chip heat dissipation device;
[0008] determining a target temperature difference based on the first temperature and the second temperature;
[0009] Determining a junction-to-case thermal resistance of the chip heat sink based on the target temperature difference and the power;
[0010] Based on the heat dissipation characteristic parameters and the junction-to-case thermal resistance, a heat dissipation method of the chip is determined.
[0011] According to another aspect of an embodiment of the present disclosure, a device for determining a heat dissipation mode is provided, comprising:
[0012] A first acquisition module, used to acquire a first temperature of a first temperature measuring element disposed on a chip in the chip heat dissipation device, and a second temperature of a second temperature measuring element disposed on a surface of a heat dissipation boss in the chip heat dissipation device facing away from the chip;
[0013] A second acquisition module, used to acquire the power of the chip;
[0014] A third acquisition module is used to acquire heat dissipation characteristic parameters of the chip heat dissipation device; wherein the heat dissipation characteristic parameters are characteristic parameters that characterize the heat dissipation performance of the chip heat dissipation device;
[0015] A first determining module, configured to determine a target temperature difference based on the first temperature and the second temperature acquired by the first acquiring module;
[0016] a second determining module, configured to determine a junction-to-case thermal resistance of the chip heat dissipation device based on the target temperature difference determined by the first determining module and the power acquired by the second acquiring module;
[0017] The third determination module is used to determine the heat dissipation mode of the chip based on the heat dissipation characteristic parameter obtained by the third acquisition module and the junction-to-case thermal resistance determined by the second determination module.
[0018] According to another aspect of an embodiment of the present disclosure, a computer-readable storage medium is provided, wherein the storage medium stores a computer program, and the computer program is used to execute the above-mentioned heat dissipation mode determination method.
[0019] According to another aspect of the embodiments of the present disclosure, an electronic device is provided, the electronic device comprising:
[0020] processor;
[0021] a memory for storing instructions executable by the processor;
[0022] The processor is used to read the executable instructions from the memory and execute the instructions to implement the above-mentioned heat dissipation mode determination method.
[0023] According to another aspect of the embodiments of the present disclosure, a computer program product is provided. When instructions in the computer program product are executed by a processor, the above-mentioned heat dissipation mode determination method is executed.
[0024] Based on the heat dissipation method determination method, device, storage medium, electronic device and program product provided by the above embodiments of the present disclosure, a chip heat dissipation device can be introduced, and the junction-to-shell thermal resistance of the chip heat dissipation device can be used for the thermal design of the chip. The junction-to-shell thermal resistance of the chip heat dissipation device can be determined based on the target temperature difference and the power of the chip, and the target temperature difference can be determined based on the first temperature and the second temperature. The first temperature can be the internal temperature of the chip in the chip heat dissipation device, and the second temperature can be the temperature of the surface of the heat dissipation boss in the chip heat dissipation device facing away from the chip. It should be noted that compared with the outer surface of the chip, the temperature difference between different areas of the surface of the heat dissipation boss facing away from the chip is smaller, then the second temperature and the average temperature deviation of the surface of the heat dissipation boss facing away from the chip are smaller, therefore, the reliability of the second temperature is higher, and accordingly, the reliability of the junction-to-shell thermal resistance of the chip heat dissipation device is also higher, which is conducive to ensuring the rationality and reliability of the thermal design results of the chip, thus, it is conducive to ensuring the rationality and reliability of the heat dissipation method of the chip, thereby facilitating the heat dissipation performance of the chip. In addition, it should be pointed out that under the actual working state of the chip, the heat at the chip is generally conducted away through the real heat dissipation boss (for example, conducted to the radiator), and the heat dissipation boss is provided in the chip heat dissipation device, which is equivalent to simulating the actual working state of the chip to determine the junction-to-case thermal resistance, which is beneficial to further ensure the reliability of the junction-to-case thermal resistance, thereby helping to further ensure the heat dissipation performance of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a schematic diagram of the structure of a chip heat dissipation device provided by some exemplary embodiments of the present disclosure.
[0026] Figure 2 It is a flowchart of a method for determining a heat dissipation mode provided by some exemplary embodiments of the present disclosure.
[0027] Figure 3 It is a flowchart of a method for determining a target temperature difference provided by some exemplary embodiments of the present disclosure.
[0028] Figure 4 It is a flowchart of a method for obtaining chip power provided by some exemplary embodiments of the present disclosure.
[0029] Figure 5 It is a flowchart of a method for determining a heat dissipation method provided by other exemplary embodiments of the present disclosure.
[0030] Figure 6-1 4 is a flow chart of a method for determining a target junction-to-case thermal resistance provided by some exemplary embodiments of the present disclosure.
[0031] Figure 6-2 4 is a flow chart of a method for determining a target junction-to-case thermal resistance provided by some other exemplary embodiments of the present disclosure.
[0032] Figure 6-3 FIG. 4 is a flow chart of a method for determining a target junction-to-case thermal resistance provided by some further exemplary embodiments of the present disclosure.
[0033] Figure 7 It is a structural schematic diagram of a heat dissipation mode determination device provided by some exemplary embodiments of the present disclosure.
[0034] Figure 8 is a structural diagram of a first determination module in some exemplary embodiments of the present disclosure.
[0035] Fig. 9 is a structural diagram of a second acquisition module in some exemplary embodiments of the present disclosure.
[0036] Fig.10 is a structural diagram of the third determination module in some exemplary embodiments of the present disclosure.
[0037] Figure 11-1 is a schematic structural diagram of the fourth determination submodule in some exemplary embodiments of the present disclosure.
[0038] Figure 11-2 It is a structural schematic diagram of the fourth determination submodule in some other exemplary embodiments of the present disclosure.
[0039] Fig.12 It is a schematic diagram of the structure of an electronic device provided by some exemplary embodiments of the present disclosure. DETAILED DESCRIPTION
[0040] To explain the present disclosure, example embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. It should be understood that the present disclosure is not limited to the example embodiments.
[0041] It should be noted that the relative arrangement of components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise.
[0042] Application Overview
[0043] At present, the application of chips is becoming more and more extensive. For example, chips can be applied to vehicles. In this case, the chips may include but are not limited to smart driving chips, smart cockpit chips, etc.
[0044] It should be noted that the heat dissipation performance of the chip is very important for the chip and will greatly affect the reliability of the chip. For example, if the heat accumulates at the chip and the temperature is too high, the chip may not work properly. How to ensure the heat dissipation performance of the chip is a problem worthy of attention for those skilled in the art.
[0045] Exemplary Systems
[0046] In order to facilitate the understanding of the following text, the chip heat dissipation device and computer simulation technology (Computer Simulation Technology, CST) are first introduced here.
[0047] Figure 1 Schematic diagram of the structure of a chip heat dissipation device provided by some exemplary embodiments of the present disclosure. Figure 1 As shown, the chip heat dissipation device may include:
[0048] Chip 10;
[0049] A test circuit board 12 , which can be used to carry the chip 10 ;
[0050] The heat dissipation boss 14 can be used to dissipate heat for the chip 10 .
[0051] Optionally, the chip 10 may be a high power consumption chip. The chip 10 may be located in a vehicle-mounted domain controller. The test circuit board 12 may be a printed circuit board (PCB). The heat dissipation boss 14 may be a metal boss, and accordingly, the metal boss may also be referred to as a metal heat dissipation block. The chip 10, the test circuit board 12, and the heat dissipation boss 14 may be arranged in a central position.
[0052] Optionally, a heat conducting medium 15 may be sandwiched between the chip 10 and the heat dissipation boss 14. The heat conducting medium 15 may be a soft metal with good thermal conductivity, or may be a thermal conductive silicone grease, a thermal conductive gel, etc. As an example, the heat conducting medium 15 may be a two-component thermal conductive gel. By providing the heat conducting medium 15, the contact thermal resistance between the chip 10 and the heat dissipation boss 14 may be reduced.
[0053] Optionally, an adjustment pad 16 may be sandwiched between the test circuit board 12 and the heat dissipation boss 14. By selecting adjustment pads 16 of different thicknesses, the thickness of the heat conducting medium 15 may be adjusted. For example, the smaller the thickness of the adjustment pad 16, the smaller the thickness of the heat conducting medium 15 may be.
[0054] Optionally, the heat dissipation boss 14 and the adjustment gasket 16 may be wrapped with a heat-insulating member 18. The heat-insulating member 18 may be made of a heat-insulating material. The heat-insulating member 18 may be flush with the heat dissipation boss 14 in the height direction, or the heat-insulating member 18 may be higher than the heat dissipation boss 14 in the height direction. By setting the heat-insulating member 18, it is possible to ensure that the heat generated by the chip 10 is spread in the height direction as much as possible, and to avoid the heat from spreading to the surroundings as much as possible.
[0055] It is understandable that computer simulation technology is a comprehensive technology that uses the achievements of computer science and technology to build a model of the simulated system and conduct dynamic experiments on the model under certain experimental conditions. It has the advantages of high efficiency, safety, and less constraints from environmental conditions. It has become an important tool for analyzing, designing, operating, evaluating, and training systems (especially complex systems). As an example, computer simulation technology can be Computational Fluid Dynamics (CFD) simulation technology.
[0056] In the embodiment of the present disclosure, a chip heat sink can be introduced, and the chip 10, the heat dissipation boss 14, the heat conducting medium 15, etc. are taken as a whole as the basis for extracting the junction-to-shell thermal resistance. On this basis, combined with the use of computer simulation technology, the thermal design of the chip 10 can be effectively performed to obtain the heat dissipation method of the chip 10, and the rationality and reliability of the heat dissipation method of the chip 10 can be better guaranteed. In this way, it is beneficial to ensure the heat dissipation performance of the chip 10.
[0057] Exemplary Methods
[0058] Figure 2 It is a flowchart of a method for determining a heat dissipation mode provided by some exemplary embodiments of the present disclosure. Figure 2 The method shown may include step 210 , step 220 , step 230 , step 240 , step 250 , and step 260 .
[0059] Step 210 , obtaining a first temperature of a first temperature measuring element disposed on a chip in the chip heat dissipation device, and a second temperature of a second temperature measuring element disposed on a surface of a heat dissipation boss in the chip heat dissipation device facing away from the chip.
[0060] Optionally, the first temperature measuring element may be disposed inside the chip in the chip heat sink, and accordingly, the first temperature of the first temperature measuring element may be the internal temperature of the chip measured by the first temperature measuring element. Figure 1 The chip 10 in the embodiment of the present invention can be provided with a first temperature measuring element. Figure 1 At position P1 in the chip, the first temperature of the first temperature measuring element may be the temperature at position P1. The first temperature may be read by chip software.
[0061] Optionally, the surface of the heat dissipation boss in the chip heat dissipation device facing away from the chip may be the upper surface of the heat dissipation boss, and the second temperature measuring element may be arranged on the upper surface of the heat dissipation boss. Accordingly, the second temperature of the second temperature measuring element may be the upper surface temperature of the heat dissipation boss measured by the second temperature measuring element. As an example, the heat dissipation boss in the chip heat dissipation device may be Figure 1 The heat dissipation boss 14 in the embodiment of the present invention, the second temperature measuring element can be arranged at Figure 1 At position P2 in the figure, the second temperature of the second temperature measuring element may be the temperature at position P2.
[0062] Step 220, obtaining the power of the chip.
[0063] Optionally, the chip may be powered, and when the chip is powered, electrical parameters of the chip may be obtained. The obtained electrical parameters may include but are not limited to voltage, current, etc. The power of the chip may be obtained by calculation based on the obtained electrical parameters. As an example, the power of the chip may be expressed as P.
[0064] Step 230, obtaining heat dissipation characteristic parameters of the chip heat dissipation device; wherein the heat dissipation characteristic parameters are characteristic parameters that characterize the heat dissipation performance of the chip heat dissipation device.
[0065] Optionally, the heat dissipation characteristic parameter may include characteristic parameters corresponding to multiple dimensions, including but not limited to shape dimension, size dimension, material dimension, etc.
[0066] Step 240, determining a target temperature difference based on the first temperature and the second temperature.
[0067] Optionally, the first temperature and the second temperature may be subtracted to obtain a corresponding temperature difference, and the absolute value of the temperature difference may be used as the target temperature difference. As an example, the target temperature difference may be expressed as ΔT.
[0068] Of course, the method for determining the target temperature difference is not limited to this. For the sake of clarity, examples will be given later.
[0069] Step 250 , determining the junction-to-case thermal resistance of the chip heat sink based on the target temperature difference and power.
[0070] Optionally, the target temperature difference can be divided by the power to obtain a corresponding ratio, which can be used as the junction-to-case thermal resistance of the chip heat sink. Assuming that the target temperature difference is represented by ΔT, the power is represented by P, and the junction-to-case thermal resistance of the chip heat sink is represented by R, then: R = ΔT / P. It can be understood that the junction-to-case thermal resistance generally refers to the thermal resistance from junction to case. The junction-to-case thermal resistance can be represented as RJC.
[0071] Of course, the method for determining the junction-to-shell thermal resistance of the chip heat sink is not limited to this. For example, the first temperature and the second temperature can be obtained at each of the multiple time points, and on this basis, multiple target temperature differences corresponding to the multiple time points can be obtained by making a difference. The multiple target temperature differences can all be divided by the power to obtain multiple ratios corresponding to the multiple time points. Afterwards, the average value of the multiple ratios can be determined, and the determined average value can be used as the junction-to-shell thermal resistance of the chip heat sink.
[0072] Step 260 , determining the heat dissipation method of the chip based on the heat dissipation characteristic parameters and the junction-to-case thermal resistance of the chip heat dissipation device.
[0073] Optionally, when the chip heat dissipation device meets a certain heat dissipation characteristic parameter, the corresponding junction-to-case thermal resistance can be obtained by executing the above steps 210 to 250. In this way, multiple junction-to-case thermal resistances mapped one-to-one with multiple heat dissipation characteristic parameters can be obtained; wherein the multiple heat dissipation characteristic parameters can be different from each other. Next, the heat dissipation method of the chip can be determined based on the multiple heat dissipation characteristic parameters and the multiple junction-to-case thermal resistances.
[0074] Optionally, the heat dissipation method of the chip may include but is not limited to the thermal management method of the chip, the size, shape, material, etc. of the actual heat dissipation boss used to dissipate the heat of the chip. The thermal management method may be a method for adjusting and controlling the temperature of the chip. For example, if a coolant is used to dissipate the heat of the chip, the thermal management method may be used to indicate the coolant flow rate and / or the coolant inlet temperature at different temperatures. In addition, the actual heat dissipation boss used to dissipate the heat of the chip refers to the heat dissipation boss used to dissipate the heat of the chip under the actual working state of the chip. As an example, the actual working state of the chip may refer to: while the vehicle is driving on the road, the chip located in the on-board domain controller actually operates to assist the intelligent driving of the vehicle. The actual heat dissipation boss used to dissipate the heat of the chip may be different from Figure 1 The heat dissipation boss 14 in the mid-chip heat dissipation device.
[0075] In the related art, when performing thermal design on a chip, it is necessary to use the junction-to-shell thermal resistance of the chip. The junction-to-shell thermal resistance of the chip can be obtained based on the temperature difference between the internal temperature of the chip and the temperature of the outer surface of the chip. Generally speaking, the outer surface temperature of the chip is measured by a temperature measuring element arranged on the outer surface of the chip. It should be noted that the temperature difference between different areas of the outer surface of the chip is large, and the deviation between the measured outer surface temperature of the chip and the average temperature of the outer surface of the chip may be very large. Therefore, the reliability of the measured outer surface temperature of the chip is low, and accordingly, the reliability of the junction-to-shell thermal resistance of the chip is also low, which can easily affect the rationality and reliability of the thermal design results of the chip.
[0076] In the embodiments of the present disclosure, a chip heat sink can be introduced, and the junction-to-shell thermal resistance of the chip heat sink can be used for the thermal design of the chip. The junction-to-shell thermal resistance of the chip heat sink can be determined based on the target temperature difference and the power of the chip, and the target temperature difference can be determined based on the first temperature and the second temperature. The first temperature can be the internal temperature of the chip in the chip heat sink, and the second temperature can be the temperature of the surface of the heat dissipation boss in the chip heat sink facing away from the chip. It should be noted that compared with the outer surface of the chip, the temperature difference between different areas of the surface of the heat dissipation boss facing away from the chip is smaller, then the second temperature and the average temperature deviation of the surface of the heat dissipation boss facing away from the chip are smaller, therefore, the reliability of the second temperature is higher, and accordingly, the reliability of the junction-to-shell thermal resistance of the chip heat sink is also higher, which is conducive to ensuring the rationality and reliability of the thermal design results of the chip, thus, it is conducive to ensuring the rationality and reliability of the heat dissipation method of the chip, thereby helping to ensure the heat dissipation performance of the chip. In addition, it should be pointed out that under the actual working state of the chip, the heat at the chip is generally conducted away through the real heat dissipation boss (for example, conducted to the radiator), and the heat dissipation boss is provided in the chip heat dissipation device, which is equivalent to simulating the actual working state of the chip to determine the junction-to-case thermal resistance, which is beneficial to further ensure the reliability of the junction-to-case thermal resistance, thereby helping to further ensure the heat dissipation performance of the chip.
[0077] In some optional examples, the heat dissipation characteristic parameter of the chip heat dissipation device may include at least one of the following:
[0078] Boss characteristic parameters of the heat dissipation boss;
[0079] The medium characteristic parameters of the heat-conducting medium sandwiched between the chip and the heat dissipation boss.
[0080] Optionally, the boss characteristic parameters of the heat dissipation boss may include but are not limited to boss shape parameters, boss material parameters, boss size parameters, etc. The boss material parameters may include but are not limited to 6063-T5 aluminum, pure copper, etc. The boss size parameters may include but are not limited to 30mm×30mm×1mm, 30mm×30mm×3mm, 33mm×33mm×3mm, etc.
[0081] Optionally, the medium characteristic parameters of the heat-conducting medium sandwiched between the chip and the heat dissipation boss may include but are not limited to medium material, medium thickness, medium thermal conductivity, etc. The medium thickness may include but are not limited to 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, etc. The medium thermal conductivity may include but are not limited to 3 W / mK, 6 W / mK, 9 W / mK, etc.
[0082] Optionally, multiple boss material parameters, multiple boss size parameters, multiple medium thicknesses, and multiple medium thermal conductivity coefficients can be arranged and combined to obtain multiple heat dissipation characteristic parameters. By repeatedly executing the above steps 210 to 250, multiple junction-to-shell thermal resistances mapped one-to-one with multiple heat dissipation characteristic parameters can be obtained. On this basis, a mapping lookup table can be constructed with the heat dissipation characteristic parameters as search index information and the junction-to-shell thermal resistance as the search result. The mapping lookup table can be used to determine the heat dissipation method of the chip.
[0083] In one example, the mapping lookup table may include four tables, namely Table 1, Table 2, Table 3 and Table 4 below.
[0084] Medium thickness\medium thermal conductivity 3W / mK 6W / mK 9W / mK 0.2mm a11 a12 a13 0.4mm a21 a22 a23 0.6mm a31 a32 a33 0.8mm a41 a42 a43
[0085] Table 1
[0086] Table 1 shows the mapping relationship between the dielectric thickness, dielectric thermal conductivity and junction-to-case thermal resistance when the material parameters of the boss are 6063-T5 aluminum and the size parameters of the boss are 30 mm×30 mm×1 mm.
[0087] a11 to a43 in Table 1 represent the junction-to-case thermal resistance respectively.
[0088] Medium thickness\medium thermal conductivity 3W / mK 6W / mK 9W / mK 0.2mm b11 b12 b13 0.4mm b21 b22 b23 0.6mm b31 b32 b33 0.8mm b41 b42 b43
[0089] Table 2
[0090] Table 2 shows the mapping relationship between the dielectric thickness, dielectric thermal conductivity and junction-to-case thermal resistance when the material parameters of the boss are 6063-T5 aluminum and the size parameters of the boss are 30 mm×30 mm×3 mm.
[0091] b11 to b43 in Table 2 represent the junction-to-case thermal resistance respectively.
[0092] Medium thickness\medium thermal conductivity 3W / mK 6W / mK 9W / mK 0.2mm c11 c12 c13 0.4mm c21 c22 c23 0.6mm c31 c32 c33 0.8mm c41 c42 c43
[0093] Table 3
[0094] Table 3 shows the mapping relationship between dielectric thickness, dielectric thermal conductivity and junction-to-case thermal resistance when the material parameters of the boss are pure copper and the size parameters of the boss are 30 mm×30 mm×1 mm. c11 to c43 in Table 3 represent junction-to-case thermal resistances respectively.
[0095] Medium thickness\medium thermal conductivity 3W / mK 6W / mK 9W / mK 0.2mm d11 d12 d13 0.4mm d21 d22 d23 0.6mm d31 d32 d33 0.8mm d41 d42 d43
[0096] Table 4
[0097] Table 4 shows the mapping relationship between dielectric thickness, dielectric thermal conductivity and junction-to-case thermal resistance when the material parameters of the boss are pure copper and the size parameters of the boss are 33 mm×33 mm×3 mm. d11 to d43 in Table 4 represent junction-to-case thermal resistances respectively.
[0098] It can be seen from Table 1 that if the material of the heat dissipation boss is 6063-T5 aluminum, the size of the heat dissipation boss is 30mm×30mm×1mm, the thickness of the thermal conductive medium is 0.4mm, and the thermal conductivity of the thermal conductive medium is 9W / mK as the search index information, the thermal resistance of the chip heat dissipation device as the search result is a23.
[0099] It can be seen from Table 2 that if the material of the heat dissipation boss is 6063-T5 aluminum, the size of the heat dissipation boss is 30mm×30mm×3mm, the thickness of the thermal conductive medium is 0.2mm, and the thermal conductivity of the thermal conductive medium is 3W / mK, the search result shows that the thermal resistance of the chip heat dissipation device is b11.
[0100] It can be seen from Table 3 that if the material of the heat sink boss is pure copper, the size of the heat sink boss is 30mm×30mm×3mm, the thickness of the thermal conductive medium is 0.6mm, and the thermal conductivity of the thermal conductive medium is 6W / mK, the search index information is searched, and the thermal resistance of the chip heat sink as the search result is c32.
[0101] It can be seen from Table 4 that if the material of the heat sink boss is pure copper, the size of the heat sink boss is 33mm×33mm×3mm, the thickness of the thermal conductive medium is 0.8mm, and the thermal conductivity of the thermal conductive medium is 9W / mK, the search is performed as index information, and the thermal resistance of the chip heat sink as the search result is d43.
[0102] It should be noted that the heat dissipation boss is used for heat dissipation of the chip, and the relevant parameters of the heat dissipation boss will affect the heat dissipation performance of the chip. In addition, the thermal conductive medium is used for heat conduction between the chip and the heat dissipation boss, and the relevant parameters of the thermal conductive medium will affect the heat dissipation performance of the chip. In view of this, in the embodiments of the present disclosure, the heat dissipation characteristic parameters of the chip heat dissipation device may include the boss characteristic parameters of the heat dissipation boss and / or the medium characteristic parameters of the thermal conductive medium. In this way, the heat dissipation characteristic parameters and the junction-to-shell thermal resistance are used for the thermal design of the chip, which is conducive to ensuring the heat dissipation performance of the chip.
[0103] Figure 3 It is a flowchart of a method for determining a target temperature difference provided by some exemplary embodiments of the present disclosure. Figure 3 The method shown may include step 310, step 320 and step 330. Optionally, the combination of step 310 to step 330 may be used as an optional implementation of step 240 of the present disclosure.
[0104] Step 310 , performing a first preset numerical operation on first temperatures corresponding to each of a plurality of first temperature measuring elements disposed in the chip to obtain a third temperature.
[0105] Optionally, the plurality of first temperature measuring elements disposed in the chip may be represented as N first temperature measuring elements. The N first temperature measuring elements may all be disposed close to the center of the chip. The N first temperature measuring elements may respectively measure a first temperature, thereby obtaining N first temperatures. Next, a first preset numerical operation may be performed on the N first temperatures to obtain a third temperature. For example, the maximum value among the N first temperatures may be obtained as the third temperature. That is, the first preset numerical operation may be a maximum value operation.
[0106] Step 320 , performing a second preset numerical operation on the second temperatures corresponding to each of the plurality of second temperature measuring elements disposed on the surface of the heat dissipation boss facing away from the chip to obtain a fourth temperature.
[0107] Optionally, a plurality of second temperature measuring elements disposed on the surface of the heat dissipation boss facing away from the chip can be represented as M second temperature measuring elements. The M second temperature measuring elements can be arranged in sequence in the horizontal direction. The M second temperature measuring elements can respectively measure a second temperature, thereby obtaining M second temperatures. Next, a second preset numerical operation can be performed on the M second temperatures to obtain a fourth temperature. For example, the maximum value or average value of the M second temperatures can be obtained as the fourth temperature. That is, the second preset numerical operation can be a maximum value operation or a mean value operation.
[0108] Step 330, determining a target temperature difference between the third temperature and the fourth temperature.
[0109] Optionally, the third temperature and the fourth temperature may be subtracted to obtain a corresponding temperature difference, and the absolute value of the temperature difference may be used as the target temperature difference.
[0110] In the embodiment of the present disclosure, the first temperature of each of the plurality of first temperature measuring elements and the first preset numerical calculation can be combined to obtain the third temperature, and the second temperature of each of the plurality of second temperature measuring elements and the second preset numerical calculation can be combined to obtain the fourth temperature difference, and the target temperature difference can be obtained by subtracting the third temperature from the fourth temperature. In this way, the process of determining the target temperature difference uses the temperatures measured by different first temperature measuring elements and the temperatures measured by different second temperature measuring elements, which is conducive to avoiding the adverse effects caused by inaccurate measurement of a single temperature measuring element, thereby ensuring the accuracy and reliability of the determined target temperature difference.
[0111] Figure 4 It is a flowchart of a method for obtaining chip power provided by some exemplary embodiments of the present disclosure. Figure 4The method shown may include step 410 and step 420. Optionally, the combination of step 410 and step 420 may be used as an optional implementation of step 220 of the present disclosure.
[0112] Step 410 , detecting the voltage and current of the chip through a test circuit board carrying the chip in the chip heat dissipation device.
[0113] Optionally, the test circuit board may be electrically connected to the chip. The test circuit board may be used to power the chip. When the chip is powered on, the test circuit board may detect the voltage and current of the chip through the electrical connection with the chip. As an example, the voltage of the chip may be represented as U, and the current of the chip may be represented as I.
[0114] Step 420 , determining the power of the chip based on the voltage and the current.
[0115] Optionally, the voltage and current may be multiplied to obtain a corresponding product, which may be used as the power of the chip. Assuming that the voltage of the chip is represented by U, the current of the chip is represented by I, and the power of the chip is represented by P, then: P = U × I.
[0116] Of course, the method for determining the power of the chip is not limited to this. For example, the test circuit board can detect the voltage and current of the chip at each of the multiple time points, and on this basis, a plurality of products corresponding to the multiple time points can be obtained through multiplication. Then, the average value of the multiple products can be determined, and the determined average value can be used as the power of the chip.
[0117] In the embodiment of the present disclosure, the voltage and current of the chip are detected by a test circuit board carrying the chip in the chip heat dissipation device, and then the power of the chip can be determined efficiently and quickly through operation logic such as multiplication operation.
[0118] Figure 5 It is a flowchart of a method for determining a heat dissipation method provided by other exemplary embodiments of the present disclosure. Figure 5 The method shown may include step 510, step 520, step 530, step 540 and step 550. Optionally, a combination of step 510 to step 550 may be used as an optional implementation of step 260 of the present disclosure. Figure 5 In the method shown, the heat dissipation mode of the chip can be obtained based on the application of computer simulation technology. The application of computer simulation technology can be realized by running computer simulation software.
[0119] Step 510: determine target heat dissipation characteristic parameters corresponding to the chip.
[0120] Optionally, the target heat dissipation characteristic parameter corresponding to the chip may be a heat dissipation characteristic parameter selected by a user for the chip. The composition of the target heat dissipation characteristic parameter corresponding to the chip may be similar to the composition of the heat dissipation characteristic parameter of the chip heat dissipation device described above.
[0121] Step 520 , based on the heat dissipation characteristic parameters and the junction-to-case thermal resistance of the chip heat dissipation device, determine the target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameters.
[0122] As described above, by performing steps 210 to 250 multiple times, multiple junction-to-case thermal resistances mapped one-to-one with multiple heat dissipation characteristic parameters can be obtained, on which basis, a correlation relationship between the heat dissipation characteristic parameters and the junction-to-case thermal resistance can be established. Based on the established correlation relationship, the junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter can be determined, and the determined junction-to-case thermal resistance can be used as the target junction-to-case thermal resistance.
[0123] Step 530 : determining simulated heat dissipation parameters associated with the chip based on the target junction-to-case thermal resistance.
[0124] Optionally, the simulated heat dissipation parameters associated with the chip may refer to: thermal simulation parameters that need to be provided to the computer simulation software in order to assist in obtaining the heat dissipation method of the chip. The simulated heat dissipation parameters associated with the chip may include a target junction-to-shell thermal resistance. The target junction-to-shell thermal resistance may be considered to belong to chip-level thermal simulation parameters. The chip-level thermal simulation parameters may also include, for example, the packaging form of the chip, the heat dissipation distribution diagram, etc. In addition, the simulated heat dissipation parameters associated with the chip may also include, but are not limited to, board-level thermal simulation parameters, system-level thermal simulation parameters, etc.
[0125] Step 540 , performing thermal simulation on the chip based on the simulated heat dissipation parameters to obtain a simulated junction temperature corresponding to the chip.
[0126] Optionally, the drawings, dimensions, materials and other information of the real circuit board used to carry the chip, as well as the simulated heat dissipation parameters determined in step 530, can be provided to the computer simulation software, and the computer simulation software can build a model of the real circuit board based on this, simulate the working conditions represented by the simulated heat dissipation parameters, and perform dynamic experiments on the model of the real circuit board to obtain the simulated junction temperature corresponding to the chip through simulation calculation. The real circuit board can refer to: a circuit board used to carry the chip in the actual working state of the chip.
[0127] It can be understood that junction temperature usually refers to: the highest temperature of a semiconductor chip located in an electronic device, which is usually higher than the case temperature and the device surface temperature, and can be used to measure the heat dissipation capacity of the chip from the semiconductor wafer to the case.
[0128] Step 550: determine the heat dissipation method of the chip based on the simulated junction temperature.
[0129] Optionally, a preset junction temperature corresponding to the chip may be obtained, and the preset junction temperature may refer to: a maximum junction temperature pre-designed for the chip that the chip can withstand. Based on the simulated junction temperature and the maximum junction temperature, a heat dissipation method of the chip may be determined.
[0130] In one example, an initial version of the thermal management method can be determined, and the simulated heat dissipation parameters can include the thermal management method of the initial version. By subtracting the simulated junction temperature from the maximum junction temperature, a corresponding temperature difference can be obtained. Based on the obtained temperature difference, it can be evaluated whether the thermal management method of the initial version is reasonable. If the evaluation result is that the thermal management method of the initial version is unreasonable, the thermal management simulation of the initial version can be adjusted to obtain an adjusted thermal management method. Afterwards, the simulated heat dissipation parameters including the adjusted thermal management method can be re-determined, and simulation can be performed accordingly to obtain the simulated junction temperature again. By subtracting the re-obtained simulated junction temperature from the maximum junction temperature, a corresponding temperature difference can be obtained. Based on the obtained temperature difference, it can be evaluated whether the adjusted thermal management method is reasonable. The subsequent process is analogous until a more reasonable thermal management method is obtained. The heat dissipation method of the chip may include the more reasonable thermal management method.
[0131] In some embodiments, the heat dissipation method of the chip may also include the size, shape, material, etc. of the actual heat dissipation boss used to dissipate the heat of the chip.
[0132] In the embodiments of the present disclosure, the target junction-to-shell thermal resistance mapped by the target heat dissipation characteristic parameters can be reasonably determined based on the heat dissipation characteristic parameters and the junction-to-shell thermal resistance of the chip heat dissipation device. Based on the determined target junction-to-shell thermal resistance, combined with the operation of computer simulation software, the simulated junction temperature corresponding to the chip can be determined efficiently and reliably, and the heat dissipation method of the chip can be determined on this basis, and the rationality and reliability of the heat dissipation method of the chip can be better guaranteed. It can be seen that by introducing a chip heat dissipation device and then using computer simulation technology, a very effective reference can be provided for the thermal design of the chip, which is conducive to ensuring the heat dissipation performance of the chip.
[0133] Figure 6-1 4 is a flow chart of a method for determining a target junction-to-case thermal resistance provided by some exemplary embodiments of the present disclosure. Figure 6-1 The method shown may include step 610 and step 620. Optionally, the combination of step 610 and step 620 may be used as an optional implementation of step 520 of the present disclosure.
[0134] Step 610 , constructing a mapping lookup table using the heat dissipation characteristic parameters of the chip heat dissipation device as search index information and the junction-to-case thermal resistance of the chip heat dissipation device as the search result.
[0135] Optionally, by performing steps 210 to 250 multiple times, multiple junction-to-case thermal resistances mapped one-to-one with multiple heat dissipation characteristic parameters can be obtained. Then, a table can be used to reflect the correlation between the heat dissipation characteristic parameters and the junction-to-case thermal resistance, and the formed table can be used as a mapping lookup table. The mapping lookup table can refer to Tables 1 to 4 above.
[0136] Step 620 : determining the target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter based on the mapping lookup table.
[0137] In some optional embodiments of the present disclosure, Figure 6-2 As shown, step 620 may include step 6201 and step 6203.
[0138] Step 6201, based on the target heat dissipation characteristic parameters, determine the target boss characteristic parameters and the target medium characteristic parameters.
[0139] Optionally, the target heat dissipation characteristic parameters may include target boss characteristic parameters and target medium characteristic parameters. Then, the target boss characteristic parameters and target medium characteristic parameters may be extracted from the target heat dissipation characteristic parameters.
[0140] Step 6203, based on the mapping lookup table, determine the target junction-to-case thermal resistance mapped with the target boss characteristic parameters and the target medium characteristic parameters.
[0141] Optionally, a mapping lookup table may be searched. If the mapping lookup table contains a junction-to-shell thermal resistance mapped to both the target boss characteristic parameters and the target medium characteristic parameters, the junction-to-shell thermal resistance may be used as the target junction-to-shell thermal resistance. If the mapping lookup table contains a junction-to-shell thermal resistance mapped to both the target boss characteristic parameters and the target medium characteristic parameters, the junction-to-shell thermal resistance may be obtained by interpolation and may be used as the target junction-to-shell thermal resistance.
[0142] In an example, the target boss characteristic parameters indicate that the material of the heat dissipation boss is 6063-T5 aluminum, and the size is 30mm×30mm×1mm. The target medium characteristic parameters indicate that the thickness of the thermal conductive medium is 0.4mm, and the thermal conductivity of the thermal conductive medium is 9W / mK. By referring to Table 1, it can be determined that the junction-to-case thermal resistance mapped with the target boss characteristic parameters and the target medium characteristic parameters is a23. Therefore, a23 can be used as the target junction-to-case thermal resistance.
[0143] In another example, the target boss characteristic parameter indicates that the material of the heat dissipation boss is 6063-T5 aluminum, the size is 30mm×30mm×1mm, and the target medium characteristic parameter indicates that the thickness of the thermal conductive medium is 0.5mm, and the thermal conductivity of the thermal conductive medium is 9W / mK. By referring to Table 1, it can be known that under the premise that the material of the heat dissipation boss is 6063-T5 aluminum, the size is 30mm×30mm×1mm, and the thermal conductivity of the thermal conductive medium is 9W / mK, if the thickness of the thermal conductive medium is 0.4mm, the junction-to-case thermal resistance is a23, and if the thickness of the thermal conductive medium is 0.6mm, the junction-to-case thermal resistance is a33. Then, linear interpolation can be performed between a23 and a33 to obtain the junction-to-case thermal resistance when the thickness of the thermal conductive medium is 0.5mm. For example, the obtained junction-to-case thermal resistance can be the average of a23 and a33, and the average can be used as the target junction-to-case thermal resistance.
[0144] Figure 6-1 In the illustrated embodiment, a mapping lookup table can be constructed to effectively reflect the correlation between the heat dissipation characteristic parameters of the chip heat dissipation device and the junction-to-case thermal resistance. Based on the search results obtained by searching the mapping lookup table, the target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameters can be efficiently and reliably determined.
[0145] Figure 6-3 4 is a flow chart of a method for determining a target junction-to-case thermal resistance provided by some other exemplary embodiments of the present disclosure. Figure 6-3 The method shown may include step 630 and step 640. Optionally, the combination of step 630 and step 640 may be an optional implementation of step 520 of the present disclosure.
[0146] Step 630 , constructing an objective function with the heat dissipation characteristic parameter as an independent variable and the junction-to-case thermal resistance as a dependent variable.
[0147] Optionally, by performing steps 210 to 250 multiple times, multiple junction-to-case thermal resistances mapped one-to-one with multiple heat dissipation characteristic parameters can be obtained. Then, the law of the change of the junction-to-case thermal resistance with the heat dissipation characteristic parameters can be summarized to obtain a function that can reflect the law, and the function can be used as the objective function. The objective function can be a simple linear function or a more complex function. The present disclosure does not limit the specific function type of the objective function.
[0148] Step 640 : determining the target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter based on the target function.
[0149] Optionally, the target heat dissipation characteristic parameter can be substituted into the objective function as the value of the independent variable, and the objective function can obtain the corresponding value of the dependent variable through calculation, and the value can be used as the target junction-to-case thermal resistance.
[0150] Figure 6-3 In the illustrated embodiment, the correlation between the heat dissipation characteristic parameters of the chip heat dissipation device and the junction-to-case thermal resistance can be effectively reflected by constructing an objective function. By running the objective function, the target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameters can be efficiently and reliably determined.
[0151] In summary, by adopting the embodiments of the present disclosure and introducing a chip heat dissipation device, the chip, heat dissipation boss, heat conductive medium, etc. can be taken as a whole as a basis for extracting the thermal resistance of the junction-to-shell. On this basis, combined with the use of computer simulation technology, the thermal design of the chip can be effectively carried out, which is beneficial to ensuring the rationality and reliability of the thermal design results and the heat dissipation performance of the chip.
[0152] Exemplary Devices
[0153] Figure 7 It is a structural schematic diagram of a heat dissipation mode determination device provided by some exemplary embodiments of the present disclosure. Figure 7 The apparatus shown may include:
[0154] A first acquisition module 710 is used to acquire a first temperature of a first temperature measuring element disposed on a chip in the chip heat dissipation device, and a second temperature of a second temperature measuring element disposed on a surface of a heat dissipation boss in the chip heat dissipation device facing away from the chip;
[0155] A second acquisition module 720, used to acquire the power of the chip;
[0156] The third acquisition module 730 is used to acquire the heat dissipation characteristic parameters of the chip heat dissipation device; wherein the heat dissipation characteristic parameters are characteristic parameters that characterize the heat dissipation performance of the chip heat dissipation device;
[0157] A first determination module 740 is used to determine a target temperature difference based on the first temperature and the second temperature acquired by the first acquisition module 710;
[0158] A second determination module 750 is used to determine the junction-to-case thermal resistance of the chip heat dissipation device based on the target temperature difference determined by the first determination module 740 and the power obtained by the second acquisition module 720;
[0159] The third determination module 760 is used to determine the heat dissipation mode of the chip based on the heat dissipation characteristic parameters obtained by the third acquisition module 730 and the junction-to-case thermal resistance determined by the second determination module 750 .
[0160] In some optional examples, the heat dissipation characteristic parameter includes at least one of the following:
[0161] Boss characteristic parameters of the heat dissipation boss;
[0162] The medium characteristic parameters of the heat-conducting medium sandwiched between the chip and the heat dissipation boss.
[0163] In some optional examples, such as Figure 8 As shown, the first determination module 740 includes:
[0164] A first operation submodule 810 is used to perform a first preset numerical operation on first temperatures corresponding to each of a plurality of first temperature measuring elements disposed in the chip to obtain a third temperature;
[0165] A second operation submodule 820 is used to perform a second preset numerical operation on the second temperatures corresponding to the plurality of second temperature measuring elements disposed on the surface of the heat dissipation boss facing away from the chip, to obtain a fourth temperature;
[0166] The first determination submodule 830 is used to determine a target temperature difference between the third temperature obtained by the first operation submodule 810 and the fourth temperature obtained by the second operation submodule 820 .
[0167] In some optional examples, such as Fig. 9 As shown, the second acquisition module 720 includes:
[0168] A detection submodule 910, used to detect the voltage and current of the chip through a test circuit board carrying the chip in the chip heat dissipation device;
[0169] The second determination submodule 920 is used to determine the power of the chip based on the voltage and current detected by the detection submodule 910 .
[0170] In some optional examples, such as Fig.10 As shown, the third determination module 760 includes:
[0171] The third determination submodule 1010 is used to determine the target heat dissipation characteristic parameters corresponding to the chip;
[0172] A fourth determination submodule 1020 is used to determine a target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter determined by the third determination submodule 1010 based on the heat dissipation characteristic parameter obtained by the third acquisition module 730 and the junction-to-case thermal resistance determined by the second determination module 750;
[0173] A fifth determination submodule 1030, configured to determine a simulation heat dissipation parameter associated with the chip based on the target junction-to-case thermal resistance determined by the fourth determination submodule 1020;
[0174] The simulation module 1040 is used to perform thermal simulation on the chip based on the simulated heat dissipation parameters determined by the fifth determination submodule 1030 to obtain a simulated junction temperature corresponding to the chip;
[0175] The sixth determination submodule 1050 is used to determine the heat dissipation method of the chip based on the simulated junction temperature obtained by the simulation module 1040.
[0176] In some optional examples, such as Figure 11-1 As shown, the fourth determining submodule 1020 includes:
[0177] A first construction unit 1110 is configured to construct a mapping lookup table using the heat dissipation characteristic parameters obtained by the third acquisition module 730 as search index information and the junction-to-case thermal resistance determined by the second determination module 750 as a search result;
[0178] The first determining unit 1120 is configured to determine, based on the mapping lookup table constructed by the first constructing unit 1110 , a target junction-to-case thermal resistance mapped to the target heat dissipation characteristic parameter determined by the third determining submodule 1010 .
[0179] In some optional examples, such as Figure 11-2 As shown, the fourth determining submodule 1020 includes:
[0180] A second construction unit 1130 is used to construct an objective function using the heat dissipation characteristic parameter obtained by the third acquisition module 730 as an independent variable and the junction-to-case thermal resistance determined by the second determination module 750 as a dependent variable;
[0181] The second determining unit 1140 is configured to determine, based on the objective function constructed by the second constructing unit 1130 , a target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter determined by the third determining submodule 1010 .
[0182] In the device of the present disclosure, the various optional embodiments, optional implementation methods and optional examples disclosed above can be flexibly selected and combined as needed to achieve corresponding functions and effects, and the present disclosure does not list them one by one.
[0183] Exemplary Electronic Devices
[0184] Fig.12 The block diagram of an electronic device according to an embodiment of the present disclosure is illustrated. The electronic device 1200 includes one or more processors 1210 and a memory 1220 .
[0185] The processor 1210 may be a central processing unit (CPU) or other forms of processing units having data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device 1200 to perform desired functions.
[0186] The memory 1220 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. Volatile memory may include, for example, random access memory (RAM) and / or cache memory (cache), etc. Non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium, and the processor 1210 may execute one or more computer program instructions to implement the methods of the various embodiments of the present disclosure described above and / or other desired functions.
[0187] In one example, the electronic device 1200 may further include: an input device 1230 and an output device 1240 , and these components are interconnected via a bus system and / or other forms of connection mechanisms (not shown).
[0188] The input device 1230 may also include, for example, a keyboard, a mouse, etc.
[0189] The output device 1240 can output various information to the outside, and may include, for example, a display, a speaker, a printer, a communication network and its connected remote output device, etc.
[0190] Of course, to simplify, Fig.12 Only some of the components related to the present disclosure in the electronic device 1200 are shown, and components such as a bus, an input / output interface, etc. are omitted. In addition, according to specific application situations, the electronic device 1200 may also include any other appropriate components.
[0191] Exemplary computer program products and computer-readable storage media
[0192] In addition to the above-mentioned methods and devices, an embodiment of the present disclosure may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present disclosure described in the above-mentioned "Exemplary Method" section of this specification.
[0193] The computer program product may be written in any combination of one or more programming languages to write program code for performing the operations of the disclosed embodiments, including object-oriented programming languages such as Java, C++, etc., and conventional procedural programming languages such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.
[0194] In addition, an embodiment of the present disclosure may also be a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, enables the processor to execute the steps of the method according to various embodiments of the present disclosure described in the above “Exemplary Method” section of this specification.
[0195] The computer readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can include, for example, but is not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.
[0196] The basic principles of the present disclosure are described above in conjunction with specific embodiments. However, the advantages, strengths, effects, etc. mentioned in the present disclosure are only examples and not limitations. It cannot be considered that these advantages, strengths, effects, etc. must be possessed by each embodiment of the present disclosure. The specific details disclosed above are only for the purpose of illustration and ease of understanding, not limitation. The above details do not limit the present disclosure to being implemented by adopting the above specific details.
[0197] Those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present disclosure claims and their equivalents, the present disclosure is also intended to include these modifications and variations.
Claims
1. A method for determining a heat dissipation method, comprising: Acquire a first temperature of a first temperature measuring element disposed in a chip in a chip heat dissipation device, and a second temperature of a second temperature measuring element disposed on a surface of a heat dissipation boss in the chip heat dissipation device facing away from the chip; obtaining the power of the chip; Acquire heat dissipation characteristic parameters of the chip heat dissipation device; wherein the heat dissipation characteristic parameters are characteristic parameters that characterize the heat dissipation performance of the chip heat dissipation device; determining a target temperature difference based on the first temperature and the second temperature; Determining a junction-to-case thermal resistance of the chip heat sink based on the target temperature difference and the power; Based on the heat dissipation characteristic parameters and the junction-to-case thermal resistance, a heat dissipation method of the chip is determined.
2. The method according to claim 1, wherein: The heat dissipation characteristic parameter includes at least one of the following: Boss characteristic parameters of the heat dissipation boss; Medium characteristic parameters of the heat-conducting medium sandwiched between the chip and the heat dissipation boss.
3. The method according to claim 1 or 2, wherein: The determining a target temperature difference based on the first temperature and the second temperature includes: Performing a first preset numerical operation on the first temperatures corresponding to each of the plurality of first temperature measuring elements disposed in the chip to obtain a third temperature; Performing a second preset numerical calculation on the second temperatures corresponding to each of the plurality of second temperature measuring elements disposed on the surface of the heat dissipation boss facing away from the chip to obtain a fourth temperature; A target temperature difference between the third temperature and the fourth temperature is determined.
4. The method according to claim 1 or 2, wherein: The obtaining the power of the chip includes: Detecting the voltage and current of the chip through a test circuit board carrying the chip in the chip heat dissipation device; Based on the voltage and the current, the power of the chip is determined.
5. The method according to claim 1 or 2, wherein: The determining the heat dissipation mode of the chip based on the heat dissipation characteristic parameter and the junction-to-case thermal resistance includes: Determining target heat dissipation characteristic parameters corresponding to the chip; Based on the heat dissipation characteristic parameter and the junction-to-case thermal resistance, determining a target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter; Determining a simulated heat dissipation parameter associated with the chip based on the target junction-to-case thermal resistance; Based on the simulated heat dissipation parameters, thermal simulation is performed on the chip to obtain a simulated junction temperature corresponding to the chip; Based on the simulated junction temperature, a heat dissipation method of the chip is determined.
6. The method according to claim 5, wherein: The step of determining the target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter based on the heat dissipation characteristic parameter and the junction-to-case thermal resistance comprises: Constructing a mapping lookup table using the heat dissipation characteristic parameter as search index information and the junction-to-case thermal resistance as the search result; Based on the mapping lookup table, a target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter is determined.
7. The method according to claim 5, wherein: The step of determining the target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter based on the heat dissipation characteristic parameter and the junction-to-case thermal resistance comprises: Constructing an objective function with the heat dissipation characteristic parameter as an independent variable and the junction-to-case thermal resistance as a dependent variable; Based on the objective function, a target junction-to-case thermal resistance mapped by the target heat dissipation characteristic parameter is determined.
8. A device for determining a heat dissipation mode, comprising: A first acquisition module, used to acquire a first temperature of a first temperature measuring element disposed on a chip in the chip heat dissipation device, and a second temperature of a second temperature measuring element disposed on a surface of a heat dissipation boss in the chip heat dissipation device facing away from the chip; A second acquisition module, used to acquire the power of the chip; A third acquisition module is used to acquire heat dissipation characteristic parameters of the chip heat dissipation device; wherein the heat dissipation characteristic parameters are characteristic parameters that characterize the heat dissipation performance of the chip heat dissipation device; A first determining module, configured to determine a target temperature difference based on the first temperature and the second temperature acquired by the first acquiring module; a second determining module, configured to determine a junction-to-case thermal resistance of the chip heat dissipation device based on the target temperature difference determined by the first determining module and the power acquired by the second acquiring module; The third determination module is used to determine the heat dissipation mode of the chip based on the heat dissipation characteristic parameter obtained by the third acquisition module and the junction-to-case thermal resistance determined by the second determination module.
9. A computer-readable storage medium storing a computer program, wherein the computer program is used to execute the heat dissipation mode determination method according to any one of claims 1 to 7.
10. An electronic device, comprising: processor; a memory for storing instructions executable by the processor; The processor is used to read the executable instructions from the memory and execute the instructions to implement the heat dissipation method determination method described in any one of claims 1-7.