Automatic adhesive film packaging equipment

Abstract

The invention provides automatic adhesive film packaging equipment. The automatic adhesive film packaging equipment comprises an upper film pressing assembly (1) and a lower film pressing assembly (2), wherein the upper film pressing assembly (1) comprises an upper film vacuumizing device (2); the lower film pressing assembly (3) is matched with the upper film pressing assembly (1) to form a film pressing cavity (6) for pressing the adhesive film (4) and the bare crystal module (5), the upper film vacuumizing device (2) is communicated with the film pressing cavity (6), the lower film pressing assembly (3) comprises a lower pressing mold (7), and the lower pressing mold and the upper film pressing assembly are pressed to press the adhesive film (4) and the bare crystal module (5). According to the automatic adhesive film packaging equipment, the packaging efficiency can be improved, and the stability of the product quality can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of motors, and in particular to an automatic adhesive film packaging device. Background Art

[0002] Direct display is a display that presents high-quality images to consumers and professionals. It has high contrast, high brightness, and high fidelity display quality. In particular, the backlit display has high brightness, high color gamut, high contrast, and low glare. It is currently widely used in computers, TVs, mobile phones, car displays, etc. In recent years, direct display has become the mainstream trend of display screens due to its advantages of being thin, light, and space-saving, and consuming less energy, especially in portable products such as laptops, tablets, and mobile phones.

[0003] Mini LED is a type of LED that can be miniaturized for display and can also be used for direct display. Mini LED has high brightness and rich colors. It can also be used as a display module alone or combined into a large-screen display module. It can be used in interactive TVs, data displays, automotive screens, etc.

[0004] Mini LED direct display screen adopts modular splicing technology. Its uniqueness lies in that the surface of the module is not covered with a liquid crystal layer, but relies on the combination of the color of the module substrate and the outer packaging film to present a deep black. Among the many packaging technologies, the film packaging process stands out and has become the mainstream choice in the industry with its simplified process, efficient output speed, high finished product qualification rate, and excellent color uniformity. Despite this, most of the existing film packaging processes rely on manual lamination and then compression by a film pressing machine. This method not only limits production efficiency, but also introduces instability in product quality due to variables in human operation. Summary of the invention

[0005] The main purpose of the present invention is to provide an automated film packaging device, which can improve packaging efficiency and improve the stability of product quality.

[0006] In order to achieve the above object, according to one aspect of the present invention, there is provided an automated film packaging device, comprising:

[0007] An upper film pressing assembly, including an upper die vacuuming device;

[0008] The lower film pressing assembly cooperates with the upper film pressing assembly to form a film pressing cavity for pressing the adhesive film and the bare crystal module. The upper mold vacuum pumping device is connected to the film pressing cavity. The lower film pressing assembly includes a lower pressing mold. The lower pressing mold and the upper film pressing assembly are pressed together to press the adhesive film and the bare crystal module.

[0009] Furthermore, the lower film pressing assembly also includes a laser cutting assembly, and an optical path structure for transmitting the laser of the laser cutting assembly to the film pressing cavity is formed on the lower pressing mold. The laser cutting assembly can use the optical path structure to cut the completed film and bare crystal module.

[0010] Furthermore, the lower pressing mold includes a pressing block, which is made of a light-transmitting material and forms an optical path structure.

[0011] Furthermore, the lower pressing mold includes a pressing block, a light-transmitting structure and a shell. The light-transmitting structure is located between the pressing block and the shell, and the light-transmitting structure forms an optical path structure.

[0012] Furthermore, the lower film pressing assembly also includes a lower die vacuum pumping device, which is connected to the film pressing cavity and is arranged on the inner peripheral side of the cutting path of the laser cutting assembly.

[0013] Furthermore, the laser cutting assembly includes a laser cutting head, which is arranged on the outside of the lower die and can transmit the laser to the position to be cut using the optical path structure.

[0014] Furthermore, the cutting laser beam of the laser cutting head is an annular laser beam, and the shape of the annular laser beam is adapted to the shape of the laminated adhesive film and the bare die module to be cut.

[0015] Furthermore, the cutting laser beam of the laser cutting head is a point-shaped laser beam, and the laser cutting assembly also includes a motion device, on which the laser cutting head is arranged, and the motion device drives the laser cutting head to move along a cutting track.

[0016] Furthermore, the upper film pressing assembly also includes a heating device, which is arranged on the pressing side of the upper film pressing assembly and heats and presses the adhesive film onto the bare crystal module.

[0017] Furthermore, the automated film packaging equipment also includes a conveying device, which includes at least one group of conveyor belts, one group of conveyor belts includes two conveyor belts arranged opposite to each other, the lower film pressing assembly is located between the two conveyor belts, and can move from under the two conveyor belts to the film pressing position.

[0018] Furthermore, the spacing between two conveyor belts in a group of conveyor belts located at the film pressing position is adjustable. In the process of the lower film pressing assembly moving upward to the film pressing position, the two conveyor belts in a group of conveyor belts located at the film pressing position move away from each other to form an avoidance space. The width of the avoidance space is greater than the width of the lower film pressing assembly in the width direction of the avoidance space. After the lower film pressing assembly completes film pressing, the two conveyor belts in a group of conveyor belts located at the film pressing position move closer to each other, and support and transport the film and bare crystal module that have completed film pressing.

[0019] Furthermore, the lower membrane pressing assembly also includes a telescopic lifting block, which is arranged on the membrane pressing side of the lower membrane pressing assembly. The telescopic lifting block extends and lifts the bare crystal module when the lower membrane pressing assembly is performing membrane pressing, and retracts after the lower membrane pressing assembly completes membrane pressing. When the telescopic lifting block lifts the bare crystal module, a spacing space is formed under the bare crystal module for the conveyor belt to enter.

[0020] By applying the technical solution of the present invention, the automated film packaging equipment includes: an upper film pressing assembly, including an upper mold vacuum pumping device; a lower film pressing assembly, which cooperates with the upper film pressing assembly to form a film pressing cavity for pressing the film and the bare crystal module, the upper mold vacuum pumping device is connected to the film pressing cavity, and the lower film pressing assembly includes a lower die, and the lower die and the upper film pressing assembly are pressed together to press the film and the bare crystal module. When the automated film packaging equipment performs automated film packaging, the lower die can cooperate with the upper film pressing assembly to press the film and the bare crystal module. During the film pressing process, the upper mold vacuum pumping device can be used to vacuum the film pressing cavity located in the upper film pressing assembly, and the negative pressure effect can be used to make the film adhere to the die surface of the film pressing cavity located in the upper film pressing assembly, thereby ensuring the film pressing flatness of the film, improving the film pressing efficiency and film pressing effect, improving the packaging efficiency, and improving the stability of product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 A schematic diagram of the structure of a bare die module is shown;

[0023] Figure 2 The schematic diagram of the structure of the finished module is shown;

[0024] Figure 3 A schematic structural diagram of an automated film packaging device according to an embodiment of the present invention is shown;

[0025] Figure 4 A diagram showing a film pressing process of an automated film packaging device according to an embodiment of the present invention;

[0026] Figure 5 A diagram showing a cutting process of an automated film packaging device according to an embodiment of the present invention;

[0027] Figure 6 A cutting completion diagram of the automated film packaging equipment according to an embodiment of the present invention is shown;

[0028] Figure 7 It shows a matching structure diagram of the automated film packaging equipment of an embodiment of the present invention when the lower film pressing assembly does not lift up the bare die module;

[0029] Figure 8 A diagram showing the coordination structure of the automated film packaging equipment according to an embodiment of the present invention when the lower film pressing assembly is in the film pressing position; and

[0030] Fig. 9 The figure shows the exploded structure of the automatic adhesive film packaging equipment according to the embodiment of the present invention after the film pressing is completed.

[0031] The above drawings include the following reference numerals:

[0032] 1. Upper film pressing assembly; 2. Upper die vacuum extraction device; 3. Lower film pressing assembly; 4. Adhesive film; 41. Bottom surface protective film; 42. Mist layer; 43. Black layer; 44. Surface protective film; 5. Bare crystal module; 51. Substrate; 52. LED chip; 6. Film pressing cavity; 7. Lower die; 8. Laser cutting assembly; 9. Press block; 10. Shell; 11. Lower die vacuum extraction device; 12. Laser cutting head; 13. Heating device; 14. Conveying device; 15. Conveyor belt; 16. First winding device; 17. Second winding device; 18. Finished product module; 19. Telescopic lifting block; 20. First layer; 21. Second layer; 20. Third layer. DETAILED DESCRIPTION

[0033] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0034] See also Figures 1 to 9 As shown, according to an embodiment of the present invention, the automated film packaging equipment includes: an upper film pressing assembly 1, including an upper mold vacuum pumping device 2; a lower film pressing assembly 3, cooperating with the upper film pressing assembly 1 to form a pressing cavity 6 for pressing the film 4 and the bare crystal module 5, the upper mold vacuum pumping device 2 is connected to the pressing cavity 6, the lower film pressing assembly 3 includes a lower pressing mold 7, and the lower pressing mold 7 is pressed together with the upper film pressing assembly 1 to press the film 4 and the bare crystal module 5.

[0035] When the automated film packaging equipment performs automated film packaging, the lower die 7 can cooperate with the upper film pressing component 1 to press the film 4 and the bare crystal module 5. During the film pressing process, the upper die vacuum pumping device 2 can be used to evacuate the film pressing cavity 6 located in the upper film pressing component 1, and the negative pressure effect can be used to make the film 4 fit onto the die surface of the film pressing cavity 6 located in the upper film pressing component 1, thereby ensuring the film pressing flatness of the film 4, improving the film pressing efficiency and film pressing effect, improving the packaging efficiency, and improving the stability of product quality.

[0036] Since the film pressing process in the film packaging process is automatically completed by the upper film pressing component and the lower film pressing component without manual operation, the automation of film packaging is realized, which effectively reduces labor costs, improves packaging efficiency, and can improve the consistency of film packaging and improve packaging quality.

[0037] In one embodiment, the lower film pressing assembly 3 also includes a laser cutting assembly 8. An optical path structure is formed on the lower pressing mold 7 for transmitting the laser of the laser cutting assembly 8 to the film pressing cavity 6. The laser cutting assembly 8 can use the optical path structure to cut the completed film 4 and bare crystal module 5.

[0038] After the lamination is completed, the laser cutting component can be used to cut the laminated film 4 and the bare crystal module 5 at the lamination position. Since the laser cutting component can use the optical path structure on the lower die 7 to perform laser transmission to achieve the cutting of the laminated film, the laminated film 4 and the bare crystal module 5 will not be blocked by the lower die 7 during the cutting process. The laminated film 4 and the bare crystal module 5 can be cut directly during the lamination process, and there is no need to make the laminated film 4 and the bare crystal module 5 walk out of the lamination area before performing sheet cutting. Therefore, continuous roll supply and cutting of the film material can be achieved, which effectively improves the film packaging efficiency, improves the cornea use efficiency, reduces the waste of resources and cost expenditure caused by extra cutting during the sheet cutting process, and improves the stability of product quality.

[0039] In this embodiment, the film pressing and film cutting processes in the film packaging process are automatically completed by the upper film pressing assembly and the lower film pressing assembly without manual operation, thereby realizing the automation of film packaging, effectively reducing labor costs, improving packaging efficiency, and being able to improve the consistency of film packaging and improve packaging quality.

[0040] See also Figures 3 to 6 As shown, in one embodiment, the lower pressing mold 7 includes a pressing block 9, which is made of a light-transmitting material and forms an optical path structure.

[0041] In this embodiment, the lower die 7 can be made of a transparent material as a pressing block 9, or it can include a shell 10 and a pressing block 9. The pressing block 9 is made of a transparent material. This design enables the pressing block 9 to form an optical path for transmitting lasers, and the laser of the laser cutting component 8 can cut the film through the optical path structure.

[0042] Since the laser cutting component 8 and the pressing block 9 made of transparent material are used to cut the film, the laser cutting component 8 can be set on the outside of the pressing block 9, and the light transmittance of the pressing block 9 can be used to realize the long-distance cutting of the film 4 by the laser cutting component 8, which will not affect the structural design of the pressing block 9 itself. This structure ensures that the cutting structure of the film 4 will not affect the crimping cooperation between the film 4 and the bare crystal module 5, and also avoids the interference of the structure of the lower pressing mold 7 with the film cutting. Therefore, the crimping between the film 4 and the bare crystal module 5 and the cutting of the film 4 can be carried out at the lamination position, without the need to cut the film into sheets after the lamination is completed, and the continuous roll supply and cutting of the film can be realized, thereby significantly improving the efficiency of film use and reducing the waste of resources and cost expenditure caused by additional cutting.

[0043] In one embodiment, the lower pressing mold 7 includes a pressing block 9, a light-transmitting structure and a shell 10. The light-transmitting structure is located between the pressing block 9 and the shell 10, and the light-transmitting structure forms an optical path structure.

[0044] In this embodiment, the lower die 7 includes a pressing block 9 located in the middle, an outer shell 10 located on the periphery, and a light-transmitting structure located between the pressing block 9 and the outer shell 10. The outer shell 10 and the pressing block 9 are connected as a whole through the light-transmitting structure. The light-transmitting structure can extend from the laser projection position of the lower die 7 to the film cutting position, thereby ensuring that the laser can effectively cut the film through the light-transmitting structure.

[0045] The light-transmitting material forming the optical path structure is, for example, quartz, glass, optical fiber, optical plastic, etc.

[0046] In one embodiment, the lower film pressing assembly 3 further includes a lower die vacuum pumping device 11 , which is connected to the film pressing cavity 6 and is disposed on the inner peripheral side of the cutting path of the laser cutting assembly 8 .

[0047] For the upper film pressing component 1, an upper mold vacuum pumping device 2 is provided on it. The function of the upper mold vacuum pumping device 2 is that when the upper film pressing component 1 cooperates with the lower film pressing component 3 to press the adhesive film 4 and the bare crystal module 5, the upper mold vacuum pumping device 2 can be used to vacuum the film pressing cavity 6. Since the film pressing cavity 6 is divided into an upper and lower cavity by the adhesive film 4, the negative pressure generated by the upper mold vacuum pumping device 2 when vacuuming mainly acts on the surface of the adhesive film 4 away from the bare crystal module 5, so that the surface of the adhesive film 4 away from the bare crystal module 5 can be fitted with the upper pressing mold of the upper film pressing component 1, thereby avoiding bubbling and wrinkling during the film pressing process and improving the film pressing quality.

[0048] As for the lower film pressing component 3, a lower mold vacuum pumping device 11 is provided on it. The function of the lower mold vacuum pumping device 11 is that when the upper film pressing component 1 cooperates with the lower film pressing component 3 to press the adhesive film 4 and the bare crystal module 5, the lower mold vacuum pumping device 11 can be used to vacuum the film pressing cavity 6. Since the film pressing cavity 6 is divided into an upper and lower cavity by the adhesive film 4, the negative pressure generated by the upper mold vacuum pumping device 2 when vacuuming mainly acts on the surface of the adhesive film 4 close to the bare crystal module 5, so that the surface of the adhesive film 4 close to the bare crystal module 5 can be tightly fitted with the bare crystal module 5, thereby ensuring the fitting quality between the adhesive film 4 and the bare crystal module 5.

[0049] Since the lower mold vacuum device 11 is arranged on the inner peripheral side of the cutting path of the laser cutting assembly 8, it will not interfere with the cutting path of the laser cutting assembly 8, thereby ensuring that the laser cutting assembly 8 can smoothly complete the film cutting.

[0050] See also Figures 3 to 9 As shown, in one embodiment, the laser cutting assembly 8 includes a laser cutting head 12, which is disposed outside the lower die 7 and can transmit the laser to the position to be cut using an optical path structure.

[0051] In this embodiment, the design of the laser cutting head 12 can determine the shape of the laser beam, so the laser cutting head 12 can be reasonably designed as needed to improve cutting efficiency and cutting quality. The laser cutting head 12 is the output end of the laser, which is arranged on the outside of the lower die 7 and corresponds to the optical path structure. After the laser is emitted from the laser cutting head 12, it can reach the location of the adhesive film 4 through the optical path structure to accurately cut the adhesive film 4.

[0052] In one embodiment, the cutting laser beam of the laser cutting head 12 is an annular laser beam, and the shape of the annular laser beam is adapted to the shapes of the laminated adhesive film 4 and the bare die module 5 to be cut.

[0053] In this embodiment, since the shape of the laser beam is adapted to the shapes of the laminated adhesive film 4 and the bare die module 5 to be cut, the laser cutting assembly 8 does not need to be moved, and the laser beam can be directly used to cut the adhesive film 4 to obtain the desired cutting structure. The laser cutting assembly 8 of this structure has a higher cutting efficiency, because no moving device is required, so the structure is relatively simpler and the cost is lower.

[0054] In one embodiment, the cutting laser beam of the laser cutting head 12 is a strip-shaped laser beam.

[0055] In one embodiment, the cutting laser beam of the laser cutting head 12 is a point laser beam, and the laser cutting assembly 8 further includes a motion device, on which the laser cutting head 12 is disposed, and the motion device drives the laser cutting head 12 to move along a cutting trajectory.

[0056] In this embodiment, when the cutting laser beam is a point laser beam, it is necessary to control the point laser beam to move along a preset trajectory during cutting, so as to cut the adhesive film 4 along the preset trajectory, so that the adhesive film 4 can form a good matching effect with the bare crystal module 5, and at the same time will not cause waste of the adhesive film 4, thereby effectively improving the utilization efficiency of the adhesive film 4.

[0057] In one embodiment, the laser cutting assembly 8 includes a mounting frame, on which a slide rail is provided, the track path of the slide rail is consistent with the cutting path, the laser cutting head 12 is slidably provided on the slide rail, and the slide rail guides the sliding of the laser cutting head 12 to ensure the cutting accuracy of the laser cutting head 12 on the film 4. The motion device includes a mounting seat, a drive motor and a gear, wherein the mounting seat is slidably provided in the slide rail, a rack is provided on the outer edge of the slide rail corresponding to the gear, the drive motor is fixedly provided on the mounting seat, the gear is provided on the output shaft of the drive motor and meshes with the rack. When cutting the film 4, the drive motor drives the gear to rotate, so that the gear can mesh with the rack, driving the laser cutting head 12 to move along the guide of the slide rail.

[0058] In one embodiment, the laser cutting assembly 8 includes a mounting frame, a linear motor is disposed on the mounting frame, and the laser cutting head 12 is disposed on a mover of the linear motor.

[0059] In one embodiment, the upper film pressing assembly 1 further includes a heating device 13 , which is disposed on the pressing side of the upper film pressing assembly 1 and heats and presses the adhesive film 4 onto the bare die module 5 .

[0060] In this embodiment, during the lamination process, the heating device 13 simultaneously provides heating to the adhesive film 4, so that the adhesive film 4 can be thermally pressed with the bare die module 5, thereby improving the pressing efficiency and bonding strength.

[0061] The heating device 13 may be an electric heating wire, or a PTC heater or the like.

[0062] See also Figures 3 to 6 As shown, in one embodiment, the automated film packaging equipment also includes a conveying device 14, the conveying device 14 includes at least one group of conveyor belts, one group of conveyor belts includes two conveyor belts 15 arranged opposite to each other, the lower film pressing assembly 3 is located between the two conveyor belts 15, and can move from under the two conveyor belts 15 to the film pressing position.

[0063] In this embodiment, the conveying device 14 includes multiple groups of conveyor belts, each group of conveyor belts includes two parallel conveyor belts 15, and a gap is formed between the two conveyor belts 15, so that the lower film pressing assembly 3 can be lifted up through the gap between the two conveyor belts 15, and the bare crystal module 5 falls into the film pressing cavity 6 of the lower film pressing assembly 3, and the bare crystal module 5 is ejected and positioned to facilitate subsequent film pressing.

[0064] In one embodiment, the spacing between two parallel conveyor belts 15 in a group of conveyor belts located at the film pressing position is adjustable. In the process of the lower film pressing assembly moving upward to the film pressing position, the conveyor belts 15 in the two parallel conveyor belts in the group of conveyor belts located at the film pressing position move away from each other to form an escape space. The width of the escape space is greater than the width of the lower film pressing assembly in this direction. After the lower film pressing assembly completes film pressing, the two parallel conveyor belts 15 in the group of conveyor belts located at the film pressing position move closer to each other to support and transport the film 4 and bare crystal module 5 that have completed film pressing.

[0065] In this embodiment, the distance between two parallel conveyor belts 15 in a group of conveyor belts located at the film pressing position is set to be adjustable, and the distance between the two parallel conveyor belts 15 in the conveyor belts can be controlled according to the different stages of the film packaging. This can ensure that the conveyor belts 15 support and convey the bare crystal module 5 when the group of conveyor belts are conveying, and can also avoid the conveyor belts 15 from interfering with the lifting and lowering movement of the lower film pressing assembly 3 when the film 4 and the bare crystal module 5 are pressed, thereby ensuring the smooth transportation of the bare crystal module 5 before and after the film pressing, and the smooth film pressing during the film pressing process.

[0066] In one embodiment, the conveying device 14 also includes an installation shaft and a rotating shaft, wherein the rotating shaft is arranged at both ends of the installation shaft and is positioned and supported by the installation shaft. The rotating shaft adopts a telescopic structure, and a telescopic cylinder or a gear rack matching mechanism can be arranged inside the rotating shaft to realize the telescopic control of the rotating shaft. The conveyor belt 15 is wound around the two rotating shafts, and the spacing is adjusted under the telescopic action of the rotating shaft. When film pressing is required, the conveyor belt 15 stops transmitting and the rotating shaft stops rotating. The telescopic mechanism is used to control the extension of the rotating shaft to drive the conveyor belts 15 at both ends to move away from each other, thereby forming an avoidance space for avoiding the lower film pressing assembly 3, ensuring that the lifting and lowering of the lower film pressing assembly 3 can be smoothly implemented.

[0067] See also Figures 7 to 9As shown, in one embodiment, the lower film pressing assembly further includes a telescopic lifting block 19, which is disposed on the film pressing side of the lower film pressing assembly 3. The telescopic lifting block 19 extends out and lifts up the bare crystal module 5 when the lower film pressing assembly is performing film pressing, and retracts after the lower film pressing assembly completes film pressing. When the telescopic lifting block 19 lifts up the bare crystal module 5, a spacing space is formed under the bare crystal module 5 for the conveyor belt 15 to enter.

[0068] In the present embodiment, the telescopic lifting block 19 is telescopically arranged in the film pressing cavity 6 of the lower film pressing component 3, and a vacuum plate is arranged in the film pressing cavity 6, and a vacuum hole is opened on the vacuum plate. When the film is pressed, the bare crystal module 5 is located in the film pressing cavity 6 of the lower film pressing component 3, and the lower surface is in contact with the vacuum plate. Under the negative pressure of the vacuum hole, it is adsorbed and fixed on the vacuum plate. A through hole is opened on the vacuum plate for the telescopic lifting block 19 to pass through. The telescopic lifting block 19 can be retracted to the bottom of the vacuum plate to avoid obstruction to the vacuum in the film pressing cavity 6. The telescopic lifting block 19 can also extend out of the film pressing cavity 6 to push the bare crystal module 5 out of the film pressing cavity 6. The extending height of the telescopic lifting block 19 is higher than the top of the film pressing cavity 6, thereby forming a spacing space between the bare crystal module 5 and the top of the side wall of the film pressing cavity 6. When the two parallel conveyor belts 15 at both ends approach each other, they can move from the spacing space to the bottom of the bare crystal module 5, thereby supporting the bare crystal module 5, so that the bare crystal module 5 that has completed the film pressing is detached from the lower film pressing assembly 3, which is convenient for the subsequent transportation work.

[0069] The multiple conveyor belts of the conveying device 14 are sequentially arranged along the conveying direction of the bare crystal module 5 to realize the feeding and transmission of the bare crystal module 5 and the discharging and transmission of the finished product module 18 formed by the adhesive film 4 and the bare crystal module 5 after the film pressing.

[0070] See also Figure 1 As shown, in the automated film packaging process, the bare die module 5 includes a substrate 51 and an LED chip 52, and the LED chip is exposed on the substrate 51. By pressing or sticking a film on the surface of the substrate 51, the LED chip is protected and the overall consistency is improved.

[0071] See also Figure 2 As shown, the adhesive film covering the LED chip includes a three-layer structure. Along the direction gradually approaching the LED chip 52, the first layer is the AG / AR layer 45, the material of which is not limited to colloid, PET, etc., and it is a carrier that can carry AG / AR particles; the second layer is the black layer 43, the material of which is not limited to silicone, UV glue, etc., and it is a carrier that can carry carbon black particles; the third layer is the mist layer 42, the material of which is not limited to silicone, UV glue, etc., and it is a material with bonding properties.

[0072] When the adhesive film 4 is in the state of being rolled up, the adhesive film 4 includes a bottom protective film 41, a fog layer 42, a black layer 43, an AG / AR layer 45 and a surface protective film 44. The adhesive film 4 is wound on the unwinding wheel. During the unwinding process, the bottom protective film 41 of the adhesive film 4 is wound on the first winding device 16, so that the fog layer 42 covered by the bottom protective film 41 is exposed, and then the adhesive film 4 continues to be transported forward. When it reaches the lamination position, the fog layer 42 of the adhesive film 4 covers the bare crystal module 5 and is pressed on the bare crystal module 5 through lamination. Then, the laser cutting component 8 is used for cutting. The laser cutting component 8 cuts the adhesive film 4 to a depth that reaches the surface protective film 44, but does not cut the surface protective film 44. It only cuts the black layer 43 and the AG / AR layer 45. The surface protective film 44 is rolled up at the second winding device 17. The second winding device 17 can be used to control the conveying position of the adhesive film 4, so as to facilitate the matching of the adhesive film 4 and the bare crystal module 5.

[0073] See also Figures 3 to 6 As shown, the process of film packaging by the automated film packaging equipment is as follows:

[0074] First, a bare crystal module 5 and a film coil are prepared, and then the bare crystal module 5 is placed on the conveyor belt 15 at the feeding position, and the conveyor belt 15 at the feeding position is used to convey the bare crystal module 5 to the conveyor belt 15 at the waiting position. The conveyor belt 15 at the waiting position stops moving when it reaches the preset film pressing position, so that the bare crystal module 5 stays at the film pressing position. Figure 3 shown.

[0075] Then the lower film pressing assembly 3 is controlled to rise to hold up the bare crystal module 5, and then the upper film pressing assembly 1 is pressed down and closed with the lower film pressing assembly 3 to form a closed film pressing cavity 6, and then the heating device 13 is controlled to heat the film pressing cavity 6, and the upper side space of the film 4 is vacuumed by the upper mold vacuum pumping device 2, and the lower side space of the film 4 is vacuumed by the lower mold vacuum pumping device 11. When the vacuum value and the heating temperature in the film pressing cavity 6 reach the preset value, the upper film pressing assembly 1 is controlled to move downward to apply pressure to the film 4, such as Figure 4 shown.

[0076] After the pressure and the pressing time applied by the upper film pressing component 1 reach the preset values, the laser cutting component 8 in the lower film pressing component 3 is controlled to cut the adhesive film 4 through the optical fiber, and the surface protection film 44 of the adhesive film 4 is retained by the laser cutting. Figure 5 The pressure applied by the upper membrane pressing assembly 1 is 0.8 MPa to 1.2 MPa, and the pressing time is 4 min to 6 min.

[0077] The upper film pressing assembly 1 and the lower film pressing assembly 3 are controlled to stop heating and release the vacuum state, and the upper film pressing assembly 1 and the lower film pressing assembly 3 are controlled to slowly separate, so that the lower film pressing assembly 3 places the finished film pressing module 18 back on the conveyor belt 15 at the waiting position, and the finished film pressing module 18 is conveyed to the conveyor belt 15 at the discharge position through the conveyor belt 15 at the waiting position, and then the finished film pressing module is sent out of the machine from the conveyor belt 15 at the discharge position, such as Figure 6 shown.

[0078] The technical solution of this application has the following beneficial effects:

[0079] 1. Automated equipment can accurately control the thickness and position of the film to ensure that the packaging quality of each display module is highly consistent, reduce the errors caused by manual operation, and improve the uniformity of the overall display effect.

[0080] 2. Compared with traditional manual packaging, the automated production line can work 24 hours a day without interruption, greatly improving production efficiency, shortening product launch cycle, and meeting the rapidly growing market demand for MiniLED displays.

[0081] 3. Automated equipment can reduce manpower requirements, reduce labor costs, and reduce waste by improving material utilization, thereby achieving a better cost-effectiveness ratio in large-scale production.

[0082] 4. The automated packaging process is carried out in a closed environment, which can better control environmental factors such as temperature and humidity. This is especially important for sensitive LED components and helps to extend the service life of the display and maintain high performance.

[0083] 5. The automated system facilitates software updates and hardware maintenance, and can quickly adapt to new packaging materials and technological advances to maintain the leading edge of production technology.

[0084] 6. Reduce workers' direct exposure to harmful chemicals and repetitive labor, reduce the risk of occupational injuries, and meet the high standards of modern enterprises for employee health and safety.

[0085] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0086] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0087] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An automated film packaging device, characterized in that: include: An upper film pressing assembly (1) comprises an upper die vacuum extraction device (2); The lower film pressing component (3) cooperates with the upper film pressing component (1) to form a film pressing cavity (6) for pressing the adhesive film (4) and the bare crystal module (5); the upper mold vacuum pumping device (2) is connected to the film pressing cavity (6); the lower film pressing component (3) includes a lower pressing mold (7), and the lower pressing mold is pressed together with the upper film pressing component to press the adhesive film (4) and the bare crystal module (5).

2. The automatic film packaging equipment according to claim 1, characterized in that: The lower film pressing component (3) also includes a laser cutting component (8), and an optical path structure is formed on the lower pressing mold (7) for transmitting the laser of the laser cutting component (8) to the film pressing cavity (6). The laser cutting component (8) can use the optical path structure to cut the film (4) and the bare crystal module (5) that have completed the film pressing.

3. The automatic film packaging equipment according to claim 2, characterized in that: The lower pressing die (7) comprises a pressing block (9), the pressing block (9) is made of a light-transmitting material, and the pressing block (9) forms the optical path structure.

4. The automatic film packaging equipment according to claim 2, characterized in that: The lower pressing die (7) comprises a pressing block (9), a light-transmitting structure and a shell (10); the light-transmitting structure is located between the pressing block (9) and the shell (10); and the light-transmitting structure forms the optical path structure.

5. The automatic film packaging equipment according to claim 2, characterized in that: The lower film pressing assembly (3) further comprises a lower die vacuum pumping device (11), the lower die vacuum pumping device (11) being connected to the film pressing cavity (6), and the lower die vacuum pumping device (11) being arranged on the inner peripheral side of the cutting path of the laser cutting assembly (8).

6. The automatic film packaging equipment according to claim 2, characterized in that: The laser cutting assembly (8) comprises a laser cutting head (12), which is arranged outside the lower die (7) and can transmit laser light to a position to be cut using the optical path structure.

7. The automatic film packaging equipment according to claim 6, characterized in that: The cutting laser beam of the laser cutting head (12) is an annular laser beam, and the shape of the annular laser beam is adapted to the shapes of the laminated adhesive film (4) and the bare crystal module (5) to be cut.

8. The automatic film packaging equipment according to claim 6, characterized in that: The cutting laser beam of the laser cutting head (12) is a point-shaped laser beam, and the laser cutting assembly (8) further comprises a motion device, on which the laser cutting head (12) is arranged, and which drives the laser cutting head (12) to move along a cutting track.

9. The automated film packaging equipment according to claim 1, characterized in that: The upper film pressing assembly (1) further comprises a heating device (13), wherein the heating device (13) is arranged on the pressing side of the upper film pressing assembly (1) and heats and presses the adhesive film (4) onto the bare crystal module (5).

10. The automated film packaging equipment according to any one of claims 1 to 9, characterized in that: The automated film packaging equipment also includes a conveying device (14), the conveying device (14) includes at least one group of conveyor belts, one group of conveyor belts includes two conveyor belts (15) arranged opposite to each other, the lower film pressing assembly (3) is located between the two conveyor belts (15), and can move from below the two conveyor belts (15) to a film pressing position.

11. The automatic film packaging equipment according to claim 10, characterized in that: The spacing between two of the conveyor belts (15) in a group of the conveyor belts located at the film pressing position is adjustable. In the process of the lower film pressing assembly moving upward to the film pressing position, the two conveyor belts (15) in a group of the conveyor belts located at the film pressing position move away from each other to form an escape space, and the width of the escape space is greater than the width of the lower film pressing assembly in the width direction of the escape space. After the lower film pressing assembly completes film pressing, the two conveyor belts (15) in a group of the conveyor belts located at the film pressing position move closer to each other to support and transport the film (4) and the bare crystal module (5) that have completed film pressing.

12. The automatic film packaging equipment according to claim 11, characterized in that: The lower film pressing assembly also includes a telescopic lifting block (19), which is arranged on the film pressing side of the lower film pressing assembly. The telescopic lifting block (19) extends out and lifts up the bare crystal module (5) when the lower film pressing assembly is performing film pressing, and retracts after the lower film pressing assembly completes film pressing. When the telescopic lifting block (19) lifts up the bare crystal module (5), a spacing space is formed under the bare crystal module (5) for the conveyor belt (15) to enter.

Images