Polygonal panel warping suppression operation platform and warping suppression method thereof

Abstract

The invention discloses a polygonal panel warping inhibition operation platform and a warping inhibition method thereof, and the operation platform comprises a bearing platform which is used for bearing a polygonal panel; the supporting mechanism is located below the bearing table and can move in the vertical direction, and when the supporting end of the supporting mechanism protrudes out of the bearing table, the polygonal panel can be supported; the jacking mechanism can drive the supporting mechanism to move up and down in the vertical direction, and when the supporting mechanism moves upwards, the polygonal panel is supported on the supporting mechanism; when the supporting mechanism moves downwards, the polygonal panel can be borne on the bearing table. One flattening mechanism corresponds to one side edge of the bearing table, and when the polygonal panel is placed on the bearing table, the multiple flattening mechanisms abut against the multiple edge parts of the polygonal panel downwards at the same time, so that the polygonal panel is attached to the bearing table. According to the invention, automatic warping suppression processing can be realized, and damage to the panel can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of warping suppression, and in particular to a polygonal panel warping suppression working platform and a warping suppression method thereof. Background Art

[0002] Panel chip-level bottom filling is a hot research direction in the chip field. Panel-level packaging is an advanced packaging process that realizes fan-out wiring in a large format. With the development of the semiconductor industry, the increase in wiring density and the increase in demand for I / 0 ports have jointly promoted the development of fan-out packaging. Fan-out packaging is divided into fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP). The difference between the two lies in the carrier. Panel-level packaging reorganizes the carrier from 8-inch / 12-inch wafer carrier to a large-size polygonal panel. Panel-level packaging has the advantages of high area utilization, less waste, more chips packaged at one time, and higher packaging efficiency. With the increase in panel area, the cost of chip manufacturing can be significantly reduced. The transition from 200mm to 300mm saves about 25% of the cost, and the transition from 300mm to panel level can save 66% of the cost.

[0003] Since the large-sized polygonal panels (e.g. 600mm*600mm) used in panel-level packaging are relatively brittle and more prone to warping than 8-inch / 12-inch wafers (the warping can reach 10mm), if the dispensing operation is performed directly in a warped state, it is easy to scratch the chip on the panel. At present, the warping treatment of large-sized polygonal panels is done by hand pressing. The staff manually flattens the warped edge of the panel on the work platform, and then places the polygonal panel on the work platform through vacuum adsorption. This method is not only inefficient, but also easy to damage the panel. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0005] To this end, the present invention provides a polygonal panel warping suppression operation platform and method.

[0006] A polygonal panel warping suppression operation platform according to an embodiment of the present invention includes:

[0007] A carrying platform, the shape of which matches the shape of the polygonal panel so as to carry the polygonal panel;

[0008] A supporting mechanism, the supporting mechanism is located below the carrying platform and can move in a vertical direction, and can support the polygonal panel when the supporting end of the supporting mechanism protrudes from the carrying platform;

[0009] A lifting mechanism, wherein the lifting mechanism can drive the supporting mechanism to move up and down in a vertical direction, and when the supporting mechanism moves upward, the polygonal panel is supported on the supporting mechanism; when the supporting mechanism moves downward, the polygonal panel can be carried on the carrying platform;

[0010] Multiple flattening mechanisms, one of the flattening mechanisms corresponds to a side of the carrier platform. When the polygonal panel is placed on the carrier platform, the multiple flattening mechanisms simultaneously press down multiple edge portions of the polygonal panel respectively, so that the polygonal panel fits the carrier platform.

[0011] The beneficial effect of the present invention is that the present invention can improve the synchronization of lifting a large-sized polygonal panel through a lifting mechanism, and can simultaneously flatten multiple edges of the polygonal panel through multiple flattening mechanisms. The present invention can realize automated warping suppression processing and reduce damage to the panel.

[0012] According to one embodiment of the present invention, the support mechanism includes: a support plate and a support assembly, the support plate is connected to the lifting mechanism, and the lower end of the support assembly is connected to the support plate; a plurality of through holes for accommodating the movement of the support assembly are opened on the bearing platform; when the polygonal panel is supported on the support assembly, the support assembly passes through the through holes and protrudes from the bearing platform; when the polygonal panel is carried on the bearing platform, the support assembly retracts into the through holes.

[0013] According to one embodiment of the present invention, the support assembly comprises: a plurality of first support members, positions of the plurality of first support members correspond to edge portions of the support plate, and the plurality of first support members jointly support the edge of the polygonal panel.

[0014] According to one embodiment of the present invention, the support assembly further comprises: a second support member, the position of the second support member corresponds to the middle of the support plate, and the second support member assists a plurality of the first support members to jointly support the polygonal panel.

[0015] According to one embodiment of the present invention, the supporting end of the first supporting member is provided with a step surface for abutting against the edge of the polygonal panel.

[0016] According to one embodiment of the present invention, the lifting mechanism comprises:

[0017] A plurality of screw jacking assemblies, wherein the plurality of screw jacking assemblies are connected to the support mechanism, and the plurality of screw jacking assemblies work simultaneously to control the overall synchronous rise and synchronous fall of the support mechanism;

[0018] A lifting drive assembly, comprising a lifting drive member and a transmission belt, wherein the transmission belt is simultaneously connected to a plurality of the screw rod lifting assemblies with a transmission belt, and the lifting drive member drives the plurality of the screw rod lifting assemblies to work simultaneously through the transmission belt;

[0019] When the output shaft of the lifting drive member rotates in the forward direction, the supporting mechanism can be driven to rise synchronously as a whole; when the output shaft of the lifting drive member rotates in the reverse direction, the supporting mechanism can be driven to descend synchronously as a whole.

[0020] According to one embodiment of the present invention, the jacking drive assembly further includes: a plurality of transmission wheels and idler wheels, wherein the transmission wheels are connected to the screw jacking assembly, and the transmission belt is wound around the transmission wheels and idler wheels to realize belt transmission.

[0021] According to one embodiment of the present invention, the flattening mechanism can be extended and retracted in the longitudinal direction to change the height and in the transverse direction to change the distance between the flattening mechanism and the supporting platform.

[0022] According to one embodiment of the present invention, the flattening mechanism includes: a longitudinal drive assembly, a transverse drive assembly, a pressure plate and a universal pressure head; the universal pressure head is installed on the pressure plate, the pressure plate is connected to the transverse drive assembly, and the transverse drive assembly is connected to the longitudinal drive assembly.

[0023] According to one embodiment of the present invention, the universal pressure head includes: a connector and a ball, most of the volume of the ball is located in the accommodating groove of the connector, and the connector is installed in the mounting hole of the pressure plate; when the ball contacts the edge of the polygonal panel, the ball can adaptively adjust the contact position with the edge as the warping amount of the polygonal panel decreases during the process of the flattening mechanism pressing the edge of the polygonal panel downward.

[0024] According to an embodiment of the present invention, the carrying platform is provided with a heating module, and when the polygonal panel is carried on the carrying platform, the heating module heats the polygonal panel.

[0025] According to one embodiment of the present invention, the support platform is provided with a vacuum adsorption module, and a plurality of adsorption channels are opened on the upper surface of the vacuum adsorption module.

[0026] The present invention also provides a method for suppressing warping of a polygonal panel, comprising:

[0027] S1, the polygonal panel is placed directly above the bearing platform, and the supporting mechanism driven by the lifting mechanism moves upward and protrudes from the bearing platform to support the polygonal panel;

[0028] S2, the lifting mechanism drives the supporting mechanism to gradually descend so that the polygonal panel contacts the upper surface of the supporting platform;

[0029] S3. A plurality of flattening mechanisms located around the carrying platform simultaneously press down a plurality of edge portions of the polygonal panel so that the polygonal panel fits onto the carrying platform.

[0030] According to an embodiment of the present invention, before step S2, the lifting mechanism drives the supporting mechanism to descend a certain distance and then hover above the supporting platform, and the heating module of the supporting platform bakes the polygonal panel.

[0031] According to an embodiment of the present invention, before step S3, a heating module of the carrier platform heats the polygonal panel.

[0032] According to one embodiment of the present invention, during the process of the flattening mechanism pressing down the edge of the polygonal panel, the universal pressure head of the flattening mechanism can adaptively adjust the contact position with the edge of the polygonal panel as the warping amount of the polygonal panel decreases.

[0033] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0036] Figure 1 It is a structural schematic diagram of the polygonal panel warping suppression working platform of the present invention.

[0037] Figure 2 It is a structural schematic diagram of the jacking mechanism (support assembly extended state) of the present invention.

[0038] Figure 3 It is a schematic structural diagram of the jacking mechanism (support assembly retracted state) of the present invention.

[0039] Figure 4 It is a structural schematic diagram of the flattening mechanism of the present invention.

[0040] Figure 5 It is a cross-sectional view of the universal pressure head of the present invention.

[0041] Figure 6 It is a cross-sectional view of the flattening mechanism of the present invention.

[0042] Figure 7 It is a schematic structural diagram of the lateral drive assembly of the present invention.

[0043] Figure 8 It is a structural schematic diagram of the connection module of the present invention.

[0044] Fig. 9 It is a schematic structural diagram of the longitudinal drive assembly of the present invention.

[0045] Fig.10 It is a schematic diagram of the universal pressing head of the present invention pressing down the edge of a polygonal panel.

[0046] Fig.11 It is a structural schematic diagram of the jacking drive assembly of the present invention.

[0047] Fig.12 It is a cross-sectional view of the jacking mechanism of the present invention.

[0048] Fig.13 It is a structural schematic diagram of the step surface of the present invention.

[0049] Fig.14 It is a partial schematic diagram of the vacuum adsorption module of the present invention.

[0050] Fig.15 It is a transverse cross-sectional view of the vacuum adsorption module of the present invention.

[0051] Fig.16 It is a structural schematic diagram of the heating plate of the present invention.

[0052] Fig.17 It is a schematic diagram of the support assembly of the present invention supporting a polygonal panel.

[0053] Fig.18 It is a schematic diagram of the warpage suppression work platform of the present invention installed on a machine platform.

[0054] In the figure: 1, bearing platform; 2, lifting mechanism; 3, flattening mechanism; 4, pressure sensor; 5, pressure calibration platform; 6, supporting mechanism; 7, temperature sensor; 8, supporting column; 101, heating plate; 102, vacuum adsorption module; 103, thermal insulation layer; 104, through hole; 22, screw lifting assembly; 23, lifting drive assembly; 24, guide assembly; 25, bottom plate; 31, universal pressure head; 32, longitudinal drive assembly; 33, transverse drive assembly; 34, pressure plate; 35, connecting module; 36, base; 221, lifting screw; 222, connecting rod; 223, third connecting block; 224, bearing; 231, lifting drive member; 232, transmission wheel; 233, transmission belt; 234, idler wheel; 241, guide column; 242 , guide block; 311, connector; 312, ball bearing; 321, longitudinal drive motor; 322, synchronous wheel; 323, synchronous belt; 324, longitudinal screw rod; 325, first connecting block; 326, longitudinal drive plate; 331, transverse drive cylinder; 332, transverse mounting plate; 333, transverse drive plate; 334, second connecting block; 351, first connecting plate; 352, second connecting plate; 353, third connecting plate; 354, guide rail; 355, first limit block; 3261, baffle; 361, photoelectric sensor; 61, support plate; 62, support assembly; 621, first support member; 622, second support member; 6211, step surface; 1021, adsorption hole; 1022, vacuum joint; 100, polygonal panel. DETAILED DESCRIPTION

[0055] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0056] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0057] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] like Figures 1 to 18 As shown, the polygonal panel warping suppression operation platform of the present invention comprises: a bearing platform 1, a supporting mechanism 6, a lifting mechanism 2 and a plurality of flattening mechanisms 3. The shape of the bearing platform 1 matches the shape of the polygonal panel 100 to carry the polygonal panel 100. The supporting mechanism 6 is located below the bearing platform 1 and can move in the vertical direction. When the supporting end of the supporting mechanism 6 protrudes from the bearing platform 1, the polygonal panel 100 can be supported. The lifting mechanism 2 can drive the supporting mechanism 6 to move up and down in the vertical direction. When the supporting mechanism 6 moves upward, the polygonal panel 100 is supported on the supporting mechanism 6. When the supporting mechanism 6 moves downward, the polygonal panel 100 can be carried on the bearing platform 1. One flattening mechanism 3 corresponds to one side of the bearing platform 1. When the polygonal panel 100 is placed on the bearing platform 1, the plurality of flattening mechanisms 3 simultaneously press downward against the plurality of edge portions of the polygonal panel 100, respectively, so that the polygonal panel 100 fits the bearing platform 1. The present invention can realize automatic flattening of the warped edge, which is beneficial to improving work efficiency and reducing damage to the polygonal panel 100.

[0059] It should be noted that the number of flattening mechanisms 3 matches the number of sides of the polygonal panel 100. For example, a quadrilateral panel is equipped with four flattening mechanisms 3, and the four flattening mechanisms 3 are respectively located at the four sides of the quadrilateral panel. When performing the flattening operation, the four flattening mechanisms 3 act on the four edges of the quadrilateral panel at the same time. This embodiment is mainly aimed at the warping suppression treatment of large-sized polygonal panels 100. For example, the size of the quadrilateral panel is 600mm*600mm. Due to the material, the warping amount of the polygonal panel 100 will be much larger than that of an 8-inch / 12-inch wafer. The warping amount of the wafer is generally about 3mm, while the warping amount of the polygonal panel 100 can reach 10mm. In the process of the warped edge being gradually flattened, the contact position between the flattening mechanism 3 and the warped edge will change due to the ductility of the product, that is, a relative displacement will occur between the flattening mechanism 3 and the panel. This relative displacement process will generate a certain friction force, and this friction force may scratch the product. Therefore, the present embodiment improves the structure of the flattening mechanism 3 so that during the pressing process, the flattening mechanism 3 is in flexible contact with the warped edge.

[0060] Specifically, the flattening mechanism 3 includes: a longitudinal drive assembly 32, a transverse drive assembly 33, a pressing plate 34 and a universal pressing head 31. The universal pressing head 31 is installed on the pressing plate 34, and the pressing plate 34 is connected to the transverse drive assembly 33, and the transverse drive assembly 33 is connected to the longitudinal drive assembly 32. There are multiple universal pressing heads 31 installed on a pressing plate 34, and the multiple universal pressing heads 31 are arranged in a "one" shape. Since the size of the polygonal panel 100 is large, in this embodiment, the number of transverse drive assemblies 33 is two, and two pressing plates 34 are arranged on each transverse drive assembly 33. Of course, for polygonal panels 100 of other sizes, the number of longitudinal drive assemblies 32, transverse drive assemblies 33, pressing plates 34, and universal pressing heads 31 can be changed, so as to be able to flatten the edge of the polygonal panel 100. The longitudinal drive assembly 32 can drive the transverse drive assembly 33 to move up and down, and the transverse drive assembly 33 can drive the pressing plate 34 to extend or retract in the horizontal direction. When the warping is not suppressed, the pressing plate 34 is in a retracted state, and the pressing plate 34 is located on the side of the supporting platform 1 , and will not affect the lifting and lowering of the polygonal panel 100 by the lifting mechanism 2 .

[0061] For example, the universal pressing head 31 includes: a connecting body 311 and a ball 312, most of the volume of the ball 312 is located in the receiving groove of the connecting body 311, and the connecting body 311 is installed in the mounting hole of the pressing plate 34. When the ball 312 contacts the warped edge, the ball 312 can adaptively adjust the contact position with the warped edge as the warping amount of the polygonal panel 100 decreases during the process of the flattening mechanism 3 pressing the edge of the polygonal panel 100 downward. It can be understood that when the edge is warped, the cross section of the panel is roughly crescent-shaped, and the warped edge is roughly arc-shaped. The ball 312 is not stuck in the receiving groove, but can rotate. During the downward pressing process of the universal pressure head 31, the ball 312 contacts the warped edge. Assuming that the initial contact position between the ball 312 and the warped edge is point A, as the warped edge gradually flattens, the contact position changes from point A to point B. During the downward pressing process, the ball 312 will generate a certain friction force due to the change in contact position, and this friction force may scratch the panel. However, the ball 312 of this embodiment is freely rotatable. When the contact position changes, this friction force can be offset by the rotation of the ball 312, thereby preventing the panel from being scratched. In addition, the ball 312 of this embodiment is in point contact with the warped edge, and the contact area is smaller, which can further reduce the risk of panel damage during the downward pressing process.

[0062] For example, the universal pressure head 31 is made of peek (polyetheretherketone) material, which has the advantages of high temperature resistance, excellent mechanical properties, good self-lubrication, chemical corrosion resistance, flame retardancy, peeling resistance, radiation resistance, and stable insulation. In addition, the friction coefficient of peek material is small, which helps to reduce the friction and wear of the product; the self-lubricating property can secrete lubricant during operation, which is conducive to further reducing wear.

[0063] Specifically, the flattening mechanism 3 further includes a connecting module 35, through which the pressing plate 34 is connected to the lateral driving assembly 33, and a pressure sensor 4 is installed on the connecting module 35, and the pressure sensor 4 is used to detect the pressure value applied by the universal pressure head 31 to the edge. The connecting module 35 includes: a first connecting plate 351, a second connecting plate 352, a third connecting plate 353 and a guide rail 354, the first connecting plate 351 and the third connecting plate 353 are slidably connected through the guide rail 354, the second connecting plate 352 is connected to the first connecting plate 351, the pressing plate 34 is connected to the second connecting plate 352, one end of the pressure sensor 4 is connected to the third connecting plate 353, and the other end is connected to the second connecting plate 352. In other words, the pressing plate 34 and the third connecting plate 353 move together, the second connecting plate 352 and the first connecting plate 351 move together, and the third connecting plate 353 and the first connecting plate 351 can slide relative to each other through the guide rail 354. The pressure sensor 4 associates the second connecting plate 352 with the third connecting plate 353. When the universal pressure head 31 presses down on the warped edge, the warped edge will generate a reaction force on the universal pressure head 31. This reaction force will cause the pressure plate 34 and the universal pressure head 31 to move upward a small distance. When the pressure plate 34 moves upward, it will drive the third connecting plate 353 to move upward as well. When the third connecting plate 353 moves upward, it will squeeze the pressure sensor 4, that is, the pressure sensor 4 can detect the magnitude of this reaction force, thereby reflecting the downward pressure of the universal pressure head 31 on the warped edge. Since the polygonal panel 100 is made of glass and is relatively brittle, if the pressure of the universal pressure head 31 is too great, the edge of the panel is easily crushed or cracked. Therefore, the pressure value of the universal pressure head 31 on the edge can be monitored in real time by the pressure sensor 4. If it is found that the real-time pressure value exceeds the preset maximum pressure value, the downward pressure is adjusted by adjusting the descending speed of the universal pressure head 31. A pressure calibration platform 5 is also installed on the second connecting plate 352 . The pressure calibration platform 5 is connected to the pressure sensor 4 , so as to calibrate the pressure sensor 4 .

[0064] For example, the first connection plate 351 is provided with a first limit block 355. The first limit block 355 is located at the lower end of the first connection plate 351, and the first limit block 355 is located below the third connection plate 353. The first limit block 355 is used to limit the downward movement of the third connection plate 353. Since the third connection plate 353 can move upward a small distance under the action of the reaction force, when the reaction force disappears, the third connection plate 353 will return to its original position due to gravity. At this time, the first limit block 355 can prevent the third connection plate 353 from falling.

[0065] It should be noted that the support platform 1 includes a vacuum adsorption module 102, and a plurality of adsorption channels are provided on the upper surface of the vacuum adsorption module 102. When the polygonal panel 100 is completely flattened, the vacuum adsorption module 102 is turned on to adsorb the multi-deformable panel, and then the universal pressure head 31 can be removed. For example, the adsorption channel is square, and the upper surface of the vacuum adsorption module 102 can be divided into four areas, each of which is provided with a plurality of square adsorption channels. For example, there are six adsorption channels in each area, and each adsorption channel is connected to an adsorption hole 1021, and the adsorption hole 1021 is connected to the vacuum joint 1022. In this way, the large-sized polygonal panel 100 can be better adsorbed.

[0066] For example, the carrier 1 is provided with a heating module, and when the polygonal panel 100 is carried on the carrier 1, the heating module heats the polygonal panel 100. It should be noted that when the polygonal panel 100 is made of metal, it does not need to be heated, and the flattening mechanism 3 is used to flatten it directly. When the polygonal panel 100 is made of glass, the polygonal panel 100 can be heated before flattening, so that the polygonal panel 100 has a certain degree of softening and is not easy to be crushed when pressed down. The heating module is, for example, a heating plate 101, which is located below the vacuum adsorption module 102, and the bottom surface and periphery of the heating plate 101 are wrapped with a heat insulation layer 103. Since the flattening mechanism 3 is located on the side of the carrier 1, and the support plate 61 is located below the heating plate 101, the heat insulation layer 103 is conducive to reducing the influence of high temperature on the flattening mechanism 3 and the support plate 61. For example, the polygonal panel warping suppression operation platform is also provided with a temperature sensor 7 for monitoring the temperature change of the heating plate 101, and the temperature sensor 7 is connected to the heating plate 101.

[0067] In this embodiment, the longitudinal drive assembly 32 is mounted on the base 36. The longitudinal drive assembly 32 includes: a longitudinal drive motor 321, two synchronous wheels 322, a synchronous belt 323, a longitudinal screw rod 324 and a first connecting block 325. The longitudinal drive motor 321 and the longitudinal screw rod 324 are respectively located on both sides of the base 36. One synchronous wheel 322 is mounted on the output shaft of the longitudinal drive motor 321, and the other synchronous wheel 322 is mounted on the longitudinal screw rod 324. The synchronous belt 323 is sleeved on the two synchronous wheels 322. The first connecting block 325 is connected to the nut on the longitudinal screw rod 324. When the longitudinal drive motor 321 is started, the longitudinal screw rod 324 can be driven to rotate through the synchronous wheel 322 and the synchronous belt 323. When the longitudinal screw rod 324 rotates, the nut and the first connecting block 325 can be driven to move up and down. Among them, the first connecting block 325 is also connected to the longitudinal drive plate 326, and the number of the longitudinal drive plate 326 matches the number of the transverse drive assembly 33. In this embodiment, the transverse drive assembly 33 is divided into two groups, the number of longitudinal drive plates 326 is two, the two sides of the first connection block 325 are respectively fixedly connected to the two longitudinal drive plates 326, and the longitudinal drive plates 326 are slidably connected to the base 36, so that the two longitudinal drive plates 326 can move up and down at the same time. For example, a baffle 3261 is connected to the side of the longitudinal drive plate 326, and two photoelectric sensors 361 are arranged at the edge of the base 36. The two photoelectric sensors 361 are on the same vertical line, the lower photoelectric sensor 361 corresponds to the initial position of the longitudinal drive plate 326, and the upper photoelectric sensor 361 corresponds to the highest position of the longitudinal drive plate 326. When the baffle 3261 is inserted into the photoelectric sensor 361, a sensing signal can be triggered so that the controller can understand the movement of the longitudinal drive plate 326.

[0068] Specifically, the transverse drive assembly 33 includes: a transverse drive cylinder 331, a transverse mounting plate 332, a transverse drive plate 333 and a second connecting block 334. The transverse mounting plate 332 is connected to the longitudinal drive plate 326. The transverse drive cylinder 331 is installed on the lower surface of the transverse mounting plate 332. The transverse drive plate 333 is slidably connected to the upper surface of the transverse mounting plate 332. The transverse drive plate 333 is connected to the transverse drive cylinder 331 through the second connecting block 334. The first connecting plate 351 is connected to the transverse drive plate 333. When the longitudinal drive plate 326 moves up and down, the transverse drive assembly 33 can be driven to move up and down as a whole. When the transverse drive cylinder 331 is started, the transverse drive plate 333 can be driven to extend or retract horizontally through the second connecting block 334. The longitudinal and transverse movements of the pressing plate 34 and the universal pressing head 31 can be realized through the longitudinal drive assembly 32 and the transverse drive assembly 33.

[0069] Since this solution is for large-sized polygonal panels 100, it is necessary to ensure the overall synchronization of the polygonal panel 100 when it is lifted and lowered, and it is not possible for one position to be lifted quickly and another position to be lifted slowly. Based on this, this embodiment improves the lifting mechanism 2 for this special application scenario. Specifically, the lifting mechanism 2 includes: a plurality of screw lifting assemblies 22 and a lifting drive assembly 23, the plurality of screw lifting assemblies 22 are connected to the support mechanism 6, and the plurality of screw lifting assemblies 22 work simultaneously to control the overall synchronous rise and synchronous descent of the support mechanism 6. The lifting drive assembly 23 includes a lifting drive member 231 and a transmission belt 233, the transmission belt 233 is simultaneously connected to the plurality of screw lifting assemblies 22 with a belt transmission, and the lifting drive member 231 drives the plurality of screw lifting assemblies 22 to work simultaneously through the transmission belt 233. When the output shaft of the lifting drive 231 rotates forward, it can drive the support mechanism 6 to rise synchronously as a whole; when the output shaft of the lifting drive 231 rotates reversely, it can drive the support mechanism 6 to descend synchronously as a whole. A plurality of screw lifting assemblies 22 are spaced apart and enclosed into a shape that matches the shape of the polygonal panel 100. The polygonal panel 100 can be in the shape of a quadrilateral, a pentagon, a hexagon, etc. The lifting drive assembly 23 includes: a plurality of transmission wheels 232 and an idler wheel 234, the transmission wheel 232 is connected to the screw lifting assembly 22, and the transmission belt 233 is wound around the transmission wheel 232 and the idler wheel 234 to realize belt transmission. In other words, the lifting mechanism 2 of this embodiment can meet the synchronization requirements when performing a lifting operation on the polygonal panel 100.

[0070] It should be noted that the support mechanism 6 includes: a support plate 61 and a support assembly 62, the support plate 61 is connected to the lifting mechanism 2, and the lower end of the support assembly 62 is connected to the support plate 61; a plurality of through holes 104 are provided on the carrier 1 to accommodate the movement of the support assembly 62; when the polygonal panel 100 is supported on the support assembly 62, the support assembly 62 passes through the through holes 104 and protrudes from the carrier 1; when the polygonal panel 100 is carried on the carrier 1, the support assembly 62 retracts into the through holes 104. The support assembly 62 includes: a plurality of first support members 621, the positions of the plurality of first support members 621 correspond to the edge of the support plate 61, and the plurality of first support members 621 jointly support the edge of the polygonal panel 100. For example, the support assembly 62 also includes: a second support member 622, the position of the second support member 622 corresponds to the middle of the support plate 61, and the second support member 622 assists the plurality of first support members 621 to jointly support the polygonal panel 100.

[0071] It should be noted that the upper ends of the first support member 621 and the second support member 622 can pass through the through hole 104 of the carrier 1. When the support mechanism 6 receives the polygonal panel 100, the first support member 621 and the second support member 622 move upward at the same time to support the polygonal panel 100. Then, the first support member 621 and the second support member 622 move downward synchronously. When the first support member 621 and the second support member 622 retract into the through hole 104, the polygonal panel 100 contacts the upper surface of the carrier 1 to achieve heating and vacuum adsorption. Among them, the upper end of the first support member 621 is provided with a step surface 6211 for abutting against the edge of the polygonal panel 100. When the polygonal panel 100 falls on the first support member 621, the side wall of the step surface 6211 can limit the edge of the polygonal panel 100. The side walls of the step surfaces 6211 of the multiple first support members 621 surround the edge of the polygonal panel 100, which can achieve the positioning of the polygonal panel 100 and prevent the polygonal panel 100 from falling.

[0072] The screw jacking assembly 22 is installed on the bottom plate 25, and the bearing platform 1 is connected to the bottom plate 25 through four support columns 8. The multiple screw jacking assemblies 22 correspond to multiple corner areas of the polygonal panel 100. The lifting drive 231 is installed on the bottom plate 25 through the mounting plate. A transmission wheel 232 is installed on each screw jacking assembly 22, and a transmission belt 233 is wound around all the transmission wheels 232. When the lifting drive 231 is started, all the screw jacking assemblies 22 can be driven to move synchronously through the transmission belt 233 and the transmission wheel 232. When the screw jacking assembly 22 is working, it can drive the supporting mechanism 6 to rise or fall as a whole, thereby realizing the synchronization of different positions of the polygonal panel 100 when rising or falling.

[0073] The screw rod lifting assembly 22 includes: a lifting screw rod 221, a connecting rod 222, a third connecting block 223 and a bearing 224. The third connecting block 223 is installed in the mounting hole of the bottom plate 25. The connecting rod 222 is fixedly connected to the lifting screw rod 221. The lower end of the connecting rod 222 is connected to the third connecting block 223 through the bearing 224. The nut on the lifting screw rod 221 is fixedly connected to the support plate 61. When the lifting screw rod 221 is driven by the lifting drive assembly 23, it can rotate. When the lifting screw rod 221 rotates, the nut on the lifting screw rod 221 can move up or down, thereby driving the support plate 61 to move up or down.

[0074] For example, the lifting mechanism 2 further includes: a guide assembly 24, which is used to guide the support mechanism 6 when it moves up and down. The guide assembly 24 includes a guide column 241 and a guide block 242, the guide block 242 is sleeved on the guide column 241 and can slide relatively with the guide column 241, the guide block 242 is fixedly connected to the support plate 61, and when the support plate 61 moves up or down under the drive of the screw lifting assembly 22, the guide block 242 slides up and down along the guide column 241. Since the size of the polygonal panel 100 is large, the size of the support plate 61 is also correspondingly large, and the stability and straightness of the support mechanism 6 when it moves up and down can be improved by the guide assembly 24.

[0075] The method for suppressing warping of a polygonal panel of the present invention comprises: S1, a polygonal panel 100 is placed directly above a carrier 1, and a support mechanism 6 driven by a lifting mechanism 2 moves upward and protrudes from the carrier 1 to support the multi-deformable panel. S2, the lifting mechanism 2 drives the support mechanism 6 to gradually descend so that the polygonal panel 100 contacts the upper surface of the carrier 1. S3, a plurality of flattening mechanisms 3 located around the carrier 1 simultaneously press down the plurality of edge portions of the polygonal panel 100 so that the polygonal panel 100 is attached to the carrier 1.

[0076] It should be noted that the polygonal panel 100 can be a quadrilateral, a pentagon, a hexagon, etc. The warping amount of the polygonal panel 100 can reach 10 mm. There are many chip structures or precision structures arranged on the polygonal panel 100. In the packaging process, there is a link to perform glue dispensing on the polygonal panel 100 to make the chip structure and the panel more firmly. Therefore, before the glue dispensing operation, the warped edge needs to be suppressed to ensure the overall flatness of the polygonal panel 100.

[0077] The specific process is as follows: the support assembly 62 extends out of the carrier 1 and receives the polygonal panel 100 to be processed. Then, the support mechanism 6 moves downward under the drive of the lifting drive assembly 23 so that the polygonal panel 100 falls on the vacuum adsorption module 102. At this time, the support assembly 62 has retracted into the carrier 1. Then, multiple flattening mechanisms 3 flatten multiple edges of the polygonal panel 100 at the same time. The specific process is as follows: the longitudinal drive assembly 32 drives the transverse drive assembly 33 and the pressing plate 34 to move upward to a specified height, and then the transverse drive assembly 33 drives the pressing plate 34 to extend horizontally close to the carrier 1, and then the longitudinal drive assembly 32 drives the transverse drive assembly 33 and the pressing plate 34 to move downward together. During the downward movement, the universal pressure head 31 contacts the warped edge and applies pressure to the edge, so that the warped edge is gradually flattened on the carrier 1. After the multiple edges of the polygonal panel 100 are flattened by the flattening mechanism 3, the vacuum adsorption module 102 immediately turns on the vacuum adsorption to suck the polygonal panel 100. Then, the lateral driving assembly 33 can drive the pressing plate 34 to retract away from the supporting platform 1 .

[0078] It should be noted that before step S3, the heating module of the carrier 1 heats the polygonal panel 100. That is, when the polygonal panel 100 is carried on the upper surface of the carrier 1, the heating plate 101 is turned on (for example, the heating temperature is 150°C) to heat the polygonal panel 100 so that the polygonal panel 100 is softened to a certain extent, which is convenient for the warping suppression process. In the entire panel chip-level bottom filling operation system, before entering the dispensing operation link, there is also a preheating link for the polygonal panel 100, that is, heating the polygonal panel 100. In this way, the heating time of the heating plate 101 on the polygonal panel 100 can be shortened, thereby improving the work efficiency of the warping suppression operation.

[0079] It should be noted that before performing step S2, a step can be added, that is, the lifting mechanism 2 drives the supporting mechanism 6 to descend a certain distance and then hover above the carrier 1, and the carrier 1 turns on the heating function to bake the polygonal panel 100. When the polygonal panel 100 contacts the upper surface of the carrier 1 and the heating plate 101 heats the polygonal panel 100, due to the large temperature difference between the surface of the carrier 1 and the polygonal panel 100, the warping of the polygonal panel 100 will increase at the moment of contact. Therefore, a baking step can be added, the polygonal panel 100 is suspended above the carrier 1, for example, 1 mm (that is, the polygonal panel 100 is not in contact with the upper surface of the carrier 1), and the heating plate 101 is turned on (for example, the heating temperature is 100°C) to bake the polygonal panel 100. By baking, the temperature difference between the polygonal panel 100 and the carrier 1 can be reduced, and the influence of the temperature difference on the warping can be reduced.

[0080] When the universal pressing head 31 applies pressure to the warped edge, the contact point between the universal pressing head 31 and the warped edge changes from point A to point B. During this position change, a certain friction force is generated. Under the action of this friction force, the ball 312 can rotate freely, thereby reducing damage to the panel. In addition, the ball 312 and the panel are in point contact, which can further reduce damage to the panel.

[0081] It should be noted that, during the process of the universal pressure head 31 applying pressure to the warped edge, the pressure sensor 4 can detect the pressure value in real time. Since the warped edge is roughly arc-shaped, and as it is flattened, the pressure of the universal pressure head 31 on the warped edge will change, and the pressure change is detected by the pressure sensor 4, which then feeds back to the controller, and the controller can adjust the pressure of the universal pressure head 31 on the warped edge in real time to prevent the pressure value from being too large (easy to crush the panel) or too small (unsatisfactory flattening effect).

[0082] In summary, the polygonal panel warping suppression working platform and the warping suppression method thereof of the present invention can realize the automatic flattening processing of the warped edge of the polygonal panel 100 through improvement, which can not only improve the work efficiency, but also reduce the risk of damaging the panel. By setting the universal pressure head 31, flexible contact with the warped edge can be achieved during the downward pressing process, which is beneficial to reduce the damage to the panel. The pressure value of the universal pressure head 31 on the warped edge is detected in real time by the pressure sensor 4, and the pressure change can be monitored and timely adjusted. The jacking mechanism 2 can improve the synchronization when jacking up the large-sized polygonal panel 100. The present invention has a clever structure, is easy to operate, and has high practical application value.

[0083] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0084] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A polygonal panel warping suppression work platform, characterized in that: include: A carrying platform (1), the shape of the carrying platform (1) matching the shape of the polygonal panel (100) so as to carry the polygonal panel (100); A supporting mechanism (6), wherein the supporting mechanism (6) is located below the carrying platform (1) and is movable in a vertical direction, and is capable of supporting the polygonal panel (100) when a supporting end of the supporting mechanism (6) protrudes from the carrying platform (1); A lifting mechanism (2), wherein the lifting mechanism (2) can drive the supporting mechanism (6) to move up and down in a vertical direction, and when the supporting mechanism (6) moves upward, the polygonal panel (100) is supported on the supporting mechanism (6); when the supporting mechanism (6) moves downward, the polygonal panel (100) can be supported on the supporting platform (1); A plurality of flattening mechanisms (3), one of the flattening mechanisms (3) corresponding to a side edge of the carrier platform (1); when the polygonal panel (100) is placed on the carrier platform (1), the plurality of flattening mechanisms (3) simultaneously press downwardly against a plurality of edge portions of the polygonal panel (100) respectively, so that the polygonal panel (100) is attached to the carrier platform (1).

2. The polygonal panel warping suppression work platform according to claim 1, characterized in that: The support mechanism (6) comprises: a support plate (61) and a support assembly (62), wherein the support plate (61) is connected to the lifting mechanism (2), and the lower end of the support assembly (62) is connected to the support plate (61); a plurality of through holes (104) for accommodating the movement of the support assembly (62) are provided on the support platform (1); when the polygonal panel (100) is supported on the support assembly (62), the support assembly (62) passes through the through holes (104) and protrudes from the support platform (1); when the polygonal panel (100) is supported on the support platform (1), the support assembly (62) retracts into the through holes (104).

3. The polygonal panel warping suppression work platform according to claim 2, characterized in that: The support assembly (62) comprises: a plurality of first support members (621), the positions of the plurality of first support members (621) correspond to the edge portions of the support plate (61), and the plurality of first support members (621) jointly support the edge of the polygonal panel (100).

4. The polygonal panel warping suppression work platform according to claim 3, characterized in that: The support assembly (62) further includes: a second support member (622), the position of the second support member (622) corresponds to the middle of the support plate (61), and the second support member (622) assists the plurality of first support members (621) to jointly support the polygonal panel (100).

5. The polygonal panel warping suppression work platform according to claim 3, characterized in that: The supporting end of the first supporting member (621) is provided with a step surface (6211) for abutting against the edge of the polygonal panel (100).

6. The polygonal panel warping suppression work platform according to claim 1, characterized in that: The lifting mechanism (2) comprises: A plurality of screw rod lifting assemblies (22), wherein the plurality of screw rod lifting assemblies (22) are connected to the support mechanism (6), and the plurality of screw rod lifting assemblies (22) work simultaneously to control the overall synchronous rise and synchronous descent of the support mechanism (6); A lifting drive assembly (23), comprising a lifting drive member (231) and a transmission belt (233), wherein the transmission belt (233) is simultaneously connected to a plurality of the screw rod lifting assemblies (22) by belt transmission, and the lifting drive member (231) drives the plurality of the screw rod lifting assemblies (22) to work simultaneously via the transmission belt (233); When the output shaft of the lifting drive member (231) rotates in the forward direction, it can drive the supporting mechanism (6) to rise synchronously as a whole; when the output shaft of the lifting drive member (231) rotates in the reverse direction, it can drive the supporting mechanism (6) to descend synchronously as a whole.

7. The polygonal panel warping suppression work platform according to claim 6, characterized in that: The lifting drive assembly (23) further comprises: a plurality of transmission wheels (232) and idler wheels (234); the transmission wheels (232) are connected to the screw rod lifting assembly (22); and the transmission belt (233) is wound around the transmission wheels (232) and the idler wheels (234) to realize belt transmission.

8. The polygonal panel warping suppression work platform according to claim 1, characterized in that: The flattening mechanism (3) can be extended and retracted in the longitudinal direction to change the height and in the transverse direction to change the distance between the flattening mechanism (3) and the supporting platform (1).

9. The polygonal panel warping suppression work platform according to claim 1, characterized in that: The flattening mechanism (3) comprises: a longitudinal drive assembly (32), a transverse drive assembly (33), a pressure plate (34) and a universal pressure head (31); the universal pressure head (31) is mounted on the pressure plate (34), the pressure plate (34) is connected to the transverse drive assembly (33), and the transverse drive assembly (33) is connected to the longitudinal drive assembly (32).

10. The polygonal panel warping suppression work platform according to claim 9, characterized in that: The universal pressing head (31) comprises: a connecting body (311) and a ball (312); most of the volume of the ball (312) is located in the receiving groove of the connecting body (311); the connecting body (311) is installed in the mounting hole of the pressing plate (34); when the ball (312) contacts the edge of the polygonal panel (100), the ball (312) can adaptively adjust the contact position with the edge as the warping amount of the polygonal panel (100) decreases during the process of the flattening mechanism (3) pressing the edge of the polygonal panel (100) downward.

11. The polygonal panel warping suppression work platform according to claim 1, characterized in that: The carrying platform (1) is provided with a heating module, and when the polygonal panel (100) is carried on the carrying platform (1), the heating module heats the polygonal panel (100).

12. The polygonal panel warping suppression work platform according to claim 1, characterized in that: The support platform (1) is provided with a vacuum adsorption module (102), and a plurality of adsorption channels are provided on the upper surface of the vacuum adsorption module (102).

13. A method for suppressing warping of a polygonal panel, characterized in that: include: S1. The polygonal panel (100) is placed directly above the bearing platform (1), and the supporting mechanism (6) driven by the lifting mechanism (2) moves upward and protrudes from the bearing platform (1) to support the polygonal panel; S2, the lifting mechanism (2) drives the supporting mechanism (6) to gradually descend so that the polygonal panel (100) contacts the upper surface of the supporting platform (1); S3. A plurality of flattening mechanisms (3) located around the support platform (1) simultaneously press downwards against a plurality of edge portions of the polygonal panel (100), so that the polygonal panel (100) is attached to the support platform (1).

14. The method for suppressing warping of a polygonal panel according to claim 13, wherein: Before step S2, the lifting mechanism (2) drives the supporting mechanism (6) to descend a certain distance and then hover above the supporting platform (1), and the heating module of the supporting platform (1) bakes the polygonal panel (100).

15. The method for suppressing warping of a polygonal panel according to claim 13, wherein: Before step S3, the heating module of the carrier platform (1) heats the polygonal panel (100).

16. The method for suppressing warping of a polygonal panel according to claim 13, wherein: During the process of the flattening mechanism (3) pressing down the edge of the polygonal panel (100), the universal pressing head (31) of the flattening mechanism (3) can adaptively adjust the contact position with the edge of the polygonal panel (100) as the warping amount of the polygonal panel (100) decreases.

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