Processing technology suitable for new energy battery module integrated busbar and integrated busbar

Abstract

The invention discloses a processing technology suitable for a new energy battery module integrated busbar, and belongs to the technical field of busbar processing. The processing technology of the integrated busbar comprises the following steps: S100, processing a plurality of busbars on a substrate, so that the plurality of busbars are of at least one integrated structure; and S200, an insulating film is hot-pressed on the plurality of busbars of the integrated structure. According to the invention, the busbar is of an integrated structure during hot pressing of the insulating film, so that the influence of hot pressing expansion and shrinkage of the insulating film on the distance between the busbars is reduced, the dimensional precision of the distance between the busbars is greatly improved, and the problem of expansion and shrinkage in the hot pressing process of the insulating film in the prior art is solved; and therefore, the relative dimensional precision among the busbars of a plurality of split structures is difficult to maintain.

Description

Technical Field

[0001] The present invention belongs to the field of busbar processing, and specifically relates to a processing technology and an integrated busbar suitable for a new energy battery module integrated busbar. Background Art

[0002] With the development of the new energy battery industry, the application of cylindrical batteries in various fields such as automobiles and energy storage has increased year by year; among them, the integrated busbar solution is still used for the voltage / temperature signal acquisition and current transmission functions of the cylindrical battery module.

[0003] In the integrated busbar solution for square shell and blade batteries, multiple independent busbars are first processed according to the series and parallel connection of the module cells, and then the busbars, signal acquisition boards, etc. are integrated through a hot pressing process using an insulating film to form an integrated busbar.

[0004] However, for the cylindrical battery solution, the cylindrical battery cells are arranged more densely and the distance between the positive and negative poles of the battery cells is closer, which leads to a denser arrangement of the busbars in the integrated busbar solution, and the accuracy requirements of the overlap area between the busbars and the battery cell tabs are very high. If the integrated busbar is still designed and processed according to the square shell and blade battery solutions, due to the expansion and contraction of the insulating film during the hot pressing process, after multiple busbars are integrated, the relative size accuracy between the busbars will be difficult to meet the assembly and welding requirements of the cylindrical battery cell module, which may easily cause the risk of battery cell short circuit during the module assembly and welding process. Summary of the invention

[0005] Purpose of the invention: To provide a processing technology and an integrated busbar suitable for an integrated busbar of a new energy battery module. By making the busbar an integrated structure during hot pressing of the insulating film, the problem of the prior art that the relative dimensional accuracy between multiple split structure buses is difficult to maintain due to expansion and contraction of the insulating film during hot pressing is solved.

[0006] The technical solution of the present invention is as follows: In the first aspect, the processing technology applicable to the integrated busbar of the new energy battery module includes: S100, processing a plurality of bus bars on a substrate so that the plurality of bus bars are at least one integrated structure.

[0007] S200, hot pressing an insulating film on a plurality of busbars of the integrated structure.

[0008] In a further embodiment of the first aspect, the processing technology of the integrated busbar further includes: S300, bending the cathode portion of the busbar, and disconnecting the connecting portion of a plurality of busbars connected into an integrated structure, so that the plurality of busbars are split structures.

[0009] The cathode portion bending and the connection portion processing and disconnection are performed simultaneously or in steps.

[0010] In a further embodiment of the first aspect, the processing technology of the integrated busbar further includes: S400, assemble the signal acquisition board on the bus.

[0011] In a further embodiment of the first aspect, the insulating film used in S200 is provided with through holes that cooperate with the busbars.

[0012] In a further embodiment of the first aspect, the insulating film used in S200 does not have a through hole that cooperates with the busbar.

[0013] In S300, through holes matching with the busbars are processed in the insulating film.

[0014] In a further embodiment of the first aspect, the substrate processed in S100 includes: a frame portion, a connecting portion, and a plurality of bus bars.

[0015] The frame portion is arranged at the side of a plurality of bus bars, the connecting portion is arranged between the bus bar and the frame portion, and the plurality of bus bars are connected into an integrated structure through the frame portion and the connecting portion.

[0016] In a further embodiment of the first aspect, the processing process further includes: S101, after processing the substrate having the frame portion, the connecting portion and a plurality of bus bars in S100, bending the cathode portion of the bus bar; S200, hot pressing an insulating film on a plurality of busbars of the integrated structure; S300, disconnecting the connection parts of the plurality of busbars connected into an integrated structure, so that the plurality of busbars are split structures.

[0017] In a further embodiment of the first aspect, the substrate processed in S100 includes: a connecting portion and a plurality of bus bars.

[0018] A connecting portion is provided between adjacent busbars, and a plurality of busbars are connected into an integrated structure through the connecting portion.

[0019] In a second aspect, an integrated busbar includes: a substrate and an insulating film.

[0020] The insulating film is arranged on the surface of the substrate.

[0021] The substrate comprises a frame portion, a connecting portion and a plurality of bus bars.

[0022] The frame portion is arranged at the side of a plurality of bus bars, the connecting portion is arranged between the bus bars and the frame portion, and the plurality of bus bars are connected into at least one integrated structure through the frame portion and the connecting portion.

[0023] In a further embodiment of the second aspect, a connecting portion is provided between adjacent bus bars so that the middle portion of the bus bar is supported.

[0024] In another embodiment of the second aspect, an integrated busbar includes: a substrate and an insulating film.

[0025] The insulating film is arranged on the surface of the substrate.

[0026] The substrate includes a connecting portion and a plurality of bus bars.

[0027] A connecting portion is provided between adjacent busbars, and a plurality of busbars are connected into at least one integrated structure through the connecting portion.

[0028] The beneficial effects of the present invention are as follows: the present application reduces the influence of the expansion and contraction of the insulating film during hot pressing on the bus spacing by making the bus an integrated structure during hot pressing of the insulating film, greatly improves the dimensional accuracy of the bus spacing, and solves the problem in the prior art that the relative dimensional accuracy between multiple split structure buses is difficult to maintain due to the expansion and contraction of the insulating film during hot pressing.

[0029] Compared with the existing blister and injection molding solutions, blister or injection molding methods use convex points for positioning, and the dimensional accuracy is relatively low. The dimensional accuracy between the bus bars of the product of the present invention is very high. At the same time, in terms of the weight of the overall product, since blister and injection molding have plastic parts and are relatively heavy, the weight of the product of the present invention is much reduced, and it has a good weight reduction effect.

[0030] After the insulating film is hot-pressed on the surface, multiple busbars of the integrated structure are bent at the same time, which speeds up the production process, effectively improves production efficiency, reduces production costs, and does not affect the spacing accuracy of the multiple busbars and the positioning accuracy of the insulating film and the busbar. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of an embodiment of the substrate of the present invention including a frame portion, a connecting portion and a plurality of bus bars.

[0032] Figure 2 It is a schematic diagram of an embodiment of a substrate of the present invention including a connecting portion and a plurality of bus bars.

[0033] Figure 3 It is a schematic diagram of an explosion of the substrate and the insulating film of the present invention before being punched.

[0034] Figure 4 It is a surface schematic diagram of the substrate and the insulating film of the present invention before being punched.

[0035] Figure 5 It is a schematic diagram of the surface of the substrate and the insulating film of the present invention after being punched and provided with a signal collection board.

[0036] Figure 6 It is an exploded schematic diagram of a substrate and an insulating film of the present invention being punched and provided with a signal acquisition board.

[0037] Figure 7 It is a schematic diagram of the surface of the substrate of the present invention after being punched.

[0038] The reference numerals shown in the figure are: bus 1 , cathode part 11 , anode part 12 , frame part 2 , connecting part 3 , insulating film 4 , and signal acquisition board 5 . DETAILED DESCRIPTION

[0039] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0040] The present application discloses a processing technology and an integrated busbar suitable for an integrated busbar of a new energy battery module. By making the busbar an integrated structure during hot pressing of an insulating film, the problem of expansion and contraction of the insulating film during hot pressing in the prior art, which makes it difficult to maintain relative dimensional accuracy between multiple split structure busbars, is solved.

[0041] First, the processing technologies applicable to the integrated busbars of new energy battery modules include: S100, processing a plurality of busbars 1 on a substrate, so that the plurality of busbars 1 are at least one integrated structure, wherein the plurality of busbars 1 can be processed on the substrate by punching, milling, laser cutting or other processes, such as Figure 1 and 2 The plurality of busbars 1 shown are an integrated structure.

[0042] It is also possible to make every several busbars 1 an integrated structure, and each integrated structure is disconnected to form two integrated structures, three integrated structures or other multiple integrated structures.

[0043] S200, such as Figure 4 As shown, an insulating film 4 is heat-pressed on a plurality of busbars 1 of an integrated structure.

[0044] S300, bending the cathode portion 11 of the busbar 1, and processing and disconnecting the connecting portion 3 that connects a plurality of busbars 1 into an integrated structure, such as Figure 7 As shown, several busbars 1 are of split structure.

[0045] The bending of the cathode part 11 and the processing and disconnection of the connecting part 3 are carried out simultaneously or in steps. The step-by-step process can be to bend the bus 1 first and then process and disconnect the connecting part 3, or to first process and disconnect the connecting part 3 and then bend the bus 1. The bending of the cathode part 11 can be achieved by a stamping process, and the processing and disconnection of the connecting part 3 can be achieved by punching, milling, laser cutting and other processes.

[0046] S400, assembling the signal acquisition board 5 on the bus bar 1 to form an integrated bus bar product that can be directly used for the battery.

[0047] Regarding the insulating film 4, the insulating film 4 used in S200 in this embodiment is provided with through holes that match the busbar 1, such as Figure 1 The busbar 1 shown in the figure includes a cathode portion 11 and an anode portion 12. A connecting portion 3 and a frame portion connected to the busbar 1 are provided on the substrate. Figure 3 The insulating film 4 is provided with through holes that cooperate with the cathode part 11 and the anode part 12 of the bus 1, so that the cathode part 11 and the anode part 12 are exposed to the outside and can cooperate with the signal acquisition board 5 and the cathode and anode of the battery.

[0048] The size of the insulating film 4 can be made smaller than the frame portion and matched with the size of the busbar 1 .

[0049] Alternatively, the size of the insulating film 4 may be matched with the frame portion, and the portion of the insulating film 4 covering the connecting portion 3 and the frame portion may be removed during the process of disconnecting the connecting portion 3 .

[0050] In another embodiment, the insulating film 4 used in S200 does not have a through hole formed therein to cooperate with the busbar 1 .

[0051] In S300, a through hole matching with the bus 1 is processed on the insulating film 4, wherein the three processes of processing the through hole on the insulating film 4, bending the bus 1, and disconnecting the connecting portion 3 can be performed simultaneously, and the processing sequence of the three can also be adjusted according to actual conditions.

[0052] Regarding the substrate, in this embodiment, Figure 1 The substrate processed in S100 includes: a frame portion 2, a connection portion 3 and a plurality of bus bars 1. The substrate can be made of a metal conductive material such as aluminum or copper, or a non-metal conductive material such as graphene, or a conductive material such as a composite material.

[0053] The frame portion 2 is arranged at the side of the plurality of busbars 1 , and the connecting portion 3 is arranged between the busbars 1 and the frame portion 2 . The plurality of busbars 1 are connected into an integrated structure through the frame portion 2 and the connecting portion 3 .

[0054] like Figure 1As shown, two frame parts 2 are respectively arranged on both sides of the busbar 1 , and both sides of each busbar 1 are connected to the frame part 2 through the connecting part 3 .

[0055] In this embodiment, the processing technology further includes: S101, after processing the substrate having the frame portion 2, the connection portion 3 and a plurality of bus bars 1 in S100, bending the cathode portion of the bus bar.

[0056] S200 , hot pressing an insulating film 4 on a plurality of busbars of the integrated structure.

[0057] S300, the connecting parts 3 that connect several bus bars 1 into an integrated structure are processed and disconnected, so that several bus bars 1 are split structures, and the cathode part 11 of the bus bar 1 is bent when the insulating film 4 is hot-pressed. It can also increase the positioning reference when the insulating film 4 is hot-pressed, and further improve the positioning accuracy when the insulating film 4 is hot-pressed.

[0058] In another embodiment, if Figure 2 The substrate after S100 processing shown includes: a connecting portion 3 and a plurality of bus bars 1 .

[0059] Connecting parts 3 are provided between adjacent busbars 1 , and several busbars 1 are connected into an integrated structure through the connecting parts 3 .

[0060] like Figure 2 As shown, three connecting portions 3 are provided between two adjacent busbars 1 , and the three connecting portions 3 respectively connect the two ends and the middle of the two busbars 1 .

[0061] The first embodiment of the second aspect is an integrated busbar formed after the S200 processing in the first aspect.

[0062] The integrated busbar includes: a substrate and an insulating film 4 .

[0063] like Figure 4 The insulating film 4 is shown to be provided on the surface of the substrate by thermal pressing.

[0064] like Figure 1 The substrate shown includes: a frame portion 2 , a connecting portion 3 and a plurality of bus bars 1 .

[0065] The frame portion 2 is arranged at the side of the plurality of busbars 1 , and the connecting portion 3 is arranged between the busbars 1 and the frame portion 2 . The plurality of busbars 1 are connected into at least one integrated structure through the frame portion 2 and the connecting portion 3 .

[0066] After the insulating film 4 is hot-pressed onto the substrate surface, the frame portion 2 and the connecting portion 3 are still retained on the substrate to connect the plurality of busbars 1 into an integrated structure, which can reduce the effect of the expansion and contraction of the insulating film 4 during hot-pressing on the relative dimensional accuracy of the plurality of busbars 1.

[0067] In a further embodiment, connecting portions 3 are provided between adjacent busbars 1 .

[0068] On the basis of setting the frame part 2, a connecting part 3 is provided between adjacent busbars 1 to support the middle part of the busbar 1, which can further improve the relative dimensional accuracy between the busbars 1 and is more suitable for busbars 1 with a longer length.

[0069] The second embodiment of the second aspect is different from the first embodiment of the second aspect in that the manner in which the busbars 1 are connected into an integrated structure is changed.

[0070] The integrated busbar includes: a substrate and an insulating film 4 .

[0071] The insulating film 4 is provided on the surface of the substrate by thermal compression.

[0072] like Figure 2 The substrate shown includes: a connecting portion 3 and a plurality of bus bars 1 .

[0073] Connecting portions 3 are provided between adjacent busbars 1 , and several busbars 1 are connected into at least one integrated structure via the connecting portions 3 .

[0074] After the insulating film 4 is hot-pressed on the substrate surface, the connecting portion 3 is still retained on the substrate to connect the plurality of busbars 1 into an integrated structure, which can reduce the influence of the expansion and contraction of the insulating film 4 during hot-pressing on the relative dimensional accuracy of the plurality of busbars 1.

[0075] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes may be made to it in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A processing technology applicable to the integrated busbar of new energy battery modules, characterized in that: include: S100, processing a plurality of bus bars on a substrate so that the plurality of bus bars are at least one integrated structure; S200, hot pressing an insulating film on a plurality of busbars of the integrated structure.

2. The processing technology for integrated busbar of new energy battery module according to claim 1 is characterized in that: Also includes: S300, bending the cathode portion of the busbar, and disconnecting the connecting portion of a plurality of busbars connected into an integrated structure, so that the plurality of busbars are split structures; The cathode portion bending and the connection portion processing and disconnection are performed simultaneously or in steps.

3. The processing technology applicable to the integrated busbar of the new energy battery module according to claim 2 is characterized in that: Also includes: S400, assemble the signal acquisition board on the bus.

4. The processing technology for integrated busbar of new energy battery module according to claim 1 is characterized in that: The insulating film used in S200 is provided with through holes that cooperate with the busbars.

5. The processing technology applicable to the integrated busbar of the new energy battery module according to claim 2 is characterized in that: The insulating film used in S200 does not have through holes for matching with the busbars; In S300, through holes matching with the busbars are processed in the insulating film.

6. The processing technology for integrated busbar of new energy battery module according to claim 1 is characterized in that: The substrate processed by S100 includes: a frame portion, a connection portion and a plurality of bus bars; The frame portion is arranged at the side of a plurality of bus bars, the connecting portion is arranged between the bus bar and the frame portion, and the plurality of bus bars are connected into an integrated structure through the frame portion and the connecting portion.

7. The processing technology for integrated busbar of new energy battery module according to claim 6 is characterized in that: Also includes: S101, after processing the substrate having the frame portion, the connection portion and a plurality of bus bars in S100, bending the cathode portion of the bus bar; S200, hot pressing an insulating film on a plurality of busbars of the integrated structure; S300, disconnecting the connection parts of the plurality of busbars connected into an integrated structure, so that the plurality of busbars are split structures.

8. The processing technology for integrated busbar of new energy battery module according to claim 1 is characterized in that: The substrate after S100 processing includes: a connection part and several bus bars; A connecting portion is provided between adjacent busbars, and a plurality of busbars are connected into an integrated structure through the connecting portion.

9. An integrated busbar, characterized in that: include: Substrate and insulating film; The insulating film is arranged on the surface of the substrate; The substrate includes: a frame portion, a connecting portion and a plurality of bus bars; The frame portion is arranged at the side of a plurality of bus bars, the connecting portion is arranged between the bus bars and the frame portion, and the plurality of bus bars are connected into at least one integrated structure through the frame portion and the connecting portion.

10. An integrated busbar, characterized in that: include: Substrate and insulating film; The insulating film is arranged on the surface of the substrate; The substrate includes: a connecting portion and a plurality of bus bars; A connecting portion is provided between adjacent busbars, and a plurality of busbars are connected into at least one integrated structure through the connecting portion.

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