Double-processing production line and control method of production line

Abstract

The invention discloses a double-machining production line and a control method of the production line, and relates to the technical field of solar cell laser machining, the double-machining production line comprises two bearing mechanisms arranged at intervals, a feeding mechanism, a discharging mechanism and a carrying mechanism, the feeding mechanism and the discharging mechanism are arranged between the two bearing mechanisms at intervals, and the carrying mechanism is arranged between the feeding mechanism and the discharging mechanism; the carrying mechanism comprises two carrying assemblies arranged in one-to-one correspondence with the two bearing mechanisms, and each carrying assembly can move in the first direction of the bearing mechanism; the carrying assemblies can transfer the silicon wafers on the feeding mechanism to the bearing mechanism and can also transfer the silicon wafers subjected to laser processing on the bearing mechanism to the discharging mechanism. According to the technical scheme provided by the invention, the technical problem of low production efficiency of an existing production line for solar cell production can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of solar cell laser processing, and in particular to a dual processing production line and a control method for the production line. Background Art

[0002] Solar cells are the core component of solar cells, which convert sunlight into electrical energy through the photoelectric effect. Solar cells are usually made of semiconductor materials, the most common of which is silicon. When using existing production lines for solar cell production for production and processing, it is usually only possible to perform laser processing on a single or a single group of silicon wafers, which will increase production time and affect production efficiency.

[0003] Therefore, it is necessary to provide a new dual processing production line and a control method for the production line to solve the above technical problems. Summary of the invention

[0004] The main purpose of the present invention is to provide a dual processing production line and a control method for the production line, aiming to solve the technical problem of low production efficiency in the existing production line for producing solar cells.

[0005] To achieve the above object, the present invention proposes a dual processing production line, comprising:

[0006] Two carrying mechanisms, the two carrying mechanisms are arranged at intervals;

[0007] A loading mechanism and a unloading mechanism, wherein the loading mechanism and the unloading mechanism are arranged between the two supporting mechanisms at intervals;

[0008] The conveying mechanism includes two conveying components arranged in one-to-one correspondence with the two carrying mechanisms, and each of the conveying components can move along the first direction of the carrying mechanism; each of the conveying components can transfer the silicon wafers on the loading mechanism to the carrying mechanism, and can also transfer the silicon wafers that have been laser processed on the carrying mechanism to the unloading mechanism.

[0009] In one embodiment, the conveying mechanism also includes a base and two driving members arranged on the base, the two conveying components are slidably arranged on the base, the two driving members are connected to the two conveying components one by one, and each driving member can drive the corresponding conveying component to slide along the first direction of the supporting mechanism.

[0010] In one embodiment, the transport assembly includes a mounting frame and two vacuum suction cups, the mounting frame is slidably disposed on the base, and the two vacuum suction cups are spaced apart from each other on the mounting frame along the second direction of the supporting mechanism.

[0011] In one embodiment, each of the bearing mechanisms comprises a turntable, a driving unit connected to the turntable, and two bearing members symmetrically arranged on the turntable, a transfer station and a processing station are symmetrically arranged above the turntable, one of the bearing members is located at one of the transfer station and the processing station, and the other bearing member is located at the other of the transfer station and the processing station; the driving unit can drive the turntable to rotate so that each of the bearing members can switch between the transfer station and the processing station;

[0012] Each of the transport components can transfer the silicon wafers on the loading mechanism to the carrier at the transfer station, and can also transfer the silicon wafers processed by laser on the carrier at the transfer station to the unloading mechanism.

[0013] In one embodiment, each of the supporting members includes two supporting plates, and the two supporting plates are spaced apart along the second direction of the supporting mechanism.

[0014] In one embodiment, each of the supporting plates is provided with a weight-reducing hole.

[0015] In one embodiment, the loading mechanism and the unloading mechanism each include a plurality of feeding units, and the plurality of feeding units are arranged at intervals along the first direction of the supporting mechanism.

[0016] In one embodiment, each of the feeding units includes a bracket, two first rollers arranged on the bracket at intervals along the first direction of the supporting mechanism, a first conveyor belt connecting the two first rollers, and a driving body arranged on the bracket; the driving body can drive the first rollers to rotate to drive the first conveyor belt to move.

[0017] In one embodiment, each of the feeding units also includes two second rollers arranged in one-to-one correspondence with the two first rollers and a second conveyor belt connecting the two second rollers, the second rollers and the corresponding first rollers are arranged at intervals along the second direction of the carrying mechanism, a connecting rod is arranged between one of the first rollers and the corresponding second roller, and the driving body drives the connecting rod to rotate through a synchronous belt.

[0018] In addition, the present invention also proposes a production line control method, which is applied to the above-mentioned dual processing production line. The production line control method includes:

[0019] Control one of the transport components to transfer the silicon wafer on the loading mechanism to the corresponding carrying mechanism, and control the other transport component to transfer the silicon wafer processed by laser on the corresponding carrying mechanism to the unloading mechanism;

[0020] Controlling the turntable of the carrying mechanism corresponding to one of the transport components to rotate, and controlling the other transport component to move to the loading mechanism;

[0021] Control the other of the transport components to transfer the silicon wafer on the loading mechanism to the corresponding carrying mechanism, and control one of the transport components to transfer the silicon wafer processed by laser on the corresponding carrying mechanism to the unloading mechanism;

[0022] The turntable of the carrying mechanism corresponding to another of the transport components is controlled to rotate, and at the same time, one of the transport components is controlled to move to the loading mechanism.

[0023] The technical solution of the present invention transfers silicon wafers through two transport components, and carries silicon wafers through two bearing mechanisms, so that external laser processing equipment can simultaneously perform laser processing on silicon wafers on two bearing mechanisms, that is, external laser processing equipment can simultaneously perform laser processing on two or two groups of silicon wafers, which can improve the production efficiency of the production line. In this embodiment, the loading mechanism is used to realize the loading of silicon wafers, and the unloading mechanism is used to realize the unloading of silicon wafers. The bearing mechanism is used to place silicon wafers for external laser processing equipment to perform laser processing on silicon wafers; the bearing mechanism is set to two, which can enable the external laser processing equipment to simultaneously perform laser processing on silicon wafers on two bearing mechanisms, that is, the external laser processing equipment can simultaneously perform laser processing on two or two groups of silicon wafers, which can improve the production efficiency of the production line. In a specific embodiment, a laser processing device is provided on one side of each bearing mechanism. Both transport components can move along the first direction of the bearing mechanism to transport silicon wafers, that is, each transport component can transport the silicon wafers on the loading mechanism to the corresponding bearing mechanism, and can also transport the silicon wafers on the bearing mechanism that have been laser processed by the external laser processing equipment to the unloading mechanism. The two handling components are used to transfer the silicon wafers, which can improve the transfer efficiency of the silicon wafers and thus improve the production efficiency of the production line. The dual processing production line is applied in the field of solar cell laser processing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0025] Figure 1 A schematic diagram of the structure of a double processing production line in an embodiment provided by the present invention;

[0026] Figure 2 for Figure 1 A magnified image of point A;

[0027] Figure 3 for Figure 1 Schematic diagram from another perspective;

[0028] Figure 4 for Figure 3 The enlarged view of point B;

[0029] Figure 5 for Figure 3 Enlarged view of point C;

[0030] Figure 6 It is a schematic flow chart of a control method of a production line in an embodiment provided by the present invention.

[0031] Description of Figure Numbers:

[0032] 100, bearing mechanism; 110, turntable; 111, transfer station; 112, processing station; 120, driving unit; 130, bearing member; 131, bearing plate; 132, weight reduction hole; 140, mounting block; 200, loading mechanism; 210, feeding unit; 211, bracket; 212, first roller; 213, first conveyor belt; 214, driving body; 215, second roller; 216, second conveyor belt; 217, connecting rod; 300, unloading mechanism; 400, conveying mechanism; 410, conveying assembly; 411, mounting frame; 412, vacuum suction cup; 420, base; 430, driving member.

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B.

[0037] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] In the related art, the production line for solar cell production is usually linear. When producing solar cells, laser processing equipment can usually only process silicon wafers of a single or a single group of solar cells. In the actual production process, the loading, unloading and testing of silicon wafers need to wait due to the constraints of the laser processing process, which will extend the production time of silicon wafers and affect production efficiency. In addition, in order to accommodate the linear production line, it is bound to require a longer production workshop. However, if a longer production workshop is selected just to adapt to the length of the production line, it is bound to result in the ineffective use of the component space of the production workshop, which will lead to waste of space in the production workshop.

[0039] The present invention provides a dual processing production line and a control method for the production line, aiming to solve the technical problem of low production efficiency existing in the existing production line for producing solar cells.

[0040] See also Figures 1 to 3 In one embodiment of the present invention, the dual processing production line includes two carrier mechanisms 100, a loading mechanism 200, a unloading mechanism 300 and a transport mechanism 400 which are arranged at intervals. The loading mechanism 200 and the unloading mechanism 300 are arranged at intervals between the two carrier mechanisms 100. The transport mechanism 400 includes two transport components 410 which are arranged in a one-to-one correspondence with the two carrier mechanisms 100. Each transport component 410 can move along the first direction of the carrier mechanism 100. Each transport component 410 can transfer the silicon wafer on the loading mechanism 200 to the carrier mechanism 100, and can also transfer the silicon wafer processed by laser on the carrier mechanism 100 to the unloading mechanism 300. The first direction refers to Figure 1 The direction indicated by the X in .

[0041] The technical solution of the present invention transports silicon wafers through two transport components 410, and carries silicon wafers through two carrying mechanisms 100, so that external laser processing equipment can simultaneously perform laser processing on silicon wafers on two carrying mechanisms 100, that is, external laser processing equipment can simultaneously perform laser processing on two or two groups of silicon wafers, which can improve the production efficiency of the production line. In this embodiment, the loading mechanism 200 is used to realize the loading of silicon wafers, and the unloading mechanism 300 is used to realize the unloading of silicon wafers. The carrying mechanism 100 is used to place silicon wafers for external laser processing equipment to perform laser processing on silicon wafers; setting the carrying mechanism 100 as two, it can enable the external laser processing equipment to simultaneously perform laser processing on silicon wafers on two carrying mechanisms 100, that is, enable the external laser processing equipment to simultaneously perform laser processing on two or two groups of silicon wafers, which can improve the production efficiency of the production line. In a specific embodiment, a laser processing device is provided on one side of each carrying mechanism 100. Both transport assemblies 410 can move along the first direction of the carrier mechanism 100 to transport silicon wafers, that is, each transport assembly 410 can transport silicon wafers on the loading mechanism 200 to the corresponding carrier mechanism 100, and can also transport silicon wafers on the carrier mechanism 100 that have been laser processed by an external laser processing device to the unloading mechanism 300. By transporting silicon wafers through two transport assemblies 410, it is possible to improve the transport efficiency of silicon wafers, thereby improving the production efficiency of the production line. The dual processing production line is applied to the field of solar cell laser processing technology.

[0042] In this embodiment, the unloading mechanism 300 conveys the silicon wafers along the second direction of the carrier mechanism 100, and the loading mechanism 200 conveys the silicon wafers in the opposite direction of the second direction of the carrier mechanism 100, and the loading mechanism 200, the unloading mechanism 300 and the two carrier mechanisms 100 are all arranged on the same side of the transport mechanism 400, wherein the second direction refers to Figure 1 In other words, the layout of the loading mechanism 200, the unloading mechanism 300, the transport mechanism 400 and the two supporting mechanisms 100 is rectangular, and compared with the linear production line in the related art, the length of the double processing production line is shorter. When the double processing production line is installed in the production workshop, due to the reduction in the length of the production line, the length of the production workshop accommodating the production line will also be smaller, that is, by using the double processing production line, the space of the production workshop can be more effectively utilized, thereby reducing the space waste of the production workshop.

[0043] See also Figure 1 , Figure 2In one embodiment of the present invention, the transport mechanism 400 further includes a base 420 and two driving members 430 disposed on the base 420, two transport assemblies 410 are slidably disposed on the base 420, the two driving members 430 are connected to the two transport assemblies 410 in a one-to-one correspondence, and each driving member 430 can drive the corresponding transport assembly 410 to slide along the first direction of the carrier mechanism 100. In this embodiment, each driving member 430 is used to drive the corresponding transport assembly 410 to slide along the first direction of the carrier mechanism 100 to achieve the transportation of silicon wafers. The two transport assemblies 410 are driven respectively by the two driving members 430, which can ensure the accuracy of the movement of each transport assembly 410 when sliding along the first direction of the carrier mechanism 100. In order to ensure the stability of the transport assembly 410 when sliding, corresponding matching structures such as slide rails and sliders, guide rods and guide blocks can be set between the transport assembly 410 and the base 420. In a specific embodiment, each driving member 430 drives the corresponding transport assembly 410 to slide along the first direction of the supporting mechanism 100 through one of a plurality of transmission modes such as screw transmission, chain transmission, and belt transmission.

[0044] See also Figure 2 In one embodiment of the present invention, the transport assembly 410 includes a mounting frame 411 and two vacuum suction cups 412. The mounting frame 411 is slidably disposed on the base 420, and the two vacuum suction cups 412 are spaced apart on the mounting frame 411 along the second direction of the carrying mechanism 100. In this embodiment, both vacuum suction cups 412 absorb silicon wafers by vacuum adsorption. The number of vacuum suction cups 412 is set to two, so that the transport assembly 410 can absorb two silicon wafers at the same time each time the silicon wafer is transported, which can improve the transport efficiency of the transport assembly 410, and thus improve the production efficiency of the dual processing production line. In addition, the number of vacuum suction cups 412 can also be three, four, etc. In a specific embodiment, the vacuum suction cup 412 can be a Bernoulli suction cup.

[0045] See also Figure 2 , Figure 5In one embodiment of the present invention, each carrier mechanism 100 includes a turntable 110, a driving unit 120 connected to the turntable 110, and two carriers 130 symmetrically arranged on the turntable 110. A transfer station 111 and a processing station 112 are symmetrically arranged above the turntable 110, one of the carriers 130 is located at one of the transfer station 111 and the processing station 112, and the other carrier 130 is located at the other of the transfer station 111 and the processing station 112; the driving unit 120 can drive the turntable 110 to rotate so that each carrier 130 switches between the transfer station 111 and the processing station 112; each transport component 410 can transfer the silicon wafers on the loading mechanism 200 to the carrier 130 at the transfer station 111, and can also transfer the silicon wafers that have been laser processed on the carrier 130 at the transfer station 111 to the unloading mechanism 300. Specifically, the two turntables 110 are respectively placed at the transfer station 111 and the processing station 112, and the drive unit 120 drives the turntable 110 to rotate, so that the two carriers 130 switch between the transfer station 111 and the processing station 112, which enables the external laser processing equipment to perform laser processing on the silicon wafer on the carrier 130 at the processing station 112 when the handling assembly 410 transfers the silicon wafer to the carrier 130 at the transfer station 111, that is, the transfer and laser processing of the silicon wafer can be carried out at the same time, which can improve production efficiency. In a specific embodiment, the carrier mechanism 100 also includes a mounting block 140, the middle part of the mounting block 140 is arranged at the center of the turntable 110, and the two carriers 130 are respectively arranged at both ends of the mounting block 140.

[0046] See also Figure 5 In one embodiment of the present invention, each carrier 130 includes two carrier plates 131, and the two carrier plates 131 are spaced apart along the second direction of the carrier mechanism 100. Specifically, the two carrier plates 131 are used to place silicon wafers. By setting the number of carrier plates 131 to two, the transport assembly 410 can transport two silicon wafers at the same time, and the external laser processing equipment can perform laser processing on the two silicon wafers at the same time, which can improve the transportation efficiency and processing efficiency of the silicon wafers, thereby improving the production efficiency of the dual processing production line. In addition, the number of carrier plates 131 can also be three, four, etc., and it only needs to ensure that the number of carrier plates 131 is consistent with the number of vacuum suction cups 412. In one embodiment of the present invention, in order to reduce the weight of the carrier plates 131, weight reduction holes 132 can be opened on each carrier plate 131.

[0047] See also Figure 1 , Figure 4In one embodiment of the present invention, the loading mechanism 200 and the unloading mechanism 300 each include a plurality of feeding units 210, and the plurality of feeding units 210 are arranged at intervals along the first direction of the supporting mechanism 100. Specifically, the loading mechanism 200 and the unloading mechanism 300 each consist of a plurality of feeding units 210, that is, the loading mechanism 200 and the unloading mechanism 300 are both split into a plurality of feeding units 210, which can modularize the loading mechanism 200 and the unloading mechanism 300 to reduce the installation difficulty of the loading mechanism 200 and the unloading mechanism 300. Moreover, in actual use, the number of feeding units 210 can be selected according to actual needs.

[0048] See also Figure 4 In one embodiment of the present invention, each feeding unit 210 includes a bracket 211, two first rollers 212 spaced apart on the bracket 211 along the first direction of the bearing mechanism 100, a first conveyor belt 213 connecting the two first rollers 212, and a driving body 214 disposed on the bracket 211; the driving body 214 can drive the first rollers 212 to rotate, so as to drive the first conveyor belt 213 to move. In this embodiment, the first rollers 212 are driven to rotate by the driving body 214, so as to drive the first conveyor belt 213 wound around the two first rollers 212 to move, thereby transporting the silicon wafers on the feeding unit 210 to the next feeding unit 210. Specifically, when producing and manufacturing the feeding unit 210, the two first rollers 212 can be set at different intervals according to actual needs.

[0049] See also Figure 6 In one embodiment of the present invention, each feeding unit 210 further includes two second rollers 215 arranged in one-to-one correspondence with the two first rollers 212 and a second conveyor belt 216 connecting the two second rollers 215. The second rollers 215 and the corresponding first rollers 212 are arranged at intervals along the second direction of the bearing mechanism 100. A connecting rod 217 is arranged between one of the first rollers 212 and the corresponding second roller 215. The driving body 214 drives the connecting rod 217 to rotate through a synchronous belt. Specifically, the first conveyor belt 213 and the second conveyor belt 216 are both used to place silicon wafers. The driving body 214 drives the connecting rod 217 to rotate, which can drive the first rollers 212 and the second rollers 215 at both ends of the connecting rod 217 to rotate, thereby driving the conveyor belts wound around the corresponding rollers to move, and transporting the silicon wafers on the feeding unit 210 to the next feeding unit 210.

[0050] The present invention also proposes a production line control method, which is applied to the above-mentioned dual processing production line. The production line control method includes (the following contents are Figure 1 For description):

[0051] S100, controlling one of the transport components 410 to transfer the silicon wafer on the loading mechanism 200 to the corresponding carrier mechanism 100, and controlling the other transport component 410 to transfer the silicon wafer on the corresponding carrier mechanism 100 that has been laser processed to the unloading mechanism 300. Specifically, controlling the corresponding driving member 430 to drive the left transport component 410 to transfer the silicon wafer on the loading mechanism 200 to the left carrier mechanism 100, and controlling the corresponding driving member 430 to drive the right transport component 410 to transfer the silicon wafer on the right carrier mechanism 100 that has been laser processed by an external laser processing device to the unloading mechanism 300.

[0052] S200, controlling the turntable 110 of the carrier mechanism 100 corresponding to one of the transport components 410 to rotate, and controlling the other transport component 410 to move to the loading mechanism 200. Specifically, controlling the driving unit 120 of the carrier mechanism 100 on the left to drive the turntable 110 to rotate, so as to switch the positions of the carrier plates 131, and controlling the corresponding driving member 430 to drive the transport component 410 on the right to move to the loading mechanism 200. In this process, the transport component 410 on the right is moved to the loading mechanism 200 in advance, which can avoid the collision between the two transport components 410.

[0053] S300, control another transport component 410 to transfer the silicon wafers on the loading mechanism 200 to the corresponding carrying mechanism 100, and at the same time control one of the transport components 410 to transfer the silicon wafers that have been laser processed on the corresponding carrying mechanism 100 to the unloading mechanism 300; specifically, control the right transport component 410 to transfer the silicon wafers on the loading mechanism 200 to the right carrying mechanism 100, and at the same time control the left transport component 410 to transfer the silicon wafers that have been laser processed by external laser processing equipment on the left carrying mechanism 100 to the unloading mechanism 300.

[0054] S400, control the turntable 110 of the carrier mechanism 100 corresponding to another carrier assembly 410 to rotate, and control one of the carrier assemblies 410 to move to the loading mechanism 200. Specifically, control the drive unit 120 of the carrier mechanism 100 on the right to drive the turntable 110 to rotate, so as to switch the positions of each carrier plate 131, and control the corresponding drive member 430 to drive the carrier assembly 410 on the left to move to the loading mechanism 200. In this process, the carrier assembly 410 on the right is moved to the loading mechanism 200 in advance, which can avoid the collision between the two carrier assemblies 410. After S400 is completed, repeat the above steps.

[0055] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A double processing production line, characterized in that: include: Two carrying mechanisms, the two carrying mechanisms are arranged at intervals; A loading mechanism and a unloading mechanism, wherein the loading mechanism and the unloading mechanism are arranged between the two supporting mechanisms at intervals; The conveying mechanism includes two conveying components arranged in one-to-one correspondence with the two carrying mechanisms, and each of the conveying components can move along the first direction of the carrying mechanism; each of the conveying components can transfer the silicon wafers on the loading mechanism to the carrying mechanism, and can also transfer the silicon wafers that have been laser processed on the carrying mechanism to the unloading mechanism.

2. The dual processing production line according to claim 1, characterized in that: The conveying mechanism also includes a base and two driving members arranged on the base, the two conveying components are slidably arranged on the base, the two driving members are connected to the two conveying components one by one, and each driving member can drive the corresponding conveying component to slide along the first direction of the supporting mechanism.

3. The dual processing production line according to claim 2, characterized in that: The transport assembly comprises a mounting frame and two vacuum suction cups. The mounting frame is slidably arranged on the base, and the two vacuum suction cups are spaced apart from each other on the mounting frame along the second direction of the bearing mechanism.

4. The dual processing production line according to claim 1, characterized in that: Each of the bearing mechanisms comprises a turntable, a driving unit connected to the turntable, and two bearing members symmetrically arranged on the turntable. A transfer station and a processing station are symmetrically arranged above the turntable, one of the bearing members is located at one of the transfer station and the processing station, and the other bearing member is located at the other of the transfer station and the processing station; the driving unit can drive the turntable to rotate so that each of the bearing members can switch between the transfer station and the processing station; Each of the transport components can transfer the silicon wafers on the loading mechanism to the carrier at the transfer station, and can also transfer the silicon wafers processed by laser on the carrier at the transfer station to the unloading mechanism.

5. The dual processing production line according to claim 4, characterized in that: Each of the bearing members comprises two bearing plates, and the two bearing plates are arranged at intervals along the second direction of the bearing mechanism.

6. The dual processing production line according to claim 5, characterized in that: Each of the bearing plates is provided with a weight-reducing hole.

7. The dual processing production line according to claim 1, characterized in that: The loading mechanism and the unloading mechanism both include a plurality of feeding units, and the plurality of feeding units are arranged at intervals along the first direction of the supporting mechanism.

8. The dual processing production line according to claim 7, characterized in that: Each of the feeding units includes a bracket, two first rollers arranged on the bracket at intervals along the first direction of the supporting mechanism, a first conveyor belt connecting the two first rollers, and a driving body arranged on the bracket; the driving body can drive the first rollers to rotate to drive the first conveyor belt to move.

9. The dual processing production line according to claim 8, characterized in that: Each of the feeding units also includes two second rollers arranged in one-to-one correspondence with the two first rollers and a second conveyor belt connecting the two second rollers, the second rollers and the corresponding first rollers are arranged at intervals along the second direction of the carrying mechanism, a connecting rod is arranged between one of the first rollers and the corresponding second roller, and the driving body drives the connecting rod to rotate through a synchronous belt.

10. A production line control method, applied to the dual processing production line according to any one of claims 1 to 9, characterized in that: The production line control method comprises: Control one of the transport components to transfer the silicon wafer on the loading mechanism to the corresponding carrying mechanism, and control the other transport component to transfer the silicon wafer processed by laser on the corresponding carrying mechanism to the unloading mechanism; Controlling the turntable of the carrying mechanism corresponding to one of the transport components to rotate, and controlling the other transport component to move to the loading mechanism; Control the other transport component to transfer the silicon wafer on the loading mechanism to the corresponding carrying mechanism, and control one of the transport components to transfer the silicon wafer processed by laser on the corresponding carrying mechanism to the unloading mechanism; The turntable of the carrying mechanism corresponding to another of the transport components is controlled to rotate, and at the same time, one of the transport components is controlled to move to the loading mechanism.

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