Cutting fluid spraying device, multi-wire cutting equipment and multi-wire cutting method

Abstract

The invention provides a cutting fluid spraying device, multi-wire cutting equipment and a multi-wire cutting method.The cutting fluid spraying device is applied to the multi-wire cutting equipment, and the multi-wire cutting equipment comprises a cutting wire used for cutting a crystal bar; the cutting fluid spraying device comprises a nozzle unit, the nozzle unit comprises a nozzle arranged above a cutting line and used for spraying cutting fluid and a moving assembly used for moving the nozzle, the moving assembly comprises at least one moving unit, each moving unit comprises a driving part, a mounting part and a moving part, the nozzle is arranged on the mounting part, and the moving part is arranged on the mounting part; the moving part can drive the mounting part to move under the driving of the driving part; and the nozzle movement control unit is used for obtaining position change information of a cutting point of the crystal bar and the cutting line in the wire cutting process and controlling the moving assembly to move the nozzle based on the position change information, so that the distance between the nozzle and the cutting point is within a threshold value. According to the cutting fluid spraying device, the multi-wire cutting equipment and the multi-wire cutting method, the cutting quality can be improved, and the cost can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of multi-wire cutting, and in particular to a cutting fluid spraying device, multi-wire cutting equipment and a multi-wire cutting method. Background Art

[0002] Multi-wire cutting is a cutting method that uses the reciprocating motion of a metal wire to bring abrasives into the processing area for grinding, and simultaneously cuts silicon crystal rods into hundreds of silicon wafers. At present, CNC multi-wire cutting machines have gradually replaced traditional inner circle cutting and become the main method of silicon wafer cutting due to their high efficiency, high production capacity, and high precision.

[0003] During the multi-wire cutting process, cutting fluid is continuously sprayed on the cutting wire, and the cutting wire carries the cutting fluid back and forth to complete the cutting of the crystal rod. In the prior art, the cutting fluid is sprayed through a fixed cutting fluid nozzle. However, during the cutting process, the cutting fluid nozzle is too far away from the cutting position of the crystal rod, and the cutting fluid is lost when the cutting wire carries the cutting fluid back and forth, which has a high production cost and affects the cutting quality. Summary of the invention

[0004] In order to solve at least one technical problem in the above-mentioned prior art, the embodiments of the present disclosure provide a cutting fluid spraying device, a multi-wire cutting device and a multi-wire cutting method.

[0005] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0006] In a first aspect, an embodiment of the present disclosure provides a cutting fluid spraying device, which is applied to a multi-wire cutting device, wherein the multi-wire cutting device includes a cutting wire for cutting a crystal rod; the cutting fluid spraying device includes:

[0007] a nozzle unit, comprising a nozzle disposed above the cutting line for spraying cutting fluid, and a moving assembly for moving the nozzle, wherein the moving assembly comprises at least one moving unit, the moving unit comprises a driving member, a mounting member and a moving member, the nozzle is disposed on the mounting member, and the moving member is configured to drive the mounting member to move under the drive of the driving member; and

[0008] The nozzle movement control unit is used to obtain the position change information of the cutting point between the crystal rod and the cutting line during the online cutting process, and based on the position change information, control the moving component to move the nozzle so that the distance between the nozzle and the cutting point is within a threshold.

[0009] Exemplarily, the multi-wire cutting device also includes two spools, and the cutting wire is wound around the two spools; wherein the mounting member is located above the cutting wire, and the spray direction of the nozzle is toward the cutting point; the movable member includes at least one movable rod, and the movable rod is arranged along the radial extension of the spool, the axial first end of the movable rod is connected to the driving member, and the axial second end of the movable rod is connected to the mounting member, and the movable rod is constructed so that the extension length along its own axial direction can be adjusted under the control of the driving member.

[0010] Exemplarily, each of the moving units includes two moving rods arranged in parallel, and the axial first end of one of the moving rods is located at one axial end of the bobbin, and the axial first end of the other moving rod is located at the other axial end of the bobbin.

[0011] Exemplarily, the mounting member is configured as a rod-shaped structure extending in an axial direction parallel to the line axis, and the nozzle is arranged along the axial direction of the mounting member.

[0012] Exemplarily, the multi-wire cutting equipment also includes two spools, and the cutting wires are wound around the two spools; the moving assembly includes two moving units, and the two moving units are respectively located on radially opposite sides of the crystal rod, and one of the moving units is installed on one of the spools, and the other moving unit is installed on the other spool.

[0013] Exemplarily, the driving member includes a servo motor.

[0014] Exemplarily, the obtaining of position change information of a cutting point between a crystal rod and a cutting line during the online cutting process specifically includes:

[0015] Based on the cutting parameters of the wire cutting, obtaining the length change data of the cutting wire entering the crystal ingot at different time points, wherein the cutting parameters include at least one or more of the diameter of the crystal ingot, the moving speed of the crystal ingot, and the inclination angle of the cutting wire relative to the crystal ingot;

[0016] Based on the cutting line length variation data, position variation information of the cutting point formed by the contact position between the outer peripheral surface of the crystal rod and the cutting line is obtained.

[0017] Exemplarily, based on the position change information, controlling the moving component to move the nozzle so that the distance between the nozzle and the cutting point is within a threshold value specifically includes:

[0018] Pre-storing the corresponding relationship data between the position of the cutting point and the moving distance of the nozzle;

[0019] Based on the position change information and the corresponding relationship data, the moving component is controlled in real time to move the nozzle so that the distance between the nozzle and the cutting point is within a threshold.

[0020] In a second aspect, an embodiment of the present disclosure further provides a multi-wire cutting device, comprising the cutting fluid spraying device as described above.

[0021] In a third aspect, the present disclosure also provides a multi-wire cutting method, which is applied to the multi-wire cutting device as described above, and the method comprises the following steps:

[0022] Obtaining position change information of the cutting point between the crystal rod and the cutting line during the online cutting process;

[0023] Based on the position change information, the moving component is controlled to move the nozzle so that the distance between the nozzle and the cutting point is within a threshold.

[0024] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0025] In the cutting fluid spray device, multi-wire cutting equipment and multi-wire cutting method of the disclosed embodiments, the nozzle in the cutting fluid spray device is designed to be movable, and the position change information of the cutting point between the crystal rod and the cutting line during the online cutting process is obtained by the nozzle movement control unit, and based on the position change information, the moving component is controlled to move the nozzle so that the distance between the nozzle and the cutting point is within the threshold. In this way, the nozzle can be moved as the cutting position changes, so that the distance between the nozzle and the cutting point is always kept within the threshold, avoiding the loss of cutting fluid caused by the cutting fluid nozzle being too far away from the cutting position during the cutting process, thereby improving the cutting quality and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram showing the structure of a multi-wire cutting device;

[0027] Figure 2 A front view showing a multi-wire cutting device according to an embodiment of the present disclosure;

[0028] Figure 3 A schematic diagram of the three-dimensional structure of a multi-wire cutting device in an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0030] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0031] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0032] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0033] See also Figure 1 , which shows a schematic diagram of a multi-wire cutting device, it can be understood that Figure 1 The structure shown is only for the purpose of illustrating the principle, and does not mean that those skilled in the art will not be able to Figure 1 The embodiments of the present invention do not impose any specific limitation on the addition or reduction of components in the illustrated structure.

[0034] like Figure 1 As shown, the multi-wire cutting device may include a wire cutting unit 11 and a carrying unit 12 ; the wire cutting unit 11 may be placed vertically below the carrying unit 12 in some examples, or may be placed vertically above the carrying unit 12 in some examples.

[0035] Specifically, the wire cutting unit 11 may include a plurality of wire reels 11a and a cutting wire 30, wherein the cutting wire 30 is wound around the wire reels 11a to form an array of cutting wire segments parallel to each other; Figure 1 In the embodiment, the number of the bobbins 11a is 2 as an example, and the reciprocating motion directions of the bobbins 11a and the cutting wire 30 toward and away from the carrying unit 12 are as follows: Figure 1 As shown by the solid arrow in FIG. 1 , the reciprocating speed may be 10 m / s to 15 m / s. The carrying unit 12 is used to load and fix the crystal rod 20. Figure 1 In the example shown, the carrier unit 12 may include a base and an intermediate piece, and the intermediate piece may fix the crystal rod to the base. For example, the crystal rod may be fixed to the base by bonding its circumferential surface to the lower surface or the upper surface of the base using resin.

[0036] for Figure 1The wire cutting device shown in the figure can move the wire cutting unit 11 or the carrying unit 12 to make the cutting wire 30 and the crystal rod 20 move toward each other in the vertical direction. After the cutting wire 30 and the crystal rod 20 contact each other, the crystal rod 20 is cut by using the movement of the cutting wire 30 along its extension direction.

[0037] In such Figure 1 In the example shown, the wire cutting unit 11 can be moved in the direction indicated by the arrow to achieve the vertical movement of the cutting wire 30 and the crystal rod 20 toward each other.

[0038] It should be noted that the embodiment of the present invention realizes the relative movement between the wire cutting unit 11 or the carrying unit 12 by installing a lifting device (not shown in the figure). It can be understood that those skilled in the art can also realize the movement of the wire cutting unit 11 or the carrying unit 12 in other ways according to actual needs and implementation scenarios.

[0039] It should be noted that during the wire cutting operation, the diameter of the wire shaft 11a is larger than the diameter of the crystal ingot, so that the distance between the cutting wire segment arrays located on the upper and lower sides of the wire shaft 11a is larger than the diameter of the crystal ingot. In this way, only the cutting wire segment array located on one side of the wire shaft 11a will cut the crystal ingot, while the cutting wire segment array located on the other side of the wire shaft 11a will not contact the crystal ingot, so as to Figure 1 For example, the cutting wire winding shaft 11a moves, wherein only the cutting wire segment array located above the shaft 11a will cut the silicon wafer, so the wire cutting area is also located on the upper side of the shaft 11a, and the cutting wire segment leaving the wire cutting area will move to the lower side of the shaft 11a. After traveling a distance without load, the winding shaft 11a returns to the upper side of the shaft 11a and enters the wire cutting area again to participate in the cutting operation, and so on, until it moves away from the shaft 11a and is taken up by the take-up wheel.

[0040] During the wire cutting process, the cutting wire 30 brings the cutting fluid to the cutting position through reciprocating motion. During the cutting process, the length of the cutting wire entering the crystal rod 20 gradually changes as the cutting proceeds, that is, the contact length between the cutting wire 30 and the crystal rod 20 changes.

[0041] In the prior art, since the cutting fluid nozzle is in a fixed position, the cutting fluid nozzle is too far away from the cutting position of the crystal rod during the cutting process. When the cutting line carries the cutting fluid back and forth, the cutting fluid is lost, which has a high production cost and affects the cutting quality.

[0042] In view of this, a cutting fluid spraying device is provided in the embodiment of the present disclosure, which can improve cutting quality and reduce costs. Figure 2 and Figure 3As shown, the cutting fluid spraying device provided by the embodiment of the present disclosure may include: a nozzle unit 100 and a nozzle movement control unit 200 .

[0043] The nozzle unit 100 includes a nozzle 110 for spraying cutting fluid, which is arranged above the cutting line 30, and a moving component 120 for moving the nozzle 110; the nozzle 110 movement control unit 200 is used to obtain the position change information of the cutting point of the crystal rod 20 and the cutting line 30 during the online cutting process, and based on the position change information, control the moving component 120 to move the nozzle 110 so that the distance between the nozzle 110 and the cutting point is within a threshold.

[0044] In the above scheme, the nozzle 110 is designed to be movable in the cutting fluid spraying device, and the position change information of the cutting point between the crystal rod 20 and the cutting line 30 is obtained by the nozzle 110 movement control unit 200 during the online cutting process, and based on the position change information, the moving component 120 is controlled to move the nozzle 110 so that the distance between the nozzle 110 and the cutting point is within the threshold. In this way, the nozzle 110 can be moved as the cutting position changes, so that the distance between the nozzle 110 and the cutting point is always kept within the threshold, avoiding the loss of cutting fluid caused by the cutting fluid nozzle 110 being too far away from the cutting position during the cutting process, thereby improving the cutting quality and reducing costs.

[0045] like Figure 2 and Figure 3 As shown, the multi-wire cutting device includes two spools 11a, and the cutting wire 30 is wound on the two spools 11a. As an exemplary embodiment, the moving assembly 120 includes at least one moving unit 120A, and the moving unit 120A includes a driving member 121, a mounting member 122 and a moving member. The nozzle 110 is arranged on the mounting member 122, and the moving member can drive the mounting member 122 to move under the drive of the driving member 121.

[0046] See also Figure 2 and Figure 3 As shown, the mounting member 122 is located above the cutting line 30, the nozzle 110 is arranged on the mounting member 122, and the spraying direction of the nozzle 110 is toward the cutting point; the moving member includes at least one moving rod 123, the moving rod 123 is arranged along the radial extension of the bobbin 11a, and the axial first end of the moving rod 123 is connected to the driving member 121, and the axial second end of the moving rod 123 is connected to the mounting member 122, and the moving rod 123 is constructed to be adjustable along its own axial extension length under the control of the driving member 121.

[0047] In the above scheme, the nozzle 110 can be moved along the radial direction of the bobbin 11a to achieve the purpose of making the distance between the nozzle 110 and the cutting point within a threshold value. By utilizing the moving rod 123 arranged radially along the bobbin 11a and the mounting member 122 arranged axially along the bobbin 11a, the moving rod 123 can be driven by the driving member 121 to achieve the purpose of moving the nozzle 110. In this way, the moving component 120 does not require a complex mechanical structure, has a relatively simple structure, and has a low cost.

[0048] In addition, in some embodiments, the moving rod 123 may be a lead screw, and the driving member 121 may be a servo motor. A servo motor is an electric motor that can accurately control angle, position, speed and acceleration. A servo motor is usually equipped with a feedback device, such as an encoder or a potentiometer, for real-time monitoring of the output position and speed of the motor. These feedback signals will be transmitted to the control system. The control system receives information from the feedback device and compares it with the set target. Based on the comparison result, the control system will determine the need to adjust the input signal of the motor so that the motor reaches the desired state. The signal output by the control system will control the power supply of the servo motor through a drive circuit (such as a PWM control circuit) to adjust the speed and direction of the motor. The motor body of the servo motor is usually a DC motor or a stepper motor, and its structural design enables it to respond quickly to control signals and quickly adjust the rotation after receiving the drive signal. The operation of the servo motor is a closed-loop control system, which means that the control system continuously receives feedback signals and adjusts the input signals in real time to ensure that the output of the motor is consistent with the set target. The servo motor can achieve high-precision and high-responsive motion control.

[0049] In this way, when the lead screw is driven to rotate by the servo motor, the axial length of the lead screw is adjustable, and the movement of the nozzle 110 is controlled by the servo motor, with high control accuracy.

[0050] It is understandable that the moving rod 123 is not limited to a lead screw, for example, the moving rod 123 may also be a telescopic rod, and the driving member 121 may also be a driving cylinder, etc. The specific structure of the moving rod 123 is not limited.

[0051] In addition, it should be noted that, in the above-mentioned embodiment, the position adjustment of the nozzle 110 is achieved by utilizing the change in the axial length of the movable rod 123 itself; in other embodiments, the movable rod 123 can be replaced by a guide rail, and the mounting member 122 can be slidably mounted on the guide rail, so as to adjust the position of the mounting member 122, thereby achieving the position adjustment of the nozzle 110.

[0052] However, the specific structure of the moving component 120 is not limited thereto, as long as the driving member 121 can realize an adjustable axial length structure.

[0053] See also Figure 2 and Figure 3 As shown, in some embodiments, the mounting member 122 is configured as a rod-shaped structure extending in an axial direction parallel to the wire axis 11a, and the nozzle 110 is arranged along the axial direction of the mounting member 122. For example, the nozzle 110 is configured to cover the entire or at least most of the axial length of the crystal rod 20, so as to ensure that each cutting area of ​​the crystal rod 20 along the axial direction can be sprayed with cutting fluid.

[0054] See also Figure 2 and Figure 3 As shown, in some embodiments, each of the moving units 120A includes two moving rods 123 arranged in parallel, and the axial first end of one of the moving rods 123 is located at one axial end of the bobbin 11a, and the axial first end of the other moving rod 123 is located at the other axial end of the bobbin 11a. In this way, by providing two moving rods 123 arranged in parallel, the stability of the movement of the nozzle 110 can be ensured.

[0055] In some embodiments, the first axial end of the moving rod 123 and the driving member 121 may be fixedly mounted on one axial end of the bobbin 11 a .

[0056] In other embodiments, the first axial end of the moving rod 123 may also be configured to be pivotally connected to one axial end of the bobbin 11a, that is, the moving rod 123 may rotate relative to the bobbin 11a around an axis parallel to the bobbin 11a. In this way, the nozzle 110 may not only be moved radially along the bobbin 11a, but may also be rotated axially along the bobbin 11a to adjust the position of the nozzle 110 so that the distance from the nozzle 110 to the cutting point is within a threshold value. It should be noted that the threshold value may be a range value obtained based on production experience.

[0057] In addition, as an exemplary embodiment, Figure 2 and Figure 3 As shown, the moving assembly 120 includes two moving units 120A, which are respectively located on opposite radial sides of the crystal rod 20, and one of the moving units 120A is installed on one of the bobbins 11a, and the other moving unit 120A is installed on the other bobbins 11a. In this way, the two moving units 120A can spray cutting fluid onto the cutting wire 30 from the radial sides of the crystal rod 20.

[0058] In addition, as an exemplary embodiment, the obtaining of the position change information of the cutting point between the crystal rod 20 and the cutting line 30 during the online cutting process specifically includes:

[0059] Based on the cutting parameters of the wire cutting, obtaining the length change data of the cutting wire 30 entering the crystal ingot 20 at different time points, wherein the cutting parameters include at least one or more of the diameter of the crystal ingot 20, the moving speed of the crystal ingot 20, and the inclination angle of the cutting wire 30 relative to the crystal ingot 20;

[0060] Based on the length variation data of the cutting line 30 , position variation information of the cutting point formed by the contact position between the outer peripheral surface of the crystal rod 20 and the cutting line 30 is obtained.

[0061] For the wire cutting equipment, the wire cutting unit 11 or the carrying unit 12 can be moved to make the cutting wire 30 and the crystal rod 20 move toward each other in the vertical direction. After the cutting wire 30 and the crystal rod 20 contact each other, the cutting wire 30 is used to cut the crystal rod 20 by moving along its extension direction. As the cutting time increases, the length of the cutting wire 30 entering the crystal rod 20 will gradually change, that is, the contact length of the cutting wire 3020 and the crystal rod 20 will gradually change.

[0062] Furthermore, the length variation data of the cutting line 30 entering the crystal rod 20 can be calculated based on at least one or more cutting parameters including the diameter of the crystal rod 20 , the moving speed of the crystal rod 20 , and the inclination angle of the cutting line 30 relative to the crystal rod 20 .

[0063] The contact point between the cutting line 30 and the peripheral surface of the crystal rod 20 is regarded as the cutting point, and the position change of the cutting point is associated with the length change of the cutting line 30 entering the crystal rod 20. Therefore, based on the length change data of the cutting line 30, the position change information of the cutting point formed by the contact position between the outer peripheral surface of the crystal rod 20 and the cutting line 30 can be obtained.

[0064] Of course, it can be understood that the above is only one implementation method of obtaining the position change information of the cutting point. In other embodiments, the position change signal of the cutting point can also be realized by detecting the position of the cutting line 30 through a position sensor, etc. Compared with the method of using a position sensor to sense the position of the cutting point, directly obtaining the position change information of the cutting point based on the cutting parameters does not require the setting of a position sensor, which is lower in cost.

[0065] In addition, in some exemplary embodiments, based on the position change information, controlling the moving component 120 to move the nozzle 110 so that the distance between the nozzle 110 and the cutting point is within a threshold value specifically includes:

[0066] Pre-storing the corresponding relationship data between the position of the cutting point and the moving distance of the nozzle 110;

[0067] Based on the position change information and the corresponding relationship data, the moving component 120 is controlled in real time to move the nozzle 110 so that the distance between the nozzle 110 and the cutting point is within a threshold.

[0068] The above solution can control the movement of the nozzle 110 in real time through the position change information and the pre-stored corresponding relationship data, wherein the corresponding relationship data can be data obtained through multiple test verifications.

[0069] In addition, the embodiment of the present disclosure further provides a multi-wire cutting device, including the cutting fluid spraying device provided in the embodiment of the present disclosure. Since the principle of solving the problem by the multi-wire cutting device is similar to the principle of solving the problem by the above-mentioned cutting fluid spraying device, the embodiment of the multi-wire cutting device provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned cutting fluid spraying device provided in the embodiment of the present disclosure, and will not be repeated here.

[0070] In addition, the embodiment of the present disclosure further provides a multi-wire cutting method, which is applied to the multi-wire cutting device provided in the embodiment of the present disclosure, and the method comprises the following steps:

[0071] Step S01, obtaining position change information of the cutting point of the crystal rod 20 and the cutting line 30 during the online cutting process;

[0072] Step S02: Based on the position change information, control the moving component 120 to move the nozzle 110 so that the distance between the nozzle 110 and the cutting point is within a threshold.

[0073] Exemplarily, the above step S01 specifically includes:

[0074] Step S011, based on the cutting parameters of the wire cutting, obtaining the length change data of the cutting wire 30 entering the crystal ingot 20 at different time points, wherein the cutting parameters include at least one or more of the diameter of the crystal ingot 20, the moving speed of the crystal ingot 20, and the inclination angle of the cutting wire 30 relative to the crystal ingot 20;

[0075] Step S012 : based on the length variation data of the cutting line 30 , obtaining position variation information of the cutting point formed by the contact position between the outer peripheral surface of the crystal rod 20 and the cutting line 30 .

[0076] Exemplarily, the above step S02 specifically includes:

[0077] Step S021, pre-storing the corresponding relationship data between the position of the cutting point and the moving distance of the nozzle 110;

[0078] Step S022: Based on the position change information and the corresponding relationship data, the moving component 120 is controlled in real time to move the nozzle 110 so that the distance between the nozzle 110 and the cutting point is within a threshold.

[0079] Since the principle of solving the problem by the multi-wire cutting method is similar to the principle of solving the problem by the above-mentioned multi-wire cutting device, the embodiment of the multi-wire cutting method provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned multi-wire cutting device provided in the embodiment of the present disclosure, and will not be repeated here.

[0080] In addition, an embodiment of the present disclosure provides a device, which includes a memory and a processor, wherein the memory is used to store an executable program, and the processor is configured to run the executable program to implement the steps of the crystal rod 20 breakage detection method as described above.

[0081] In addition, an embodiment of the present disclosure further provides a computer-readable storage medium, on which an executable program is stored, and the executable program is executed by a processor to implement the steps of the multi-wire cutting method as described above.

[0082] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0083] There are a few points to note:

[0084] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0085] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0086] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0087] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A cutting fluid spraying device, used in a multi-wire cutting device, wherein the multi-wire cutting device includes a cutting wire for cutting a crystal rod; characterized in that: The cutting fluid spraying device comprises: a nozzle unit, comprising a nozzle disposed above the cutting line for spraying cutting fluid, and a moving assembly for moving the nozzle, wherein the moving assembly comprises at least one moving unit, the moving unit comprises a driving member, a mounting member and a moving member, the nozzle is disposed on the mounting member, and the moving member is configured to drive the mounting member to move under the drive of the driving member; and The nozzle movement control unit is used to obtain the position change information of the cutting point between the crystal rod and the cutting line during the online cutting process, and based on the position change information, control the moving component to move the nozzle so that the distance between the nozzle and the cutting point is within a threshold.

2. The cutting fluid spraying device according to claim 1, characterized in that: The multi-wire cutting device also includes two spools, and the cutting wire is wound on the two spools; wherein the mounting member is located above the cutting wire, and the spray direction of the nozzle is toward the cutting point; the moving member includes at least one moving rod, and the moving rod is arranged along the radial extension of the spool, the axial first end of the moving rod is connected to the driving member, and the axial second end of the moving rod is connected to the mounting member, and the moving rod is constructed so that the extension length along its own axial direction can be adjusted under the control of the driving member.

3. The cutting fluid spraying device according to claim 2, characterized in that: Each of the moving units includes two moving rods arranged in parallel, wherein the axial first end of one of the moving rods is located at one axial end of the bobbin, and the axial first end of the other moving rod is located at the other axial end of the bobbin.

4. The cutting fluid spraying device according to claim 1, characterized in that: The multi-wire cutting device further comprises two spools, the cutting wires are wound around the two spools; the mounting member is constructed as a rod-shaped structure extending in an axial direction parallel to the spools, and the nozzle is arranged along the axial direction of the mounting member.

5. The cutting fluid spraying device according to claim 1, characterized in that: The multi-wire cutting equipment also includes two spools, and the cutting wires are wound around the two spools; the moving component includes two moving units, and the two moving units are respectively located on radially opposite sides of the crystal rod, and one of the moving units is installed on one spool, and the other moving unit is installed on the other spool.

6. The cutting fluid spraying device according to claim 1, characterized in that: The driving member includes a servo motor.

7. The cutting fluid spraying device according to claim 1, characterized in that: The obtaining of position change information of the cutting point between the crystal rod and the cutting line during the online cutting process specifically includes: Based on the cutting parameters of the wire cutting, obtaining the length change data of the cutting wire entering the crystal ingot at different time points, wherein the cutting parameters include at least one or more of the diameter of the crystal ingot, the moving speed of the crystal ingot, and the inclination angle of the cutting wire relative to the crystal ingot; Based on the cutting line length variation data, position variation information of the cutting point formed by the contact position between the outer peripheral surface of the crystal rod and the cutting line is obtained.

8. The cutting fluid spraying device according to claim 1, characterized in that: The controlling the moving component to move the nozzle based on the position change information so that the distance between the nozzle and the cutting point is within a threshold value specifically includes: Pre-storing the corresponding relationship data between the position of the cutting point and the moving distance of the nozzle; Based on the position change information and the corresponding relationship data, the moving component is controlled in real time to move the nozzle so that the distance between the nozzle and the cutting point is within a threshold.

9. A multi-wire cutting device, characterized in that: It comprises the cutting fluid spraying device as described in any one of claims 1 to 8.

10. A multi-wire cutting method, characterized in that: Applied to the multi-wire cutting device as claimed in claim 9, the method comprises the following steps: Obtaining position change information of the cutting point between the crystal rod and the cutting line during the online cutting process; Based on the position change information, the moving component is controlled to move the nozzle so that the distance between the nozzle and the cutting point is within a threshold.

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