Vehicle-mounted semiconductor cooling and heating box with auxiliary heat dissipation of air conditioner and control method

Abstract

The invention relates to a vehicle-mounted semiconductor cooling and heating box for auxiliary heat dissipation of an air conditioner and a control method. The technical problem that an existing vehicle-mounted cooling and heating box suffers from high environment temperature is solved. The method includes the following steps that S1, the cold and warm box is started, and operation information of the cold and warm box is obtained; s2, acquiring vehicle information; and S3, after power-on self-test of the cold and warm box is passed, the cold and warm box enters a standby state, an operation instruction is waited to be input, and a cold and warm box control strategy The refrigerating and heating box has the advantages that the first refrigerating mode and the second refrigerating mode can be selected according to the temperature difference delta T and the maximum refrigerating temperature difference T1 in the refrigerating mode, the refrigerating effect of the refrigerating and heating box body is improved, the refrigerating and heating box body can compare the temperature difference delta T and the maximum refrigerating temperature difference T1 in real time in the refrigerating mode, the first refrigerating mode and the second refrigerating mode are switched in real time, and the refrigerating effect is improved. And communication between the air conditioner auxiliary heat dissipation device and the air conditioner refrigeration system can be conveniently controlled through the heat dissipation electromagnetic valve, the refrigeration efficiency is improved, and the energy loss of the cold and warm box body is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of vehicle-mounted cooling and heating boxes, and in particular relates to a vehicle-mounted semiconductor cooling and heating box with air-conditioning auxiliary heat dissipation and a control method. Background Art

[0002] Semiconductor cooling and heating boxes use the Peltier effect of thermoelectric semiconductors to draw heat from the box to the outside of the box to achieve cooling inside the box. When the thermoelectric semiconductor is energized in reverse, heating inside the box can be achieved. Semiconductor cooling boxes based on thermoelectric semiconductor refrigeration technology have the advantages of simple structure and low cost, and are increasingly popular in the market. However, existing semiconductor cooling and heating boxes are easily affected by ambient temperature during the cooling or heating process, and when the ambient temperature is too high, the cooling performance of the semiconductor cooling and heating box is reduced, and when the ambient temperature is too low, the heating performance of the semiconductor cooling and heating box is reduced, affecting the user experience. Summary of the invention

[0003] The object of the present invention is to provide a method for controlling a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation in order to solve the above-mentioned problems.

[0004] Another object of the present invention is to provide a semiconductor cooling and heating box for vehicles with air conditioning auxiliary heat dissipation in order to solve the above problems.

[0005] To achieve the above object, the present invention adopts the following technical solution: a method for controlling a vehicle-mounted semiconductor cooling and heating box with air conditioning auxiliary heat dissipation, the method comprising the following steps:

[0006] Step S1: Turn on the cooling and heating box and obtain the cooling and heating box operation information;

[0007] Step S2: Obtain vehicle information;

[0008] Step S3: After the cooling and heating box passes the self-test, it enters the standby state, waiting for the input of the operation command, and starts the cooling and heating box control strategy.

[0009] In the above-mentioned control method of a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation, in step S1, the cooling and heating box operation information includes any one of shutdown, standby, cooling mode and heating mode.

[0010] In the above-mentioned method for controlling a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation, in step S2, the vehicle information includes the in-vehicle ambient temperature and / or air conditioning status information.

[0011] In the above-mentioned method for controlling a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation, the step S3 specifically includes:

[0012] Input cooling, heating, and shutdown operation instructions. In the heating operation mode, after setting the target temperature, start heating and perform PID temperature control until the target temperature Ts is reached. In the cooling operation mode, after setting the target temperature Ts, collect the vehicle interior ambient temperature Ta, and by determining the temperature difference ΔT between the vehicle interior ambient temperature Ta and the cooling set temperature Ts, execute different cooling control modes, start cooling, and perform PID temperature control until the target temperature Ts is reached.

[0013] In the above-mentioned method for controlling a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation, the specific steps of executing different cooling control modes in step S3 include:

[0014] Set the calibration temperature difference T1, T1 is the maximum cooling temperature difference of the vehicle-mounted semiconductor cooling and heating box, and select different cooling control modes by comparing ΔT with T1. When ΔT>T1, execute cooling control mode 1; when ΔT≤T1, execute cooling control mode 2.

[0015] In the above-mentioned method for controlling a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation, the refrigeration control mode 1 includes: when the temperature difference ΔT between the interior ambient temperature Ta and the refrigeration set temperature Ts is higher than the maximum refrigeration temperature difference T1 of the vehicle-mounted semiconductor cooling and heating box, the refrigeration capacity of the semiconductor cooling and heating box itself cannot achieve the set refrigeration temperature Ts, the air conditioning assisted heat dissipation is started, and a request is sent to the host. After the host agrees and starts the air conditioning compressor, the solenoid valve is opened, the hot end cooling fan is closed, and refrigeration is started. If the air conditioning assisted heat dissipation start request is rejected and the air conditioning compressor is not started, the cooling of the cooling and heating box is stopped, and an alarm prompt is sent.

[0016] In the above-mentioned method for controlling a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation, the refrigeration control mode 2 includes:

[0017] When the temperature difference ΔT between the interior ambient temperature Ta and the cooling set temperature Ts is not higher than the maximum cooling temperature difference T1 of the on-board semiconductor cooling and heating box, if the air conditioner of the entire vehicle is in the on-state, the air conditioner auxiliary heat dissipation function is turned on, the heat dissipation solenoid valve is opened, and the hot end heat dissipation fan is turned off; if the air conditioner of the entire vehicle is in the off-state, the air conditioner auxiliary heat dissipation function is turned off, the heat dissipation solenoid valve is closed, the hot end heat dissipation fan is started, and the semiconductor cooling and heating box operates independently.

[0018] In the above-mentioned vehicle-mounted semiconductor heating and cooling box control method with air conditioning assisted heat dissipation, in step S3, the vehicle interior ambient temperature Ta is collected in real time, and ΔT is compared with T1. When the magnitude relationship between ΔT and T1 changes, the refrigeration control mode is also switched accordingly in time.

[0019] In the above-mentioned vehicle-mounted semiconductor heating and cooling box control method for air-conditioning assisted heat dissipation, in step S3, the operating status of the air-conditioning of the whole vehicle is collected in real time. Only when the operating status of the air-conditioning of the whole vehicle is in the cooling state, the air-conditioning assisted heat dissipation function can be turned on. When the heating and cooling box receives the change of the air-conditioning cooling on or off state, the cooling control mode of the heating and cooling box is adjusted accordingly.

[0020] A vehicle-mounted semiconductor cooling and heating box control method for air-conditioning assisted heat dissipation, comprising a cooling and heating box body with heat insulation cotton on one side, a thermoelectric semiconductor sheet on the inner side of the heat insulation cotton, one side of the thermoelectric semiconductor sheet in contact with a cold-end radiator located in the cooling and heating box body and a cold-end heat dissipation fan is provided on the outer side of the cold-end radiator, the other side of the thermoelectric semiconductor sheet in contact with an air-conditioning auxiliary heat dissipation device, the outer side of the air-conditioning auxiliary heat dissipation device is provided with a hot-end heat dissipation fan, the air-conditioning auxiliary heat dissipation device and the hot-end heat dissipation fan are installed in a heat dissipation air guide hood located on one side of the heat insulation cotton, the air-conditioning auxiliary heat dissipation device has a flow channel, and the flow channel is connected to a heat dissipation solenoid valve through an air-conditioning pipeline and is connected to the whole vehicle air-conditioning refrigeration system, the air-conditioning pipeline is wrapped with an air-conditioning pipeline insulation layer, the heat dissipation solenoid valve can control the refrigerant to flow into the air-conditioning auxiliary heat dissipation device, thereby improving the auxiliary heat dissipation effect, and the air-conditioning pipeline can be insulated through the air-conditioning pipeline insulation layer to reduce the heat loss of the air-conditioning pipeline.

[0021] Compared with the prior art, the advantages of the present invention are:

[0022] 1. In cooling mode, you can select cooling mode 1 and cooling mode 2 according to the temperature difference ΔT and the maximum cooling temperature difference T1 to improve the cooling effect of the cooling and heating box.

[0023] 2. In the cooling mode, the cooling and heating box body can compare the temperature difference ΔT with the maximum cooling temperature difference T1 in real time, and switch between cooling mode 1 and cooling mode 2 in real time to ensure the cooling effect while reducing energy loss.

[0024] 3. The heat dissipation solenoid valve can be used to control the connection between the air-conditioning auxiliary heat dissipation device and the air-conditioning refrigeration system, thereby improving the refrigeration efficiency and reducing the energy loss of the heating and cooling box.

[0025] 4. The air-conditioning pipe insulation layer can keep the air-conditioning pipe warm and reduce the heat loss of the air-conditioning pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is the main control flow chart of the present invention.

[0027] Figure 2 It is a control flow chart of the cooling or heating mode in the present invention.

[0028] Figure 3It is a flow chart of refrigeration mode 1 in the present invention.

[0029] Figure 4 It is a flow chart of refrigeration mode 2 in the present invention.

[0030] Figure 5 It is a flow chart of the present invention in the standby state.

[0031] Figure 6 It is a structural explosion diagram of the present invention.

[0032] In the figure: a cooling and heating box body 1, thermal insulation cotton 11, a cold end radiator 12, a cold end heat dissipation fan 13, a thermoelectric semiconductor sheet 2, an air conditioning auxiliary heat dissipation device 3, an air conditioning pipeline 31, a heat dissipation solenoid valve 32, an air conditioning pipeline insulation layer 33, a hot end heat dissipation fan 4, and a heat dissipation air guide cover 5. DETAILED DESCRIPTION

[0033] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] like Figure 1 , Figure 2 , Figure 5 As shown, a method for controlling a semiconductor cooling and heating box on a vehicle with air conditioning assisted heat dissipation, the method comprises the following steps:

[0035] Step S1: Turn on the cooling and heating box and obtain the cooling and heating box operation information;

[0036] Step S2: Obtain vehicle information;

[0037] Step S3: After the cooling and heating box passes the self-test, it enters the standby state, waiting for the input of the operation command, and starts the cooling and heating box control strategy.

[0038] Specifically, in step S1, the operation information of the refrigerator and heater includes any one of shutdown, standby, cooling mode and heating mode.

[0039] Wherein, in step S2, the vehicle information includes the vehicle interior environment temperature and / or air conditioning status information.

[0040] like Figure 2 , Figure 3 As shown, step S3 specifically includes:

[0041] Input cooling, heating, and shutdown operation instructions. In the heating operation mode, after setting the target temperature, start heating and perform PID temperature control until the target temperature Ts is reached. In the cooling operation mode, after setting the target temperature Ts, collect the vehicle interior ambient temperature Ta, and by determining the temperature difference ΔT between the vehicle interior ambient temperature Ta and the cooling set temperature Ts, execute different cooling control modes, start cooling, and perform PID temperature control until the target temperature Ts is reached.

[0042] Furthermore, in step S3, the specific steps of executing different refrigeration control modes include:

[0043] Set the calibration temperature difference T1, T1 is the maximum cooling temperature difference of the vehicle-mounted semiconductor cooling and heating box, and select different cooling control modes by comparing ΔT with T1. When ΔT>T1, execute cooling control mode 1; when ΔT≤T1, execute cooling control mode 2.

[0044] Among them, refrigeration control mode 1 includes: when the temperature difference ΔT between the interior ambient temperature Ta and the refrigeration set temperature Ts is higher than the maximum refrigeration temperature difference T1 of the on-board semiconductor cold and warm box, the refrigeration capacity of the semiconductor cold and warm box itself cannot achieve the set refrigeration temperature Ts. In order to ensure the refrigeration effect of the cold and warm box, the air conditioner is started to assist in heat dissipation, and a request is sent to the host. After the host agrees and starts the air-conditioning compressor, the solenoid valve is opened, the hot end heat dissipation fan is turned off, and the refrigeration is started. If the air-conditioning auxiliary heat dissipation start request is rejected and the air-conditioning compressor is not started, the refrigeration of the cold and warm box stops, and an alarm prompt is sent.

[0045] Combination Figure 2 , Figure 3 , Figure 4 As shown, refrigeration control mode 2 includes:

[0046] When the temperature difference ΔT between the interior ambient temperature Ta and the cooling set temperature Ts is not higher than the maximum cooling temperature difference T1 of the on-board semiconductor cooling and heating box, if the air conditioner of the entire vehicle is in the on-state, the air conditioner auxiliary heat dissipation function is turned on, the heat dissipation solenoid valve is opened, and the hot end heat dissipation fan is turned off; if the air conditioner of the entire vehicle is in the off-state, the air conditioner auxiliary heat dissipation function is turned off, the heat dissipation solenoid valve is closed, the hot end heat dissipation fan is started, and the semiconductor cooling and heating box operates independently.

[0047] Among them, in step S3, the vehicle interior ambient temperature Ta is collected in real time, and ΔT is compared with T1. When the magnitude relationship between ΔT and T1 changes, the cooling control mode is switched accordingly in time.

[0048] Specifically, in step S3, the operating status of the vehicle's air conditioner is collected in real time. Only when the vehicle's air conditioner is in cooling state, can the air conditioner auxiliary heat dissipation function be turned on. When the heating and cooling box receives the change in the air conditioning cooling on or off state, the cooling control mode of the heating and cooling box is adjusted accordingly.

[0049] Combination Figure 6As shown, a semiconductor cooling and heating box for vehicles with air-conditioning assisted heat dissipation and a control method for a semiconductor cooling and heating box for vehicles, comprising a cooling and heating box body 1 with heat insulation cotton 11 on one side, a thermoelectric semiconductor sheet 2 on the inner side of the heat insulation cotton 11, the heat insulation cotton 11 can keep the thermoelectric semiconductor sheet 2 warm and reduce heat loss, one side of the thermoelectric semiconductor sheet 2 is in contact with a cold end radiator 12 located in the cooling and heating box body 1, and a cold end heat dissipation fan 13 is provided on the outer side of the cold end radiator 12, the heat exchange speed in the cooling and heating box body 1 can be increased by the cold end heat dissipation fan 13 and the cold end radiator 12, and the cooling or heating efficiency can be improved, and the other side of the thermoelectric semiconductor sheet 2 is provided with an air-conditioning assisted heat dissipation fan 13 and the cold end ... The heat dissipation device 3 is in contact with each other, and a hot-end heat dissipation fan 4 is arranged on the outside of the air-conditioning auxiliary heat dissipation device 3. The air-conditioning auxiliary heat dissipation device 3 and the hot-end heat dissipation fan 4 are installed in the heat dissipation wind guide 5 located on one side of the thermal insulation cotton 11. The air-conditioning auxiliary heat dissipation device 3 has a flow channel, and the flow channel is connected to the heat dissipation solenoid valve 32 through the air-conditioning pipeline 31 and connected to the vehicle air-conditioning refrigeration system. The air-conditioning pipeline 31 is wrapped with an air-conditioning pipeline insulation layer 33. The heat dissipation solenoid valve 32 can control the refrigerant to flow into the air-conditioning auxiliary heat dissipation device 3 to improve the auxiliary heat dissipation effect, and the air-conditioning pipeline insulation layer 33 can keep the air-conditioning pipeline 31 warm, thereby reducing the heat loss of the air-conditioning pipeline 31.

[0050] The principle of this embodiment is that when the temperature difference ΔT between the vehicle interior ambient temperature Ta and the cooling setting temperature Ts is greater than the maximum cooling temperature difference T1, the cooling control mode 1 is started, the cooling and heating box body 1 cannot achieve the cooling temperature Ts through the thermoelectric semiconductor chip 2, and in order to achieve the cooling temperature Ts, the air-conditioning auxiliary heat dissipation device 3 is started, and a request is sent to the host. After the host agrees and the air-conditioning compressor is started, the heat dissipation solenoid valve 32 is opened, the hot end heat dissipation fan 4 is closed, and the cooling is started. If the start-up request of the air-conditioning auxiliary heat dissipation device 3 is rejected and the air-conditioning compressor is not started, the thermoelectric semiconductor chip 2 of the cooling and heating box body 1 is turned off. The cooling stops and an alarm is sent; when the temperature difference ΔT between the interior ambient temperature Ta and the cooling set temperature Ts is not higher than the maximum cooling temperature difference T1, the cooling mode 2 is started. If the air conditioner of the whole vehicle is in the on state, the air conditioner auxiliary heat dissipation device 3 is turned on, the heat dissipation solenoid valve 32 is opened, and the hot end heat dissipation fan 4 is turned off; if the air conditioner of the whole vehicle is in the off state, the air conditioner auxiliary heat dissipation device 3 is turned off, the heat dissipation solenoid valve 32 is closed, the hot end heat dissipation fan 4 is started, and the heating and cooling box body 1 operates independently; and the cooling mode 1 and the cooling mode 2 can be switched according to the real-time size of the interior ambient temperature Ta and the maximum cooling temperature difference T1.

[0051] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0052] Although this article uses more terms such as cooling and heating box body 1, insulation cotton 11, cold end radiator 12, cold end heat dissipation fan 13, thermoelectric semiconductor sheet 2, air conditioning auxiliary heat dissipation device 3, air conditioning pipeline 31, heat dissipation solenoid valve 32, air conditioning pipeline insulation layer 33, hot end heat dissipation fan 4, heat dissipation air guide cover 5, etc., it does not exclude the possibility of using other terms. The use of these terms is only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

Claims

1. A method for controlling a semiconductor cooling and heating box on a vehicle with air conditioning assisted heat dissipation, characterized in that: The method comprises the following steps: Step S1: Turn on the cooling and heating box and obtain the cooling and heating box operation information; Step S2: Obtain vehicle information; Step S3: After the cooling and heating box passes the self-test, it enters the standby state, waiting for the input of the operation command, and starts the cooling and heating box control strategy.

2. The control method of a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation according to claim 1 is characterized in that: In step S1, the operation information of the cooling and heating box includes any one of shutdown, standby, cooling mode and heating mode.

3. The control method of a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation according to claim 1 is characterized in that: In step S2, the vehicle information includes the vehicle interior environment temperature and / or air conditioning status information.

4. A method for controlling a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation according to claim 1, 2 or 3, characterized in that: The step S3 specifically includes: Input cooling, heating, and shutdown operation instructions. In the heating operation mode, after setting the target temperature, start heating and perform PID temperature control until the target temperature Ts is reached. In the cooling operation mode, after setting the target temperature Ts, collect the vehicle interior ambient temperature Ta, and by determining the temperature difference ΔT between the vehicle interior ambient temperature Ta and the cooling set temperature Ts, execute different cooling control modes, start cooling, and perform PID temperature control until the target temperature Ts is reached.

5. The control method of a vehicle-mounted semiconductor cooling and heating box with air conditioning assisted heat dissipation according to claim 4 is characterized in that: The specific steps of executing different refrigeration control modes in step S3 include: Set the calibration temperature difference T1, T1 is the maximum cooling temperature difference of the vehicle-mounted semiconductor cooling and heating box, and select different cooling control modes by comparing ΔT with T1. When ΔT>T1, execute cooling control mode 1; when ΔT≤T1, execute cooling control mode 2.

6. The control method of a vehicle-mounted semiconductor cooling and heating box with air conditioning auxiliary heat dissipation according to claim 5 is characterized in that: The refrigeration control mode 1 includes: when the temperature difference ΔT between the vehicle interior ambient temperature Ta and the refrigeration set temperature Ts is higher than the maximum refrigeration temperature difference T1 of the vehicle-mounted semiconductor cooling and heating box, the refrigeration capacity of the semiconductor cooling and heating box itself cannot achieve the set refrigeration temperature Ts, the air conditioner is started to assist in heat dissipation, and a request is sent to the host. After the host agrees and starts the air-conditioning compressor, the solenoid valve is opened, the hot end heat dissipation fan is closed, and refrigeration is started. If the air-conditioning auxiliary heat dissipation start request is rejected and the air-conditioning compressor is not started, the cooling of the cooling and heating box is stopped, and an alarm prompt is sent.

7. The control method of a vehicle-mounted semiconductor cooling and heating box with air conditioning auxiliary heat dissipation according to claim 5 is characterized in that: The refrigeration control mode 2 includes: When the temperature difference ΔT between the interior ambient temperature Ta and the cooling set temperature Ts is not higher than the maximum cooling temperature difference T1 of the on-board semiconductor cooling and heating box, if the air conditioner of the entire vehicle is in the on-state, the air conditioner auxiliary heat dissipation function is turned on, the heat dissipation solenoid valve is opened, and the hot end heat dissipation fan is turned off; if the air conditioner of the entire vehicle is in the off-state, the air conditioner auxiliary heat dissipation function is turned off, the heat dissipation solenoid valve is closed, the hot end heat dissipation fan is started, and the semiconductor cooling and heating box operates independently.

8. The control method of a vehicle-mounted semiconductor cooling and heating box with air conditioning auxiliary heat dissipation according to claim 5 is characterized in that: In step S3, the vehicle interior ambient temperature Ta is collected in real time, and ΔT is compared with T1. When the magnitude relationship between ΔT and T1 changes, the cooling control mode is switched accordingly in a timely manner.

9. The control method of a vehicle-mounted semiconductor cooling and heating box with air conditioning auxiliary heat dissipation according to claim 5 is characterized in that: In step S3, the operating status of the vehicle air conditioner is collected in real time. Only when the vehicle air conditioner is in the cooling state, the air conditioner auxiliary heat dissipation function can be turned on. When the heating and cooling box receives the change of the air conditioning cooling on or off state, the cooling control mode of the heating and cooling box is adjusted accordingly.

10. A vehicle-mounted semiconductor cooling and heating box using a vehicle-mounted semiconductor cooling and heating box control method with air-conditioning assisted heat dissipation as described in any one of claims 1 to 9, comprising a cooling and heating box body (1) provided with heat insulation cotton (11) on one side, a thermoelectric semiconductor sheet (2) provided on the inner side of the heat insulation cotton (11), one side of the thermoelectric semiconductor sheet (2) in contact with a cold end radiator (12) located in the cooling and heating box body (1) and a cold end heat dissipation fan (13) provided on the outer side of the cold end radiator (12), an air-conditioning auxiliary heat dissipation device (3) in contact with the other side of the thermoelectric semiconductor sheet (2), a hot end heat dissipation fan (4) provided on the outer side of the air-conditioning auxiliary heat dissipation device (3), the air-conditioning auxiliary heat dissipation device (3) and the hot end heat dissipation fan (4) are installed in a heat dissipation air guide cover (5) located on one side of the heat insulation cotton (11), characterized in that: The air-conditioning auxiliary heat dissipation device (3) has a flow channel therein, and the flow channel is connected to the heat dissipation solenoid valve (32) through an air-conditioning pipeline (31) and connected to the air-conditioning refrigeration system of the entire vehicle, and the air-conditioning pipeline (31) is wrapped with an air-conditioning pipeline insulation layer (33).

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