Inflatable silicon wafer packaging box

Abstract

The inflatable silicon wafer packaging box comprises a foam frame, a soft plastic bottom plate, a partition plate and an air valve, the foam frame comprises a bottom frame body and a side frame body, the soft plastic bottom plate is provided with a first air cavity and is adjacent to the bottom frame body and the side frame body to form a clamping groove, and the partition plate comprises a foam isolation part and a soft plastic isolation part; the foam isolation part is arranged at the bottom of the clamping groove and provided with a second air cavity, the soft plastic isolation part comprises a first part and two second parts, the two second parts wrap the side faces, opposite to the groove area, of the foam isolation part respectively, and the first part is connected between the ends, away from the foam isolation part, of the two second parts to jointly form a third air cavity; the second air cavity is communicated between the first air cavity and the third air cavity and is filled with buffer gas; and the air valve is used for controlling whether the first air cavity is deflated or not. According to the inflatable silicon wafer packaging box, buffering supporting performance can be further improved, and meanwhile recycling is facilitated so that the packaging cost can be reduced.

Description

Technical Field

[0001] The invention relates to the technical field of cushioning packaging, and in particular to an inflatable silicon wafer packaging box. Background Art

[0002] Currently, foam boxes are usually used to cushion silicon wafers. The foam boxes need to be destroyed to take out the silicon wafers, so the foam boxes can only be used as disposable cushioning products, resulting in increased packaging costs. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide an inflatable silicon wafer packaging box, which is conducive to further improving the cushioning support performance while also facilitating recycling to reduce packaging costs.

[0004] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0005] An inflatable silicon wafer packaging box, comprising:

[0006] A foam frame, the foam frame comprising a bottom frame body and a side frame body which enclose and form a containing cavity;

[0007] A soft plastic bottom plate is adjacent to the bottom frame and the side frame so that the accommodating cavity forms a card slot, and a first air cavity is provided in the soft plastic bottom plate;

[0008] a partition, fixed to the side frame and the soft plastic bottom plate, so that the card slot is separated into different slot areas arranged along the first direction, the partition comprising a foam isolation part and a soft plastic isolation part, the foam isolation part is arranged at the bottom of the card slot, the foam isolation part is provided with a second air cavity, the soft plastic isolation part comprises a first part and two second parts, the two second parts respectively cover a side surface of the foam isolation part opposite to the slot area, the first part is connected between the ends of the two second parts away from the foam isolation part to form a third air cavity together, the second air cavity is connected between the first air cavity and the third air cavity, and the three are used to fill the buffer gas; and

[0009] The air valve is convexly arranged on a side of the soft plastic bottom plate away from the partition plate, and the air valve is used to control whether the first air cavity is deflated.

[0010] In some possible implementations, the first portion is bent toward the soft plastic bottom plate to form a first groove, and the first groove is spaced apart from the side frame body and the foam isolation portion.

[0011] In some possible embodiments, the end surface of the foam isolation portion facing away from the soft plastic bottom plate is recessed to form a second groove, the second groove is spaced apart from the side frame body, the second air cavity runs through the bottom wall of the second groove, and the projections of the second groove and the first groove at least partially overlap.

[0012] In some possible implementations, the projection of the second air cavity is located within the first air cavity.

[0013] In some possible implementations, when viewed relative to the third air cavity, the thickness of the second portion and the first portion are both 0.07-0.1 mm.

[0014] In some possible implementations, the bottom frame is provided with a window exposing the soft plastic bottom plate, the air valve is provided in the window, and the projection of the window is placed in the first air cavity.

[0015] In some possible embodiments, at least two partitions are arranged at equal intervals in the card slot along the first direction, the first air cavity is connected to the second air cavity in each of the partitions, the number of the windows is multiple, and the multiple windows are arranged in partitions along the first direction, and the air valve is arranged in one of the windows.

[0016] In some possible embodiments, there are two foam frames. When viewed along the first direction, one foam frame is arranged beside the other foam frame and both of them share the common part of the side frame body. Each foam frame is connected to the soft plastic bottom plate and the partition plate, and each soft plastic bottom plate is provided with the air valve.

[0017] In some possible implementations, a projection of the second air cavity is located at an end of the second groove away from the shared portion of the side frame body.

[0018] In some possible implementations, the foam frame is a square frame, and the inflatable silicon wafer packaging box further includes:

[0019] Two flexible plastic protective shells are arranged at intervals, one of which covers two adjacent outer corners of the foam frame, and the other covers the other two outer corners of the foam frame, and a partial projection of each groove area is exposed in the gap between the two flexible plastic protective shells.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] In the present application, a soft plastic bottom plate and a partition are provided in the foam frame, and a first air cavity is provided in the soft plastic bottom plate, the partition includes a foam isolation part and a soft plastic isolation part, the foam isolation part is provided with a second air cavity, the soft plastic isolation part is provided with a third air cavity, the second air cavity is connected between the first air cavity and the third air cavity, and the three are used to fill the buffer gas, so that when the silicon chip is placed in the card slot, the soft plastic part will be squeezed to deform, thereby changing the pressure of the air cavity, so that the soft plastic part fully wraps the silicon chip to improve the support and cushioning properties, and in addition, the air cavity is filled with buffer gas, which is conducive to further improving the buffering effect of the packaging box on the silicon chip. In addition, the inflatable silicon chip packaging box can change the pressure of the air cavity by deflation of the air valve, thereby reducing the holding force of the card slot on the silicon chip, facilitating the removal of the silicon chip without destroying the foam frame, thereby facilitating the reuse of the inflatable silicon chip packaging box to reduce the packaging cost. Therefore, the inflatable silicon chip packaging box provided by the present application is conducive to further improving the buffering support while also facilitating recycling to reduce the packaging cost.

[0022] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of an inflatable silicon wafer packaging box provided in one embodiment of the present application;

[0024] Figure 2 for Figure 1 A schematic structural diagram of the inflatable silicon wafer packaging box from another perspective shown;

[0025] Figure 3 for Figure 2 Section along V-V;

[0026] Figure 4 for Figure 2 Cross-section along VI-VI.

[0027] Description of Figure Numbers:

[0028] 10 - foam frame; 11 - bottom frame; 12 - side frame; 101 - card slot; 110 - window; 20 - soft plastic bottom plate;

[0029] 201 - first air cavity; 30 - partition; 31 - foam insulation part; 32 - soft plastic insulation part; 321 - first part;

[0030] 322 - second part; 3210 - first groove; 301 - second air cavity; 3010 - second groove; 302 - third air cavity;

[0031] 40 - air valve; 50 - tough plastic protective shell. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can be a centered element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be a centered element. When an element is referred to as "arranged on" another element, it can be arranged on the other element or there can be a centered element.

[0034] Reference Figures 1 to 4 In one embodiment of the present application, an inflatable silicon wafer packaging box is provided. The inflatable silicon wafer packaging box includes a foam frame 10, a soft plastic bottom plate 20, a partition 30 and an air valve 40. The foam frame 10 includes a bottom frame body 11 and a side frame body 12 that enclose and form a receiving cavity. The soft plastic bottom plate 20 is adjacent to the bottom frame body 11 and the side frame body 12, so that the receiving cavity forms a card slot 101. Figure 3 and Figure 4, a first air cavity 201 is provided in the soft plastic bottom plate 20. Exemplarily, the material of the soft plastic bottom plate 20 may be polyethylene terephthalate (PET). Exemplarily, the bottom frame 11 may close the tube cavity surrounded by the side frame 12 (forming a groove structure), or may not close the tube cavity surrounded by the side frame. The partition 30 is fixed to the side frame 12 and the soft plastic bottom plate 20, so that the card slot 101 is isolated into different groove areas arranged along the first direction X. The partition 30 includes a foam insulation part 31 and a soft plastic insulation part 32. The foam insulation part 31 is arranged at the bottom of the card slot 101. The foam insulation part 31 is provided with a second air cavity 301. The soft plastic insulation part 32 includes a first part 321 and two second parts 322. The two second parts 322 each cover a side of the foam insulation part 31 opposite to the groove area. The first part 321 is connected between the ends of the two second parts 322 away from the foam insulation part 31 to form a third air cavity 302 together. The second air cavity 301 is connected between the first air cavity 201 and the third air cavity 302, and the three are used to fill the buffer gas. Exemplarily, the buffer gas can be air. Exemplarily, the material of the soft plastic insulation part 32 can be PET. Exemplarily, the second part 322 can be bonded to the foam insulation part 31. Exemplarily, when the partition 30 leaks, the new soft plastic insulation part 32 can be replaced by peeling off the second part 322. The air valve 40 is protrudingly provided on the side of the soft plastic bottom plate 20 facing away from the partition 30. The air valve 40 is used to control whether the first air cavity 201 is deflated or not. That is, the air valve 40 is connected to the first air cavity 201. In specific use, when the air pressure in the partition 30 is insufficient, air can be pumped into the first air cavity 201, the second air cavity 301 and the third air cavity 302 from the air valve 40. When the silicon wafer needs to be taken out, the air can also be deflated through the air valve 40.

[0035] Specifically, when the silicon wafer is placed in the slot area, in the initial state, the upper half of the soft plastic isolation part 32 corresponding to the slot area is squeezed and deformed. When the silicon wafer continues to be placed down, the silicon wafer squeezes the bottom of the card slot 101, so that the soft plastic bottom plate 20 is squeezed and deformed. Since the first air cavity 201, the second air cavity 301 and the third air cavity 302 are interconnected, and the partition plate 30 includes the soft plastic isolation part 32, when the first air cavity 201 is squeezed, the buffer gas flows to the third air cavity 302, so that the soft plastic isolation part 32 is supported. Large deformation can further improve the wrapping of the silicon wafer by the partition 30, so that the inflatable silicon wafer packaging box can support the silicon wafer while also achieving shock absorption, and can protect the silicon wafer from direct external force during transportation. When the silicon wafer is taken out, the air can be deflated through the air valve 40 to reduce the air pressure in each air cavity. When the silicon wafer needs to be packaged later, it can be inflated to a predetermined air pressure through the air valve 40, thereby avoiding the need to destroy the packaging box when removing the silicon wafer, so that the packaging box of the present application can be reused to reduce packaging costs.

[0036] In the present application, a soft plastic bottom plate 20 and a partition 30 are provided in a foam frame 10, and a first air cavity 201 is provided in the soft plastic bottom plate 20, the partition 30 includes a foam isolation part 31 and a soft plastic isolation part 32, the foam isolation part 31 is provided with a second air cavity 301, the soft plastic isolation part 32 is provided with a third air cavity 302, the second air cavity 301 is connected between the first air cavity 201 and the third air cavity 302, and the three are used to fill buffer gas, so that when the silicon wafer is placed in the card slot 101, the soft plastic part will be squeezed to deform, thereby changing the pressure of the air cavity, so that the soft plastic part fully wraps the silicon wafer to improve the support and cushioning properties. In addition, the air cavity is filled with buffer gas, which is beneficial to further improve the cushioning effect of the packaging box on the silicon wafer. In addition, the inflatable silicon wafer packaging box can change the pressure of the air cavity by deflation of the air valve 40, thereby reducing the clamping force of the clamping slot 101 on the silicon wafer, making it easier to remove the silicon wafer without destroying the foam frame 10, thereby facilitating the reuse of the inflatable silicon wafer packaging box to reduce packaging costs. Therefore, the inflatable silicon wafer packaging box provided by the present application is conducive to further improving the cushioning support while also facilitating recycling to reduce packaging costs.

[0037] In some embodiments, reference Figure 2 and Figure 3 The first portion 321 is bent toward the soft plastic bottom plate 20 to form a first groove 3210, and the first groove 3210 is spaced apart from the side frame 12 and the foam isolation portion 31. The formation of the first groove 3210 can prevent the silicon wafer from being completely covered, thereby facilitating the subsequent removal of the silicon wafer. In addition, the first groove 3210 is spaced apart from the side frame 12 and the foam isolation portion 31 to ensure that the partition 30 can provide a multi-directional clamping point, thereby facilitating the buffer support.

[0038] In some embodiments, reference Figure 4 The end surface of the foam isolation part 31 facing away from the soft plastic bottom plate 20 is recessed to form a second groove 3010, the second groove 3010 is spaced apart from the side frame body 12, the second air cavity 301 runs through the bottom wall of the second groove 3010, and the projections of the second groove 3010 and the first groove 3210 at least partially overlap, so as to ensure that the second part 322 between the second groove 3010 and the first groove 3210 has a larger deformation area, so as to ensure greater support and buffering.

[0039] In some embodiments, the projection of the second air cavity 301 is located within the first air cavity 201, so that the aperture of the second air cavity 301 is smaller than the aperture of the first air cavity 201, so that when the first air cavity 201 is squeezed and deformed, the gas can quickly pass through the second air cavity 301 into the third air cavity 302, thereby accelerating the side response wrapping of the inflatable silicon wafer packaging box, which is beneficial to improve the wrapping responsiveness to improve the packaging efficiency.

[0040] In some embodiments, reference Figure 1 and Figure 3 The bottom frame 11 is provided with a window 110 exposing the soft plastic bottom plate 20, the air valve 40 is arranged in the window 110, and the projection of the window 110 is placed in the first air cavity 201. The setting of the window 110 can increase the deformation space of the soft plastic bottom plate 20, thereby facilitating the improvement of the carrying capacity of the inflatable silicon wafer packaging box.

[0041] In some embodiments, reference Figure 2 and Figure 3 At least two partitions 30 are arranged at equal intervals in the card slot 101 along the first direction X, the first air cavity 201 is connected to the second air cavity 301 in each partition 30, the number of the windows 110 is multiple, and the multiple windows 110 are arranged in partitions along the first direction X, and the air valve 40 is arranged in one window 110. The cooperation between the above functional parts is conducive to further improving the buffer support on the one hand, and on the other hand, it is convenient to adjust the pressure of the air cavity in a foam frame 10 through an air valve 40 to improve the convenience of operation.

[0042] In some embodiments, there are two foam frames 10. When viewed along the first direction X, one foam frame 10 is disposed beside another foam frame 10 and the two share a common side frame 12. Each foam frame 10 is connected to a soft plastic bottom plate 20 and a partition plate 30. Each soft plastic bottom plate 20 is provided with an air valve 40. Exemplarily, the groove areas of the two foam frames 10 are disposed one by one. Adding foam frames 10, soft plastic bottom plates 20 and partition plates 30 is conducive to further increasing the buffering load.

[0043] In some embodiments, the projection of the second air cavity 301 is located at an end of the second groove 3010 away from the shared portion of the side frame body 12 , so as to facilitate the buffer gas to first fill the outer portion of the third air cavity 302 .

[0044] In some embodiments, the thickness of the second portion 322 and the first portion 321 are both 0.07-0.1 mm relative to the third air cavity 302, thereby facilitating the deformation requirement and increasing the number of cycles. The inflatable silicon wafer packaging box provided by the present application can be used more than 2,000 times.

[0045] In some embodiments, the foam frame 10 is a square frame, and the inflatable silicon wafer packaging box also includes two tough plastic protective shells 50 arranged at intervals, one tough plastic protective shell 50 covers two adjacent outer corners of the foam frame 10, and the other tough plastic protective shell 50 covers the other two outer corners of the foam frame 10, and a portion of the projection of each groove area is exposed to the gap between the two tough plastic protective shells 50. Exemplarily, the material of the tough plastic protective shell 50 can be acrylonitrile-butadiene-styrene copolymer (ABS). The provision of the tough plastic protective shell 50 is conducive to protecting the foam frame 10 from breaking when it is subjected to external force collision. Exemplarily, the tough plastic protective shell 50 can be buckled on the outside of the foam frame 10, and the tough plastic protective shell 50 can also be bonded to the outside of the foam frame 10.

[0046] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. An inflatable silicon wafer packaging box, characterized in that: include: A foam frame, the foam frame comprising a bottom frame body and a side frame body which enclose and form a containing cavity; A soft plastic bottom plate is adjacent to the bottom frame and the side frame so that the accommodating cavity forms a card slot, and a first air cavity is provided in the soft plastic bottom plate; A partition, fixed to the side frame and the soft plastic bottom plate, so that the card slot is separated into different slot areas arranged along the first direction, the partition comprises a foam isolation part and a soft plastic isolation part, the foam isolation part is arranged at the bottom of the card slot, the foam isolation part is provided with a second air cavity, the soft plastic isolation part comprises a first part and two second parts, the two second parts respectively cover a side surface of the foam isolation part opposite to the slot area, the first part is connected between the ends of the two second parts away from the foam isolation part to form a third air cavity together, the second air cavity is connected between the first air cavity and the third air cavity, and the three are used to fill the buffer gas; as well as The air valve is convexly arranged on a side of the soft plastic bottom plate away from the partition plate, and the air valve is used to control whether the first air cavity is deflated.

2. The inflatable silicon wafer packaging box according to claim 1, characterized in that: The first portion is bent toward the soft plastic bottom plate to form a first groove, and the first groove is spaced apart from the side frame body and the foam isolation portion.

3. The inflatable silicon wafer packaging box according to claim 2, characterized in that: The end surface of the foam isolation part facing away from the soft plastic bottom plate is recessed to form a second groove, the second groove is spaced apart from the side frame body, the second air cavity runs through the bottom wall of the second groove, and the projections of the second groove and the first groove at least partially overlap.

4. The inflatable silicon wafer packaging box according to claim 3, characterized in that: The projection of the second air cavity is located in the first air cavity.

5. The inflatable silicon wafer packaging box according to claim 1, characterized in that: Observed relative to the third air cavity, the thickness of the second portion and the first portion are both 0.07-0.1 mm.

6. The inflatable silicon wafer packaging box according to claim 3, characterized in that: The bottom frame is provided with a window for exposing the soft plastic bottom plate, the air valve is arranged in the window, and the projection of the window is placed in the first air cavity.

7. The inflatable silicon wafer packaging box according to claim 6, characterized in that: At least two partitions are arranged at equal intervals in the card slot along the first direction, the first air cavity is connected to the second air cavity in each of the partitions, there are multiple windows, and the multiple windows are arranged in partitions along the first direction, and the air valve is arranged in one of the windows.

8. The inflatable silicon wafer packaging box according to claim 7, characterized in that: There are two foam frames. When viewed along the first direction, one foam frame is arranged beside the other foam frame and the two foam frames share the side frame body. Each foam frame is connected to the soft plastic bottom plate and the partition plate, and each soft plastic bottom plate is provided with the air valve.

9. The inflatable silicon wafer packaging box according to claim 8, characterized in that: The projection of the second air cavity is located at an end of the second groove away from the shared portion of the side frame body.

10. The inflatable silicon wafer packaging box according to any one of claims 1 to 9, characterized in that: The foam frame is a square frame, and the inflatable silicon wafer packaging box also includes: Two flexible plastic protective shells are arranged at intervals, one of which covers two adjacent outer corners of the foam frame, and the other covers the other two outer corners of the foam frame, and a partial projection of each groove area is exposed in the gap between the two flexible plastic protective shells.

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