Continuous surface-shaped micro-nano structure and preparation method thereof

Abstract

The invention discloses a continuous surface-shaped micro-nano structure and a preparation method thereof. The preparation method comprises the following steps: preparing micro-nano units distributed at intervals; the micro-nano units distributed at intervals are coated with a glue solution, so that the glue solution covers all the micro-nano units and is filled between every two adjacent micro-nano units; and curing the glue solution to obtain a cured microstructure, and obtaining a micro-nano structure with a continuous surface shape. The preparation technology is simple, the machining precision is high, expensive preparation equipment is not needed, and the continuous surface-shaped micro-nano structure can be prepared through the micro-nano units distributed at intervals.

Description

Technical Field

[0001] The invention belongs to the technical field of micro-nano structure preparation, and in particular relates to a continuous surface micro-nano structure and a preparation method thereof. Background Art

[0002] At present, the most commonly used processing methods for continuous surface micro-nano structures are moving mask exposure, grayscale exposure, multi-beam exposure, etc. The main problems of these processing methods are that the equipment is relatively expensive, the process is complicated, and the processing accuracy is not high.

[0003] Therefore, in view of the above technical problems, it is necessary to provide a continuous surface micro-nano structure and a preparation method thereof. Summary of the invention

[0004] The object of the present invention is to provide a continuous surface micro-nano structure and a preparation method thereof, which can prepare the continuous surface micro-nano structure based on spaced micro-nano units.

[0005] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows:

[0006] A method for preparing a continuous surface micro-nano structure, the preparation method comprising:

[0007] Prepare spaced and distributed micro-nano units;

[0008] Apply glue on the spaced micro-nano units so that the glue covers all the micro-nano units and fills the space between two adjacent micro-nano units;

[0009] The glue is cured to obtain a cured microstructure, and a micro-nanostructure with a continuous surface shape is obtained.

[0010] In one or more embodiments of the present invention, the glue is coated on the spaced micro-nano units by an atomization spraying process, and the atomization spraying process includes:

[0011] The glue atomized particles are sprayed onto the upper surface of the micro-nano unit, and the glue atomized particles flow naturally on the upper surface of the micro-nano unit and cover all the micro-nano units.

[0012] In one or more embodiments of the present invention, the thickness of the solidified microstructure between two adjacent micro-nano units gradually increases from the middle to both sides.

[0013] In one or more embodiments of the present invention, the micro-nano units are distributed at intervals in an array; or, the micro-nano units are distributed at intervals along a first direction.

[0014] In one or more embodiments of the present invention, the micro-nano units are distributed in an array:

[0015] The micro-nano unit is columnar, and the upper surface of the micro-nano unit is flat, the solidified microstructure array is distributed on the micro-nano unit, each solidified microstructure surface is curved, and the thickness of the solidified microstructure above each micro-nano unit gradually decreases from the middle to the periphery; or,

[0016] The upper surface of the micro-nano unit is a curved surface, the solidified microstructure array is distributed on the micro-nano unit, each solidified microstructure surface is a curved surface, the thickness of each micro-nano unit gradually decreases from the middle to the outside, and the thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to the surroundings.

[0017] In one or more embodiments of the present invention, the micro-nano units are distributed at intervals along the first direction:

[0018] The micro-nano units are longitudinally shaped and are distributed perpendicularly to the first direction, and the thickness of the micro-nano units in the first direction gradually decreases from the middle to both sides, the solidified microstructures are distributed on the micro-nano units along the first direction, the surface of each solidified microstructure is a curved surface, and the thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to both sides; or,

[0019] The micro-nano unit is longitudinally elongated and distributed perpendicularly to the first direction, and the upper surface of the micro-nano unit is a plane. The solidified microstructure is distributed on the micro-nano unit along the first direction, and the surface of each solidified microstructure is a curved surface. The thickness of the solidified microstructure above each micro-nano unit gradually decreases from the middle to both sides.

[0020] Another specific embodiment of the present invention provides a technical solution as follows:

[0021] A continuous surface micro-nano structure, comprising spaced micro-nano units and a solidified microstructure; wherein:

[0022] The solidified microstructure is continuously distributed and covers all the micro-nano units, and the thickness of the solidified microstructure between two adjacent micro-nano units gradually increases from the middle to both sides.

[0023] In one or more embodiments of the present invention, the micro-nano units are distributed at intervals in an array; or, the micro-nano units are distributed at intervals along a first direction.

[0024] In one or more embodiments of the present invention, the micro-nano units are distributed in an array: the micro-nano units are columnar, and the upper surface of the micro-nano units is a plane, the solidified microstructure array is distributed on the micro-nano units, each of the solidified microstructure surfaces is a curved surface, and the thickness of the solidified microstructure above each micro-nano unit gradually decreases from the middle to the periphery; or,

[0025] The micro-nano units are distributed in an array-like manner: the upper surface of the micro-nano unit is a curved surface, the solidified microstructure array is distributed on the micro-nano unit, the surface of each solidified microstructure is a curved surface, the thickness of each micro-nano unit gradually decreases from the middle to the outside, and the thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to the surroundings.

[0026] In one or more embodiments of the present invention, the micro-nano units are distributed at intervals along the first direction: the micro-nano units are longitudinally long and distributed perpendicularly to the first direction, and the thickness of the micro-nano units in the first direction gradually decreases from the middle to both sides, the solidified microstructures are distributed on the micro-nano units along the first direction, each of the solidified microstructures has a curved surface, and the thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to both sides; or,

[0027] The micro-nano units are distributed at intervals along the first direction: the micro-nano units are longitudinally elongated and distributed perpendicularly to the first direction, and the upper surface of the micro-nano units is a plane, the solidified microstructures are distributed on the micro-nano units along the first direction, each of the solidified microstructure surfaces is a curved surface, and the thickness of the solidified microstructure above each micro-nano unit gradually decreases from the middle to both sides.

[0028] Compared with the prior art, the continuous surface micro-nano structure and the preparation method thereof of the present invention can obtain a micro-nano structure with a continuous surface by coating glue on the micro-nano units distributed at intervals;

[0029] The invention has a simple preparation process, high processing precision, and simple preparation equipment;

[0030] The present invention is applicable to micro-nano units with various interval distributions and has a wide application range. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 This is a flow chart of the method for preparing the continuous surface micro-nano structure in Example 1 of the present invention;

[0033] Figure 2 This is a schematic diagram of the structure of the spaced-apart micro-nano units in Example 1 of the present invention;

[0034] Figure 3 It is a schematic plan view of the spaced-apart micro-nano units in Example 1 of the present invention;

[0035] Figure 4 This is a schematic diagram of the structure of the continuous surface micro-nano structure in Example 1 of the present invention;

[0036] Figure 5 This is a schematic diagram of the structure of the continuous surface micro-nano structure in Example 1 of the present invention;

[0037] Figure 6 Schematic diagram of the structure of the continuous surface micro-nano structure in Example 2 of the present invention;

[0038] Figure 7 It is a schematic plan view of the spaced-apart micro-nano units in Example 3 of the present invention;

[0039] Figure 8 This is a schematic diagram of the structure of the continuous surface micro-nano structure in Example 3 of the present invention;

[0040] Fig. 9 A microscope image of the spaced-apart micro-nano units and the continuous surface micro-nano structure in Example 3 of the present invention;

[0041] Fig.10 A microscope image of the spaced-apart micro-nano units and the continuous surface micro-nano structure in Example 3 of the present invention;

[0042] Fig.11 This is a schematic diagram of the structure of the continuous surface micro-nano structure in Example 3 of the present invention;

[0043] Fig.12 Schematic diagram of the structure of the continuous surface micro-nano structure in Example 4 of the present invention. DETAILED DESCRIPTION

[0044] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0045] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] The present invention discloses a method for preparing a continuous surface micro-nano structure, which specifically comprises:

[0047] Prepare spaced and distributed micro-nano units;

[0048] Apply glue on the spaced micro-nano units so that the glue covers all the micro-nano units and fills the space between two adjacent micro-nano units;

[0049] The glue is cured to obtain a cured microstructure, and a micro-nanostructure with a continuous surface shape is obtained. In this embodiment, the glue is a photoresist, and the glue is cured by ultraviolet light.

[0050] The present invention will be further described below with reference to the embodiments.

[0051] Embodiment 1:

[0052] like Figure 1 As shown, this embodiment discloses a method for preparing a continuous surface micro-nano structure, which specifically includes:

[0053] Step S1, preparing spaced and distributed micro-nano units 12.

[0054] Step S2, coating glue on the spaced micro-nano units 12, so that the glue covers all the micro-nano units 12 and fills between two adjacent micro-nano units 12. In this embodiment, the glue is coated on the spaced micro-nano units 12 by an atomization spraying process.

[0055] Furthermore, the atomization spraying process in this embodiment includes: spraying glue atomized particles onto the upper surface of the micro-nano unit 12 , and the glue atomized particles naturally flow on the upper surface of the micro-nano unit and cover all the micro-nano units 12 .

[0056] Step S3, curing the glue to obtain a cured microstructure 20, and obtaining a micro-nanostructure with a continuous surface shape. In this embodiment, the glue is a photoresist, and the glue is cured by ultraviolet light.

[0057] Further, the step S1 of preparing the spaced micro-nano units specifically includes: coating a glue on a substrate, exposing and developing the glue, forming spaced micro-nano units on the substrate, and peeling the substrate to obtain spaced micro-nano units. It is understandable that the glue used in the process of preparing the spaced micro-nano units can be a photoresist. Optionally, the material of the substrate includes at least one of silicon, germanium, glass, quartz, sapphire and indium phosphide.

[0058] Furthermore, the method for preparing the spaced micro-nano units in this embodiment is only an example, and those skilled in the art may prepare the spaced micro-nano units by other methods, such as nanoimprinting, etching, etc.

[0059] like Figure 2 The schematic diagram of the structure of the spaced micro-nano units in this embodiment is shown, the substrate 10 includes a first surface and a second surface arranged opposite to each other, and the spaced micro-nano units 12 are arranged on the first surface of the substrate 10. Optionally, the thickness of the substrate 10 is 5μm to 50μm. It can be understood that, for the convenience of describing the present invention, each of the drawings in the specification is described with the spaced micro-nano units arranged on the substrate 10, and the continuous surface micro-nano structure mentioned in the present invention does not include the substrate 10.

[0060] like Figure 3 As shown, the micro-nano units 12 in this embodiment are distributed at intervals in an array.

[0061] like Figure 4 As shown, the continuous surface micro-nano structure in this embodiment includes micro-nano units 12 and solidified microstructures 20 that are distributed at intervals. The solidified microstructures 20 are continuously distributed and cover all the micro-nano units 12. The thickness of the solidified microstructures between two adjacent micro-nano units 12 gradually increases from the middle to both sides. In this embodiment, the micro-nano units 12 are columnar, the upper surface of the micro-nano units 12 is a plane, and the upper surface of the micro-nano units 12 is parallel to the lower surface. By coating glue on the micro-nano units 12 that are distributed at intervals in an array, the glue covers all the micro-nano units 12 and fills between two adjacent micro-nano units 12, and the glue is solidified to obtain the solidified microstructure 20, and the solidified microstructure 20 is distributed in an array on the columnar micro-nano units 12. It can be understood that the micro-nano units 12 in this embodiment can be cylindrical, prismatic, etc.

[0062] It is understandable that before curing the glue, the glue will flow naturally on the surface of the micro-nano unit 12, covering all the micro-nano units 12 and filling between two adjacent micro-nano units 12, so the surface of each cured microstructure 20 is curved, and the cured microstructures 20 are continuously distributed, and the thickness of the cured microstructure 20 above the columnar micro-nano unit 12 gradually decreases from the middle to the surroundings. Further, in this embodiment, the glue can be cured after the glue stops flowing, or the glue can be cured when the glue covers all the micro-nano units 12 and fills between two adjacent micro-nano units 12.

[0063] Furthermore, the thickness of the solidified microstructure 20 between two adjacent micro-nano units 12 gradually increases from the middle to both sides.

[0064] It can be understood that, for the micro-nano units 12 with the same spacing distribution, the minimum thickness of the solidified microstructure 20 between two adjacent micro-nano units 12 is determined by the amount of glue. Figure 5 As shown in FIG. 1 , when the amount of glue used in the preparation process of the continuous surface micro-nano structure is large, the minimum thickness of the solidified microstructure 21 between two adjacent micro-nano units is relatively thick. Figure 4 As shown, when the amount of glue used in the preparation process of the continuous surface micro-nano structure is small, the minimum thickness of the solidified microstructure 20 between two adjacent micro-nano units 12 is close to 0, and the solidified microstructure 20 remains continuous.

[0065] Embodiment 2:

[0066] like Figure 6 As shown, the continuous surface micro-nano structure in this embodiment includes micro-nano units 13 and solidified microstructures 22 that are distributed at intervals. The solidified microstructures 22 are continuously distributed and cover all the micro-nano units 13. The thickness of the solidified microstructure between two adjacent micro-nano units 13 gradually increases from the middle to both sides. The micro-nano units 13 in this embodiment are distributed at intervals in an array, and the upper surface of the micro-nano units 13 is a curved surface, and the thickness of each micro-nano unit 13 gradually decreases from the middle to the outside. The solidified microstructure 22 is obtained by coating glue on the micro-nano units 13 that are distributed at intervals in an array, so that the glue covers all the micro-nano units 13 and fills between two adjacent micro-nano units 13, and solidifying the glue.

[0067] The solidified microstructures 22 are arrayed on the micro-nano units 13, and the surface of each solidified microstructure 22 is curved. The thickness of the solidified microstructure 22 above each micro-nano unit 13 gradually increases from the middle to the surroundings. The thickness of the solidified microstructure 22 between two adjacent micro-nano units 13 gradually increases from the middle to the sides. Furthermore, the micro-nano unit 13 in this embodiment can be a hemispherical, spherical, or cylindrical structure with a curved upper surface.

[0068] Embodiment 3:

[0069] like Figure 7 As shown, the micro-nano units 14 in this embodiment are distributed at intervals along the first direction A, wherein the micro-nano units 14 are longitudinally long and distributed perpendicularly to the first direction A.

[0070] like Figure 8 As shown, the continuous surface micro-nano structure in this embodiment includes micro-nano units 14 and solidified microstructures 23 that are distributed at intervals. The solidified microstructures 23 are continuously distributed and cover all the micro-nano units 14. The thickness of the solidified microstructure between two adjacent micro-nano units 14 gradually increases from the middle to both sides. The thickness of the micro-nano units 14 in this embodiment in the first direction A gradually decreases from the middle to both sides, that is, for each micro-nano unit 14, its thickness gradually increases and then gradually decreases along the first direction A. The solidified microstructure 23 is obtained by coating glue on the micro-nano units 14 that are distributed at intervals along the first direction A, so that the glue covers all the micro-nano units 14 and fills between two adjacent micro-nano units 14, and solidifying the glue.

[0071] like Figure 8 As shown, in this embodiment, the solidified microstructures 23 are distributed on the micro-nano units 14 along the first direction A, and the surface of each solidified microstructure 23 is curved, and the thickness of the solidified microstructure 23 above each micro-nano unit 14 gradually increases from the middle to both sides. The thickness of the solidified microstructure 23 between two adjacent micro-nano units 14 gradually increases from the middle to both sides.

[0072] like Fig. 9 As shown in a, it is a confocal microscope image of the spaced micro-nano units, where the micro-nano units are spaced along the first direction A, wherein the micro-nano units are longitudinal and distributed perpendicular to the first direction, the distance x1 between the symmetry center of the micro-nano unit and the symmetry center of two adjacent micro-nano units is approximately 74 μm, and the maximum thickness y1 of the micro-nano unit is approximately 14.97 μm.

[0073] like Fig. 9 b shows a confocal microscopy image of a continuous surface micro-nanostructure, covered by glue. Fig. 9 All the micro-nano units shown in a are filled between two adjacent micro-nano units, and the glue becomes a solidified microstructure after solidification. The thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to both sides, and the thickness of the solidified microstructure between two adjacent micro-nano units gradually increases from the middle to both sides. The distance x2 between the symmetry center of a micro-nano unit and the symmetry center of two adjacent micro-nano units is about 74μm, and the distance y2 between the highest point and the lowest point of the solidified microstructure is about 14.22μm. Fig. 9 a and Fig. 9From the comparison of y1 and y2, it can be seen that the method for preparing continuous surface micro-nano structures proposed in the present invention realizes the preparation of continuous surface micro-nano structures based on spaced micro-nano units, and based on the data changes of y1 and y2, it can be seen that the minimum thickness of the solidified microstructure between two adjacent micro-nano units is close to 0 (but will not be 0), and the solidified microstructure remains continuous.

[0074] Understandably, Fig. 9 a and Fig. 9 The coordinate system in b is used as a reference to illustrate the thickness change of the solidified microstructure between two adjacent micro-nano units, and the substrate thickness is not fully displayed.

[0075] like Fig.10 As shown, based on the preparation method of the continuous surface micro-nano structure proposed in the present invention, glue is coated on the spaced micro-nano units to obtain a micro-nano structure with a continuous surface.

[0076] It can be understood that, for the same micro-nano units 14 spaced apart along the first direction A, the minimum thickness of the solidified microstructure between two adjacent micro-nano units is determined by the amount of glue. Fig.11 As shown, when the amount of glue used in the preparation process of the continuous surface micro-nano structure is large, the minimum thickness of the cured microstructure 24 between two adjacent micro-nano units is relatively thick. Figure 8 As shown, when the amount of glue used in the preparation process of the continuous surface micro-nano structure is small, the minimum thickness of the solidified microstructure 23 between two adjacent micro-nano units is almost 0, but the solidified microstructure 23 still remains continuous.

[0077] Embodiment 4:

[0078] like Fig.12 As shown, the continuous surface micro-nano structure in this embodiment includes micro-nano units 15 and solidified microstructures 25 that are distributed at intervals. The solidified microstructures 25 are continuously distributed and cover all the micro-nano units 15. The thickness of the solidified microstructure between two adjacent micro-nano units 15 gradually increases from the middle to both sides. The micro-nano units 15 in this embodiment are distributed at intervals along the first direction A, wherein the micro-nano units 15 are longitudinally long and distributed perpendicularly to the first direction A. The upper surface of the micro-nano units 15 in this embodiment is a plane, and the thickness of the micro-nano units in the first direction A is equal. By coating glue on the micro-nano units 14 that are distributed at intervals along the first direction A, the glue covers all the micro-nano units 15 and fills between two adjacent micro-nano units 15, and the glue is solidified to obtain the solidified microstructure 25.

[0079] The solidified microstructures 25 are distributed on the micro-nano units 15 along the first direction A. The surface of each solidified microstructure 25 is curved, and the thickness of the solidified microstructure above each micro-nano unit 15 gradually decreases from the middle to the sides. The thickness of the solidified microstructure 25 between two adjacent micro-nano units 15 gradually increases from the middle to the sides.

[0080] It can be seen from the above technical solutions that the present invention has the following beneficial effects:

[0081] The present invention can obtain a micro-nano structure with a continuous surface shape by coating glue on the micro-nano units distributed at intervals. The present invention has a simple preparation process and high processing accuracy, and does not require expensive preparation equipment.

[0082] The present invention is applicable to micro-nano units with various interval distributions and has a wide application range.

[0083] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0084] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A method for preparing a continuous surface micro-nano structure, characterized in that: The preparation method comprises: Prepare spaced and distributed micro-nano units; Apply glue on the spaced micro-nano units so that the glue covers all the micro-nano units and fills the space between two adjacent micro-nano units; The glue is cured to obtain a cured microstructure, and a micro-nanostructure with a continuous surface shape is obtained.

2. The method for preparing a continuous surface micro-nano structure according to claim 1, characterized in that: The glue is coated on the spaced micro-nano units by an atomization spraying process, and the atomization spraying process includes: The glue atomized particles are sprayed onto the upper surface of the micro-nano unit, and the glue atomized particles flow naturally on the upper surface of the micro-nano unit and cover all the micro-nano units.

3. The method for preparing a continuous surface micro-nano structure according to claim 1, characterized in that: The thickness of the solidified microstructure between two adjacent micro-nano units gradually increases from the middle to both sides.

4. The method for preparing a continuous surface micro-nano structure according to claim 1, characterized in that: The micro-nano units are distributed in an array at intervals; or, the micro-nano units are distributed in an array at intervals along a first direction.

5. The method for preparing a continuous surface micro-nano structure according to claim 4, characterized in that: The micro-nano units are distributed in an array-like manner: The micro-nano unit is columnar, and the upper surface of the micro-nano unit is flat, the solidified microstructure array is distributed on the micro-nano unit, each solidified microstructure surface is curved, and the thickness of the solidified microstructure above each micro-nano unit gradually decreases from the middle to the periphery; or, The upper surface of the micro-nano unit is a curved surface, the solidified microstructure array is distributed on the micro-nano unit, each solidified microstructure surface is a curved surface, the thickness of each micro-nano unit gradually decreases from the middle to the outside, and the thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to the surroundings.

6. The method for preparing a continuous surface micro-nano structure according to claim 4, characterized in that: The micro-nano units are distributed at intervals along the first direction: The micro-nano units are longitudinally shaped and are distributed perpendicularly to the first direction, and the thickness of the micro-nano units in the first direction gradually decreases from the middle to both sides, the solidified microstructures are distributed on the micro-nano units along the first direction, the surface of each solidified microstructure is a curved surface, and the thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to both sides; or, The micro-nano unit is longitudinally elongated and distributed perpendicularly to the first direction, and the upper surface of the micro-nano unit is a plane. The solidified microstructure is distributed on the micro-nano unit along the first direction, and the surface of each solidified microstructure is a curved surface. The thickness of the solidified microstructure above each micro-nano unit gradually decreases from the middle to both sides.

7. A continuous surface micro-nano structure, characterized in that: The continuous surface micro-nano structure includes spaced micro-nano units and a solidified microstructure; wherein, The solidified microstructure is continuously distributed and covers all the micro-nano units, and the thickness of the solidified microstructure between two adjacent micro-nano units gradually increases from the middle to both sides.

8. The continuous surface micro-nano structure according to claim 7, characterized in that: The micro-nano units are distributed in an array at intervals; or, the micro-nano units are distributed in an array at intervals along a first direction.

9. The continuous surface micro-nano structure according to claim 8, characterized in that: The micro-nano units are distributed in an array: the micro-nano units are columnar, and the upper surface of the micro-nano units is a plane, the solidified microstructure array is distributed on the micro-nano units, each solidified microstructure surface is a curved surface, and the thickness of the solidified microstructure above each micro-nano unit gradually decreases from the middle to the surroundings; or, The micro-nano units are distributed in an array-like manner: the upper surface of the micro-nano unit is a curved surface, the solidified microstructure array is distributed on the micro-nano unit, the surface of each solidified microstructure is a curved surface, the thickness of each micro-nano unit gradually decreases from the middle to the outside, and the thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to the surroundings.

10. The continuous surface micro-nano structure according to claim 8, characterized in that: The micro-nano units are distributed at intervals along the first direction: the micro-nano units are longitudinal and distributed perpendicularly to the first direction, and the thickness of the micro-nano units in the first direction gradually decreases from the middle to both sides, the solidified microstructures are distributed on the micro-nano units along the first direction, each of the solidified microstructures has a curved surface, and the thickness of the solidified microstructure above each micro-nano unit gradually increases from the middle to both sides; or, The micro-nano units are distributed at intervals along the first direction: the micro-nano units are longitudinally elongated and distributed perpendicularly to the first direction, and the upper surface of the micro-nano units is a plane, the solidified microstructures are distributed on the micro-nano units along the first direction, each of the solidified microstructure surfaces is a curved surface, and the thickness of the solidified microstructure above each micro-nano unit gradually decreases from the middle to both sides.

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