Glass laser cutting method without polishing process
By setting auxiliary liquid in the station of the laser cutting machine, the glass surface is softened, thereby realizing the polishing process of glass laser cutting, solving the problems of high cost, low efficiency and unenvironmental protection in the prior art, and realizing the Efficient and environmentally friendly glass cutting effect.
Patent Information
- Application Number
- CN202310977028.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-04
- Publication Date
- 2025-02-14
AI Technical Summary
The existing glass laser cutting technology requires the polishing process using a polishing liquid, resulting in high cost, low efficiency and uneco-friendly.
A glass laser cutting method with no polishing process is adopted. By setting auxiliary liquid in the station of the laser cutting machine, the glass surface is softened, so that the laser can penetrate and accurately cut the glass.
This method does not require a polishing process and polishing liquid, reduces production costs, improves cutting efficiency, and is environmentally friendly.
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Figure CN119430639A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of laser cutting, and in particular to a glass laser cutting method without polishing process. Background Art
[0002] Glass is an amorphous inorganic non-metallic material. It is generally made of a variety of inorganic minerals (such as quartz sand, borax, boric acid, barite, barium carbonate, limestone, feldspar, soda ash, etc.) as the main raw materials, and a small amount of auxiliary raw materials are added. Its main components are silicon dioxide and other oxides. The chemical composition of ordinary glass is Na,Si0,.CaSi0,Si0, or Na,0·Ca0·6Si0, etc. The main component is silicate complex salt, which is a non-standard solid with irregular structure.
[0003] With the rapid development of the industry, the demand for glass is also increasing. In order to adapt to the use in certain fields, glass needs to be cut into various structures. The conventional cutting method is to use a cutting machine to cut rectangular glass produced in batches. This cutting method is easy to generate dust and seriously pollute the processing area. In addition, the edges cut by the cutting machine are uneven and need to be ground later, which is extremely inefficient.
[0004] In order to improve the above problems, the technical means of laser cutting has emerged. The motion trajectory of the laser head is pre-set in the control system, and the glass is cut by the laser beam. Before cutting, the cut glass needs to be polished with polishing liquid so that the laser can penetrate the cut glass. This method uses polishing liquid with high cost, low efficiency, and is not environmentally friendly.
[0005] Therefore, a better method is urgently needed to solve this problem. Summary of the invention
[0006] In view of this, an embodiment of the present invention provides a glass laser cutting method without a polishing process. By eliminating the polishing process, a new glass laser cutting method is adopted to solve the problems of high cost, low efficiency and environmental pollution in the prior art.
[0007] In a first aspect, an embodiment of the present invention provides a method for laser cutting glass without a polishing process, the method for laser cutting glass without a polishing process comprising:
[0008] S1: Workpiece preparation: clean the surface of the milled workpiece with clean water and remove the excess glass powder on the surface;
[0009] S2: Blow dry the cleaned workpiece surface with an air gun;
[0010] S3: Place the workpiece ready for cutting on the workstation of the laser cutting machine and start cutting;
[0011] S4: The cut workpiece is divided into parts;
[0012] Wherein, the workstation of the laser cutting machine is set as a rectangular cavity; auxiliary liquid is arranged in the rectangular cavity, and the liquid level of the auxiliary liquid is above the surface of the workpiece during the cutting operation.
[0013] As a preferred technical solution of an embodiment of the present invention, the milling includes rough grinding the surface of the workpiece.
[0014] As a preferred technical solution of the embodiment of the present invention, the workpiece surface in S2 is the cutting surface of the workpiece.
[0015] As a preferred technical solution of an embodiment of the present invention, a fixture for clamping the workpiece is provided on the workstation of the laser cutting machine.
[0016] As a preferred technical solution of the embodiment of the present invention, the auxiliary liquid includes a solution formed by mixing auxiliary materials with water;
[0017] The auxiliary materials include polytetrafluoroethylene, liquefied hydrogen fluoride and sodium hydroxide;
[0018] The auxiliary liquid is prepared by mixing only one of the auxiliary materials with water in a certain proportion.
[0019] As a preferred technical solution of an embodiment of the present invention, the workstation of the laser cutting machine includes a liftable setting.
[0020] As a preferred technical solution of the embodiment of the present invention, before S3, the following is also included:
[0021] S031: Clamping the workpiece onto the fixture;
[0022] S032: injecting auxiliary liquid into the workstation of the laser cutting machine;
[0023] S033: Immerse the assembled workpiece into the auxiliary liquid so that the auxiliary liquid level covers the surface of the workpiece.
[0024] In summary, the beneficial effects of the present invention are as follows:
[0025] In order to solve the above-mentioned technical problems, an embodiment of the present invention provides a glass laser cutting method without polishing process. This method only needs to clean the glass powder on the surface of the milled workpiece, and then dry it. After the workpiece is clamped, it is immersed in the workstation of the laser cutting machine. By setting the mixed auxiliary liquid in the workstation of the laser cutting machine, the laser cutting machine is assisted to perform laser cutting on the workpiece that has not undergone the traditional polishing procedure, and can accurately complete the cutting task; this method allows the workpiece to be penetrated by the laser for cutting without polishing with polishing liquid. This method eliminates the polishing process and the additional products in the polishing process and the extra labor costs; this method can effectively reduce production costs, greatly improve efficiency, and the method is environmentally friendly. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.
[0027] Figure 1 It is a schematic diagram of laser cutting processing of a glass laser cutting method without polishing process;
[0028] Figure 2 It is a grinding machine and milling schematic diagram of a glass laser cutting method without polishing process;
[0029] Figure 3 It is a schematic diagram of a cleaning mechanism of a glass laser cutting method without a polishing process;
[0030] Figure 4 It is a schematic diagram of the process of glass laser cutting method without polishing process;
[0031] Figure 5 yes Figure 4 A schematic diagram of the steps before step S3;
[0032] Parts and numbers in the figure: 1-workpiece, 11-liftable workbench, 20-laser cutting machine station, 30-auxiliary fluid, 40-laser cutting head, 51-column, 52-cantilever beam, 53-grinding head, 54-workbench, 55-base, 60-cleaning mechanism, 61-cleaning blue bar. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such a process, method, article or device. In the absence of further restrictions, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article or device comprising the elements. If there is no conflict, the various features in the embodiments and examples of the present invention can be combined with each other, all within the scope of protection of the present invention.
[0034] Example 1
[0035] See also Figures 1 to 4 , an embodiment of the present invention provides a method for improving glass cutting efficiency, the method for improving glass cutting efficiency comprising:
[0036] S1: Workpiece preparation: clean the surface of the milled workpiece with clean water and remove the excess glass powder on the surface;
[0037] Due to the size and dimensions of the workpiece 1, it is not convenient to wash it manually, and it is generally cleaned by equipment;
[0038] For details, please see Figure 2The embodiment of the present invention further provides a milling machine, which includes a column 51, a cantilever beam 52, a grinding head 53, a workbench 54, and a base 55; the cantilever beam 52 is arranged at one end of the column 51 and extends in a direction away from the column 51, and a grinding head 53 is arranged at the end of the cantilever beam 52 away from the column 51; the grinding head 53 can perform a rotational motion with adjustable speed based on the cantilever beam 52, and the cantilever beam 52 can perform a reciprocating linear motion based on the column 51; the workbench 54 is arranged on the base 55; a clamping tool is also arranged on the workbench 54;
[0039] First, place the workpiece blank on Figure 2 The clamping fixture on the workbench 54 of the milling machine shown is clamped and fixed, and then milling is performed, and the milling only needs to perform rough grinding on the workpiece 1; when the existing technology is used for processing, the surface to be processed of the workpiece 1 needs to be roughly ground to ensure its smoothness;
[0040] For details, please see Figure 3 The embodiment of the present invention further provides a cleaning mechanism 60, the cleaning mechanism 60 includes a plurality of cleaning blue strips 61, a plurality of teeth are arranged on one side of the cleaning blue strips 61, each pair of the cleaning blue strips 61 is arranged with the teeth facing each other, and a cavity is formed between the four teeth of each two pairs of the cleaning blue strips 61; each of the cleaning mechanisms 60 has a plurality of the cleaning blue strips 61, and a plurality of cavities for accommodating workpieces 1 can be formed by the teeth between the cleaning blue strips 61, so that a plurality of workpieces 1 can be cleaned at one time; as a preferred technical solution of this embodiment, the cleaning blue strips 61 are made of metal material;
[0041] The workpiece that has been roughly ground by the milling grinder is placed in the cleaning mechanism 60 for cleaning, and the residual glass powder during the rough grinding of the surface to be cut of the workpiece is cleaned by the cleaning;
[0042] S2: Blow dry the cleaned workpiece surface with an air gun;
[0043] Blow dry the surface of the cleaned workpiece 1 with an air gun at room temperature to prevent the residual water stains on the workpiece 1 after cleaning from adhering to the workpiece 1, and bringing the workpiece 1 into the workstation of the laser cutting machine to merge with the auxiliary liquid and contaminate the auxiliary liquid 30; wherein the workpiece surface can be the cutting surface of the workpiece, and the surface to be processed can be determined after the above steps, and the surface processed by the above steps can be laser cut;
[0044] S3: Place the workpiece ready for cutting on the workstation of the laser cutting machine and start cutting;
[0045] Place the prepared workpiece on the workstation of the laser cutting machine, operate the laser cutting machine, set cutting parameters, and perform cutting operations;
[0046] S4: The cut workpiece is divided into parts;
[0047] Divide the powder cut into a preset thickness into several small pieces of workpieces of required sizes;
[0048] The working station of the laser cutting machine is set as a rectangular cavity; an auxiliary liquid is arranged in the rectangular cavity, and the liquid level of the auxiliary liquid is above the surface of the workpiece 1 during the cutting operation; the auxiliary liquid 30 comprises a solution mixed with auxiliary materials and water; the auxiliary materials comprise polytetrafluoroethylene, liquefied hydrogen fluoride and sodium hydroxide; the auxiliary liquid 30 is made by mixing only one of the auxiliary materials with water or a blending solution in proportion; the auxiliary liquid 30 is used to assist the laser cutting machine to penetrate the auxiliary liquid surface and then penetrate the surface of the workpiece 1 for cutting operation; the auxiliary liquid 30 is also used to soften the glass surface, so that the laser cutting machine can more easily pass through the surface of the workpiece 1 to complete the cutting operation; the proportion of the auxiliary material is generally less than 2-10%, which is relatively small, and only the surface of the workpiece can be softened; and the auxiliary liquid 30 is reusable, and workers need to wear waterproof gloves when using it;
[0049] As a preferred technical solution of the embodiment of the present invention, before S3, the following is also included:
[0050] S031: Clamping the workpiece onto the fixture;
[0051] The work station of the laser cutting machine is provided with a fixture for clamping the workpiece, which is used to clamp the workpiece 1; the fixture on the work station of the laser cutting machine can be shrunk or expanded according to the size of the workpiece 1 to adapt to the size of the shrunk workpiece 1, so as to facilitate processing;
[0052] S032: injecting auxiliary liquid into the workstation of the laser cutting machine;
[0053] The auxiliary liquid 30 can be mixed in advance before injection, or can be mixed in the station of the laser cutting machine; in this embodiment, the mixed auxiliary liquid 30 is injected; the auxiliary liquid 30 is used to soften the surface of the workpiece so that the laser can penetrate the surface more easily to complete the cutting work;
[0054] S033: immersing the assembled workpiece into the auxiliary liquid so that the auxiliary liquid level covers the surface of the workpiece;
[0055] After the workpiece is clamped, the workpiece is immersed in the liquid surface of the auxiliary liquid 30 to be soaked in the auxiliary liquid 30 , so that the workpiece is subjected to laser cutting operation in the auxiliary liquid 30 .
[0056] Example 3
[0057] See also Figures 1 to 4 , an embodiment of the present invention provides a method for improving glass cutting efficiency. The principle of laser cutting glass is to use the high energy density and thermal effect of the laser beam to heat the glass surface and expand it rapidly, and then break the glass through the action of internal stress. Specifically, when the laser beam enters the glass surface, it will be absorbed and converted into heat energy, causing the temperature of the glass surface to rise. As time goes by, the heat energy will gradually conduct to the inside of the glass, causing the internal glass to be heated as well. When the temperature of the glass surface and the inside reaches a certain level, the glass will undergo thermal expansion and be affected by the internal stress, causing the glass to break. In this way, the laser beam can achieve precise cutting of the glass by controlling the heating time and heating intensity. However, when laser cutting glass, the surface of the processed glass is usually polished with polishing liquid first. The surface of the glass must be polished to be smooth to ensure the accuracy after laser penetration. The polishing process of the polishing machine: Polishing requires cleaning: clean the object to be polished and remove dirt and impurities on the surface; Rough polishing: use a coarse grinding wheel or abrasive belt for rough polishing to remove unevenness and scratches on the surface of the object; Medium polishing: use a medium grinding wheel or abrasive belt for medium polishing to remove tiny unevenness and scratches on the surface; Fine polishing: use a fine grinding wheel or abrasive belt for fine polishing to make the surface smoothness meet the requirements; Polishing: use a polishing brush or polishing cloth with polishing liquid to polish so that the surface smoothness and glossiness of the object meet the requirements; However, since the polishing liquid is generally not recycled and reused, the cost of the polishing liquid is high and it pollutes the environment. If each glass is polished, the overall processing efficiency will be reduced. This invention softens the surface of the glass to be processed by setting an auxiliary liquid so that the laser can smoothly penetrate the surface of the glass to be processed. The method provided in this embodiment only needs to clean the glass powder on the surface of the milled workpiece and then dry it. After the workpiece is clamped, it is immersed in the workstation of the laser cutting machine. By setting the mixed auxiliary liquid 30 in the workstation of the laser cutting machine, the laser cutting machine is assisted to perform laser cutting on the workpiece that has not undergone the traditional polishing procedure, and the cutting task can be completed accurately. This method allows the workpiece to be penetrated by the laser for cutting without polishing with polishing liquid. This method does not require polishing process and polishing liquid, reduces cost, greatly improves efficiency, and the method is environmentally friendly.
[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some or all of the technical features can be replaced by equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A glass laser cutting method without polishing process, characterized in that: The glass laser cutting method without polishing process comprises: S1: Workpiece preparation: clean the surface of the milled workpiece with clean water and remove excess glass powder from the workpiece surface; S2: Blow dry the cleaned workpiece surface with an air gun; S3: Place the workpiece ready for cutting on the workstation of the laser cutting machine and start cutting; S4: dividing the cut workpieces; Wherein, the workstation of the laser cutting machine is set as a rectangular cavity; auxiliary liquid is arranged in the rectangular cavity, and the liquid level of the auxiliary liquid is above the surface of the workpiece during the cutting operation.
2. The glass laser cutting method without polishing process according to claim 1 is characterized in that: The milling includes rough grinding of the surface of the workpiece.
3. The method for improving glass cutting efficiency according to claim 1, characterized in that: The workpiece surface in S2 can be the cutting surface of the workpiece.
4. The glass laser cutting method without polishing process according to claim 3 is characterized in that: A fixture for clamping the workpiece is provided on the workstation of the laser cutting machine.
5. The glass laser cutting method without polishing process according to claim 1, characterized in that: The auxiliary liquid includes a solution formed by mixing auxiliary materials with water; The auxiliary materials include polytetrafluoroethylene, liquefied hydrogen fluoride and sodium hydroxide; The auxiliary liquid is prepared by mixing only one of the auxiliary materials with water in a certain proportion.
6. The glass laser cutting method without polishing process according to claim 1, characterized in that: The workstation of the laser cutting machine includes a lifting and lowering arrangement.
7. The glass laser cutting method without polishing process according to claim 1, characterized in that: The S3 also includes: S031: Clamping the workpiece onto the fixture; S032: injecting auxiliary liquid into the workstation of the laser cutting machine; S033: Immerse the assembled workpiece into the auxiliary liquid so that the auxiliary liquid level covers the surface of the workpiece.
8. The glass laser cutting method without polishing process according to claim 1, characterized in that: The cutting depth or thickness of the workpiece when cutting is calculated from the liquid level of the auxiliary liquid.