Thermal insulation coating for construction on high-temperature surface and preparation method of thermal insulation coating

Abstract

The invention provides a thermal insulation coating for construction on a high-temperature surface and a preparation method thereof, and relates to the field of thermal insulation coatings. The thermal insulation coating for high-temperature surface construction is prepared from organic silicon resin, polybutadiene, a catalyst, E51 epoxy resin, a Karst catalyst, a solvent 1, a solvent 2, a thermal insulation functional filler, SiO2 aerogel, titanium dioxide and an adhesion promoter. The epoxy modified organic silicon resin and the two high-boiling-point organic solvents are combined, so that the problem that a traditional coating system cannot be directly constructed on a high-temperature surface is solved, the prepared high-temperature surface construction heat insulation coating material can be directly sprayed and constructed on the surface of a substrate at the high temperature of 160 DEG C, and normal production activities are not affected.

Description

Technical Field

[0001] The invention relates to the technical field of heat-insulating coatings, and in particular to a heat-insulating coating for application on high-temperature surfaces and a preparation method thereof. Background Art

[0002] High-temperature reaction furnaces and smelting furnaces used in large-scale industrial production release heat to the surroundings during use. The surface temperature of the furnace is high, which is very dangerous. In order to maintain the temperature inside the furnace, a large amount of energy is consumed. Therefore, spraying a layer of thermal insulation coating on the surface of the furnace is a simple and effective solution. However, the use of conventional thermal insulation coating materials requires the furnace to be shut down and construction can only be carried out after the temperature drops, which is bound to affect the normal production progress of the enterprise.

[0003] At present, when the existing coating system is directly sprayed onto a high-temperature surface, the normal film-forming process of the coating system will be destroyed, the solvent volatilization process will be sharply shortened, and the resin curing rate will be greatly accelerated, resulting in problems such as blistering, orange peel, cracking, powdering, poor adhesion, etc., and the film cannot be formed, so it cannot be directly applied on a high-temperature surface. Therefore, a thermal insulation coating material that can be sprayed on a high-temperature surface is needed. Summary of the invention

[0004] In view of this, the present application utilizes a combination of epoxy-modified silicone resin and two high-boiling point organic solvents to solve the problem that traditional coating systems cannot be directly applied on high-temperature surfaces, and prepares a thermal insulation coating material that can be applied on high-temperature surfaces.

[0005] The technical solution of the present invention is implemented as follows: The present invention provides a thermal insulation coating for application on high-temperature surfaces, comprising the following initial raw materials in parts by mass: 45-58 parts of silicone resin; 85-110 parts of polybutadiene; Catalyst 0.010~0.014 parts; E51 epoxy resin 1.5~2.5 parts; Custer catalyst 0.002~0.003 parts; Solvent 1 15-25 parts; Solvent 2 5-8 parts; 15~25 parts of heat insulation filler; 1~3 parts of SiO2 aerogel; 1.5~2.5 parts of titanium dioxide; Adhesion promoter 0.5~1.5 parts.

[0006] On the basis of the above technical solution, preferably, the solvent 1 is selected from at least one of DBE, cyclohexanone and amyl acetate.

[0007] On the basis of the above technical solution, preferably, the solvent 2 is selected from DPNB and / or ethyl benzoate.

[0008] On the basis of the above technical solution, preferably, the catalyst is Pt.

[0009] According to another aspect of the present application, a method for preparing the above-mentioned thermal insulation coating for application on a high-temperature surface is provided, wherein the raw materials are weighed by mass, and the method comprises the following steps: Step a: stirring a mixture containing an epoxy-modified silicone resin, solvent 1, and solvent 2 for 1 to obtain an epoxy-modified silicone resin solution; Step b: Add heat-insulating functional filler, SiO2 aerogel and titanium dioxide to the epoxy-modified silicone resin solution in sequence, stir for 2, add adhesion promoter, stir for 3, and obtain the heat-insulating coating for application on high-temperature surfaces.

[0010] Based on the above technical solution, preferably, in step a, the boiling point of solvent 1 is lower than the boiling point of solvent 2.

[0011] On the basis of the above technical solution, preferably, in step a, the preparation method of the epoxy-modified silicone resin comprises the following steps: Step S1: reacting a mixture of an organic silicone resin, polybutadiene, Pt and toluene to obtain a modified organic silicone resin; Step S2: reacting a mixture containing modified silicone resin, E51 epoxy resin, Custer catalyst and xylene by 2 to obtain epoxy modified silicone resin.

[0012] On the basis of the above technical solution, preferably, in the step S1, the amount of Pt added is calculated based on the total mass of the silicone resin and polybutadiene, and 80 mg Pt is added per kilogram of the silicone resin and polybutadiene.

[0013] On the basis of the above technical solution, preferably, in the step S2, the added amount of the Custer catalyst is calculated based on the mass of the silicone resin, and 50 mg of the Custer catalyst is added per kilogram of the silicone resin.

[0014] On the basis of the above technical solution, preferably, in the step S1, when using polybutadiene, the water present in the polybutadiene needs to be removed in advance.

[0015] On the basis of the above technical solution, preferably, in the step S1, the temperature of the reaction 1 is 70-90° C., and the time of the reaction 1 is 4-8 h.

[0016] On the basis of the above technical solution, preferably, in the step S1, the temperature of the reaction 1 is independently selected from any value of 70°C, 75°C, 80°C, 85°C, 90°C or a range between any two of the above.

[0017] On the basis of the above technical solution, preferably, in the step S1, the time of the reaction 1 is independently selected from any value among 4h, 5h, 6h, 7h, 8h or a range between any two of the above.

[0018] On the basis of the above technical solution, preferably, in the step S2, the temperature of the reaction 2 is 90-100° C., and the time of the reaction 2 is 6-12 h.

[0019] On the basis of the above technical solution, preferably, in the step S2, the temperature of the reaction 2 is independently selected from any value of 90°C, 92°C, 95°C, 98°C, 100°C or a range between any two of the above.

[0020] On the basis of the above technical solution, preferably, in the step S2, the time of the reaction 2 is independently selected from any value among 6h, 7h, 8h, 9h, 10h, 11h, 12h or a range between any two of the above.

[0021] On the basis of the above technical solution, preferably, the rotation speed of the stirring 1 is 500-1000 rpm, and the stirring time of the stirring 1 is 20-40 min.

[0022] On the basis of the above technical solution, preferably, the rotation speed of the stirring 1 is independently selected from any value of 500 rpm, 600 rpm, 700 rpm, 800 rpm, 900 rpm, 1000 rpm or a range between any two of the above.

[0023] On the basis of the above technical solution, preferably, the stirring time 1 is independently selected from any value among 20 min, 25 min, 30 min, 35 min, 40 min or a range value between any two of the above.

[0024] On the basis of the above technical solution, preferably, the rotation speed of the stirring 2 is 300-600 rpm, and the stirring time of the stirring 2 is 30-60 min.

[0025] On the basis of the above technical solution, preferably, the rotation speed of the stirring 2 is independently selected from any value of 300 rpm, 350 rpm, 400 rpm, 450 rpm, 500 rpm, 550 rpm, 600 rpm or a range between any two of the above.

[0026] On the basis of the above technical solution, preferably, the stirring time 2 is independently selected from any value among 30min, 35min, 40min, 45min, 50min, 55min, 60min or a range value between any two of the above.

[0027] On the basis of the above technical solution, preferably, the rotation speed of the stirring 3 is 500-1000 rpm, and the stirring time of the stirring 3 is 30-60 min.

[0028] On the basis of the above technical solution, preferably, the rotation speed of the stirring 3 is independently selected from any value of 500 rpm, 600 rpm, 700 rpm, 800 rpm, 900 rpm, 1000 rpm or a range between any two of the above.

[0029] On the basis of the above technical solution, preferably, the stirring time 3 is independently selected from any value among 30min, 35min, 40min, 45min, 50min, 55min, 60min or a range value between any two of the above.

[0030] On the basis of the above technical solution, preferably, the heat insulating functional filler is selected from at least one of hollow glass microspheres, hollow alumina spheres, and vitrified microspheres.

[0031] As an optional implementation method, the present application is implemented through the following technical solutions: Step 1, weighing the silicone resin, polybutadiene and Pt by mass, adding them to a toluene solution, heating under reflux at 70-90° C., stirring for 6 hours, and distilling under reduced pressure to remove the solvent to obtain a modified silicone resin; Step 2, adding the modified silicone resin obtained in step 1, E51 epoxy resin and Custer catalyst into a xylene solution, heating under reflux at 90-100° C., stirring for 8 hours, and reacting to obtain an epoxy-modified silicone resin; Step 3, adding the epoxy-modified silicone resin obtained in step 2, solvent 1 and solvent 2 into a disperser, stirring until uniformly dispersed, to obtain an epoxy-modified silicone resin solution; Step 4, adding the heat-insulating filler, SiO2 aerogel and titanium dioxide to the mixed solution obtained in step 3 in sequence, stirring until the mixture is evenly dispersed to obtain a mixed solution; Step 5: Add the adhesion promoter to the mixed solution obtained in step 4, stir until it is evenly dispersed, and obtain a thermal insulation coating that can be applied on high-temperature surfaces.

[0032] On the basis of the above technical solutions, preferably, after the epoxy-modified silicone resin is modified, the molecular chain of the resin becomes longer, the curing rate decreases, and the toughness and adhesion thereof are improved.

[0033] On the basis of the above technical scheme, preferably, when the boiling point of solvent 1 is lower than that of solvent 2, solvent 1 can evaporate quickly on the surface of the substrate, so that the coating can initially form a film and adhere to the surface of the substrate; when the boiling point of solvent 2 is higher than that of solvent 1, the evaporation rate of solvent 2 on the surface of the substrate is slower, so that the coating maintains fluidity for a certain period of time, so that the paint film on the surface of the substrate can be leveled.

[0034] The thermal insulation coating prepared by the present application using a combination of epoxy-modified silicone resin, solvent 1 and solvent 2 has good film-forming properties on high-temperature surfaces. This is due to the moderate curing rate of the epoxy-modified silicone resin. When the boiling point of solvent 1 is lower than that of solvent 2, solvent 1 can evaporate quickly on the high-temperature surface, and will not evaporate completely before the paint mist falls on the high-temperature surface, so that the coating can initially form a film on the high-temperature surface; wherein, solvent 2 has a higher boiling point, and the evaporation rate of solvent 2 on the high-temperature surface is relatively slow, so that the coating can maintain fluidity on the high-temperature surface for a certain period of time, so that the paint film can be leveled. Therefore, only when the appropriate ratio between solvent 1 and solvent 2 is ensured, the spraying quality of the thermal insulation coating on the substrate surface can be guaranteed.

[0035] The heat-insulating coating material of the present invention that can be applied on high-temperature surfaces has the following beneficial effects compared to the prior art: (1) The thermal insulation coating prepared in this application and capable of being applied on high-temperature surfaces can effectively reduce the temperature of the outer surfaces of high-temperature objects such as high-temperature reactors and smelting furnaces, improve safety, reduce the incidence of high-temperature injuries, reduce energy consumption, and can be applied without stopping production, thereby reducing downtime losses.

[0036] (2) The thermal insulation coating prepared in this application and capable of being applied on high-temperature surfaces can be directly sprayed on the surface of a substrate at a high temperature of 160°C without affecting normal production activities.

[0037] (3) The epoxy-modified silicone resin provided in the present application extends the silicone side chain and reduces the curing rate of silicone on high-temperature surfaces, while retaining the advantages of high adhesion and good toughness of epoxy resin.

[0038] (4) The thermal insulation coating provided in the present application that can be applied on high-temperature surfaces has good thick coating properties, with a one-time film thickness of up to 1000 μm; it has good thermal insulation effect and can effectively reduce the surface temperature of the substrate; on the substrate surface under 160°C conditions, its thermal insulation temperature difference reaches 45°C±5°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 This is a diagram of a thermal insulation coating film that can be applied on a high-temperature surface according to an embodiment of the present invention; Figure 2 This is a coating film diagram of the coating prepared without modifying the organic silicon resin in Comparative Example 1 of the present invention; Figure 3 This is a coating film diagram of a coating prepared with a small amount of solvent 2 in Comparative Example 2 of the present invention; Figure 4 This is a coating film diagram of a coating prepared with a small amount of solvent 1 in Comparative Example 3 of the present invention; Figure 5 This is a coating film diagram of a coating prepared using other solvents in Comparative Example 4 of the present invention. DETAILED DESCRIPTION

[0041] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] In the examples of the present application, "DBE" refers to a divalent acid ester and "DPNB" refers to "dipropylene glycol butyl ether".

[0043] Example 1 Step 1, weighing 45 g of silicone resin, 85 g of polybutadiene and 0.010 g of Pt by mass, adding them into 1000 mL of toluene solution, heating under reflux at 70° C., stirring for 8 h, and distilling under reduced pressure to remove the toluene solvent to obtain a modified silicone resin; Step 2: Add the modified silicone resin obtained in step 1, 1.5 g of E51 epoxy resin, and 0.002 g of Custer catalyst into 500 mL of xylene solution, heat under reflux at 90° C., stir for 12 h, and react to obtain epoxy-modified silicone resin; Step 3, adding the epoxy-modified silicone resin obtained in step 2, 15 g of DBE solvent 1 and 5 g of DPNB solvent 2 into a disperser, stirring at 500 rpm for 40 min until uniform dispersion is obtained to obtain an epoxy-modified silicone resin solution; Step 4: add 15 g of hollow glass microsphere insulation functional filler, 1 g of SiO2 aerogel and 1.5 g of titanium dioxide to the mixed solution obtained in step 3, and stir at 300 rpm for 60 min until the mixture is evenly dispersed to obtain a mixed solution; Step 5: Add 0.5 g of adhesion promoter to the mixed solution obtained in step 4, stir at 500 rpm for 60 min until it is evenly dispersed, and obtain a thermal insulation coating that can be applied on high-temperature surfaces.

[0044] Example 2 Step 1, weighing 58 g of silicone resin, 110 g of polybutadiene and 0.013 g of Pt by mass, adding them into 1000 mL of toluene solution, heating under reflux at 90° C., stirring for 4 h, and distilling under reduced pressure to remove the toluene solvent to obtain a modified silicone resin; Step 2: Add the modified silicone resin obtained in step 1, 2.5 g of E51 epoxy resin, and 0.003 g of Custer catalyst into 500 mL of xylene solution, reflux at 100° C., stir for 6 h, and react to obtain epoxy-modified silicone resin; Step 3, adding the epoxy-modified silicone resin obtained in step 2, 25 g of cyclohexanone solvent 1 and 8 g of ethyl benzoate solvent 2 into a disperser, stirring at 1000 rpm for 20 min until the mixture is evenly dispersed, to obtain an epoxy-modified silicone resin solution; Step 4: add 25 g of hollow glass microsphere insulation functional filler, 3 g of SiO2 aerogel and 2.5 g of titanium dioxide to the mixed solution obtained in step 3, and stir at 600 rpm for 30 min until the mixture is evenly dispersed to obtain a mixed solution; Step 5: Add 1.5 g of adhesion promoter to the mixed solution obtained in step 4, stir at 1000 rpm for 30 min until it is evenly dispersed, and obtain a thermal insulation coating that can be applied on high-temperature surfaces.

[0045] Example 3 Step 1, weighing 50 g of silicone resin, 100 g of polybutadiene and 0.012 g of Pt by mass, adding them into 1000 mL of toluene solution, heating under reflux at 80° C., stirring for 6 h, and distilling under reduced pressure to remove the toluene solvent to obtain a modified silicone resin; Step 2: Add the modified silicone resin obtained in step 1, 2 g of E51 epoxy resin, and 0.0025 g of Custer catalyst into 500 mL of xylene solution, heat under reflux at 95° C., stir for 8 h, and react to obtain epoxy-modified silicone resin; Step 3: Add the epoxy-modified silicone resin obtained in step 2, 20 g of DBE solvent 1 and 6.5 g of DPNB solvent 2 into a disperser, and stir at 700 rpm for 30 min until the mixture is evenly dispersed to obtain an epoxy-modified silicone resin solution; Step 4: add 20 g of alumina hollow sphere heat insulation filler, 2 g of SiO2 aerogel and 2 g of titanium dioxide to the mixed solution obtained in step 3, stir at 450 rpm for 45 min until the mixture is evenly dispersed, to obtain a mixed solution; Step 5: Add 1 g of adhesion promoter to the mixed solution obtained in step 4, stir at 700 rpm for 45 minutes until it is evenly dispersed, and obtain a thermal insulation coating that can be applied on high-temperature surfaces.

[0046] Example 4 Step 1, weighing 45 g of silicone resin, 85 g of polybutadiene and 0.010 g of Pt by mass, adding them into 1000 mL of toluene solution, heating under reflux at 70° C., stirring for 8 h, and distilling under reduced pressure to remove the toluene solvent to obtain a modified silicone resin; Step 2: Add the modified silicone resin obtained in step 1, 1.5 g of E51 epoxy resin, and 0.002 g of Custer catalyst into 500 mL of xylene solution, heat under reflux at 90° C., stir for 12 h, and react to obtain epoxy-modified silicone resin; Step 3, adding the epoxy-modified silicone resin obtained in step 2, 15 g of amyl acetate solvent 1 and 5 g of DPNB solvent 2 into a disperser, stirring at 500 rpm for 40 min until the mixture is evenly dispersed, to obtain an epoxy-modified silicone resin solution; Step 4: 15 g of hollow glass microsphere insulation filler, 1 g of SiO2 aerogel and 1.5 g of titanium dioxide are sequentially added to the mixed solution obtained in step 3, and stirred at 300 rpm for 60 min until uniformly dispersed to obtain a mixed solution; Step 5: Add 0.5 g of adhesion promoter to the mixed solution obtained in step 4, stir at 500 rpm for 60 minutes until the mixture is evenly dispersed, and obtain a thermal insulation coating that can be applied on high-temperature surfaces.

[0047] Example 5

[0048] Step 1, weighing 52 g of silicone resin, 105 g of polybutadiene and 0.012 g of Pt by mass, adding them to 1000 mL of toluene solution, heating under reflux at 80° C., stirring for 6 h, and distilling under reduced pressure to remove the toluene solvent to obtain a modified silicone resin; Step 2: Add the modified silicone resin obtained in step 1, 2.2 g of E51 epoxy resin, and 0.0025 g of Custer catalyst into 500 mL of xylene solution, heat under reflux at 95° C., stir for 8 h, and react to obtain epoxy-modified silicone resin; Step 3, adding the epoxy-modified silicone resin obtained in step 2, 18 g of DBE solvent 1 and 6 g of DPNB solvent 2 into a disperser, stirring at 750 rpm for 30 min until the mixture is evenly dispersed, to obtain an epoxy-modified silicone resin solution; Step 4: add 22 g of glass microsphere insulation filler, 2 g of SiO2 aerogel and 2 g of titanium dioxide to the mixed solution obtained in step 3, stir at 500 rpm for 42 min until the mixture is evenly dispersed, and obtain a mixed solution; Step 5: Add 1 g of adhesion promoter to the mixed solution obtained in step 4, stir at 750 rpm for 43 minutes until it is evenly dispersed, and obtain a thermal insulation coating that can be applied on high-temperature surfaces.

[0049] The thermal insulation coatings prepared in Examples 1 to 5 that can be applied on high temperature surfaces were sprayed on the surface of a substrate at 160°C and the thermal insulation temperature difference was tested. The thermal insulation temperature difference was 45°C ± 5°C. Figure 1 The figure shows the coating film of the thermal insulation coating that can be applied on the high-temperature surface using Examples 1 to 5. The thermal insulation coating forms a film on the surface of the substrate without cracks, and can effectively reduce energy consumption after spraying.

[0050] Comparative Example 1 Steps 1 and 2 in Example 1 were omitted, and 45 g of organic silicone resin was directly added to step 3. The remaining preparation conditions were the same as those in Example 1 to obtain a thermal insulation coating. Figure 2 As shown, after the thermal insulation coating prepared in Comparative Example 1 is sprayed on the surface of the substrate, the paint film surface is cracked and cannot form a film, and cannot be directly sprayed on the surface of the high-temperature substrate.

[0051] Comparative Example 2 The 5 g DPNB solvent 2 in step 3 of Example 1 was replaced with 4 g DPNB solvent 2, and the remaining steps were the same as those in Example 1 to obtain a thermal insulation coating. Figure 3 As shown, after the thermal insulation coating prepared in Comparative Example 2 is sprayed on the surface of the substrate, the paint film surface is cracked, the paint film cannot be leveled, the surface is uneven, and a film cannot be formed. Therefore, when the amount of solvent 2 is not within the component range of the thermal insulation coating that can be applied on a high-temperature surface, the paint film on the surface of the substrate after spraying cannot be leveled, an uneven surface appears, and a film cannot be formed.

[0052] Comparative Example 3 The 15 g DBE solvent 1 in step 3 of Example 1 was replaced with 12 g DBE solvent 1, and the remaining steps were the same as in Example 1 to obtain a thermal insulation coating. Figure 4 As shown, after the thermal insulation coating prepared in Comparative Example 3 is sprayed on the surface of the substrate, the paint film surface has cracks, the surface is uneven, and the film-forming effect is poor. Therefore, when the amount of solvent 1 is not within the component range of the thermal insulation coating that can be applied on the high-temperature surface, the solvent 1 evaporates completely before the paint mist completely falls on the high-temperature surface, resulting in a poor film-forming effect of the coating on the high-temperature surface.

[0053] Comparative Example 4 The 15 g DBE solvent 1 in step 3 of Example 1 was replaced with 15 g xylene as solvent 1, and the remaining steps were the same as those in Example 1 to obtain a thermal insulation coating. Figure 5 As shown, after the thermal insulation coating prepared in Comparative Example 4 is sprayed on the substrate surface, it cannot form a film and the surface agglomerates into powder. Therefore, when other solvents are used as solvent 1, the xylene solvent evaporates completely before the paint mist falls on the high-temperature surface, so that the coating agglomerates into powder on the high-temperature surface.

[0054] In the present application, when the thermal insulation coating material capable of being constructed on high-temperature surfaces prepared in the present application is sprayed on the surface of a substrate at 160°C to form a film, when the thermal insulation coating material capable of being constructed on high-temperature surfaces is prepared without adding epoxy-modified silicone resin, the paint film on the surface of the substrate cannot form a film and the film surface cracks; when the amounts of solvent 1 and solvent 2 are not within the range of the raw material formula, after the prepared thermal insulation coating material is sprayed, there are problems such as the paint film being unable to flow level and the paint film being uneven and having cracks. Therefore, the present application utilizes a combination of epoxy-modified silicone resin and two high-boiling point organic solvents (solvent 1 and solvent 2), and solves the problem that traditional coating systems cannot be directly constructed on high-temperature surfaces through the synergistic effect between epoxy-modified silicone resin and solvent 1 and solvent 2.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A thermal insulation coating for application on high temperature surfaces, characterized in that: The starting materials are composed of the following parts by weight: 45-58 parts of silicone resin; 85-110 parts of polybutadiene; Catalyst 0.010~0.014 parts; E51 epoxy resin 1.5~2.5 parts; Custer catalyst 0.002~0.003 parts; Solvent 1 15-25 parts; Solvent 2 5-8 parts; 15~25 parts of heat insulation filler; 1~3 parts of SiO2 aerogel; 1.5~2.5 parts of titanium dioxide; Adhesion promoter 0.5~1.5 parts.

2. The thermal insulation coating for application on high temperature surfaces as claimed in claim 1, characterized in that: The solvent 1 is selected from at least one of DBE, cyclohexanone and amyl acetate; The solvent 2 is selected from DPNB and / or ethyl benzoate; The catalyst is Pt.

3. The method for preparing a thermal insulation coating for application on a high temperature surface according to claim 1 or 2, characterized in that: Weigh the raw materials by mass, including the following steps: Step a: stirring a mixture containing an epoxy-modified silicone resin, solvent 1, and solvent 2 for 1 to obtain an epoxy-modified silicone resin solution; Step b: Add heat-insulating functional filler, SiO2 aerogel and titanium dioxide to the epoxy-modified silicone resin solution in sequence, stir for 2, add adhesion promoter, stir for 3, and obtain the heat-insulating coating for application on high-temperature surfaces.

4. The preparation method according to claim 3, characterized in that: In the step a, the boiling point of the solvent 1 is lower than the boiling point of the solvent 2.

5. The preparation method according to claim 3, characterized in that: In the step a, the preparation method of the epoxy-modified silicone resin comprises the following steps: Step S1: reacting a mixture of an organic silicone resin, polybutadiene, Pt and toluene to obtain a modified organic silicone resin; Step S2: reacting a mixture containing modified silicone resin, E51 epoxy resin, Custer catalyst and xylene by 2 to obtain epoxy modified silicone resin.

6. The preparation method according to claim 5, characterized in that: In the step S1, the amount of Pt added is calculated based on the total mass of the silicone resin and polybutadiene, and 80 mg of Pt is added per kilogram of the silicone resin and polybutadiene.

7. The preparation method according to claim 5, characterized in that: In the step S2, the amount of the Custer catalyst added is based on the mass of the silicone resin, and 50 mg of the Custer catalyst is added per kilogram of the silicone resin.

8. The preparation method according to claim 5, characterized in that: In step S1, the temperature of reaction 1 is 70-90° C., and the time of reaction 1 is 4-8 hours; In the step S2, the temperature of the reaction 2 is 90-100° C., and the time of the reaction 2 is 6-12 hours.

9. The preparation method according to claim 3, characterized in that: The stirring speed of the stirring 1 is 500-1000 rpm, and the stirring time of the stirring 1 is 20-40 min; The stirring speed of the stirring 2 is 300-600 rpm, and the stirring time of the stirring 2 is 30-60 min; The rotation speed of the stirring 3 is 500-1000 rpm, and the stirring time is 30-60 min.

10. The preparation method according to claim 3, characterized in that: The heat-insulating functional filler is selected from at least one of hollow glass microspheres, hollow alumina spheres, and vitrified microspheres.

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