Electroplating device

Abstract

The electroplating device comprises a membrane frame and an ionic membrane, the ionic membrane is arranged at the bottom of the membrane frame, the membrane frame comprises a plurality of first spraying holes used for discharging cathode liquid, a first preset included angle is formed between the liquid outlet direction of the first spraying holes and the vertical downward direction, and the first preset included angle is an acute angle. Cathode liquid discharged by the first jet holes downwards scours the ionic membrane, the flowability of a flow field on the lower layer of the cathode cavity is promoted, crystal precipitation is reduced, and voltage rise between an anode and a substrate caused by continuous increase of resistance between the anode and the substrate of the electroplating device is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to an electroplating device. Background Art

[0002] See also Figure 1 , shows a schematic diagram of the structure of an electroplating device, which includes an electroplating chamber, a membrane frame 100', an ion membrane 200', an electroplating power supply 800', and a substrate holding device 600'. The interior of the electroplating chamber includes a cathode chamber 300' and an anode chamber 400'. The side wall of the membrane frame 100' is surrounded to form the cathode chamber 300'. The anode chamber 400' is located below the cathode chamber 300'. The anode chamber 410' is accommodated in the anode chamber 400'. The ion membrane 200' is arranged at the bottom of the membrane frame 100' to separate the anode chamber 400' and the cathode chamber 300'. Among them, the anode 410' is immersed in the anode liquid and is electrically connected to the positive electrode of the electroplating power supply 800' through the titanium plate 450'. The substrate 500' is immersed in the cathode liquid and is electrically connected to the negative electrode of the electroplating power supply 800' through the substrate holding device 600'. The substrate 500' serves as a cathode. The metal ions in the anode liquid in the anode chamber 400' pass through the ion membrane 200' and enter the cathode liquid in the cathode chamber 300'. During electroplating, the electroplating power supply 800' outputs a constant current, and the substrate holding device 600' clamps the substrate 500' so that the substrate 500' is immersed in the cathode liquid in the cathode chamber 300' with its front side facing downward. The metal ions in the cathode liquid and the anode liquid, such as Cu 2+ Migrate to the surface of the substrate 500', the substrate 500' acquires electrons, and the metal ions are plated onto the surface of the substrate 500' to form an electroplating layer.

[0003] Generally, after multiple substrate electroplating processes (often referred to as "running") are performed in an electroplating device, the voltage between the anode 410' and the substrate 500' will increase. This phenomenon is mostly caused by the increase in resistance between the anode 410' and the substrate 500'. Figure 2 , shows a voltage curve between the anode 410' and the substrate 500' measured after the electroplating device has been run 14 times, from Figure 2 It can be seen that after 14 runs, the voltage between the anode 410' and the substrate 500' has increased significantly, close to 25 V. It is worth noting that when the voltage between the anode 410' and the substrate 500' increases to the maximum output voltage of the electroplating power supply 800', the electroplating power supply 800' will be converted from the constant current output mode to the constant voltage output mode. If the resistance between the anode 410' and the substrate 500' continues to increase at this time, the output current of the electroplating power supply 800' will deviate from the set current, thereby affecting the electroplating performance, such as affecting the uniformity of the electroplating film thickness. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that the voltage between the anode and the substrate increases after the electroplating device runs the film multiple times.

[0005] To solve the above problems, an embodiment of the present invention proposes an electroplating device, including a membrane frame and an ion membrane, the ion membrane is arranged at the bottom of the membrane frame, the membrane frame includes a plurality of first injection holes for discharging cathode liquid, and the liquid outlet directions of the plurality of first injection holes form a first predetermined angle with the vertical downward direction, and the first predetermined angle is an acute angle.

[0006] As described above, the electroplating device of the present invention has the following advantages:

[0007] The membrane frame used in the electroplating device is provided with a plurality of first injection holes, and the liquid outlet directions of the plurality of first injection holes form a first predetermined angle with the vertical downward direction. The first predetermined angle is an acute angle, so that the liquid outlet direction of the plurality of first injection holes is toward the ion membrane. The cathode liquid discharged from the first injection holes washes the ion membrane below the membrane frame obliquely downward, promotes the flow field fluidity of the lower layer of the cathode chamber, and thereby reduces the crystal precipitation on the ion membrane, avoids the continuous increase of the resistance between the anode and the substrate, thereby improving the problem of voltage increase between the anode and the substrate, and achieving good electroplating performance.

[0008] Other features and corresponding beneficial effects of the present invention are described in the latter part of the specification, and it should be understood that at least part of the beneficial effects become obvious from the description in the specification of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a structural schematic diagram of an electroplating device;

[0010] Figure 2 for Figure 1 The voltage curve between the anode and the substrate measured after 14 runs of the electroplating device shown;

[0011] Figure 3 It is a structural schematic diagram of a membrane frame;

[0012] Figure 4 This is a cross-sectional view of a branch pipe;

[0013] Figure 5 For use in an electroplating device Figure 3 The flow field distribution diagram of the lower layer of the cathode chamber behind the membrane frame shown;

[0014] Figure 6 A schematic diagram of the structure of a membrane frame provided in Example 1 of the present invention;

[0015] Figure 7 and Figure 8 A schematic cross-sectional view of a membrane frame provided in Example 1 of the present invention;

[0016] Fig. 9 A cross-sectional view of a branch pipe provided in Example 1 of the present invention;

[0017] Fig.10 A schematic diagram of a partial structure of a membrane frame provided in Example 1 of the present invention;

[0018] Fig.11 A schematic diagram of the direction in which cathode liquid is discharged from the first injection holes of two adjacent branch pipes of the membrane frame provided in Example 1 of the present invention;

[0019] Fig.12 A bottom-view cross-sectional schematic diagram of a branch pipe provided in Example 1 of the present invention, in which only one side wall is provided with a plurality of first injection holes;

[0020] Fig.13 A schematic diagram of the structure of the membrane frame provided in Example 1 of the present invention with the bottom facing upward;

[0021] Fig.14 A bottom view schematic diagram of a membrane frame provided in Example 1 of the present invention;

[0022] Fig.15 A flow field distribution diagram of the lower layer of the cathode chamber provided in Example 1 of the present invention;

[0023] Fig.16 A voltage curve diagram between the anode and the substrate measured after 14 runs of the electroplating device provided in Example 1 of the present invention;

[0024] Fig.17 A cross-sectional schematic diagram of a membrane frame with through holes provided in Example 1 of the present invention;

[0025] Fig.18 A bottom view schematic diagram of a membrane frame with through holes provided in Example 1 of the present invention;

[0026] Fig.19 A flow field distribution diagram of the lower layer of the cathode chamber after the electroplating device provided in Example 1 of the present invention uses a membrane frame with through holes.

[0027] Fig. 20 A schematic diagram of the structure of a membrane frame provided in Example 2 of the present invention;

[0028] Fig.21 A cross-sectional view of a branch pipe provided in Example 2 of the present invention;

[0029] Fig. 22 Another cross-sectional view of the branch pipe provided in Example 2 of the present invention;

[0030] Fig.23 A schematic diagram of a partial structure of a membrane frame provided in Example 2 of the present invention;

[0031] Fig.24 A schematic diagram of the direction in which cathode liquid is discharged from the second injection holes of two adjacent branch pipes of the membrane frame provided in Example 2 of the present invention; and

[0032] Fig.25 This is a flow field distribution diagram of the lower layer of the cathode chamber provided in Example 2 of the present invention. DETAILED DESCRIPTION

[0033] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may extend based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0034] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0035] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0039] Figure 1 The schematic diagram of the structure of the electroplating device in one embodiment is shown, and the electroplating device includes an electroplating chamber, a membrane frame 100', an ion membrane 200', a substrate holding device 600', an electroplating power supply 800', an ammeter 910' and a voltmeter 920'. The interior of the electroplating chamber includes a cathode chamber 300' and an anode chamber 400'. The side wall of the membrane frame 100' is surrounded to form the cathode chamber 300', which is used to accommodate the cathode liquid. The anode chamber 400' is located below the cathode chamber 300' and is used to accommodate the anode 410' and the anode liquid. The ion membrane 200' is arranged at the bottom of the membrane frame 100', which is used to separate the anode chamber 400' and the cathode chamber 300'. Among them, the anode 410' is immersed in the anode liquid and is electrically connected to the positive electrode of the electroplating power supply 800' through the titanium plate 450', the substrate 500' is immersed in the cathode liquid and is electrically connected to the negative electrode of the electroplating power supply 800' through the substrate holding device 600', and the substrate 500' serves as the cathode. The ammeter 910' is used to measure the current on the entire circuit, and the voltmeter 920' is used to measure the voltage between the anode 410' and the substrate 500'. It should be pointed out that the anode liquid and the cathode liquid can be collectively referred to as the electroplating liquid, and the electroplating liquid includes, for example, copper sulfate.

[0040] When the electroplating process is performed multiple times in succession in the electroplating device (hereinafter referred to as "runs"), the voltage between the anode 410' and the substrate 500' will increase. For example, when the electroplating device is run for the 14th time, the voltage increases from the set 21V to nearly 25V (refer to Figure 2 ), the cause of this phenomenon is mostly due to the increase in resistance between the anode 410' and the substrate 500'. The inventors of the present application have found that one of the reasons for the increase in resistance is that there are crystals precipitated on the ion membrane 200', such as copper sulfate crystals precipitated from the electroplating solution, which passivates the ion membrane 200'. In order to reduce the crystal precipitation, the flow field fluidity of the cathode chamber 300' can be enhanced.

[0041] Combination Figure 3 and Figure 4 , Figure 3 A schematic diagram of the structure of a membrane frame is shown. Figure 4 The liquid outlet direction of the injection hole 152' of the membrane frame 100' forms a predetermined angle α with the vertical upward direction (refer to Figure 4 ). The cathode liquid in the liquid supply channel 140' of the branch pipe 120' is discharged obliquely upward through the injection hole 152', which can promote the fluidity of the flow field in the upper layer of the cathode chamber 300'. However, the fluidity of the flow field in the lower layer of the cathode chamber 300' is very small, which can easily cause the plating liquid to crystallize and precipitate on the ion membrane 200' (combined with reference Figure 1 ), resulting in an increase in resistance between the anode 410' and the substrate 500', which in turn results in an increase in voltage between the anode 410' and the substrate 500'.

[0042] See also Figure 5 , Figure 5 An electroplating device using Figure 3 The flow field distribution diagram of the cathode chamber lower layer behind the membrane frame is shown in Fig. Figure 5 It can be seen that the dark area in the flow field region is large, indicating that there are many dead zones in the flow field at the lower layer of the cathode chamber 300'; the light area in the flow field region is small, indicating that the flow field fluidity at the lower layer of the cathode chamber 300' is very small.

[0043] In order to improve the flow field fluidity of the lower layer of the cathode chamber 300' and prevent the voltage between the anode 410' and the substrate 500' from increasing after multiple runs, the present invention improves the design of the film frame 100' of the electroplating device, as shown in the following embodiments.

[0044] Embodiment 1:

[0045] See also Figures 6 to 9 , Figure 6 A schematic diagram of the structure of the membrane frame in the embodiment of the present application is shown; Figure 7 and Figure 8 A cross-sectional schematic diagram of a membrane frame in an embodiment of the present application is shown; Fig. 9 The cross-sectional view of the branch pipe in the embodiment of the present application is shown. Figure 6 The section is made along the center section line DD.

[0046] like Figure 6 As shown, the membrane frame 100 includes a membrane frame side wall 110 and a plurality of branch pipes 120. Each branch pipe 120 has a first end and a second end. The first end of each branch pipe 120 extends to the middle channel 130 in the middle of the membrane frame 100, and the second end of each branch pipe 120 is connected to the membrane frame side wall 110. Figure 7 and Figure 8 As shown, an ion membrane 200 is disposed at the bottom of the membrane frame 100, and the liquid outlet directions of the plurality of first injection holes 151 are toward the ion membrane 200. Specifically, as Fig. 9As shown, the liquid outlet direction of the first spray hole 151 of the branch pipe 120 forms a first predetermined angle β1 with the vertical downward direction, and the first predetermined angle β1 is an acute angle, for example, 30° to 60°, and for example, 45°. In other embodiments, the angle of the first predetermined angle β1 can be designed according to specific needs.

[0047] like Figure 8 As shown, each branch pipe 120 is provided with a liquid supply channel 140 and a plurality of first injection holes 151. The liquid supply channel 140 is provided inside the branch pipe 120 and extends along the length direction of the branch pipe 120. The liquid supply channel 140 is connected with the plurality of first injection holes 151 and the cathode liquid inlet 111 provided on the side wall 110 of the membrane frame. When the cathode liquid is supplied to the cathode chamber 300, the cathode liquid flows into the liquid supply channel 140 from the cathode liquid inlet 111, and the cathode liquid in the liquid supply channel 140 enters the cathode chamber 300 through the plurality of first injection holes 151. The cathode liquid discharged from the first injection holes 151 flushes the ion membrane 200 obliquely downward, so that the fluidity of the flow field at the lower layer of the cathode chamber 300 is increased, so as to reduce the crystal precipitation on the ion membrane 200, and prevent the resistance between the anode and the substrate from continuously increasing and causing the voltage between the anode and the substrate to increase, thereby ensuring good electroplating performance and uniform electroplating film thickness. It should be noted that the lower layer of the cathode chamber 300 refers to the area in the cathode chamber 300 close to the ion membrane 200 , and particularly refers to the area in the cathode chamber 300 below the first injection hole 151 .

[0048] See also Fig.10 and Fig.11 , Fig.10 A partial structural schematic diagram of a membrane frame is shown; Fig.11 A schematic diagram showing the direction in which cathode liquid is discharged from the first injection holes of two adjacent branch pipes of the membrane frame; wherein, Fig.11 The dotted arrow in FIG. 1 indicates the direction in which the cathode liquid is discharged from the first injection hole.

[0049] like Fig.10 As shown, each branch pipe 120 has two opposite side walls, namely a first side wall 1201 and a second side wall 1202. Along the circumferential direction of the membrane frame 100, the side wall on the same side of each branch pipe 120 is the first side wall 1201, and the second side wall 1202 is on the opposite side of the first side wall 1201. Fig. 9 and Fig.10, the first side wall 1201 has a straight wall and a chamfered structure 12013, 12014, and the straight wall connects the chamfered structures 12013, 12014. The second side wall 1202 has a straight wall and a chamfered structure 12023, 12024, and the straight wall connects the chamfered structures 12023, 12024. A plurality of first injection holes 151 are arranged on the first side wall 1201 and / or the second side wall 1202. Specifically, the first injection holes 151 of this embodiment are arranged on the straight wall of the side wall. In some embodiments, the first injection holes 151 can be arranged at the chamfered structure 12014 of the first side wall 1201 and the chamfered structure 12024 of the second side wall 1202.

[0050] The plurality of first spray holes 151 are formed in at least one row on the side wall of the branch pipe 120 along the height direction thereof, and the plurality of first spray holes in each row of the first spray holes 151 are arranged in a row at intervals along the length direction L of the branch pipe 120. Fig.10 1 shows a row of first spray holes 151 on the corresponding side wall of the branch pipe 120, wherein a plurality of first spray holes in the row of first spray holes 151 are arranged in a row along the length direction L of the branch pipe 120. It should be noted that the height direction of the branch pipe 120 is a vertical direction in this embodiment, which is perpendicular to the length direction L.

[0051] Continue to see Fig.10 In some embodiments, for each branch pipe 120, a plurality of first injection holes 151 are disposed on the first side wall 1201 and the second side wall 1202, and form a row on each of the first side wall 1201 and the second side wall 1202. The row of first injection holes 151 disposed on the first side wall 1201 and the row of first injection holes 151 disposed on the second side wall 1202 are located at the same height of the branch pipe 120, and are staggered in the length direction L of the branch pipe 120.

[0052] In some embodiments, for each branch pipe 120, a plurality of first injection holes 151 are disposed on the first side wall 1201 and the second side wall 1202, and the plurality of first injection holes 151 are respectively arranged in a plurality of rows on the first side wall 1201 and the second side wall 1202 along the height direction of the branch pipe 120. The plurality of rows of first injection holes 151 disposed on the first side wall 1201 correspond to the plurality of rows of first injection holes 151 disposed on the second side wall 1202 in the height direction of the branch pipe 120, respectively, wherein the first injection holes 151 located on different side walls and at the same height are staggered in the length direction L of the branch pipe 120.

[0053] In some embodiments, the plurality of first spray holes 151 form at least two rows on the side wall of the branch pipe 120 along the height direction thereof, and two adjacent rows of first spray holes 151 on the same side wall of the branch pipe 120 are staggered in the length direction L of the branch pipe 120 .

[0054] In some embodiments, see Fig.11 , the first injection holes 151 on the opposite side walls of two adjacent branch pipes 120 are staggered. In this example, the first side wall 1201 of each branch pipe 120 is opposite to the second side wall 1202 of the adjacent branch pipe 120. When the first injection hole 151 of the first side wall 1201 of each branch pipe 120 and the first injection hole 151 of the second side wall 1202 respectively discharge the cathode liquid, the direction in which the first injection hole 151 of the first side wall 1201 of the branch pipe 120 discharges the cathode liquid is staggered with the direction in which the first injection hole 151 of the second side wall 1202 of the adjacent branch pipe 120 discharges the cathode liquid, which can weaken the mutual impact of the cathode liquid discharged from the opposite side walls, so that the flow rate of the plating liquid near the substrate in the cathode cavity is smooth.

[0055] In some embodiments, a plurality of first injection holes 151 are disposed on the sidewalls of each branch pipe 120 on the same side along the circumferential direction of the film frame 100. Fig.12 , Fig.12 FIG. 1 is a bottom-view cross-sectional schematic diagram showing that the branch pipe 120 is provided with a plurality of first injection holes 151 only on the first side wall 1201. Fig.12 As shown, a plurality of first injection holes 151 are disposed on a first side wall 1201 of each branch pipe 120, wherein the first side wall 1201 is located on the same side of each branch pipe 120 along the circumferential direction of the film frame 100 (for example, on the right side along the clockwise direction of the film frame 100). In other examples, a plurality of first injection holes 151 are disposed on a second side wall 1202 of each branch pipe 120, wherein the second side wall 1202 is located on the same side of each branch pipe 120 along the circumferential direction of the film frame 100.

[0056] Combination Fig.10 , Fig.13 and Fig.14 , Fig.13 and Fig.14 The membrane frame 100 further includes an intermediate retaining wall 131 and an intermediate channel 130. The intermediate retaining wall 131 defines the intermediate channel 130 extending in the vertical direction. The intermediate retaining wall 131 is connected to the first end of each branch pipe 120. A first groove 123 is provided at the bottom of the first end of each branch pipe 120. The plurality of first grooves 123 provided at the bottom of the first end of the branch pipe 120 can form an intermediate annular area for liquid circulation on the outer periphery of the intermediate retaining wall 131 (please refer to Fig.14 The dotted circle shown in the figure is located on the outer periphery of the middle retaining wall 131, so that the plating solution can flow in the middle annular area, thereby enhancing the fluidity of the flow field in the corner area between the middle retaining wall 131 and each branch pipe 120, reducing the dead zone of the flow field in the corner area, and further enhancing the overall fluidity of the lower layer of the cathode chamber.

[0057] In some embodiments, a second groove 124 is provided at the bottom of the second end of each branch pipe 120 connected to the membrane frame side wall 110. The plurality of second grooves 124 can allow the plating solution on both sides of the second end of the branch pipe 120 to flow, thereby enhancing the fluidity of the flow field in the corner area between the membrane frame side wall 110 and each branch pipe 120, reducing the dead zone of the flow field in the corner area, and further enhancing the overall fluidity of the lower layer of the cathode chamber.

[0058] like Fig.13 and Fig.14 As shown, the membrane frame 100 further includes an outer retaining wall 160, which is disposed between the first end and the second end of the plurality of branch pipes 120, and is used to separate the cathode chamber 300 into at least two independent cathode regions. In this embodiment, the membrane frame 100 includes an outer retaining wall 160, which divides the cathode chamber 300 into two cathode regions, the region surrounded by the outer retaining wall 160 is the first cathode region 310, and the region between the outer retaining wall 160 and the membrane frame side wall 110 is the second cathode region 320. The first ends of the plurality of branch pipes 120 are located in the first cathode region 310, and the second ends of the plurality of branch pipes 120 are located in the second cathode region 320.

[0059] In some embodiments, in the first cathode region 310 , a third groove (not shown) is disposed at the bottom of each branch pipe 120 connected to the outer retaining wall 160 to enhance fluidity of the flow field in the corner area between the outer retaining wall 160 and each branch pipe 120 .

[0060] In some embodiments, Fig.13 As shown, in the second cathode region 320, the membrane frame 100 is further provided with a reinforcing rib 170, which connects the outer ring retaining wall 160 and the membrane frame side wall 110, and can strengthen the strength of the outer ring retaining wall 160. In this embodiment, a reinforcing rib 170 is provided between adjacent branch pipes 120, and the reinforcing rib 170 and the branch pipe 120 divide the second cathode region 320 into multiple sub-regions along the circumferential direction. In order to enhance the fluidity of the flow field between the multiple sub-regions, a fourth groove 171 is provided at the bottom of the reinforcing rib 170. Fig.13 As shown, each sub-region is defined by an outer ring retaining wall 160 , a branch pipe 120 , a side wall 110 of the membrane frame 100 , and a reinforcing rib 170 .

[0061] By setting a second groove 124 at the bottom of the second end of the branch pipe 120 and setting a fourth groove 171 at the bottom of the reinforcing rib 170, an edge ring area for liquid circulation is formed in the circumference of the second cathode area 320, and the plating liquids of any two adjacent sub-areas of the second cathode area 320 circulate with each other, thereby enhancing the flow field fluidity of the second cathode area 320 and reducing the flow field dead zone of the second cathode area 320.

[0062] See also Fig.15 , Fig.15The figure shows the flow field distribution diagram of the lower layer of the cathode chamber after the electroplating device uses the membrane frame of this embodiment 1. Figure 5 The flow field distribution diagram of the lower layer of the cathode chamber 300' is compared. Fig.15 The shallow area of ​​the middle flow field region increases significantly, indicating that the overall flow field fluidity of the lower layer of the cathode chamber 300 is significantly accelerated.

[0063] See also Fig.16 , Fig.16 The voltage curve between the anode and the substrate is shown after 14 runs of the electroplating device using the film frame of this embodiment. Figure 2 The voltage curve between the anode and the substrate is shown in Figure 2. Fig.10 The voltage curves during each run are basically similar. After 14 runs, the voltage is stabilized at about 22V.

[0064] Therefore, combined with Fig.15 and Fig.16 It can be known that after the electroplating device adopts the membrane frame of this embodiment 1, the flow field fluidity of the lower layer of the cathode chamber 300 is significantly enhanced, which can reduce the crystal precipitation on the ion membrane 200, thereby reducing the voltage increase between the anode and the substrate after multiple runs.

[0065] like Fig.15 As shown, in the first cathode region 310, the flow field fluidity at the position of the plurality of first grooves arranged at the bottom of the first end of each branch pipe (reference position indicated by a1) is slightly weak. Based on this, in order to further improve the fluid fluidity, a through hole can be arranged at the first end of each branch pipe, see Fig.17 and Fig.18 A through hole 1231 is provided at the first end of each branch pipe 120, and the through hole 1231 connects the liquid supply channel 140 and the first groove 123 at the bottom of the first end of the corresponding branch pipe 120, so that the cathode liquid in the liquid supply channel 140 flushes downwardly the ion membrane 200 under the first groove 123, so as to enhance the flow field fluidity at the position of the first groove 123 at the bottom of the first end of each branch pipe 120, and further enhance the flow field fluidity in the corner area between the intermediate retaining wall 131 and each branch pipe 120. Fig.19 The figure shows the flow field distribution diagram of the lower layer of the cathode chamber after the electroplating device uses a membrane frame with through holes. Fig.19 It can be seen that the fluidity of the flow field at the position of the first groove at the bottom of the first end of each branch pipe (reference position indicated by a2) is significantly enhanced.

[0066] Similarly, combined Fig.17 and Fig.18In the second cathode region 320, a through hole 1231 may also be provided at the second end of each branch pipe 120, and the through hole 1231 connects the liquid supply channel 140 and the second groove 124 at the bottom of the second end of each branch pipe 120, so as to enhance the fluidity of the flow field at the position of the second groove 124, and further enhance the fluidity of the flow field in the corner area between the membrane frame side wall 110 and each branch pipe 120. Fig.15 Compared with the flow field at the second groove position at the bottom of the second end of each branch pipe (reference position indicated by b1), Fig.19 At the position of the second groove at the bottom of the second end of each branch pipe shown (the position indicated by reference b2), the fluidity of the flow field is relatively enhanced.

[0067] In some embodiments, a through hole (not shown) can be further provided at the junction of each branch pipe 120 and the outer ring retaining wall 160, and the through hole connects the liquid supply channel 140 and the third groove, so that the cathode liquid in the liquid supply channel 140 flushes downwardly the ion membrane 200 under the third groove to enhance the fluidity of the flow field at the position of the third groove.

[0068] In this embodiment, since the liquid outlet direction of the first injection hole 151 on the branch pipe 120 of the membrane frame 100 is toward the ion membrane 200 at the bottom of the membrane frame 100, which is obliquely downward, the first injection hole 151 can be punched from bottom to top, so that the tool penetrates from the bottom of the membrane frame 100 to punch the branch pipe 120, the drilling is convenient, and the tool is not easy to break.

[0069] Embodiment 2:

[0070] See also Figure 20 to Figure 22 , Fig. 20 A schematic structural diagram of a film frame 100A of an electroplating device provided in Example 2 of the present invention; Fig.21 A cross-sectional view of a branch pipe provided in Example 2 of the present invention; Fig. 22 Another cross-sectional view of the branch pipe provided in Example 2 of the present invention. Compared with Example 1, the difference of this embodiment is that: 1) the branch pipe 120A includes not only a plurality of first spray holes 151A, but also a plurality of second spray holes 152A. When the substrate is immersed in the cathode liquid of the cathode chamber 300A for electroplating, the liquid outlet direction of the first spray hole 151A is toward the ion membrane 200A, and the liquid outlet direction of the second spray hole 152A is toward the substrate, that is, the liquid outlet direction of the second spray hole 152A is away from the ion membrane 200A. 2) There is no groove at the bottom of each branch pipe 120A (please refer to Example 1). Fig.13 The first groove 123, the second groove 124 and the third groove not shown in the figure), and the bottom of the reinforcing rib 170A is not provided with a groove (please refer to the embodiment 1 Fig.13 The fourth groove 171).

[0071] like Fig.21 and Fig. 22 As shown, the liquid discharge direction of the first spray hole 151A forms a first predetermined angle β2 with the vertical downward direction, and the liquid discharge direction of the second spray hole 152A forms a second predetermined angle β3 with the vertical upward direction, and the first predetermined angle β2 and the second predetermined angle β3 are both acute angles. The first predetermined angle β2 is the same as the second predetermined angle β3, for example, 30° to 60°, and for example, 45°.

[0072] See also Fig. 20 Each branch pipe 120A has two opposite side walls, namely a first side wall 1201A and a second side wall 1202A. Fig.21 and Fig. 22 The first side wall 1201A has a straight wall and a chamfered structure 12013A, 12014A, wherein the straight wall connects the chamfered structures 12013A, 12014A, and the second side wall 1202A has a straight wall and a chamfered structure 12023A, 12024A, wherein the straight wall connects the chamfered structures 12023A, 12024A. A plurality of first injection holes 151A and a plurality of second injection holes 152A are arranged on the first side wall 1201A and / or the second side wall 1202A of each branch pipe 120A. Specifically, the first injection hole 151A of this embodiment is arranged on the straight wall of the side wall, and the second injection hole 152A is arranged at the chamfered structure (i.e., the chamfered structure 12013A or the chamfered structure 12023A) of the side wall. In some embodiments, the first side wall 1201A and the second side wall 1202A may both have straight walls, and in this case, the first injection hole 151A and the second injection hole 152A are both disposed on the straight walls of the corresponding side walls.

[0073] A plurality of first injection holes 151A and a plurality of second injection holes 152A are respectively formed in at least one row on the side wall along the height direction of the branch pipe 120A, and a plurality of first injection holes in each row of first injection holes 151A are arranged in a row at intervals along the length direction L of the branch pipe 120A, and a plurality of second injection holes in each row of second injection holes 152A are arranged in a row at intervals along the length direction L of the branch pipe 120A.

[0074] In some embodiments, Fig. 20A row of first injection holes 151A and a row of second injection holes 152A are formed on the first side wall 1201A and the second side wall 1202A of each branch pipe 120A, and the second injection holes 152A on the same side wall are located above the first injection holes 151A. In this embodiment, the first injection holes 151A and the second injection holes 152A on the same side wall are staggered in the length direction L of the branch pipe 120. In addition, with respect to the same branch pipe 120A, a row of first injection holes 151A arranged on the first side wall 1201A and a row of first injection holes 151A arranged on the second side wall 1202A are located at the same height of the branch pipe 120A, and are staggered in the length direction L of the branch pipe 120A; similarly, with respect to the second injection holes 152A, a row of second injection holes 152A arranged on the first side wall 1201A and a row of second injection holes 152A arranged on the second side wall 1202A are located at the same height of the branch pipe 120A, and are staggered in the length direction L of the branch pipe 120A.

[0075] In some embodiments, a plurality of rows of first injection holes 151A and a plurality of rows of second injection holes 152A are formed on the first side wall 1201A and the second side wall 1202A of each branch pipe 120A along the height direction of the branch pipe 120A. In the same branch pipe 120A, the plurality of rows of first injection holes 151A arranged on the first side wall 1201A correspond to the plurality of rows of first injection holes 151A arranged on the second side wall 1202A in the height direction of the branch pipe 120A, respectively, wherein the first injection holes 151A located on different side walls and at the same height are staggered in the length direction L of the branch pipe 120A. Similarly, with respect to the second injection holes 152A, in the same branch pipe 120A, the multiple rows of second injection holes 152A arranged on the first side wall 1201A correspond to the multiple rows of second injection holes 152A arranged on the second side wall 1202A in the height direction of the branch pipe 120A, wherein the second injection holes 152A located on different side walls and at the same height are staggered in the length direction L of the branch pipe 120A.

[0076] In some embodiments, the plurality of first injection holes 151A are formed in at least two rows on the side wall where the branch pipe 120A is located along the height direction, and the second injection holes 152A are located above the first injection holes 151A on the same side wall of the branch pipe 120A, and the two adjacent rows of first injection holes 151A located on the same side wall of the branch pipe 120A are staggered in the length direction L of the branch pipe 120A. Similarly, the plurality of second injection holes 152A are formed in at least two rows on the side wall where the branch pipe 120A is located along the height direction, and the two adjacent rows of second injection holes 152A located on the same side wall of the branch pipe 120A are staggered in the length direction L of the branch pipe 120A. In this embodiment, a row of first injection holes 151A and a row of second injection holes 152A located on the same side wall of the branch pipe 120A and adjacent in the height direction of the branch pipe 120A are staggered in the length direction of the branch pipe 120A.

[0077] In some embodiments, reference Fig.23 On the same side wall of the branch pipe 120A, at least one row of first injection holes 151A and at least one row of second injection holes 152A alternate in the height direction of the branch pipe 120A, wherein a row of first injection holes 151A and a row of second injection holes 152A adjacent in the height direction of the branch pipe 120A are staggered in the length direction L of the branch pipe 120A, which helps to make the flow field in the cathode chamber 300A more uniform.

[0078] In some embodiments, in combination Fig.21 and Fig. 22 In the same cross section of the branch pipe 120A, the first injection hole 151A and the second injection hole 152A located on different side walls are coaxial. Fig. 20 The first injection hole 151A of the first side wall 1201A and the second injection hole 152A of the second side wall 1202A are coaxial, and their axes pass through the liquid supply channel 140A of the branch pipe 120A. Through this coaxial design, in the process of machining the injection holes, the first injection hole 151A and the second injection hole 152A can be punched from bottom to top, that is, the tool penetrates obliquely upward from the bottom of the membrane frame 100A to punch the branch pipe 120A, and at the same time, the first injection hole 151A of one side wall and the second injection hole 152A of the other side wall are punched, which is convenient for punching and the tool is not easy to break.

[0079] See also Fig.24 , Fig.24 The schematic diagram is a direction diagram of cathode liquid discharged from the second injection holes of two adjacent branches of the membrane frame 100A; wherein, Fig.24The dotted arrow in the figure indicates the direction in which the cathode liquid is discharged from the second injection hole. The second injection holes 152A on the opposite side walls of two adjacent branch pipes 120A are staggered with each other, and the first side wall 1201A of each branch pipe 120A is opposite to the second side wall 1202A of the adjacent branch pipe 120A. The direction in which the cathode liquid is discharged from the second injection hole 152A on the first side wall 1201A of the branch pipe 120A is staggered with the direction in which the cathode liquid is discharged from the second injection hole 152A on the second side wall 1202A of the adjacent branch pipe 120A, which can avoid the cathode liquid discharged from the opposite side walls toward the substrate from colliding with each other, reduce the impact of the cathode liquid on the substrate, thereby making the cathode liquid flow rate near the substrate smooth, ensuring a good electroplating effect. Similarly, the first injection holes 151A on the opposite side walls of two adjacent branch pipes 120A are staggered with each other.

[0080] In this embodiment, the cathode liquid is discharged obliquely upward by using the design of opening the second injection hole 152A obliquely upward, so as to promote the fluidity of the flow field in the upper layer of the cathode chamber 300A. The cathode liquid flushes the ion membrane 200A obliquely downward by using the design of opening the first injection hole 151A obliquely downward (refer to Fig. 20 ) to promote the flow field fluidity of the lower layer of the cathode chamber 300A, reduce the dead zone of the flow field, and further reduce the crystal precipitation on the ion membrane 200A, prevent the resistance between the anode and the substrate from increasing and causing the voltage between the anode and the substrate to increase, thereby achieving good electroplating performance.

[0081] In addition, when the cathode liquid flow rate supplied to the branch pipe 120A is the same, compared with only opening the second injection hole 152A, the branch pipe 120A in the present application simultaneously opens the first injection hole 151A and the second injection hole 152A, so that the cathode liquid in the branch pipe 120A is discharged in two directions at the same time, which plays a role of diversion. Under the premise of ensuring that the total supply flow rate of the cathode liquid remains unchanged, the cathode liquid flow rate of the second injection hole 152A is reduced, thereby reducing the impact of the cathode liquid on the substrate, thereby making the cathode liquid flow rate near the substrate smooth, thereby ensuring a good electroplating effect.

[0082] See also Fig.25 , shows the flow field distribution diagram of the lower layer of the cathode chamber after the electroplating device uses the membrane frame 100A of this embodiment 2. Figure 5 The flow field distribution diagram of the lower layer of the cathode chamber 300' is compared. Fig.25 The light-colored area in the middle flow field region is significantly increased, indicating that the flow rate of the plating solution in the lower layer of the cathode chamber 300A is significantly accelerated and the dead zone of the flow field is significantly reduced.

[0083] After the electroplating device uses the membrane rack 100A of this embodiment and has been run for many times, the voltage between the anode and the substrate can remain stable, and the voltage will not increase significantly due to the increase of crystal precipitation on the ion membrane 200A.

[0084] It should be noted that the bottom of the branch pipe 120A of the second embodiment can also be configured as in the first embodiment as required. Fig.13 The first groove 123, the second groove 124, the third groove not shown in the figure, and the bottom of the reinforcing rib 170A can also be configured as in Example 1 as needed. Fig.13 The fourth groove 171 is formed in the shape of a second groove 171 of the mobile phase.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electroplating device, characterized in that: It includes a membrane frame and an ion membrane, wherein the ion membrane is arranged at the bottom of the membrane frame, and the membrane frame includes: A plurality of first spray holes are used to discharge cathode liquid, and the liquid discharge direction of the plurality of first spray holes forms a first predetermined angle with the vertical downward direction, and the first predetermined angle is an acute angle.

2. The electroplating device according to claim 1, characterized in that: The membrane frame includes a plurality of branch pipes, each of which includes a liquid supply channel for providing cathode liquid and two opposite side walls, the two side walls include a first side wall and a second side wall, the plurality of first injection holes are arranged on the first side wall and / or the second side wall, the liquid supply channel extends along the length direction of the branch pipe, and the plurality of first injection holes are connected to the liquid supply channel.

3. The electroplating device according to claim 2, characterized in that: The plurality of first spray holes form at least one row on the side wall along the height direction of the branch pipe, and the plurality of first spray holes in each row of the first spray holes are arranged in a row at intervals along the length direction of the branch pipe.

4. The electroplating device according to claim 3, characterized in that: At least one row of first injection holes respectively formed on the two side walls of each branch pipe correspond to each other in the height direction of the branch pipe, and the first injection holes at the same height on the two side walls of each branch pipe are staggered in the length direction of the branch pipe.

5. The electroplating device according to claim 3, characterized in that: The plurality of first injection holes form at least two rows on the side wall thereof along the height direction of the branch pipe, and two adjacent rows of first injection holes located on the same side wall of the branch pipe are staggered in the length direction of the branch pipe.

6. The electroplating device according to claim 3, characterized in that: The plurality of first injection holes are arranged on the first side wall and the second side wall, and the first injection holes on the opposite side walls of two adjacent branch pipes are arranged alternately.

7. The electroplating device according to claim 2, characterized in that: The membrane frame further comprises a membrane frame side wall, an intermediate retaining wall and an intermediate channel are arranged in the middle of the membrane frame, the intermediate retaining wall defines an intermediate channel extending in a vertical direction, each branch pipe has a first end and a second end, the first end of each branch pipe is connected to the intermediate retaining wall, and the second end of each branch pipe is connected to the membrane frame side wall; wherein, A first groove is disposed at the bottom of the first end of each branch pipe, and / or a second groove is disposed at the bottom of the second end of each branch pipe.

8. The electroplating device according to claim 7, characterized in that: The side wall of the membrane frame is arranged to form a cathode cavity, and the membrane frame further comprises an outer ring retaining wall, which is arranged around the first end and the second end of the plurality of branch pipes and is used to separate the cathode cavity into at least two independent cathode areas; wherein, A third groove is arranged at the bottom of the connection between each branch pipe and the outer ring retaining wall.

9. The electroplating device according to claim 7 or 8, characterized in that: A through hole is also provided in each branch pipe, and the through hole communicates with the liquid supply channel and at least one of the first groove, the second groove or the third groove.

10. The electroplating device according to claim 8, characterized in that: The membrane frame further comprises reinforcing ribs, wherein the reinforcing ribs are connected between the outer ring retaining wall and the side wall of the membrane frame; wherein, A fourth groove is arranged at the bottom of the reinforcing rib.

11. The electroplating device according to claim 1, characterized in that: The film frame also includes: A plurality of second spray holes are used to discharge cathode liquid, wherein the liquid discharge direction of the second spray holes forms a second predetermined angle with the vertical upward direction, and the first predetermined angle and the second predetermined angle are both acute angles.

12. The electroplating device according to claim 11, characterized in that: The first predetermined angle is the same as the second predetermined angle.

13. The electroplating device according to claim 11, characterized in that: The membrane frame includes a plurality of branch pipes, each of which includes a liquid supply channel for providing cathode liquid and two opposite side walls, the two side walls include a first side wall and a second side wall, the plurality of first injection holes and the plurality of second injection holes are arranged on the first side wall and / or the second side wall, the liquid supply channel extends along the length direction of the branch pipe, and the plurality of first injection holes and the plurality of second injection holes are both connected to the liquid supply channel.

14. The electroplating device according to claim 13, characterized in that: The multiple first injection holes and the multiple second injection holes are respectively formed in at least one row on the side wall along the height direction of the branch pipe, and the multiple first injection holes in each row of the first injection holes are arranged in a row along the length direction of the branch pipe, and the multiple second injection holes in each row of the second injection holes are arranged in a row along the length direction of the branch pipe.

15. The electroplating device according to claim 14, characterized in that: On the same cross section of the branch pipe, the first injection hole and the second injection hole respectively located on different side walls of the branch pipe are coaxial.

16. The electroplating device according to claim 14, characterized in that: At least one row of first injection holes respectively formed on the two side walls of each branch pipe corresponds to each other in the height direction of the branch pipe, and at least one row of second injection holes respectively formed on the two side walls of each branch pipe corresponds to each other in the height direction of the branch pipe; and, The first injection holes located at the same height on the two side walls of each branch pipe are staggered in the length direction of the branch pipe; The second injection holes located at the same height on the two side walls of each branch pipe are staggered in the length direction of the branch pipe.

17. The electroplating device according to claim 14, characterized in that: The plurality of first spray holes and the plurality of second spray holes are respectively formed in at least two rows on the side walls where the branch pipes are located along the height direction of the branch pipes; Two adjacent rows of first injection holes located on the same side wall of the branch pipe are staggered in the length direction of the branch pipe; Two adjacent rows of second injection holes located on the same side wall of the branch pipe are staggered in the length direction of the branch pipe.

18. The electroplating device according to claim 14, characterized in that: On the same side wall of the branch pipe, a row of first spray holes and a row of second spray holes adjacent to each other in the height direction of the branch pipe are alternately arranged in the length direction of the branch pipe.

19. The electroplating device according to claim 14, characterized in that: The plurality of second injection holes are arranged on the first side wall and the second side wall, and the second injection holes on the opposite side walls of two adjacent branch pipes are arranged alternately.

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