Suction pump type multi-parameter gas sensor

Abstract

The suction pump type multi-parameter gas sensor comprises a rain cover, a shell and a bottom plate, the rain cover is arranged on the upper portion of the shell, the bottom plate is arranged at the bottom of the shell, and an internal working cavity is defined by the rain cover, the shell and the bottom plate; the interior of the internal working cavity is divided into a top layer, a main board sealing layer and a probe detection layer from top to bottom; the probe detection layer is communicated with the outside and is provided with a plurality of gas sensor probes for detecting gas entering the probe detection layer; a snakelike pipeline and a PCB mainboard are arranged in the mainboard sealing layer, the snakelike pipeline is provided with an air pump, and the two ends of the snakelike pipeline are communicated with the probe detection layer and the probe detection layer respectively; the PCB mainboard is connected with the working chip; the working chip is electrically connected with the air pump and the gas sensor probe respectively; the top layer is communicated with the outside. According to the self-adaptive air-cooled heat dissipation gas sensor, multi-parameter detection of gas can be met, self-adaptive air-cooled heat dissipation can be achieved, and the problem that the gas sensor generates heat by itself is solved.

Description

Technical Field

[0001] The invention relates to the technical field of gas sensing, and in particular to a suction pump type multi-parameter gas sensor. Background Art

[0002] Gas sensors were born with the invention of integrated circuits. Their main function is to convert a certain gas into a corresponding electrical signal. With the development of chip technology, sensor technology is constantly innovating. The scope and accuracy of gas detection are increasing.

[0003] However, existing sensors still have shortcomings and defects. A large number of existing sensors have poor durability. In harsh environments (such as high temperature and high humidity), sensors are prone to aging, which affects their service life. Heat dissipation and protection of sensors are issues that need to be urgently addressed. Summary of the invention

[0004] In order to solve the deficiencies in the prior art, the present application proposes a suction pump type multi-parameter gas sensor, which can not only meet the requirements of multi-parameter gas detection, but also realize adaptive air cooling and heat dissipation, thus solving the problem of heat generation of the gas sensor itself.

[0005] The technical solution adopted by the present invention is as follows:

[0006] A suction pump type multi-parameter gas sensor comprises a rain cover, an outer shell and a bottom plate, wherein the rain cover is arranged on the upper part of the outer shell, and the bottom plate is arranged on the bottom of the outer shell, and an internal working cavity is surrounded by the rain cover, the outer shell and the bottom plate;

[0007] The internal working cavity is divided into a top layer, a mainboard sealing layer, and a probe detection layer from top to bottom;

[0008] The probe detection layer is connected to the outside world and a plurality of gas sensor probes are arranged in the probe detection layer to detect the gas entering the probe detection layer;

[0009] The mainboard sealing layer is provided with a serpentine pipeline and a PCB mainboard, the serpentine pipeline is equipped with an air pump, and the two ends of the serpentine pipeline are respectively connected to the probe detection layer and the probe detection layer; the PCB mainboard is connected to the working chip, and the working chip is respectively electrically connected to the air pump and the gas sensor probe;

[0010] The top layer is communicated with the outside.

[0011] Furthermore, a limit height layer is provided at the bottom of the probe detection layer.

[0012] Furthermore, a plurality of fixing pins are provided at the bottom of the rain cover or the bottom of the height-limiting height.

[0013] Furthermore, the PCB mainboard is also welded with a wireless network function module, the wireless network function module is electrically connected to the working chip, and information is transmitted to the outside through the wireless network function module.

[0014] Furthermore, a thermistor is welded near the working chip and the mobile power supply installation groove, and the thermistor is electrically connected to the working chip to detect the temperature information of the working chip and the power supply.

[0015] Furthermore, the air pump is electrically connected to the working chip, and the working chip controls the start and stop of the air pump according to the temperature detected by the thermistor to achieve adaptive heat dissipation.

[0016] Furthermore, heat-conducting plastic is filled between the serpentine pipe and the PCB mainboard, and multiple layers of heat-dissipating fins are arranged outside the serpentine pipe. The heat-dissipating fins are in contact with the heat-conducting plastic to achieve heat transfer between the PCB mainboard and the serpentine pipe.

[0017] Furthermore, the serpentine pipeline adopts a concentric ring structure, and microfluidic pipes are arranged between adjacent rings. During the ventilation process, the gas only flows through the microfluidic pipes.

[0018] Furthermore, air windows are arranged on the outer shell of the top layer and equipped with stainless steel wire mesh.

[0019] Furthermore, an air window is arranged on the outer shell of the probe detection layer and a filter is provided.

[0020] Beneficial effects of the present invention:

[0021] 1. The present invention can detect information on a variety of gases.

[0022] 2. The device has a simple structure, is suitable for outdoor work, and is not easily damaged.

[0023] 3. Taking the heat dissipation of the device into consideration, it can achieve adaptive air cooling and improve working stability.

[0024] 4. This device can effectively protect the internal structure of the sensor, reduce the erosion of external substances, and extend the service life of the sensor.

[0025] 5. By optimizing the packaging design, environmental interference can be reduced and the sensitivity and selectivity to the target gas can be improved.

[0026] 6. This device can reduce the interference of external signals and improve the performance of the sensor in complex environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The figure is an overall schematic diagram of a suction pump type multi-parameter gas sensor of the present invention.

[0028] Figure 2It is a longitudinal sectional stereoscopic view of the main structure of a suction pump type multi-parameter gas sensor of the present invention.

[0029] Figure 3 It is a longitudinal sectional plan view of the main structure of a suction pump type multi-parameter gas sensor of the present invention.

[0030] Figure 4 This is a left view of the main structure of a suction pump type multi-parameter gas sensor of the present invention.

[0031] Figure 5 This is a right view of the main structure of a suction pump type multi-parameter gas sensor of the present invention.

[0032] Figure 6 The figure is a schematic diagram of ventilation and heat dissipation of a suction pump type multi-parameter gas sensor of the present invention.

[0033] Figure 7 The figure is a schematic longitudinal cross-sectional view of a PCB mainboard of a suction pump type multi-parameter gas sensor according to the present invention.

[0034] Figure 8 The figure is a top view of a PCB mainboard of a suction pump type multi-parameter gas sensor of the present invention.

[0035] Fig. 9 The figure is a bottom view of a PCB mainboard of a suction pump type multi-parameter gas sensor according to the present invention.

[0036] Fig.10 The present invention is a schematic diagram of a serpentine pipeline structure of a suction pump type multi-parameter gas sensor.

[0037] Fig.11 This is a longitudinal cross-sectional view of a serpentine pipeline of a suction pump type multi-parameter gas sensor of the present invention.

[0038] Fig.12 The figure is a front view of a serpentine pipeline of a suction pump type multi-parameter gas sensor of the present invention.

[0039] Fig.13 This is an electrical connection diagram of a suction pump type multi-parameter gas sensor of the present invention.

[0040] In the figure, A, top layer, B, mainboard sealing layer, C, probe detection layer, D, limited high layer, 1, partition, 2, first support column group, 3, bottom plate, 4, filter, 5, sealing plate, 6, serpentine pipe, 7, wireless network function module, 8, thermal conductive plastic, 9, PCB mainboard, 9-1, first circuit layer, 9-2, heavy wiring layer, 9-3, second circuit layer, 10, plastic packaging material, 11, air duct, 12, shell, 13, rain cover, 14, fixed pin, 15, second support column group, 16, detection layer plastic shell, 17, exhaust pipe, 18, air pump, 19, gas sensor probe, 20, mobile power supply installation slot, 21, stainless steel wire mesh, 22, third support column group, 23, electronic components, 24, solder joints, 25, metal ball column, 26, thermistor, 27, working chip, 28, holes, 29, heat sink fins, 30, microfluidic pipeline. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0042] A suction pump type multi-parameter gas sensor, the structure of which is as follows Figure 1-12 As shown, it includes a rain cover 13, an outer shell 12 and a bottom plate 3. The rain cover 13 is arranged on the upper part of the outer shell 12. The lower part of the rain cover 13 is also connected to a plurality of fixed pins 14. The fixed pins 14 are arranged circumferentially around the outer shell 12. The bottom of the fixed pins 14 is a pointed end, which can be inserted into the soil to achieve fixed installation of the sensor. The bottom plate 3 is arranged at the bottom of the outer shell 12; the internal working cavity is surrounded by the rain cover 13, the outer shell 12 and the bottom plate 3. The internal working cavity is divided from top to bottom into a top layer A, a mainboard sealing layer B, and a probe detection layer C.

[0043] A sealing plate 5 is arranged above the bottom plate 3, and a probe detection layer C is formed between the bottom plate 3 and the sealing plate 5; the outer shell 12 at the probe detection layer C is not fully enclosed, so the air in the external environment can enter the probe detection layer C; a plurality of gas sensor probes 19 are arranged in the probe detection layer C, and the gas sensor probes 19 are used to detect the gas entering the probe detection layer C.

[0044] A mainboard sealing layer B is arranged above the probe detection layer C, and the mainboard sealing layer B includes a serpentine pipe 6, a PCB mainboard 9, an air pump 18, etc.; wherein the serpentine pipe 6 and the air pump 18 are laid above the sealing plate 5, the exhaust end of the serpentine pipe 6 is connected to the air guide pipe 11, the air inlet end of the serpentine pipe 6 is connected to the air outlet end of the air pump 18, the air inlet end of the air pump 18 is connected to the exhaust pipe 17, and the exhaust pipe 17 extends to the probe detection layer C. The PCB mainboard 9 is located above the serpentine pipe 6 and the air pump 18, and the space between the sealing plate 5 and the PCB mainboard 9 is filled with heat-conducting plastic 8. A plastic encapsulation material 10 is arranged above the PCB mainboard 9, and the PCB mainboard 9 is covered with the plastic encapsulation material 10 to seal and protect the electronic components and circuits on the PCB mainboard 9. The PCB mainboard 9 is connected to the gas sensor probe 19 signal, and the gas sensor probe 19 inputs the detected data into the PCB mainboard 9.

[0045] The top layer A is between the upper part of the mainboard sealing layer B and the rain cover 13. The housing 12 at the top layer A is not fully enclosed, so the air in the top layer A can be discharged to the external environment. Specifically, the air guide pipe 11 of the serpentine pipeline 6 extends through the mainboard sealing layer B to the top layer A, and then is discharged from the top layer A.

[0046] In this embodiment, combined with the attached Figure 7 , 8 A working chip 27 is welded on the top of the PCB main board 9, and multiple gas sensors 19 are welded on the bottom of the PCB main board 9. The gas sensors 19 are electrically connected to the working chip 27, and their detection results are input into the working chip 27.

[0047] A wireless network function module 7 is also welded on the bottom layer of the PCB main board 9 . The wireless network function module 7 is electrically connected to the working chip 27 . The wireless network function module 7 can be used for outward information transmission.

[0048] A thermistor 26 is welded near the working chip 27 and the mobile power supply installation slot 20 . The thermistor 26 is electrically connected to the working chip 27 , and can detect the temperature information of the working chip 27 and the power supply.

[0049] The air pump 18 is electrically connected to the working chip 27 , and the working start and stop of the air pump 18 is controlled by the working chip 27 .

[0050] Other components 23 may also be welded on the PCB main board 9 to achieve multiple functions.

[0051] In this embodiment, the device has an adaptive air cooling control effect. The thermistor 26 can transmit the temperature information of the working chip 27 and the mobile power installation slot 20 to the PCB mainboard 9. The PCB mainboard 9 determines whether to start the air pump 18 or how much power is needed to achieve the heat dissipation function based on the transmitted temperature information.

[0052] Combined with Figure 7 The electrical connection method between the working chip 27 and the PCB main board 9 and various components is introduced; the working chip 27 is connected to the second circuit layer 9-3, the redistribution circuit layer 9-2, the first circuit layer 9-1 and the solder joints 24 on the corresponding components on the PCB main board 9 in sequence through the metal ball column 25.

[0053] In this embodiment, a third support column group 22 is provided between the rain cover 13 and the plastic packaging material 10, and a second support column group 15 is provided between the sealing plate 5 and the bottom plate 3 for support.

[0054] In this embodiment, the thermal conductivity of the thermally conductive plastic 8 should be no less than 10 W / (mk).

[0055] In this embodiment, an air window is provided on the outer shell 12 of the probe detection layer C and a filter 4 is provided, and the inside of the probe detection layer C is connected with the external environment through the air window, and the filter 4 can filter dust and the like from the external air.

[0056] In this embodiment, an air window and a stainless steel wire mesh 21 are provided on the outer shell 12 of the top layer A, and the top layer A is connected to the external environment through the air window.

[0057] In this embodiment, multiple layers of heat dissipation fins 29 made of materials with strong thermal conductivity are distributed outside the serpentine pipe 6. The contact between the heat dissipation fins 29 and the thermal conductive plastic 8 can improve the heat transfer efficiency between the components on the PCB mainboard and the gas in the serpentine pipe 6. The serpentine pipe 6 adopts a concentric ring structure, and micro-fluidic pipes 30 are arranged between adjacent rings. During the ventilation process, the gas only flows through the micro-fluidic pipes 30, so as to increase the gas flow rate.

[0058] In this embodiment, a limit layer D is provided at the bottom of the probe detection layer C, and the limit layer D includes a first support column group 2 and a partition 1, wherein the partition 1 is located below the bottom plate 3, and the partition 1 and the bottom plate 3 are connected through the first support column group 2. Due to the existence of the limit layer D, during the sensor installation process, the partition 1 will contact the ground surface, and stopping the downward pressure at this time can prevent the probe detection layer from being too close to the ground, thereby preventing the soil surface water from flowing into the probe detection layer and affecting the normal operation of the probe.

[0059] In this embodiment, the height of the limit layer D can be adjusted by selecting an appropriate height of the first support column group 2 , such as the height of the limit layer D is between 10 and 15 cm.

[0060] In this embodiment, a plurality of holes 28 are provided on the partition plate 1 to allow the soil water flowing into the high limit layer to be discharged smoothly and to prevent the water flow from interfering with the detection layer of the probe.

[0061] In this embodiment, the serpentine pipe 6 adopts a U-shaped winding structure to increase the heat dissipation area, thereby improving the heat dissipation efficiency. In the gap between the pipes, other components such as sensors are placed to pass through longitudinally, thereby improving the heat dissipation efficiency.

[0062] In the present embodiment, the effect of the rain cover 13 is to stop rainwater from infiltrating the device body, mainly playing a rainproof effect. In addition, a layer of highly reflective material is coated on the shell of the rain cover 13 top and the device body, which can reflect most of the sunlight and help to prevent heat.

[0063] Combined with Fig.13 The functions of a suction pump type multi-parameter gas sensor designed by the present invention are introduced in detail:

[0064] Air parameter and internal temperature information collection function: This device is equipped with carbon dioxide concentration sensors, sulfur dioxide concentration sensors, ammonia concentration sensors, air temperature sensors, air humidity sensors, chip temperature sensors and power supply temperature sensors, etc., to realize the detection of various gas concentrations, humidity, and temperatures, as well as the detection of the temperature of each component inside the device.

[0065] Output processing and transmission function: The collected information is processed by using the PCB main board 9 and the working chip 27. The wireless network function module 7 is used to realize information interaction with the outside.

[0066] Adaptive air cooling system: By designing a serpentine pipe 6 and an air pump 18 in the mainboard sealing layer B, it is possible to determine whether to start the air pump 18 or how much power is needed to achieve the heat dissipation function based on the internal temperature.

[0067] The above embodiments are only used to illustrate the design ideas and features of the present invention, and their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. The protection scope of the present invention is not limited to the above embodiments. Therefore, any equivalent changes or modifications made based on the principles and design ideas disclosed by the present invention are within the protection scope of the present invention.

Claims

1. A suction pump type multi-parameter gas sensor, characterized in that: It comprises a rain cover (13), an outer shell (12) and a bottom plate (3), wherein the rain cover (13) is arranged on the upper part of the outer shell (12), and the bottom plate (3) is arranged on the bottom of the outer shell (12), and an internal working cavity is surrounded by the rain cover (13), the outer shell (12) and the bottom plate (3); The internal working cavity is divided into a top layer (A), a mainboard sealing layer (B), and a probe detection layer (C) from top to bottom; The probe detection layer (C) is connected to the outside world and a plurality of gas sensor probes (19) are arranged on the probe detection layer (C) to detect the gas entering the probe detection layer (C); The mainboard sealing layer (B) is provided with a serpentine pipeline (6) and a PCB mainboard (9); the serpentine pipeline (6) is equipped with an air pump (18); the two ends of the serpentine pipeline (6) are respectively connected to the probe detection layer (C) and the probe detection layer (C); the PCB mainboard (9) is connected to a working chip (27); the working chip (27) is respectively electrically connected to the air pump (18) and the gas sensor probe (19); The top layer (A) is in communication with the outside.

2. A suction pump type multi-parameter gas sensor according to claim 1, characterized in that: A limit layer (D) is provided at the bottom of the probe detection layer (C).

3. A suction pump type multi-parameter gas sensor according to claim 2, characterized in that: A plurality of fixing pins (14) are arranged at the bottom of the rain cover (13) or the bottom of the limit height D.

4. A suction pump type multi-parameter gas sensor according to claim 1, characterized in that: The PCB mainboard (9) is also welded with a wireless network function module (7), and the wireless network function module (7) is electrically connected to the working chip (27), and information is transmitted externally through the wireless network function module (7).

5. A suction pump type multi-parameter gas sensor according to claim 1, characterized in that: A thermistor (26) is welded near the working chip (27) and the mobile power supply installation groove (20); the thermistor (26) is electrically connected to the working chip (27) to detect temperature information of the working chip (27) and the power supply.

6. A suction pump type multi-parameter gas sensor according to claim 5, characterized in that: The air pump (18) is electrically connected to the working chip (27), and the working chip (27) controls the start and stop of the air pump (18) according to the temperature detected by the thermistor (26) to achieve adaptive heat dissipation.

7. The suction pump type multi-parameter gas sensor according to claim 1, characterized in that: A heat-conducting plastic (8) is filled between the serpentine pipe (6) and the PCB main board (9), and a plurality of heat-dissipating fins (29) are arranged outside the serpentine pipe (6). The heat-dissipating fins (29) are in contact with the heat-conducting plastic (8), thereby achieving heat transfer between the PCB main board (9) and the serpentine pipe (6).

8. The suction pump type multi-parameter gas sensor according to claim 1, characterized in that: The serpentine pipeline (6) adopts a concentric ring structure, and microfluidic pipelines (30) are arranged between adjacent rings. During the ventilation process, the gas only flows through the microfluidic pipelines (30).

9. The suction pump type multi-parameter gas sensor according to claim 1, characterized in that: The outer shell (12) of the top layer (A) is provided with air windows and equipped with a stainless steel wire mesh (21).

10. The suction pump type multi-parameter gas sensor according to claim 1, characterized in that: An air window is arranged on the outer shell (12) of the probe detection layer (C) and a filter (4) is provided.

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