Thermal excitation device and method for infrared thermal imaging detection of basin-type insulator
By adopting double-sided heating design and fast moving doors in the basin insulator infrared thermal imaging detection device, the problem of internal defect signals being submerged after thermal excitation of the basin insulator is solved, achieving more accurate and efficient detection.
Patent Information
- Application Number
- CN202411473057.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-02-14
AI Technical Summary
After thermal excitation of the basin insulator, the surface temperature rises rapidly, while the internal temperature rises slowly, resulting in the internal defect signal being flooded by surface noise, and it is difficult to take into account long-term preheating and rapid detection.
A basin insulator infrared thermal imaging detection thermal excitation device is designed, including a heating unit, an erecting unit and a thermal imager. The heating unit realizes uniform heating of the insulator on both sides by the opposite arrangement of the upper heating plate and the lower heating plate. The rapid movable door design allows rapid evacuation of the heating area.
The uniformity of the internal temperature distribution of the insulator is achieved, the accuracy and signal-to-noise ratio of detection are improved, and the problem of internal defective heat wave signals being flooded by surface noise is solved, and the optimal detection opportunity is seized, which improves the effectiveness of detection is improved. .
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Figure CN119438289A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of thermal excitation detection of pot-type insulators, in particular to a device and method for thermal excitation detection of pot-type insulators by infrared thermal imaging. Background Art
[0002] The pot insulator is mainly composed of a center insert, epoxy castings and metal flanges. The epoxy casting is the core module, which is cast by mixing epoxy resin, curing agent and filler. The surface heat absorption rate of epoxy castings is low and the thermal diffusivity is low. The pot insulator has a thick structure and the internal defects are deep, which requires high-power equipment or long-term heating to provide sufficient temperature rise to ensure the detection signal-to-noise ratio.
[0003] After thermal excitation, the surface temperature of the insulator rises rapidly, while the internal temperature rises more slowly. According to the principle of reflective infrared thermal imaging detection, the internal heat wave propagates from the surface to the defect and then reflects back to the surface, during which the heat wave energy gradually dissipates. In a short period of time, the surface temperature is much higher than the internal temperature, causing the internal defect signal to be submerged by the surface noise; after a long time, the temperature drops, the heat wave energy weakens, and it is also difficult to extract useful signals.
[0004] To solve this problem, a thermostat can be used to preheat the insulator for a long time so that the internal temperature rises evenly and reaches equilibrium. Then the insulator is taken out and installed on the detection equipment to collect the surface cooling curve data. At this time, the internal heat is transferred to the surface through heat conduction and radiated heat, and the surface temperature is always lower than the internal temperature, which improves the detection effect. However, it takes tens of seconds or even minutes to take the insulator out of the thermostat and install it on the detection rack. During this time, the surface temperature has begun to drop, and the best detection time has been lost, resulting in inaccurate detection results. Summary of the invention
[0005] In view of the above problems or problems existing in the prior art, the present invention is proposed.
[0006] Therefore, the purpose of the present invention is to provide a thermal excitation device for infrared thermal imaging detection of pot-type insulators, which can solve the problem of loss of detection opportunity due to the drop in surface temperature of the pot-type insulator during heating, and the contradiction between long-term preheating of the pot-type insulator and rapid detection.
[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a thermal excitation device for infrared thermal imaging detection of pot-type insulators, comprising an insulator, wherein the insulator is a pot-type insulator to be detected;
[0008] A heating unit, the heating unit comprising at least one heating layer, the heating layer being capable of heating the insulator, and comprising at least one movable door that can be opened and closed to facilitate rapid evacuation of the heating area;
[0009] A mounting unit, the mounting unit is used to fix and support the insulator and can keep the insulator stable during the heating process;
[0010] A thermal imager is used to collect infrared thermal imaging data of the insulator during the heating and cooling process.
[0011] As a preferred solution of the thermal excitation device for infrared thermal imaging detection of pot-type insulators of the present invention, wherein: the heating unit comprises an upper heating layer, a lower heating layer arranged at the bottom of the upper heating layer, a side plate arranged between the upper heating layer and the lower heating layer, and a movable door arranged at one side of the side plate;
[0012] Wherein, the side plate is provided with a placement slot for accommodating the erection unit;
[0013] The erection unit comprises a placement rack which can be slidably arranged inside the placement groove, a vertical column arranged outside the placement rack, and a base arranged at the bottom of the vertical column.
[0014] As a preferred solution of the thermal excitation device for infrared thermal imaging detection of pot-type insulators of the present invention, wherein: the upper heating layer comprises an upper insulation cover at the upper end, and an upper heating plate arranged on the inner side of the upper insulation cover;
[0015] The thermal insulation upper cover has heat insulation performance; the upper heating plate can evenly heat the top surface of the insulator.
[0016] As a preferred solution of the thermal excitation device for infrared thermal imaging detection of pot-type insulators of the present invention, wherein: the lower heating layer comprises a lower insulation cover at the lower end, and a lower heating plate arranged on the inner side of the lower insulation cover;
[0017] And the thermal insulation lower cover also has good thermal insulation performance;
[0018] The lower heating plate is capable of uniformly heating the bottom surface of the insulator.
[0019] As a preferred solution of the infrared thermal imaging detection thermal excitation device for pot-type insulators described in the present invention, the upper heating plate and the lower heating plate are arranged opposite to each other, so that the insulator can receive uniform heat input on both sides at the same time, thereby achieving a comprehensive heating effect.
[0020] As a preferred solution of the thermal excitation method for infrared thermal imaging detection of pot-type insulators described in the present invention, the movable door is hinged to the thermal insulation cover through a hinge to facilitate rapid opening or closing, thereby ensuring rapid temperature changes during the test.
[0021] As a preferred solution of the infrared thermal imaging detection thermal excitation device for pot-type insulators of the present invention, wherein: the placement rack is horizontally installed inside the vertical column;
[0022] And it is capable of supporting the insulator in a horizontal direction.
[0023] As a preferred solution of the thermal excitation device for infrared thermal imaging detection of pot-type insulators of the present invention, wherein: the placement frame is vertically connected to the vertical column by plugging;
[0024] The placement rack and the vertical columns are symmetrically arranged.
[0025] Beneficial effects of the present invention: The device ensures that the insulator receives uniform heat input on both sides at the same time through the relative arrangement of the upper heating plate and the lower heating plate, thereby achieving a comprehensive heating effect. This double-sided heating design makes the temperature distribution of the insulator more uniform throughout the volume, improves the accuracy of detection and the signal-to-noise ratio, and solves the problem that the internal defect thermal wave signal is submerged by the surface background noise. It is also possible to quickly evacuate the heating area after the heating is completed, reducing the time interval for the temperature to drop, thereby seizing the best detection opportunity and solving the problem of losing the best detection opportunity due to the drop in surface temperature. After evacuating the heating area, the thermal imager is immediately used to collect infrared thermal imaging data during the cooling process of the insulator surface, ensuring that data collection is completed before the surface temperature begins to drop, thereby improving the effectiveness of the detection. The design of the device fully considers multiple aspects such as uniform heating, rapid response, stability and high-sensitivity detection, greatly improving the effect of internal defect detection of pot-type insulators and ensuring the accuracy and reliability of the detection results.
[0026] To solve the above technical problems, the present invention also provides the following technical solutions: a thermal excitation method for infrared thermal imaging detection of pot-type insulators, comprising installing the preheated insulator on a mounting unit;
[0027] The heating unit heats the insulator so that the insulator reaches a predetermined temperature and maintains a thermal equilibrium state;
[0028] Quickly open the movable door and evacuate the heating area quickly;
[0029] Immediately collect infrared thermal imaging data of the insulator surface during the cooling process through a thermal imager;
[0030] Analyze the acquired infrared thermographic data to identify defects inside the insulator.
[0031] As a preferred solution of the thermal excitation method for infrared thermal imaging detection of pot-type insulators of the present invention, wherein: during the heating process, the heating temperature and time of the heating unit are regulated by the control unit to ensure that the insulator is heated evenly;
[0032] After leaving the heating area, the thermal imager immediately starts to collect temperature change data on the insulator surface in order to analyze the internal defects of the insulator;
[0033] Through the collaborative work of the thermal imager and the control unit, the data obtained from the insulator surface is processed and analyzed in real time to achieve accurate positioning and evaluation of internal defects in the insulator. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0035] Figure 1 It is a side cross-sectional view of the thermal excitation device for infrared thermal imaging detection of pot-type insulators of the present invention.
[0036] Figure 2 It is a front cross-sectional view of the thermal excitation device for infrared thermal imaging detection of pot-type insulators of the present invention.
[0037] Figure 3 The figure is a schematic diagram of the use of the infrared thermal imaging detection device for insulators of the present invention.
[0038] Figure 4 The figure is a flow chart of the infrared thermal imaging detection method for insulators of the present invention. DETAILED DESCRIPTION
[0039] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.
[0040] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0041] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.
[0042] Example 1, reference Figure 1 to Figure 3, which is the first embodiment of the present invention, and provides a thermal excitation device for infrared thermal imaging detection of a pot-type insulator, comprising an insulator 100, where the insulator 100 is a pot-type insulator to be detected;
[0043] A heating unit 200, the heating unit 200 includes at least one heating layer, the heating layer can heat the insulator 100, and includes at least one openable and closable movable door to facilitate rapid evacuation of the heating area;
[0044] A mounting unit 300, which is used to fix and support the insulator 100 and can keep the insulator 100 stable during the heating process;
[0045] The thermal imager 400 is used to collect infrared thermal imaging data of the insulator 100 during the heating and cooling processes.
[0046] It should be noted that the insulator 100 is a pot-type insulator to be tested, which is usually composed of three parts: a center insert, an epoxy casting, and a metal flange. The epoxy casting is a core module, which is cast by mixing epoxy resin, a curing agent, and a filler. Its characteristics: the epoxy casting surface of the pot-type insulator has a low heat absorption rate, a low thermal diffusivity, and a thick structure. Some internal defects are located in a deeper position, requiring high-power equipment or long-term excitation to provide sufficient temperature rise to ensure the detection signal-to-noise ratio.
[0047] Preferably, the heating unit 200 includes at least one heating layer, which can evenly heat the insulator 100, and includes at least one openable and closable movable door to facilitate rapid evacuation of the heating area.
[0048] Preferably, the heating layer can be in various forms, such as an electric heating plate, a resistance wire or other types of heat sources. The design of the heating layer should ensure that the insulator 100 can be heated evenly to avoid local overheating or cold areas.
[0049] Preferably, the movable door can be opened and closed by mechanical or electronic means. The opening and closing speed of the movable door should be considered during design to ensure that the heating area can be evacuated quickly after the heating is completed, thereby reducing the time interval for the temperature to drop.
[0050] Preferably, the mounting unit 300 is used to fix and support the insulator 100 and can keep the insulator 100 stable during the heating process.
[0051] Preferably, the mounting unit 300 may include various forms of brackets, clamps or other fixing devices. These devices should have sufficient rigidity and stability to ensure that the insulator 100 does not move or tilt during the heating and cooling process.
[0052] Preferably, the thermal imager 400 is used to collect infrared thermal imaging data of the insulator 100 during the heating and cooling process. The thermal imager 400 is equipped with a high-sensitivity detector, which can record and process the temperature change data obtained from the surface of the insulator in real time.
[0053] Preferably, the thermal imager 400 can be connected to a control system to achieve real-time monitoring and analysis of data. Through image processing and model calculation, structural property information inside the insulator 100, such as defects, cracks, and coating thickness, can be extracted from the collected data.
[0054] In summary, the device preheats the insulator for a long time through the thermostat mechanism of the heating unit 200, so that the internal temperature of the insulator increases and reaches a balanced state. This helps to ensure that the thermal wave signal of the internal defect can be captured more clearly by the thermal imager during the inspection process. And at least one movable door that can be opened and closed can quickly evacuate the heating area after the heating is completed, without the need to install the heated insulator on the inspection table again. This rapid response mechanism ensures that data collection of the cooling process starts immediately before the surface temperature of the insulator begins to drop.
[0055] Example 2, reference Figure 1 to Figure 3 , which is the second embodiment of the present invention, and is different from the first embodiment in that: it comprises a heating unit 200 including an upper heating layer 201, a lower heating layer 202 arranged at the bottom of the upper heating layer 201, a side plate 203 arranged between the upper heating layer 201 and the lower heating layer 202, and a movable door 204 arranged at one side of the side plate 203;
[0056] The side plate 203 is provided with a placement slot 203a for accommodating the mounting unit 300;
[0057] The mounting unit 300 includes a mounting frame 301 that can be slidably disposed inside the mounting groove 203 a , a vertical column 302 disposed outside the mounting frame 301 , and a base 303 disposed at the bottom of the vertical column 302 .
[0058] Furthermore, the upper heating layer 201 includes an upper heat-insulating cover 201a at the upper end, and an upper heating plate 201b disposed inside the upper heat-insulating cover 201a;
[0059] The thermal insulation upper cover 201a has heat insulation performance; the upper heating plate 201b can evenly heat the top surface of the insulator 100.
[0060] Further, the lower heating layer 202 includes a heat-insulating lower cover 202a at the lower end, and a lower heating plate 202b disposed inside the heat-insulating lower cover 202a;
[0061] The thermal insulation lower cover 202a also has good thermal insulation performance;
[0062] The lower heating plate 202 b can uniformly heat the bottom surface of the insulator 100 .
[0063] Furthermore, the upper heating plate 201b and the lower heating plate 202b are arranged opposite to each other, so that the insulator 100 can receive uniform heat input on both sides at the same time, thereby achieving a comprehensive heating effect.
[0064] Furthermore, the movable door 204 is hinged to the heat-insulating upper cover 201a via a hinge Y to facilitate rapid opening or closing, thereby ensuring rapid temperature changes during the test.
[0065] Further, the placement rack 301 is horizontally installed inside the vertical column 302;
[0066] And it is capable of supporting the insulator 100 in the horizontal direction.
[0067] Furthermore, the placement rack 301 is vertically connected to the vertical column 302 by plugging;
[0068] The placement rack 301 and the vertical columns 302 are symmetrically arranged.
[0069] It should be noted that the heating unit 200 includes an upper heating layer 201, a lower heating layer 202, a side plate 203 and a movable door 204. The upper heating layer 201 is located at the top of the device and is composed of an insulation upper cover 201a and an upper heating plate 201b. The upper heating plate 201b is arranged on the inner side of the insulation upper cover 201a, and the heat released by the upper heating plate 201b can directly contact the top surface of the insulator 100.
[0070] Preferably, the lower heating layer 202 is located at the bottom of the upper heating layer 201, and is also composed of a thermal insulation lower cover 202a and a lower heating plate 202b. The thermal insulation lower cover 202a also has good thermal insulation properties to prevent heat from dissipating downward. The lower heating plate 202b is fixedly arranged on the inner side of the thermal insulation lower cover 202a, and the heat released by it can directly contact the bottom surface of the insulator 100. The upper heating plate 201b and the lower heating plate 202b are arranged opposite to each other, so that the insulator 100 can receive uniform heat input on both sides at the same time, thereby achieving a comprehensive heating effect. This double-sided heating design ensures that the temperature distribution of the insulator 100 in the entire volume is more uniform, thereby improving the accuracy of detection.
[0071] Preferably, the upper heating plate 201b and the lower heating plate 202b can be made of materials with high thermal conductivity, such as copper or aluminum, to improve the efficiency of heat conduction. The heating plate can be an electric heating plate or a resistance wire, and a suitable heating method can be selected according to actual needs. The thermal insulation upper cover 201a and the thermal insulation lower cover 202a can be made of multi-layer composite materials, such as a combination of ceramic fiber and glass fiber, to improve thermal insulation performance, ensure that heat is concentrated on the insulator 100, and reduce heat loss.
[0072] Preferably, the side plate 203 is fixedly arranged on the side of the upper heating layer 201 and the lower heating layer 202 to play a supporting and isolating role. The side plate 203 is provided with a placement groove 203a for accommodating the mounting unit 300. The design of the placement groove 203a allows the mounting unit 300 to slide in and out conveniently, making it easy to install and remove the insulator 100.
[0073] Preferably, the movable door 204 is also fixedly arranged on one side of the side plate 203 and is hinged to the heat preservation cover 201a through a hinge Y. This ensures that the heating area can be quickly evacuated after the heating is completed, and the time interval for temperature drop is reduced, so as to seize the best detection opportunity.
[0074] Preferably, the mounting unit 300 includes a placement frame 301, a vertical column 302 and a base 303. The placement frame 301 is horizontally installed inside the vertical column 302 and can support the insulator 100 in the horizontal direction. The placement frame 301 is vertically connected to the vertical column 302 by plugging, and this connection method is convenient for disassembly and adjustment. The placement frame 301 and the vertical column 302 are symmetrically arranged to ensure the balance and structural stability of the entire device.
[0075] Preferably, the placement rack 301 can be designed to be adjustable in height and angle to accommodate insulators 100 of different sizes and shapes, thereby increasing the flexibility and applicability of the device.
[0076] Preferably, the thermal imager 400 is used to collect infrared thermal imaging data of the insulator 100 during the heating and cooling process. The thermal imager 400 is equipped with a high-sensitivity detector, which can record and process the temperature change data obtained from the surface of the insulator in real time. Through the connection with the control system, real-time monitoring and analysis of the data are achieved, thereby providing more comprehensive and detailed test results. The high-sensitivity detector of the thermal imager 400 can capture subtle temperature changes, thereby identifying the location and nature of internal defects, and improving the resolution and accuracy of the test.
[0077] Method of use: install the insulator 100 on the mounting unit 300 to ensure that it is correctly positioned and stable. Then use the heating unit 200 to heat the insulator 100 to reach a predetermined temperature and maintain a thermal equilibrium state. The design of the heating layer should ensure uniform heating to avoid local overheating or cold areas. When the insulator 100 reaches a predetermined temperature, quickly open the movable door 204 of the heating unit 200 and quickly evacuate the heating area. The rapid opening and closing design of the movable door 204 ensures the efficiency of the evacuation process and reduces the time interval for temperature drop. After evacuating the heating area, immediately use the thermal imager 400 to collect infrared thermal imaging data during the cooling process of the surface of the insulator 100. The thermal imager 400 records and processes data in real time to analyze the defects inside the insulator 100. The high-sensitivity detector of the thermal imager 400 can capture subtle temperature changes, thereby identifying the location and nature of internal defects.
[0078] In summary, the device ensures that the insulator 100 receives uniform heat input on both sides at the same time through the relative arrangement of the upper heating plate 201b and the lower heating plate 202b, thereby achieving a comprehensive heating effect. This double-sided heating design makes the temperature distribution of the insulator 100 more uniform throughout the volume, improves the accuracy and signal-to-noise ratio of detection, and solves the problem that the internal defect thermal wave signal is submerged by the surface background noise. It can also quickly evacuate the heating area after the heating is completed, reduce the time interval for the temperature to drop, thereby seizing the best detection opportunity and solving the problem of losing the best detection opportunity due to the drop in surface temperature. After evacuating the heating area, the thermal imager 400 is immediately used to collect infrared thermal imaging data during the cooling process of the surface of the insulator 100, ensuring that data collection is completed before the surface temperature begins to drop, thereby improving the effectiveness of the detection. The design of the device fully considers multiple aspects such as uniform heating, rapid response, stability and high-sensitivity detection, greatly improving the effect of internal defect detection of pot-type insulators, and ensuring the accuracy and reliability of the detection results.
[0079] Embodiment 3 is the third embodiment of the present invention, which is different from the first two embodiments in that it also includes a thermal excitation method for infrared thermal imaging detection of pot-type insulators, specifically:
[0080] Installing the preheated insulator 100 onto the mounting unit 300;
[0081] The heating unit 200 heats the insulator 100 so that the insulator 100 reaches a predetermined temperature and maintains a thermal equilibrium state;
[0082] Quickly open the movable door 204 and quickly evacuate the heating area;
[0083] Immediately collect infrared thermal imaging data of the insulator 100 surface during the temperature reduction process by using the thermal imager 400;
[0084] The collected infrared thermal imaging data is analyzed to identify defects inside the insulator 100 .
[0085] Furthermore, during the heating process, the heating temperature and time of the heating unit 200 are regulated by the control unit to ensure that the insulator 100 is heated evenly;
[0086] After leaving the heating area, the thermal imager 400 immediately starts to collect temperature change data on the surface of the insulator 100 in order to analyze internal defects of the insulator;
[0087] Through the coordinated work of the thermal imager 400 and the control unit, the data obtained from the surface of the insulator 100 is processed and analyzed in real time, thereby achieving accurate positioning and evaluation of internal defects of the insulator.
[0088] It is important to note that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.
Claims
1. A thermal excitation device for infrared thermal imaging detection of pot-type insulators, characterized in that: include, An insulator (100), wherein the insulator (100) is a pot-type insulator to be tested; A heating unit (200), the heating unit (200) comprising at least one heating layer, the heating layer being capable of heating the insulator (100), and comprising at least one openable and closable movable door for facilitating rapid evacuation of the heating area; A mounting unit (300), the mounting unit (300) being used to fix and support the insulator (100) and capable of keeping the insulator (100) stable during a heating process; A thermal imager (400) is used to collect infrared thermal imaging data of an insulator (100) during a heating and cooling process.
2. The thermal excitation device for infrared thermal imaging detection of pot-type insulators according to claim 1, characterized in that: The heating unit (200) comprises an upper heating layer (201), a lower heating layer (202) arranged at the bottom of the upper heating layer (201), a side plate (203) arranged between the upper heating layer (201) and the lower heating layer (202), and a movable door (204) arranged at one side of the side plate (203); Wherein, the side plate (203) is provided with a placement groove (203a) for accommodating the mounting unit (300); The mounting unit (300) comprises a mounting frame (301) that can be slidably mounted inside the mounting groove (203a), a vertical column (302) disposed outside the mounting frame (301), and a base (303) disposed at the bottom of the vertical column (302).
3. The thermal excitation device for infrared thermal imaging detection of pot-type insulators according to claim 2, characterized in that: The upper heating layer (201) comprises a heat-insulating upper cover (201a) at the upper end, and an upper heating plate (201b) arranged on the inner side of the heat-insulating upper cover (201a); Furthermore, the thermal insulation upper cover (201a) has heat insulation performance; and the upper heating plate (201b) can evenly heat the top surface of the insulator (100).
4. The thermal excitation device for infrared thermal imaging detection of pot-type insulators according to claim 3, characterized in that: The lower heating layer (202) comprises a heat-insulating lower cover (202a) at the lower end, and a lower heating plate (202b) arranged on the inner side of the heat-insulating lower cover (202a); Furthermore, the heat-insulating lower cover (202a) also has good heat-insulating performance; The lower heating plate (202b) is capable of uniformly heating the bottom surface of the insulator (100).
5. The thermal excitation device for infrared thermal imaging detection of pot-type insulators according to claim 4, characterized in that: The upper heating plate (201b) and the lower heating plate (202b) are arranged opposite to each other, so that the insulator (100) can receive uniform heat input on both sides at the same time, thereby achieving a comprehensive heating effect.
6. The thermal excitation device for infrared thermal imaging detection of pot-type insulators according to claim 5, characterized in that: The movable door (204) is hinged to the heat-insulating upper cover (201a) via a hinge (Y) so as to be quickly opened or closed, thereby ensuring a rapid change in temperature during the test process.
7. The thermal excitation device for infrared thermal imaging detection of pot-type insulators according to claim 6, characterized in that: The placement rack (301) is horizontally installed inside the vertical column (302); And it is capable of supporting the insulator (100) in a horizontal direction.
8. The thermal excitation device for infrared thermal imaging detection of pot-type insulators according to claim 7, characterized in that: The placement rack (301) is vertically connected to the vertical column (302) by plugging; The placement rack (301) and the vertical pillar (302) are symmetrically arranged.
9. A thermal excitation method for infrared thermal imaging detection of pot-type insulators, characterized in that: The invention comprises the thermal excitation device for infrared thermal imaging detection of pot-type insulators as claimed in any one of claims 1 to 8, and further comprises the following steps: installing the preheated insulator (100) onto the erection unit (300); The heating unit (200) heats the insulator (100) so that the insulator (100) reaches a predetermined temperature and maintains a thermal equilibrium state; Quickly open the movable door (204) and quickly evacuate the heating area; Immediately collecting infrared thermal imaging data of the insulator (100) surface during the temperature reduction process by means of a thermal imager (400); The collected infrared thermal imaging data is analyzed to identify defects inside the insulator (100).
10. The method for thermal excitation of infrared thermal imaging detection of pot-type insulators according to claim 9, characterized in that ; During the heating process, the heating temperature and time of the heating unit (200) are regulated by the control unit to ensure that the insulator (100) is heated evenly; After leaving the heating area, the thermal imager (400) immediately starts collecting temperature change data on the surface of the insulator (100) so as to analyze internal defects of the insulator; Through the coordinated work of the thermal imager (400) and the control unit, data acquired from the surface of the insulator (100) is processed and analyzed in real time, thereby achieving accurate positioning and evaluation of internal defects of the insulator.