Light velocity chip cooling system

Abstract

The invention provides a light velocity chip cooling system, and relates to the field of chip cooling. The light speed chip cooling system comprises a base, an upper shell is arranged above the base, a lower shell is arranged below the base, diffusers are arranged at the left end of the upper shell and the left end of the lower shell, collectors are arranged at the right end of the upper shell and the right end of the lower shell, an air inlet structure used for conducting air cooling heat dissipation on a chip is arranged at the left end of the base, and an air outlet structure used for conducting air cooling heat dissipation on the chip is arranged at the right end of the base. The right end of the base is provided with an air outlet structure used for conducting air cooling heat dissipation on the chip, and the upper side and the lower side of the base are provided with liquid cooling structures used for conducting liquid cooling heat dissipation on the chip. According to the light speed chip cooling system, the chip is placed in the base, the chip can be covered and sealed through the upper shell and the lower shell, then air cooling heat dissipation can be conducted on the chip through the air inlet structure and the air outlet structure, liquid cooling heat dissipation can be conducted on the chip through the liquid cooling structure, and therefore the heat dissipation effect on the chip can be improved.

Description

Technical Field

[0001] The invention relates to the field of chip cooling, and in particular to a light-speed chip cooling system. Background Art

[0002] Lightspeed chips refer to chips that use light as an information carrier. Such chips have the advantages of fast speed, low latency, and low power consumption in information transmission and processing. The chip generates heat when working. If the heat generated by the chip is not dissipated in time, the performance of the chip may be affected.

[0003] Patent application number CN202311527271.8 discloses a cooling structure for a chip, including a housing, a heat sink and a cooling plate. The chip is located in the housing, a cooling channel is provided in the cooling plate, the heat sink includes a heat sink rubber block and a heat sink gasket, the heat sink rubber block contacts the chip and the housing at the same time, and the heat sink gasket contacts the cooling plate and the housing at the same time;

[0004] When the above patented structure is in use, the heat dissipation of the chip is mainly achieved from both sides through the heat sink and the cooling plate. However, the heat dissipation of the chip through the heat sink is relatively passive and cannot actively and quickly dissipate the heat generated by the chip. At the same time, the chip is only liquid-cooled on one side through the cooling plate, resulting in low heat dissipation efficiency, making it inconvenient to use air cooling and liquid cooling in combination to efficiently dissipate the chip at the same time. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies of the prior art, the present invention provides a light-speed chip cooling system, which solves the problem that it is inconvenient to use air cooling and liquid cooling together to efficiently dissipate the heat of the chip.

[0007] (II) Technical solution

[0008] In order to achieve the above purpose of facilitating the coordinated use of air cooling and liquid cooling to efficiently dissipate heat for the chip when dissipating heat for the chip, the present invention is implemented through the following technical solutions: a light speed chip cooling system, comprising a base, an upper shell is arranged above the base, a lower shell is arranged below the base, a diffuser is arranged at the left end of the upper shell and the lower shell, a collector is arranged at the right end of the upper shell and the lower shell, an air inlet structure for air cooling and heat dissipation of the chip is arranged at the left end of the base, an air outlet structure for air cooling and heat dissipation of the chip is arranged at the right end of the base, and liquid cooling structures for liquid cooling and heat dissipation of the chip are arranged on the upper and lower sides of the base;

[0009] The base includes a mounting slot and a chip body, wherein the mounting slot is provided on a side of the base, and the chip body is movably connected to the inside of the mounting slot;

[0010] An upper slot is provided above the diffuser, a lower slot is provided below the diffuser, an air inlet pipe is installed on the diffuser, and an air outlet pipe is installed on the collector.

[0011] Preferably, the air inlet structure includes an upper air inlet channel, a lower air inlet channel and an upper air cooling channel, the upper air inlet channel is opened on the upper surface of the left end of the base, the lower air inlet channel is opened on the lower surface of the left end of the base, and the upper air cooling channel is opened in the middle of the upper surface of the base.

[0012] Preferably, the inner bottom surface of the upper air inlet channel and the inner top surface of the lower air inlet channel are both arc-shaped, the diffuser is installed and fixed at the left end of the base, the diffuser is connected to the upper air inlet channel and the lower air inlet channel, and the upper shell is installed and fixedly connected to the top of the diffuser and the collector through an upper slot.

[0013] Preferably, the upper air-cooling channel is connected to the mounting slot, and the upper surface of the chip body is exposed inside the upper air-cooling channel.

[0014] Preferably, the air outlet structure includes an upper air outlet channel, a lower air outlet channel and a lower air cooling channel, the upper air outlet channel is opened on the upper surface of the right end of the base, the lower air outlet channel is opened on the lower surface of the right end of the base, and the lower air cooling channel is opened in the middle of the lower surface of the base.

[0015] Preferably, the inner bottom surface of the upper air outlet channel and the inner top surface of the lower air outlet channel are both arc-shaped, the collector is installed and fixed at the right end of the base, the collector is connected to the upper air outlet channel and the lower air outlet channel, and the lower shell is installed and fixedly connected to the bottom of the diffuser and collector through a lower slot.

[0016] Preferably, the lower air-cooling channel is connected to the mounting slot, and the lower surface of the chip body is exposed inside the lower air-cooling channel.

[0017] Preferably, the upper air inlet channel and the lower air inlet channel, the upper air outlet channel and the lower air outlet channel, and the upper air cooling channel and the lower air cooling channel are staggered one above the other, the two ends of the upper air cooling channel are connected with the upper air inlet channel and the upper air outlet channel on both sides thereof, the two ends of the lower air cooling channel are connected with the lower air inlet channel and the lower air outlet channel on both sides thereof, the upper shell is sealedly connected with the ports of the upper air inlet channel, the upper air outlet channel and the upper air cooling channel, and the lower shell is sealedly connected with the ports of the lower air inlet channel, the lower air outlet channel and the lower air cooling channel.

[0018] Preferably, the liquid cooling structure includes a snake-shaped upper cooling plate and a lower cooling plate, the upper cooling plate is installed and fixed on the top end of the lower air inlet channel and the lower air outlet channel, the lower cooling plate is installed and fixed on the bottom end of the upper air inlet channel and the upper air outlet channel, the gap between the upper cooling plates forms an upper air cooling channel, and the gap between the lower cooling plates forms a lower air cooling channel.

[0019] Preferably, an upper liquid inlet pipe and an upper liquid outlet pipe are respectively installed and fixed at both ends of the inlet and outlet of the upper cooling plate, and a lower liquid inlet pipe and a lower liquid outlet pipe are respectively installed and fixed at both ends of the inlet and outlet of the lower cooling plate, and a snake-shaped cooling cavity is opened inside the upper cooling plate and the lower cooling plate.

[0020] (III) Beneficial effects

[0021] The present invention provides a light-speed chip cooling system, which has the following beneficial effects:

[0022] 1. The air volume can be dispersed to each port of the upper air inlet channel and the lower air inlet channel through the diffuser. The wind at the upper air inlet channel port can pass through the upper air cooling channel and then be discharged from the upper air outlet channel. The wind at the lower air inlet channel port can pass through the lower air cooling channel and then be discharged from the lower air outlet channel. When the wind passes through the upper air cooling channel, the upper surface of the chip body can be cooled and dissipated. When the wind passes through the lower air cooling channel, the lower surface of the chip body can be cooled and dissipated, so that the chip body can be quickly cooled and dissipated from both sides.

[0023] 2. The coolant inside the external liquid cooling circulation system can enter the upper cooling plate through the upper liquid inlet pipe, and then flow out to the external liquid cooling circulation system through the upper liquid outlet pipe. The coolant inside the external liquid cooling circulation system can enter the lower cooling plate through the lower liquid inlet pipe, and then flow out to the external liquid cooling circulation system through the lower liquid outlet pipe. During the flow of the coolant inside the cooling cavity, the upper and lower sides of the chip body can be liquid-cooled and dissipated at the same time, so as to cooperate with air cooling to cool and dissipate the chip body, thereby improving the cooling and heat dissipation effect of the chip body.

[0024] 3. After the diffuser diffuses the wind, it can enter the ports of the upper air inlet channel and the lower air inlet channel. The wind at the upper air inlet channel port can be guided by the internal arc surface and then blown to the upper shell and then enter the upper air cooling channel, which can cool and dissipate the surface of the upper shell. The wind at the lower air inlet channel port can be guided by the internal arc surface and blown to the lower shell, which can cool and dissipate the surface of the lower shell, thereby avoiding overheating of the upper shell and the lower shell themselves and affecting the heat dissipation effect of the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the present invention;

[0026] Figure 2 It is an exploded view of the structural base, upper shell and lower shell of the present invention;

[0027] Figure 3 It is a schematic diagram of the structural diffuser of the present invention;

[0028] Figure 4 It is a schematic diagram of the structure collector of the present invention;

[0029] Figure 5 This is a diagram of the upper cooling plate and the lower cooling plate of the structure of the present invention;

[0030] Figure 6 It is a schematic diagram of the structural base of the present invention;

[0031] Figure 7 It is a schematic diagram of the cooling cavity structure of the present invention.

[0032] Among them, 1. base; 11. mounting slot; 12. chip body; 2. upper shell; 21. upper card slot; 3. lower shell; 31. lower card slot; 4. diffuser; 41. air inlet pipe; 5. collector; 51. air outlet pipe; 6. air inlet structure; 61. upper air inlet channel; 62. lower air inlet channel; 63. upper air cooling channel; 7. air outlet structure; 71. upper air outlet channel; 72. lower air outlet channel; 73. lower air cooling channel; 8. liquid cooling structure; 81. upper cooling plate; 811. upper liquid inlet pipe; 812. upper liquid outlet pipe; 82. lower cooling plate; 821. lower liquid inlet pipe; 822. lower liquid outlet pipe; 83. cooling cavity. DETAILED DESCRIPTION

[0033] The present invention is further described below in conjunction with the accompanying drawings and embodiments. In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] See also Figure 1-Figure 7 The present invention provides a technical solution: a light speed chip cooling system, comprising a base 1, an upper shell 2 is arranged above the base 1, a lower shell 3 is arranged below the base 1, a diffuser 4 is arranged at the left end of the upper shell 2 and the lower shell 3, a collector 5 is arranged at the right end of the upper shell 2 and the lower shell 3, an air inlet structure 6 for air cooling and heat dissipation of the chip is arranged at the left end of the base 1, an air outlet structure 7 for air cooling and heat dissipation of the chip is arranged at the right end of the base 1, and a liquid cooling structure 8 for liquid cooling and heat dissipation of the chip is arranged on the upper and lower sides of the base 1;

[0035] The base 1 includes a mounting slot 11 and a chip body 12. The mounting slot 11 is provided on a side of the base 1, and the chip body 12 is movably connected to the inside of the mounting slot 11.

[0036] An upper card slot 21 is provided above the diffuser 4, a lower card slot 31 is provided below the diffuser 4, an air inlet pipe 41 is installed on the diffuser 4, and an air outlet pipe 51 is installed on the collector 5. By connecting the external air cooling system with the air inlet pipe 41, and by connecting the two ends of the upper liquid inlet pipe 811 and the upper liquid outlet pipe 812, as well as the two ends of the lower liquid inlet pipe 821 and the lower liquid outlet pipe 822 to the external liquid cooling circulation system, the external air volume and coolant can pass through the surface of the chip body 12, so that the chip body 12 can be cooled and dissipated by both air cooling and liquid cooling.

[0037] In this embodiment, the air inlet structure 6 includes an upper air inlet channel 61, a lower air inlet channel 62 and an upper air cooling channel 63. The upper air inlet channel 61 is opened on the upper surface of the left end of the base 1, the lower air inlet channel 62 is opened on the lower surface of the left end of the base 1, and the upper air cooling channel 63 is opened in the middle of the upper surface of the base 1.

[0038] For details, please refer to the attached manual. Figure 2 , Instruction Manual Figure 3 And the instruction manual Figure 6 As shown, after the upper shell 2 and the lower shell 3 are installed and fixed at the upper and lower ends of the base 1, the upper end of the air duct formed by the upper air inlet channel 61, the upper air outlet channel 71 and the upper air cooling channel 63 can be sealed through the upper shell 2, so that the two ends of the air duct are connected to the diffuser 4 and the collector 5 for ventilation, so as to carry out air cooling and heat dissipation for the chip body 12 from the upper side. Similarly, the bottom end of the air duct formed by the lower air inlet channel 62, the lower air outlet channel 72 and the lower air cooling channel 73 can be sealed through the lower shell 3, so that the two ends of the air duct are connected to the diffuser 4 and the collector 5 for ventilation, so as to carry out air cooling and heat dissipation for the chip body 12 from the lower side.

[0039] In this embodiment, the inner bottom surface of the upper air inlet channel 61 and the inner top surface of the lower air inlet channel 62 are both arc-shaped, the diffuser 4 is fixedly mounted on the left end of the base 1, the diffuser 4 is connected to the upper air inlet channel 61 and the lower air inlet channel 62, and the upper shell 2 is fixedly mounted and connected to the upper part of the diffuser 4 and the collector 5 through the upper card slot 21;

[0040] Specifically, the diffuser 4 is an existing ventilation diffuser structure, and the collector 5 is an existing collector structure, which will not be described in detail. The diffuser 4 can diffuse the wind to each port of the upper air inlet channel 61 and the lower air inlet channel 62, and the collector 5 can collect and discharge the wind at the ports of the upper air outlet channel 71 and the lower air outlet channel 72.

[0041] In this embodiment, the upper air cooling channel 63 is connected to the mounting slot 11, and the upper surface of the chip body 12 is exposed inside the upper air cooling channel 63;

[0042] Specifically, when wind passes through the upper air cooling channel 63 , the upper surface of the chip body 12 can be cooled and dissipated, thereby accelerating the heat dissipation effect of the upper surface of the chip body 12 .

[0043] In this embodiment, the air outlet structure 7 includes an upper air outlet channel 71, a lower air outlet channel 72 and a lower air cooling channel 73. The upper air outlet channel 71 is opened on the upper surface of the right end of the base 1, the lower air outlet channel 72 is opened on the lower surface of the right end of the base 1, and the lower air cooling channel 73 is opened in the middle of the lower surface of the base 1.

[0044] For details, please refer to the attached manual. Figure 2 , Instruction Manual Figure 3 And the instruction manual Figure 6 As shown, after the wind passes through the upper air cooling channel 63 and dissipates heat to the upper surface of the chip body 12, the wind can enter the upper air outlet channel 71. After the wind passes through the lower air cooling channel 73 and dissipates heat to the lower surface of the chip body 12, the wind can enter the lower air outlet channel 72. The collector 5 can collect and discharge the wind in the upper air outlet channel 71 and the lower air outlet channel 72 ports.

[0045] In this embodiment, the inner bottom surface of the upper air outlet channel 71 and the inner top surface of the lower air outlet channel 72 are both arc-shaped, and the collector 5 is installed and fixed at the right end of the base 1. The collector 5 is connected with the upper air outlet channel 71 and the lower air outlet channel 72, and the lower shell 3 is installed and fixedly connected with the diffuser 4 and the lower part of the collector 5 through the lower card slot 31;

[0046] Specifically, the diffuser 4 diffuses the wind into the upper air cooling channel 63 and the lower air cooling channel 73, and performs air cooling and heat dissipation on both sides of the chip body 12. The wind after air cooling and heat dissipation can be concentrated by the collector 5 and then discharged, avoiding the hot air collected by the collector 5 from blowing onto the surface of the chip body 12 again.

[0047] In this embodiment, the lower air cooling channel 73 is connected to the mounting slot 11, and the lower surface of the chip body 12 is exposed inside the lower air cooling channel 73;

[0048] Specifically, when wind passes through the lower air cooling channel 73 , the lower surface of the chip body 12 can be cooled and dissipated, thereby accelerating the heat dissipation effect of the lower surface of the chip body 12 .

[0049] In this embodiment, the upper air inlet channel 61 and the lower air inlet channel 62, the upper air outlet channel 71 and the lower air outlet channel 72, and the upper air cooling channel 63 and the lower air cooling channel 73 are arranged alternately one above the other, and the two ends of the upper air cooling channel 63 are connected to the upper air inlet channel 61 and the upper air outlet channel 71 on both sides thereof, and the two ends of the lower air cooling channel 73 are connected to the lower air inlet channel 62 and the lower air outlet channel 72 on both sides thereof, the upper shell 2 is sealedly connected to the ports of the upper air inlet channel 61, the upper air outlet channel 71 and the upper air cooling channel 63, and the lower shell 3 is sealedly connected to the ports of the lower air inlet channel 62, the lower air outlet channel 72 and the lower air cooling channel 73;

[0050] Specifically, after the diffuser 4 diffuses the wind, it can enter the port of the upper air inlet channel 61 and the port of the lower air inlet channel 62, and the wind at the port of the upper air inlet channel 61 can be guided by the internal curved surface and then blown to the upper shell 2 and then enter the upper air cooling channel 63, thereby also cooling and dissipating the surface of the upper shell 2. Similarly, the wind at the port of the lower air inlet channel 62 can be guided by the internal curved surface and blown to the lower shell 3, thereby also cooling and dissipating the surface of the lower shell 3, thereby avoiding overheating of the upper shell 2 and the lower shell 3 themselves and affecting the heat dissipation effect of the chip body 12.

[0051] In this embodiment, the liquid cooling structure 8 includes a snake-shaped upper cooling plate 81 and a lower cooling plate 82. The upper cooling plate 81 is mounted and fixed on the top of the lower air inlet channel 62 and the lower air outlet channel 72, and the lower cooling plate 82 is mounted and fixed on the bottom of the upper air inlet channel 61 and the upper air outlet channel 71. The gap between the upper cooling plates 81 forms the upper air cooling channel 63, and the gap between the lower cooling plates 82 forms the lower air cooling channel 73.

[0052] For details, please refer to the attached manual. Figure 2 , Instruction Manual Figure 3 And the instruction manual Figure 5As shown, the upper cooling plate 81 is located on the outside of the upper air-cooling channel 63 and is distributed in a snake shape, and the lower cooling plate 82 is located on the outside of the lower air-cooling channel 73 and is distributed in a snake shape, so as to prevent the upper cooling plate 81 from affecting the internal flow of wind in the upper air-cooling channel 63 and to prevent the lower cooling plate 82 from affecting the internal flow of wind in the lower air-cooling channel 73.

[0053] In this embodiment, an upper liquid inlet pipe 811 and an upper liquid outlet pipe 812 are respectively installed and fixed at both ends of the inlet and outlet of the upper cooling plate 81, and a lower liquid inlet pipe 821 and a lower liquid outlet pipe 822 are respectively installed and fixed at both ends of the inlet and outlet of the lower cooling plate 82. A snake-shaped cooling cavity 83 is opened inside the upper cooling plate 81 and the lower cooling plate 82.

[0054] Specifically, when the two ends of the upper liquid inlet pipe 811 and the upper liquid outlet pipe 812, as well as the two ends of the lower liquid inlet pipe 821 and the lower liquid outlet pipe 822 are connected to an external liquid cooling circulation system, the coolant can circulate inside the upper cooling plate 81 and the lower cooling plate 82, thereby liquid cooling and heat dissipation of the upper and lower sides of the chip body 12.

[0055] The working principle and use process of the present invention are as follows: by connecting the external air cooling system with the air inlet pipe 41, the air volume is introduced into the diffuser 4 from the air inlet pipe 41, and the diffuser 4 can disperse the air volume to each port of the upper air inlet channel 61 and the lower air inlet channel 62, so that the air at the port of the upper air inlet channel 61 can pass through the upper air cooling channel 63 and then be discharged from the upper air outlet channel 71, so that the air at the port of the lower air inlet channel 62 can pass through the lower air cooling channel 73 and then be discharged from the lower air outlet channel 72, and the air discharged from the ports of the upper air outlet channel 71 and the lower air outlet channel 72 can be collected by the collector 5 and then be discharged through the air outlet pipe 51, and when the wind passes through the upper air cooling channel 63, the upper side surface of the chip body 12 can be cooled and cooled, and when the wind passes through the lower air cooling channel 73, the lower side surface of the chip body 12 can be cooled and cooled, so that the chip body 12 can be quickly cooled and cooled from both sides;

[0056] By connecting the two ends of the upper liquid inlet pipe 811 and the upper liquid outlet pipe 812, as well as the two ends of the lower liquid inlet pipe 821 and the lower liquid outlet pipe 822 to the external liquid cooling circulation system, the cooling liquid inside the external liquid cooling circulation system can enter the upper cooling plate 81 through the upper liquid inlet pipe 811, and then flow out to the external liquid cooling circulation system through the upper liquid outlet pipe 812. Similarly, the cooling liquid inside the external liquid cooling circulation system can enter the lower cooling plate 82 through the lower liquid inlet pipe 821, and then flow out to the external liquid cooling circulation system through the lower liquid outlet pipe 822. The cooling liquid flows in a serpentine shape in the cooling cavity 83 inside the upper cooling plate 81 and in the cooling cavity 83 inside the lower cooling plate 82. During the flow of the cooling liquid in the cooling cavity 83, the upper and lower sides of the chip body 12 can be simultaneously liquid-cooled and cooled, so as to cooperate with air cooling to cool and dissipate the chip body 12, thereby improving the cooling and heat dissipation effect of the chip body 12.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A light-speed chip cooling system, comprising a base (1), characterized in that: An upper shell (2) is arranged above the base (1), a lower shell (3) is arranged below the base (1), a diffuser (4) is arranged at the left end of the upper shell (2) and the lower shell (3), a collector (5) is arranged at the right end of the upper shell (2) and the lower shell (3), an air inlet structure (6) for air cooling and heat dissipation of the chip is arranged at the left end of the base (1), an air outlet structure (7) for air cooling and heat dissipation of the chip is arranged at the right end of the base (1), and liquid cooling structures (8) for liquid cooling and heat dissipation of the chip are arranged on the upper and lower sides of the base (1); The base (1) comprises a mounting slot (11) and a chip body (12); the mounting slot (11) is provided on a side surface of the base (1), and the chip body (12) is movably snap-connected to the inside of the mounting slot (11); An upper slot (21) is provided above the diffuser (4), a lower slot (31) is provided below the diffuser (4), an air inlet pipe (41) is installed on the diffuser (4), and an air outlet pipe (51) is installed on the collector (5).

2. The light-speed chip cooling system according to claim 1, characterized in that: The air inlet structure (6) comprises an upper air inlet channel (61), a lower air inlet channel (62) and an upper air cooling channel (63); the upper air inlet channel (61) is opened on the upper surface of the left end of the base (1); the lower air inlet channel (62) is opened on the lower surface of the left end of the base (1); and the upper air cooling channel (63) is opened in the middle of the upper surface of the base (1).

3. The light-speed chip cooling system according to claim 2, characterized in that: The inner bottom surface of the upper air inlet channel (61) and the inner top surface of the lower air inlet channel (62) are both arc-shaped; the diffuser (4) is fixedly mounted on the left end of the base (1); the diffuser (4) is connected to the upper air inlet channel (61) and the lower air inlet channel (62); and the upper shell (2) is fixedly mounted on the diffuser (4) and the upper part of the collector (5) via an upper slot (21).

4. The light-speed chip cooling system according to claim 2, characterized in that: The upper air cooling channel (63) is in communication with the mounting slot (11), and the upper surface of the chip body (12) is exposed inside the upper air cooling channel (63).

5. The light-speed chip cooling system according to claim 2, characterized in that: The air outlet structure (7) comprises an upper air outlet channel (71), a lower air outlet channel (72) and a lower air cooling channel (73); the upper air outlet channel (71) is opened on the upper surface of the right end of the base (1); the lower air outlet channel (72) is opened on the lower surface of the right end of the base (1); and the lower air cooling channel (73) is opened in the middle of the lower surface of the base (1).

6. The light-speed chip cooling system according to claim 5, characterized in that: The inner bottom surface of the upper air outlet channel (71) and the inner top surface of the lower air outlet channel (72) are both arc-shaped; the collector (5) is fixedly mounted on the right end of the base (1); the collector (5) is connected to the upper air outlet channel (71) and the lower air outlet channel (72); and the lower shell (3) is fixedly mounted and connected to the diffuser (4) and the lower part of the collector (5) through a lower slot (31).

7. The light-speed chip cooling system according to claim 5, characterized in that: The lower air cooling channel (73) is in communication with the mounting slot (11), and the lower surface of the chip body (12) is exposed inside the lower air cooling channel (73).

8. The light-speed chip cooling system according to claim 5, characterized in that: The upper air inlet channel (61) and the lower air inlet channel (62), the upper air outlet channel (71) and the lower air outlet channel (72), and the upper air cooling channel (63) and the lower air cooling channel (73) are arranged alternately one above the other; the two ends of the upper air cooling channel (63) are connected to the upper air inlet channel (61) and the upper air outlet channel (71) on both sides thereof; the two ends of the lower air cooling channel (73) are connected to the lower air inlet channel (62) and the lower air outlet channel (72) on both sides thereof; the upper shell (2) is sealedly connected to the ports of the upper air inlet channel (61), the upper air outlet channel (71) and the upper air cooling channel (63); and the lower shell (3) is sealedly connected to the ports of the lower air inlet channel (62), the lower air outlet channel (72) and the lower air cooling channel (73).

9. The light-speed chip cooling system according to claim 5, characterized in that: The liquid cooling structure (8) includes a snake-shaped upper cooling plate (81) and a lower cooling plate (82), wherein the upper cooling plate (81) is installed and fixed on the top of the lower air inlet channel (62) and the lower air outlet channel (72), and the lower cooling plate (82) is installed and fixed on the bottom of the upper air inlet channel (61) and the upper air outlet channel (71). The gap between the upper cooling plates (81) forms an upper air cooling channel (63), and the gap between the lower cooling plates (82) forms a lower air cooling channel (73).

10. The light-speed chip cooling system according to claim 9, characterized in that: An upper liquid inlet pipe (811) and an upper liquid outlet pipe (812) are respectively fixedly installed at both ends of the inlet and outlet of the upper cooling plate (81), and a lower liquid inlet pipe (821) and a lower liquid outlet pipe (822) are respectively fixedly installed at both ends of the inlet and outlet of the lower cooling plate (82), and a snake-shaped cooling cavity (83) is provided inside the upper cooling plate (81) and the lower cooling plate (82).

Images