Packaging structure of double-temperature-zone integrated spectroscope

Abstract

The invention discloses a packaging structure of a double-temperature-zone integrated spectroscope. The packaging structure comprises an A wave band assembly, a B wave band assembly, a cold platform cavity, a spectroscope, a cold screen, a window, a refrigerating machine A, a refrigerating machine B and a Dewar cavity. The cold platform cavity is installed in the Dewar cavity in a heat insulation mode, an A-wave-band installation face, a B-wave-band installation face and a spectroscope frame installation face in the cold platform cavity are perpendicular to one another, and an A-wave-band assembly and a B-wave-band assembly are cooled through a refrigerating machine. The included angle between the spectroscope and the A-waveband mounting surface and the included angle between the spectroscope and the B-waveband mounting surface are 45 degrees. The device is high in integration level, compact in structure, light in weight, capable of achieving double-temperature-zone temperature control and suitable for occasions where a spectroscope and a multi-band detector are integrated on the same cold platform at the same time and low-temperature application is achieved.

Description

Technical Field

[0001] The present invention relates to the field of optical detection and imaging technology, and in particular to a packaging structure of a dual-temperature zone integrated spectroscope, which is suitable for simultaneously integrating a spectroscope and a multi-band detector on the same cold platform and realizing low-temperature applications. Background Art

[0002] In the field of optical detection and imaging technology, especially in the fields of earth remote sensing, astronomical observation, medical imaging and scientific research, it is often necessary to use electromagnetic radiation of different bands to obtain full spectrum information of the target. Traditional multi-band detector systems usually adopt independent packaging, that is, the detectors of each band and their related components are individually packaged in an independent structure. Although such a design is simple and direct, it leads to large volume, high cost and complex thermal management. In addition, during the integration and packaging of multi-band detectors, detectors of different bands may have different requirements for cooling capacity and cooling temperature. For example, infrared detectors, such as medium and short wave bands, generally require cooling temperatures above 80K, while long wave and very long wave bands often require cooling temperatures of 60K or even below 60K. Therefore, in low-temperature applications, how to achieve zone temperature control and effectively manage the heat load of the system and reduce heat leakage is a key technology. Traditional packaging structures often find it difficult to meet these requirements at the same time. A new type of packaging structure is urgently needed to realize the integration of temperature zones and low-temperature applications of detectors. Summary of the invention

[0003] The purpose of the present invention is to provide a packaging structure of a dual-temperature zone integrated spectroscope, which solves the problems of large volume, high cost and complex thermal management in the prior art, and provides a new way to prepare a new integrated dual-temperature zone Dewar or cold box assembly.

[0004] To achieve the above object, the technical solution of the present invention is:

[0005] A packaging structure of a dual-temperature zone integrated spectroscope, comprising a cold platform cavity adiabatically mounted in a Dewar cavity; the cold platform cavity is provided with an A-band component mounting surface, a B-band component mounting surface, a spectroscope frame mounting surface and a cold shield mounting surface;

[0006] An A-band component is arranged on the A-band component mounting surface, a B-band component is arranged on the B-band component mounting surface, a spectroscope frame is arranged on the spectroscope frame mounting surface, and a spectroscope is arranged on the spectroscope frame; a cold screen is fitted and mounted on the cold screen mounting surface;

[0007] An A-band refrigerator is also provided to be connected to the A-band assembly, and a B-band refrigerator is connected to the B-band assembly;

[0008] The cold shield mounting surface is parallel to the A-band component mounting surface; the A-band component mounting surface and the B-band component mounting surface are perpendicular to each other; the angles between the beam splitter and the A-band mounting surface and the B-band mounting surface are both 45°±1°;

[0009] A window is provided in the Dewar cavity corresponding to the cold shield;

[0010] The operating temperature of the A-band components is lower than that of the B-band components.

[0011] The A-band assembly includes an A-band substrate, an A-band detector, an A-band filter holder and an A-band filter;

[0012] The A-band detector is arranged on the front of the A-band substrate, and the A-band filter is arranged on the front of the A-band detector; the A-band filter frame is arranged on the front of the A-band substrate, and the A-band filter is arranged on the A-band filter frame; the A-band detector is a chip, or an array composed of multiple chips.

[0013] An A-band cold chain is also provided, through which the A-band refrigerator is connected to the A-band assembly, one end of the A-band cold chain is connected to the back of the A-band substrate, and the other end is connected to the A-band refrigerator.

[0014] An A-band heat-insulating support with a hollow frame structure is also provided at the edge of the A-band substrate, and the A-band component is provided on the A-band installation surface through the A-band heat-insulating support.

[0015] The A-band insulation support is made of titanium alloy material with low thermal conductivity.

[0016] The B-band assembly includes a B-band substrate, a B-band detector, a B-band filter holder and a B-band filter;

[0017] The B-band detector is arranged on the front of the A-band substrate, and the B-band filter is arranged on the front of the B-band detector; the B-band filter frame is arranged on the front of the B-band substrate, and the B-band filter is arranged on the B-band filter frame.

[0018] The B-band detector is a chip or an array of multiple chips.

[0019] A B-band cold chain is also provided, through which the B-band refrigerator is connected to the B-band assembly. One end of the B-band cold chain is connected to the back of the B-band substrate, and the other end is connected to the B-band refrigerator.

[0020] The outer surface of the cold platform cavity is polished or plated with a high reflectivity coating, and the inner surface is plated with a low reflectivity coating; the outer surface of the cold screen facing the window is polished or plated with a high reflectivity coating, and the inner surface facing the cold platform cavity is plated with a low reflectivity coating;

[0021] Perform low reflectivity treatment on the spectroscope frame, A-band filter frame, and B-band filter frame; perform high reflectivity treatment on the inner wall of the Dewar cavity;

[0022] The cold platform cavity is made of low expansion coefficient material;

[0023] The window is made of zinc selenide material.

[0024] The inner surface of the cold platform cavity is treated with black nickel with low reflectivity, and the outer surface is treated with high reflectivity gold plating; the A-band filter holder and the B-band filter holder are both treated with black nickel with low reflectivity; the surface of the spectroscope holder is treated with black nickel with low reflectivity; the inner surface of the cold screen is treated with black nickel with low reflectivity, and the outer surface is treated with polished gold plating; the inner wall of the Dewar cavity is treated with polished gold plating;

[0025] The cold platform cavity is made of Invar alloy.

[0026] A window cap is also provided, and the window and the window cap are airtightly welded to form a combination, and the combination is then airtightly connected to the Dewar cavity.

[0027] The beneficial effects of the present invention are:

[0028] 1. The present invention integrates the spectroscope and multi-band detector on the same cold platform, with high integration, compact structure and light weight. 2. Dual-zone temperature control is realized, and the A-band component and the B-band component are cooled by the A-band refrigerator and the B-band refrigerator respectively, and the B-band refrigerator cools the cold platform cavity at the same time, which can not only reduce the temperature of the spectroscope, but also provide pre-cooling for the A-band component, effectively reducing the heat leakage of the system. 3. A cold chain is used to connect the refrigerator and each band component. The flexibility of the cold chain can effectively reduce the influence of the refrigerator vibration on the alignment accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of the present invention.

[0030] Figure 2 It is a schematic diagram of the cooling platform cavity structure of the present invention.

[0031] Figure 3 It is a schematic diagram of the structure of the A-band component in the present invention.

[0032] Figure 4 It is a schematic diagram of the structure of the B-band component in the present invention.

[0033] In the figure: 1-A band component; 101-A band substrate; 102-A band detector; 103-A band filter holder; 104-A band cold chain; 105-A band filter; 106-A band insulation support; 2-B band component; 201-A band substrate; 202-B band detector; 203-B band filter holder; 204-B band cold chain; 205-B band filter; 3-cold platform cavity; 301-A band component mounting surface; 302-B band component mounting surface; 303-beam splitter frame mounting surface; 304-cold screen mounting surface; 4-beam splitter; 5-beam splitter frame; 6-cold screen; 7-window cap; 8-window; 9-A band refrigerator; 10-B band refrigerator; 11-Dewar cavity. DETAILED DESCRIPTION

[0034] In order to more concisely describe the present embodiment, some parts known to those skilled in the art but not related to the main content of the present invention are omitted in the drawings or descriptions. In addition, for the convenience of description, some parts in the drawings are omitted, enlarged or reduced, but they do not represent the size or entire structure of the actual product.

[0035] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0036] The present invention is further described below in conjunction with the accompanying drawings, which are only used for exemplary description and cannot be understood as limiting the present invention.

[0037] The present invention will now be further described with reference to the embodiments and the accompanying drawings:

[0038] The present invention relates to a packaging structure of a dual-temperature zone integrated spectroscope, such as Figure 1 As shown, there is a cold platform chamber 3 which is thermally insulated and installed in the Dewar chamber 11; Figure 2 As shown, the cold platform cavity 3 is provided with an A-band component mounting surface 301, a B-band component mounting surface 302, a beam splitter frame mounting surface 303 and a cold shield mounting surface 304;

[0039] An A-band component 1 is arranged on the A-band component mounting surface 301, a B-band component 2 is arranged on the B-band component mounting surface 302, a spectroscope frame 5 is arranged on the spectroscope frame mounting surface 303, and a spectroscope 4 is arranged on the spectroscope frame 5; a cold shield 6 is fitted and mounted on the cold shield mounting surface 304;

[0040] An A-band refrigerator 9 is also provided to be connected to the A-band component 1 , and a B-band refrigerator 10 is connected to the B-band component 2 .

[0041] The A-band component 1 includes an A-band substrate 101, an A-band detector 102, an A-band filter holder 103 and an A-band filter 105; Figure 3 As shown, the A-band detector 102 is arranged on the front of the A-band substrate 101, and the A-band filter 105 is arranged on the front of the A-band detector 102; the A-band filter holder 103 is arranged on the front of the A-band substrate 101, and the A-band filter 105 is arranged on the A-band filter holder 103. The A-band detector 102 can be a chip, or an array composed of multiple chips.

[0042] Preferably, an A-band cold chain 104 is also provided, through which the A-band refrigerator 9 is connected to the A-band assembly 1, one end of the A-band cold chain 104 is connected to the back of the A-band substrate 101, and the other end is connected to the A-band refrigerator 9. The flexibility of the A-band cold chain 104 can effectively reduce the influence of the vibration of the A-band refrigerator 9 on the registration accuracy.

[0043] Furthermore, an A-band heat-insulating support 106 of a hollow frame structure is provided at the edge of the A-band substrate 101 , and the A-band component 1 is provided on the A-band mounting surface 301 through the A-band heat-insulating support 106 .

[0044] The A-band detector 102 is a long-wave infrared array detector, and the A-band detector 102 is mounted on the front of the A-band substrate 101 using low-temperature epoxy adhesive.

[0045] The surface of the A-band filter holder 103 is treated with black nickel for low reflection. The A-band filter 105 is first installed on the A-band filter holder 103 using low-temperature epoxy glue, and then installed on the front of the A-band substrate 101 using epoxy glue. The A-band filter 105 is located above the A-band detector 102. The A-band insulation support 106 is made of titanium alloy material with low thermal conductivity and is made into a hollow frame structure and installed on the outer edge of the A-band substrate 101. The parallelism between the photosensitive surface of the A-band detector 102 chip and the mounting surface of the A-band insulation support 106 is controlled to be less than 0.01mm. Finally, the A-band component 1 is installed on the A-band mounting surface 301 of the cold platform cavity 3 through the A-band insulation support 106 using fixing screws. The photosensitive surface of the A-band detector 102 is controlled to be parallel to the A-band mounting surface 301, and the assembly deviation is less than ±0.2°.

[0046] like Figure 4 As shown, the B-band assembly 2 includes a B-band substrate 201, a B-band detector 202, a B-band filter holder 203 and a B-band filter 205;

[0047] The B-band detector 202 is disposed on the front of the B-band substrate 201, and the B-band filter 205 is disposed on the front of the B-band detector 202; the B-band filter holder 203 is disposed on the front of the B-band substrate 201, and the B-band filter 205 is disposed on the B-band filter holder 203. The B-band detector 202 can be a chip or an array composed of multiple chips.

[0048] Preferably, a B-band cold chain 204 is also provided, and the B-band refrigerator 10 is connected to the B-band component 2 via the B-band cold chain 204, one end of the B-band cold chain 204 is connected to the back of the B-band substrate 201, and the other end is connected to the B-band refrigerator 10. Similarly, by utilizing the flexibility of the B-band cold chain 204, the influence of the vibration of the B-band refrigerator 10 on the registration accuracy can be effectively reduced.

[0049] The B-band detector 202 is a medium-wave infrared array detector, and the B-band detector 202 is mounted on the front of the B-band substrate 201 using low-temperature epoxy adhesive.

[0050] The surface of the B-band filter holder 203 is treated with black nickel for low reflection. The B-band filter 205 is first installed on the B-band filter holder 203 using low-temperature epoxy glue, and then installed on the front of the B-band substrate 201 using epoxy glue. The B-band filter 205 is located above the B-band detector 202. The B-band component 2 has no insulation support. After the above work is completed, the B-band component 2 is installed on the B-band mounting surface 302 of the cold platform cavity 3 through the B-band substrate 201 using fixing screws. The photosensitive surface of the B-band detector 202 is controlled to be parallel to the B-band mounting surface 302, and the assembly deviation is less than ±0.2°.

[0051] The A-band detector 102 is a long-wave infrared array detector, the B-band detector 202 is a medium-wave infrared array detector, and the operating temperature of the A-band component 1 is lower than the operating temperature of the B-band component 2 .

[0052] The Dewar chamber 11 is pre-airtightly welded with the A-band refrigerator 9 and the B-band refrigerator 10, and the A-band component 1 and the B-band component 2 are insulated and installed in the Dewar chamber 11. The A-band cold chain 104 and the A-band refrigerator 9 are connected by screws, and the B-band cold chain 204 and the B-band refrigerator 10 are connected.

[0053] The cold platform cavity 3 is made of Invar alloy with low expansion coefficient. The outer surface of the cold platform cavity 3 is polished or plated with a high reflectivity coating, and the inner surface is plated with a low reflectivity coating. The inner surface of the cold platform cavity 3 is treated with black nickel low reflectivity, and the outer surface is treated with high reflectivity gold plating.

[0054] The A-band component mounting surface 301 and the B-band component mounting surface 302 are perpendicular to each other, and the verticality tolerance is less than 0.01 mm.

[0055] The cold shield mounting surface 304 is parallel to the A-band component mounting surface 301; the outer surface of the cold shield 6 facing the window 8 is polished or plated with a high-reflectivity coating, and the inner surface facing the cold platform cavity 3 is plated with a low-reflectivity coating; the inner surface of the cold shield 6 is treated with black nickel low-reflectivity, and the outer surface is polished and gold-plated.

[0056] The surface of the beam splitter frame 5 is treated with black nickel for low reflection. The beam splitter 4 is first mounted on the beam splitter frame 5 using low-temperature epoxy glue, and then mounted on the beam splitter frame mounting surface 303 using screws; the angles between the beam splitter 4 and the A-band mounting surface 301 and the B-band mounting surface 302 are both 45°, and the assembly deviation is controlled within ±0.1°.

[0057] The photosensitive surface of the A-band detector 102 is parallel to the A-band mounting surface 301 , and the photosensitive surface of the B-band detector 202 is parallel to the B-band mounting surface 302 , and the allowable assembly deviation is less than ±1°.

[0058] A window 8 is provided on the Dewar cavity 11 corresponding to the cold shield 6; the window 8 is made of zinc selenide material.

[0059] Preferably, a window cap 7 is also provided, and the window 8 and the window cap 7 are airtightly welded to form a combination, and the combination is then airtightly connected to the Dewar chamber 11 by laser welding.

[0060] The inner wall of the Dewar cavity 11 is polished and gold-plated to achieve high reflectivity.

[0061] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, any equivalent changes and modifications made according to the content of the patent application scope of the present invention should be within the technical scope of the present invention.

Claims

1. A packaging structure of a dual-temperature zone integrated spectroscope, comprising a cold platform cavity (3) thermally adiabatically mounted in a Dewar cavity (11); characterized in that: The cold platform cavity (3) is provided with an A-band component mounting surface (301), a B-band component mounting surface (302), a beam splitter frame mounting surface (303) and a cold shield mounting surface (304); An A-band component (1) is arranged on the A-band component mounting surface (301), a B-band component (2) is arranged on the B-band component mounting surface (302), a beam splitter frame (5) is arranged on the beam splitter frame mounting surface (303), and a beam splitter (4) is arranged on the beam splitter frame (5); and a cold shield (6) is mounted on the cold shield mounting surface (304); An A-band refrigerator (9) is also provided to be connected to the A-band component (1), and a B-band refrigerator (10) is connected to the B-band component (2); The cold shield mounting surface (304) is parallel to the A-band component mounting surface (301); the A-band component mounting surface (301) and the B-band component mounting surface (302) are perpendicular to each other; and the included angles between the beam splitter (4) and the A-band mounting surface (301) and the B-band mounting surface (302) are both 45°±1°; A window (8) is provided on the Dewar cavity (11) corresponding to the cold shield (6); The operating temperature of the A-band component (1) is lower than the operating temperature of the B-band component (2).

2. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 1, characterized in that: The A-band component (1) comprises an A-band substrate (101), an A-band detector (102), an A-band filter holder (103) and an A-band filter (105); The A-band detector (102) is arranged on the front of the A-band substrate (101), and the A-band filter (105) is arranged on the front of the A-band detector (102); the A-band filter frame (103) is arranged on the front of the A-band substrate (101), and the A-band filter (105) is arranged on the A-band filter frame (103); The A-band detector (102) is a chip, or an array consisting of multiple chips.

3. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 2, characterized in that: An A-band cold chain (104) is also provided, and the A-band refrigerator (9) is connected to the A-band component (1) via the A-band cold chain (104); one end of the A-band cold chain (104) is connected to the back of the A-band substrate (101), and the other end is connected to the A-band refrigerator (9).

4. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 2, characterized in that: An A-band heat-insulating support (106) of a hollow frame structure is also provided at the edge of the A-band substrate (101), and the A-band component (1) is provided on the A-band mounting surface (301) via the A-band heat-insulating support (106).

5. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 4, characterized in that: The A-band insulation support (106) is made of a titanium alloy material with low thermal conductivity.

6. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 1, characterized in that: The B-band component (2) comprises a B-band substrate (201), a B-band detector (202), a B-band filter holder (203) and a B-band filter (205); The B-band detector (202) is arranged on the front of the A-band substrate (201), and the B-band filter (205) is arranged on the front of the B-band detector (202); the B-band filter holder (203) is arranged on the front of the B-band substrate (201), and the B-band filter (205) is arranged on the B-band filter holder (203); The B-band detector (202) is a chip, or an array consisting of multiple chips.

7. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 6, characterized in that: A B-band cold chain (204) is also provided, and the B-band refrigerator (10) is connected to the B-band component (2) via the B-band cold chain (204); one end of the B-band cold chain (204) is connected to the back of the B-band substrate (201), and the other end is connected to the B-band refrigerator (10).

8. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 1, characterized in that: The outer surface of the cold platform cavity (3) is polished or plated with a high reflectivity coating, and the inner surface is plated with a low reflectivity coating; the outer surface of the cold shield (6) facing the window (8) is polished or plated with a high reflectivity coating, and the inner surface thereof facing the cold platform cavity (3) is plated with a low reflectivity coating; The spectroscope frame (5), the A-band filter frame (103), and the B-band filter frame (203) are subjected to low reflectivity treatment; and the inner wall of the Dewar cavity (11) is subjected to high reflectivity treatment; The cold platform cavity (3) is made of a material with a low expansion coefficient; The window (8) is made of zinc selenide material.

9. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 8, characterized in that: The inner surface of the cold platform cavity (3) is treated with black nickel with low reflectivity, and the outer surface is treated with high reflectivity gold plating; the A-band filter holder (103) and the B-band filter holder (203) are both treated with black nickel with low reflectivity; the surface of the spectroscope holder (5) is treated with black nickel with low reflectivity; the inner surface of the cold shield (6) is treated with black nickel with low reflectivity, and the outer surface is treated with polished gold plating; the inner wall of the Dewar cavity (11) is treated with polished gold plating; The cold platform cavity (3) is made of Invar alloy.

10. The packaging structure of the dual-temperature zone integrated spectroscope according to claim 8, characterized in that: A window cap (7) is also provided, and the window (8) and the window cap (7) are airtightly welded to form a combined body, which is then airtightly connected to the Dewar chamber (11).

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