Backlight module, manufacturing method thereof and display device

Abstract

The invention discloses a backlight module, a manufacturing method of the backlight module and a display device. The backlight module comprises a substrate, a plurality of light emitting diodes and a metal heat dissipation layer. The multiple light emitting diodes are arranged on the same side of the substrate at intervals. The metal heat dissipation layer is located on the side, away from the light-emitting diodes, of the substrate. The metal heat dissipation layer comprises heat dissipation blocks corresponding to the light-emitting diodes, and orthographic projections of the heat dissipation blocks on the substrate comprise orthographic projections of the corresponding light-emitting diodes on the substrate.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a backlight module and a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous development of display technology, the current display market is mainly composed of traditional backlight + LCD (Liquid Crystal Display, Chinese: Liquid Crystal Display), mini-LED (mini Light-Emitting Diode, Chinese: Sub-millimeter Light-Emitting Diode) backlight + LCD and OLED (Organic Light-Emitting Diode, Chinese: Organic Light-Emitting Diode). Display products with mini-LED backlight + LCD have the advantages of high contrast, high color accuracy, high brightness, high safety and partition control functions, and can be applied to large-size displays such as car displays. Moreover, mini-LED backlight can provide more backlight areas. Compared with OLED, the display can still be clearly visible under strong sunlight conditions, so that whether driving in bright daylight or at night, the driver can easily read the information on the car display without being affected by light.

[0003] The temperature of traditional backlight + LCD display products can reach 40℃~50℃, and even 80℃ in hot summer. The temperature of mini-LED backlight + LCD display products is facing more challenges as the number of light areas and control ICs (English: microchip, Chinese: chip) increases. Summary of the invention

[0004] The present application provides a backlight module and a manufacturing method thereof, and a display device, aiming to solve the heat dissipation of a mini-LED backlight source to at least a certain extent.

[0005] In a first aspect of the present application, a backlight module is provided, the backlight module comprising: substrate substrate; A plurality of light emitting diodes are arranged at intervals on the same side of the base substrate; The metal heat dissipation layer is located on a side of the base substrate away from the light emitting diode; the metal heat dissipation layer includes a heat dissipation block corresponding to the light emitting diode, and the orthographic projection of the heat dissipation block on the base substrate includes the orthographic projection of the corresponding light emitting diode on the base substrate.

[0006] In some embodiments, a side of the base substrate away from the light-emitting diode is a plane; in a direction perpendicular to the base substrate, a thickness of the metal heat dissipation layer is 15 μm to 25 μm.

[0007] In some embodiments, a side of the substrate away from the light-emitting diode has a groove, and the metal heat dissipation layer is at least partially located in the groove.

[0008] In some embodiments, in a direction perpendicular to the substrate, the thickness of the metal heat dissipation layer is 270 μm to 370 μm.

[0009] In some embodiments, the metal heat dissipation layer includes a seed sublayer and a metal sublayer sequentially arranged in a direction away from the substrate, the seed sublayer is formed by a sputtering process, and the metal sublayer is formed by an electroplating process.

[0010] In some embodiments, the center of the orthographic projection of the heat dissipation block on the base substrate coincides with the center of the orthographic projection of the corresponding light emitting diode on the base substrate.

[0011] In some embodiments, an area of ​​a cross section of the metal heat dissipation layer parallel to the base substrate gradually increases in a direction away from the light emitting diode.

[0012] In some embodiments, the heat dissipation blocks are arranged in multiple rows, and the heat dissipation blocks in two adjacent rows are arranged opposite to each other or staggered; the metal heat dissipation layer further includes: A connecting bar is located between two adjacent columns of the heat dissipation blocks and extends along the column direction; the connecting bar is connected to each of the heat dissipation blocks on both sides.

[0013] In some embodiments, the backlight module further includes: A metal plate, located on a side of the metal heat dissipation layer away from the light-emitting diode; the metal plate has a plurality of independent through holes; The thermal conductive adhesive is located between the metal plate and the metal heat dissipation layer.

[0014] In some embodiments, the through holes are arranged in multiple rows and columns, the through holes in two adjacent rows are staggered, and the through holes in two adjacent columns are staggered.

[0015] In some embodiments, the base substrate has a light-emitting area and a binding area, and the light-emitting diode is located in the light-emitting area; the backlight module further includes: a connecting line, located between the light-emitting diode and the base substrate, and connected to the light-emitting diode; the connecting line extends from the light-emitting area to the binding area, and the orthographic projection of the connecting line in the light-emitting area on the base substrate partially overlaps with the orthographic projection of the light-emitting diode on the base substrate; The metal heat dissipation layer further includes a heat sink, and an orthographic projection of the heat sink on the base substrate partially overlaps with an orthographic projection of the connection line in the binding area on the base substrate.

[0016] In a second aspect of the present application, a display device is provided, comprising a liquid crystal display panel and a backlight module as provided in the first aspect, wherein the backlight module and the liquid crystal display panel are arranged opposite to each other.

[0017] In a third aspect of the present application, a method for manufacturing a backlight module is provided, the manufacturing method comprising: providing a substrate base plate; A metal heat dissipation layer is formed on one side of the substrate, wherein the metal heat dissipation layer includes a plurality of heat dissipation blocks spaced apart from each other; A light emitting diode corresponding to the heat dissipation block is formed on a side of the base substrate away from the metal heat dissipation layer, and the orthographic projection of the heat dissipation block on the base substrate includes the orthographic projection of the corresponding light emitting diode on the base substrate.

[0018] In some embodiments, forming a metal heat dissipation layer on one side of the substrate includes: Depositing a seed layer on the substrate by a sputtering process; Laying photoresist on the seed sublayer and performing exposure and development to expose a target area of ​​the seed sublayer; Depositing a metal sublayer on the target area of ​​the photoresist and the seed sublayer using an electroplating process; removing the photoresist and the metal sublayer on the photoresist to expose the seed sublayer; The seed sublayer and the metal sublayer are etched until the exposed seed sublayer is removed, and the remaining metal sublayer and the seed sublayer under the metal sublayer form the metal heat dissipation layer.

[0019] In some embodiments, before forming the metal heat dissipation layer on one side of the base substrate, the manufacturing method further includes: Laying photoresist on the substrate and performing exposure and development to expose a target area of ​​the substrate; Etching a target area of ​​the substrate to form a groove, so as to form the said in the groove; The photoresist is removed.

[0020] In some embodiments, after forming a metal heat dissipation layer on one side of the base substrate, the manufacturing method further includes: Applying thermal conductive adhesive on a metal plate, wherein the metal plate has a plurality of independent through holes; The metal plate is adhered to the metal heat dissipation layer by using the heat conductive adhesive.

[0021] According to one or more embodiments of the present application, a backlight module and a manufacturing method thereof, and a display device are provided, including a substrate, a plurality of light-emitting diodes and a metal heat dissipation layer, wherein the plurality of light-emitting diodes are arranged at intervals on the same side of the substrate, the metal heat dissipation layer is located on the side of the substrate away from the light-emitting diodes, the metal heat dissipation layer includes a heat dissipation block corresponding to the light-emitting diode, and the orthographic projection of the heat dissipation block on the substrate substrate includes the orthographic projection of the corresponding light-emitting diode on the substrate substrate. The heat generated by the light-emitting diode when working can be more quickly conducted to the corresponding heat dissipation block for dissipation, and can also achieve a rapid cooling effect in a strong convection environment, which is conducive to enhancing the heat dissipation capacity of the entire display product, avoiding accelerated aging of electronic devices due to being in a high temperature environment for a long time, and increasing the service life of the electronic devices. Moreover, the heat dissipation block is arranged corresponding to the light-emitting diode, which can reduce unnecessary settings, reduce implementation costs and reduce product weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A schematic structural diagram of a backlight module in one or more embodiments of the present application is shown.

[0024] Figure 2 Shows Figure 1 A top view schematic diagram of a backlight module.

[0025] Figure 3 Shows Figure 2 A distribution diagram of heat sinks corresponding to the light emitting diodes.

[0026] Figure 4 Shows Figure 2 Another distribution diagram of the heat sinks arranged corresponding to the light emitting diodes.

[0027] Figure 5 A schematic structural diagram of a backlight module in another embodiment of the present application is shown.

[0028] Figure 6 Shows Figure 1 Schematic diagram of the structure of the metal heat dissipation layer.

[0029] Figure 7 A schematic structural diagram of a backlight module in another embodiment of the present application is shown.

[0030] Figure 8 A schematic diagram of the local distribution of a metal heat dissipation layer in another embodiment of the present application is shown.

[0031] Fig. 9 A schematic structural diagram of a backlight module in another embodiment of the present application is shown.

[0032] Fig.10 Shows Fig. 9 Schematic diagram of the distribution of through holes in the metal plate.

[0033] Fig.11 A partial top view schematic diagram of a backlight module in another embodiment of the present application is shown.

[0034] Fig.12 Shows Fig.11 Schematic diagram of the partial structure of the backlight module.

[0035] Fig.13 A partial top view schematic diagram of a backlight module in another embodiment of the present application is shown.

[0036] Fig.14 A heat dissipation simulation diagram of a backlight module in the related art is shown.

[0037] Fig.15 A heat dissipation simulation diagram of a backlight module in an embodiment of the present application is shown.

[0038] Fig.16 A schematic diagram of the structure of a display device in one or more embodiments of the present application is shown.

[0039] Fig.17 A schematic flow chart of a method for manufacturing a display panel in one or more embodiments of the present application is shown.

[0040] Fig.18 Shows Fig.17 Schematic diagram of the process of step S102.

[0041] Fig.19 A schematic flow chart of a method for manufacturing a display panel in another embodiment of the present application is shown.

[0042] Fig. 20 A schematic flow chart of a method for manufacturing a display panel in another embodiment of the present application is shown.

[0043] Fig.21 Shows Fig.17 Schematic diagram of the flow chart of step S103.

[0044] Explanation of the reference numerals: 10: substrate; 101: groove; 11: light-emitting area; 12: binding area; 20: light-emitting diode; 30: metal heat dissipation layer; 301: seed sublayer; 302: metal sublayer; 31: heat dissipation block; 32: connecting strip; 33: heat sink; 41: metal plate; 410: through hole; 42: thermal conductive adhesive; 51: connecting line; 52: first passivation layer; 53: second passivation layer; 54: metal protective layer; 55: sealing layer; 56: welding layer; 100: liquid crystal display panel; 200: backlight module. DETAILED DESCRIPTION

[0045] In order to make the technical personnel in the technical field to which the present application belongs to understand the present application more clearly, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0046] Figure 1 For a schematic diagram of the structure of the backlight module in one or more embodiments of the present application, please refer to Figure 1 In a first aspect of the present application, a backlight module is provided, which includes a base substrate 10, a plurality of light-emitting diodes 20 and a metal heat dissipation layer 30. The plurality of light-emitting diodes 20 are arranged at intervals on the same side of the base substrate 10. The metal heat dissipation layer 30 is located on a side of the base substrate 10 away from the light-emitting diodes 20. The metal heat dissipation layer 30 includes a heat dissipation block 31 corresponding to the light-emitting diode 20, and the orthographic projection of the heat dissipation block 31 on the base substrate 10 includes the orthographic projection of the corresponding light-emitting diode 20 on the base substrate 10.

[0047] The above-mentioned backlight module includes a base substrate 10, a plurality of light-emitting diodes 20 and a metal heat dissipation layer 30. The plurality of light-emitting diodes 20 are arranged at intervals on the same side of the base substrate 10. The metal heat dissipation layer 30 is located on the side of the base substrate 10 away from the light-emitting diodes 20. The metal heat dissipation layer 30 includes a heat dissipation block 31 corresponding to the light-emitting diodes 20. The orthographic projection of the heat dissipation block 31 on the base substrate 10 includes the orthographic projection of the corresponding light-emitting diodes 20 on the base substrate 10. The heat generated by the light-emitting diodes 20 when working can be more quickly conducted to the corresponding heat dissipation block 31 for dissipation. In a strong convection environment, the effect of rapid cooling can also be achieved, which is conducive to enhancing the heat dissipation capacity of the entire display product, avoiding accelerated aging of electronic devices due to being in a high temperature environment for a long time, and increasing the service life of the electronic devices. Moreover, the heat dissipation block 31 is arranged corresponding to the light-emitting diodes 20, which can reduce unnecessary settings, reduce implementation costs and reduce product weight.

[0048] In some embodiments, the base substrate 10 may be a glass substrate or a PCB (Printed Circuit Board). The main component of PCB is epoxy resin, the thermal conductivity of epoxy resin is 0.2w / km to 0.8w / km, and the thermal conductivity of glass is 0.8w / km to 1.5w / km. Therefore, the heat dissipation effect of the base substrate 10 is better when the glass substrate is selected. Moreover, compared with PCB, the flatness of the glass substrate is better, and the surface roughness of the metal traces formed on the surface is smaller, which is conducive to reducing the distance between the metal traces and improving the process accuracy.

[0049] For example, see Figure 1 The thickness D of the base substrate 10 may be 600 μm to 800 μm, such as 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, etc.

[0050] Figure 2 for Figure 1 For a top view of the backlight module, please refer to Figure 2 In some embodiments, the base substrate 10 may have a light emitting area 11 , and the light emitting diode 20 and the heat sink 31 are both located in the light emitting area 11 .

[0051] For example, see Figure 2 The base substrate 10 may have a plurality of light emitting areas 11, each light emitting area 11 is provided with at least one light emitting diode 20, the light emitting diodes 20 in the same light emitting area 11 are synchronously controlled, and the light emitting diodes 20 in different light emitting areas 11 are independently controlled.

[0052] In some embodiments, see Figure 2 , the light emitting diodes 20 can be arranged in an array. Correspondingly, the heat sinks 31 can also be arranged in an array, that is, arranged in multiple rows and columns.

[0053] In one possible embodiment, see Figure 2 , two adjacent rows of light-emitting diodes 20 may be arranged opposite to each other, and two adjacent columns of light-emitting diodes 20 may be arranged opposite to each other. For example, the light-emitting diodes 20 in the first row and the first column are arranged opposite to the light-emitting diodes 20 in the first row and the first column, and the light-emitting diodes 20 in the first row and the second column are arranged opposite to the light-emitting diodes 20 in the second row and the second column. For another example, the light-emitting diodes 20 in the first row and the first column are arranged opposite to the light-emitting diodes 20 in the first row and the second column, and the light-emitting diodes 20 in the second row and the first column are arranged opposite to the light-emitting diodes 20 in the second row and the second column.

[0054] Figure 3 for Figure 2 A distribution diagram of the heat sink blocks corresponding to the light-emitting diodes is shown in FIG. Figure 3, illustratively, two adjacent rows of heat dissipation blocks 31 can be arranged in a one-to-one correspondence, and two adjacent columns of heat dissipation blocks 31 can be arranged in a one-to-one correspondence.

[0055] Figure 4 for Figure 2 For another schematic diagram of the distribution of the heat sink corresponding to the light emitting diodes, please refer to Figure 4 For example, two adjacent rows of heat dissipation blocks 31 may be arranged alternately, and two adjacent columns of heat dissipation blocks 31 may be arranged alternately. For example, the heat dissipation blocks 31 in the first row and the first column, the heat dissipation blocks 31 in the first row and the second column, the heat dissipation blocks 31 in the second row and the first column, the heat dissipation blocks 31 in the second row and the second column, the heat dissipation blocks 31 in the third row and the first column, and the heat dissipation blocks 31 in the third row and the second column are arranged in sequence along the column direction.

[0056] In another possible embodiment, two adjacent rows of light-emitting diodes 20 may be arranged in an alternating manner, and two adjacent columns of light-emitting diodes 20 may be arranged in an alternating manner. For example, the light-emitting diodes 20 in the first row and the first column, the light-emitting diodes 20 in the second row and the first column, the light-emitting diodes 20 in the first row and the second column, the light-emitting diodes 20 in the second row and the second column, the light-emitting diodes 20 in the first row and the third column, and the light-emitting diodes 20 in the second row and the third column are arranged in sequence along the row direction. For another example, the light-emitting diodes 20 in the first row and the first column, the light-emitting diodes 20 in the first row and the second column, the light-emitting diodes 20 in the second row and the first column, the light-emitting diodes 20 in the second row and the second column, the light-emitting diodes 20 in the third row and the second column are arranged in sequence along the column direction.

[0057] Exemplarily, two adjacent rows of heat dissipation blocks 31 may be arranged in a one-to-one correspondence, and two adjacent columns of heat dissipation blocks 31 may be arranged in a one-to-one correspondence. Alternatively, two adjacent rows of heat dissipation blocks 31 may be arranged alternately, and two adjacent columns of heat dissipation blocks 31 may be arranged alternately.

[0058] Exemplarily, the light-emitting diode 20 may be a mini-LED, a micro-LED (English: microLight-Emitting Diode, Chinese: micro light-emitting diode), or an OLED.

[0059] In some embodiments, the material of the metal heat dissipation layer 30 may be copper or aluminum. The thermal conductivity of aluminum is 237w / km, and the thermal conductivity of copper is 385w / km. Both copper and aluminum have good heat dissipation effects, but copper is better for the heat dissipation effect when the material of the metal heat dissipation layer 30 is selected.

[0060] In some embodiments, see Figure 1, the center of the orthographic projection of the heat sink 31 on the base substrate 10 can coincide with the center of the orthographic projection of the corresponding light emitting diode 20 on the base substrate 10. The heat sink 31 coincides with the center of the orthographic projection of the corresponding light emitting diode 20 on the base substrate 10, and the orthographic projection of the light emitting diode 20 on the base substrate 10 is included in the orthographic projection of the corresponding heat sink 31 on the base substrate 10, so the heat generated by the light emitting diode 20 when working can be evenly dissipated through the corresponding heat sink 31.

[0061] Exemplarily, when two adjacent rows of light-emitting diodes 20 are arranged one by one, and two adjacent columns of light-emitting diodes 20 are arranged one by one, the heat dissipation blocks 31 of two adjacent rows are arranged one by one, and the heat dissipation blocks 31 of two adjacent columns are arranged one by one. When two adjacent rows of light-emitting diodes 20 are arranged staggered, and two adjacent columns of light-emitting diodes 20 are arranged staggered, the heat dissipation blocks 31 of two adjacent rows are arranged staggered, and the heat dissipation blocks 31 of two adjacent columns are arranged staggered.

[0062] Exemplarily, the orthographic projection of the heat dissipation block 31 on the base substrate 10 may be a circle, a square, a pentagon, etc. When the orthographic projection of the heat dissipation block 31 on the base substrate 10 is a circle, the manufacturing process may be convenient.

[0063] Figure 5 This is a schematic diagram of the structure of the backlight module in another embodiment of the present application. Figure 5 In some embodiments, the area of ​​the cross section of the metal heat dissipation layer 30 parallel to the base substrate 10 may gradually increase in a direction away from the light emitting diode 20. The area of ​​the cross section of the metal heat dissipation layer 30 parallel to the base substrate 10 gradually increases in a direction away from the light emitting diode 20, which is beneficial for the metal heat dissipation layer 30 to dissipate the heat transferred from the base substrate 10 in a direction away from the light emitting diode 20, thereby improving the heat dissipation efficiency.

[0064] In one possible embodiment, see Figure 1 The side of the base substrate 10 away from the light emitting diode 20 may be a plane.

[0065] For example, see Figure 1 In the direction perpendicular to the base substrate 10, the thickness d of the metal heat dissipation layer 30 can be 15μm to 25μm, such as 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, 21μm, 22μm, 23μm, 24μm, 25μm, etc. The thickness of the metal heat dissipation layer 30 is 15μm to 25μm. On the one hand, it can have enough thickness for heat dissipation. On the other hand, the side of the base substrate 10 away from the light emitting diode 20 is a plane. The metal heat dissipation layer 30 is arranged protruding from the surface of the base substrate 10. The influence of the metal heat dissipation layer 30 with a smaller thickness on the overall thickness of the product can be ignored.

[0066] Figure 6 for Figure 1 For a schematic diagram of the structure of the metal heat dissipation layer, please refer to Figure 6 In some embodiments, the metal heat dissipation layer 30 may include a seed sublayer 301 and a metal sublayer 302 sequentially arranged in a direction away from the base substrate 10, the seed sublayer 301 is formed by a sputtering process, and the metal sublayer 302 is formed by an electroplating process.

[0067] The density of the metal deposited by the sputtering process is high, but the thickness is generally less than 1.8 μm, and can only reach 2.7 μm at most, which cannot meet the thickness requirement of the metal heat dissipation layer 30. By first forming a seed sublayer 301 on the base substrate 10 by a sputtering process, and then forming a metal sublayer 302 on the seed sublayer 301 by an electroplating process, the thickness requirement of the metal heat dissipation layer 30 can be met.

[0068] By way of example, the material of the seed sub-layer 301 and the material of the metal sub-layer 302 may be the same.

[0069] Illustratively, in a direction perpendicular to the base substrate 10 , the thickness of the seed sublayer 301 may be 0.5 μm to 0.7 μm, such as 0.5 μm, 0.55 μm, 0.6 μm, 0.65 μm, or 0.7 μm.

[0070] Figure 7 This is a structural diagram of a backlight module in another embodiment of the present application. Figure 7 In another possible embodiment, a side of the substrate 10 away from the light emitting diode 20 may have a groove 101 , and the metal heat dissipation layer 30 is at least partially located in the groove 101 .

[0071] In the above embodiment, by providing a groove 101 on the side of the base substrate 10 away from the light-emitting diode 20 to set the metal heat dissipation layer 30, the thickness of the metal heat dissipation layer 30 and the contact area with the base substrate 10 can be greatly increased, and the heat generated by the light-emitting diode 20 during operation is effectively promoted to be transferred to the metal heat dissipation layer 30 through the base substrate 10, thereby greatly enhancing the heat dissipation effect.

[0072] For example, see Figure 7 The depth H of the groove 101 may be 250 μm to 350 μm, such as 250 μm, 260 μm, 270 μm, 280 μm, 290 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, etc.

[0073] For example, see Figure 7In the direction perpendicular to the base substrate 10, the thickness d of the metal heat dissipation layer 30 can be 270μm to 370μm, such as 270μm, 280μm, 290μm, 300μm, 310μm, 320μm, 330μm, 340μm, 350μm, 360μm, 370μm, etc.

[0074] In some embodiments, the side of the base substrate 10 away from the light-emitting diode 20 may have multiple independent grooves 101 . When the metal heat dissipation layer 30 only includes the heat dissipation block 31 , the grooves 101 are arranged corresponding to the heat dissipation block 31 , and the heat dissipation block 31 fills the corresponding grooves 101 .

[0075] Exemplarily, the bottom surface of the groove 101 may be circular, square, pentagonal, etc.

[0076] In some embodiments, the metal heat dissipation layer 30 can be formed by a curing process of a metal paste, or can be formed by a curing process of a metal paste. Figure 6 As shown, the metal heat dissipation layer 30 includes a seed sublayer 301 and a metal sublayer 302 which are sequentially arranged in a direction away from the substrate. The seed sublayer 301 is formed by a sputtering process, and the metal sublayer 302 is formed by an electroplating process.

[0077] Figure 8 This is a schematic diagram of the local distribution of the metal heat dissipation layer in another embodiment of the present application. Figure 8 When the heat sinks 31 are arranged in multiple columns and two adjacent columns of heat sinks 3 are arranged opposite to each other or staggered, the metal heat sink layer 30 may further include a connecting bar 32, which is located between two adjacent columns of heat sinks 31 and extends along the column direction. The connecting bar 32 is connected to each heat sink 31 on both sides in a fin shape. At this time, the connecting bar 32 acts as an odd fin or a single fin, extending along the midline of the entire figure. The heat sinks 31 act as even fins or side fins, distributed on both sides of the entire figure.

[0078] The heat dissipation blocks 31 on both sides are connected to form a fish fin shape through a connecting strip 32, and the heat dissipation method is heat conduction first and then heat convection. When the airflow passes through the fins, the channel becomes narrower, the flow rate becomes faster, and the heat dissipation is accelerated.

[0079] Exemplarily, when the side of the base substrate 10 away from the light emitting diode 20 has a groove 101 , the groove 101 is arranged corresponding to the connecting bar 32 , and the connecting bar 32 and each connected heat sink 31 fill the corresponding groove 101 .

[0080] Fig. 9 This is a structural diagram of a backlight module in another embodiment of the present application. Fig. 9In some embodiments, the backlight module may further include a metal plate 41 and a thermal conductive adhesive 42. The metal plate 41 is located on a side of the metal heat dissipation layer 30 away from the light emitting diode 20. The metal plate 41 has a plurality of independent through holes. The thermal conductive adhesive 42 is located between the metal plate 41 and the metal heat dissipation layer 30.

[0081] By sticking the metal plate 41 to the metal heat dissipation layer 30 through the thermal conductive adhesive 42, the heat dissipation effect in the vertical direction can be further increased, and the heat conducted to each heat dissipation block 31 can be dispersed to improve the heat dissipation efficiency and temperature uniformity. Moreover, the metal plate 41 has a plurality of independent through holes, which can enhance the convective heat transfer of the heat dissipation block 31 and further improve the heat dissipation efficiency. In addition, the metal plate 41 and the thermal conductive adhesive 42 can also play a role in protecting the base substrate 10.

[0082] By way of example, the material of the metal plate 41 may be steel.

[0083] Fig.10 for Fig. 9 For a schematic diagram of the distribution of through holes in the metal plate, please refer to Fig.10 For example, the through holes 410 of the metal plate 41 can be arranged in multiple rows and columns, and the through holes 410 in two adjacent rows are staggered, and the through holes 410 in two adjacent columns are staggered, which is beneficial to enhance the convective heat transfer of the heat sink 31 and improve the heat dissipation efficiency.

[0084] For example, the number of metal plates 41 can be one or more. For example, each light-emitting area 11 is provided with a metal plate 41, which can prevent the bending of the metal plate 41 from causing friction and edge collapse on the side of the light-emitting area 11. For another example, multiple light-emitting areas 11 are provided with the same metal plate 41, which can achieve a visual effect of a narrow frame.

[0085] Fig.11 This is a partial top view of a backlight module in another embodiment of the present application. Fig.12 for Fig.11 For a partial structural diagram of the backlight module, please refer to Fig.11 and Fig.12 In some embodiments, the base substrate 10 may further include a binding area 12, which is located on one side of the light-emitting area 11. The backlight module may further include a connecting line 51, which is located between the light-emitting diode 20 and the base substrate 10 and connected to the light-emitting diode 20. The connecting line 51 extends from the light-emitting area 11 to the binding area 12, and the orthographic projection of the connecting line 51 in the light-emitting area 11 on the base substrate 10 partially overlaps with the orthographic projection of the light-emitting diode 20 on the base substrate 10.

[0086] Exemplarily, the material of the connection wire 51 may be copper.

[0087] Illustratively, in a direction perpendicular to the base substrate 10 , the thickness of the connection line 51 may be 1.6 μm to 2 μm, such as 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, 2 μm, etc.

[0088] The width of the connection line 51 may vary in a direction perpendicular to the extension direction of the connection line 51 and parallel to the base substrate 10. For example, the width of the portion of the connection line 51 connected to the light-emitting diode 20 is relatively large, and a pad may be formed to facilitate electrical connection with the light-emitting diode 20. For another example, the width of the portion of the connection line 51 not connected to the light-emitting diode 20 is relatively small, and a routing may be formed to reduce space occupation.

[0089] In some embodiments, see Fig.12 The backlight module may further include a first passivation layer 52 and a second passivation layer 53. The first passivation layer 52 is located between the connecting line 51 and the base substrate 10. The second passivation layer 53 is located on a side of the first passivation layer 52 away from the base substrate 10 and at least covers the side of the connecting line 51, thereby protecting and insulating the connecting line 51.

[0090] In some embodiments, see Fig.12 The backlight module may further include a metal protective layer 54, which is located on a side of the connecting wire 51 away from the first passivation layer 52 and in contact with the second passivation layer 53. The metal protective layer 54, the first passivation layer 52, and the second passivation layer 53 seal the connecting wire 51, protect the connecting wire 51, and extend the service life of the connecting wire 51. Moreover, the metal protective layer 54 is conductive, and the connecting wire 51 can be electrically connected to the light emitting diode 20 through the metal protective layer 54.

[0091] Exemplarily, the material of the metal protective layer 54 may be nickel or gold, and may also include a nickel sublayer and a gold sublayer stacked in sequence. The gold sublayer has high chemical stability and can play a good protective role as a top layer. The nickel sublayer is located between the gold sublayer and the connecting wire 51, which can prevent the mutual diffusion between the gold layer and the connecting wire 51 and also prevent the connecting wire 51 from being corroded.

[0092] Illustratively, in the direction perpendicular to the base substrate 10 , the thickness of the nickel sublayer can be 2.5 μm to 3.5 μm, such as 2.5 μm, 2.6 μm, 2.7 μm, 2.8 μm, 2.9 μm, 3 μm, 3.1 μm, 3.2 μm, 3.3 μm, 3.4 μm, 3.5 μm, etc.

[0093] In the direction perpendicular to the base substrate 10 , the thickness of the gold layer may be 0.03 μm to 0.07 μm, such as 0.03 μm, 0.04 μm, 0.05 μm, 0.06 μm, 0.07 μm, etc.

[0094] In some embodiments, see Fig.12 The backlight module may further include a sealing layer 55 , and the sealing layer 55 is located on a side of the second passivation layer 53 away from the first passivation layer 52 .

[0095] Exemplarily, the material of the sealing layer 55 may be white oil.

[0096] In some embodiments, see Fig.12 The backlight module may further include a welding layer 56, which is located between the light-emitting diode 20 and the connecting wire 51, and can fix the light-emitting diode 20 on the connecting wire 51 and make an electrical connection.

[0097] By way of example, the material of the solder layer 56 may be tin.

[0098] Fig.13 This is a partial top view of a backlight module in another embodiment of the present application. Fig.13 Exemplarily, the metal heat dissipation layer 30 may further include a heat sink 33 , and the orthographic projection of the heat sink 33 on the base substrate 10 partially overlaps with the orthographic projection of the connection line 51 in the binding area 12 on the base substrate 10 .

[0099] For example, see Fig.13 , multiple heat sinks 33 can be connected to each other in the shape of fish fins, and the heat dissipation method is heat conduction first and then heat convection. When the airflow passes through the fins, the channel becomes narrower, the flow rate becomes faster, and the heat dissipation is accelerated. Combined with the metal plate 41 with through holes 410, the convective heat transfer can be further enhanced.

[0100] Exemplarily, the density of the metal heat dissipation layer 30 may be positively correlated with the density of the connection wires 51. For example, if the density of the connection wires 51 in the binding area 12 is greater than the density of the connection wires 51 in the light-emitting area 11, the density of the heat sink 33 is greater than the density of the heat sink 31, so that the heat dissipation effect is more uniform.

[0101] Fig.14 This is a heat dissipation simulation diagram of a backlight module in the related art. Fig.15 This is a heat dissipation simulation diagram of the backlight module in one embodiment of the present application. Fig.14 and Fig.15 , under the conditions of an ambient temperature of 25°C, the same convection mode, the same space, and the same device power, the surface temperature of the 50mm×50mm substrate 10 is simulated, and it can be found that the heat dissipation efficiency of the present application is approximately improved by (47°C-35°C) / (47°C-25°C)=54.5%, which effectively reduces the possibility of tin melting in the welding layer 56, especially for vehicle-mounted displays under solar radiation, and improves the stability and safety of the product.

[0102] Fig.16 For a schematic diagram of the structure of a display device in one or more embodiments of the present application, please refer to Fig.16 According to a second aspect of the present application, a display device is provided. The display device includes a liquid crystal display panel 100 and a backlight module 200 provided in any of the above embodiments. The backlight module 200 and the liquid crystal display panel 100 are arranged relative to each other.

[0103] Fig.17 For a flow chart of a method for manufacturing a display panel in one or more embodiments of the present application, please refer to Fig.17 According to a third aspect of the present application, a method for manufacturing a display panel is provided. The method comprises the following steps S101 to S103.

[0104] Step S101, providing a base substrate.

[0105] Step S102 , forming a metal heat dissipation layer on one side of the base substrate, wherein the metal heat dissipation layer includes a plurality of heat dissipation blocks spaced apart from each other.

[0106] Step S103 , forming a light emitting diode corresponding to the heat dissipation block on a side of the base substrate away from the metal heat dissipation layer, wherein the orthographic projection of the heat dissipation block on the base substrate includes the orthographic projection of the corresponding light emitting diode on the base substrate.

[0107] Fig.18 for Fig.17 For a flow chart of step S102, please refer to Fig.18 In some embodiments, the step S102 may include the following steps S201 to S205.

[0108] Step S201: depositing a seed layer on a substrate by a sputtering process.

[0109] Step S202, laying photoresist on the seed sub-layer and performing exposure and development to expose the target area of ​​the seed sub-layer.

[0110] Step S203: depositing a metal sub-layer on the target area of ​​the photoresist and the seed sub-layer by using an electroplating process.

[0111] Step S204, removing the photoresist and the metal sublayer on the photoresist to expose the seed sublayer.

[0112] Step S205 , etching the seed sublayer and the metal sublayer until the exposed seed sublayer is removed, and the remaining metal sublayer and the seed sublayer under the metal sublayer form a metal heat dissipation layer.

[0113] Exemplarily, the etching depth of the seed sublayer and the metal sublayer may be greater than the deposition thickness of the seed sublayer to avoid the seed sublayer remaining.

[0114] Fig.19 This is a flow chart of a method for manufacturing a display panel in another embodiment of the present application. Fig.19 In some embodiments, before step S102, the manufacturing method may further include the following steps S301 to S303.

[0115] Step S301 , laying photoresist on the substrate and performing exposure and development to expose the target area of ​​the substrate.

[0116] Step S302 , etching the target area of ​​the substrate to form a groove, so as to form a metal heat dissipation layer in the groove.

[0117] Exemplarily, the step S302 may form the groove by laser induced etching combined with hydrogen fluoride.

[0118] Step S303, removing the photoresist.

[0119] Fig. 20 This is a schematic diagram of a method for manufacturing a display panel in another embodiment of the present application. Fig. 20 In some embodiments, after step S102, the manufacturing method may further include the following steps S401 to S402.

[0120] Step S401, coating a thermal conductive adhesive on a metal plate, wherein the metal plate has a plurality of independent through holes.

[0121] Step S402, sticking the metal plate to the metal heat dissipation layer by using thermal conductive adhesive.

[0122] Fig.21 for Fig.17 For a flow chart of step S103, please refer to Fig.21 In some embodiments, the step S103 may include the following steps S501 to S506.

[0123] Step S501 , using a CVD (Chemical Vapor Deposition) process to deposit a first passivation layer on a side of the substrate away from the metal heat dissipation layer.

[0124] Step S502, depositing metal material on the first passivation layer by magnetron sputtering technology, and patterning it by yellow light, wet etching and stripping process to form connecting lines.

[0125] Step S503, depositing a second passivation layer on the first passivation layer and the connecting wires by using a CVD process, and patterning the first passivation layer and the connecting wires by using yellow light, dry etching and stripping processes to expose the connecting wires.

[0126] Step S504: using ENIG (Electroless Nickel Immersion Gold) process to deposit a metal protection layer on the connection line.

[0127] Step S505: forming a sealing layer on the second passivation layer by using a printing process.

[0128] Step S506: Using SMT (English: Surface Mount Technology, Chinese: Surface Mount Technology) technology to weld the light emitting diode to the metal protective layer through the welding layer.

[0129] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0130] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise" and "counterclockwise" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0131] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0132] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0133] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A backlight module, characterized in that: The backlight module comprises: A substrate base plate (10); A plurality of light emitting diodes (20) are arranged at intervals on the same side of the base substrate (10); A metal heat dissipation layer (30) is located on a side of the base substrate (10) away from the light-emitting diode (20); the metal heat dissipation layer (30) comprises a heat dissipation block (31) corresponding to the light-emitting diode (20), and the orthographic projection of the heat dissipation block (31) on the base substrate (10) comprises the orthographic projection of the corresponding light-emitting diode (20) on the base substrate (10).

2. The backlight module according to claim 1, characterized in that: The side of the base substrate (10) away from the light-emitting diode (20) is a plane; in a direction perpendicular to the base substrate (10), the thickness of the metal heat dissipation layer (30) is 15 μm to 25 μm.

3. The backlight module according to claim 1, characterized in that: A side of the base substrate (10) away from the light emitting diode (20) has a groove (101), and the metal heat dissipation layer (30) is at least partially located in the groove (101).

4. The backlight module according to claim 3, characterized in that: In a direction perpendicular to the base substrate (10), the thickness of the metal heat dissipation layer (30) is 270 μm to 370 μm.

5. The backlight module according to claim 2 or 4, characterized in that: The metal heat dissipation layer (30) comprises a seed sublayer (301) and a metal sublayer (302) which are sequentially arranged in a direction away from the base substrate (10); the seed sublayer (301) is formed by a sputtering process, and the metal sublayer (302) is formed by an electroplating process.

6. The backlight module according to any one of claims 1 to 4, characterized in that: The center of the orthographic projection of the heat dissipation block (31) on the base substrate (10) coincides with the center of the orthographic projection of the corresponding light emitting diode (20) on the base substrate (10).

7. The backlight module according to any one of claims 1 to 4, characterized in that: The area of ​​the cross section of the metal heat dissipation layer (30) parallel to the base substrate (10) gradually increases in a direction away from the light emitting diode (20).

8. The backlight module according to any one of claims 1 to 4, characterized in that: The heat dissipation blocks (31) are arranged in a plurality of rows, and the heat dissipation blocks (31) in two adjacent rows are arranged opposite to each other or staggered; the metal heat dissipation layer (30) further comprises: A connecting bar (32) is located between two adjacent columns of the heat dissipation blocks (31) and extends along the column direction; the connecting bar (32) is connected to each of the heat dissipation blocks (31) on both sides.

9. The backlight module according to claim 8, characterized in that: The backlight module also includes: A metal plate (41) located on a side of the metal heat dissipation layer (30) away from the light-emitting diode (20); the metal plate (41) has a plurality of independent through holes (410); The heat-conducting adhesive (42) is located between the metal plate (41) and the metal heat dissipation layer (30).

10. The backlight module according to claim 9, characterized in that: The through holes (410) are arranged in multiple rows and columns, the through holes (410) in two adjacent rows are staggered, and the through holes (410) in two adjacent columns are staggered.

11. The backlight module according to any one of claims 1 to 4, characterized in that: The base substrate (10) has a light-emitting area (11) and a binding area (12), and the light-emitting diode (20) is located in the light-emitting area (11); the backlight module further comprises: a connecting line (51) located between the light-emitting diode (20) and the base substrate (10), and connected to the light-emitting diode (20); the connecting line (51) extends from the light-emitting area (11) to the binding area (12), and an orthographic projection of the connecting line (51) in the light-emitting area (11) on the base substrate (10) partially overlaps with an orthographic projection of the light-emitting diode (20) on the base substrate (10); The metal heat dissipation layer (30) further comprises a heat sink (33), the orthographic projection of the heat sink (33) on the base substrate (10) partially overlapping with the orthographic projection of the connection line (51) in the binding area (12) on the base substrate (10).

12. A display device, characterized in that: The display device comprises a liquid crystal display panel (100) and a backlight module (200) as claimed in claims 1 to 11, wherein the backlight module (200) and the liquid crystal display panel (100) are arranged opposite to each other.

13. A method for manufacturing a backlight module, characterized in that: The manufacturing method comprises: providing a substrate base plate; A metal heat dissipation layer is formed on one side of the substrate, wherein the metal heat dissipation layer includes a plurality of heat dissipation blocks spaced apart from each other; A light emitting diode corresponding to the heat dissipation block is formed on a side of the base substrate away from the metal heat dissipation layer, and the orthographic projection of the heat dissipation block on the base substrate includes the orthographic projection of the corresponding light emitting diode on the base substrate.

14. The manufacturing method according to claim 13, characterized in that: The step of forming a metal heat dissipation layer on one side of the substrate includes: Depositing a seed layer on the substrate by a sputtering process; Laying photoresist on the seed sublayer and performing exposure and development to expose a target area of ​​the seed sublayer; Depositing a metal sublayer on the target area of ​​the photoresist and the seed sublayer using an electroplating process; removing the photoresist and the metal sublayer on the photoresist to expose the seed sublayer; The seed sublayer and the metal sublayer are etched until the exposed seed sublayer is removed, and the remaining metal sublayer and the seed sublayer under the metal sublayer form the metal heat dissipation layer.

15. The manufacturing method according to claim 13, characterized in that: Before forming a metal heat dissipation layer on one side of the base substrate, the manufacturing method further includes: Laying photoresist on the substrate and performing exposure and development to expose a target area of ​​the substrate; Etching a target area of ​​the substrate to form a groove, so as to form the metal heat dissipation layer in the groove; The photoresist is removed.

16. The manufacturing method according to any one of claims 13 to 15, characterized in that: After forming a metal heat dissipation layer on one side of the base substrate, the manufacturing method further includes: Applying thermal conductive adhesive on a metal plate, wherein the metal plate has a plurality of independent through holes; The metal plate is adhered to the metal heat dissipation layer by using the heat conductive adhesive.

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