Device and method for controlling temperature of high-temperature object
Through the combination of heat conduction module, motion module and monitoring and control module, the special cross-sectional configuration of the heat conduction unit and the hollow runner design, the sensitivity and high temperature resistance of the existing high-temperature object temperature control methods are solved, and high-efficiency high-temperature objects are achieved Temperature control.
Patent Information
- Application Number
- CN202411355733.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-02-14
AI Technical Summary
The existing high-temperature object temperature control methods have problems such as insensitive temperature control, insensitive air-cooling temperature control, and easy melting of the surface of the water-cooling module.
The combination device of the heat conduction module, the motion module and the monitoring and control module is adopted. Through the special cross-sectional configuration of the heat conduction unit and the hollow runner design, combined with the coordinated work of the motion module and the monitoring and control module, the fine temperature control of high-temperature objects is achieved.
It realizes efficient temperature control of high-temperature objects, can quickly cool down in high-temperature environments, avoid the problem of excessive temperature, and can be applied to multiple high-temperature related fields.
Smart Images
Figure CN119440129A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of high-temperature thermal control, and in particular relates to a device and method for controlling the temperature of a high-temperature object. Background Art
[0002] In the fields of metallurgy, high-temperature scientific experiments, etc., it is often necessary to heat the crucible or experimental objects at high temperatures. In order to make the process more controllable in related reactions or experiments, it is necessary to use certain methods to control the temperature of such high-temperature objects.
[0003] At present, the methods for controlling the temperature of high-temperature objects are mainly divided into two categories. One is to control the heating source, and control the temperature of the high-temperature object by increasing or decreasing the heating rate of the high-temperature object, but there is a problem of insensitive temperature control; the other is to use cooling methods (air cooling, water cooling) to adjust the temperature of the high-temperature object, but there are problems such as insensitive air cooling temperature control and the surface of the water cooling module is easy to melt when it contacts the high-temperature object under high temperature conditions. Summary of the invention
[0004] In view of the above problems, the present invention provides a device and method for controlling the temperature of a high-temperature object, which can control the temperature of a high-temperature object.
[0005] The technical solution of the present invention is: a device for controlling the temperature of a high-temperature object, comprising:
[0006] A heat conduction module, the main function of which is to reduce the temperature of a specific area on a high-temperature object by heat conduction; the heat conduction module is composed of one or more identical or different heat conduction units;
[0007] A motion module, the main function of which is to change the position of the heat transfer unit, so that a single or multiple heat transfer units are in contact with or out of contact with the high-temperature object, and the contact position can be changed;
[0008] The monitoring and control module mainly controls the motion module and the heat conduction module to achieve the temperature control effect on the high-temperature object.
[0009] Furthermore, the heat conduction unit is a triangular pyramid or a cone, and the contact mode between the heat conduction unit and the high-temperature object is that the end with a smaller area of the triangular pyramid or the cone contacts the surface of the high-temperature object, so that the cross-section of the heat conduction unit becomes larger the farther away from the high-temperature object; when the heat conduction unit contacts the high-temperature object for temperature control, the heat diffuses to the inside of the heat conduction unit through the contact surface between the heat conduction unit and the high-temperature object; since the cross-sectional configuration of the heat conduction unit increases from small to large, the heat dissipation area becomes larger and larger when the heat is conducted inside the heat conduction unit, and the heat flux density becomes smaller and smaller, so that the heat at the contact surface can be quickly conducted, and the temperature at the contact surface is not easy to rise, so such a heat conduction unit can be used to control the temperature of the high-temperature object.
[0010] Furthermore, the heat conduction unit is made of a single material or made of different materials according to specific temperature control requirements.
[0011] Furthermore, the heat conduction unit is made of a material selected from the group consisting of tungsten, titanium, ceramic material, and diamond, or a combination of two or more thereof.
[0012] Furthermore, the contact area between the heat conduction unit and the high-temperature object is made of diamond material.
[0013] Furthermore, a plurality of heat conduction units can be used in combination to achieve the function of fixing or supporting a high-temperature object.
[0014] Furthermore, the heat conduction unit can move under the control of the motion module to achieve contact or loss of contact with a specific area of the high-temperature object, and different areas of the high-temperature object can be selected for contact temperature control.
[0015] Furthermore, the heat conduction unit is designed with a hollow flow channel, in which there is flowing coolant, which can take away the heat from the heat conduction unit by means of flow heat exchange, thereby reducing the temperature of the heat conduction unit.
[0016] Furthermore, the coolant may be a liquid or gaseous coolant.
[0017] Furthermore, the outer side of the heat conduction unit is covered with a special material that can withstand a high temperature working environment. The special material has the property of reflecting most of the heat radiation from the high temperature object, thereby reducing the influence of the heat radiation on the heat conduction unit.
[0018] Furthermore, the heat transfer unit includes a high temperature resistant temperature sensor element for obtaining the real-time temperature information of the heat transfer unit or uses a non-contact temperature measurement method to obtain the real-time temperature information of the high temperature object and / or the heat transfer unit during the temperature control process; the monitoring and control module can select a single or multiple heat transfer units to contact the high temperature object according to the real-time temperature information, and can adjust the contact area position, area and contact time between the heat transfer unit and the high temperature object. In addition, the adjustable parameters also include the coolant type and flow rate. Through the above operations, the temperature distribution of the high temperature object can be regulated.
[0019] Furthermore, the temperature control device can be used in atmospheric environment, high and low pressure environment, other atmospheres or vacuum environment.
[0020] The present invention also provides a high temperature object temperature control method based on the high temperature object temperature control device, comprising:
[0021] According to the specific temperature control requirements, set the control parameters, including the number, position, and time of heat transfer units in contact with the high-temperature object, and select the coolant type and coolant flow rate;
[0022] Based on the set control parameters, the monitoring and control module is used to control the motion module so that the corresponding heat conduction unit contacts the high-temperature object and starts temperature control;
[0023] Use temperature sensors or non-contact temperature measurement methods to obtain real-time temperature information of the heat conduction unit and / or high-temperature objects; determine whether the temperature of the high-temperature object meets the temperature control requirements. If not, adjust the temperature control parameters again to control the temperature; repeat the process until the temperature control requirements are met and the task is completed.
[0024] Furthermore, the temperature of high-temperature objects can be controlled in stages and regions according to thermal principles and temperature control models.
[0025] The remarkable effects of the present invention are:
[0026] (1) The present invention can control the temperature of high-temperature objects, and the temperature of the high-temperature objects being controlled can be as high as 3000°C or above;
[0027] (2) The present invention uses high thermal conductivity and high melting point materials to make the heat conduction unit. The heat in the contact area can be quickly extracted by using the special cross-sectional configuration design of the heat conduction unit. A hollow flow channel is designed in the heat conduction unit to dissipate heat. Through the above design, the heat conduction unit can efficiently control the temperature of a high-temperature object and can support and fix it. Due to the fast heat dissipation rate, the heat conduction unit can even control the temperature of a high-temperature object with a temperature higher than the melting point of the material in the contact area;
[0028] (3) The present invention can control the temperature of a high-temperature object by adjusting the number, position, area, contact time of the contact area, selecting the type of coolant, controlling the coolant flow rate and other parameters;
[0029] (4) The present invention can be applied to a variety of scientific research and engineering technology fields related to high temperatures, such as laser-matter interaction, high-temperature thermal physics, controlled nuclear fusion, aerospace propulsion, high-temperature metallurgy, etc. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 Schematic diagram of the contact between the heat conduction unit and the high-temperature object.
[0031] Figure 2 It is a schematic diagram of the usage status of the temperature control device for high-temperature objects.
[0032] Figure 3 This is a schematic diagram of the structure when the heat conduction unit is a cone. The temperature sensor can be set inside or outside the heat conduction unit, and the specific position is selected according to the temperature control requirements.
[0033] Figure 4 It is a flow chart of a method for controlling the temperature of a high-temperature object.
[0034] In the figure: 1. heat conduction unit, 2. motion module, 3. monitoring and control module, 4. high temperature object, 101. main structure of heat conduction unit, 102. hollow flow channel, 103. high temperature resistant reflective layer, 104. high temperature resistant temperature sensing element, 105. diamond. DETAILED DESCRIPTION
[0035] The present invention will be further described below in conjunction with the accompanying drawings.
[0036] The present invention provides a device for controlling the temperature of a high-temperature object. Figure 2 As shown, including:
[0037] The heat conduction module mainly functions to reduce the temperature of a specific area on the high-temperature object 4 by heat conduction. The heat conduction module can be composed of one or more heat conduction units 1 that are the same or different.
[0038] The motion module 2 mainly functions to change the position of the heat conduction unit, so that a single or multiple heat conduction units are in contact with or out of contact with the high-temperature object, and the contact position can be changed.
[0039] The monitoring and control module 3 mainly controls the motion module and the heat conduction module to achieve the temperature control effect on the high-temperature object.
[0040] The device for controlling the temperature of a high-temperature object mainly utilizes the principle of heat conduction. The temperature of a high-temperature object is high, and the vibration kinetic energy of the microscopic particles inside is large. The temperature of the heat conduction module is low, and the vibration kinetic energy of the microscopic particles inside is small. When the heat conduction module comes into contact with the high-temperature object, due to the huge temperature difference between the two, the microscopic vibration, displacement and mutual collision of the molecules, atoms and electrons inside the object transfer energy, thereby reducing the temperature of the high-temperature object. The relevant physical process can be expressed by Fourier's law:
[0041]
[0042] In the formula, J T is the heat flux in the r direction, which is perpendicular to the isothermal surface and is proportional to the temperature gradient dT / dr in that direction, and k is the thermal conductivity. This formula can be understood as the amount of heat passing through a given cross section per unit time, which is proportional to the temperature change rate and cross-sectional area in the direction perpendicular to the cross section.
[0043] The heat conduction unit may be a triangular pyramid or a cone, and the contact method between the heat conduction unit and the high temperature object is as follows: Figure 1 As shown. The heat conduction unit is characterized in that the area of the contact region with the high-temperature object is small, and the farther away from the high-temperature object, the larger the cross-section of the heat conduction unit. When the heat conduction unit contacts the high-temperature object for temperature control, the heat diffuses to the inside of the heat conduction unit through the contact surface. Since the heat conduction unit has a cross-sectional configuration that is small at the top and large at the bottom, the heat dissipation area becomes larger and larger when the heat is conducted inside the heat conduction unit, and the heat flux density becomes smaller and smaller, so that the heat at the contact surface can be quickly conducted and the temperature at the contact surface is not easy to rise. Therefore, such a heat conduction unit can be used to control the temperature of the high-temperature object. In some specific designs, the temperature of the high-temperature object being controlled can even be higher than the melting point of the material in the contact area of the heat conduction unit.
[0044] Furthermore, the heat transfer unit needs to be resistant to high temperatures and have good thermal conductivity. The unit can be made of a single material or different materials according to specific temperature control requirements. The materials that can be used include metals with high melting points such as tungsten and titanium, or other high temperature resistant non-metallic materials such as ceramic materials and diamonds. Figure 3 As shown, in order to achieve better high temperature resistance and efficient thermal control, the contact area between the heat conduction unit and the high temperature object can be made of materials with high thermal conductivity and high melting point such as diamond 105.
[0045] Furthermore, the multiple heat conduction units in the temperature control device can be used in combination to achieve the function of fixing or supporting a high-temperature object.
[0046] Furthermore, the heat conduction unit can move under the control of the motion module to achieve contact or loss of contact with a specific area of the high-temperature object, and different areas of the high-temperature object can be selected for contact temperature control.
[0047] Further, such as Figure 3 As shown, the heat transfer unit may be designed with a hollow channel 102. A coolant flows in the hollow channel, which can remove heat from the heat transfer unit by flow heat exchange, thereby reducing the temperature of the heat transfer unit.
[0048] Furthermore, the coolant may be a liquid or gaseous coolant.
[0049] Further, such as Figure 3 As shown, the outer side of the heat conduction unit can be covered with a special material (high temperature resistant reflective layer 103), which can withstand high temperature working environment. In some specific designs, the material has the property of reflecting most of the heat radiation from high temperature objects, which can reduce the impact of heat radiation on the heat conduction unit.
[0050] Furthermore, the heat transfer unit may include a high temperature resistant temperature sensor element 104 for obtaining real-time temperature information of the heat transfer unit.
[0051] Furthermore, the monitoring and control module can select a single or multiple heat transfer units to contact the high-temperature object according to the real-time temperature information of the heat transfer unit, and can adjust the contact area position, area and contact time between the heat transfer unit and the high-temperature object. In addition, the adjustable parameters also include the type and flow rate of the coolant. Through the above operations, the temperature distribution of the high-temperature object can be regulated.
[0052] Furthermore, non-contact temperature measurement methods, such as infrared temperature measurement, may also be used to obtain temperature information of the high-temperature object and / or the heat transfer unit during the temperature control process, and then use the information to control the temperature of the high-temperature object.
[0053] Furthermore, the temperature control device can be used in different gas environment conditions including atmospheric environment, high and low pressure environment, other atmospheres, vacuum environment, etc.
[0054] like Figure 4 As shown, a high temperature object temperature control method based on the high temperature object temperature control device as described above comprises:
[0055] According to the specific temperature control requirements, set the control parameters, including the number, position, time, etc. of heat transfer units in contact with the high-temperature object, and select the coolant type and coolant flow rate.
[0056] Based on the set control parameters, the monitoring and control module is used to control the motion module so that the corresponding heat conduction unit contacts the high-temperature object and starts temperature control.
[0057] Use temperature sensors or non-contact temperature measurement methods to obtain real-time temperature information of the heat transfer unit and / or high-temperature object. Determine whether the temperature of the high-temperature object meets the temperature control requirements. If not, adjust the temperature control parameters again to control the temperature. Repeat this process until the temperature control requirements are met and the task is completed.
[0058] In addition, the temperature of high-temperature objects can be controlled in stages and areas based on thermal principles and temperature control models.
[0059] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A device for controlling the temperature of a high-temperature object, characterized in that: include: A heat conduction module, the main function of which is to reduce the temperature of a specific area on a high-temperature object by heat conduction; the heat conduction module is composed of one or more identical or different heat conduction units; A motion module, the main function of which is to change the position of the heat transfer unit, so that a single or multiple heat transfer units are in contact with or out of contact with the high-temperature object, and the contact position can be changed; The monitoring and control module mainly controls the motion module and the heat conduction module to achieve the temperature control effect on the high-temperature object.
2. A device for controlling the temperature of a high-temperature object according to claim 1, characterized in that: The heat conduction unit is a triangular pyramid or a cone, and the contact mode between the heat conduction unit and the high-temperature object is that the end with a smaller area of the triangular pyramid or the cone contacts the surface of the high-temperature object, so that the cross-section of the heat conduction unit becomes larger the farther away from the high-temperature object; when the heat conduction unit contacts the high-temperature object for temperature control, the heat diffuses to the inside of the heat conduction unit through the contact surface between the heat conduction unit and the high-temperature object; since the cross-sectional configuration of the heat conduction unit increases from small to large, the heat dissipation area becomes larger and larger when the heat is conducted inside the heat conduction unit, and the heat flux density becomes smaller and smaller, so that the heat at the contact surface can be quickly conducted, and the temperature at the contact surface is not easy to increase, so such a heat conduction unit can be used to control the temperature of the high-temperature object.
3. The device for controlling the temperature of a high-temperature object according to claim 1, characterized in that: A plurality of heat conduction units can be used in combination to achieve the function of fixing or supporting a high-temperature object.
4. The device for controlling the temperature of a high-temperature object according to claim 1, characterized in that: The heat conduction unit can move under the control of the motion module to achieve contact or discontinuity with a specific area of the high-temperature object, and can select different areas of the high-temperature object for contact temperature control.
5. The device for controlling the temperature of a high-temperature object according to claim 1, characterized in that: The heat transfer unit is designed with a hollow flow channel, in which there is flowing coolant, which can take away the heat on the heat transfer unit by means of flow heat exchange, thereby reducing the temperature of the heat transfer unit.
6. The device for controlling the temperature of a high-temperature object according to claim 1, characterized in that: The outer side of the heat conduction unit is covered with a special material that can withstand a high temperature working environment. The special material has the property of reflecting most of the heat radiation from the high temperature object, and can reduce the influence of the heat radiation on the heat conduction unit.
7. The device for controlling the temperature of a high-temperature object according to claim 1, characterized in that: The heat conduction unit includes a high temperature resistant temperature sensing element for obtaining real-time temperature information of the heat conduction unit or uses a non-contact temperature measurement method to obtain real-time temperature information of the high-temperature object and / or the heat conduction unit during the temperature control process; the monitoring and control module can select a single or multiple heat conduction units to contact the high-temperature object according to the real-time temperature information, and can adjust the contact area position, area and contact time of the heat conduction unit and the high-temperature object.
8. The device for controlling the temperature of a high-temperature object according to claim 1, characterized in that: The temperature control device can be used in an atmospheric environment, a high or low pressure environment, other atmospheres or a vacuum environment.
9. A high temperature object temperature control method based on the high temperature object temperature control device, characterized in that: include: According to the specific temperature control requirements, set the control parameters, including the number, position, and time of heat transfer units in contact with the high-temperature object, and select the coolant type and coolant flow rate; Based on the set control parameters, the monitoring and control module is used to control the motion module so that the corresponding heat conduction unit contacts the high-temperature object and starts temperature control; Use temperature sensors or non-contact temperature measurement methods to obtain real-time temperature information of the heat conduction unit and / or high-temperature objects; determine whether the temperature of the high-temperature object meets the temperature control requirements. If not, adjust the temperature control parameters again to control the temperature; repeat the process until the temperature control requirements are met and the task is completed.
10. A high temperature object temperature control method based on the high temperature object temperature control device according to claim 9, characterized in that: It can control the temperature of high-temperature objects in stages and areas according to thermal principles and temperature control models.