Microcrack repairing method, glass substrate and chip assembly after packaging of glass substrate

Abstract

The invention relates to the technical field of semiconductor chips, and particularly discloses a microcrack repairing method, a glass substrate and a glass substrate packaged chip assembly.The method comprises the steps that a glass substrate chip obtained based on single cutting treatment is obtained; sequentially coating the periphery of the glass substrate chip with a reinforcing material; baking the glass substrate chip so as to repair microcracks, formed in the single cutting treatment process, of the glass substrate chip by using the cured reinforcing material; according to the microcrack repairing method, the microcracks at the edge of the glass substrate chip are repaired in a mode of combining reinforcing material coating and baking treatment, the problem of edge microcracks caused by cutting stress in a single cutting link of the glass substrate chip is effectively solved, the structural integrity and mechanical strength of the chip are remarkably improved, and the service life of the chip is prolonged. And resource waste is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chips, and in particular to a micro-crack repairing method, a glass substrate, and a chip assembly encapsulated by a glass substrate. Background Art

[0002] In the field of semiconductor manufacturing, semiconductor chips made on glass substrates have attracted much attention due to their unique physical and electrical properties. However, this technology faces a significant technical challenge in the chip singulation process: the problem of edge microcracks caused by cutting stress.

[0003] Although glass substrates have excellent light transmittance and flatness, their brittle nature is particularly prominent during the cutting process. In the chip singulation process, when high-precision cutting tools act on semiconductor chips on glass substrates (i.e., glass substrate chips), tiny cracks are easily generated on the cutting edges due to factors such as uneven stress distribution inside the material, improper cutting parameter settings, or insufficient equipment accuracy. These microcracks not only significantly reduce the structural integrity and mechanical strength of the chip, but also directly affect its electrical performance, greatly reducing the expected high performance and causing the chip to fail to meet the expected usage standards.

[0004] Faced with this situation, if these glass substrate chips containing microcracks are directly discarded, it will undoubtedly cause a huge waste of resources.

[0005] There is currently no effective technical solution to the above problems. Summary of the invention

[0006] The purpose of the present application is to provide a micro-crack repair method, a glass substrate and a chip assembly after glass substrate packaging, so as to repair micro-cracks on the edge of the glass substrate chip caused by cutting and avoid wasting resources.

[0007] In a first aspect, the present application provides a microcrack repair method, which is applied to a glass substrate chip, and the method comprises the steps of: S1, obtaining a glass substrate chip obtained through singulation processing; S2, sequentially coating reinforcing materials around the glass substrate chip; S3, baking the glass substrate chip to use the solidified reinforcement material to repair micro cracks formed on the glass substrate chip during the singulation process.

[0008] The microcrack repair method of the present application repairs microcracks at the edge of the glass substrate chip by combining coating of reinforcement material and baking treatment, effectively solving the problem of edge microcracks of the glass substrate chip caused by cutting stress during the singulation process, significantly improving the structural integrity and mechanical strength of the chip, and avoiding waste of resources.

[0009] In the micro-crack repairing method, step S2 is to simultaneously coat a plurality of stacked glass substrate chips with a reinforcing material.

[0010] The micro-crack repair method of the present application can effectively reduce the time and operation steps of processing a single chip one by one by simultaneously coating a plurality of stacked glass substrate chips with reinforcing materials, thereby improving the overall production efficiency, significantly improving the repair efficiency, and improving the consistency of glass substrate chip products. This method is particularly suitable for large-scale production environments, helping to reduce costs and increase production capacity.

[0011] In the micro-crack repairing method, the stacked glass substrate chips are arranged at intervals.

[0012] The micro-crack repair method of the present application arranges multiple glass substrate chips into a stacked state with intervals and then applies the reinforcing material, which can ensure that each glass substrate chip can evenly contact the material when applying the reinforcing material, and avoids direct contact between chips, reducing possible damage and uneven coating problems, and also avoids the problem of glass substrate chips sticking together during subsequent baking and curing.

[0013] The microcrack repairing method further includes the following steps between step S1 and step S2: SA, the glass substrate chip is cleaned, dried and subjected to anti-static treatment in sequence.

[0014] The microcrack repairing method, wherein step S2 comprises: S21, preparing a reinforcement material solution; S22, placing the glass substrate chip on its side, so that each side thereof is immersed in the reinforcing material solution in turn.

[0015] In the microcrack repair method, the reinforcing material solution is PI solution, bottom filling glue, glass glue, epoxy resin solution, liquid silicone or phenolic resin solution.

[0016] The microcrack repair method, wherein the preparation process of the PI solution comprises: Adding polyamic acid powder into a pre-prepared polar solvent and stirring the mixture sufficiently with a stirrer to obtain a mixed solution; The mixed solution is filtered and degassed to obtain the PI solution.

[0017] The microcrack repairing method further includes the following steps between step S2 and step S3: SB, pre-baking the glass substrate chip, the pre-baking process comprising: The glass substrate chip is subjected to a first stage of pre-baking treatment, the pre-baking temperature is 100° C., and the pre-baking time is 20-40 minutes; The glass substrate chip is subjected to a second stage of pre-baking treatment, the pre-baking temperature is 150° C., and the pre-baking time is 30-50 minutes.

[0018] In a second aspect, the present application further provides a glass substrate for use in a glass substrate chip, wherein the glass substrate chip is repaired for microcracks based on the microcrack repair method provided in the first aspect.

[0019] After the glass substrate chip made of the glass substrate of the present application is repaired based on the micro-crack repair method, a PI film is formed on all sides that is in close contact with the edge. The PI film can reinforce the edge of the glass substrate chip and penetrate into and fill the micro-cracks to eliminate the micro-cracks, effectively solving the problem of edge micro-cracks caused by cutting stress in the singulation process of the glass substrate chip, significantly improving the structural integrity and mechanical strength of the chip, and avoiding waste of resources.

[0020] In a third aspect, the present application further provides a glass substrate packaged chip assembly, wherein the glass substrate packaged chip assembly comprises a glass substrate chip, and the glass substrate chip is repaired for microcracks based on the microcrack repair method provided in the first aspect.

[0021] In summary, the present application provides a microcrack repair method, a glass substrate, and a chip assembly after glass substrate packaging, wherein the microcrack repair method repairs the microcracks at the edge of the glass substrate chip by combining coating of reinforcement material and baking treatment, effectively solving the problem of edge microcracks of the glass substrate chip caused by cutting stress during the singulation process, significantly improving the structural integrity and mechanical strength of the chip, and avoiding waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A flow chart of a microcrack repair method provided in some embodiments of the present application.

[0023] Figure 2 A flow chart of a microcrack repair method provided in another embodiment of the present application.

[0024] Figure 3 A flow chart of a microcrack repair method provided for some further embodiments of the present application. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0029] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0030] First, please refer to Figure 1-Figure 3 Some embodiments of the present application provide a microcrack repair method, which is applied to a glass substrate chip. The method comprises the steps of: S1, obtaining a glass substrate chip obtained through singulation processing; S2, coating reinforcing materials around the glass substrate chip in sequence; S3, baking the glass substrate chip to use the solidified reinforcement material to repair micro cracks formed on the glass substrate chip during the singulation process.

[0031] Specifically, a glass substrate chip is a semiconductor chip with a glass substrate. After the entire panel is packaged, the glass substrate chip generally needs to be singulated to obtain multiple glass substrate chips. The singulation process is generally performed by laser cutting, mechanical cutting, or wire cutting. These cutting processes will cause the edges of the glass substrate chip to produce tiny cracks of varying degrees. The micro-crack repair method of the embodiment of the present application aims to perform a simplified reinforcement process on the edge of the glass substrate chip to repair the micro-cracks of the glass substrate chip and enhance the protection of the edge of the glass substrate chip, thereby improving the mechanical strength and electrical performance of the glass substrate chip and avoiding waste of resources.

[0032] More specifically, step S2 sequentially coats reinforcing materials around the glass substrate chip, and the reinforcing materials can be used to effectively fill and cover microcracks, thereby enhancing the structural integrity of the chip; step S3 bakes the glass substrate chip coated with the reinforcing material to further repair the microcracks using the heat-cured reinforcing material, and uses the cured reinforcing material to provide protection for the edge of the glass substrate chip, thereby effectively repairing the microcracks generated during the cutting process, and improving the mechanical strength and electrical performance of the chip, thereby avoiding waste of resources.

[0033] In the specific implementation process, the microcrack repair method of the embodiment of the present application can adjust the parameters such as the type of reinforcing material, coating method, baking temperature and duration according to actual needs. For example, different reinforcing materials can be selected, such as epoxy resin, silicone, etc.; the coating method can be spraying, brushing, etc.; the baking temperature and duration can be optimized according to the characteristics of the reinforcing material. These variants and embodiments further enrich the technical solution of the present application and enhance its applicability and flexibility.

[0034] More specifically, the reinforcement material can be a material based on resin, PI or ABF, which has good buffering performance and elasticity, can well cover the edge of the glass substrate chip and fill and repair microcracks; among them, ABF (Ajinomoto Build-up Film) is a high-performance insulating material with excellent heat resistance and mechanical strength. PI (polyimide) has excellent high temperature resistance and chemical stability; resin materials have good fluidity and filling properties, and can well fill microcracks.

[0035] The micro-crack repair method of the embodiment of the present application repairs the micro-cracks at the edge of the glass substrate chip by combining coating of reinforcement material and baking treatment, effectively solving the problem of edge micro-cracks of the glass substrate chip caused by cutting stress during the singulation process, significantly improving the structural integrity and mechanical strength of the chip, and avoiding waste of resources.

[0036] In some preferred embodiments, step S2 is to simultaneously coat a plurality of stacked glass substrate chips with a reinforcing material.

[0037] Specifically, the microcrack repair method of the embodiment of the present application can effectively reduce the time and operation steps of processing a single chip one by one by simultaneously coating a plurality of stacked glass substrate chips with a reinforcing material, thereby improving the overall production efficiency, significantly improving the repair efficiency, and improving the consistency of glass substrate chip products. This method is particularly suitable for large-scale production environments, helping to reduce costs and increase production capacity.

[0038] It should be noted that step S3 can be performed on the glass substrate chips in a stacked state, or can be performed on the glass substrate chips after being split and laid flat.

[0039] In some preferred embodiments, the stacked glass substrate chips are arranged at intervals.

[0040] Specifically, a plurality of glass substrate chips can be arranged at intervals by providing a spacer or a prefabricated mold including a plurality of spacing grooves, so that the plurality of glass substrate chips are aligned and stacked without contacting each other.

[0041] It should be noted that the edges of each layer of the stacked glass substrate chips need to be aligned to ensure the uniformity and consistency of the subsequently coated reinforcement materials; in actual operation, after multiple glass substrate chips are stacked and arranged at intervals, alignment detection can be performed through an additionally configured edge alignment detection component, such as a camera or an ultrasonic ranging sensor.

[0042] More specifically, the micro-crack repair method of the embodiment of the present application arranges multiple glass substrate chips into a stacked state with intervals and then applies the reinforcement material, which can ensure that each glass substrate chip can evenly contact the material when the reinforcement material is applied, and avoid direct contact between chips, reducing possible damage and uneven coating problems, and also avoiding the problem of adhesion of glass substrate chips during subsequent baking and curing.

[0043] More specifically, in an implementation method in which a prefabricated mold including a plurality of spacing grooves is used to achieve the spaced arrangement of glass substrate chips, a plurality of glass substrate chips are placed in the spacing grooves of the prefabricated mold in sequence, and then the glass substrate chips are locked by the prefabricated mold to achieve the spaced stacking of the glass substrate chips, thereby ensuring that a certain spacing is maintained between each glass substrate chip and the edges are aligned, and then the glass substrate chip on the prefabricated mold is coated on one edge, and then the position of the glass substrate chip on the prefabricated mold is adjusted so as to perform coating on the next side edge, and this is repeated to achieve coating on all sides; in some other implementation methods, in order to avoid the reinforcement material from sticking to the prefabricated mold and affecting the coating effect, a pre-bake may be performed after each coating on one side edge is completed to preliminarily solidify the reinforcement material on the side edge of the glass substrate chip.

[0044] In some preferred embodiments, Figure 2 As shown, the steps between step S1 and step S2 also include the following steps: SA, the glass substrate chip is cleaned, dried and destaticized in sequence.

[0045] Specifically, the cleaning, drying and anti-static treatment steps play an important role in the process of repairing microcracks. Cleaning can remove impurities and contaminants on the surface of the glass substrate chip to ensure the coating effect of the subsequent reinforcement material. The drying step can remove moisture from the surface of the glass substrate chip to prevent the reinforcement material from reacting adversely with moisture. Anti-static treatment can prevent static electricity from damaging the chip and ensure the stability of the glass substrate chip in subsequent processing. These steps work together to effectively improve the adhesion and repair effect of the reinforcement material on the edge of the glass substrate chip, thereby better repairing the microcracks generated during the cutting process and improving the quality and reliability of the glass substrate chip.

[0046] In some preferred embodiments, in step S3, the baking temperature is 250-350° C., and the baking time is 15-60 minutes.

[0047] Specifically, the setting of baking temperature and duration plays a key role in repairing microcracks. Appropriate temperature and time can ensure that the reinforcing material is fully solidified, thereby effectively filling and repairing the microcracks generated in the glass substrate chip during the cutting process, and improving the structural integrity and reliability of the chip.

[0048] More specifically, the microcrack repair method of the embodiment of the present application sets the baking temperature to 250-350°C and the baking time to 15-60 minutes, which can fully solidify the reinforcing material, thereby effectively repairing the microcracks and enhancing the structural integrity and mechanical strength of the chip.

[0049] In some preferred embodiments, step S2 comprises: S21, preparing a reinforcement material solution; S22, placing the glass substrate chip on its side, so that each side thereof is immersed in the reinforcing material solution in turn.

[0050] Specifically, the micro-crack repair method of the embodiment of the present application places the glass substrate chips on their side and immerses the sides of these glass substrate chips in the reinforcement material solution in turn, which can ensure that the reinforcement material can evenly cover and penetrate into each side of the chip, thereby effectively repairing the micro-cracks caused by the cutting process; in addition, placing the glass substrate chips on their side can allow the edges to be immersed in the reinforcement material solution in a manner parallel to the liquid surface of the reinforcement material solution, ensuring that the wetting effect is consistent at all parts of the edge, thereby enhancing the repair and reinforcement effect.

[0051] More specifically, in step S22, only one side edge of the glass substrate chip is immersed in the reinforcement material solution each time to avoid the reinforcement material solution covering the top and bottom surfaces of the glass substrate chip; after completing the coating process of one side edge of the glass substrate chip, the glass substrate chip can be lifted and rotated 90° to coat the next side edge.

[0052] In some preferred embodiments, in step S22, after each side of the glass substrate chip is immersed in the reinforcing material solution, it is kept still for 0.5-1 minute.

[0053] Specifically, after the edge of the glass substrate chip is immersed in the reinforcement material solution, the immersion state is maintained for 0.5-1 minute, which can ensure that the reinforcement material repeatedly penetrates into the microcracks to fully fill the microcracks and enhance the repair and reinforcement effect.

[0054] In some other implementations, step S2 may be to coat the reinforcing material around the glass substrate chip by coating.

[0055] Specifically, the coating process can accurately control the coverage thickness of the reinforcing material and can more effectively improve the consistency of the glass substrate chip.

[0056] In some more preferred embodiments, step S2 further includes the following steps performed after step S22: S23, flattening the edge of the glass substrate chip.

[0057] Specifically, the planarization treatment can be performed by spin coating, coating, etc., to planarize the reinforcing material covered on the edge of the glass substrate chip by immersion, so as to control the thickness of the reinforcing material and to allow the reinforcing material to fill the microcracks more fully through the extrusion force generated by the coating.

[0058] In some preferred embodiments, the reinforcing material solution is PI solution, bottom filling glue, glass glue, epoxy resin solution, liquid silicone or phenolic resin solution.

[0059] Specifically, in the embodiment of the present application, the reinforcing material solution is preferably a PI solution. As a reinforcing material solution, the PI solution has excellent mechanical strength and thermal stability, and can effectively fill and repair microcracks generated in the glass substrate chip during the cutting process. The microcrack repair method of the embodiment of the present application uses the PI solution, which can be solidified in the subsequent baking process, thereby enhancing the structural strength of the chip, preventing the expansion of microcracks, and improving the reliability and service life of the chip.

[0060] More specifically, in this embodiment, the baking temperature in step S3 is further preferably 250-300° C., and the baking time is 30-60 minutes.

[0061] In some preferred embodiments, the preparation process of the PI solution includes: S211, adding polyamic acid powder to a pre-prepared polar solvent, and stirring the mixture thoroughly with a stirrer to obtain a mixed solution; S212, filtering and degassing the mixed solution to obtain a PI solution.

[0062] Specifically, the present application ensures that the polyamic acid powder is evenly dispersed in the solvent by adding the polyamic acid powder into a polar solvent and stirring the mixture sufficiently to form a uniform mixed solution. The impurities in the mixed solution can be removed by filtering the mixed solution to ensure the purity of the solution. The degassing treatment can remove the bubbles in the solution to prevent the appearance of bubbles in the subsequent use process from affecting the repair effect.

[0063] More specifically, in the specific implementation process, step S211 includes: first, adding the polyamic acid powder into a pre-prepared polar solvent in proportion. Commonly used polar solvents include N-methylpyrrolidone (NMP), dimethylacetamide (DMAc), etc. After adding the powder, use a high-speed stirrer to fully stir it. The stirring time is usually 30 minutes to 2 hours to ensure that the polyamic acid powder is completely dissolved and evenly dispersed in the solvent to form a uniform mixed solution.

[0064] More specifically, the filtration treatment in step S212 can use a microporous filter membrane or other suitable filtration device to remove insoluble impurities in the solution to ensure the purity of the solution, and the degassing treatment can use a vacuum degassing method to place the solution in a vacuum environment for a period of time to remove bubbles in the solution.

[0065] More specifically, the PI solution prepared by the above steps has high purity and uniformity, and can be effectively used to repair micro cracks formed in the glass substrate chip during the singulation process.

[0066] In some preferred embodiments, Figure 3 As shown, the steps between step S2 and step S3 also include the following steps: SB, pre-bake the glass substrate chip, the pre-bake process includes: SB1. Perform the first stage of pre-baking treatment on the glass substrate chip, the pre-baking temperature is 100° C., and the pre-baking time is 20-40 minutes; SB2. Perform a second stage of pre-baking treatment on the glass substrate chip, the pre-baking temperature is 150° C., and the pre-baking time is 30-50 minutes.

[0067] Specifically, in this embodiment, the first stage of pre-baking can preliminarily remove moisture and volatile substances on the surface of the glass substrate chip to prevent bubbles or other defects from occurring during the subsequent high-temperature baking process. The second stage of pre-baking further removes residual moisture and volatile substances and preliminarily solidifies the reinforcing material to enhance its adhesion to the chip surface.

[0068] More specifically, the microcrack repair method of the embodiment of the present application can provide better conditions for subsequent high-temperature baking through these two stages of pre-baking treatment, ensuring that the reinforcement material can be fully cured, thereby effectively repairing the microcracks generated during the cutting process and improving the reliability and service life of the chip.

[0069] In a second aspect, some embodiments of the present application further provide a glass substrate for use in a glass substrate chip, wherein the glass substrate chip is repaired for microcracks based on the microcrack repair method provided in the first aspect.

[0070] Specifically, the present application also proposes a glass substrate chip, which has a glass substrate and is repaired through the microcrack repair method provided in the first aspect. After the glass substrate chip is repaired, a PI film is formed on all sides that is in close contact with the edge. The PI film can reinforce the edge of the glass substrate chip and penetrate into and fill the microcracks to eliminate the microcracks.

[0071] After the glass substrate chip made of the glass substrate in the embodiment of the present application is repaired based on the micro-crack repair method, a PI film is formed on all sides that is in close contact with the edge. The PI film can reinforce the edge of the glass substrate chip and penetrate into and fill the micro-cracks to eliminate the micro-cracks, effectively solving the problem of edge micro-cracks of the glass substrate chip caused by cutting stress during the singulation process, significantly improving the structural integrity and mechanical strength of the chip, and avoiding waste of resources.

[0072] In a third aspect, some embodiments of the present application further provide a glass substrate packaged chip assembly, the glass substrate packaged chip assembly comprising a glass substrate chip, wherein the glass substrate chip is repaired for microcracks based on the microcrack repair method provided in the first aspect.

[0073] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0074] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A microcrack repair method, applied in a glass substrate chip, characterized in that: The method comprises the steps of: S1, obtaining a glass substrate chip obtained through singulation processing; S2, sequentially coating reinforcing materials around the glass substrate chip; S3, baking the glass substrate chip to use the solidified reinforcement material to repair micro cracks formed on the glass substrate chip during the singulation process.

2. The microcrack repairing method according to claim 1, characterized in that: Step S2 is to simultaneously coat the reinforcing material on the plurality of stacked glass substrate chips.

3. The microcrack repairing method according to claim 2, characterized in that: The stacked glass substrate chips are arranged at intervals.

4. The microcrack repairing method according to claim 1, characterized in that: The steps between step S1 and step S2 include: SA, the glass substrate chip is cleaned, dried and subjected to anti-static treatment in sequence.

5. The microcrack repairing method according to claim 1, characterized in that: Step S2 includes: S21, preparing a reinforcement material solution; S22, placing the glass substrate chip on its side, so that each side edge thereof is immersed in the reinforcing material solution in turn.

6. The microcrack repairing method according to claim 5, characterized in that: The reinforcing material solution is PI solution, bottom filling glue, glass glue, epoxy resin solution, liquid silica gel or phenolic resin solution.

7. The microcrack repairing method according to claim 6, characterized in that: The preparation process of the PI solution includes: Adding polyamic acid powder into a pre-prepared polar solvent and stirring the mixture sufficiently with a stirrer to obtain a mixed solution; The mixed solution is filtered and degassed to obtain the PI solution.

8. The microcrack repairing method according to claim 1, characterized in that: The steps between step S2 and step S3 include: SB, pre-baking the glass substrate chip, the pre-baking process comprising: The glass substrate chip is subjected to a first stage of pre-baking treatment, the pre-baking temperature is 100° C., and the pre-baking time is 20-40 minutes; The glass substrate chip is subjected to a second stage of pre-baking treatment, the pre-baking temperature is 150° C., and the pre-baking time is 30-50 minutes.

9. A glass substrate, used in a glass substrate chip, characterized in that: The glass substrate chip is repaired by microcracks based on the microcrack repair method according to any one of claims 1 to 8.

10. A chip assembly encapsulated by a glass substrate, characterized in that: The chip assembly after glass substrate packaging comprises a glass substrate chip, and the glass substrate chip is repaired for microcracks based on the microcrack repairing method according to any one of claims 1 to 8.

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