Wafer heating device with uniform heating

Abstract

A rotating disc is rotatably connected to the middle of the side wall of the top in a heating box, through holes are evenly formed in the side wall of the bottom of the rotating disc in a penetrating mode, the rotating disc is of a hollow structure, a cross is rotatably connected to the middle of the side wall of the bottom in the heating box, and fixing columns are detachably connected to the four ends of the cross. The heating device has the following advantages that the resistance heating discs are evenly distributed on the rotating disc, all the resistance heating discs are of a staggered double-ring structure, in this way, it can be guaranteed that heating points are evenly distributed, and when necessary, the driver is started to drive the gear to drive the rotating disc to rotate; double circles of heating points are continuously in a linear state through the rotating disc rotating at a high speed, so that radiated heat is uniformly distributed in the heating box, finally, the heat can be uniformly radiated to a wafer, the effect of comprehensively and synchronously heating the wafer can be realized, and the wafer is prevented from being damaged due to non-uniform heating.

Description

Technical Field

[0001] The invention relates to the technical field of heating equipment, and in particular to a wafer heating device with uniform heating. Background Art

[0002] Wafers are the main carrier for the production of new products. Chip circuits are made on wafers through photolithography machines, and then the chips are cut from the wafers. This is also the current main production process of chips. Therefore, the quality requirements for wafers are very high. Wafers need to go through many processes to meet the needs of chip production.

[0003] Wafers need to be heated during the production process, and they need to be heated to the required temperature in a very short time to improve the quality of the wafers. Although current heating devices have many heating methods, there is still a problem with heating uniformity. If the wafers are heated unevenly, it will cause problems in their heat treatment and even cause damage to the wafers. Therefore, a wafer heating device with uniform heating is proposed. Summary of the invention

[0004] The technical solution adopted by the present invention to solve the technical problem is: a uniformly heated wafer heating device, including a heating box, a rotating disk is rotatably connected to the middle of the top side wall of the heating box, the bottom side wall of the rotating disk is evenly penetrated with through holes, the rotating disk is a hollow structure, a cross is rotatably connected to the middle of the bottom side wall of the heating box, the four ends of the cross are detachably connected to fixed columns, and the bottom side wall of the heating box is inlaid with a reflective plate.

[0005] As a preferred technical solution of the present invention, a non-slip suction cup is fixedly connected to the top of the fixed column, a wafer is adsorbed and placed on the top of the non-slip suction cup, a motor box is detachably connected to the middle of the bottom side wall of the heating box, a motor is detachably connected to the motor box, and the output end of the motor extends into the heating box and is detachably connected to the middle of the bottom of the cross.

[0006] As a preferred technical solution of the present invention, the top outer wall of the heating box is detachably connected to a drive box, and a driver is connected inside the drive box, and the output end of the driver is detachably connected to a gear through the side wall of the drive box, and one side of the gear extends into the heating box.

[0007] As a preferred technical solution of the present invention, a gear ring is fixedly connected to the middle of the outer side wall of the rotating disk, and tooth grooves are evenly opened on the top side wall of the gear ring. The gear is meshed and connected with the tooth grooves through one side extending into the heating box.

[0008] As a preferred technical solution of the present invention, the rotating disk is evenly provided with the same number of resistance heating disks as the through holes, the resistance heating disks are detachably embedded in the through holes, the middle of the top side wall of the resistance heating disk is electrically connected with a power-carrying coil, the top side wall of the rotating disk is fixedly connected with an insulating layer, the middle of the rotating disk is connected with an electric wire, and the two ends of the electric wire pass through the top side wall of the heating box to be connected with a power source and the power-carrying coil respectively.

[0009] The present invention has the following advantages: the traditional integral resistance heating component is divided into multiple independent resistance heating disks, and the resistance heating disks are evenly distributed on the rotating disk. All the resistance heating disks are in an interlaced double-circle structure, which can ensure the uniform distribution of heating points. When necessary, the driver is started to drive the gear to drive the rotating disk to rotate, and the double-circle heating points are connected into a linear state through the high-speed rotating rotating disk, so that the radiated heat is evenly distributed in the heating box. Although it is a double-circle structure, the heat generated by the resistance heating disks with the same amount of current is also the same, and the heat will radiate, and finally the heat can be evenly radiated to the wafer, so that the effect of comprehensive and synchronous heating of the wafer can be achieved, avoiding damage to the wafer due to uneven heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the three-dimensional structure of a preferred embodiment of the present invention;

[0011] Figure 2 It is a bottom-up stereoscopic structural schematic diagram of a preferred embodiment of the present invention;

[0012] Figure 3 It is a schematic diagram of the exploded three-dimensional structure of a preferred embodiment of the present invention.

[0013] Explanation of the accompanying drawings: 1. Heating box; 2. Reflection plate; 3. Cross; 4. Fixing column; 5. Anti-slip suction cup; 6. Motor box; 7. Drive box; 8. Gear; 9. Heating plate; 10. Through hole; 11. Gear ring; 12. Power coil; 13. Insulation layer; 14. Resistance heating plate. DETAILED DESCRIPTION

[0014] The present invention will be further described below in conjunction with the accompanying drawings.

[0015] Please refer to Figure 1-3The present invention discloses a uniformly heated wafer heating device, comprising a heating box 1, a rotating disk 9 is rotatably connected to the middle of the top side wall of the heating box 1, and a through hole 10 is evenly penetrated through the bottom side wall of the rotating disk 9. The rotating disk 9 is a hollow structure, a cross 3 is rotatably connected to the middle of the bottom side wall of the heating box 1, and the four ends of the cross 3 are detachably connected to fixed columns 4. A reflecting plate 2 is inlaid on the bottom side wall of the heating box 1, and a non-slip suction cup 5 is fixedly connected to the top of the fixed column 4, and a wafer is adsorbed and placed on the top of the non-slip suction cup 5. A motor box 6 is detachably connected to the middle of the bottom side wall of the heating box 1, and a motor is detachably connected in the motor box 6, and the output end of the motor extends into the heating box 1 and is detachably connected to the middle of the bottom of the cross 3.

[0016] The technical effect of this scheme is as follows: the resistance heating disk 14 is energized through the electric wire and the energized coil 12 to start preheating. When the temperature inside the heating box 1 reaches a constant state, the wafer is placed in the heating box 1, and the heat generated by the resistance heating disk 14 is radiated to the wafer to heat the wafer, thereby performing heat treatment on the wafer. Because the rotating disk 9 can rotate and the resistance heating disk 14 is evenly distributed on the rotating disk 9, it is possible to ensure that the heat is evenly radiated and finally acts on the wafer. At the same time, a reflective plate 2 is laid on the bottom side wall of the heating box 1 to reflect heat, so that the back side of the wafer can be heated synchronously to ensure that both sides of the wafer are heated at the same time, thereby ensuring the effect of comprehensive heat treatment and avoiding damage to the wafer due to uneven heating.

[0017] The top outer wall of the heating box 1 is detachably connected to a driving box 7, and a driver is connected inside the driving box 7, and the output end of the driver is detachably connected to a gear 8 through the side wall of the driving box 7, one side of the gear 8 extends into the heating box 1, and a gear ring 11 is fixedly connected to the middle of the outer side wall of the rotating disk 9, and tooth grooves are evenly opened on the top side wall of the gear ring 11. The gear 8 is meshed and connected with the tooth grooves through one side thereof extending into the heating box 1, and the rotating disk 9 is evenly provided with resistance heating disks 14 of the same number as the through holes 10, and the resistance heating disks 14 are detachably embedded in the through holes 10, and the middle of the top side wall of the resistance heating disk 14 is electrically connected to a power-carrying coil 12, and an insulating layer 13 is fixedly connected to the top side wall of the rotating disk 9, and an electric wire is inserted and connected in the middle of the rotating disk 9, and the two ends of the electric wire respectively pass through the top side wall of the heating box 1 to be connected to the power supply and the power-carrying coil 12.

[0018] The technical effect of this solution is: the wafer can be driven to rotate by the motor, and the rotation direction is opposite to the rotating disk 9, which can further ensure that the heat is evenly radiated to the wafer, improve the heating efficiency, and ensure the uniform heating function of the wafer in the rotating state, thereby improving the heat treatment effect and reducing the scrap rate.

[0019] Specifically, when the present invention is used, the wafer to be processed is placed in the preheated heating box 1, and then the motor and the driver are started to drive the wafer and the rotating disk 9 to rotate, and at the same time, the resistance heating disk 14 is continuously powered to increase the heating rate of the resistance heating disk 14. As the temperature rises, the high temperature acts on the wafer through radiation, so that the wafer is heat-treated. The radiated heat will irradiate the reflective plate 2, and the heat can be reflected by the reflective plate 2, and the reflected heat will act on the bottom of the wafer, so that the effect of synchronous and uniform heating of both sides of the wafer can be achieved, thereby avoiding damage to the wafer due to uneven heating, and improving the yield of the heat treatment. After the treatment is completed, the wafer can be taken out and put in the next wafer.

[0020] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

[0021] Other parts of the present invention not described in detail belong to the prior art and will not be described in detail here.

[0022] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer heating device with uniform heating, comprising a heating box (1), characterized in that: A rotating disk (9) is rotatably connected in the middle of the top side wall of the heating box (1), and through holes (10) are evenly opened on the bottom side wall of the rotating disk (9). The rotating disk (9) is a hollow structure. A cross (3) is rotatably connected in the middle of the bottom side wall of the heating box (1), and the four ends of the cross (3) are detachably connected to fixed columns (4). A reflective plate (2) is inlaid on the bottom side wall of the heating box (1).

2. A uniformly heated wafer heating device as claimed in claim 1, characterized in that: The top of the fixed column (4) is fixedly connected to an anti-skid suction cup (5), and a wafer is placed on the top of the anti-skid suction cup (5). A motor box (6) is detachably connected to the middle of the bottom side wall of the heating box (1), and a motor is detachably connected to the motor box (6), and the output end of the motor extends into the heating box (1) and is detachably connected to the middle of the bottom of the cross (3).

3. The uniformly heated wafer heating device according to claim 1, characterized in that: The top outer wall of the heating box (1) is detachably connected to a drive box (7), and a driver is connected inside the drive box (7), and the output end of the driver is detachably connected to a gear (8) through the side wall of the drive box (7), and one side of the gear (8) extends into the heating box (1).

4. The uniformly heated wafer heating device according to claim 3, characterized in that: A gear ring (11) is fixedly connected in the middle of the outer wall of the rotating disk (9), and tooth grooves are evenly formed on the top side wall of the gear ring (11). The gear (8) is meshed and connected with the tooth grooves through one side thereof extending into the heating box (1).

5. The uniformly heated wafer heating device according to claim 1, characterized in that: The rotating disk (9) is evenly provided with the same number of resistance heating disks (14) as the through holes (10); the resistance heating disks (14) are detachably embedded in the through holes (10); the middle of the top side wall of the resistance heating disk (14) is electrically connected to a power coil (12); the top side wall of the rotating disk (9) is fixedly connected to an insulating layer (13); an electric wire is inserted in the middle of the rotating disk (9), and the two ends of the electric wire pass through the top side wall of the heating box (1) to be connected to a power source and to the power coil (12).

Images