Electric auxiliary stripping device and method for cable semiconductor layer

Abstract

The invention discloses an electric auxiliary stripping device and method for a cable semiconductor layer. The device comprises a device body, a cutting mechanism, a heating unit and a display unit. The cutting mechanism comprises a sliding rail, a first motor, a second motor, a lifting screw rod, a heating rod and a tool bit; the sliding rail is movably arranged in the device body, and the first motor can drive the lifting screw to rotate and lift so as to push the sliding rail to slide up and down relative to the device body; a cable containing part is arranged on the lower portion of the device body, and the sliding rail can drive the tool bit to ascend and descend in the cable containing part. The second motor is connected with the tool bit and can drive the tool bit to rotate relative to the heating rod; the heating unit comprises a first hot air assembly and a second hot air assembly which are arranged on the two sides of the cutting mechanism correspondingly. The display unit comprises a camera and a display screen which are in signal connection; the camera faces the tool bit; according to the device, the stripping efficiency is improved, the construction progress can be quickly accelerated, the cutting precision is also improved, and the damage to an insulating layer is reduced.

Description

Technical Field

[0001] The invention relates to the field of electrical engineering construction tools, and in particular to an electrically assisted stripping device and method for a cable semiconductor layer. Background Art

[0002] During the installation of cable lines, the production of cable terminals and cable intermediate joints is an indispensable process. The production process requirements for cable terminals and cable intermediate joints are very strict. Since the semiconductor layer is very tightly combined with the main insulation of the cable, it is particularly difficult to strip the semiconductor layer, and a lot of time is needed in this process. Therefore, the stripping of the semiconductor layer is the process that has the greatest impact on construction quality, construction period, and safety; in winter, due to the influence of low temperatures, the hardness of the cable increases, and the operation of stripping the semiconductor layer is more difficult. Improper handling of the semiconductor layer of the high-voltage cable will cause uneven distribution of the cable electric field, partial discharge, single-phase grounding or phase-to-phase insulation breakdown short circuit faults, seriously affecting the safety and reliability of power supply. Summary of the invention

[0003] In order to enrich the product types of cable semiconductor layer stripping devices, increase the selection space of cable semiconductor layer stripping methods, and improve the efficiency of cable semiconductor layer stripping, the present invention provides a cable semiconductor layer electric-assisted stripping device and method.

[0004] In a first aspect, an embodiment of the present invention provides an electrically assisted stripping device for a cable semiconductor layer, comprising a device body, a cutting mechanism, a heating unit and a display unit;

[0005] The cutting mechanism comprises a slide rail, a first motor, a second motor, a lifting screw, a heating rod and a cutter head;

[0006] The first motor, the lifting screw, the heating rod and the cutter head are connected in sequence from top to bottom; the slide rail is arranged on the side of the lifting screw and the heating rod, and is fixedly connected to the lifting screw; the slide rail is movably arranged in the device body, and the first motor can drive the lifting screw to rotate and lift, so as to push the slide rail to slide up and down relative to the device body;

[0007] A cable accommodating portion is provided at the lower part of the device body, and the slide rail can drive the cutter head to rise and fall in the cable accommodating portion;

[0008] The second motor is connected to the cutter head, and the second motor can drive the cutter head to rotate relative to the heating rod;

[0009] The heating unit comprises a first hot air component and a second hot air component respectively arranged on both sides of the cutting mechanism; the first hot air component and the second hot air component are arranged above the cable accommodating portion and can provide hot air to the cable accommodating portion;

[0010] The display unit includes a signal-connected camera and a display screen; the display screen is arranged on the top of the device body; the camera is arranged above the cable accommodating portion and faces the cutter head.

[0011] In one or some optional embodiments, the cutting mechanism further includes a cutter head lifting and lowering adjustment switch;

[0012] The blade lifting and lowering adjustment switch is arranged on the device body and connected to the first motor;

[0013] The blade lifting adjustment switch can control the blade to rise and fall in the cable accommodating portion.

[0014] In one or some optional embodiments, the cutting mechanism further includes a cutter head temperature adjustment switch;

[0015] The blade temperature regulating switch is arranged on the device body and connected to the heating rod;

[0016] The cutter head temperature regulating switch can control the temperature of the cutter head.

[0017] In one or some optional embodiments, the cutting mechanism further includes a cutter head direction adjustment switch;

[0018] The blade direction switch is arranged on the device body and connected to the second motor;

[0019] The cutter head direction switch can control the direction of the cutter head.

[0020] In one or some optional embodiments, the cable semiconductor layer electrically assisted stripping device further comprises a cable positioning structure;

[0021] The cable positioning structure comprises at least two rolling steel balls arranged on both sides of the cable accommodating portion;

[0022] When the cable is accommodated in the cable accommodating portion, the at least two rolling steel balls can abut against the cable.

[0023] In one or some optional embodiments, the rolling steel ball can be slidably adjusted along the side wall of the cable accommodating portion.

[0024] In one or some optional embodiments, the cable positioning structure includes four rolling steel balls evenly distributed on both sides of the cable accommodating portion.

[0025] In one or some optional embodiments, the first hot air assembly includes a first fan and a first heating wire disposed on the device body up and down, and the first fan faces the cable accommodating portion;

[0026] A first air inlet is arranged on the side of the first hot air component.

[0027] In one or some optional embodiments, the second hot air assembly includes a second fan and a second heating wire disposed above and below the device body, and the second fan faces the cable accommodating portion;

[0028] A second air inlet is arranged on the side of the second hot air component.

[0029] In one or some optional embodiments, the heating unit further includes an electric hot air adjustment switch;

[0030] The electric hot air regulating switch is arranged on the device body and is connected to the first hot air component and the second hot air component respectively;

[0031] The electric hot air regulating switch can control the wind speed and hot air temperature of the first hot air component;

[0032] The electric hot air regulating switch can control the wind speed and hot air temperature of the second hot air component.

[0033] In one or some optional embodiments, the outer wall of the heating rod is covered with an insulating layer.

[0034] In one or some optional embodiments, the device body is provided with a battery compartment;

[0035] The battery compartment is used for installing batteries.

[0036] In a second aspect, an embodiment of the present invention provides a method for electrically assisted stripping of a semiconductor layer of a cable, using the electrically assisted stripping device for electrically assisted stripping of a semiconductor layer of a cable as described in the first aspect, comprising:

[0037] Accommodating the cable in the cable accommodation portion of the cable semiconductor layer electrically assisted stripping device;

[0038] Start the display unit to monitor the area where the cutter head is located in real time, and adjust the height of the cutter head relative to the cable according to the monitoring screen displayed on the display screen;

[0039] Starting the heating unit to heat and soften the cable semiconductor layer;

[0040] When the cable is circularly cut, the direction of the cutter head is adjusted to be consistent with the tangential direction of the cable, and the cable semiconductor layer electrically assisted stripping device is rotated along the cable to circularly cut the cable semiconductor layer;

[0041] When longitudinal cutting is performed on the cable, after the direction of the cutter head is adjusted to be consistent with the axial direction of the cable, the cable semiconductor layer electrically assisted stripping device is slid along the cable to longitudinally cut the cable semiconductor layer.

[0042] The beneficial effects of the above technical solution provided in the embodiments of the present invention include at least:

[0043] The electrically assisted stripping device for the semiconductor layer of a cable provided in an embodiment of the present invention can visualize the cutting process through a display unit when cutting the semiconductor layer of the cable, and can adjust the lifting and lowering of the cutter head through the coordinated use of a lifting screw and a slide rail. The cutter head is heated and heated by a heating rod so that the cutter head can be inserted into and cut the semiconductor layer more smoothly. The direction of the cutter head can be adjusted to switch between circular cutting and longitudinal cutting at any time. The cable in the cable accommodation portion is heated and softened by a heating unit, so that the hardness of the semiconductor layer of the cable is reduced, making it easier to cut, thereby greatly reducing the cutting time. This not only improves the stripping efficiency and is conducive to quickly advancing the construction progress, but also improves the cutting accuracy, reduces the damage to the insulation layer, avoids the occurrence of local discharge caused by uneven distribution of the cable electric field, and improves the power supply safety and reliability.

[0044] Through the coordinated use of the display unit, the heating unit and the cutting mechanism, the electrically assisted stripping device for the cable semiconductor layer can operate in a low-temperature environment, which greatly improves the adaptability of the electrically assisted stripping device for the cable semiconductor layer to operate in a field environment.

[0045] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0046] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0048] Figure 1 It is a schematic structural diagram of the electric-assisted stripping device for the semiconductor layer of a cable provided in an embodiment of the present invention;

[0049] Figure 2 It is a schematic cross-sectional structure diagram of the electric-assisted stripping device for the semiconductor layer of a cable provided in an embodiment of the present invention;

[0050] Figure 3 It is a schematic structural diagram of a cutting mechanism provided in an embodiment of the present invention;

[0051] Figure 4 It is a schematic flow chart of the electrically assisted stripping method of the cable semiconductor layer provided in an embodiment of the present invention.

[0052] In the figure:

[0053] 1 is the device body, 11 is the cable accommodating portion, 12 is the first air inlet, 13 is the second air inlet, and 14 is the battery compartment;

[0054] 2 is a cutting mechanism, 21 is a slide rail, 22 is a first motor, 23 is a lifting screw, 24 is a heating rod, 25 is a cutter head, 26 is a cutter head lifting adjustment switch, 27 is a cutter head temperature adjustment switch, 28 is a cutter head direction adjustment switch, and 29 is an insulating heat insulation layer;

[0055] 31 is a first hot air component, 311 is a first fan, 312 is a first electric heating wire, 32 is a second hot air component, 321 is a second fan, 322 is a second electric heating wire, and 33 is an electric hot air adjustment switch;

[0056] 41 is a camera, 42 is a display screen;

[0057] 51 is a rolling steel ball;

[0058] 100 is the cable. DETAILED DESCRIPTION

[0059] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0060] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", "far", "near", "front", "back" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0061] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0062] The inventors found that it takes too long to strip the semiconductor layer of a cable using existing cable stripping tools, and it takes even longer when the temperature is low, which seriously affects the production efficiency of the cable terminal and hinders the progress of electrical construction.

[0063] Based on this, an embodiment of the present invention provides an electrically assisted stripping device and method for a cable semiconductor layer, which will be described in detail below through specific embodiments.

[0064] Embodiment 1

[0065] The embodiment of the present invention provides a device for electrically assisted stripping of a semiconductor layer of a cable, referring to Figure 1-Figure 3 As shown, it includes a device body 1, a cutting mechanism 2, a heating unit and a display unit;

[0066] The cutting mechanism 2 includes a slide rail 21, a first motor 22, a second motor (not shown in the figure), a lifting screw 23, a heating rod 24 and a cutter head 25;

[0067] The first motor 22, the lifting screw 23, the heating rod 24 and the cutter head 25 are connected in sequence from top to bottom; the slide rail 21 is arranged on the side of the lifting screw 23 and the heating rod 24, and is fixedly connected to the lifting screw 23; the slide rail 21 is movably arranged in the device body 1, and the first motor 22 can drive the lifting screw 23 to rotate and rise, so as to push the slide rail 21 to slide up and down relative to the device body 1;

[0068] A cable accommodating portion 11 is provided at the lower part of the device body 1, and the cutter head 25 can slide along the slide rail 21 and rise and fall in the cable accommodating portion 11;

[0069] The second motor is connected to the cutter head 25, and the second motor can drive the cutter head 25 to rotate relative to the heating rod 24;

[0070] The heating unit includes a first hot air component 31 and a second hot air component 32 respectively arranged on both sides of the cutting mechanism 2; the first hot air component 31 and the second hot air component 32 are arranged above the cable accommodating portion 11, and can provide hot air to the cable accommodating portion 11;

[0071] The display unit includes a signal-connected camera 41 and a display screen 42 ; the display screen 42 is arranged on the top of the device body 1 ; the camera 41 is arranged above the cable accommodating portion 11 and faces the cutter head 25 ; the display screen 42 can display the monitoring screen of the camera 41 .

[0072] In the embodiment of the present invention, the display unit is used to monitor the area where the cutter head 25 is located, so as to obtain the height position, direction and actual situation of the cutter head 25 during the cutting process; the cutting mechanism 2 is used to cut the cable semiconductor layer, and can adjust the cutting depth of the cutter head 25 according to the monitoring screen of the display unit, and realize circular cutting and longitudinal cutting by adjusting the direction of the cutter head 25; the heating unit is used to heat the cable semiconductor layer with hot air, so as to reduce the hardness of the cable semiconductor layer, so that the cable semiconductor layer is easy to cut. The coordinated use of the display unit, the heating unit and the cutting mechanism 2 can improve the efficiency and accuracy of cable semiconductor stripping, reduce the operation time, and avoid the danger caused by cable damage.

[0073] In a specific embodiment, referring to Figure 1-Figure 3 As shown, the cutter head 25 extends into the cable accommodating portion 11, and the lifting screw 23 can rotate and lift under the drive of the first motor 22, and drive the slide rail 21 to slide up and down, so that the cutter head 25 can be lifted and lowered in the cable accommodating portion 11 along with the sliding of the slide rail 21, so that the height adjustment of the cutter head 25 relative to the cable 100 can be achieved when stripping the cable semiconductor layer, and further, the adjustment of the cutting depth of the cutter head 25 is achieved, thereby improving the accuracy of cutting the cable semiconductor layer. The cutting mechanism 2 also includes a cutter head lifting adjustment switch 26 arranged on the device body 1, and the cutter head lifting adjustment switch 26 is connected to the first motor 22, and controls the cutter head 25 to lift and lower in the cable accommodating portion 11 by controlling the first motor 22 to drive the lifting screw 23. In this embodiment, the blade lifting adjustment switch 26 is respectively set to three positions of high, medium and low. By adjusting the blade lifting adjustment switch 26, the height position of the blade 25 can be quickly switched, and the height of the blade 25 relative to the cable 100 can be quickly changed. Furthermore, if the three positions cannot meet the appropriate cutting depth, the lifting screw 23 can be manually rotated to adjust the position of the blade 25 to an appropriate height, so that the depth of the blade 25 inserted into the cable semiconductor layer is suitable for cutting, thereby reducing the cutting time.

[0074] Obviously, the setting method of the cutter head lifting adjustment switch 26 is not limited to the above-mentioned three positions of high, medium and low, and can also be set to more height levels or continuous height change adjustment, as long as the position of the cutter head 25 can be adjusted to a suitable cutting feed depth. For details, please refer to the detailed records of the prior art, and no limitation is made here.

[0075] In the embodiment of the present invention, referring to Figure 2 and Figure 3 As shown, the cable accommodating portion 11 is a half-enclosed structure, which can accommodate cables of different specifications. The cutter head 25 can adapt to cables of different specifications by adjusting the height, thereby improving the adaptability of the cable semiconductor layer electrically assisted stripping device to cables of different specifications.

[0076] In a specific embodiment, referring to Figure 1-Figure 3As shown, the cutter head 25 is connected to the heating rod 24. After the heating rod 24 is powered on and heated, the heat is transferred to the cutter head 25, so that the temperature of the cutter head 25 increases. When the cutter head 25 contacts the cable semiconductor layer, it can heat and soften the cable semiconductor layer, so that it can be inserted and cut more smoothly, reducing the cutting time and improving the stripping efficiency. The cutting mechanism 2 also includes a cutter head temperature adjustment switch 27 arranged on the device body 1. The cutter head temperature adjustment switch 27 is connected to the heating rod 24. By adjusting the cutter head temperature adjustment switch 27 to control the current input to the heating rod 24, the temperature of the heating rod 24 can be controlled, and then the temperature of the cutter head 25 can be controlled. In this embodiment, the blade temperature adjustment switch 27 is respectively set to a high temperature gear, a low temperature gear and a stop gear. The temperature of the high temperature gear is greater than that of the low temperature gear. The stop gear means that the blade 25 is not heated to adapt to different ambient temperatures. For example, in an environment with extremely low temperature, the hardness of the cable semiconductor layer is very high, and the high temperature gear can be used to heat the blade 25. The blade 25 with increased temperature can effectively heat and soften the cable semiconductor layer, thereby facilitating cutting. In an environment with very high temperature, the hardness of the cable semiconductor layer is not high, and the stop gear can be used, and cutting can be performed without heating the blade 25.

[0077] Obviously, the setting method of the blade temperature adjustment switch 27 is not limited to the above three gears, and can also be set to more gears or continuous temperature adjustment, etc., as long as the blade 25 can be heated to a temperature suitable for cutting. For details, please refer to the detailed records of the prior art, and no limitation is made here.

[0078] In a specific embodiment, the outer wall of the heating rod 24 is covered with an insulating layer 29, which can prevent the heating rod 24 from touching the slide rail 21, and reduce the heat transferred from the heating rod 24 to the slide rail 21 and the device body 1, thereby ensuring that the heat of the heating rod 24 is concentratedly transferred to the cutter head 25.

[0079] In a specific embodiment, a second motor is further provided in the device body 1, and the cutter head 25 can rotate relative to the heating rod 24 under the drive of the second motor to adjust the direction of the cutter head 25, so that the cutter head 25 can perform circular cutting and longitudinal cutting on the cable 100 in the cable accommodating portion 11. In this embodiment, in order to prevent the direction of the cutter head 25 from deviating from the tangential or axial direction of the cable 100, the initial direction of the cutter head 25 is set to the axial or tangential direction of the cable 100, and the rotation angle of the cutter head 25 is set to 90°. The cutting mechanism 2 also includes a cutter head direction adjustment switch 28 provided on the device body 1, and the cutter head direction adjustment switch 28 is connected to the second motor, and the cutter head 25 can rotate 90° under the drive of the second motor, thereby realizing the switching between circular cutting and longitudinal cutting.

[0080] The electrically assisted stripping device for the semiconductor layer of a cable provided in an embodiment of the present invention realizes the lifting and lowering adjustment of the cutter head 25 through the coordinated use of the lifting screw 23 and the slide rail 21. The cutter head 25 is heated and heated by the heating rod 24, so that the cutter head 25 can be inserted and cut the semiconductor layer more smoothly. By adjusting the direction of the cutter head 25, it is possible to switch between circular cutting and longitudinal cutting at any time, thereby greatly improving the stripping efficiency and cutting accuracy.

[0081] In a specific embodiment, referring to Figure 1-Figure 3 As shown, the camera 41 is aimed at the area where the cutter head 25 is located, and can monitor the area where the cutter head 25 is located in real time. The camera 41 is connected to the display screen 42 by signal; the display screen 42 is flatly arranged on the upper surface of the device body 1, and can display the monitoring picture taken by the camera 41, so that the cutting situation can be intuitively displayed during cutting, and the direction and height of the cutter head 25 can be adjusted according to the monitoring picture, so as to improve the cutting accuracy and reduce the damage to the insulation layer.

[0082] In a specific embodiment, referring to Figure 1-Figure 3 As shown, the first hot air assembly 31 includes a first fan 311 and a first heating wire 312 which are arranged on the device body 1 from top to bottom, and the first fan 311 faces the cable accommodating portion 11; the first fan 311 rotates to blow the heat of the first heating wire 312 to the cable accommodating portion 11 to heat and soften the cable semiconductor layer. A first air inlet 12 is arranged on the side of the first hot air assembly 31 to allow air to circulate around the first fan 311, and the first fan 311 can rotate normally. The second hot air assembly 32 includes a second fan 321 and a second heating wire 322 which are arranged on the device body 1 from top to bottom, and the second fan 321 faces the cable accommodating portion 11; the second fan 321 rotates to blow the heat of the second heating wire 322 to the cable accommodating portion 11 to heat and soften the cable semiconductor layer. A second air inlet 13 is arranged on the side of the second hot air assembly 32 to allow air to circulate around the second fan 321, and the second fan 321 can rotate normally. When the heating unit is started, the first heating wire 312 and the second heating wire 322 are heated to a preset temperature, and the first fan 311 and the second fan 321 rotate to blow the heat of the first heating wire 312 and the second heating wire 322 toward the cable accommodating portion 11 .

[0083] In the embodiment of the present invention, by respectively arranging the first hot air component 31 and the second hot air component 32 on both sides of the cutting mechanism 2, the blown hot air can be evenly distributed in the cable accommodating portion 11, so that the cable 100 accommodated in the cable accommodating portion 11 can be evenly heated and softened, and the hardness of the cable semiconductor layer near the cutter head 25 can be reduced, making the cable semiconductor layer easier to cut and reducing the cutting time. Especially in an environment with low temperature, heating and softening the cable semiconductor layer can greatly improve the stripping efficiency of the cable semiconductor layer and speed up the construction progress.

[0084] In a specific embodiment, referring to Figure 1 As shown, the heating unit also includes an electric hot air regulating switch 33 arranged on the device body 1, and the electric hot air regulating switch 33 is connected to the first hot air component 31 and the second hot air component 32 respectively. The electric hot air regulating switch 33 can control the current input into the first hot air component 31 and the second hot air component 32, thereby controlling the rotation speed of the first fan 311 and the second fan 321, and the temperature of the first electric heating wire 312 and the second electric heating wire 322. In this embodiment, the electric hot air regulating switch 33 is respectively provided with a fast gear, a slow gear and a stop gear. The wind speed and temperature of the fast gear are both greater than the slow gear, and the stop gear means that hot air heating is not provided to adapt to different working environments. For example, in an environment with extremely low temperature, the hardness of the cable semiconductor layer is very high, and the fast gear can be used to heat and soften the cable semiconductor layer, so that the cable semiconductor layer quickly reaches a hardness suitable for cutting, greatly reducing the cutting time and improving the stripping efficiency; in an environment with very high temperature, the temperature of the cable semiconductor layer is high and the hardness is low, and the stop gear can be used, and cutting can be performed without heating.

[0085] Obviously, the setting method of the electric hot air adjustment switch 33 is not limited to the above-mentioned fast gear, slow gear and stop gear. More adjustment gears can be set, or the temperature and wind speed can be set separately, etc., as long as the temperature and wind speed can be controlled. For details, please refer to the detailed records in the prior art, and no limitation is made here.

[0086] In a specific embodiment, referring to Figure 1 and Figure 2 As shown, the electrically assisted stripping device for the semiconductor layer of the cable also includes a cable positioning structure, which is used to fix the electrically assisted stripping device for the semiconductor layer of the cable on the surface of the cable, and enable the electrically assisted stripping device for the semiconductor layer of the cable to slide relative to the surface of the cable 100. The cable positioning structure includes at least two rolling steel balls 51 arranged on both sides of the cable accommodating portion 11. When the cable is accommodated in the cable accommodating portion 11, at least two rolling steel balls 51 can abut against the cable 100 and can roll on the surface of the cable 100, so that the electrically assisted stripping device for the semiconductor layer of the cable can slide relative to the surface of the cable 100, thereby realizing the circular cutting and longitudinal cutting of the semiconductor layer of the cable. In this embodiment, the cable positioning structure includes four rolling steel balls 51 evenly distributed on both sides of the cable accommodating portion 11, so that the electrically assisted stripping device for the semiconductor layer of the cable can easily slide in a straight line along the surface of the cable, avoiding cutting errors caused by offset during the sliding process, thereby improving the stability and accuracy of the cutting.

[0087] In a specific embodiment, the position of the rolling steel ball 51 on the side wall of the cable accommodating portion 11 can be adjusted up and down, so that the cable positioning structure can adapt to cables of different specifications. The rolling steel ball 51 is provided with a screw buckle that is inserted into the device body 1, so as to achieve the position adjustment of the rolling steel ball 51 on the side wall of the cable accommodating portion 11, and make the line connecting the steel balls on both sides and the center of the cable 100 accommodated in the cable accommodating portion 11 form an angle of 60°-90°, so as to prevent the cable semiconductor layer electric auxiliary stripping device from being unable to be stably placed on the cable surface.

[0088] In a specific embodiment, referring to Figure 1 As shown, the device body 1 is also provided with a battery compartment 14 for installing batteries. The battery compartment 14 is respectively connected to the cutting mechanism 2, the display unit and the heating unit, so as to provide power to the cutting mechanism 2, the display unit and the heating unit. The battery installed in the battery compartment 14 includes but is not limited to a lithium battery, and the details can be referred to in the prior art, which will not be repeated here.

[0089] In the embodiment of the present invention, the specific process of cutting and stripping the semiconductor layer of the cable using the semiconductor layer electric-assisted stripping device may include:

[0090] The rolling steel ball 51 is adjusted according to the outer diameter of the cable 100 so that the cable 100 can be accommodated in the cable accommodating portion 11;

[0091] The cable 100 is accommodated in the cable accommodation portion 11;

[0092] Start the display unit to monitor the area where the cutter head 25 is located in real time, and adjust the height of the cutter head 25 according to the monitoring picture displayed on the display frequency;

[0093] Starting the heating unit to heat and soften the cable semiconductor layer;

[0094] When the cable 100 is circularly cut, the direction of the cutter head 25 is adjusted to be consistent with the tangential direction of the cable 100, and the cable semiconductor layer electrically assisted stripping device is rotated along the cable 100 to circularly cut the cable semiconductor layer;

[0095] When longitudinally cutting the cable 100, after adjusting the direction of the cutter head 25 to be consistent with the axial direction of the cable 100, the cable semiconductor layer electrically assisted stripping device is slid along the cable axial direction 100 to longitudinally cut the cable semiconductor layer;

[0096] During the cutting process, the cutting situation is monitored in real time, and the cutting depth, cutting direction, etc. are adjusted in time according to the cutting situation to avoid improper operation and damage to the cable 100.

[0097] The electrically assisted stripping device for the conductor layer provided in the embodiment of the present invention improves the cutting accuracy and stripping efficiency through the coordinated use of the display unit, the heating unit and the cutting mechanism 2. The device has a simple and compact structure, is easy to carry and operate, has strong environmental adaptability, and has broad prospects for promotion and application.

[0098] Embodiment 2

[0099] Based on the same inventive concept, the embodiment of the present invention also provides a method for electrically assisted stripping of a semiconductor layer of a cable, using the electrically assisted stripping device for the semiconductor layer of a cable described in the first embodiment, referring to Figure 4 As shown, including:

[0100] S101: accommodating the cable 100 in the cable accommodating portion 11 of the cable semiconductor layer electrically assisted stripping device;

[0101] S102: Start the display unit to monitor the area where the cutter head 25 is located in real time, and adjust the height of the cutter head 25 relative to the cable 100 according to the monitoring screen displayed on the display screen 42;

[0102] S103: starting the heating unit to heat and soften the cable semiconductor layer;

[0103] S104: when the cable 100 is circularly cut, the direction of the cutter head 25 is adjusted to be consistent with the tangential direction of the cable 100, and the cable semiconductor layer electrically assisted stripping device is rotated along the cable 100 to circularly cut the cable semiconductor layer;

[0104] S105: When longitudinally cutting the cable 100, after adjusting the direction of the cutter head 25 to be consistent with the axial direction of the cable 100, the cable semiconductor layer electrically assisted stripping device is slid along the axial direction of the cable 100 to longitudinally cut the cable semiconductor layer.

[0105] In the embodiment of the present invention, the method for electrically assisted stripping of the cable semiconductor layer corresponds to the electrically assisted stripping device for the cable semiconductor layer described in the above embodiment 1. The specific implementation process can refer to the process of electrically assisted stripping of the cable semiconductor layer using the electrically assisted stripping device for the cable semiconductor layer in the above embodiment 1. The repeated parts will not be repeated here.

[0106] Obviously, various changes and modifications may be made to the present invention by those skilled in the art without departing from the spirit and scope of the present invention. The present disclosure is not limited to the precise structure described above and shown in the accompanying drawings, and various changes and modifications may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims. Thus, if these changes and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these changes and modifications.

Claims

1. A device for electrically assisted stripping of a cable semiconductor layer, characterized in that: It includes a device body, a cutting mechanism, a heating unit and a display unit; The cutting mechanism comprises a slide rail, a first motor, a second motor, a lifting screw, a heating rod and a cutter head; The first motor, the lifting screw, the heating rod and the cutter head are connected in sequence from top to bottom; the slide rail is arranged on the side of the lifting screw and the heating rod, and is fixedly connected to the lifting screw; the slide rail is movably arranged in the device body, and the first motor can drive the lifting screw to rotate and lift, so as to push the slide rail to slide up and down relative to the device body; A cable accommodating portion is provided at the lower part of the device body, and the slide rail can drive the cutter head to rise and fall in the cable accommodating portion; The second motor is connected to the cutter head, and the second motor can drive the cutter head to rotate relative to the heating rod; The heating unit comprises a first hot air component and a second hot air component respectively arranged on both sides of the cutting mechanism; the first hot air component and the second hot air component are arranged above the cable accommodating portion and can provide hot air to the cable accommodating portion; The display unit includes a signal-connected camera and a display screen; the display screen is arranged on the top of the device body; the camera is arranged above the cable accommodating portion and faces the cutter head.

2. The cable semiconductor layer electrically assisted stripping device according to claim 1, characterized in that: The cutting mechanism also includes a cutter head lifting and lowering adjustment switch; The blade lifting and lowering adjustment switch is arranged on the device body and connected to the first motor; The blade lifting adjustment switch can control the blade to rise and fall in the cable accommodating portion.

3. The cable semiconductor layer electrically assisted stripping device according to claim 1, characterized in that: The cutting mechanism also includes a cutter head temperature adjustment switch; The blade temperature regulating switch is arranged on the device body and connected to the heating rod; The cutter head temperature regulating switch can control the temperature of the cutter head.

4. The electric-assisted stripping device for the cable semiconductor layer according to claim 1, characterized in that: The cutting mechanism also includes a cutter head direction adjustment switch; The blade direction switch is arranged on the device body and connected to the second motor; The cutter head direction switch can control the direction of the cutter head.

5. The electric-assisted stripping device for the semiconductor layer of a cable according to claim 1, characterized in that: The cable semiconductor layer electrically assisted stripping device also includes a cable positioning structure; The cable positioning structure comprises at least two rolling steel balls arranged on both sides of the cable accommodating portion; When the cable is accommodated in the cable accommodating portion, the at least two rolling steel balls can abut against the cable.

6. The electric-assisted stripping device for the semiconductor layer of a cable according to claim 5, characterized in that: The rolling steel ball can be slidably adjusted along the side wall of the cable accommodating portion.

7. The electric-assisted stripping device for the cable semiconductor layer according to claim 5, characterized in that: The cable positioning structure comprises four rolling steel balls evenly distributed on both sides of the cable accommodating portion.

8. The electric-assisted stripping device for the cable semiconductor layer according to claim 1, characterized in that: The first hot air assembly includes a first fan and a first heating wire disposed on the device body from top to bottom, and the first fan faces the cable accommodating portion; A first air inlet is arranged on the side of the first hot air component.

9. The electric-assisted stripping device for the cable semiconductor layer according to claim 1, characterized in that: The second hot air assembly comprises a second fan and a second heating wire disposed on the device body from top to bottom, and the second fan faces the cable accommodating portion; A second air inlet is arranged on the side of the second hot air component.

10. The electric-assisted stripping device for the semiconductor layer of a cable according to claim 1, characterized in that: The heating unit also includes an electric hot air adjustment switch; The electric hot air regulating switch is arranged on the device body and is connected to the first hot air component and the second hot air component respectively; The electric hot air regulating switch can control the wind speed and hot air temperature of the first hot air component; The electric hot air regulating switch can control the wind speed and hot air temperature of the second hot air component.

11. The electric-assisted stripping device for the semiconductor layer of a cable according to claim 1, characterized in that: The outer wall of the heating rod is covered with an insulating heat insulation layer.

12. The electric-assisted stripping device for the cable semiconductor layer according to claim 1, characterized in that: The device body is provided with a battery compartment; The battery compartment is used for installing batteries.

13. A method for electrically assisted stripping of a cable semiconductor layer, using the electrically assisted stripping device for a cable semiconductor layer according to any one of claims 1 to 12, characterized in that: include: Accommodating the cable in the cable accommodation portion of the cable semiconductor layer electrically assisted stripping device; Start the display unit to monitor the area where the cutter head is located in real time, and adjust the height of the cutter head relative to the cable according to the monitoring screen displayed on the display screen; Starting the heating unit to heat and soften the cable semiconductor layer; When the cable is circularly cut, the direction of the cutter head is adjusted to be consistent with the tangential direction of the cable, and the cable semiconductor layer electrically assisted stripping device is rotated along the cable to circularly cut the cable semiconductor layer; When longitudinal cutting is performed on the cable, after the direction of the cutter head is adjusted to be consistent with the axial direction of the cable, the cable semiconductor layer electrically assisted stripping device is slid along the cable to longitudinally cut the cable semiconductor layer.

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