Automated device with heat sink

Abstract

The invention relates to an automated device having a heat sink, having a circuit board arranged parallel to a first side and a second side at right angles to a top side or a bottom side, the circuit board carrying a microprocessor which in turn is thermally connected to the heat sink, the heat sink having a plurality of cooling metal plates, the cooling metal plates are arranged parallel to the circuit board with a gap therebetween, so that for a first installation position, the bottom side is horizontally aligned in the first installation position, the cooling medium can flow through the gap from the bottom side, and an opening is arranged in each cooling metal plate, so that for a second installation position, the cooling medium can flow through the gap from the bottom side. In the second installation position, the bottom side is vertically aligned, and the cooling medium can flow through the opening parts which are arranged in an up-and-down overlapping manner.

Description

Technical Field

[0001] The invention relates to an automation device which is implemented in an automation environment for the automation of industrial processes and comprises: a basic housing, comprising a rear side, a top side, a bottom side, a first side portion and a second side portion, thereby providing a box-shaped body, the rear side being implemented for mounting on a mounting device, a printed circuit board being arranged parallel to the first side portion and the second side portion at right angles to the top side or the bottom side, the printed circuit board carrying a microprocessor which in turn is thermally connected to a heat sink having a cooling metal plate. Background Art

[0002] EP 2 736 311 B1 discloses an automation device having a basic housing, a front cover and a main heat sink for dissipating heat from a microprocessor.

[0003] The miniaturization of electronic components has led to an increasing realization of higher packaging density / functional density at electronic components / components on planar components (e.g. assembled printed circuit boards). This leads to increased power losses, especially in microprocessors, as the performance of microprocessors increases and the heat losses also increase. For example, the use of modern microprocessors (such as those used in the field of personal computers) in automation equipment has led to a huge increase in power losses in automation equipment.

[0004] Until now, CPUs commonly used throughout industry have been installed with processors with relatively low power densities. Therefore, heat sinks made of die-cast or extruded parts have been sufficient "state of the art" so far. Due to the significantly higher power density of the new processor generations, such heat sinks, due to their lower cooling power, are no longer able to meet the requirements of the environmental conditions required by industry, e.g. temperatures of up to 60°C, without active fans but relying solely on convection cooling, vibration and shock loads and long continuous operation periods of up to 10 years. Therefore, a new, more powerful cooling system must be used in this area in the future. In addition, adequate cooling should be guaranteed regardless of the installation position. Summary of the invention

[0005] It is an object of the present invention to provide an improved cooling solution for automation equipment which ensures sufficient cooling regardless of the installation location.

[0006] This object is achieved in the following manner: the heat sink has a plurality of cooling metal plates, which are arranged parallel to the printed circuit board with gaps between them and are used in a first installation position, in which the bottom side is horizontally aligned and the cooling medium can flow through the gaps from the bottom side, wherein openings are respectively arranged in the cooling metal plates and are used in a second installation position, in which the bottom side is vertically aligned and the cooling medium can flow through the openings arranged one above the other in the second installation position.

[0007] The opening in the cooling metal plate acts like a chimney within the heat sink package. The heated air can easily flow out according to the Bernoulli effect. The rear side is implemented for mounting on a mounting device, such as a control panel or a standard top hat rail. The usual first mounting position is the horizontal mounting position, but in some cases, due to lack of space, a second mounting position may be required, i.e. a mounting position rotated 90° relative to the first mounting position.

[0008] For example, the temperature range of an automation module is 0°C to +60°C, but in a vertical mounting position the temperature should not exceed 40°C.

[0009] The cooling performance is further optimized if the openings in the cooling metal plate extend out of the cooling metal plate in a curved manner as blades. In particular, when the blades are folded upwards, these openings are provided with a more uniform laminar flow. This effect has a further positive influence on the efficiency of any heat pipes used in a vertical situation. Furthermore, the advantage of these blades is that the total surface of the cooling metal plate is almost the same as the total surface of a package with a cooling metal plate without these openings. A positive result of this is that the cooling performance remains almost unchanged when using heat pipes even when mounted horizontally.

[0010] If a heat pipe is used, the radiator includes a cooling plate arranged on the microprocessor, and the pipeline is embedded in the cooling plate so that the first pipe section protrudes vertically from the cooling metal plate, the second pipe section is at least partially embedded in the cooling plate, and the third pipe section protrudes vertically from the cooling plate, and the cooling metal plate is arranged on the first pipe section and the third pipe section in parallel to the printed circuit board with gaps between them.

[0011] If the first pipeline and the second pipeline are embedded in the cooling plate, so that the first pipe section of the first pipeline protrudes vertically from the cooling plate, the second pipe section of the first pipeline is at least partially embedded in the cooling plate, and the third pipe section of the first pipeline protrudes vertically from the cooling plate, the cooling performance is further improved, and the first pipe section of the second pipeline protrudes vertically from the cooling plate, the second pipe section of the second pipeline is at least partially embedded in the cooling plate, and the third pipe section of the second pipeline protrudes vertically from the cooling plate, and the cooling metal plate is arranged on the first pipe section and the third pipe section of the first pipeline and the second pipeline in parallel to the printed circuit board with gaps between them.

[0012] For example, two copper tubes, known as "heat pipes", can be pressed, glued or welded to a cooling plate to act as a heat spreader. A cooling metal plate, for example made of aluminum, can also be pressed, glued or welded to the heat pipes.

[0013] In order to prevent the microprocessor to be cooled from losing contact with the cooling plate even when the automation device is subjected to vibration loads, the cooling plate is surrounded by a base support, a cover is arranged on the base support, and a printed circuit board is arranged between the base support and the cover, wherein a spring-loaded pressure device is arranged between the cover and the printed circuit board.

[0014] In order to obtain a stable arrangement of the cooling kit, the cooling metal plate is implemented as a sheet metal stamping and a connecting piece is arranged in the edge area, wherein the connecting piece comprises a support part, a first arm and a second arm, the first arm and the second arm are arranged at the edge of the cooling metal plate, wherein the first arm and the second arm are combined to form the support part, a recess is punched out between the first arm and the second arm, so that the pin part is arranged on the edge, wherein a pin part carrier passing through the recess is additionally arranged at the connection point of the first arm and the second arm to the support part. The connecting piece is at a 90 degree angle to the surface normal of the cooling metal plate, so that an assembly of the cooling metal plates can be formed. The cooling metal plates can now be stacked and clamped or locked together.

[0015] For the purposes of the present invention, a heat pipe, i.e. the pipe used, is understood to be a cooling system that cools a microprocessor in a closed system in a heat pipe. The operating principle of most heat pipes is simple: a thin-walled heat pipe has a special capillary structure inside and is made of a highly thermally conductive material. It has a small amount of liquid that can evaporate. Using the pipe cooling principle, the heat pipe absorbs the higher temperature and transports it to where the heat can be dissipated.

[0016] There is negative pressure and some liquid inside the heat pipe. This liquid absorbs heat, heats up and travels to the other end of the heat pipe in the form of vapor. Since the temperature there is lower, it cools down and condenses. This releases heat, making the liquid cold again. The liquid then flows back to the starting position to absorb heat and prepare for a new round. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings illustrate an embodiment of the present invention. In the drawings:

[0018] Figure 1 The automation equipment is shown in a three-dimensional view.

[0019] Figure 2 shows a front view of the automation equipment,

[0020] Figure 3 Shows Figure 2 The installation position of the automation equipment when it is rotated 90 degrees,

[0021] Figure 4 shows a side view of the automation equipment,

[0022] Figure 5 An automation device with a partially opened housing through which a heat sink can be seen is shown, wherein the heat sink can be seen,

[0023] Figure 6 A view showing an automation device with a printed circuit board and a microprocessor,

[0024] Figure 7 A heat sink unit with a cooling metal plate assembly is shown.

[0025] Figure 8 shows a cooling metal plate,

[0026] Fig. 9 A cooling unit is shown, in which a cooling plate and a heat pipe are visible,

[0027] Fig.10 Shows Fig. 9 Rotated view of the cooling unit in the

[0028] Fig.11 A view showing the pressing element of the cooling unit with the cover opened,

[0029] Fig.12 A pressing element is shown,

[0030] Fig.13A , Fig. 13B The cooling metal plate kit for automation equipment is shown in a horizontal installation position and in a vertical installation position.

[0031] Fig.14 A detailed illustration showing a cooling metal plate with interlocking tabs,

[0032] Fig.15 A detailed illustration of the connection piece is shown. DETAILED DESCRIPTION

[0033] according to Figure 1 , shows an automation device 1 for use in an automation environment for automation of industrial processes.

[0034] The automation device 1 has a basic housing 2, which includes a rear side RS, a top side OS, a bottom side US, a first side S1 and a second side S2. This provides a box-shaped body of the automation device 1, wherein electronic circuits, printed circuit boards, cooling elements, connectors, etc. are arranged inside. The automation device 1 has ventilation grilles LG on the top side OS and the bottom side US. For the standard installation position, the automation device 1 is aligned horizontally WA. This means that the sides S1, S2 are aligned vertically. The automation device 1 is implemented as a convection cooling in terms of its cooling principle, which means that air can flow in from the bottom side US, can cool the components, and then be discharged from the top side OS through the ventilation grilles LG.

[0035] Figure 2 The automation device 1 is shown in a first installation position E1, which is a preferred installation position for the automation device 1. The bottom side US is aligned horizontally WA.

[0036] Figure 3 The automation device 1 is shown in a second installation position E2 , in which the side parts S1 , S2 are aligned horizontally WA and the top side OS and the bottom side US are aligned vertically SE.

[0037] according to Figure 4 , the automation device 1 is shown from the perspective of the second side S2. The rear side RS is designed for mounting on a mounting device. Here, for example, there are hooks for hooking the automation device 1 onto the profile rail, there are grounding springs for establishing grounding contact with the profile rail, and there are threaded devices for final fastening.

[0038] according to Figure 5 , partially remove the front cover on the automation device 1, and the heat sink 4 can be seen. The heat sink 4 is thermally connected to the microprocessor 3 arranged on the printed circuit board L. The heat sink 4 has a plurality of cooling metal plates K1, ..., K9. The cooling metal plates K1, ..., K9 are arranged parallel to the printed circuit board L with gaps between each other, and therefore for the first installation position E1, in which the bottom side US is horizontally aligned WA, the cooling medium KM can flow through the gap from the bottom side US and cool the automation device 1. A heat pipe is provided in the heat sink 4 for effectively dissipating the heat of the cooling plate 5 placed directly on the microprocessor 3. The heat pipe includes a first pipe 11 and a second pipe 12.

[0039] Figure 6The automation device 1 is shown in a three-dimensional view with the heat sink 4 removed. A view of a printed circuit board L and a microprocessor 3 mounted thereon is thus shown. Previously, the power consumption in conventional processors was 5 to 12 watts. Now, however, new processors based on a 10 nm manufacturing process will be used. These microprocessors achieve significantly higher clock frequencies and therefore also significantly increase the power consumption, which must be dissipated efficiently. For example, the new microprocessor 3 reaches a power loss of nearly 50 watts in turbo frequency operation.

[0040] according to Figure 7 , a radiator 4 is shown in a three-dimensional view. The radiator 4 is arranged on a cooling plate 5. The cooling plate 5 is directly arranged on the microprocessor 3. A first pipe 11 and a second pipe 12 are arranged in the cooling plate 5 (see Fig. 9 ). The heat sink 4 includes a plurality of cooling metal plates K1, ..., K9, which are arranged parallel to the printed circuit board L with gaps between each other, so that the cooling medium KM can flow from the bottom side US through the cooling metal plates K1, ..., K9. The openings O1, ..., O6 are arranged in the cooling metal plates K1, ..., K9, respectively, and therefore for another second installation position E2, the bottom side US can be vertically aligned in the second installation position, so that the cooling medium KM flows through the openings O1, ..., O6 of each cooling metal plate K1, ..., K9 that are arranged in an overlapping manner. Taking the ninth cooling metal plate K9 as an example, the first opening O1, the second opening O2 and the third opening O3 are arranged in the first row. The fourth opening O4, the fifth opening O5 and the sixth opening O6 are arranged in the second row. Each cooling metal plate K1 , . . . , K9 has these openings O1 , . . . , O6 so that for the vertical installation position, ie the second installation position E2 , a chimney is formed which can discharge the cooling medium KM upwards through the openings O1 , . . . , O6 .

[0041] The cooling plate 5 is surrounded by a base support 6. A cover 7 is arranged on the base support 6, and a printed circuit board L is arranged between the base support 6 and the cover 7. A spring-loaded pressing device 8 is arranged between the cover 7 and the printed circuit board L (see Fig.11 ).

[0042] according to Figure 8, a single cooling metal plate is shown using the example of the ninth cooling metal plate K9. The openings O1, ..., O6 in the ninth cooling metal plate K9 are bent and extended from the ninth cooling metal plate K9 as a first blade F1 and a second blade F2. In order to enable multiple cooling metal plates K1, ..., K9 to be fixed in an up-and-down stack, the ninth cooling metal plate K9 has a first connecting piece VL1, a second connecting piece VL2, a third connecting piece VL3 and a fourth connecting piece VL4. The ninth cooling metal plate K9 is implemented as a sheet metal stamping made of aluminum and has connecting pieces VL1, ..., VL4 in the edge area on the edge R. In order to be plugged into the first pipe 11 or the second pipe 12, the cooling metal plate K9 has a first tube hole RL1, a second tube hole RL2, a third tube hole RL3 and a fourth tube hole RL4.

[0043] The connecting pieces VL1, ..., VL4 will be referred to below Fig.14 and Fig.15 It is explained in detail and becomes clear how the design of the connecting webs VL1 , . . . , VL4 enables the individual cooling metal plates K1 , . . . , K9 to form a heat sink 4 which is fixedly connected to one another in a stackable manner.

[0044] Fig. 9 The diagram shows that the first pipe 11 and the second pipe 12 are embedded in the cooling plate 5. The first pipe 11 and the second pipe 12 are embedded in the cooling plate 5 in such a way that the first pipe section 11a of the first pipe 11 protrudes vertically from the cooling plate 5. The second pipe section 11b of the first pipe 11 is at least partially embedded in the cooling plate 5. The third pipe section 11c of the first pipe 11 again protrudes vertically from the cooling plate 5. The second pipe 12 is arranged similarly. The first pipe section 12a of the second pipe 12 protrudes vertically from the cooling plate 5, and the second pipe section 12b of the second pipe 12 is at least partially embedded in the cooling plate 5. The third pipe section 12c of the second pipe 12 again protrudes vertically from the cooling plate 5. This arrangement of the first pipe 11 and the second pipe 12 enables the cooling metal plates K1, ..., K9 to be stacked on the vertically protruding pipe sections and connected to each other by connecting pieces VL1, ..., VL4 to form a heat sink package.

[0045] Fig.10 The cover 7 is shown screwed onto the base support 6 , with the pressing means 8 being located underneath a pronounced bulge in the cover 7 .

[0046] like Fig.11 As shown, the cover 7 is open and the spring-loaded pressing device 8 is visible. Fig.12 As shown, a spring-loaded pressing device 8 is inside the cover body 7 and is implemented as a printed circuit board. The printed circuit board is pressed against the cooling plate 5 by specially arranged domes and spacers in the pressing device 8, so that the microprocessor 3 always maintains good contact with the cooling plate 5.

[0047] The pressing device 8 is made of a plastic material with the abbreviation PEEK 10GF, polyetheretherketone with 10% glass fiber reinforcement. This material can be used at a continuous operating temperature of up to 250-260°C.

[0048] The pressing device 8 is designed as a pressure stamp with a specially arranged dome, which is pressed directly into the interspace of the component onto the printed circuit board L. As a result, the printed circuit board L and the microprocessor 3 mounted on the opposite side of the printed circuit board L are pressed onto the cooling plate 5 of the heat pipe by the defined force of four compression springs without damaging the electronic components.

[0049] Fig.13A and 13B The diagram again illustrates the principle of the heat sink 4 according to the invention, which ensures sufficient heat dissipation of the components for the first mounting position E1 and the second mounting position E2.

[0050] according to Fig.13A In the first installation position E1, the cooling medium KM can flow through the gaps between the cooling metal plates K1, ..., K9. Fig. 13B In the second installation position E2 shown, the cooling plate 5 is in the horizontal WA position. The cooling medium KM can now flow through the heat sink 4 by the chimney effect through the openings O1, ..., O6 arranged one above the other. The additionally introduced guide plates as blades F1, F2 extending in a curved manner from the cooling metal plates K1, ..., K9 can further improve the flow and have the particular advantage that the surface remains approximately the same size as the unperforated cooling metal plates K1, ..., K9.

[0051] Fig.14 and Fig.15 The construction principle of the connecting pieces VL1, ..., VL4 is shown. Fig.14, showing a detailed view of the radiator 4. The seventh cooling metal plate K7 is arranged below the eighth cooling metal plate K8 and below the ninth cooling metal plate K9. In the edge area on the edge R of the ninth cooling metal plate K9, the connecting pieces VL1, ..., VL4 are punched out from the metal sheet so that the connecting piece VL1 produces the following arrangement. The support portion 20 is connected to the first branch arm 21 and the second branch arm 22. The first branch arm 21 and the second branch arm 22 are arranged on the edge R of the cooling metal plates K1, ..., K9. The first branch arm 21 and the second branch arm 22 are combined to form the support portion 20. A recess is punched out between the first branch arm 21 and the second branch arm 22, so that the pin portion 24 is arranged on the edge R. The mating piece of the pin portion 24 is additionally located through the recess 23 at the connection point of the first branch arm and the second branch arm 21, 22 with the support portion 20, where a pin portion carrier 25 is arranged. The corresponding pin 24 of the metal plate to be hooked engages in the pin carrier 25 of the cooling metal plate K1 , . . . , K9 situated opposite.

[0052] The support portion 20 not only ensures better strength but also defines the distance of the gaps between the cooling metal plates K1 , . . . , K9 . Fig.15 A stamped aluminum sheet is shown again as the sheet metal component. The stamped connecting piece VL1 is bent almost at a right angle to the cooling sheet metal K9. In addition, the support part 20 is bent again by the first arm 21 and the second arm 22 at an angle α. This allows the support part 20 to be firmly supported on the lower surface of the cooling sheet metal 20. The second pipe hole L2 shown is also stamped out of the cooling sheet metal K9 by a stamping process. This type of stamping makes it easier to glue, weld or press in the first pipe 11 or the second pipe 12 later.

[0053] By means of the connecting pieces VL1 , . . . , VL4 shown, the heat sink 4 can be stacked as high as required and always have sufficient strength and always maintain the same gap.

Claims

1. An automation device (1) for implementing automation of an industrial process in an automation environment, the automation device comprising: A basic housing (2) comprising a rear side (RS), a top side (OS), a bottom side (US), a first side (S1) and a second side (S2), thereby providing a box-shaped body, wherein the rear side (RS) is implemented for mounting on a mounting device, a printed circuit board (L) is arranged parallel to the first side (S1) and the second side (S2) at right angles to the top side (OS) or the bottom side (US), the printed circuit board (L) carrying a microprocessor (3), which in turn is thermally connected to a heat sink (4), the heat sink (4) having a cooling metal plate, It is characterized in that The heat sink (4) has a plurality of cooling metal plates (K1, ..., K9), which are arranged parallel to the printed circuit board (L) with gaps between them, and for a first installation position (E1), in the first installation position the bottom side (US) is horizontally aligned, and a cooling medium (KM) can flow from the bottom side (US) through the gaps, wherein openings (O1, ..., O6) are respectively arranged in the cooling metal plates (K1, ..., K9), and for a second installation position (E2), in the second installation position the bottom side (US) is vertically aligned, and the cooling medium (KM) can flow through the openings (O1, ..., O6) arranged in an overlapping manner.

2. The automation device (1) according to claim 1, wherein: The openings (O1, . . . , O6) in the cooling metal plates (K1, . . . , K9) extend out of the cooling metal plates (K1, . . . , K9) in a bent manner as blades (F1, F2).

3. The automation device (1) according to claim 1 or 2, wherein: The heat sink (4) comprises a cooling plate (5) arranged on the microprocessor (3), a pipe being embedded in the cooling plate (5), so that a first pipe section (11a) protrudes vertically from the cooling plate (5), a second pipe section (11b) is at least partially embedded in the cooling plate (5), and a third pipe section (11c) protrudes vertically from the cooling plate (5), and the cooling metal plates (K1, . . . , K9) are arranged on the first pipe section (11a) and the third pipe section (11c) in parallel with the printed circuit board (L) with a gap between them.

4. The automation device (1) according to claim 1 or 2, wherein: The heat sink (4) comprises a cooling plate (5) arranged on the microprocessor (3), a first pipe (11) and a second pipe (12) being embedded in the cooling plate (5), so that a first pipe section (11a) of the first pipe (11) protrudes vertically from the cooling plate (5), a second pipe section (11b) of the first pipe (11) is at least partially embedded in the cooling plate (5), and a third pipe section (11c) of the first pipe (11) protrudes vertically from the cooling plate (5), and The first pipe section (12a) of the second pipe (12) protrudes vertically from the cooling plate (5), the second pipe section (12b) of the second pipe (12) is at least partially embedded in the cooling plate (5), and the third pipe section (12c) of the second pipe (12) protrudes vertically from the cooling plate (5), and the cooling metal plates (K1, . . . , K9) are arranged on the first pipe sections (11a, 12a) and the third pipe sections (11c, 12c) of the corresponding first pipe and second pipe (11, 12) in parallel with the printed circuit board (L) with gaps in between.

5. The automation device (1) according to any one of claims 3 or 4, wherein: The cooling plate (5) is surrounded by a base support (6), a cover (7) is arranged on the base support (6), and the printed circuit board (L) is arranged between the base support (6) and the cover (7), wherein a spring-loaded pressing device (8) is arranged between the cover (7) and the printed circuit board (L).

6. The automation device (1) according to any one of claims 1 to 5, wherein: The cooling metal plate (K2, ..., K9) is implemented as a sheet metal stamping and has a connecting piece (VL1, ..., VL4) arranged in the edge area, wherein the connecting piece (Vl1) comprises a supporting part (20), a first arm (21) and a second arm (22), wherein the first arm (21) and the second arm (22) are arranged at the edge (R) of the cooling metal plate (K2, ..., K9), wherein the first arm and the second arm (21, 22) are combined to form the supporting part (20), a recess (23) is stamped out between the first arm (21) and the second arm (22), so that a pin part (24) is arranged on the edge (R), wherein a pin part carrier (25) passing through the recess (23) is additionally arranged at the connection point of the first arm and the second arm (21, 22) to the supporting part (20).

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