Cooling device for electronic component, electrical equipment and vehicle

Abstract

The invention relates to a cooling device (2) for an electronic component (1), the cooling device (2) comprising a cooling channel (20) for the passage of a cooling medium, the channel bottom (201) of the cooling channel (20) comprising a plurality of bottom projections (202), each bottom projection (202) comprising a convex-knot-shaped base body (203) and a flow guide (204), the flow guide is designed to extend from the base body (203) in a main flow direction (R) of the cooling medium. The invention further relates to a corresponding electrical device and to a vehicle.

Description

Technical Field

[0001] The present invention relates to a cooling device for an electronic component, comprising a cooling channel for a cooling medium to pass through. In addition, the present invention also relates to a corresponding electrical device and a vehicle. Background Art

[0002] Electrical equipment with electronic components, such as inverters in vehicles, is usually provided with a cooling device to cool them during operation. A cooling medium, such as a coolant, enters the cooling channel of the cooling device through the inlet of the cooling device, wherein the heat generated by the electronic components due to operation is taken away by the cooling medium flowing through the cooling channel, and the cooling medium after heat exchange flows out through the outlet of the cooling device. The flow rate of the cooling medium is very important for the cooling process. A slow flow rate of the cooling medium leads to a decrease in the flow rate of the cooling channel per unit time, thereby reducing the amount of heat taken away, thereby reducing the cooling effect; conversely, a faster flow rate of the cooling medium will achieve a good cooling effect. However, through the study of the cooling device of the prior art, it was found that the cooling medium often has an unexpected backflow in the cooling device, which leads to an excessive pressure drop of the cooling medium in the inlet area, thereby making the flow rate too slow and the maximum temperature of the cooling device higher than the allowed threshold. Summary of the invention

[0003] In view of this, the technical problem to be solved by the present invention is to provide a cooling device for electronic components, which can overcome the above disadvantages and achieve a better cooling effect.

[0004] In order to solve the technical problem, the present invention provides a cooling device for electronic components, the cooling device includes a cooling channel for a cooling medium to pass through, the channel bottom of the cooling channel includes a plurality of bottom protrusions, the bottom protrusion includes a knob-shaped base and a guide portion, the guide portion is configured to extend from the base along the main flow direction of the cooling medium.

[0005] On the one hand, the bottom protrusion arranged at the bottom of the channel occupies part of the space of the cooling channel, thereby reducing the flow cross section for the cooling medium, increasing the flow rate of the cooling medium, and increasing the amount of cooling medium flowing through the cooling channel per unit time, thereby improving the cooling effect. On the other hand, the guide portion greatly eliminates the bypass caused by the arrangement of the bottom protrusion, and further increases the flow rate of the cooling medium by directional guidance of the cooling medium.

[0006] In some embodiments, the cooling channel is divided into a plurality of channel partitions in sequence along the main flow direction. Within each channel partition, the bottom protrusions are arranged in an array. The bottom protrusions located in the last column of each channel partition along the main flow direction have a first guide portion, and the bottom protrusions located upstream of the last column have a second guide portion. The first guide portion is longer than the second guide portion.

[0007] In some embodiments, at the junction between adjacent channel partitions, the first guide portion spans across two channel partitions.

[0008] In some embodiments, along the main flow direction, the distance between the channel bottom of the cooling channel and the lower surface of the electronic component decreases successively.

[0009] In some embodiments, the cooling channel is divided into a first channel partition, a second channel partition, and a third channel partition in sequence along the main flow direction.

[0010] Observing along the cross section of the cooling channel perpendicular to the main flow direction, while the lateral dimension of the cooling channel remains unchanged, the flow cross section for the cooling medium in each channel partition is reduced by successively reducing the distance between the channel bottom of the cooling channel and the lower surface of the electronic component. This makes the flow velocity of the cooling medium gradually increase from the inlet to the outlet.

[0011] In some embodiments, the cooling channel comprises an inlet, wherein, in a transition region between the inlet and the cooling channel, two mutually opposing inlet side walls of a cross section of the cooling channel enclose a first angle.

[0012] In some embodiments, the first angle is 120° to 130°.

[0013] In some embodiments, the cooling channel comprises an outlet, wherein, in a transition region between the outlet and the cooling channel, two mutually opposing outlet side walls of the cross section of the cooling channel enclose a second angle.

[0014] In some embodiments, the second angle is 120° to 130°.

[0015] As a result, the rectangular cross-section traditionally formed in the transition area between the inlet or outlet and the cooling channel is abandoned, thereby avoiding the occurrence of right-angled parts that cause violent backflow of the cooling medium, eliminating excessive backflow of the cooling medium when it flows from the inlet into the cooling channel, and avoiding a violent pressure drop of the cooling medium when it enters the cooling channel.

[0016] In some embodiments, the cooling channel includes a channel sidewall, and the channel sidewall includes a plurality of sidewall protrusions protruding toward a longitudinal center axis of the cooling channel.

[0017] As a result, the cooling medium can be forced to flow toward the center of the cooling channel without affecting the cooling effect, thereby increasing the flow rate of the cooling medium.

[0018] In order to solve the technical problem, the present invention also provides an electrical device, which includes an electronic component and the above-mentioned cooling device.

[0019] In some embodiments, the cooling device is arranged below the electronic component.

[0020] In some embodiments, in the main flow direction, the electronic component is divided into a plurality of sub-regions in sequence, and the cooling channel is divided into a plurality of channel partitions in sequence, and the projection of each channel partition on the channel bottom partially overlaps with the projection of at least one sub-region on the channel bottom.

[0021] In addition, in order to solve the technical problem, the present invention also provides a vehicle, which includes the above-mentioned electrical device.

[0022] The features and advantages described above with respect to the cooling device for electronic components are also applicable to the corresponding electrical equipment or vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0024] Figure 1 A partial perspective view schematically showing an electrical device according to the present invention;

[0025] Figure 2 Schematically shown Figure 1 A perspective view of a cooling device for an electrical device shown;

[0026] Figure 3 Schematically shown Figure 2 A top view of the cooling device shown;

[0027] Figure 4 Schematically showing the Figure 3 The cross-sectional view obtained by the cutting line AA shown;

[0028] Figure 5 Schematically showing the Figure 3 A cross-sectional view taken along the section line BB; and

[0029] Figure 6 Schematically showing the Figure 3 The cross-sectional view is obtained along the cutting line CC shown.

[0030] List of Reference Numerals

[0031] 1 Electronic components

[0032] 2 Cooling device

[0033] 20 Cooling channels

[0034] 11. First sub-area

[0035] 12 Second sub-area

[0036] 13 The third sub-area

[0037] 20a First channel partition

[0038] 20b Second channel partition

[0039] 20c Third channel partition

[0040] 201 Channel Bottom

[0041] 202 Bottom bulge

[0042] 202' Sidewall bulge

[0043] 203 Matrix

[0044] 204 diversion part

[0045] 205 First channel side wall

[0046] 206 Second channel side wall

[0047] 21 Entrance

[0048] 22 Exit

[0049] 211 First entrance side wall

[0050] 212 Second entrance side wall

[0051] 221 First outlet side wall

[0052] 222 Second outlet side wall

[0053] R Main flow direction

[0054] α First angle

[0055] β Second angle

[0056] x longitudinal center axis DETAILED DESCRIPTION

[0057] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0058] The "one embodiment" or "embodiment" referred to herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "top", "bottom", etc. is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0059] Figure 1 A partial perspective view of an electrical device according to the present invention is schematically shown. In this embodiment, the electrical device shown is, for example, an inverter for a car. The present disclosure does not limit the type of the electrical device.

[0060] The electrical device includes an electronic component 1 and a cooling device 2 fixedly connected below the electronic component 1. The electronic component 1 is basically plate-shaped and has a substantially rectangular cross-section, and includes a plurality of power electronic components arranged above. The cooling device 2 is slightly larger than the electronic component 1 so as to fully cool it. The cooling device 2 includes an inlet 21, an outlet 22, and a cooling channel 20 connecting the inlet 21 and the outlet 22.

[0061] It should be noted that the direction in which the cooling medium flows from the inlet 21 to the outlet 22 is set as the main flow direction R of the cooling medium. The distance between the channel bottom 201 of the cooling channel 20 and the lower surface of the electronic component 1 is called the "height" of the cooling channel.

[0062] It should also be noted that the "main flow direction" within the scope of the present invention refers to the dominant flow direction in the cooling channel. When the straight line between the inlet and outlet of the cooling channel is parallel to the longitudinal axis of the channel, the main flow direction refers to the ray direction from the outlet to the inlet; when the straight line between the inlet and outlet forms an angle with the longitudinal axis of the channel, the main flow direction refers to the main flow direction of the cooling medium between the inlet and outlet of the cooling channel without considering its disturbance or turbulence.

[0063] like Figure 1As shown, the electronic component 1 is divided into three sub-areas arranged side by side with a spacing between them, namely, the first sub-area 11, the second sub-area 12 and the third sub-area 13 in sequence along the main flow direction R. A plurality of electronic components ( Figure 1 For example, two electronic components are arranged in the center of each sub-area, and the electronic components are, for example, insulated gate bipolar transistors (IGBT). The present disclosure does not limit the type of electronic components and the arrangement of electronic components.

[0064] Figure 2 Schematically shown Figure 1 FIG. 2 is a perspective view of a cooling device 2 for an electrical device.

[0065] like Figure 2 As shown, the main body of the cooling device 2 is generally in the shape of a parallelepiped, and the inlet 21 and the outlet 22 are respectively constructed as hollow cylinders and communicated with a groove located in the middle of the main body, and the groove cooperates with the lower surface of the electronic component 1 to form a cooling channel 20, and the cooling channel 20 has a channel side wall extending parallel to the main flow direction R, including a first channel side wall 205 and a second channel side wall 206. The cooling medium input through the inlet 21 can flow out from the outlet 22 via the cooling channel 20, and in this process, the electronic component 1 is cooled by heat exchange of the cooling medium.

[0066] In some embodiments of the present disclosure, in the main flow direction R, the cooling channel 20 is divided into multiple channel partitions, and the projection of each channel partition on the channel bottom 201 of the cooling channel 20 partially overlaps with the projection of at least one sub-region of the electronic component 1 on the channel bottom 201.

[0067] like Figure 2 As shown, the cooling channel 20 is also divided into three channel partitions, namely, a first channel partition 20a corresponding to the first sub-region 11 of the electronic component 1, a second channel partition 20b corresponding to the second sub-region 12, and a third channel partition 20c corresponding to the third sub-region 13. In this embodiment, the first sub-region 11 is located directly above the first channel partition 20a, the second sub-region 12 is located directly above the second channel partition 20b, and the third sub-region 13 is located directly above the third channel partition 20c. Each channel partition includes a plurality of bottom protrusions 202 protruding upward from the channel bottom 201.

[0068] Figure 3 Schematically shown Figure 2 A top view of the cooling device 2 is shown.

[0069] like Figure 3As shown, each bottom protrusion 202 includes a convex knob-shaped base 203 protruding upward from the channel bottom 201 and a guide portion 204 extending from the base 203. The guide portion 204 is integrally formed with the base 203 and extends downstream along the main flow direction R, so that each guide portion 204 is arranged in parallel with each other. In each channel partition, that is, inside the first channel partition 20a, the second channel partition 20b and the third channel partition 20c, the bottom protrusion 202 is regularly arranged in an array. However, not all guide portions 204 of the bottom protrusion 202 are of the same length. The bottom protrusion 202 located at the last column of each channel partition along the main flow direction R, that is, at the downstream edge, has a longer guide portion 204, while the bottom protrusion 202 located upstream of the last column of each channel partition has a shorter guide portion 204. Since the electronic components are arranged in the center of each sub-area of ​​the electronic assembly 1, there are no electronic components to be cooled above the intersection of adjacent channel partitions, so the bottom protrusions 202 at the intersection of two adjacent channel partitions are arranged at a relatively large spacing in terms of their base, and the large spacing between the bottom protrusions 202 will cause turbulence of the coolant. In order to avoid turbulence of the coolant and speed up the flow rate of the coolant, in some embodiments of the present disclosure, at the intersection between adjacent channel partitions, a longer guide spans across two channel partitions. For example, the bottom protrusion 202 located in the last column of the first channel partition 20a along the main flow direction R has a guide 204 that spans the first channel partition 20a and the second channel partition 20b, and the bottom protrusion 202 located in the last column of the second channel partition 20b along the main flow direction R has a guide 204 that spans the second channel partition 20b and the third channel partition 20c. In addition, a longer guide 204 is also provided in the transition area between the third channel partition 20c and the outlet 22. Therefore, a plurality of relatively long guide portions 204 extending in parallel are respectively arranged downstream of each channel sub-region, so as to directionally guide the flow of the coolant in the empty space of the cooling channel 20 where no bottom protrusion 202 is arranged.

[0070] The guide portions 204 oriented parallel to each other guide the cooling medium in a directional manner, which greatly reduces the backflow of the cooling medium and helps to increase the flow rate of the cooling medium in the cooling channel.

[0071] In addition, if Figure 3As shown, the channel side wall of the cooling channel 20 includes a plurality of side wall protrusions 202'. On the one hand, the side wall protrusions 202' protrude from the first channel side wall 205 and the second channel side wall 206 toward the longitudinal center axis x of the cooling channel 20, and on the other hand, the bottom of the side wall of the channel is integrally constructed with the channel side wall, so that the cooling medium that should originally flow through the right angle between the channel side wall and the channel bottom can be "squeezed" to the middle of the cooling channel 20. Since the lateral dimension of each channel partition of the cooling channel 20 is slightly larger than the sub-area of ​​the electronic component corresponding thereto, there is no electronic component to be cooled above the edge of each channel partition close to the channel side wall. As a result, the cooling medium can be forced to flow toward the center of the cooling channel 20 without affecting the cooling effect, thereby increasing the flow rate of the cooling medium.

[0072] The cooling medium first flows into the first channel subregion 20a of the cooling channel 20 through the inlet 21, wherein the inlet 21 transitions to the first channel subregion 20a via a ramp. Figure 4 In the shown section AA, i.e. the cross section perpendicular to the main flow direction R, the mutually opposite inlet side walls are not oriented perpendicularly to the horizontal plane, i.e. the cross section is not rectangular, but comprises a first inlet side wall 211 and a second inlet side wall 212 which enclose a first angle α with each other.

[0073] Accordingly, the cooling medium flows out from the last channel partition, that is, the third channel partition 20c, of the cooling channel 20 from the outlet 22, wherein the third channel partition 20c transitions to the outlet 22 via a ramp. Figure 5 In the shown section BB, i.e. the cross section perpendicular to the main flow direction R, the mutually opposite outlet side walls are not oriented perpendicularly to the horizontal plane, i.e. the cross section is not rectangular, but comprises a first outlet side wall 221 and a second outlet side wall 222 which enclose a second angle β with each other.

[0074] The first angle α and the second angle β may be the same or different. In the illustrated embodiment, the first angle α is 120° to 130°, preferably 125°; the second angle β is 120° to 130°, preferably 125°.

[0075] In some embodiments of the present disclosure, the channel bottom 201 of the cooling channel 20 is constructed in a stepped manner. Figure 6As shown in the cross section CC, the channel bottom 201 is at the height of the first partition bottom surface 201a within the range of the first channel partition 20a, and maintains a height difference of H1 with the lower surface of the electronic component 1 not shown in the figure; the channel bottom 201 is at the height of the second partition bottom surface 201b within the range of the second channel partition 20b, and maintains a height difference of H2 with the lower surface of the electronic component 1; the channel bottom 201 is at the height of the third partition bottom surface 201c within the range of the third channel partition 20c, and maintains a height difference of H3 with the lower surface of the electronic component 1. Figure 6 As shown, the height differences between the bottom surface 201a of the first partition, the bottom surface 201b of the second partition, and the bottom surface 201c of the third partition and the lower surface of the electronic component 1 decrease in sequence, that is, H1>H2>H3. When the lateral dimension of the cooling channel 20 remains unchanged, the area of ​​the flow cross section for the cooling medium is reduced in stages by the height change, so that the flow velocity of the cooling medium is increased in stages from the inlet to the outlet.

[0076] At least one embodiment of the present disclosure further provides a vehicle, which includes the electrical device provided by at least one embodiment of the present disclosure. The vehicle may be an electrified vehicle, such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), an extended range electric vehicle (Range extended EV), or a fuel cell vehicle (FCEV). The vehicle may also be a hydrogen energy vehicle.

[0077] Certain features, structures or characteristics in one or more embodiments of the present disclosure may be appropriately combined.

[0078] The above is an explanation of the present disclosure and should not be considered as a limitation thereof. Although several exemplary embodiments of the present disclosure are described, it will be readily appreciated by those skilled in the art that many modifications may be made to the exemplary embodiments without departing from the novel teachings and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure as defined in the claims. It should be understood that the above is an explanation of the present disclosure and the present disclosure should not be considered to be limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the present disclosure.

Claims

1. A cooling device (2) for an electronic component (1), characterized in that: The cooling device (2) comprises a cooling channel (20) for a cooling medium to pass through, the channel bottom (201) of the cooling channel (20) comprises a plurality of bottom protrusions (202), the bottom protrusions (202) comprise a knob-shaped base (203) and a guide portion (204), the guide portion being configured to extend from the base (203) along a main flow direction (R) of the cooling medium.

2. The cooling device (2) according to claim 1, characterized in that The cooling channel (20) is divided into a plurality of channel partitions in sequence along the main flow direction (R), and within each channel partition, the bottom protrusions (202) are arranged in an array, and the bottom protrusions (202) located in the last column of each channel partition along the main flow direction (R) have a first guide portion, and the bottom protrusions (202) located upstream of the last column have a second guide portion, and the first guide portion is longer than the second guide portion.

3. The cooling device (2) according to claim 2, characterized in that: At the boundary between adjacent channel partitions, the first guide portion spans across two channel partitions.

4. The cooling device (2) according to claim 2, characterized in that: Along the main flow direction (R), the distance between the channel bottom (201) of the cooling channel (20) and the lower surface of the electronic component (1) decreases successively.

5. The cooling device (2) according to claim 2, characterized in that: The cooling channel (20) is divided into a first channel partition (20a), a second channel partition (20b) and a third channel partition (20c) in sequence along the main flow direction (R).

6. The cooling device (2) according to claim 1, characterized in that: The cooling channel (20) comprises an inlet (21), wherein, in a transition area between the inlet (21) and the cooling channel (20), two mutually opposite inlet side walls of the cross section of the cooling channel (20) enclose a first angle (α).

7. The cooling device (2) according to claim 6, characterized in that The first angle (α) is 120° to 130°.

8. The cooling device (2) according to claim 1, characterized in that The cooling channel (20) comprises an outlet (22), wherein, in a transition area between the outlet (22) and the cooling channel (20), two mutually opposite outlet side walls of the cross section of the cooling channel (20) enclose a second angle (β).

9. The cooling device (2) according to claim 8, characterized in that The second angle (β) is 120° to 130°.

10. The cooling device (2) according to claim 1, characterized in that The cooling channel (20) comprises a channel side wall, wherein the channel side wall comprises a plurality of side wall protrusions (202') protruding toward a longitudinal center axis (x) of the cooling channel (20).

11. An electrical device comprising: Electronic components (1); and A cooling device (2) according to any one of claims 1 to 10.

12. The electrical device according to claim 11, characterized in that The cooling device (2) is arranged below the electronic component (1).

13. The electrical device according to claim 11, characterized in that In the main flow direction (R), the electronic component (1) is divided into a plurality of sub-regions in sequence, and the cooling channel (20) is divided into a plurality of channel partitions in sequence, and the projection of each channel partition on the channel bottom partially overlaps with the projection of at least one sub-region on the channel bottom.

14. A vehicle, characterized in that: The vehicle includes the electric device according to any one of claims 11 to 13.

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