Heat dissipation module and display equipment

Abstract

The invention belongs to the field of display equipment, and particularly discloses a heat dissipation module and display equipment, and the heat dissipation module comprises a fixing support which is used for fixing an electronic element; the heat dissipation module further comprises a plurality of radiators, a plurality of heat conduction pipes and a heat dissipation keel, at least one heat conduction pipe is connected between the fixing support and the heat dissipation keel, a plurality of inserting grooves are formed in the heat dissipation keel at intervals, and the inserting grooves are distributed in the extending direction of the heat dissipation keel. Each radiator is at least connected with one heat conduction pipe, and the heat conduction pipes are partially exposed out of the radiators to form protruding parts. And at least one radiator is inserted into the slot through the protruding part and is spliced with the radiating keel. In this way, modularization of the heat dissipation module is achieved, and the applicability of the heat dissipation module in different application spaces is improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation equipment, and in particular to a heat dissipation module and a display device. Background Art

[0002] During operation, electronic products often generate a lot of heat, causing the temperature of the electronic products to be too high. Over time, this will affect the working condition and service life of the electronic products. Current electronic products mainly rely on heat dissipation modules composed of heat pipes and radiators to dissipate heat.

[0003] Traditional radiator modules are made as a whole or the aluminum fins are soldered together and cannot be freely spliced ​​or disassembled. This results in that within the limited structural space of electronic products, a heat dissipation module of one specification often cannot be adapted and installed in electronic products of different sizes. The heat dissipation module cannot be adjusted in size according to the space size of the electronic product, and its applicability is low. Replacing heat dissipation modules of other sizes will further increase costs.

[0004] Therefore, how to realize the modularization of the heat dissipation module and improve the applicability of the heat dissipation module in different application spaces has become an urgent problem to be solved in this field. Summary of the invention

[0005] The present application discloses a heat dissipation module and a display device, the purpose of which is to realize the modularization of the heat dissipation module and improve the applicability of the heat dissipation module in different application spaces.

[0006] The present application discloses a heat dissipation module, comprising a fixed bracket, which is used to fix electronic components; the heat dissipation module also includes multiple heat sinks, multiple heat pipes and heat dissipation keels, at least one of the heat pipes is connected between the fixed bracket and the heat dissipation keel, and the heat dissipation keel is provided with multiple slots at intervals, and the multiple slots are arranged along the extension direction of the heat dissipation keel; each of the heat sinks is connected to at least one of the heat pipes, and the heat pipes are partially exposed from the heat sink to form a protrusion; at least one of the heat sinks is inserted into the slot through the protrusion and spliced ​​with the heat dissipation keel.

[0007] Optionally, the radiator includes a first radiator and a second radiator, and the heat pipe includes a first heat pipe and a second heat pipe, one end of the first heat pipe is connected to the first radiator, and the other end forms the protrusion, and the protrusion of the first heat pipe is inserted into the slot from one side of the heat dissipation keel; one end of the second heat pipe is connected to the second radiator, and the other end forms the protrusion, and the protrusion of the second heat pipe is inserted into the slot from a side of the heat dissipation keel away from the first radiator; the protrusion of the first heat pipe and the protrusion of the second heat pipe are respectively inserted into the slot and abut against each other.

[0008] Optionally, a metal sleeve is provided in the slot, and the metal sleeve wraps the protruding parts of the first heat conducting pipe and the second heat conducting pipe.

[0009] Optionally, the first radiator and the second radiator are respectively provided with a first splicing portion and a second splicing portion on one side close to the fixed bracket, and the radiator also includes a third radiator and a fourth radiator, the third radiator and the fourth radiator are respectively provided on both sides of the fixed bracket, and the third radiator and the fourth radiator are respectively connected to the fixed bracket through the heat pipe; the position of the third radiator corresponds to the position of the first radiator, and the fourth radiator corresponds to the position of the second radiator, the third radiator is provided with a third splicing portion at a position corresponding to the first splicing portion, and the fourth radiator is provided with a fourth splicing portion at a position corresponding to the second splicing portion; splicing parts are provided between the first splicing portion and the third splicing portion, and between the second splicing portion and the fourth splicing portion, and the first splicing portion and the third splicing portion, as well as the second splicing portion and the fourth splicing portion are all connected through the splicing parts; the splicing parts are made of metal thermal conductive material.

[0010] Optionally, the radiator includes a heat sink and a plurality of heat sink fins, the heat sink includes a first support member and a second support member, the first support member and the second support member are arranged in parallel, a plurality of first slots are arranged at intervals on the first support member, a plurality of second slots are arranged at intervals on the second support member, the position of each first slot corresponds one-to-one to the position of each second slot, and each heat sink fin is perpendicular to the first support member and the second support member, and is partially embedded in the first slot and the second slot.

[0011] Optionally, fixing members are provided on the groove walls of the first slot and the second slot, and a card slot is provided at a position of the heat dissipation fin corresponding to the fixing member, and the fixing member is embedded in the card slot and card-connected with the card slot.

[0012] Optionally, the depth of the first slot and the second slot are both less than or equal to twice the thickness of the heat sink fin.

[0013] Optionally, the first heat pipe and the second heat pipe each include a first end, a heat pipe body and a second end, and the first end and the second end are respectively located on both sides of the length direction of the heat pipe body; each of the heat dissipating fins is provided with a through hole, and the through holes on the plurality of heat dissipating fins are arranged opposite to each other, and the second end passes through the through holes on the plurality of heat dissipating fins arranged opposite to each other in sequence to connect the heat pipe body with the plurality of heat dissipating fins; the first end portion is exposed from the radiator to form the protrusion.

[0014] Optionally, the through hole includes a first hole and a second hole, the second hole is arranged at the edge of the first hole and is connected to the first hole; the first hole is circular, and the heat pipe body is inserted into the first hole; the second hole is arc-shaped, and the opening size of the second hole is smaller than the opening size of the first hole.

[0015] The present application also discloses a display device, including a housing. The display device also includes the heat dissipation module described above, and the heat dissipation module is arranged in the housing.

[0016] The present application improves the heat dissipation module by connecting the fixed bracket and the heat dissipation keel with a heat pipe. When the electronic component generates heat during operation, the heat will first be conducted to the fixed bracket, and then conducted to the heat dissipation keel by the fixed bracket through the heat pipe, with the heat dissipation keel serving as the heat conduction center of the entire heat dissipation module. Since the heat dissipation keel has multiple slots, the radiator with the heat pipe can be inserted into any slot for installation by using the protrusion formed by the heat pipe, and the heat is conducted to the radiator by using the heat dissipation keel through the heat pipe on the radiator, and finally the heat is dissipated to the external environment through the radiator. In this way, according to the actual space usage of the display device and the obstruction of the heat dissipation module by other structures, one or more radiators can be assembled arbitrarily, and radiators of different sizes can be matched by means of slot plug-in, while reasonably avoiding and satisfying the installation, so as to adjust the size and shape of the entire heat dissipation module to adapt to the installation of different display devices, realize the modularization of the heat dissipation module, and improve the applicability of the heat dissipation module in different application spaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 A schematic diagram of a first embodiment of the heat dissipation module of the present application;

[0019] Figure 2 A schematic diagram of a second embodiment of the heat dissipation module of the present application;

[0020] Figure 3 A schematic diagram of a third embodiment of the heat dissipation module of the present application;

[0021] Figure 4 A schematic diagram of a fourth embodiment of the heat dissipation module of the present application;

[0022] Figure 5 A bottom view of the support member and the heat dissipation fins in the fifth embodiment of the heat dissipation module of the present application;

[0023] Figure 6 A side view of a support member and heat dissipation fins in a fifth embodiment of the heat dissipation module of the present application;

[0024] Figure 7 This is a schematic diagram of a support member and heat dissipation fins in a sixth embodiment of the heat dissipation module of the present application;

[0025] Figure 8 A schematic diagram of a seventh embodiment of the heat dissipation module of the present application;

[0026] Fig. 9 This is a partially enlarged schematic diagram of the heat dissipation fins in the eighth embodiment of the heat dissipation module of the present application;

[0027] Fig.10 It is a schematic diagram of an embodiment of a display device of the present application.

[0028] Among them, 10, display device; 100, heat dissipation module; 200, housing; 300, electronic component; 110, fixing bracket; 120, radiator; 121, first radiator; 122, first splicing part; 123, second radiator; 124, second splicing part; 125, third radiator; 126, third splicing part; 127, fourth radiator; 128, fourth splicing part; 130, splicing piece; 140, heat dissipation fin; 141, through hole; 142 , first hole; 143, second hole; 150, heat sink; 151, first support member; 152, first slot; 153, second support member; 154, second slot; 155, slot; 156, fixing member; 160, heat pipe; 161, protrusion; 162, first heat pipe; 163, second heat pipe; 164, first end; 165, heat pipe body; 166, second end; 170, heat dissipation keel; 171, slot; 172, metal sleeve. DETAILED DESCRIPTION

[0029] The present application is described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, under the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0030] Figure 1 Schematic diagram of the first embodiment of the heat dissipation module of the present application, such as Figure 1As shown, the present application discloses a heat dissipation module 100, including a fixing bracket 110, the fixing bracket 110 is used to fix the electronic component 300; the heat dissipation module 100 also includes a plurality of heat sinks 120, a plurality of heat pipes 160 and a heat dissipation keel 170, at least one heat pipe 160 is connected between the fixing bracket 110 and the heat dissipation keel 170, a plurality of slots 171 are arranged at intervals on the heat dissipation keel 170, and the plurality of slots 171 are arranged along the extension direction of the heat dissipation keel 170; each heat sink 120 is connected to at least one heat pipe 160, and a portion of the heat pipe 160 is exposed from the heat sink 120 to form a protrusion 161; at least one heat sink 120 is inserted into the slot 171 through the protrusion 161 and spliced ​​with the heat dissipation keel 170.

[0031] The present application improves the heat dissipation module 100, and uses a heat pipe 160 to connect the fixed bracket 110 and the heat dissipation keel 170. When the electronic component 300 generates heat during operation, the heat is firstly conducted to the fixed bracket 110, and then conducted to the heat dissipation keel 170 by the fixed bracket 110 through the heat pipe 160, and the heat dissipation keel 170 is used as the heat conduction center of the entire heat dissipation module 100; since the heat dissipation keel 170 has a plurality of slots 171, the heat sink 120 with the heat pipe 160 can be installed by inserting the protrusion 161 formed by the heat pipe 160 into any slot 171, and the heat dissipation keel 170 is used to conduct the heat to the heat sink 120 through the heat dissipation keel 170. The heat pipe 160 on 20 conducts the heat to the radiator 120, and finally dissipates the heat to the external environment through the radiator 120; in this way, according to the actual space usage of the display device 10 and the obstruction of the heat dissipation module 100 by other structures, one or more radiators 120 can be assembled arbitrarily through the slot 171 while reasonably avoiding and satisfying the installation, and radiators 120 of different sizes can be matched to adjust the size and shape of the entire heat dissipation module 100 to adapt to the installation of different display devices 10, thereby realizing the modularization of the heat dissipation module 100 and improving the applicability of the heat dissipation module 100 in different application spaces.

[0032] like Figure 1 As shown, when a radiator 120 needs to be installed, it is only necessary to insert the protrusion 161 formed by the heat pipe 160 of the radiator 120 into the slot 171 of the heat dissipation keel 170, and the splicing of the radiator 120 and the heat dissipation keel 170 is completed; of course, in the present application, since there are multiple slots 171 on the heat dissipation keel 170 and they are arranged along the extension direction of the heat dissipation keel 170, the radiator 120 can be inserted into the slots 171 at different positions or directions of different heat dissipation keels 170 through the protrusion 161 formed by the heat pipe 160 for installation, which further improves the flexibility of assembly of the heat dissipation module 100.

[0033] Figure 2 This is a schematic diagram of the second embodiment of the heat dissipation module of the present application. Figure 2 As shown, the radiator 120 includes a first radiator 121 and a second radiator 123, and the heat pipe 160 includes a first heat pipe 162 and a second heat pipe 163. One end of the first heat pipe 162 is connected to the first radiator 121, and the other end forms a protrusion 161. The protrusion 161 of the first heat pipe 162 is inserted into the slot 171 from one side of the heat dissipation keel 170; one end of the second heat pipe 163 is connected to the second radiator 123, and the other end forms a protrusion 161. The protrusion 161 of the second heat pipe 163 is inserted into the slot 171 from the side of the heat dissipation keel 170 away from the first radiator 121; the protrusion 161 of the first heat pipe 162 and the protrusion 161 of the second heat pipe 163 are respectively inserted into the slot 171 and abut against each other.

[0034] When it is necessary to install two radiators 120, that is, to install the first radiator 121 and the second radiator 123, the protrusion 161 formed by the first heat pipe 162 in the first radiator 121 can be inserted into the slot 171 of the heat dissipation keel 170 from one side of the heat dissipation keel 170, and the assembly of the first radiator 121 is completed; when installing the second radiator 123 to the heat dissipation keel 170, it is only necessary to insert the protrusion 161 formed by the second heat pipe 163 in the second radiator 123 from the side of the heat dissipation keel 170 relative to the first radiator 121 into the slot 171 of the heat dissipation keel 170, and the assembly of the second radiator 123 is completed.

[0035] When the first heat sink 121 and the second heat sink 123 are assembled, the protrusion 161 of the first heat pipe 162 and the protrusion 161 of the second heat pipe 163 form abutment in the slot 171, so that the first heat sink 121 and the second heat sink 123 can also directly conduct heat on the basis of heat conduction through the heat dissipation keel 170, further enhancing the heat conduction performance, which is beneficial for the heat dissipation keel 170 to conduct heat to the first heat sink 121 and the second heat sink 123 in a concentrated manner, and then use the first heat sink 121 and the second heat sink 123 to dissipate the heat to the external environment; through the installation method of the slot 171, the first heat sink 121 and the second heat sink 123 are flexibly assembled and disassembled, and the modularization of the heat dissipation module 100 is further realized, thereby improving the applicability of the heat dissipation module 100 in different application spaces.

[0036] Of course, in the present application, since there are multiple slots 171 on the heat dissipation keel 170 and they are arranged along the extension direction of the heat dissipation keel 170, the first heat sink 121 and the second heat sink 123 can be installed by inserting the protrusion 161 formed by the first heat pipe 162 and the protrusion 161 formed by the second heat pipe 163 into the slots 171 at different positions or directions of the heat dissipation keel 170, that is, the first heat sink 121 and the second heat sink 123 can be installed on both sides of the heat dissipation keel 170, or on the same side of the heat dissipation keel 170; they can be installed symmetrically. It can also be installed asymmetrically, and there can be multiple first radiators 121 and multiple second radiators 123; specifically, the number and position of the first radiator 121 and the second radiator 123 can be adaptively adjusted according to the actual use of the heat dissipation module 100 and the space size of the display device 10; the present application does not make specific restrictions on the number and installation position of the first radiator 121 and the second radiator 123, and only takes the example of one first radiator 121 and one second radiator 123, which are respectively installed on both sides of the heat dissipation keel 170.

[0037] Figure 3 Schematic diagram of the third embodiment of the heat dissipation module of the present application, as shown Figure 3 As shown, Figure 3 The illustrated embodiment is based on Figure 2 In the improvement, a metal sleeve 172 is arranged in the slot 171, and the metal sleeve 172 wraps the protrusion 161 of the first heat conducting pipe 162 and the second heat conducting pipe 163.

[0038] The present embodiment is different from the previous embodiment in that a metal sleeve 172 is additionally provided in the slot 171 of the heat dissipation keel 170. When the first heat sink 121 and the second heat sink 123 are respectively inserted into the slot 171 from both sides of the heat dissipation keel 170 through the protrusion 161 of the first heat pipe 162 and the protrusion 161 of the second heat pipe 163, they can just be inserted into the metal sleeve 172, and the metal sleeve 172 completely wraps the protrusion 161 of the first heat pipe 162 and the protrusion 161 of the second heat pipe 163; the metal sleeve 172 makes it difficult for the heat of the protrusion 161 of the first heat pipe 162 and the second heat pipe 163 to be lost at the joint, so that the heat can be concentratedly conducted through the heat dissipation keel 170 to each heat sink 120 for heat dissipation, further improving the heat dissipation efficiency and heat dissipation performance of the heat dissipation module 100.

[0039] Of course, if the protrusion 161 of the first heat pipe 162 and the protrusion 161 of the second heat pipe 163 are not inserted into the same slot 171, the metal sleeve 172 can also increase the structural strength of the protrusion 161 and increase the stability of the first heat pipe 162 and the second heat pipe 163 connected to the heat dissipation keel 170 through the protrusion 161.

[0040] Figure 4 Schematic diagram of a fourth embodiment of the heat dissipation module of the present application, such as Figure 4 As shown, Figure 4 The illustrated embodiment is based on Figure 2 The first radiator 121 and the second radiator 123 are respectively provided with a first splicing portion 122 and a second splicing portion 124 on one side close to the fixing bracket 110. The radiator 120 further includes a third radiator 125 and a fourth radiator 127. The third radiator 125 and the fourth radiator 127 are respectively provided on both sides of the fixing bracket 110. The third radiator 125 and the fourth radiator 127 are respectively connected to the fixing bracket 110 through a heat pipe 160. The third radiator 125 corresponds to the position of the first radiator 121, and the fourth radiator 127 corresponds to the position of the second radiator 110. The position of the third splicing portion 123 corresponds to that of the third radiator 125, and the third splicing portion 126 is arranged at the position of the first splicing portion 122; the position of the fourth radiator 127 corresponds to that of the second splicing portion 124, and the fourth splicing portion 128 is arranged; splicing pieces 130 are arranged between the first splicing portion 122 and the third splicing portion 126, and between the second splicing portion 124 and the fourth splicing portion 128; the first splicing portion 122 and the third splicing portion 126, and the second splicing portion 124 and the fourth splicing portion 128 are all connected through the splicing pieces 130; the splicing pieces 130 are made of metal thermal conductive material.

[0041] This embodiment and Figure 2 The difference between the embodiments shown is that in this embodiment, a first splicing portion 122 and a second splicing portion 124 are respectively provided on the first radiator 121 and the second radiator 123. The first splicing portion 122 and the second splicing portion 124 can be spliced ​​with the third splicing portion 126 of the third radiator 125 and the fourth splicing portion 128 of the fourth radiator 127, respectively, to form a heat dissipation module 100 having four radiators 120. The first radiator 121 can also be spliced ​​with the third radiator 125 alone or the second radiator 123 can be spliced ​​with the third radiator 125 alone according to actual conditions. The fourth radiator 127 is spliced ​​to form a smaller heat dissipation module 100, or the heat dissipation module 100 only has the first radiator 121 and the fourth radiator 127, or only has the second radiator 123 and the third radiator 125 to form a smaller heat dissipation module 100; specifically, it can be flexibly assembled according to the actual space usage in the display device 10 to meet the adjustment of the size, form and number of heat dissipation modules 100 of different space sizes, further realize the modular design of the heat dissipation module 100, and improve the applicability of the heat dissipation module 100.

[0042] The first radiator 121 and the third radiator 125, as well as the second radiator 123 and the fourth radiator 127 are connected via a splicing piece 130, which is made of a metal thermal conductive material and can transfer the heat of the first radiator 121 and the second radiator 123 to the third radiator 125 and the fourth radiator 127. The third radiator 125 and the fourth radiator 127 can share the heat dissipation pressure of the first radiator 121 and the second radiator 123, and the heat can be further dissipated into the environment, thereby improving the heat dissipation efficiency of the heat dissipation module 100.

[0043] In addition, since the radiator 120 itself has a certain size and occupies a certain space, in order to further realize the modular design of the heat dissipation module 100 and adjust the size and shape of the radiator 120 itself, the present application also improves the radiator 120, and the specific improvements are as follows:

[0044] Figure 5 A bottom view of the support member and the heat dissipation fins in the fifth embodiment of the heat dissipation module of the present application; Figure 6 This is a side view of the support member and the heat dissipation fins in the fifth embodiment of the heat dissipation module of the present application. Figure 5 and Figure 6 As shown, the radiator 120 includes a heat sink 150 and a plurality of heat dissipation fins 140, the heat sink 150 includes a first support member 151 and a second support member 153, the first support member 151 and the second support member 153 are arranged in parallel, a plurality of first slots 152 are arranged at intervals on the first support member 151, a plurality of second slots 154 are arranged at intervals on the second support member 153, each first slot 152 corresponds to the position of each second slot 154 one by one, each heat dissipation fin 140 is perpendicular to the first support member 151 and the second support member 153, and is partially embedded in the first slot 152 and the second slot 154.

[0045] Unlike the traditional heat dissipation fins 140 installed by welding, the present embodiment converts the originally welded heat dissipation fins 140 into detachable heat dissipation fins 140, by respectively providing a plurality of first slots 152 and a plurality of second slots 154 in the heat dissipation frame 150 of the radiator 120 for connecting with the heat dissipation fins 140. When installing the heat dissipation fins 140, it is only necessary to align each heat dissipation fin 140 with the position of the first slot 152 and the second slot 154 for insertion, and the installation of the heat dissipation fins 140 is completed. In this way, a suitable number of heat dissipation fins 140 can be installed according to the actual required size of the radiator 120, and the layout, size and shape of each radiator 120 can be adjusted according to the number of heat dissipation fins 140, so as to realize the customization of the heat dissipation area of ​​the radiator 120, and effectively prevent the heat dissipation fins 140 from being deformed due to welding.

[0046] In order to ensure that the heat dissipation fins 140 still have sufficient heat dissipation area after being installed in the first slot 152 and the second slot 154, the present application also imposes restrictions on the depths of the first slot 152 and the second slot 154, as follows:

[0047] The depth of the first slot 152 and the second slot 154 is less than or equal to twice the thickness of the heat sink 140. This ensures that a sufficient portion of the heat sink 140 is embedded in the first slot 152 and the second slot 154 to form a stable installation, prevents the heat sink 140 from falling off from the first slot 152 and the second slot 154, and improves the structural stability of the heat sink 120. At the same time, the heat sink 140 can have a sufficient area exposed outside the first slot 152 and the second slot 154 to dissipate heat without affecting the heat dissipation efficiency of the heat sink 140.

[0048] In addition, the spacing between two adjacent first slots 152 or two adjacent second slots 154 is between 5 mm and 6 mm, which can ensure that there is enough gap between two adjacent heat sink fins 140 after installation, allowing air to flow in the gap between two adjacent heat sink fins 140 to improve heat dissipation efficiency.

[0049] Figure 7 FIG. 1 is a partial schematic diagram of a support member and heat dissipation fins in a sixth embodiment of the heat dissipation module of the present application. Figure 7 As shown, Figure 7 The illustrated embodiment is based on Figure 6 In the improvement, fixing members 156 are provided on the groove walls of the first slot 152 and the second slot 154 , and a card slot 155 is provided at a position of the heat dissipation fin 140 corresponding to the fixing member 156 , and the fixing member 156 is embedded in the card slot 155 and is card-engaged with the card slot 155 .

[0050] The present embodiment is different from the previous embodiment in that a fixing member 156 is provided on the groove wall of the first slot 152 and the second slot 154, and a card slot 155 is provided at the position of the heat dissipation fin 140 corresponding to the fixing member 156, wherein the fixing member 156 can be a card-engaging spring strip, and when the heat dissipation fin 140 is installed in the first slot 152 and the second slot 154, the fixing member 156 can just be carded into the card slot 155, and the fixing member 156 is elastically abutted and card-engaged in the card slot 155, so that the heat dissipation fin 140 is not easy to fall off after being installed in the first slot 152 and the second slot 154, thereby further improving the structural stability of the heat dissipation module 100.

[0051] Of course, after the heat sink 140 is installed in the first slot 152 and the second slot 154, it can also be fixed in other ways. For example, a fixing hole is opened in the slot wall of the first slot 152 and the second slot 154, and a mounting hole is opened at the position of the heat sink 140 corresponding to the fixing hole. After the heat sink 140 is installed in the first slot 152 and the second slot 154, a pin can be passed through the fixing hole and the mounting hole to lock the heat sink 140 with the first slot 152 and the second slot 154 to prevent the heat sink 140 from falling off from the first slot 152 and the second slot 154. The present application does not impose specific restrictions on the fixing method between the heat sink 140 and the first slot 152 and the second slot 154, as long as the heat sink 140 can be inserted into the first slot 152 and the second slot 154 to form a detachable fixation, the present application only takes the fixing method of the card slot 155 and the fixing member 156 as an example.

[0052] Figure 8 Schematic diagram of the seventh embodiment of the heat dissipation module of the present application, as shown Figure 8 As shown, the first heat pipe 162 and the second heat pipe 163 each include a first end 164, a heat pipe body 165 and a second end 166, and the first end 164 and the second end 166 are respectively located on both sides of the length direction of the heat pipe body 165; each heat dissipation fin 140 is provided with a through hole 141, and the through holes 141 on the plurality of heat dissipation fins 140 are arranged opposite to each other, and the second end 166 passes through the through holes 141 arranged opposite to each other on the plurality of heat dissipation fins 140 in sequence to connect the heat pipe body 165 with the plurality of heat dissipation fins 140; the first end 164 is partially exposed from the radiator 120 to form a protrusion 161.

[0053] In this embodiment, the second ends 166 of the first heat pipe 162 and the second heat pipe 163 are sequentially passed through the through holes 141 on the plurality of heat dissipation fins 140, so that the first heat pipe 162 and the second heat pipe 163 are directly connected to the plurality of heat dissipation fins 140 respectively, and are in direct contact with the heat dissipation fins 140 that mainly play a heat dissipation effect in the heat dissipation module 100. When the first heat pipe 162 and the second heat pipe 163 conduct the heat on the electronic component 300 to the radiator 120, the heat of the first heat pipe 162 and the second heat pipe 163 is directly conducted to the heat dissipation fins 140, and the heat is dissipated through the heat dissipation fins 140, thereby further improving the heat dissipation effect.

[0054] When the second ends 166 of the first heat pipe 162 and the second heat pipe 163 and the heat pipe body 165 are sequentially inserted into the through holes 141 and connected to the plurality of heat dissipation fins 140, most of the first heat pipe 162 and the second heat pipe 163 are connected to the radiator 120, and only the first end 164 is exposed from the radiator 120 to form a protrusion 161, which can be used for rapid splicing with the slot 171 of the heat dissipation keel 170, thereby further improving the structural stability of the heat dissipation module 100.

[0055] In addition, after the first heat pipe 162 and the second heat pipe 163 are inserted into the heat sink 140, they absorb heat when the electronic component 300 is running, and cool down and shrink when the electronic component 300 stops working. In order to prevent the first heat pipe 162 and the second heat pipe 163 from continuously expanding and contracting, causing the through hole 141 to damage the first heat pipe 162 and the second heat pipe 163, the present application also improves the through hole 141 for installing the first heat pipe 162 and the second heat pipe 163, as follows:

[0056] Fig. 9 This is a schematic diagram of the heat dissipation fins in the eighth embodiment of the heat dissipation module of the present application. Fig. 9 The illustrated embodiment is based on Figure 8 The improvement is that the through hole 141 includes a first hole 142 and a second hole 143, the second hole 143 is arranged at the edge of the first hole 142 and is connected to the first hole 142; the first hole 142 is circular, and the heat pipe body 165 is inserted into the first hole 142; the second hole 143 is arc-shaped, and the opening size of the second hole 143 is smaller than the opening size of the first hole 142.

[0057] This embodiment is different from the previous embodiment in that the through hole 141 in this embodiment is formed by combining the first hole 142 and the second hole 143, wherein the first hole 142 is circular and the second hole 143 is arc-shaped. The through hole 141 formed by combining the first hole 142 and the second hole 143 is similar to a "flask shape", and the first heat pipe 162 and the second heat pipe 163 are respectively inserted from the circular first hole 142, and the second hole 143 provides expansion space for the first heat pipe 162 and the second heat pipe 163 after insertion.

[0058] When the first heat-conducting pipe 162 and the second heat-conducting pipe 163 absorb heat and expand in the first hole 142, the opening formed by the second hole 143 at the first hole 142 can be used to allow the first hole 142 to form an adaptive deformation, thereby alleviating the expansion and squeezing force generated between the first hole 142 and the first heat-conducting pipe 162 and the second heat-conducting pipe 163, and effectively preventing the hole wall of the first hole 142 from damaging the surface of the first heat-conducting pipe 162 and the second heat-conducting pipe 163 when the first heat-conducting pipe 162 and the second heat-conducting pipe 163 expand; and the opening size of the second hole 143 is smaller than the opening size of the first hole 142, so that the first hole 142 can effectively limit the first heat-conducting pipe 162 and the second heat-conducting pipe 163, thereby preventing the first heat-conducting pipe 162 and the second heat-conducting pipe 163 from sliding into the second hole 143, and further improving the structural stability of the heat dissipation module 100.

[0059] Fig.10 is a schematic diagram of an embodiment of a display device of the present application, such as Fig.10 As shown, the present application also discloses a display device 10, including a housing 200, and the display device 10 also includes the above-mentioned heat dissipation module 100, and the heat dissipation module 100 is arranged in the housing 200. The heat dissipation module 100 is installed in the housing 200 of the display device 10, and the housing 200 is used to protect the heat dissipation module 100 from being invaded by external water vapor, and prevent the external water vapor from corroding the heat dissipation module 100 and affecting the heat dissipation effect of the heat dissipation module 100; at the same time, it can also prevent the display device 10 from being hit by the outside world during the movement or transportation process, resulting in damage to the heat dissipation module 100.

[0060] The shells 200 of different display devices 10 are of different sizes, and the accommodating space in the shells 200 is also designed differently according to different display devices 10. Therefore, the heat dissipation module 100 of the same size may not be installed in different display devices 10. If it needs to be installed in different display devices 10, it is necessary to redesign the mold and manufacture the heat dissipation module 100 that meets the specifications, which increases the cost and affects the applicability of the heat dissipation module 100.

[0061] It should be noted that the display device 10 in the present application is mainly aimed at a display device 10 with a display that can display images, such as a mobile phone, a computer, a television and other devices. The present application does not impose specific restrictions on the type of the display device 10.

[0062] In view of the above problems, the present application improves the heat dissipation module 100 in the display device 10. The present application improves the heat dissipation module 100 by connecting the fixed bracket 110 and the heat dissipation keel 170 using a heat pipe 160. When the electronic component 300 generates heat during operation, the heat is firstly conducted to the fixed bracket 110, and then conducted to the heat dissipation keel 170 by the fixed bracket 110 through the heat pipe 160. The heat dissipation keel 170 is used as the heat conduction center of the entire heat dissipation module 100. Since the heat dissipation keel 170 has a plurality of slots 171, the heat sink 120 with the heat pipe 160 can be installed by inserting the protrusion 161 formed by the heat pipe 160 into any slot 171. 70 conducts heat to the radiator 120 through the heat pipe 160 on the radiator 120, and finally dissipates the heat to the external environment through the radiator 120; in this way, according to the actual space usage of the display device 10 and the obstruction of the heat dissipation module 100 by other structures, one or more radiators 120 can be arbitrarily assembled through the slot 171 while reasonably avoiding and satisfying the installation, and radiators 120 of different sizes can be matched to adjust the size and shape of the entire heat dissipation module 100 to adapt to the installation of different display devices 10, thereby realizing the modularization of the heat dissipation module 100, improving the applicability of the heat dissipation module 100 in different application spaces, and further reducing the cost of the display device 10.

[0063] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0064] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A heat dissipation module, comprising a fixing bracket, wherein the fixing bracket is used to fix electronic components; characterized in that: The heat dissipation module further includes a plurality of heat sinks, a plurality of heat pipes and heat dissipation keels, at least one of the heat pipes is connected between the fixing bracket and the heat dissipation keel, A plurality of slots are arranged at intervals on the heat dissipation keel, and the plurality of slots are arranged along the extension direction of the heat dissipation keel; Each of the heat sinks is connected to at least one of the heat pipes, and a portion of the heat pipe is exposed from the heat sink to form a protrusion; At least one of the heat sinks is inserted into the slot through the protrusion and is spliced ​​with the heat dissipation keel.

2. The heat dissipation module according to claim 1, characterized in that: The radiator comprises a first radiator and a second radiator, the heat pipe comprises a first heat pipe and a second heat pipe, one end of the first heat pipe is connected to the first radiator, the other end forms the protrusion, and the protrusion of the first heat pipe is inserted into the slot from one side of the heat dissipation keel; one end of the second heat pipe is connected to the second radiator, the other end forms the protrusion, and the protrusion of the second heat pipe is inserted into the slot from a side of the heat dissipation keel away from the first radiator; The protruding portion of the first heat conducting pipe and the protruding portion of the second heat conducting pipe are respectively inserted into the slots and abut against each other.

3. The heat dissipation module according to claim 2, characterized in that: A metal sleeve is arranged in the slot, and the metal sleeve wraps the protruding parts of the first heat conducting pipe and the second heat conducting pipe.

4. The heat dissipation module according to claim 2, characterized in that: The first radiator and the second radiator are respectively provided with a first splicing portion and a second splicing portion on one side close to the fixing bracket. The radiator further comprises a third radiator and a fourth radiator, wherein the third radiator and the fourth radiator are respectively arranged on both sides of the fixing bracket, and the third radiator and the fourth radiator are respectively connected to the fixing bracket through the heat conducting pipe; The position of the third radiator corresponds to that of the first radiator, and the position of the fourth radiator corresponds to that of the second radiator. A third splicing portion is provided at a position of the third radiator corresponding to that of the first splicing portion, and a fourth splicing portion is provided at a position of the fourth radiator corresponding to that of the second splicing portion. Splicing pieces are provided between the first splicing portion and the third splicing portion, and between the second splicing portion and the fourth splicing portion. The first splicing portion and the third splicing portion, as well as the second splicing portion and the fourth splicing portion are all connected via the splicing pieces. The splicing pieces are made of metal thermal conductive material.

5. The heat dissipation module according to claim 2, characterized in that: The radiator includes a heat sink and a plurality of heat dissipation fins, the heat sink includes a first support member and a second support member, the first support member and the second support member are arranged in parallel, a plurality of first slots are arranged at intervals on the first support member, a plurality of second slots are arranged at intervals on the second support member, each of the first slots corresponds to each of the second slots in a one-to-one manner, and each of the heat dissipation fins is perpendicular to the first support member and the second support member, and is partially embedded in the first slot and the second slot.

6. The heat dissipation module according to claim 5, characterized in that: The groove walls of the first slot and the second slot are both provided with fixing members, the heat dissipation fins are provided with card slots at positions corresponding to the fixing members, and the fixing members are embedded in the card slots and card-connected with the card slots.

7. The heat dissipation module according to claim 6, characterized in that: The depth of the first slot and the second slot are both less than or equal to twice the thickness of the heat sink fin.

8. The heat dissipation module according to claim 5, characterized in that: The first heat-conducting pipe and the second heat-conducting pipe each include a first end, a heat pipe body, and a second end, wherein the first end and the second end are respectively located on two sides of the heat pipe body in a length direction; A through hole is provided on each of the heat dissipation fins, and the through holes on the plurality of heat dissipation fins are arranged opposite to each other. The second end passes through the through holes on the plurality of heat dissipation fins in sequence to connect the heat pipe body with the plurality of heat dissipation fins; the first end is partially exposed from the radiator to form the protrusion.

9. The heat dissipation module according to claim 8, characterized in that: The through hole includes a first hole and a second hole, the second hole is arranged at the edge of the first hole and is connected to the first hole; the first hole is circular, and the heat pipe body is inserted into the first hole; the second hole is arc-shaped, and the opening size of the second hole is smaller than the opening size of the first hole.

10. A display device, comprising a housing, characterized in that: The display device further comprises a heat dissipation module as claimed in any one of claims 1 to 9, wherein the heat dissipation module is arranged in the housing.

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