Multi-base-point U-shaped door opening convex shank single-face side trapezoid heat conduction integrated turbulent flow plate

By designing a multi-base point U-shaped doorway convex tibia single-side trapezoidal thermally conductive integrated turbulence plate, the existing turbulence plate is solved by using the through-door diversion partition and the U-shaped doorway convex tibia structure, dividing and denser heat flow field, the existing turbulence plate is solved at a high level The problem of poor thermal conductivity in the heat flow density environment has achieved efficient heat flow exchange and improved manufacturing performance.

CN119451054AActive Publication Date: 2025-02-14CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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Patent Information

Application Number
CN202411610584.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-12
Publication Date
2025-02-14
Estimated Expiration
2044-11-12

AI Technical Summary

Technical Problem

Existing turbulent plates are difficult to effectively conduct heat in high heat flow density environments, resulting in poor thermal performance of electronic equipment and may lead to failure of functional tasks.

Method used

Design a multi-base point U-shaped door opening convex tibia single-side trapezoidal thermally conductive integrated turbulence plate, forming a closed trapezoidal turbulence cavity through the integrated top cover and lower shell, and setting up multiple side-by-side door diversion partitions and U-shaped door opening convex Tibia, divides the hot flow line domain and the cold flow line domain, and increases the heat flow exchange.

Benefits of technology

The thermal conductivity of high heat flow density is achieved, flow resistance is reduced, manufacturing and economicality is improved, complex mechanical processes in conventional design are avoided, and efficient heat dissipation of electronic equipment is ensured.

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Abstract

The invention discloses a multi-base-point U-shaped door opening convex shin single-face side trapezoid heat conduction integrated turbulent flow plate which comprises an integrated top cover and a lower shell, the integrated top cover is connected with a heat source, a closed trapezoid turbulent flow cavity is formed after the lower shell and the integrated top cover are fixed in an enclosed mode, and a plurality of door penetrating flow dividing partitions arranged side by side are arranged in the turbulent flow cavity. A plurality of U-shaped door opening protruding shins matched with the door-penetrating shunting partitions are arranged at the end, facing the lower shell, of the integrated top cover. Heat conduction integration is fully practiced through the single-face side trapezoid turbulent flow cavity, the turbulent flow effect is obtained, through the structural design that the U-shaped door opening protruding shins are arranged on the integrated top cover, and the door penetrating flow dividing partition and the U-shaped door opening protruding shins are arranged, a heat dissipation working medium hot flow line domain and a heat dissipation working medium cold flow line domain can be divided, and multi-layer exchange of a heat flow densification area is achieved, so that the heat flow density is improved, and the heat dissipation efficiency is improved. The door-penetrating shunting partitions which are arranged side by side are arranged in the turbulent flow cavity of the integrated top cover and the lower shell, so that excellent manufacturability is achieved, and meanwhile flow resistance is reduced.
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Description

Technical Field

[0001] The invention relates to the technical field of turbulent plates, and more specifically to a multi-base-point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate. Background Art

[0002] At present, the integration of electronic equipment systems is becoming increasingly severe. According to the existing levels, it can be roughly divided into upper and lower domain blocks. The upper domain block generally refers to the integration of multi-task high-power equipment, and the lower domain block refers to the integration of single-molecule task low-power components (modules). This situation is concentrated in high-load electronic task systems. The power components in these integrated systems have rich task functions and complex characteristics. Then the heat is also concentrated and increased, and the heat dissipation of the whole machine has increased sharply. In response to the general principle of "multi-platform integration and reduction", the original working space of the equipment has been reduced successively, and many thermal links have been changed from wide to narrow, and parallel to series. As shown in the above series of restriction boundaries, the heat flux density in the core area has increased excessively, and the substrate temperature of many component modules has increased abnormally, which seriously affects the task performance reachability of the whole equipment.

[0003] In line with the rapid development of electronic technology in the information age, the multi-dimensional space-time envelope has expanded, and there is a strong demand for information search capabilities for deep space high-frequency scanning and tracing. In order to cope with such a large number of tasks, the strong functional types of electronic modules that match them are increasing day by day, and the density of electronic dissipation power units is also rising, resulting in the overall system platform power consumption reaching about megawatts, the global heat of the module components at the power amplifier source base point is about kilowatts, and the square millimeter micro-area round crystal substrate generates a high-frequency heat flux of hundreds of watts. In addition, it is precisely because the structural margin of the above-mentioned series of electronic information equipment (cabinets) with high-power heat source carriers is constantly shrinking, the space for thermal measures that can be extracted from them is extremely narrow, and the envelope size is strongly limited; in summary, the heat flux density in a single volume greatly exceeds the threshold, the temperature of the core shell of the power wafer rises faster, the bottom temperature breaks the device breakdown temperature, and the global thermal performance level of electronic equipment remains high, which will cause the functional mission of the equipment system to fail. Therefore, the limitations and obstacles of the electronic heat dissipation transmission link are becoming more and more apparent.

[0004] For turbulent plates with excessive heat flux requirements, if they are formed according to the conventional shell substrate design and integrated on the substrate, some heat conducting plates of certain sizes (shank thickness, shank height, spacing) are usually designed to achieve the purpose of taking heat away from the heat source body of the electronic device through the shank heat path; the shank structure size of this type of heat dissipation design will increase with the continuous increase of heat consumption, and the spacing will be denser. In this way, the existing industrial CNC machining technology is difficult to match. The reason is mainly reflected in: the heat that can be dissipated in the integrated flow basin is high, and it can only be solved by encrypting and lengthening the heat conducting shanks. However, this method gathers the difficulty of processing technology and further increases the cost of engineering research and development; following the aforementioned intensive heat conducting shank design, it will inevitably force the formation of a vertical column of strong flow resistance areas similar to "groove vortex", and based on this characteristic, it will hinder the full-condition heat conduction integration effect. Summary of the invention

[0005] The technical problem to be solved by the present invention is how to provide a turbulent plate with high manufacturability, low cost, small flow resistance and high heat flux density.

[0006] The present invention solves the above-mentioned technical problems through the following technical means: a multi-base point U-shaped doorway convex shank single-sided trapezoidal heat-conducting integrated turbulent plate, comprising an integrated top cover and a lower shell, the integrated top cover is connected to a heat source, the lower shell and the integrated top cover are enclosed and fixed to form a closed trapezoidal turbulent chamber, a plurality of through-door diversion partitions arranged side by side are arranged in the turbulent chamber, a plurality of U-shaped doorway convex shanks matched with the through-door diversion partitions are arranged at one end of the integrated top cover facing the lower shell, the through-door diversion partition is fastened to the lower shell through the U-shaped doorway convex shank, a heat dissipation medium is built in the turbulent chamber, the U-shaped doorway convex shank and the through-door diversion partition can divide the hot flow line domain and the cold flow line domain of the heat dissipation medium and cause multi-layer exchange in the heat flow densification area to form turbulence.

[0007] As a preferred technical solution, the U-shaped door opening convex shank includes convex shanks and door openings that are distributed at intervals, adjacent door openings are fixedly connected by the convex shanks, and a U-shaped hole is formed on the door opening.

[0008] As a preferred technical solution, the through-door diversion partition includes a turbulence plate, a limit plate, a diverter plate, and a guide plate. The turbulence plate is vertically arranged in the turbulence chamber, one end of the turbulence plate is fixedly connected to the limit plate, a diverter plate fixedly connected to the turbulence plate is arranged between adjacent limit plates, and a guide plate is fixed to the end of the diverter plate away from the limit plate. The plane where the bottom of the limit plate is located is the same as the plane where the inner wall of the bottom of the lower shell is located. The plane where the bottom of the limit plate is located is below the plane where the bottom of the turbulence plate is located, and the plane where the top of the limit plate is located is above the plane where the top of the turbulence plate is located.

[0009] As a preferred technical solution, the bottom inner wall of the lower shell body is provided with a plurality of card bodies adapted to the through-door diversion partition, and the top of the card body abuts against the bottom of the turbulence plate.

[0010] As a preferred technical solution, the integrated top cover and the U-shaped door opening shank are an integrally formed structure, and a buffer flow area is formed between adjacent U-shaped door opening shanks.

[0011] As a preferred technical solution, one end of the limit plate facing away from the turbulence plate abuts against the inner wall of the convex shank, part of the diverter plate and the guide plate extends out of the door opening, and part of the diverter plate and the guide plate are located between adjacent convex shanks, and the limit plate has the same height as the convex shank.

[0012] As a preferred technical solution, two liquid inlet and outlet joints are provided on the top of the integrated top cover, and the two liquid inlet and outlet joints are located at opposite corners of the integrated top cover.

[0013] As a preferred technical solution, the gap between the guide plate and the diverter plate, the gap between the door hole and the turbulence plate, the gap between the diverter plate, and the gap between the card body and the turbulence plate, the limit plate, and the inner wall of the lower shell form a flow hole.

[0014] As a preferred technical solution, the card body and the inner wall of the lower shell are an integrally formed structure, and one end of the card body abuts against an end of the turbulence plate away from the diverter plate.

[0015] As a preferred technical solution, the integrated top cover and the lower shell are fixed by welding, and the heat source includes an electronic component module, and the electronic component module is fixedly connected to one end of the integrated top cover away from the lower shell.

[0016] The beneficial effects of the present invention are:

[0017] (1) In the present invention, heat conduction integration is fully implemented through a single-sided trapezoidal turbulent cavity to obtain a turbulent effect. By arranging a U-shaped door opening convex leg on the integrated top cover, the structural design of the through-door diversion partition and the U-shaped door opening convex leg can divide the heat flow line domain and the cold flow line domain of the heat dissipation medium and cause multi-layer exchange of the heat flow densification area, thereby improving the heat flux density. The through-door diversion partitions arranged side by side are placed in the turbulent cavity of the integrated top cover and the lower shell, which has excellent manufacturability and reduces the flow resistance.

[0018] (2) The present invention aims to abandon the conventional design of excessively dense growth of batches of tiny fins in conventional electronic cooling research and development, thereby intuitively and efficiently eliminating numerous complex mechanical processes to improve economic efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the overall structure provided by an embodiment of the present invention;

[0020] Figure 2 A schematic diagram of an explosion structure provided by an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the layout structure of the through-door diversion partition provided in an embodiment of the present invention;

[0022] Figure 4 The embodiment of the present invention provides Figure 3 AA cross-sectional structural diagram;

[0023] Figure 5 The embodiment of the present invention provides Figure 3 BB cross-sectional structure diagram;

[0024] Figure 6 A bottom-view structural schematic diagram of an integrated top cover provided by an embodiment of the present invention;

[0025] Figure 7 A schematic diagram of a through-door flow-dividing partition structure provided in an embodiment of the present invention;

[0026] Figure 8 A schematic diagram of the structure of a buffer basin area provided in an embodiment of the present invention;

[0027] Figure numbers: 1. Integrated top cover; 2. U-shaped door opening shank; 21. shank; 22. Door opening; 221. Hole; 3. Buffer flow area; 4. Through-door diversion partition; 41. Turbulence plate; 42. Limit plate; 43. Diverter plate; 44. Drainage plate; 5. Flow hole; 6. Lower shell; 7. Card body; 8. Inlet and outlet liquid joints; 9. Electronic component module. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in combination with the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1 , Figure 2, a multi-base point U-shaped door opening convex leg single-sided trapezoidal heat-conducting integrated turbulent plate, comprising an integrated top cover 1, a U-shaped door opening convex leg 2, a through-door diversion partition 4, a lower shell 6, a card body 7, an inlet and outlet liquid joint 8, and an electronic component module 9. The end of the integrated top cover 1 facing the lower shell 6 is provided with a plurality of U-shaped door opening convex legs 2 arranged side by side along the width direction of the integrated top cover 1. The lower shell 6 and the integrated top cover 1 are enclosed and fixed to form a turbulent cavity, and a heat dissipation medium is provided in the turbulent cavity. A plurality of through-door diversion partitions 4 corresponding to the U-shaped door opening convex legs 2 are provided in the turbulent cavity; a plurality of card bodies 7 are provided at the bottom of the lower shell 6, that is, the bottom of the turbulent cavity, and the card bodies 7 are used to limit the through-door diversion partition 4. The through-door diversion partition 4 is connected and fastened to the integrated top cover 1 through the card body 7 and the U-shaped door opening convex leg 2. The end of the integrated top cover 1 away from the U-shaped door opening convex leg 2 is provided with an inlet and outlet liquid joint 8 and an electronic component module 9.

[0030] It should be noted that the integrated top cover 1 and the lower shell 6 are welded and fixed to form a complete heat-conducting structure, which is helpful to improve the heat dissipation effect; the integrated top cover 1 and the U-shaped door opening convex shank 2 are an integrally formed structure, and the U-shaped door opening convex shank 2 is formed by deep mechanical CNC boring and milling at the bottom of the integrated top cover 1; the gap between the U-shaped door opening convex shanks 2 forms a buffer flow basin area 3, and the through-door diversion partition 4 is provided with a flow hole 5.

[0031] See also Figure 3 , Figure 4 , Figure 6 The U-shaped door opening convex shank 2 includes convex shanks 21 and door openings 22 that are distributed at intervals. Adjacent door openings 22 are fixedly connected by the convex shanks 21. The convex shanks 21 and the door openings 22 are integrally formed, and a U-shaped hole 221 is formed on the door opening 22; the through-door diversion partition 4 is arranged in the working fluid mixed flow area, and is used to divide the hot flow line domain and the cold flow line domain, thereby promoting concentrated turbulence, fully satisfying the multi-layer exchange of the heat flow densification area, and can orderly generate a set of high convection coefficients and strong thermal conductivity chain reactions in a short period of time at the intersection section of the fluid layer; based on multiple factors such as heat consumption of components, tolerance temperature, thermal ductility and assembly preload, the number and shape design of the shank ribs of the U-shaped door opening convex shank 2 and the structure and shape design of the through-door diversion partition 4 are determined.

[0032] See also Figure 5 , Figure 7, the through-door diversion partition 4 includes a turbulent plate 41, a limiting plate 42, a diverter plate 43, and a guide plate 44. The turbulent plate 41 is a horizontally movable plate. In this embodiment, one end of the turbulent plate 41 abuts against a card body 7 vertically fixed to the bottom of the lower shell 6, and the other end is fixedly connected with a plurality of limiting plates 42. The plurality of limiting plates 42 are distributed at intervals, and gaps are left between adjacent limiting plates 42. The end of the limiting plate 42 away from the turbulent plate 41 abuts against the inner wall of the convex shank 21, and the plane where the bottom of the limiting plate 42 is located is located below the plane where the bottom of the turbulent plate 41 is located. In this embodiment, the plane where the bottom of the limiting plate 42 is located is coplanar with the plane where the bottom inner wall of the lower shell 6 is located and the plane where the bottom of the card body 7 is located, and the plane where the top of the limiting plate 42 is located is located above the plane where the top of the turbulent plate 41 is located;

[0033] The bottom of the turbulence plate 41 is against the top of the card body 7, and a diverter plate 43 is provided between adjacent limit plates 42. One end of the diverter plate 43 is fixedly connected to the turbulence plate 41, and the other end is fixedly connected to the guide plate 44. The height of the diverter plate 43 is the same as the hole 221. After the U-shaped door opening shank 2 is fixed to the through-door diverter partition 4, the diverter plate 43 and the guide plate 44 extend out of the door opening 22 of the U-shaped door opening shank 2, and the diverter plate 43 and the guide plate 44 are located between adjacent shanks 21. The lateral section plane of the card body 7 is parallel to the turbulence plate 41 of the through-door diverter partition 4, so as to maintain the stability of the turbulence chamber reference plane, and the turbulence plate 41 and the shank 21 are the same height.

[0034] The length-to-height ratio of the turbulence plate 41, the limit plate 42, the diverter plate 43, and the guide plate 44 can be adjusted according to design parameters, and the length-to-height ratio is between 0.5 and 1.

[0035] See also Figure 1 , Figure 7 , Figure 8 , the cold state heat dissipation medium filled with full pressure between the inner walls of the turbulent cavity is guided along the centerline of the inner cavity, and flows diagonally into and out of the liquid joint 8 at a variable angle. The two inlet and outlet liquid joints 8 are located at the diagonals of the integrated top cover 1, one is the liquid inlet end, and the other is the liquid outlet end; the electronic component module 9 can be integrated on the integrated top cover 1 by screwing, welding, etc. In this embodiment, the card body 7 is a semicircular block, of course, it can also be other shapes such as a rectangular block, a cube block, etc., but is not limited to this. The integrated top cover 1 is a trapezoid, and of course it can be circular, square, rectangular, etc.; the gap between the guide plate 44 and the diverter plate 43, the gap between the door hole 22 and the turbulent plate 41, the gap between the diverter plate 43, the card body 7 and the bottom of the turbulent plate 41, the limit plate 42, and the inner wall of the lower shell 6 form a flow hole 5, and the hot-cold flow lines in the flow hole 5 actively interact.

[0036] In actual engineering practice, it may happen that the multi-point turbulent plate cannot select an applicable thermal conductivity (parameter) series in the industrial material library at this level. In this case, there should be no strong constraints, and this material system can be jumped out, such as focusing on the type of composite materials or variant process mode. In addition, when the lateral length of the through-door diversion partition 4 is not completely equal to the inner cavity width of the turbulent cavity, it should not be regarded as a solidification constraint, but in engineering research and development, it is generally limited to not less than 97% of the inner cavity width. For cooling medium, it is mainly suitable for fluids with high flowability and large thermal conductivity, but other liquid substances with fluid-heat coupling characteristics are not excluded.

[0037] Usage: With the help of the strong heat capacity of the cooling medium, the medium is rapidly depressurized from the liquid inlet end of the inlet and outlet liquid joint 8 and falls into the turbulent chamber of the lower shell 6. First, it is squeezed and diverted through the guide plate 44 and the diverter plate 43 of the through-door diverter partition 4 and the convex leg 21. The flow boundary of the through-door diverter partition 4 is phase-separated to form multiple base point turbulent lines. The turbulent lines are spread around the flow area of ​​the filling card body 7. The local liquid stands in an instantaneous rotating flow state. At this time, most of the liquid columns are formed by the turbulent plate 41 and the door. The gap between the inner walls of the hole 22 enters the channel between the inner wall of the convex shank 21 and the limit plate 42, and after being stuck, it rotates back to the U-shaped door hole convex shank 2, resulting in heat conduction azimuthal coupling, and the same through-door diversion partition 4 cross-section generates cross-sectional flow resistance, based on which the "turbulent step" heat conduction integration is forced to be derived; as mentioned above, the cooling medium replaced by the thermal reaction of the previous level is successively diverted to the base point "turbulent domain" of the next level until the global heat conduction release is achieved in the turbulent main cavity 6.

[0038] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate, characterized in that: The utility model comprises an integrated top cover and a lower shell body, wherein the integrated top cover is connected to a heat source, and the lower shell body and the integrated top cover are enclosed and fixed to form a closed trapezoidal turbulent chamber, wherein a plurality of through-door diversion partitions arranged side by side are arranged in the turbulent chamber, and a plurality of U-shaped door opening convex legs matched with the through-door diversion partitions are arranged at one end of the integrated top cover facing the lower shell body, and the through-door diversion partitions are fastened to the lower shell body via the U-shaped door opening convex legs, and a heat dissipation medium is built in the turbulent chamber, and the U-shaped door opening convex legs and the through-door diversion partitions can divide the hot flow line domain and the cold flow line domain of the heat dissipation medium and cause multi-layer exchange in the heat flow densification zone to form turbulence.

2. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 1, characterized in that: The U-shaped door opening convex shank comprises convex shanks and door openings which are distributed at intervals. Adjacent door openings are fixedly connected by the convex shanks, and a U-shaped hole is formed on the door opening.

3. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 2, characterized in that: The through-door diversion partition includes a turbulence plate, a limit plate, a diverter plate, and a guide plate. The turbulence plate is vertically arranged in the turbulence chamber, one end of the turbulence plate is fixedly connected to the limit plate, a diverter plate fixedly connected to the turbulence plate is arranged between adjacent limit plates, and a guide plate is fixed to the end of the diverter plate away from the limit plate. The plane where the bottom of the limit plate is located is the same as the plane where the inner wall of the bottom of the lower shell is located. The plane where the bottom of the limit plate is located is below the plane where the bottom of the turbulence plate is located, and the plane where the top of the limit plate is located is above the plane where the top of the turbulence plate is located.

4. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 3, characterized in that: The inner wall at the bottom of the lower shell body is provided with a plurality of card bodies adapted to the through-door diversion partition, and the top of the card body abuts against the bottom of the turbulent plate.

5. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 1, characterized in that: The integrated top cover and the U-shaped door opening convex shank are an integrally formed structure, and a buffer flow area is formed between adjacent U-shaped door opening convex shanks.

6. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 3, characterized in that: One end of the limit plate facing away from the turbulence plate abuts against the inner wall of the convex shank, part of the diverter plate and the guide plate extends out of the door opening, and part of the diverter plate and the guide plate is located between adjacent convex shanks, and the limit plate has the same height as the convex shank.

7. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 1, characterized in that: The top of the integrated top cover is provided with two inlet and outlet liquid joints, and the two inlet and outlet liquid joints are located at opposite corners of the integrated top cover.

8. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 4, characterized in that: The gaps between the guide plate and the diverter plate and the door opening, the gaps between the door opening and the turbulent plate and the diverter plate, and the gaps between the card body and the turbulent plate, the limit plate, and the inner wall of the lower shell form flow holes.

9. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 4, characterized in that: The card body and the inner wall of the lower shell are an integrally formed structure, and one end of the card body abuts against an end of the turbulence plate away from the diverter plate.

10. The multi-base point U-shaped door opening convex shank single-sided trapezoidal heat-conducting integrated turbulent plate according to claim 9, characterized in that: The integrated top cover and the lower shell are fixed by welding. The heat source comprises an electronic component module. The electronic component module is fixedly connected to one end of the integrated top cover away from the lower shell.

Citation Information

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