Heat dissipation module and electronic equipment

Abstract

The invention discloses a heat dissipation module and electronic equipment, and is applied to the technical field of heat dissipation of the electronic equipment, and the heat dissipation module comprises a heat dissipation main body which is internally provided with a circulation flow channel for air flow to flow; liquid-cooling the cold plate; an air cooling assembly; and the liquid cooling fin assembly is installed in the heat dissipation main body, the liquid cooling fin assembly comprises a liquid cooling part and a fin part, and the fin part is located in the circulating flow channel and is in contact connection with the liquid cooling part. According to the heat dissipation module provided by the invention, the heat dissipation purpose of the first electric appliance element and the second electric appliance element can be realized by cooling the air flow in the circulating flow channel, and meanwhile, the arrangement of the liquid cooling plate and the air cooling assembly is matched, so that the heat dissipation of the first electric appliance element with relatively high heat productivity can be better realized, and the heat dissipation efficiency is improved. Meanwhile, the heat dissipation effect on the second electrical component is guaranteed, the heat dissipation efficiency is obviously improved, air in the heat dissipation body does not need to be exhausted to the machine room for heat dissipation, the cost of heat dissipation equipment in the machine room can be saved, and energy waste is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation module and electronic equipment. Background Art

[0002] As the power consumption of various electrical components in the circuit board increases rapidly, the requirements for heat dissipation efficiency are higher for devices that generate more heat, such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), memory, etc.

[0003] In the related technology, a cooling fan is generally used to blow out the high-temperature gas in the chassis, cool it down with the air conditioner in the computer room, and then return it to the inside of the chassis, thereby realizing the circulation of gas in the chassis and heat dissipation. For devices with higher heat generation, a liquid-cooled cold plate is installed to supplement the air-cooled heat dissipation with liquid cooling to improve the heat dissipation efficiency.

[0004] However, the heat dissipation method in the related technology needs to rely on the air conditioner in the computer room. The space of the computer room is large, and the temperature control accuracy is not high. At the same time, the circulation of gas inside and outside the chassis causes part of the cooling capacity of the liquid cooling plate to be wasted, resulting in low efficiency and high energy consumption.

[0005] Therefore, how to improve the heat dissipation efficiency of the heat dissipation module is a technical problem that technical personnel in this field currently need to solve. Summary of the invention

[0006] The purpose of the present invention is to provide a heat dissipation module and electronic equipment, which can effectively improve the heat dissipation efficiency of electrical components, reduce energy consumption and save costs.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A heat dissipation module, comprising:

[0009] A heat dissipation body, in which a circulation channel for airflow is formed, a first electrical component and a second electrical component are installed in the heat dissipation body, and the first electrical component is installed on a circuit board;

[0010] A liquid-cooled cold plate, disposed on the first electrical component, the liquid-cooled cold plate being connected to a first medium inlet pipeline and a first medium outlet pipeline;

[0011] An air cooling component, used for providing airflow for the circulation channel, wherein the air cooling component is installed in the heat dissipation body;

[0012] A liquid-cooled fin assembly is installed in the heat dissipation body, and the liquid-cooled fin assembly includes a liquid-cooled component and a fin component. The fin component is located in the circulation channel and is in contact with and connected to the liquid-cooled component. The liquid-cooled component is connected to a second medium inlet pipeline and a second medium outlet pipeline, the first medium inlet pipeline is connected to the second medium inlet pipeline, and the first medium outlet pipeline is connected to the second medium outlet pipeline.

[0013] On the other hand, it also includes a guide cover, a closed heat dissipation cavity is provided inside the heat dissipation body, the guide cover is installed in the closed heat dissipation cavity, and the guide cover is used to separate the closed heat dissipation cavity along the left and right direction or along the up and down direction to form the circulation channel.

[0014] On the other hand, the extension direction of the air guide cover is parallel to the extension direction of the circuit board, and avoidance portions are provided at both the front and rear ends of the air guide cover. The air flow flows from one side of the air guide cover through the avoidance portions to the other side of the air guide cover; the air cooling component is installed on at least one side of the air guide cover.

[0015] On the other hand, the heat dissipation body includes a shell and a front closing component and a rear closing component installed on the shell. The shell, the front closing component and the rear closing component surround and form the closed heat dissipation cavity. The front closing component and the rear closing component are both plate-shaped.

[0016] On the other hand, a hard disk area is provided at the front end of the closed heat dissipation cavity, and the front closing component is connected to the shell by rotation. The front closing component can be rotated relative to the shell to open or close the front end of the closed heat dissipation cavity; when the front end of the closed heat dissipation cavity is opened, the hard disk can be placed in the hard disk area or taken out from the hard disk area.

[0017] On the other hand, a rotating shaft and an elastic component installed on the rotating shaft are provided between the front closing component and the shell. When the front closing component opens the front end of the closed heat dissipation cavity, the elastic component undergoes elastic deformation to allow the front closing component to reset and close the front end of the closed heat dissipation cavity.

[0018] On the other hand, the liquid-cooled fin assembly is installed on a side of the heat dissipation body close to the air-cooling assembly, and the liquid-cooled fin assembly is located between the air-cooling assembly and the circuit board; or, the liquid-cooled fin assembly is installed on a side of the heat dissipation body away from the air-cooling assembly.

[0019] On the other hand, it also includes:

[0020] A main liquid inlet pipeline, on which the first medium inlet pipeline and the second medium inlet pipeline are connected in series;

[0021] A total liquid outlet pipeline, wherein the first medium outlet pipeline and the second medium outlet pipeline are connected in series to the liquid outlet pipeline;

[0022] A water pump is installed on the total liquid inlet pipeline or the total liquid outlet pipeline, and the water pump is used to control the flow in the total liquid inlet pipeline or the total liquid outlet pipeline.

[0023] On the other hand, it also includes:

[0024] A main liquid inlet pipeline, on which the first medium inlet pipeline and the second medium inlet pipeline are connected in parallel;

[0025] A total liquid outlet pipeline, wherein the first medium outlet pipeline and the second medium outlet pipeline are connected in parallel to the liquid outlet pipeline;

[0026] A first liquid outlet valve, used for adjusting the flow of the first medium inlet pipeline, the first liquid outlet valve being installed on the first medium inlet pipeline;

[0027] A second liquid outlet valve, used for adjusting the flow of the second medium inlet pipeline, the second liquid outlet valve being installed on the second medium inlet pipeline;

[0028] A first temperature sensor is installed on the first electrical component, and the first temperature sensor is used to obtain the component temperature of the first electrical component;

[0029] A second temperature sensor is installed in the heat dissipation body, and the second temperature sensor is used to obtain the channel temperature in the circulation flow channel;

[0030] A controller, wherein the first liquid outlet valve, the second liquid outlet valve, the first temperature sensor and the second temperature sensor are all connected to the controller; the controller is used to control the flow rate of the first liquid outlet valve to decrease when the element temperature is greater than the first target temperature, and to control the flow rate of the first liquid outlet valve to increase when the element temperature is less than the second target temperature; and is also used to control the flow rate of the second liquid outlet valve to decrease when the channel temperature is greater than the third target temperature, and to control the flow rate of the second liquid outlet valve to increase when the channel temperature is less than the fourth target temperature.

[0031] The present invention further provides an electronic device, comprising any one of the heat dissipation modules described above.

[0032] The heat dissipation module provided by the present invention has the following beneficial effects: by arranging the circulation flow channel in the heat dissipation body, the flow of air flow is utilized to realize the process of transferring heat from the first electrical component and the second electrical component to the liquid-cooled fin assembly and the air-cooled assembly; by arranging the liquid-cooled cold plate, the electrical component with higher heat dissipation arranged on the circuit board is cooled; the first electrical component may be a central processing unit, an image processor and other devices; since the liquid-cooled cold plate is fittedly arranged on the first electrical component, the heat dissipation is mainly aimed at the first electrical component, while the heat dissipation effect of other second electrical components, such as a network card installed on the circuit board, or a hard disk installed in the heat dissipation body and other structures, is poor; the heat dissipation module is achieved by adding the liquid-cooled fin assembly in the heat dissipation body; the liquid-cooled fin assembly is installed in the heat dissipation body; the liquid-cooled component of the liquid-cooled fin assembly realizes heat exchange by passing a cooling medium, At the same time, the fin component is contacted and connected to the liquid-cooling component, and the fin component can also be fixed on the liquid-cooling component, and any method that can achieve heat exchange is available; the fin component is arranged in the circulation channel, and then the setting of the air-cooling component is utilized, and the air-cooling component provides power for the airflow, so that the airflow in the circulation channel passes through the fin component and is transferred to the liquid-cooling component, thereby achieving a cooling effect on the fin component; at the same time, a first medium inlet pipeline and a first medium outlet pipeline are connected to the liquid-cooling cold plate, and a second medium inlet pipeline and a second medium outlet pipeline are connected to the liquid-cooling component. By connecting the first medium inlet pipeline with the second medium inlet pipeline and connecting the first medium outlet pipeline with the second medium outlet pipeline, the flow of the medium in the liquid-cooling cold plate and the liquid-cooling component can be facilitated, and the arrangement of each pipeline can be facilitated, which is beneficial to reducing costs and ensuring the normal heat dissipation and operation of electronic equipment.

[0033] The heat dissipation module provided by the present invention, by arranging the liquid-cooled fin assembly in the circulating flow channel, can achieve the purpose of heat dissipation for the first electrical component and the second electrical component by cooling the airflow in the circulating flow channel. At the same time, in conjunction with the arrangement of the liquid-cooled cold plate and the air-cooled assembly, it can better dissipate the heat of the first electrical component with a larger heat generation, while ensuring the purpose of heat dissipation for the second electrical component. The heat dissipation efficiency is significantly improved, and there is no need to discharge the air in the heat dissipation body to the computer room for heat dissipation, which can save the cost of heat dissipation equipment in the computer room and reduce energy waste.

[0034] In one embodiment, a closed heat dissipation cavity is provided inside the heat dissipation body. The air guide cover is provided and the closed heat dissipation cavity is divided by the air guide cover to form the circulation flow channel. The above-mentioned arrangement is to form a closed cooling system inside the heat dissipation body. The airflow passes through the first electrical component, the second electrical component, the air-cooling assembly and the liquid-cooled fin assembly in a self-circulating manner in the closed heat dissipation cavity, so that the liquid-cooled fin assembly is used to cool the airflow in the circulation flow channel, without using the airflow outside the heat dissipation body, thereby reducing interference with other equipment; and the arrangement of the closed heat dissipation cavity can make more effective use of the cooling capacity of the liquid-cooled fin assembly, the liquid-cooled cold plate and the air-cooled assembly, avoid energy waste, and further achieve energy saving.

[0035] The electronic device provided by the present invention is provided with the above-mentioned heat dissipation module. Since the heat dissipation module has the above-mentioned technical effects, the electronic device provided with the heat dissipation module should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 This is a structural schematic diagram of a first specific implementation mode of the heat dissipation module provided by the present invention;

[0038] Figure 2 This is a structural schematic diagram of a second specific implementation mode of the heat dissipation module provided by the present invention;

[0039] Figure 3 This is a schematic structural diagram of a third specific implementation mode of the heat dissipation module provided by the present invention;

[0040] Figure 4 This is a front view of the heat dissipation module provided by the present invention;

[0041] Figure 5 for Figure 4 A schematic diagram of the structure of the front closed component in the heat dissipation module when it is opened;

[0042] Figure 6 It is a schematic diagram of the structure of the liquid cooling fin assembly in the heat dissipation module provided by the present invention.

[0043] Reference numerals:

[0044] Circuit board 100; management board 101; hard disk 200; power supply 300;

[0045] Heat dissipation body 1; shell 11; front closing component 12; rotating shaft 121; rear closing component 13; liquid-cooled cold plate 2; first medium inlet pipeline 21; first medium outlet pipeline 22; air cooling assembly 3; liquid-cooled fin assembly 4; liquid cooling component 41; fin component 42; second medium inlet pipeline 43; second medium outlet pipeline 44; air guide cover 5; avoidance portion 51; first liquid outlet valve 6; second liquid outlet valve 7. DETAILED DESCRIPTION

[0046] The core of the present invention is to provide a heat dissipation module and electronic equipment, which can significantly improve the heat dissipation efficiency, ensure the normal operation of electrical components, and ensure the smooth operation of electronic equipment.

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] Please refer to Figure 1 In this embodiment, the heat dissipation module includes:

[0049] The heat dissipation body 1 has a circulation channel for airflow formed therein, and a first electrical component and a second electrical component are installed in the heat dissipation body 1, and the first electrical component is installed on the circuit board 100;

[0050] A liquid-cooled cold plate 2 is disposed on the first electrical component, and a first medium inlet pipeline 21 and a first medium outlet pipeline 22 are connected to the liquid-cooled cold plate 2;

[0051] The air cooling component 3 is used to provide airflow for the circulation channel, and the air cooling component 3 is installed in the heat dissipation body 1;

[0052] The liquid cooling fin assembly 4 is installed in the heat dissipation body 1. The liquid cooling fin assembly 4 includes a liquid cooling component 41 and a fin component 42. Figure 6 As shown, the fin component 42 is located in the circulation channel and is in contact with the liquid cooling component 41. The liquid cooling component 41 is connected to a second medium inlet pipeline 43 and a second medium outlet pipeline 44. The first medium inlet pipeline 21 is connected to the second medium inlet pipeline 43, and the first medium outlet pipeline 22 is connected to the second medium outlet pipeline 44.

[0053] Specifically, the heat dissipation body 1 can be a chassis or a part of a chassis of an electronic device, such as a server or a switch. The circuit board 100, the first electrical component and the second electrical component are all installed in the heat dissipation body 1. The heat dissipation body 1 is also provided with a power supply 300, cables and other components; the first electrical component is a component with a large heat output, such as a CPU, a GPU, a memory and other components with a large heat output, and the second electrical component is other components on the circuit board 100 with a relatively small heat output, such as a network card, and the second electrical component can also be a hard disk 200 and other components that are not arranged on the circuit board 100 but also generate heat; the liquid-cooled cold plate 2 passes the cooling medium through the first medium inlet pipeline 21, and then the cooling medium undergoes heat exchange and then flows out through the first medium outlet pipeline 22; the liquid-cooled component 41 passes the cooling medium through the second medium inlet pipeline 43, and then after heat exchange with the fin component 42, it flows out through the second medium outlet pipeline 44.

[0054] Furthermore, the cooling medium can be a single-phase solution or a two-phase solution; when a single-phase solution is used, it is generally a water-based solution, and liquid cooling heat dissipation of the liquid-cooled cold plate 2 and the liquid-cooled component 41 is achieved by changing the solution temperature; when a two-phase solution is used, a Freon series solution is generally used, and the Freon solution is vaporized and dissipated at the position of the liquid-cooled cold plate 2 and the liquid-cooled component 41, and takes away the heat of the first electrical component or the fin component 42. In the liquid-cooled fin assembly 4, heat dissipation is mainly achieved by the temperature increase of the liquid Freon, and only a small amount of liquid Freon will vaporize.

[0055] The heat dissipation module, by setting a circulation flow channel in the heat dissipation body 1, utilizes the flow of airflow to realize the process of heat transfer from the first electrical component and the second electrical component to the liquid-cooled fin assembly 4 and the air-cooled assembly 3, and dissipates the electrical components with higher heat dissipation arranged on the circuit board 100 through the setting of the liquid-cooled cold plate 2. The first electrical component can be a central processing unit, an image processor and other devices. Since the liquid-cooled cold plate 2 is fitted on the first electrical component, it mainly dissipates the heat for the first electrical component, while for other second electrical components, such as the network card installed on the circuit board 100, or the hard disk 200 installed in the heat dissipation body 1, the heat dissipation effect is poor; the heat dissipation module, by adding a liquid-cooled fin assembly 4 in the heat dissipation body 1, the liquid-cooled fin assembly 4 is installed in the heat dissipation body 1, and the liquid-cooled part 41 of the liquid-cooled fin assembly 4 realizes heat exchange by passing a cooling medium, and at the same time contacts the liquid-cooled part 41 The fin component 42 can be connected or fixed on the liquid cooling component 41, and any method that can achieve heat exchange is available; the fin component 42 is arranged in the circulation channel, and then the setting of the air cooling component 3 is utilized, and the air cooling component 3 provides power for the airflow, so that the airflow in the circulation channel passes through the fin component 42 and is transferred to the liquid cooling component 41, thereby achieving a cooling effect on the fin component 42; at the same time, the liquid cooling cold plate 2 is connected with a first medium inlet pipeline 21 and a first medium outlet pipeline 22, and the liquid cooling component 41 is connected with a second medium inlet pipeline 43 and a second medium outlet pipeline 44. By connecting the first medium inlet pipeline 21 with the second medium inlet pipeline 43 and connecting the first medium outlet pipeline 22 with the second medium outlet pipeline 44, the flow of the medium in the liquid cooling cold plate 2 and the liquid cooling component 41 can be facilitated, and the arrangement of each pipeline can be facilitated, which is beneficial to reducing costs and ensuring the normal heat dissipation and operation of electronic equipment.

[0056] The heat dissipation module, by arranging a liquid-cooled fin assembly 4 in the circulating flow channel, can achieve the purpose of heat dissipation for the first electrical component and the second electrical component by cooling the airflow in the circulating flow channel. At the same time, with the arrangement of the liquid-cooled cold plate 2 and the air-cooled assembly 3, it can better dissipate the heat for the first electrical component with a larger heat generation, while ensuring the heat dissipation effect for the second electrical component. The heat dissipation efficiency is significantly improved, and there is no need to discharge the air in the heat dissipation body 1 to the computer room for heat dissipation, which can save the cost of the heat dissipation equipment in the computer room and reduce energy waste.

[0057] In some embodiments, please refer to Figure 4, and also includes a deflector 5. A closed heat dissipation cavity is provided inside the heat dissipation body 1. The deflector 5 is installed in the closed heat dissipation cavity. The deflector 5 is used to separate the closed heat dissipation cavity along the left-right direction or along the up-down direction to form a circulation channel. Specifically, a closed heat dissipation cavity is provided inside the heat dissipation body 1. By setting the deflector 5, the closed heat dissipation cavity is separated by the deflector 5 to form a circulation channel. The above setting is to form a closed cooling system inside the heat dissipation body 1. The airflow passes through the first electrical component, the second electrical component, the air cooling component 3 and the liquid cooling fin component 4 in a self-circulating manner in the closed heat dissipation cavity, so that the liquid cooling fin component 4 is used to cool the airflow in the circulation channel, without using the airflow outside the heat dissipation body 1, reducing interference with other equipment; and the setting of the closed heat dissipation cavity can make more full use of the cooling capacity of the liquid cooling fin component 4, the liquid cooling cold plate 2 and the air cooling component 3, avoid energy waste, and further achieve energy saving. More specifically, when the air guide 5 is arranged parallel to the circuit board 100, the closed heat dissipation cavity is divided into two upper and lower channels. When the air guide 5 is arranged perpendicular to the circuit board 100, the closed heat dissipation cavity is divided into two left and right channels. Then, by leaving a certain space at the front and rear ends of the air guide 5, a circulation channel can be formed in the closed heat dissipation cavity to facilitate the circulation of airflow. Of course, an open cavity can also be set in the heat dissipation body 1, and the airflow enters the heat dissipation body 1 and then exits to the machine room. Due to the addition of the liquid cooling fin assembly 4, the airflow does not need to be heat exchanged in the machine room. Of course, the airflow in the open cavity can also be heat exchanged with the airflow in the machine room.

[0058] In some embodiments, the extension direction of the air deflector 5 is parallel to the extension direction of the circuit board 100, that is, it is better to adopt an up and down circulation method. With this arrangement, the circuit board 100 can be set in the lower layer of the air deflector, and the upper layer of the air deflector 5 is only used for air circulation. The front and rear ends of the air deflector 5 are provided with avoidance portions 51. The airflow flows from one side of the air deflector 5 to the other side of the air deflector 5 through the avoidance portions 51, thereby realizing the circulation of the airflow; the air cooling component 3 is installed on at least one side of the air deflector 5, and any method that can provide power for the airflow is available. The air cooling component 3 is preferably installed at a position close to the circuit board 100 to facilitate the arrangement of power supply and cables.

[0059] In some embodiments, the heat dissipation body 1 includes a shell 11 and a front closing component 12 and a rear closing component 13 installed on the shell 11. The shell 11, the front closing component 12 and the rear closing component 13 surround and form a closed heat dissipation cavity, and the front closing component 12 and the rear closing component 13 are both plate-shaped; specifically, the shell 11 is closed by the front closing component 12 and the rear closing component 13 to form a closed heat dissipation cavity, and then the air guide cover 5 is installed in the closed heat dissipation cavity to form a circulation flow channel; the air guide cover 5 can be plate-shaped, and except for the avoidance portion 51 at the front and rear ends of the air guide cover 5, the other positions are connected to the shell 11 to ensure that the airflow can only flow through the avoidance portion 51, thereby ensuring the circulation flow effect of the airflow and improving the uniformity of the cooling effect.

[0060] In some embodiments, please refer to Figure 5 A hard disk 200 area is provided at the front end of the closed heat dissipation cavity, and the front closing component 12 is connected to the shell 11 by rotation. The front closing component 12 can rotate relative to the shell 11 to open or close the front end of the closed heat dissipation cavity; when the front end of the closed heat dissipation cavity is opened, the hard disk 200 can be placed in the hard disk 200 area or taken out from the hard disk 200 area; through the rotation setting of the front closing component 12, the front closing component 12 constitutes a reversible closing component, which can facilitate the installation and removal of the hard disk 200; further, the rear closing component 13 can also be set as a reversible closing component, and by opening both the front closing component 12 and the rear closing component 13, the closed heat dissipation cavity can be switched to an open state, the airflow of the closed heat dissipation cavity can be replaced, and the exchange of gas inside the closed heat dissipation cavity and external gas can be realized.

[0061] In some embodiments, a rotating shaft 121 and an elastic component installed on the rotating shaft 121 are provided between the front closing component 12 and the shell 11. The elastic component can be a torsion spring. When the front closing component 12 opens the front end of the closed heat dissipation cavity, the elastic component undergoes elastic deformation. When the front closing component 12 loses the action of external force, the front closing component 12 can drive the front closing component 12 to reset under the action of elastic force. After the front closing component 12 is reset, the front end of the closed heat dissipation cavity can be closed, so that the closed heat dissipation cavity is closed again. A circulating flow channel can be formed in the closed heat dissipation cavity without the need for a sealing setting.

[0062] In some embodiments, the liquid-cooled fin assembly 4 is installed on a side of the heat dissipation body 1 close to the air-cooled assembly 3, and the liquid-cooled fin assembly 4 is located between the air-cooled assembly 3 and the circuit board 100; in this way, the liquid-cooled fin assembly 4 is close to the air-cooled assembly 3, which not only facilitates the arrangement of cables, is conducive to combing the cables and reducing the use of cables, but also can make full use of the space in the chassis.

[0063] In some embodiments, the liquid-cooled fin assembly 4 is installed on a side of the heat dissipation body 1 away from the air-cooled assembly 3; specifically, the liquid-cooled fin assembly 4 can also be arranged on a side of the heat dissipation body 1 away from the air-cooled assembly 3. Such a configuration can facilitate the introduction of cooling medium into the liquid-cooled fin assembly 4, reduce the use of the second medium inlet pipeline 43 and the second medium outlet pipeline 44, and save costs.

[0064] In some embodiments, it further comprises:

[0065] The main liquid inlet pipeline, the first medium inlet pipeline 21 and the second medium inlet pipeline 43 are connected in series to the liquid inlet pipeline;

[0066] The main liquid outlet pipeline, the first medium outlet pipeline 22 and the second medium outlet pipeline 44 are connected in series on the liquid outlet pipeline;

[0067] A water pump is installed on the total liquid inlet pipeline or the total liquid outlet pipeline. The water pump is used to control the flow in the total liquid inlet pipeline or the total liquid outlet pipeline.

[0068] Specifically, the above arrangement uses a total liquid inlet pipeline and a total liquid outlet pipeline to provide cooling medium for the liquid-cooled cold plate 2 and the liquid-cooled fin assembly 4, the total liquid inlet pipeline and the total liquid outlet pipeline are connected to the cooling medium storage device, and the first medium inlet pipeline 21 and the second medium inlet pipeline 43 are connected in series to the liquid inlet pipeline, that is, the cooling medium in the total liquid inlet pipeline will pass through the first medium inlet pipeline 21 and the second medium inlet in turn, and can also pass through the second medium inlet pipeline 43 and the first medium inlet pipeline 21 in turn, that is, the cooling medium in the liquid-cooled cold plate 2 and the liquid-cooled fin assembly 4 is in the same The cooling medium flows in a circulation pipeline, and then the flow rate of the cooling medium in the entire circulation pipeline can be controlled by the flow control of the water pump; the second medium outlet pipeline 44 is also used as the first medium inlet pipeline 21, or the first medium outlet pipeline 22 is also used as the second medium inlet pipeline 43, that is, the cooling medium first passes through the liquid-cooled cold plate 2 and then enters the liquid-cooled fin assembly 4, or first passes through the liquid-cooled fin assembly 4 and then flows to the liquid-cooled cold plate 2. With this arrangement, the arrangement of each pipeline is more convenient, the length of the pipeline is shorter, and the cost of the pipeline can be effectively saved.

[0069] In some embodiments, please refer to Figure 3 , also includes:

[0070] The main liquid inlet pipeline, the first medium inlet pipeline 21 and the second medium inlet pipeline 43 are connected in parallel to the liquid inlet pipeline;

[0071] The total liquid outlet pipeline, the first medium outlet pipeline 22 and the second medium outlet pipeline 44 are connected in parallel to the liquid outlet pipeline;

[0072] A first liquid outlet valve 6, used for adjusting the flow of the first medium inlet pipeline 21, and the first liquid outlet valve 6 is installed on the first medium inlet pipeline 21;

[0073] A second liquid outlet valve 7, used for adjusting the flow of the second medium inlet pipeline 43, and the second liquid outlet valve 7 is installed on the second medium inlet pipeline 43;

[0074] A first temperature sensor is installed on the first electrical component, and the first temperature sensor is used to obtain the component temperature of the first electrical component;

[0075] A second temperature sensor is installed in the heat dissipation body 1, and the second temperature sensor is used to obtain the channel temperature in the circulation channel;

[0076] The controller, the first liquid outlet valve 6, the second liquid outlet valve 7, the first temperature sensor and the second temperature sensor are all connected to the controller; the controller is used to control the flow rate of the first liquid outlet valve 6 to decrease when the element temperature is greater than the first target temperature, and to control the flow rate of the first liquid outlet valve 6 to increase when the element temperature is less than the second target temperature; it is also used to control the flow rate of the second liquid outlet valve 7 to decrease when the channel temperature is greater than the third target temperature, and to control the flow rate of the second liquid outlet valve 7 to increase when the channel temperature is less than the fourth target temperature.

[0077] Specifically, the support body is further provided with a first sub-collector and a second sub-collector, the total liquid inlet pipeline is connected to the first medium inlet pipeline 21 and the second medium inlet pipeline 43 through the first sub-collector, and the total liquid outlet pipeline is connected to the first medium outlet pipeline 22 and the second medium outlet pipeline 44 through the second sub-collector; in the above manner, the liquid-cooled cold plate 2 and the liquid-cooled fin assembly 4 are connected in parallel, that is, the total liquid inlet pipeline is divided into two paths after entering the support body, and enters the liquid-cooled cold plate 2 and the liquid-cooled fin assembly 4 respectively. At the same time, the first liquid outlet valve 6 and the second liquid outlet valve 7 are respectively provided on the first medium inlet pipeline 21 and the second medium inlet pipeline 43, and the first liquid outlet valve 6 and the second liquid outlet valve 7 are respectively used to control the flow of the first medium inlet pipeline 21 and the second medium inlet pipeline 43. In this manner, the cooling medium entering the liquid-cooled cold plate 2 and the liquid-cooled fin assembly 4 can be adjusted separately as needed, so that the cooling capacity of the cooling medium can be more fully utilized, and the total usage of the cooling medium can be saved, thereby reducing the overall cost of the heat dissipation module. Furthermore, in order to better regulate the flow of the first medium inlet pipeline 21 and the second medium inlet pipeline 43, a first temperature sensor and a second temperature sensor are also provided. The first temperature sensor is used to obtain the component temperature of the first electrical component, and the second temperature sensor is used to obtain the channel temperature in the circulation flow channel and control the setting of the controller. The controller can obtain the component temperature and the channel temperature. The first electrical component has a large calorific value. When the temperature of the component rises, the flow of the cooling medium entering the first medium inlet pipeline 21 can be increased by increasing the flow of the first liquid outlet valve 6, so that the first electrical component can be dissipated in time; the flow of the second liquid outlet valve 7 can also be adjusted by judging the channel temperature, thereby changing the flow of the cooling medium entering the second medium inlet pipeline 43, so that the channel temperature in the circulation flow channel can be adjusted in time; the first temperature sensor can obtain the component temperature of the first electrical component in real time, and the second temperature sensor can obtain the channel temperature in the circulation flow channel in real time, thereby improving the accuracy of temperature control. Of course, when the medium flow rate in the total liquid inlet pipeline is fixed, the flow rate of the cooling medium entering the second medium inlet pipeline 43 can also be indirectly adjusted by only setting the first liquid outlet valve 6, that is, by adjusting the flow rate of the first liquid outlet valve 6. This method can reduce the setting of the liquid outlet valve and make the control more convenient. More specifically, the total liquid inlet pipeline and the total liquid outlet pipeline can be connected to the heat dissipation body 1 using a blind plug connector to improve the disassembly and assembly efficiency of the total liquid inlet pipeline and the total liquid outlet pipeline.

[0078] In some embodiments, the air cooling component 3 includes a plurality of cooling fans arranged in sequence, and the controller is further used to control the power and start time of the cooling fans according to the size of the component temperature and the channel temperature; further, the air cooling component 3 includes a plurality of upper cooling fans located on the upper layer of the air guide cover 5 and a plurality of lower cooling fans located on the upper layer of the air guide cover 5, and the upper cooling fans and the lower cooling fans are located at the same end of the closed cooling cavity, that is, the upper cooling fans and the lower cooling fans are both located at the front end of the closed cooling cavity, such an arrangement can facilitate the line connection between the upper cooling fans and the lower cooling fans, in order to ensure the upper cooling fans and the lower cooling fans are connected. The airflow direction of the heat fan is straight, and the upper cooling fan and the lower cooling fan can respectively adopt the blowing and suction modes. For example, the upper cooling fan adopts the suction mode, and the lower cooling fan adopts the blowing mode, so as to realize the circulation of airflow in the circulation channel; or, the upper cooling fan and the lower cooling fan can also be arranged at both ends of the closed cooling cavity, for example, the upper cooling fan is located at the rear end of the closed cooling cavity, and the lower cooling fan is located at the front end of the closed cooling cavity. With this arrangement, the upper cooling fan and the lower cooling fan can both be set to the blowing mode; of course, other methods that can meet the circulation of airflow are also possible.

[0079] In some embodiments, the circuit board 100 includes a management board 101 and a mounting board, the first electrical component is arranged on the mounting board, and the controller is arranged on the pipeline board; by dividing the circuit board 100 into different units, modular assembly can be easily realized and flexibility can be improved; further, the power supply 300 in the heat dissipation body 1 can be connected to an external device through a wiring terminal.

[0080] Specifically, in a specific embodiment, the heat dissipation module is installed in a heat dissipation body 1, such as a chassis of an electronic device, and a hard disk 200, a memory, a circuit board 100 and a power supply 300 are also provided in the chassis. The heat dissipation module includes an air cooling component 3, a liquid cooling cold plate 2, a liquid cooling fin component 4, a plurality of pipelines and a guide cover 5; the electronic device full liquid cooling heat dissipation module of the liquid cooling cold plate 2 + the liquid cooling fin component 4 is a heat dissipation method by combining the liquid cooling cold plate 2 with the liquid cooling fin component 4; the liquid cooling cold plate 2 realizes the heat dissipation of the CPU or the CPU + memory, The liquid-cooled fin assembly 4 realizes the heat dissipation of other heat-generating electrical components; the heat dissipation body 1 adopts two types: closed and open; the liquid-cooled fin assembly 4 includes a main fin + copper tube or aluminum tube radiator, and the liquid-cooled cold plate 2 is a copper or aluminum liquid-cooled cold plate 2 with shovel fins inside; the liquid-cooled cold plate 2 + liquid-cooled fin assembly 4 can be connected in series, and when a closed cycle is formed inside the heat dissipation body 1, the internal air flow circulates to achieve full liquid cooling; the liquid-cooled cold plate 2 + liquid-cooled fin assembly 4 are connected in series to a unified pipeline, and the interface uses a quick connector to connect to the external total liquid inlet pipeline and total liquid outlet pipeline. The air inside the heat dissipation body 1 is in a closed cycle, and the temperature rises after flowing through the electrical components, and then cools down through the liquid-cooled fin assembly 4. The air flow is reciprocated from both sides or the top through the air-cooled assembly 3 to ensure the heat dissipation of the heat dissipation body 1. The internal temperature rise of the heat dissipation body 1 is estimated to be 10-17°C, which can achieve the consistency of the inlet temperature and outlet temperature of the heat dissipation body 1. The solution of the liquid-cooled cold plate 2 + liquid-cooled fin assembly 4 can be achieved through natural cooling, The computer room air conditioner only needs to maintain the ambient temperature; a deflector 5 is arranged in the heat dissipation body 1, and the deflector 5 can be arranged only above the circuit board 100, until the liquid-cooled fin assembly 4, dividing the closed heat dissipation cavity into two upper and lower circulation channels, and heat exchange is performed in the middle through the liquid-cooled fin assembly 4; the front closed component 12, such as the front window of the chassis, adopts a >90° upward flip-up baffle, and the rear closed component 13, such as the rear window of the chassis, is closed with a sealing groove baffle to form a closed heat dissipation cavity of the heat dissipation body 1; or, the deflector 5 uses a door frame type to close the middle of the heat dissipation body 1, that is, the deflector 5 is perpendicular to the circuit board 100, and the gaps on both sides of the deflector 5 and the heat dissipation body 1 form an air flow channel; the first medium inlet pipeline 21 and the first medium outlet pipeline 22 and the second medium inlet pipeline 43 and the second medium outlet pipeline 44 can be plastic or rubber pipelines made of materials such as PTFE or EPDM. Furthermore, a closed heat dissipation chamber is arranged inside the heat dissipation body 1, that is, a closed air circulation is adopted, which can support an inlet water temperature of 32°C, and the outlet water temperature is adjusted according to the load; the air flow temperature on the upwind side is designed to be 35°C, and the outlet air temperature rise is designed to be 10-17°C in combination with the load power consumption; the cooling medium adopts a two-phase solution, which is vaporized in the liquid-cooled cold plate 2, with an inlet liquid temperature of 30°C and an outlet air temperature of 42°C; and, the heat dissipation architecture of the liquid-cooled cold plate 2 + liquid-cooled fin assembly 4, the temperature control of the heat dissipation body 1 can be combined with the operating system to identify the temperature points on the circuit board 100 and to perform joint control with the air-cooled assembly 3.

[0081] In addition to the above-mentioned heat dissipation module, the present invention further provides an electronic device including the above-mentioned heat dissipation module. For the structure of other parts of the electronic device, please refer to the relevant technology and will not be described in detail herein.

[0082] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0083] The heat dissipation module provided by the present invention is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A heat dissipation module, characterized in that: include: A heat dissipation body (1) is formed with a circulation channel for airflow, a first electrical component and a second electrical component are installed in the heat dissipation body (1), and the first electrical component is installed on a circuit board (100); A liquid-cooled cold plate (2) is arranged on the first electrical component, and a first medium inlet pipeline (21) and a first medium outlet pipeline (22) are connected to the liquid-cooled cold plate (2); An air cooling component (3) is used to provide airflow for the circulation channel, and the air cooling component (3) is installed in the heat dissipation body (1); A liquid-cooling fin assembly (4) is installed in the heat dissipation body (1), and the liquid-cooling fin assembly (4) comprises a liquid-cooling component (41) and a fin component (42). The fin component (42) is located in the circulation channel and is in contact with and connected to the liquid-cooling component (41). The liquid-cooling component (41) is connected to a second medium inlet pipeline (43) and a second medium outlet pipeline (44). The first medium inlet pipeline (21) is connected to the second medium inlet pipeline (43), and the first medium outlet pipeline (22) is connected to the second medium outlet pipeline (44).

2. The heat dissipation module according to claim 1, characterized in that: It also comprises a deflector (5), wherein a closed heat dissipation cavity is provided inside the heat dissipation body (1), the deflector (5) is installed in the closed heat dissipation cavity, and the deflector (5) is used to separate the closed heat dissipation cavity in the left-right direction or in the up-down direction to form the circulation channel.

3. The heat dissipation module according to claim 2, characterized in that: The extension direction of the air guide cover (5) is parallel to the extension direction of the circuit board (100); both front and rear ends of the air guide cover (5) are provided with avoidance portions (51); the airflow flows from one side of the air guide cover (5) to the other side of the air guide cover (5) through the avoidance portions (51); and the air cooling assembly (3) is installed on at least one side of the air guide cover (5).

4. The heat dissipation module according to claim 2, characterized in that: The heat dissipation body (1) comprises a shell (11) and a front closing component (12) and a rear closing component (13) mounted on the shell (11); the shell (11), the front closing component (12) and the rear closing component (13) surround and form the closed heat dissipation cavity; the front closing component (12) and the rear closing component (13) are both plate-shaped.

5. The heat dissipation module according to claim 4, characterized in that: A hard disk (200) area is provided at the front end of the closed heat dissipation cavity. The front closing component (12) is rotatably connected to the housing (11). The front closing component (12) can be rotated relative to the housing (11) to open or close the front end of the closed heat dissipation cavity. When the front end of the closed heat dissipation cavity is opened, the hard disk (200) can be placed in the hard disk (200) area or taken out from the hard disk (200) area.

6. The heat dissipation module according to claim 5, characterized in that: A rotating shaft (121) and an elastic component mounted on the rotating shaft (121) are provided between the front closing component (12) and the housing (11); when the front closing component (12) opens the front end of the closed heat dissipation cavity, the elastic component undergoes elastic deformation to allow the front closing component (12) to reset and close the front end of the closed heat dissipation cavity.

7. The heat dissipation module according to claim 1, characterized in that: The liquid-cooling fin assembly (4) is installed on a side of the heat dissipation body (1) close to the air-cooling assembly (3), and the liquid-cooling fin assembly (4) is located between the air-cooling assembly (3) and the circuit board (100); or, the liquid-cooling fin assembly (4) is installed on a side of the heat dissipation body (1) away from the air-cooling assembly (3).

8. The heat dissipation module according to any one of claims 1 to 7, characterized in that: Also includes: A main liquid inlet pipeline, wherein the first medium inlet pipeline (21) and the second medium inlet pipeline (43) are connected in series to the liquid inlet pipeline; A total liquid outlet pipeline, wherein the first medium outlet pipeline (22) and the second medium outlet pipeline (44) are connected in series to the liquid outlet pipeline; A water pump is installed on the total liquid inlet pipeline or the total liquid outlet pipeline, and the water pump is used to control the flow in the total liquid inlet pipeline or the total liquid outlet pipeline.

9. The heat dissipation module according to any one of claims 1 to 7, characterized in that: Also includes: A total liquid inlet pipeline, the first medium inlet pipeline (21) and the second medium inlet pipeline (43) being connected in parallel to the liquid inlet pipeline; A total liquid outlet pipeline, wherein the first medium outlet pipeline (22) and the second medium outlet pipeline (44) are connected in parallel to the liquid outlet pipeline; a first liquid outlet valve (6), used for adjusting the flow rate of the first medium inlet pipeline (21), the first liquid outlet valve (6) being installed on the first medium inlet pipeline (21); a second liquid outlet valve (7), used for adjusting the flow rate of the second medium inlet pipeline (43); the second liquid outlet valve (7) is installed on the second medium inlet pipeline (43); A first temperature sensor is installed on the first electrical component, and the first temperature sensor is used to obtain the component temperature of the first electrical component; a second temperature sensor installed in the heat dissipation body (1), the second temperature sensor being used to obtain the channel temperature in the circulation channel; A controller, wherein the first liquid outlet valve (6), the second liquid outlet valve (7), the first temperature sensor and the second temperature sensor are all connected to the controller; the controller is used to control the flow rate of the first liquid outlet valve (6) to decrease when the element temperature is greater than a first target temperature, and to control the flow rate of the first liquid outlet valve (6) to increase when the element temperature is less than a second target temperature; and is also used to control the flow rate of the second liquid outlet valve (7) to decrease when the channel temperature is greater than a third target temperature, and to control the flow rate of the second liquid outlet valve (7) to increase when the channel temperature is less than a fourth target temperature.

10. An electronic device, comprising a heat dissipation module, characterized in that: The heat dissipation module is the heat dissipation module according to any one of claims 1 to 9.

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