A solder ball production device

Abstract

The present application provides a tin ball production device, which includes a tin melting part, a tin ball forming part, and a transverse air supply system. The tin melting part is used to melt the tin into molten tin, and a molten tin outlet is provided at the bottom of the tin melting part; the tin ball forming part is connected to the molten tin outlet of the tin melting part, and the tin ball forming part includes an outer shell and a forming plate arranged inside the outer shell, the edge of the forming plate is connected to the inner wall of the outer shell, and a plurality of forming holes of the same size are provided on the forming plate, and the molten tin entering the inner shell falls on the forming plate; the transverse air supply system is provided on the outer shell below the forming plate, and the transverse air supply system includes an air supply pipe and an air outlet pipe, and the air supply pipe is used to convey a transverse airflow into the outer shell. The tin ball production device provided by the present application can produce high-quality tin balls with uniform shape, smooth surface and no adhesion, thereby ensuring the quality of the tin balls.

Description

Technical Field

[0001] The invention relates to the technical field of solder ball production, and in particular to a solder ball production device. Background Art

[0002] In electronic packaging, semiconductor manufacturing and many other industrial fields, solder balls are an important connection material. Their quality and production efficiency directly affect the performance and cost of the final product. Traditional solder ball production methods often involve complex process flows and have low production efficiency, making it difficult to meet the needs of large-scale production. In particular, how to effectively control the shape, size and surface quality of solder balls during the solder ball forming process has always been a technical problem in the industry.

[0003] Existing solder ball production equipment often lacks an effective cooling and shaping mechanism during the process of forming molten solder into solder balls, resulting in solder balls of different shapes, rough surfaces, and even adhesion, which seriously affects the quality of the solder balls and subsequent use effects. Summary of the invention

[0004] The purpose of the present invention is to provide a solder ball production device to solve the technical problems of the traditional solder ball production equipment lacking an effective cooling and shaping mechanism, resulting in solder balls with different shapes and rough surfaces.

[0005] To achieve the above object, the technical solution adopted by the present invention is: to provide a solder ball production device, the solder ball production device comprising:

[0006] A tin material melting part, the tin material melting part is used to melt the tin material into molten tin, and a molten tin outlet is provided at the bottom of the tin material melting part;

[0007] A tin ball forming part, the tin ball forming part is connected to the tin water outlet of the tin material melting part, the tin ball forming part comprises an outer shell and a forming plate arranged inside the outer shell, the edge of the forming plate is connected to the inner wall of the outer shell, the forming plate is provided with a plurality of forming holes of the same size, and the tin water entering the inner shell falls on the forming plate;

[0008] A transverse air supply system is arranged on the outer shell below the forming plate. The transverse air supply system includes an air supply pipe and an air outlet pipe. The air supply pipe is used to transport transverse airflow into the outer shell.

[0009] In one embodiment, the forming holes on the forming plate are circular holes, and the forming holes are concentrated and distributed directly below the tin water outlet of the tin melting part.

[0010] In one embodiment, a screening system is further included, wherein the screening system includes a first screen, wherein the first screen is disposed inside the housing and below the forming plate, and the aperture of the screen holes on the first screen is consistent with the diameter of the finished solder balls.

[0011] In one embodiment, the screening system further includes a second screen, which is arranged below the first screen, and the screen hole diameter of the second screen is smaller than the screen hole diameter of the first screen.

[0012] In one embodiment, the first screen and the second screen are both inclined, and a slag outlet is provided on the outer shell near the bottom end of the first screen; a solder ball outlet is provided on the outer shell near the bottom end of the second screen.

[0013] In one embodiment, it also includes a rounding portion, which is arranged between the first screen and the second screen. The rounding portion includes a baffle and a plurality of rounding units. The edge of the baffle is connected to the inner wall of the outer shell. A connecting hole is opened on the baffle. The rounding unit is installed in the connecting hole of the baffle. The solder balls screened by the first screen first fall onto the baffle and then enter into the rounding unit for rounding processing.

[0014] In one embodiment, an arc-shaped collecting groove is provided on the upper surface of the baffle with the connecting hole as the center.

[0015] In one embodiment, the full circle unit comprises:

[0016] A full round tube, the full round tube is installed in the connecting hole of the baffle, the full round tube includes a preheating section at the top and a shaping section at the bottom; a preheating channel is arranged in the preheating section, an arc-shaped guide groove is arranged at the top of the preheating section, and the arc-shaped guide groove is connected with the preheating channel; a shaping channel is arranged in the shaping section, and the shaping channel is connected with the preheating channel; the diameter of the preheating channel is larger than the diameter of the finished solder ball, and the diameter of the shaping channel is the same as the diameter of the finished solder ball;

[0017] An annular heating plate, wherein the annular heating plate is embedded in the full-circular tube;

[0018] A wind rotation system, the wind rotation system is arranged on the full-circle tube, the wind rotation system includes a first air hole, a second air hole, an air supply channel and a pump body; the first air hole and the second air hole are both arranged in the preheating section, and one end of the first air hole and the second air hole are both connected to the preheating channel, and the air outlet directions of the first air hole and the second air hole are both inclined; the air supply channel is arranged inside the full-circle tube; the first air hole and the second air hole are both connected to the output end of the pump body through the air supply channel.

[0019] In one embodiment, the full-circle unit further includes a tin water collecting portion, and the tin water collecting portion includes an annular groove, a collecting channel, and a collecting chamber;

[0020] The annular groove is arranged at the bottom of the shaping channel, and the annular groove and the inner wall of the shaping channel have a smooth transition;

[0021] The collecting chamber is arranged inside the shaping section and below the annular groove, and the collecting chamber is communicated with the annular groove above through the collecting channel.

[0022] In one embodiment, a valve is provided at the bottom of the collecting chamber to facilitate tin discharge, and the top of the collecting chamber is connected to the input end of the pump body.

[0023] One or more of the above technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0024] The solder ball production device provided in the embodiment of the present invention can produce high-quality solder balls with uniform shape, smooth surface and no adhesion through precise tin material melting and molding control, combined with the cooling and shaping effect of the lateral air supply system, to ensure the quality of the solder balls. In addition, the optimized solder ball molding process and efficient cooling mechanism enable the present invention to significantly improve the production speed compared with traditional equipment, thereby meeting the needs of large-scale production and improving production efficiency. In addition, the solder ball production device of the present invention is reasonably designed, easy to operate, and has low maintenance costs. Due to the improvement in production efficiency and the improvement in solder ball quality, the overall production cost is effectively reduced. Finally, the solder ball production device of the present invention can be applied to the production of solder balls of different specifications and materials. By adjusting the size of the molding hole and the parameters of the lateral air supply system (including wind force, direction, etc.), customized production of different solder balls can be easily achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the structure of a solder ball production device provided in an embodiment of the present invention;

[0027] Figure 2 A cross-sectional view of a solder ball production device provided in an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of the structure of a full-circle unit provided by an embodiment of the present invention;

[0029] Figure 4 A cross-sectional view of a full-circle unit provided by an embodiment of the present invention;

[0030] Figure 5 A schematic structural diagram of a tin water collecting portion provided in an embodiment of the present invention.

[0031] The respective reference numerals are as follows:

[0032] 1. Tin melting part; 2. Tin ball forming part; 3. Horizontal air supply system; 4. Screening system; 5. Rounding part; 11. Tin water outlet; 21. Shell; 22. Forming plate; 31. Air supply pipe; 32. Air outlet pipe; 41. First screen; 42. Second screen; 51. Baffle; 52. Rounding unit; 211. Slag outlet; 212. Tin ball outlet; 221. Forming hole; 521. Round pipe; 522. Ring heating plate; 5 23. Wind-driven rotation system; 524. Tin water collecting part; 5211. Preheating section; 5212. Shaping section; 5231. First air hole; 5232. Second air hole; 5233. Air supply channel; 5234. Pump body; 5241. Annular groove; 5242. Collecting channel; 5243. Collecting chamber; 5244. Valve; 52111. Preheating channel; 52112. Arc-shaped guide groove; 52121. Shaping channel. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] See also Figure 1 to Figure 2 The embodiment of the present application provides a solder ball production device, which includes a tin melting part 1, a tin ball forming part 2, and a transverse air supply system 3. The tin melting part 1 is used to melt the tin into tin water, and a tin water outlet 11 is provided at the bottom of the tin melting part 1; the tin ball forming part 2 is connected to the tin water outlet 11 of the tin melting part 1, and the tin ball forming part 2 includes a shell 21 and a forming plate 22 arranged inside the shell 21, the edge of the forming plate 22 is connected to the inner wall of the shell 21 (to prevent the tin water from leaking out from the gap between the forming plate 22 and the shell 21), and a plurality of forming holes 221 of the same size are provided on the forming plate 22, and the tin water entering the shell 21 falls on the forming plate 22; the transverse air supply system 3 is arranged on the shell 21 below the forming plate 22, and the transverse air supply system 3 includes an air supply pipe 31 and an air outlet pipe 32, and the air supply pipe 31 is used to convey a transverse airflow into the shell 21.

[0038] The tin ball production device provided in this embodiment produces tin balls by first using the tin melting part 1 to melt the tin material into molten tin. The molten molten tin is input downward from the molten tin outlet 11 into the tin ball forming part 2 and falls on the forming plate 22. Since the forming hole 221 is provided on the forming plate 22, the molten tin will drip downward from the forming hole 221 in the shape of water drops. When the molten tin drips downward to the vicinity of the horizontal air supply system 3, the horizontal airflow delivered by the horizontal air supply system 3 is used to rotate the dripping tin, gradually changing from a water drop shape to a spherical shape. With the cooling effect of the horizontal airflow, the spherical tin is cooled and solidified into a tin ball, thereby completing the production of the tin ball.

[0039] During this process, the aperture size of the forming hole 221 can be adjusted accordingly according to the specific diameter of the solder ball to be produced (the adjustment method can be to replace the forming plate 22 with different aperture sizes), as well as the wind speed of the horizontal air flow delivered by the horizontal air supply system 3 below, so as to achieve the production of solder balls of different diameters, so that the solder ball production device of this embodiment has a wide range of applicability.

[0040] Specifically, the tin material melting part 1 can be a funnel-shaped structure, and a heating structure (such as a built-in resistance heating wire, etc.) is provided on its inner wall. The heating structure inside is used to heat the tin block raw material and melt it into molten tin. The melted tin water flows from the tin water outlet 11 at the bottom into the tin ball forming part 2 below.

[0041] In order to facilitate feeding into the tin melting part 1, an openable top cover can be optionally installed on the top of the solder ball melting part. When feeding is needed, just open the top cover to conveniently feed. After feeding, close the top cover to maintain the airtightness of the tin melting part 1 to prevent the toxic and harmful gases generated during the tin melting process from overflowing (and an exhaust device can be installed on the top cover to extract the gas generated by the tin melting for centralized treatment), which is more environmentally friendly. At the same time, the thermal insulation performance of the tin melting part 1 is improved, the heat loss of the tin water in the tin melting part 1 is reduced, and the energy consumed by the tin melting part 1 to melt the tin is reduced, saving production costs.

[0042] In addition, a regulating valve may be provided at the molten tin outlet 11 , and the regulating valve may adjust the flow rate of the molten tin at the molten tin outlet 11 to cooperate with the molten tin forming unit 2 to process molten tin balls of different sizes.

[0043] In the transverse air supply system 3, the input end of the air supply pipe 31 can be connected to a booster pump, and the booster pump is used to generate airflow to supply the transverse air supply system 3. Optionally, in order to further improve the quality of the solder balls, the horizontal airflow delivered by the transverse air supply system 3 is an inert gas, which can protect the solder balls and reduce the probability of oxidation during the solder ball forming process (the solder balls are used in the electronic field, and the oxidized solder balls will reduce their conductivity), thereby improving the quality of the solder balls.

[0044] In one embodiment, the forming holes 221 on the forming plate 22 are circular holes, and the forming holes 221 are concentrated and distributed directly below the molten tin outlet 11 of the tin melting part 1. The circular forming holes 221 are conducive to making the shape of the molten tin dripping from the forming holes 221 closer to a sphere, thereby making the manufactured tin balls closer to a spherical shape, thereby improving the quality of the tin balls. In addition, since the molten tin pressure in the area of ​​the forming plate 22 near the position directly below the molten tin outlet 11 is affected by the impact force of the molten tin flowing in from above, the molten tin pressure there is higher than that in the edge area. In order to avoid the molten tin dripping from the forming holes 221 too quickly or even forming a line due to excessive molten tin pressure, more forming holes 221 are opened in the area of ​​the forming plate 22 near the position directly below the molten tin outlet 11 to disperse the molten tin pressure and ensure the molding quality.

[0045] like Figure 3 As shown, in one embodiment, a screening system 4 is further included, and the screening system 4 includes a first screen 41, which is arranged inside the housing 21 and below the forming plate 22. The aperture of the screen holes on the first screen 41 is consistent with the diameter of the finished solder ball. The first screen 41 can screen out defective products (slag) larger than the diameter of the finished solder ball to ensure the quality of the finished product.

[0046] In one embodiment, the screening system 4 further includes a second screen 42, which is disposed below the first screen 41, and the screen aperture of the second screen 42 is smaller than the screen aperture of the first screen 41. The second screen 42 is used to screen out debris (irregular solid tin) mixed in the solder balls.

[0047] In one embodiment, the first screen 41 and the second screen 42 are both inclined, and a slag outlet 211 is provided at a position near the bottom of the first screen 41 on the housing 21; a solder ball outlet 212 is provided at a position near the bottom of the second screen 42 on the housing 21. By setting the first screen 41 and the second screen 42 both inclined, and respectively providing the slag outlet 211 and the solder ball outlet 212 at the bottom of the first screen 41 and the bottom of the second screen 42, the sieved slag can automatically move downward along the inclined surface of the first screen 41 to the slag outlet 211 for discharge. Similarly, the inclined second screen 42 can make the screened finished solder balls automatically gather at the bottom of the second screen 42 and be output from the solder ball outlet 212, thereby ensuring the continuous screening effect of the first screen 41 and the second screen 42.

[0048] Optionally, in order to further improve the slag discharge efficiency of the first screen 41, the inclination direction of the first screen 41 can be set to be inclined downward from the end close to the air supply pipe 31 to the end close to the air outlet pipe 32, so that the airflow output by the transverse air supply system 3 can play an auxiliary role, blowing out the slag on the first screen 41 along the inclined surface, thereby improving the slag discharge efficiency of the first screen 41.

[0049] like Figure 2-5 As shown, in order to further improve the sphericity of the solder balls and thus improve the quality of the solder ball products, in one embodiment, it also includes a rounding portion 5, which is arranged between the first sieve 41 and the second sieve 42. The rounding portion 5 includes a baffle 51 and a plurality of rounding units 52. The edge of the baffle 51 is connected to the inner wall of the outer shell 21, and a connecting hole is opened on the baffle 51. The rounding unit 52 is installed in the connecting hole of the baffle 51. The solder balls screened by the first sieve 41 first fall onto the baffle 51, and then enter the rounding unit 52 for rounding treatment.

[0050] After being screened by the first screen 41, the solder balls first gather on the baffle 51, and then roll into the connection hole and enter the rounding unit 52. The rounding unit 52 rounds the solder balls to make the solder balls more round. In order to improve the rounding efficiency, multiple sets of rounding units 52 are provided in this embodiment, and each rounding unit 52 operates independently without interfering with each other. By providing multiple rounding units 52, the rounding efficiency is improved.

[0051] In one embodiment, an arc-shaped collecting groove is provided on the upper surface of the baffle plate 51 with the connecting hole as the center. The arc-shaped collecting groove can play a guiding role, so that the solder balls on the baffle plate 51 can enter the rounding unit 52 more quickly for rounding.

[0052] In one embodiment, the full-circle unit 52 includes a full-circle tube 521, an annular heating plate 522, and a wind-driven rotating system 523. The full-circle tube 521 is installed in the connection hole of the baffle 51, and the full-circle tube 521 includes a preheating section 5211 at the top and a shaping section 5212 at the bottom; a preheating channel 52111 is provided in the preheating section 5211, and an arc-shaped guide groove 52112 is provided at the top of the preheating section 5211, and the arc-shaped guide groove 52112 is connected to the preheating channel 52111; a shaping channel 52121 is provided in the shaping section 5212, and the shaping channel 52121 is connected to the preheating channel 52111 (the connection position of the two is smoothly transitioned to avoid hindering the falling of the solder ball); the diameter of the preheating channel 52111 is larger than the diameter of the finished solder ball, and the diameter of the shaping channel 52121 is the same as the diameter of the finished solder ball. The annular heating plate 522 is embedded in the full-circle tube 521. The wind rotation system 523 is arranged on the full-circle tube 521, and the wind rotation system 523 includes a first air hole 5231, a second air hole 5232, an air supply channel 5233 and a pump body 5234; the first air hole 5231 and the second air hole 5232 are both arranged in the preheating section 5211, and one end of the first air hole 5231 and the second air hole 5232 are both connected to the preheating channel 52111, and the air outlet directions of the first air hole 5231 and the second air hole 5232 are both inclined; the air supply channel 5233 is arranged inside the full-circle tube 521; the first air hole 5231 and the second air hole 5232 are both connected to the output end of the pump body 5234 through the air supply channel 5233.

[0053] When the solder ball falls from the connection hole of the baffle 51 into the full-circle tube 521 , the solder ball quickly enters the preheating channel 52111 of the preheating section 5211 under the guidance of the arc-shaped guide groove 52112 , and falls downward along the preheating channel 52111 . When the solder ball is in the preheating channel 52111, the pump body 5234 of the wind rotation system 523 pumps the airflow to the first air hole 5231 and the second air hole 5232 through the air supply channel 5233, and sprays the air into the preheating channel 52111 through the first air hole 5231 and the second air hole 5232. When the solder ball passes through the exit positions of the first air hole 5231 and the second air hole 5232, the solder ball starts to rotate under the action of the sprayed airflow, and then the rotating solder ball continues to move downward along the preheating channel 52111. Under the heating of the annular heating plate 522, the surface temperature of the solder ball gradually increases. In conjunction with the rotation of the solder ball, the preheating section 5211 can make the solder ball heated more evenly. When the preheated solder ball moves downward into the shaping channel 52121 of the shaping section 5212, if there is a local protrusion on the surface of the solder ball, the rotating solder ball will make the protrusion contact with the inner wall of the shaping channel 52121 (the temperature of the shaping channel 52121 is higher than the melting point of tin), so that the protrusion is melted and smoothed out along with the contact friction with the inner wall of the shaping channel 52121. The solder ball after completing the rounding is discharged from the bottom of the shaping channel 52121, making the surface of the solder ball smoother and more round.

[0054] Optionally, the outlet angles of the first air hole 5231 and the second air hole 5232 are both set to be inclined, and the outlet angles of the two are parallel to each other (specifically, the outlet angle of the first air hole 5231 is inclined upward, and the outlet angle of the second air hole 5232 is inclined downward), and the outlets of the first air hole 5231 and the second air hole 5232 are at the same horizontal height, and the aperture sizes of the two are consistent. Therefore, when the solder ball passes through the first air hole 5231 and the second air hole 5232, since the output airflow velocity in the first air hole 5231 and the second air hole 5232 is consistent (both supplied by the pump body 5234), the wind force in the horizontal direction given to the solder ball by the airflow in two directions offsets, and only the torque that makes the solder ball rotate remains, so that the solder ball will not deviate from or contact the inner wall of the preheating channel 52111 under the action of the airflow and wind force while rotating, thereby ensuring the temperature and uniformity of the solder ball preheating.

[0055] In addition, since the air outlet angles of the first air hole 5231 and the second air hole 5232 are both set to be inclined, when the solder ball rotates under the action of airflow and wind force, its rotation axis is perpendicular to the axis of the preheating channel 52111 and the shaping channel 52121, so that when the solder ball enters the shaping channel 52121, any protrusion on the surface of the solder ball can contact the inner wall of the shaping channel 52121 during the rotation process, thereby ensuring the rounding effect of the rounding unit 52.

[0056] like Figure 4-5 As shown, when the shaping section 5212 rounds the solder ball, the irregular areas such as the bumps on the solder ball will be melted into molten tin and flow downward along the inner wall of the shaping channel 52121, in order to prevent the molten tin from continuing to adhere to the rounded solder ball surface or dripping onto the finished solder ball surface below. In one embodiment, the rounding unit 52 also includes a molten tin collection portion 524, which includes an annular groove 5241, a collection channel 5242, and a collection chamber 5243; the annular groove 5241 is arranged at the bottom of the shaping channel 52121, and the annular groove 5241 and the inner wall of the shaping channel 52121 have a smooth transition; the collection chamber 5243 is arranged inside the shaping section 5212 and below the annular groove 5241, and the collection chamber 5243 is connected to the annular groove 5241 above through the collection channel 5242.

[0057] The molten tin flows downward along the inner wall of the shaping channel 52121 until it converges into the annular groove 5241, and continues to flow into the collection chamber 5243 for collection through the collection channel 5242 connected to the annular groove 5241. In addition, by smoothly transitioning between the annular groove 5241 and the inner wall of the shaping channel 52121, it is beneficial for the molten tin to flow into the annular groove 5241 along the smooth transition area, thereby improving the molten tin collection effect and preventing the molten tin from continuing to adhere to the surface of the fully rounded solder ball or dripping onto the surface of the solder ball finished product below.

[0058] In one embodiment, a valve 5244 is provided at the bottom of the collecting chamber 5243 to facilitate tin discharge, and the top of the collecting chamber 5243 is connected to the input end of the pump body 5234 .

[0059] A tin-draining valve 5244 is provided at the bottom of the collecting chamber 5243 so as to regularly clean the tin collected in the collecting chamber 5243. In addition, by connecting the top of the collecting chamber 5243 with the input end of the pump body 5234, the negative pressure suction force generated by the pump body 5234 is used to act along the collecting chamber 5243 through the collecting channel 5242 to the annular groove 5241, so that the tin water in the shaping channel 52121, the annular groove 5241 and the collecting channel 5242 can be more effectively gathered in the collecting chamber 5243, thereby improving the collection efficiency of the tin water collecting part 524. In addition, the input end of the pump body 5234 is connected to the collection chamber 5243, so that the airflow input at the input end of the pump body 5234 is the airflow heated by the shaping section 5212, and thus the airflow output by the wind rotation system 523 can not only rotate the solder ball, but also heat the solder ball (compared to using external cold air as the air source of the wind rotation system 523), and realize the recycling of heat, save energy consumed in the whole circle process, and reduce costs.

[0060] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A solder ball production device, characterized in that: The solder ball production device comprises: A tin material melting part, the tin material melting part is used to melt the tin material into molten tin, and a molten tin outlet is provided at the bottom of the tin material melting part; A tin ball forming part, the tin ball forming part is connected to the tin water outlet of the tin material melting part, the tin ball forming part comprises an outer shell and a forming plate arranged inside the outer shell, the edge of the forming plate is connected to the inner wall of the outer shell, the forming plate is provided with a plurality of forming holes of the same size, and the tin water entering the inner shell falls on the forming plate; A transverse air supply system, the transverse air supply system is arranged on the outer shell below the forming plate, the transverse air supply system comprises an air supply pipe and an air outlet pipe, the air supply pipe is used to transport a transverse airflow into the outer shell; It also includes a screening system, the screening system includes a first screen, the first screen is arranged inside the shell, and the first screen is located below the forming plate, and the aperture of the screen on the first screen is consistent with the diameter of the finished solder ball; The screening system further comprises a second screen, which is arranged below the first screen, and the screen hole diameter of the second screen is smaller than the screen hole diameter of the first screen; It also includes a rounding part, which is arranged between the first screen and the second screen, and includes a baffle and a plurality of rounding units. The edge of the baffle is connected to the inner wall of the shell, and a connecting hole is opened on the baffle. The rounding unit is installed in the connecting hole of the baffle. The solder balls screened by the first screen first fall onto the baffle, and then enter the rounding unit for rounding treatment. The full circle unit comprises: A full round tube, the full round tube is installed in the connecting hole of the baffle, the full round tube includes a preheating section at the top and a shaping section at the bottom; a preheating channel is arranged in the preheating section, an arc-shaped guide groove is arranged at the top of the preheating section, and the arc-shaped guide groove is connected with the preheating channel; a shaping channel is arranged in the shaping section, and the shaping channel is connected with the preheating channel; the diameter of the preheating channel is larger than the diameter of the finished solder ball, and the diameter of the shaping channel is the same as the diameter of the finished solder ball; An annular heating plate, wherein the annular heating plate is embedded in the full-circular tube; A wind rotation system, the wind rotation system is arranged on the full-circle tube, the wind rotation system includes a first air hole, a second air hole, an air supply channel and a pump body; the first air hole and the second air hole are both arranged in the preheating section, and one end of the first air hole and the second air hole are both connected to the preheating channel, and the air outlet directions of the first air hole and the second air hole are both inclined; the air supply channel is arranged inside the full-circle tube; the first air hole and the second air hole are both connected to the output end of the pump body through the air supply channel.

2. A solder ball production device according to claim 1, characterized in that: The forming holes on the forming plate are circular holes, and the forming holes are concentrated and distributed directly below the tin water outlet of the tin material melting part.

3. The solder ball production device according to claim 1, characterized in that: The first screen and the second screen are both arranged obliquely, a slag outlet is arranged on the outer shell near the bottom end of the first screen, and a solder ball outlet is arranged on the outer shell near the bottom end of the second screen.

4. The solder ball production device according to claim 1, characterized in that: An arc-shaped collecting groove is arranged on the upper surface of the baffle with the connecting hole as the center.

5. The solder ball production device according to claim 1, characterized in that: The full-circle unit further includes a tin water collecting portion, which includes an annular groove, a collecting channel, and a collecting chamber; The annular groove is arranged at the bottom of the shaping channel, and the annular groove and the inner wall of the shaping channel have a smooth transition; The collecting chamber is arranged inside the shaping section and below the annular groove, and the collecting chamber is communicated with the annular groove above through the collecting channel.

6. A solder ball production device according to claim 5, characterized in that: A valve for tin discharge is provided at the bottom of the collecting chamber, and the top of the collecting chamber is connected with the input end of the pump body.

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