Feeding and discharging equipment for semiconductor cleaning

Abstract

The invention discloses feeding and discharging equipment for semiconductor cleaning, and relates to the technical field of feeding and discharging equipment. The device comprises a support plate, two sliding rails are fixedly installed on the support plate, the two sliding rails are symmetrically arranged, sliding blocks are installed on the sliding rails in a sliding mode, a supporting plate is fixedly installed on the sliding blocks, an adjusting assembly is arranged on the supporting plate, and a basket is arranged on the adjusting assembly. A movable block is pushed through a first bidirectional push rod in the adjusting assembly, the movable block and a mounting shaft on a mounting frame are movably mounted, a basket rotates by 90 degrees through a rotating shaft on a fixed block, the basket rotates by 90 degrees, horizontal loading and unloading of a semiconductor wafer are facilitated, and the efficiency of loading and unloading of the semiconductor wafer is improved. And meanwhile, when the basket is in a standing state, three-dimensional feeding and three-dimensional cleaning can be conveniently carried out on the semiconductor wafers, and the production efficiency and the product quality are improved by realizing flexible use and multiple feeding modes of the basket.

Description

Technical Field

[0001] The invention belongs to the technical field of loading and unloading equipment, and in particular relates to a loading and unloading equipment for semiconductor cleaning. Background Art

[0002] The loading and unloading handling system is an essential equipment in the semiconductor cleaning field or automation road. It is mainly used to link the intermediate links of the upper and lower processes of the cleaning process to realize the unmanned operation of the cleaning system. Commonly used handling methods include horizontal track handling, robot handling, etc., and each handling system can be divided into more categories according to its structural form.

[0003] In order to facilitate the correct installation and fixation of chips, the loading and unloading equipment in the prior art usually adopts vertical loading and unloading, such as vertical loading and unloading machines, vertical feeders, etc. However, the structure and design of these devices can only realize vertical loading and unloading, and this vertical loading and unloading limits the flexibility and production efficiency of the production line, and the traditional loading and feeding methods may cause damage and loss of chips.

[0004] To this end, we provide a loading and unloading equipment for semiconductor cleaning to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a loading and unloading device for semiconductor cleaning, which solves the problem in the prior art that vertical loading and unloading limits the flexibility and production efficiency of the production line by cooperating with an adjusting component, a stabilizing component and a clamping component.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions: The present invention is a loading and unloading device for semiconductor cleaning, comprising a support plate, on which two slide rails are fixedly installed, the two slide rails are symmetrically arranged, a slider is slidably installed on the slide rail, a support plate is fixedly installed on the slider, an adjustment component is arranged on the support plate, a basket is arranged on the adjustment component, and the basket is used to place semiconductor wafers; A fixing block is fixedly mounted on the lower end surface of the basket, a rotating shaft is rotatably mounted on the fixing block, and the fixing block is rotatably mounted on the support plate via the rotating shaft; The lower end surface of the bracket plate is provided with a stabilizing component, through which the basket rotated 90 degrees is stabilized; Two positioning plates are arranged on the outer side of the bracket plate, and clamping components are arranged on the positioning plates to improve the stability of the basket.

[0007] The present invention is further configured as follows: the adjustment component includes a reset component and a pushing component, the reset component includes four positioning rods, the four positioning rods are symmetrically arranged on the support plate, a mounting plate is fixedly installed on the top end of the positioning rod, a mounting cylinder is fixedly installed on the mounting plate, a lifting block is slidably installed inside the mounting cylinder, a top rod is fixedly installed on the top end of the lifting block, a spring is fixedly installed on the lower end surface of the lifting block, and one end of the spring away from the lifting block is fixedly installed on the inner bottom for installation.

[0008] The present invention is further configured such that the pushing assembly comprises a mounting block and a mounting frame, the mounting block is fixedly mounted on the top end of the push rod, a first bidirectional push rod is fixedly mounted on the mounting block, and a movable block is fixedly mounted on the output end of the first bidirectional push rod; The mounting frame is fixedly mounted on the side end surface of the basket, the mounting frame has an internal rotation mounting shaft, and the movable block is rotationally mounted on the mounting shaft.

[0009] The present invention is further configured such that the stabilizing component includes a mounting vertical plate, the mounting vertical plate is fixedly mounted on the lower end surface of the bracket plate, a second bidirectional push rod is fixedly mounted on the mounting vertical plate, a sliding plate is fixedly mounted on the second bidirectional push rod, an electric push rod is fixedly mounted on the sliding plate, and a top plate is fixedly mounted on the output end of the electric push rod.

[0010] The present invention is further configured such that a sliding groove is provided on the side end surface of the bracket plate, and the sliding plate is slidably mounted in the sliding groove.

[0011] The present invention is further configured as follows: the clamping assembly includes a U-shaped plate and a mounting groove, an air pump is fixedly mounted on the U-shaped plate, a shunt pipe is fixedly mounted on the output end of the air pump, an end of the shunt pipe away from the air pump is fixedly connected to an exhaust pipe, and an end of the exhaust pipe away from the shunt pipe is fixedly connected to a connecting pipe.

[0012] The present invention is further configured such that the mounting groove is arranged on the inner side of the clamping plate, a clamping airbag is arranged inside the mounting groove, and the connecting pipe extends from one end away from the exhaust pipe to the inside of the mounting groove and is connected to the clamping airbag.

[0013] The present invention is further configured such that the bottom of the basket is made of iron material, and the side frame of the basket is made of hard plastic.

[0014] The present invention is further configured such that a stabilizing block is fixedly mounted on the upper end surface of the support plate, an electromagnet is fixedly mounted on the upper end surface of the stabilizing block, and the electromagnet is magnetically connected to the bottom of the basket.

[0015] The present invention is further configured such that a first through hole is formed on a side end surface of the bracket plate, and a through hole is formed on a side end surface of the mounting vertical plate.

[0016] The present invention has the following beneficial effects: 1. The present invention pushes the movable block by adjusting the first bidirectional push rod in the assembly, and utilizes the movable block to be movably installed with the mounting shaft on the mounting frame, so that the basket can be rotated ninety degrees through the rotating shaft on the fixed block. By rotating the basket ninety degrees, it is convenient to horizontally load and unload semiconductor wafers. At the same time, when the basket is in an upright state, it is convenient to perform three-dimensional feeding and three-dimensional cleaning of semiconductor wafers. By realizing the flexible use of the basket and a variety of feeding methods, the production efficiency and product quality are improved.

[0017] 2. In the present invention, when the basket rotates 90 degrees, the sliding plate is driven to move outward by the second bidirectional push rod in the stabilizing assembly. When the sliding plate moves to a specified position, the electric push rod drives the top plate to rise, so that the top plate fits on the basket, completing the first position fixation. By supporting the basket, the accuracy of loading is improved, ensuring the correct installation and fixation of semiconductor wafers, and effectively improving the effect and efficiency of semiconductor loading and unloading.

[0018] 3. In the present invention, when the basket rotates ninety degrees, the basket is located between two positioning plates, and by starting the air pump in the clamping assembly, the gas generated by the air pump will enter the clamping airbag through the shunt pipe, the exhaust pipe and the connecting pipe. When the clamping airbag is filled with gas, it will expand, and the clamping airbag in the mounting groove will extend out of the mounting groove, and the extended part will fit on the side end surface of the basket. The second position fixation of the basket is completed by the clamping airbag, and the front and rear clamping fixation effect can provide additional stability to the basket, effectively improving the practicality of the loading and unloading equipment.

[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for describing the embodiments are briefly introduced below.

[0021] Figure 1 The overall structure of a loading and unloading device for semiconductor cleaning is shown in Figure 1. Figure 1 .

[0022] Figure 2 The overall structure of a loading and unloading device for semiconductor cleaning is shown in Figure 1. Figure 2 ; Figure 3 The overall structure of a loading and unloading device for semiconductor cleaning is shown in Figure 1. Figure 3 ; Figure 4 This is a schematic diagram of the structure of a support plate in a loading and unloading device for semiconductor cleaning; Figure 5 It is a structural schematic diagram of a clamping component in a loading and unloading device for semiconductor cleaning; Figure 6 It is a structural schematic diagram of an adjustment component in a loading and unloading device for semiconductor cleaning; Figure 7 It is a structural schematic diagram of a mounting frame in a loading and unloading device for semiconductor cleaning; Figure 8 A schematic diagram of the internal structure of a mounting barrel in a loading and unloading device for semiconductor cleaning; Fig. 9 The present invention is a schematic diagram of the structure of installing a vertical plate in a loading and unloading device used for semiconductor cleaning.

[0023] In the accompanying drawings: 1. bracket plate; 2. slide rail; 3. slider; 4. support plate; 5. basket; 6. fixed block; 7. rotating shaft; 8. positioning plate; 9. positioning rod; 10. mounting plate; 11. mounting cylinder; 12. lifting block; 13. push rod; 14. spring; 15. mounting block; 16. mounting frame; 17. first two-way push rod; 18. movable block; 19. mounting shaft; 20. mounting vertical plate; 21. second two-way push rod; 22. sliding plate; 23. electric push rod; 24. top plate; 25. sliding groove; 26. U-shaped plate; 27. mounting groove; 28. air pump; 29. ​​shunt pipe; 30. exhaust pipe; 31. connecting pipe; 32. clamping airbag; 33. stabilizing block; 34. electromagnet; 35. first through hole; 36. second through hole. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described below in conjunction with the drawings in the embodiments of the present invention. The described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Specific embodiment 1

[0025] See also Figure 1-9 The present invention is a loading and unloading device for semiconductor cleaning, comprising a support plate 1, two slide rails 2 are fixedly installed on the support plate 1, the two slide rails 2 are symmetrically arranged, a slider 3 is slidably installed on the slide rail 2, a support plate 4 is fixedly installed on the slider 3, an adjustment component is arranged on the support plate 4, a basket 5 is arranged on the adjustment component, the basket 5 is used to place semiconductor wafers, the bottom of the basket 5 is made of iron material, the side frame of the basket 5 is made of hard plastic, a stabilizing block 33 is fixedly installed on the upper end surface of the support plate 4, an electromagnet 34 is fixedly installed on the upper end surface of the stabilizing block 33, and the electromagnet 34 is magnetically connected to the bottom of the basket 5; A fixing block 6 is fixedly mounted on the lower end surface of the basket 5, a rotating shaft 7 is rotatably mounted on the fixing block 6, and the fixing block 6 is rotatably mounted on the supporting plate 4 via the rotating shaft 7; The adjustment component includes a reset component and a push component. The reset component includes four positioning rods 9. The four positioning rods 9 are symmetrically arranged on the support plate 4. A mounting plate 10 is fixedly installed on the top of the positioning rod 9. A mounting tube 11 is fixedly installed on the mounting plate 10. A lifting block 12 is slidably installed inside the mounting tube 11. A push rod 13 is fixedly installed on the top of the lifting block 12. A spring 14 is fixedly installed on the lower end surface of the lifting block 12. One end of the spring 14 away from the lifting block 12 is fixedly installed on the inner bottom for installation. The reaction force of the spring 14 facilitates the lifting block 12, which has a certain position, to be restored to its original position. At the same time, the spring 14 is used to enhance the firmness and stability between the first two-way push rod 17 and the basket 5. The pushing assembly includes a mounting block 15 and a mounting frame 16. The mounting block 15 is fixedly mounted on the top of the push rod 13. A first bidirectional push rod 17 is fixedly mounted on the mounting block 15. A movable block 18 is fixedly mounted on the output end of the first bidirectional push rod 17. The power source of the first bidirectional push rod 17 can be mounted on the mounting block 15 or the support plate 4. The mounting frame 16 is fixedly mounted on the side end surface of the basket 5 , and a rotationally mounted shaft 19 is inside the mounting frame 16 , on which the movable block 18 is rotationally mounted.

[0026] Specifically: the movable block 18 is pushed by the first bidirectional push rod 17 in the adjustment component, and the movable block 18 is movably installed with the mounting shaft 19 on the mounting frame 16, so that the basket 5 is rotated ninety degrees through the rotating shaft 7 on the fixed block 6. By rotating the basket 5 ninety degrees, it is convenient to horizontally load and unload semiconductor wafers. At the same time, when the basket 5 is in an upright state, it is convenient to perform three-dimensional feeding and three-dimensional cleaning of semiconductor wafers. By realizing the flexible use of the basket 5 and a variety of feeding methods, the production efficiency and product quality are improved. Specific embodiment 2

[0027] See also Figure 1-9 , based on the specific embodiment 1, a stabilizing component is provided on the lower end surface of the bracket plate 1, and the basket 5 rotated 90 degrees is stabilized by the stabilizing component; The stabilizing component includes a mounting vertical plate 20, which is fixedly mounted on the lower end surface of the bracket plate 1, a second bidirectional push rod 21 is fixedly mounted on the mounting vertical plate 20, a sliding plate 22 is fixedly mounted on the second bidirectional push rod 21, an electric push rod 23 is fixedly mounted on the sliding plate 22, a top plate 24 is fixedly mounted on the output end of the electric push rod 23, and the power sources of the second bidirectional push rod 21 and the electric push rod 23 can be mounted on the mounting vertical plate 20; A sliding groove 25 is provided on the side end surface of the bracket plate 1 , and the sliding plate 22 is slidably installed with the sliding groove 25 . The sliding plate 22 slides in the sliding groove 25 to ensure the stability of the sliding plate 22 , thereby improving the supporting force of the top plate 24 on the basket 5 .

[0028] In this embodiment, when the basket 5 rotates ninety degrees, the sliding plate 22 is driven to move outward by the second bidirectional push rod 21 in the stabilizing assembly. When the sliding plate 22 moves to the specified position, the electric push rod 23 drives the top plate 24 to rise, so that the top plate 24 fits on the basket 5, completing the first position fixation. By supporting the basket 5, the accuracy of loading is improved, ensuring the correct installation and fixation of the semiconductor wafer, and effectively improving the effect and efficiency of semiconductor loading and unloading. Specific embodiment three

[0029] See also Figure 1-9 On the basis of the first specific embodiment, two positioning plates 8 are provided on the outer side of the bracket plate 1, and a clamping assembly is provided on the positioning plate 8 to improve the stability of the basket 5; The clamping assembly includes a U-shaped plate 26 and a mounting groove 27. An air pump 28 is fixedly mounted on the U-shaped plate 26. A shunt pipe 29 is fixedly mounted on the output end of the air pump 28. An end of the shunt pipe 29 away from the air pump 28 is fixedly connected to an exhaust pipe 30. An end of the exhaust pipe 30 away from the shunt pipe 29 is fixedly connected to a connecting pipe 31. The mounting groove 27 is arranged on the inner side surface of the clamping plate, and a clamping airbag 32 is arranged inside the mounting groove 27. One end of the connecting pipe 31 away from the exhaust pipe 30 extends to the inside of the mounting groove 27 and is communicated with the clamping airbag 32. A first through hole 35 is provided on the side end surface of the bracket plate 1, and a second through hole 36 is provided on the side end surface of the mounting vertical plate 20. One end of the exhaust pipe 30 away from the shunt pipe 29 extends to the outside of the bracket plate 1 through through pipe 1, and one end of the shunt pipe 29 away from the air pump 28 passes through through pipe 2 and is communicated with the exhaust pipe 30. Both the shunt pipe 29 and the connecting pipe 31 are provided with a one-way valve, and the one-way valve is used to ensure that there is no backflow in the pipeline. In addition, an exhaust pipe 30 is provided on the clamping airbag 32, and a valve is provided on the exhaust pipe 30. By opening the valve, the exhaust pipe 30 is used to facilitate the discharge of gas in the clamping airbag 32. Since this technology is well known to people in this field, it will not be described in detail here.

[0030] Specifically: when the basket 5 rotates ninety degrees, the basket 5 is located between the two positioning plates 8, and by starting the air pump 28 in the clamping assembly, the gas generated by the air pump 28 will enter the clamping airbag 32 through the shunt pipe 29, the exhaust pipe 30 and the connecting pipe 31. When the clamping airbag 32 is filled with gas, it will expand, and the clamping airbag 32 in the mounting groove 27 will extend out of the mounting groove 27, and the extended part will fit on the side end surface of the basket 5. The second position fixation of the basket 5 is completed by the clamping airbag 32, and the front and rear clamping fixation effect can provide additional stability to the basket 5, effectively improving the practicality of the loading and unloading equipment.

[0031] The working principle of the present invention is: When in use, the two baskets 5 are driven to move by the slide rails 2 on the support plate 1 and the sliders 3. When the baskets 5 are in the loading and unloading position, if a vertical feeding method is adopted, it is not necessary to move the baskets 5, and it is only necessary to put the semiconductor wafers into the baskets 5. When the basket 5 is laid down to drop the semiconductor wafers horizontally, the electromagnet 34 is not energized, and the movable block 18 is pushed by the first bidirectional push rod 17. The movable block 18 is movably installed with the mounting shaft 19 on the mounting frame 16, so that the basket 5 is rotated 90 degrees through the rotating shaft 7 on the fixed block 6, and the mounting block 15 is moved down a certain distance in the mounting cylinder 11 through the lifting block 12 on the top rod 13, and the lifting block 12 that has moved down a certain distance is in a stable state through the reaction force of the spring 14. By rotating the basket 5 90 degrees, it is convenient to load and unload the semiconductor wafers horizontally. At the same time, when the basket 5 is in an upright state, it is convenient to feed and clean the semiconductor wafers in three dimensions. By realizing the flexible use of the basket 5 and a variety of feeding methods, the production efficiency and product quality are improved. When the basket 5 rotates 90 degrees, the sliding plate 22 is driven to move outward by the second bidirectional push rod 21 in the stabilizing assembly. When the sliding plate 22 moves to the specified position, the electric push rod 23 drives the top plate 24 to rise, so that the top plate 24 fits on the basket 5, completing the first position fixation. By supporting the basket 5, the accuracy of loading is improved, ensuring the correct installation and fixation of the semiconductor wafer. When the basket 5 rotates 90 degrees, the basket 5 is located between the two positioning plates 8. By starting the air pump 28 in the clamping assembly, the gas generated by the air pump 28 will enter the clamping airbag 32 through the shunt pipe 29, the exhaust pipe 30 and the connecting pipe 31. When the clamping airbag 32 is filled with gas, it will expand, and the clamping airbag 32 in the mounting groove 27 will extend out of the mounting groove 27. The extended part will fit the side end surface of the basket 5. The second position fixation of the basket 5 is completed by the clamping airbag 32. The front and rear clamping fixation effect can provide additional stability for the basket 5, effectively improving the effect and efficiency of semiconductor loading and unloading. When the basket 5 rotated 90 degrees needs to be restored to its original state, the electromagnet 34 is energized, and the electromagnet 34 adsorbs the basket 5 to ensure the stability of the basket 5.

[0032] In the present technical solution, a special fixing device can be installed in the basket 5 to fix the position of the semiconductor wafer. At the same time, the semiconductor wafer can be cleaned by spraying cleaning water through a nozzle. At the same time, the loading and unloading method can be completed by a robot. Since the fixing device, cleaning method and robot are technologies well known to people in this field, they will not be described in detail here.

[0033] The standard parts used in the present invention can all be purchased from the market, and can be customized according to the description in the specification and drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. Machinery, parts and equipment all adopt conventional models in the prior art. The control method is automatically controlled by a control unit. The control circuit of the control unit can be realized by simple programming by technicians in this field, which is common knowledge in this field, so the control method and circuit connection are not explained in detail in the present invention.

[0034] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that technicians in the relevant technical field can better understand and utilize the present invention.

Claims

1. A loading and unloading device for semiconductor cleaning, comprising a support plate (1), characterized in that: Two slide rails (2) are fixedly mounted on the support plate (1), the two slide rails (2) are symmetrically arranged, a slider (3) is slidably mounted on the slide rail (2), a support plate (4) is fixedly mounted on the slider (3), an adjustment component is arranged on the support plate (4), a basket (5) is arranged on the adjustment component, and the basket (5) is used to place semiconductor wafers; A fixing block (6) is fixedly mounted on the lower end surface of the basket (5), a rotating shaft (7) is rotatably mounted on the fixing block (6), and the fixing block (6) is rotatably mounted on the support plate (4) via the rotating shaft (7); The lower end surface of the support plate (1) is provided with a stabilizing component, through which the basket (5) rotated ninety degrees is stabilized; Two positioning plates (8) are arranged on the outer side surface of the support plate (1), and a clamping assembly is arranged on the positioning plate (8), so that the stability of the basket (5) is improved by the clamping assembly.

2. The loading and unloading equipment for semiconductor cleaning according to claim 1, characterized in that: The adjustment component comprises a reset component and a push component. The reset component comprises four positioning rods (9). The four positioning rods (9) are symmetrically arranged on the support plate (4). A mounting plate (10) is fixedly mounted on the top of the positioning rod (9). A mounting cylinder (11) is fixedly mounted on the mounting plate (10). A lifting block (12) is slidably mounted inside the mounting cylinder (11). A push rod (13) is fixedly mounted on the top of the lifting block (12). A spring (14) is fixedly mounted on the lower end surface of the lifting block (12). One end of the spring (14) away from the lifting block (12) is fixedly mounted on an inner bottom for installation.

3. The loading and unloading equipment for semiconductor cleaning according to claim 2, characterized in that: The pushing assembly comprises a mounting block (15) and a mounting frame (16); the mounting block (15) is fixedly mounted on the top end of the push rod (13); a first bidirectional push rod (17) is fixedly mounted on the mounting block (15); and a movable block (18) is fixedly mounted on the output end of the first bidirectional push rod (17); The mounting frame (16) is fixedly mounted on a side end surface of the basket (5), a rotationally mounted shaft (19) is provided inside the mounting frame (16), and the movable block (18) is rotationally mounted on the mounting shaft (19).

4. The loading and unloading equipment for semiconductor cleaning according to claim 3, characterized in that: The stabilizing component comprises a mounting vertical plate (20), wherein the mounting vertical plate (20) is fixedly mounted on the lower end surface of the bracket plate (1), a second bidirectional push rod (21) is fixedly mounted on the mounting vertical plate (20), a sliding plate (22) is fixedly mounted on the second bidirectional push rod (21), an electric push rod (23) is fixedly mounted on the sliding plate (22), and a top plate (24) is fixedly mounted on the output end of the electric push rod (23).

5. The loading and unloading equipment for semiconductor cleaning according to claim 4, characterized in that: A sliding groove (25) is provided on the side end surface of the bracket plate (1), and the sliding plate (22) is slidably mounted in the sliding groove (25).

6. The loading and unloading equipment for semiconductor cleaning according to claim 1, characterized in that: The clamping assembly comprises a U-shaped plate (26) and a mounting groove (27); an air pump (28) is fixedly mounted on the U-shaped plate (26); a shunt pipe (29) is fixedly mounted on the output end of the air pump (28); an end of the shunt pipe (29) away from the air pump (28) is fixedly connected to an exhaust pipe (30); and an end of the exhaust pipe (30) away from the shunt pipe (29) is fixedly connected to a connecting pipe (31).

7. The loading and unloading equipment for semiconductor cleaning according to claim 6, characterized in that: The mounting groove (27) is arranged on the inner side of the clamping plate, a clamping airbag (32) is arranged inside the mounting groove (27), and an end of the connecting pipe (31) away from the exhaust pipe (30) extends to the inside of the mounting groove (27) and is connected to the clamping airbag (32).

8. The loading and unloading equipment for semiconductor cleaning according to claim 1, characterized in that: The bottom of the basket (5) is made of iron material, and the side frame of the basket (5) is made of hard plastic.

9. The loading and unloading equipment for semiconductor cleaning according to claim 8, characterized in that: A stabilizing block (33) is fixedly mounted on the upper end surface of the support plate (4), an electromagnet (34) is fixedly mounted on the upper end surface of the stabilizing block (33), and the electromagnet (34) is magnetically connected to the bottom of the basket (5).

10. The loading and unloading equipment for semiconductor cleaning according to claim 4, characterized in that: A first through hole (35) is formed on the side end surface of the bracket plate (1), and a second through hole (36) is formed on the side end surface of the mounting vertical plate (20).

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