Non-viscous glass substrate for electrostatic adsorption and manufacturing method thereof

Abstract

The invention relates to the technical field of semiconductor chips, and particularly discloses a non-viscous glass substrate for electrostatic adsorption and a manufacturing method thereof.The method comprises the steps that S1, a glass substrate is prepared, and the surface of the glass substrate is pretreated; s2, forming an electrostatic adsorption layer on the upper surface of the glass substrate, wherein the electrostatic adsorption layer is made of a high polymer material; the non-viscous glass substrate for electrostatic adsorption prepared by the method can achieve temporary bonding and debonding functions through the electrostatic adsorption layer attached to the surface of the non-viscous glass substrate under the condition of not using viscous glue, so that stable connection and easy separation between a chip and the glass substrate are realized; the problems of mechanical damage and residue on the chip in the de-bonding process of the traditional temporary bonding glue are solved, the efficiency of the packaging process and the integrity of the chip are improved, and the cost and complexity of the production process are also reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chips, and in particular to a non-sticky glass substrate for electrostatic adsorption and a manufacturing method thereof. Background Art

[0002] In the field of semiconductor chip packaging, with the continuous advancement of technology and the growing demand for product miniaturization and integration, the use of glass substrates as packaging carriers has become an important technological trend. Glass substrates provide an ideal support platform for chips with their excellent flatness, thermal stability and chemical stability. However, in the complex packaging process, how to ensure the precise alignment and stable connection between the chip and the carrier or other functional layers, while being flexible and easy to separate in subsequent processes, has become a key challenge.

[0003] In the related art, the glass substrate is generally connected to the chip or functional layer through a temporary bonding adhesive. The temporary bonding adhesive can firmly adhere the chip or other functional layers to the glass substrate through its strong viscosity in the early stage of packaging, so that the glass substrate can be used as a temporary support during the packaging process. However, during the debonding process, the traditional temporary bonding adhesive is too sticky and often needs to be separated by physical tearing, which not only easily causes mechanical damage to the fragile chip, but also may cause part of the bonding adhesive to remain on the chip surface, affecting the quality and efficiency of subsequent processes.

[0004] There is currently no effective technical solution to the above problems. Summary of the invention

[0005] The purpose of the present application is to provide a non-adhesive glass substrate for electrostatic adsorption and a method for manufacturing the same, so as to provide a carrier that does not require temporary bonding glue to connect and fix chips or functional layers, thereby improving the quality and efficiency of the packaging process.

[0006] In a first aspect, the present application provides a method for manufacturing a non-adhesive glass substrate for electrostatic adsorption, which is applied in the manufacture of semiconductor chips, and the method comprises the steps of: S1, preparing a glass substrate and pre-treating the surface of the glass substrate; S2. Forming an electrostatic adsorption layer on the upper surface of the glass substrate, wherein the electrostatic adsorption layer is made of a polymer material.

[0007] The non-sticky glass substrate for electrostatic adsorption obtained by the manufacturing method of the non-sticky glass substrate for electrostatic adsorption in the present application can achieve temporary bonding and debonding functions through the electrostatic adsorption layer attached to its surface without using adhesive glue, thereby realizing a stable connection and easy separation between the chip and the glass substrate, solving the problem of mechanical damage and residue caused to the chip by traditional temporary bonding glue during the debonding process, improving the efficiency of the packaging process and the integrity of the chip, and reducing the cost and complexity of the production process.

[0008] In the method for manufacturing the non-sticky glass substrate for electrostatic adsorption, the electrostatic adsorption layer includes one of a TPU electrostatic film, a PTFE film and a carbon fiber film.

[0009] In this example, the TPU (thermoplastic polyurethane) electrostatic film, PTFE (polytetrafluoroethylene) film and carbon fiber film each have different physical and chemical properties, which can meet the needs of different application scenarios. The method for making a non-sticky glass substrate for electrostatic adsorption in this application can ensure the adhesion and stability of the electrostatic adsorption layer on the glass substrate by selecting appropriate materials, thereby improving the efficiency and quality of the semiconductor chip manufacturing process.

[0010] In the method for manufacturing a non-sticky glass substrate for electrostatic adsorption, when the electrostatic adsorption layer includes a TPU electrostatic film, step S2 includes: S21, obtaining TPU particles; S22, after the TPU particles and the electrostatic additive are uniformly mixed, heating and melting to obtain a molten material; S23, extruding the melt onto the upper surface of the glass substrate, and casting the melt into a TPU electrostatic film; S24, cooling the TPU electrostatic film and the glass substrate.

[0011] In this example, the TPU particles and the electrostatic additive are mixed evenly and then heated to melt, so that the TPU particles have electrostatic properties under the action of the electrostatic additive, and then are extruded in a molten state to cover the upper surface of the glass substrate, so as to produce a TPU electrostatic film tightly attached to the glass substrate through cast molding, ensuring that the TPU electrostatic film can evenly cover the glass substrate and has the flatness required for the packaging process. Cooling the TPU electrostatic film and the glass substrate can solidify the TPU electrostatic film and firmly adhere to the glass substrate, thereby forming a non-sticky glass substrate with electrostatic adsorption function.

[0012] The method for manufacturing a non-sticky glass substrate for electrostatic adsorption further includes the following steps between step S22 and step S23: S2A, preheating the upper surface of the glass substrate.

[0013] In the method for manufacturing a non-sticky glass substrate for electrostatic adsorption, when the electrostatic adsorption layer includes a PTFE film, step S2 includes: S21', obtaining PTFE resin; S22', mixing the PTFE resin and the extrusion aid, and pressing to obtain a PTFE sheet; S23', stretching the PTFE sheet to form a microporous structure therein; S24', sintering and shaping the PTFE sheet with a microporous structure to obtain a PTFE film; S25', fixing the PTFE film on the upper surface of the glass substrate by hot-melt welding.

[0014] The method for manufacturing a non-sticky glass substrate for electrostatic adsorption, wherein step S25' comprises: S251', covering the upper surface of the glass substrate with the PTFE film, and preheating the upper surface of the glass substrate and the PTFE film; S252', hot-pressing and fixing the preheated PTFE film on the upper surface of the glass substrate, so that the upper surface of the glass substrate and the PTFE film are closely attached; S253', cooling the glass substrate and the PTFE film.

[0015] In the method for manufacturing the non-adhesive glass substrate for electrostatic adsorption, step S24' and step S25' are performed under an inert gas atmosphere.

[0016] In the method for manufacturing a non-sticky glass substrate for electrostatic adsorption, in step S2, an electrostatic adsorption layer is formed based on a preset pattern.

[0017] The method for manufacturing a non-sticky glass substrate for electrostatic adsorption, wherein the pretreatment comprises: Cleaning the surface of the glass substrate; The glass substrate is dried.

[0018] In a second aspect, the present application further provides a non-adhesive glass substrate for electrostatic adsorption, which is manufactured based on the manufacturing method of the non-adhesive glass substrate for electrostatic adsorption provided in the first aspect.

[0019] The non-sticky glass substrate for electrostatic adsorption of the present application is made based on the aforementioned manufacturing method, which describes the specific steps of making the non-sticky glass substrate, including preparing a glass substrate, pre-treating the surface of the glass substrate, forming an electrostatic adsorption layer on the glass substrate, etc. The electrostatic adsorption layer can be made of one of TPU electrostatic film, PTFE film or carbon fiber film, and the specific manufacturing steps and conditions of each film are described in detail; the non-sticky glass substrate for electrostatic adsorption can achieve effective adsorption of semiconductor chips through the electrostatic adsorption layer on the glass substrate without the need to use sticky materials, thereby avoiding the pollution, inconvenience and damage that may be caused by sticky materials.

[0020] As can be seen from the above, the present application proposes a non-sticky glass substrate for electrostatic adsorption and a method for manufacturing the same, wherein the non-sticky glass substrate for electrostatic adsorption manufactured by the method can achieve temporary bonding and debonding functions through the electrostatic adsorption layer attached to its surface without using adhesive glue, thereby realizing a stable connection and easy separation between the chip and the glass substrate, solving the problem of mechanical damage and residue caused to the chip by traditional temporary bonding glue during the debonding process, improving the efficiency of the packaging process and the integrity of the chip, and reducing the cost and complexity of the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A flow chart of a method for manufacturing a non-adhesive glass substrate for electrostatic adsorption provided in an embodiment of the present application.

[0022] Figure 2 The figure is a flow chart of steps for forming an electrostatic adsorption layer on the upper surface of a glass substrate in some embodiments.

[0023] Figure 3 The figure is a flow chart of steps for forming an electrostatic adsorption layer on the upper surface of a glass substrate in some other embodiments.

[0024] Figure 4 The figure is a flow chart of steps for forming an electrostatic adsorption layer on the upper surface of a glass substrate in some other embodiments. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0029] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0030] First, please refer to Figure 1-Figure 4 Some embodiments of the present application provide a method for manufacturing a non-sticky glass substrate for electrostatic adsorption, which is applied in the manufacture of semiconductor chips. The method includes the steps of: S1, preparing a glass substrate and pre-treating the surface of the glass substrate; S2. Forming an electrostatic adsorption layer on the upper surface of the glass substrate, wherein the electrostatic adsorption layer is made of a polymer material.

[0031] Specifically, the glass substrate prepared in step S1 is a substrate that can be directly used as a carrier in semiconductor chip packaging. The pretreatment of the glass substrate is used to process the surface of the glass substrate into a contact surface that meets the adhesion conditions of the electrostatic adsorption layer, such as for processing the dryness, cleanliness, flatness, smoothness and other characteristics of the surface of the glass substrate.

[0032] More specifically, the method for manufacturing a non-adhesive glass substrate for electrostatic adsorption in the embodiment of the present application aims to manufacture a carrier that does not require the use of temporary bonding glue to connect and fix the chip or functional layer. Therefore, in step S2, an electrostatic adsorption layer is formed on the pre-treated glass substrate, and the electrostatic adsorption layer is used to replace the temporary bonding glue layer in the traditional packaging solution to temporarily bond and connect the chip or functional layer; wherein, the electrostatic adsorption layer is made of polymer materials, and the layer structure made of polymer materials generally has the characteristic of low viscosity. The main reason lies in its molecular structure and surface characteristics. Polymer materials are generally composed of long-chain molecules. The interaction between these molecules is weak, resulting in low surface energy and difficulty in forming strong adhesion with other substances. Secondly, the microscopic protrusions, pits, pores and other defects that may exist on the surface of the polymer material, as well as the weak boundary layer formed during the processing, will further reduce its adhesion performance. The combined effect of these factors can make the electrostatic adsorption layer made of polymer materials have the advantage of low viscosity; in step S2, the electrostatic adsorption layer is formed on the upper surface of the glass substrate to obtain a non-adhesive glass substrate for electrostatic adsorption with temporary bonding ability.

[0033] More specifically, in the embodiments of the present application, the electrostatic adsorption layer can be made based on different polymer materials, and the appropriate materials and process parameters can be selected according to actual needs during the specific implementation process; in actual use, the electrostatic adsorption layer can generate static electricity through electrostatic treatment to produce adsorption ability for objects in contact with its surface, such as by applying a high-voltage electric field to charge its own surface to achieve adsorption and fixation of the chip or functional layer, thereby achieving the purpose of temporary bonding. After the high-voltage electric field is removed and discharged, the adsorption and fixation can be released, thereby achieving the purpose of releasing the bonding.

[0034] The non-adhesive glass substrate for electrostatic adsorption obtained by the method for manufacturing the non-adhesive glass substrate for electrostatic adsorption in the embodiment of the present application can achieve temporary bonding and debonding functions through the electrostatic adsorption layer attached to its surface without using adhesive glue, thereby realizing a stable connection and easy separation between the chip and the glass substrate, solving the problem of mechanical damage and residue caused to the chip by traditional temporary bonding glue during the debonding process, improving the efficiency of the packaging process and the integrity of the chip, and reducing the cost and complexity of the production process.

[0035] It should be noted that the method for manufacturing a non-sticky glass substrate for electrostatic adsorption in the embodiment of the present application can be applied in the chip packaging process, that is, used as a pre-process of the complete packaging process, and can also be directly used in the production process of the glass substrate to batch produce glass substrates that can be directly used as carriers, that is, prefabricated glass substrates with temporary bonding functions as products. In the embodiment of the present application, the latter is preferred. The glass substrate can be replaced and applied in process scenarios that require temporary bonding of the glass substrate, thereby reducing the cost and complexity of the existing production processes of various types of semiconductor chips and improving the efficiency of the packaging process and the integrity of the chip.

[0036] It should be noted that before electrostatic treatment, the electrostatic adsorption layer on the glass substrate is in a non-charged state and will not affect the adjustment of the chip position. After the chip position is accurately adjusted, the corresponding production process can drive the electrostatic adsorption layer to be charged through an electrostatic generator or electrostatic treatment equipment to achieve temporary bonding of the chip.

[0037] In some preferred embodiments, the electrostatic adsorption layer includes one of a TPU electrostatic film, a PTFE film and a carbon fiber film.

[0038] Specifically, the material selection of the electrostatic adsorption layer is the key to solving the problems of electrostatic adsorption performance and applicability. TPU (thermoplastic polyurethane) electrostatic film, PTFE (polytetrafluoroethylene) film and carbon fiber film each have different physical and chemical properties, which can meet the needs of different application scenarios. The method for manufacturing a non-sticky glass substrate for electrostatic adsorption in an embodiment of the present application can ensure the adhesion and stability of the electrostatic adsorption layer on the glass substrate by selecting suitable materials, thereby improving the efficiency and quality of the semiconductor chip manufacturing process.

[0039] More specifically, TPU and PTFE belong to organic polymer materials, and carbon fiber belongs to inorganic polymer materials.

[0040] More specifically, TPU electrostatic film is an innovative product that combines TPU (thermoplastic polyurethane) materials and electrostatic technology. It forms a uniform electrostatic layer on the surface of TPU, giving the material excellent electrostatic adsorption properties. It inherits the softness, toughness and wear resistance of the TPU material itself, and can maintain stable physical properties in various environments; PTFE in PTFE film is a polymer compound with fluorine atoms in its molecular structure. The bonds formed by fluorine atoms and other atoms are very strong, making PTFE not easy to adhere to other substances, and has good non-stickiness and certain electrostatic adsorption ability; carbon fiber film is mainly known for its high strength, corrosion resistance and good conductivity, but its microstructure has good porosity and specific surface area, and has certain electrostatic adsorption properties, but its non-stickiness is weaker than the above two materials.

[0041] More specifically, the electrostatic adsorption layers made of the above-mentioned materials can meet the requirements of temporary bonding and debonding without adhesion. Considering the advantages and disadvantages of characteristics and cost, the method for manufacturing a non-sticky glass substrate for electrostatic adsorption in the embodiment of the present application preferably uses TPU electrostatic film or PTFE film as the electrostatic adsorption layer.

[0042] In some preferred embodiments, Figure 2 As shown, when the electrostatic adsorption layer includes a TPU electrostatic film, step S2 includes: S21, obtaining TPU particles; S22, after the TPU particles and the electrostatic additive are uniformly mixed, heating and melting to obtain a molten material; S23, extruding the melt onto the upper surface of the glass substrate, and casting the melt into a TPU electrostatic film; S24, cooling the TPU electrostatic film and the glass substrate.

[0043] Specifically, the TPU particles can be prepared by preparing a prepolymer based on oligomer polyol and diisocyanate, and then adding a chain extender to the prepolymer to carry out a chain extension reaction.

[0044] More specifically, the TPU particles and the electrostatic additive are mixed evenly and then heated to melt, so that the TPU particles have electrostatic properties under the action of the electrostatic additive, and then extruded in a molten state to cover the upper surface of the glass substrate, so as to produce a TPU electrostatic film tightly attached to the glass substrate through cast molding, ensuring that the TPU electrostatic film can evenly cover the glass substrate and has the flatness required by the packaging process. Cooling the TPU electrostatic film and the glass substrate can solidify the TPU electrostatic film and firmly adhere to the glass substrate, thereby forming a non-sticky glass substrate with electrostatic adsorption function.

[0045] It should be noted that other types of additives may be added in step S22 to enhance various properties of the TPU electrostatic film.

[0046] More specifically, the electrostatic aid may be erucamide, conductive particles, conductive fibers, etc., to impart conductivity to the TPU material so that it has electrostatic adsorption capability after electrostatic treatment.

[0047] More specifically, other implementations may first prepare the TPU electrostatic film by tape casting, and then bond the TPU electrostatic film to the glass substrate; in contrast, the method for preparing a non-sticky glass substrate for electrostatic adsorption in the embodiment of the present application combines step S23 and step S24 to directly tape-cast the TPU electrostatic film on the glass substrate, which can avoid the bonding process, and can improve the close bonding between the glass substrate and the TPU electrostatic film and the flatness of the surface of the TPU electrostatic film, and can effectively avoid problems such as bubbles between the glass substrate and the TPU electrostatic film, and also reduce the cost and complexity of the production process.

[0048] In some other embodiments, step S2 further includes the following steps performed after step S24: S25, performing preliminary electrostatic treatment on the TPU electrostatic film.

[0049] Specifically, preliminary electrostatic treatment of the TPU electrostatic film can enable the glass substrate to have a weaker adsorption ability, so as to facilitate preliminary positioning and adjustment of the chip in the packaging process.

[0050] In some preferred embodiments, Figure 3 As shown, the steps between step S22 and step S23 also include the following steps: S2A, preheating the upper surface of the glass substrate.

[0051] Specifically, in this embodiment, after the preheating treatment, the upper surface temperature of the glass substrate is slightly higher than (e.g., 5%) or equal to the temperature of the melt, so that in the subsequent step, the molten TPU material can be extruded onto the upper surface of the glass substrate and can be smoothly covered on the glass substrate by the tape casting process, and can be better combined with the surface of the glass substrate, thereby improving the molding quality and adhesion of the film, avoiding the problem of partial solidification of the molten TPU material during the tape casting process, and avoiding the stress concentration and film warping caused by the large temperature difference between the molten TPU material and the glass substrate surface during the cooling process.

[0052] In some preferred embodiments, Figure 4 As shown, when the electrostatic adsorption layer includes a PTFE film, step S2 includes: S21', obtaining PTFE resin; S22', mixing PTFE resin and extrusion aid, and pressing to obtain PTFE sheet; S23', stretching the PTFE sheet to form a microporous structure therein; S24', sintering and shaping the PTFE sheet with a microporous structure to obtain a PTFE film; S25', fixing the PTFE film on the upper surface of the glass substrate by hot-melt welding.

[0053] Specifically, the method for manufacturing a non-sticky glass substrate for electrostatic adsorption in an embodiment of the present application forms a microporous structure by stretching a PTFE sheet, thereby increasing the surface area and adsorption capacity of the sheet, and then sintering and shaping the sheet to ensure that its structure is stable to obtain a PTFE film. Finally, the PTFE film is fixed to the upper surface of the glass substrate by hot-melt welding to ensure that the film is tightly fitted to the glass substrate and provide stable electrostatic adsorption performance. Through these steps, the problem of how to effectively fix the PTFE film on the upper surface of the glass substrate is solved, thereby ensuring the performance and stability of the electrostatic adsorption layer.

[0054] In some preferred embodiments, step S25' comprises: S251', covering the upper surface of the glass substrate with a PTFE film, and preheating the upper surface of the glass substrate and the PTFE film; S252', hot-pressing and fixing the preheated PTFE film on the upper surface of the glass substrate, so that the upper surface of the glass substrate and the PTFE film are closely attached; S253', cooling the glass substrate and the PTFE film.

[0055] Specifically, step S251 ′ is used to preheat the PTFE film to a softening temperature, preferably 210-220° C. in the embodiment of the present application, so that it can be closely attached to the upper surface of the glass substrate and be fixed by hot pressing.

[0056] More specifically, in the specific implementation process, the PTFE film is first covered on the upper surface of the glass substrate, and the upper surface of the glass substrate and the PTFE film are preheated. The purpose of preheating is to increase the molecular activity of the PTFE film and the surface of the glass substrate and soften the PTFE film, thereby facilitating the subsequent hot pressing process. Next, the preheated PTFE film is hot-pressed and fixed on the upper surface of the glass substrate, and by applying appropriate pressure and heat, the PTFE film is closely attached to the surface of the glass substrate to form a strong bond. Finally, the glass substrate and the PTFE film are cooled to ensure the stability and durability of the bond.

[0057] More specifically, in some embodiments, the hot pressing process of step S252' briefly (e.g., 1-5 seconds) heats the PTFE film to 327°C, and then step S253' is performed to cool and solidify the PTFE film on the glass substrate; in this embodiment, step S252' briefly heats the PTFE film to the melting temperature, so that it is more fully in close contact and bonded with the glass substrate without destroying the microporous structure, and then step S253' is used to cool and solidify, thereby further improving the bonding strength between the PTFE film and the glass substrate.

[0058] In some preferred embodiments, step S24' and step S25' are performed under an inert gas atmosphere.

[0059] Specifically, by performing these steps under an inert gas atmosphere, the influence of environmental factors such as oxidation on the quality of the PTFE film can be effectively avoided, and the oxidation or degradation of the PTFE film can be avoided, thereby improving the stability and performance of the film.

[0060] In some other embodiments, step S2 further includes the following steps performed after step S25': S26', perform preliminary electrostatic treatment on the PTFE film.

[0061] Specifically, preliminary electrostatic treatment of the PTFE film can enable the glass substrate to have a weaker adsorption ability, so as to facilitate preliminary positioning and adjustment of the chip in the packaging process.

[0062] In some preferred embodiments, in step S2, the electrostatic adsorption layer is formed based on a preset pattern.

[0063] Specifically, the method for manufacturing a non-sticky glass substrate for electrostatic adsorption in an embodiment of the present application can realize a specific graphic design on a glass substrate by forming an electrostatic adsorption layer based on a preset pattern in step S2. This design can be customized according to application requirements, thereby improving the functionality and applicability of the electrostatic adsorption layer. The electrostatic adsorption layer of the preset pattern can provide an electrostatic adsorption function in a specific area while maintaining non-adsorption in other areas. This is of great significance for precise operation and positioning in semiconductor chip manufacturing. Positioning marks can be made, and gaps for separating packaging bodies can be reserved, etc.

[0064] In some preferred embodiments, the pretreatment comprises: Cleaning the surface of the glass substrate; The glass substrate is dried.

[0065] Specifically, the cleaning process can remove dirt, dust and other impurities on the surface of the glass substrate to ensure the surface is clean, and the drying process can remove moisture from the surface of the glass substrate to prevent the presence of moisture in subsequent steps from affecting the adhesion and uniformity of the electrostatic adsorption layer. The method for manufacturing a non-sticky glass substrate for electrostatic adsorption in an embodiment of the present application pre-treats the glass substrate through these two steps, which can significantly improve the adhesion effect of the electrostatic adsorption layer on the glass substrate, thereby improving the performance and reliability of the final product.

[0066] More specifically, the cleaning process is to perform surface cleaning based on deionized water, alcohol or other detergents to remove impurities such as grease, dust, etc. on the surface of the glass substrate.

[0067] In a second aspect, some embodiments of the present application further provide a non-adhesive glass substrate for electrostatic adsorption, which is manufactured based on the manufacturing method of the non-adhesive glass substrate for electrostatic adsorption provided in the first aspect.

[0068] The non-sticky glass substrate for electrostatic adsorption in the embodiment of the present application is made based on the aforementioned manufacturing method, which describes the specific steps of making the non-sticky glass substrate, including preparing a glass substrate, pre-treating the surface of the glass substrate, forming an electrostatic adsorption layer on the glass substrate, etc. The electrostatic adsorption layer can be made of one of a TPU electrostatic film, a PTFE film or a carbon fiber film, and the specific manufacturing steps and conditions of each film are described in detail; the non-sticky glass substrate for electrostatic adsorption can achieve effective adsorption of semiconductor chips through the electrostatic adsorption layer on the glass substrate without the need to use sticky materials, thereby avoiding the pollution, inconvenience and damage that may be caused by sticky materials.

[0069] In summary, the present application proposes a non-sticky glass substrate for electrostatic adsorption and a method for manufacturing the same, wherein the non-sticky glass substrate for electrostatic adsorption manufactured by the method can achieve temporary bonding and debonding functions through the electrostatic adsorption layer attached to its surface without using adhesive glue, thereby realizing a stable connection and easy separation between the chip and the glass substrate, solving the problem of mechanical damage and residue caused to the chip by traditional temporary bonding glue during the debonding process, improving the efficiency of the packaging process and the integrity of the chip, and reducing the cost and complexity of the production process.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0071] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A method for manufacturing a non-sticky glass substrate for electrostatic adsorption, which is used in the manufacture of semiconductor chips, characterized in that: The method comprises the steps of: S1, preparing a glass substrate and pre-treating the surface of the glass substrate; S2. Forming an electrostatic adsorption layer on the upper surface of the glass substrate, wherein the electrostatic adsorption layer is made of a polymer material.

2. The method for manufacturing a non-adhesive glass substrate for electrostatic adsorption according to claim 1, characterized in that: The electrostatic adsorption layer includes one of a TPU electrostatic film, a PTFE film and a carbon fiber film.

3. The method for manufacturing a non-adhesive glass substrate for electrostatic adsorption according to claim 1, characterized in that: When the electrostatic adsorption layer includes a TPU electrostatic film, step S2 includes: S21, obtaining TPU particles; S22, after the TPU particles and the electrostatic additive are uniformly mixed, heating and melting to obtain a molten material; S23, extruding the melt onto the upper surface of the glass substrate, and casting the melt into a TPU electrostatic film; S24, cooling the TPU electrostatic film and the glass substrate.

4. The method for manufacturing a non-adhesive glass substrate for electrostatic adsorption according to claim 3, characterized in that: The steps between step S22 and step S23 include: S2A, preheating the upper surface of the glass substrate.

5. The method for manufacturing a non-adhesive glass substrate for electrostatic adsorption according to claim 1, characterized in that: When the electrostatic adsorption layer includes a PTFE film, step S2 includes: S21', obtaining PTFE resin; S22', mixing the PTFE resin and the extrusion aid, and pressing to obtain a PTFE sheet; S23', stretching the PTFE sheet to form a microporous structure therein; S24', sintering and shaping the PTFE sheet with a microporous structure to obtain a PTFE film; S25', fixing the PTFE film on the upper surface of the glass substrate by hot-melt welding.

6. The method for manufacturing a non-adhesive glass substrate for electrostatic adsorption according to claim 5, characterized in that: Step S25' comprises: S251', covering the upper surface of the glass substrate with the PTFE film, and preheating the upper surface of the glass substrate and the PTFE film; S252', hot-pressing and fixing the preheated PTFE film on the upper surface of the glass substrate, so that the upper surface of the glass substrate and the PTFE film are closely attached; S253', cooling the glass substrate and the PTFE film.

7. The method for manufacturing a non-adhesive glass substrate for electrostatic adsorption according to claim 5, characterized in that: Step S24 ′ and step S25 ′ are performed under an inert gas atmosphere.

8. The method for manufacturing a non-adhesive glass substrate for electrostatic adsorption according to claim 1, characterized in that: In step S2, an electrostatic adsorption layer is formed based on a preset pattern.

9. The method for manufacturing a non-adhesive glass substrate for electrostatic adsorption according to claim 1, characterized in that: The pre-processing comprises: Cleaning the surface of the glass substrate; The glass substrate is dried.

10. A non-sticky glass substrate for electrostatic adsorption, characterized in that: The non-adhesive glass substrate is manufactured based on the method for manufacturing the non-adhesive glass substrate for electrostatic adsorption as described in any one of claims 1 to 9.

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