Corrosion-resistant heat-conducting copper wire gauze and preparation method thereof
By adding specific elements to the copper wire and performing the preparation steps, the existing copper wire mesh has been solved, and its performance has been significantly improved and the application field has been expanded.
Patent Information
- Application Number
- CN202411781337.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-02-18
AI Technical Summary
Due to its poor corrosion resistance and thermal conductivity, existing copper wire mesh limits its further application in electronics, filtration and other fields.
Copper wire mesh is prepared by adding elements such as Zn, Ni, Mg, Al, Ti, Pr, Nd to the copper wire, and performing rolling, drawing, annealing, and passivation during the preparation process of the copper wire mesh. , the component mass percentage of its copper wire meets a specific range, including 0.82%≤Ti+Pr-Nd≤1.13%.
It significantly improves the corrosion resistance and thermal conductivity of copper wire mesh, and expands its application potential in electronics, filtration and other fields.
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Abstract
Description
Technical Field
[0001] The invention relates to the technical field of copper alloys, and in particular to a corrosion-resistant heat-conducting copper wire mesh and a preparation method thereof. Background Art
[0002] Copper wire mesh can be woven from copper wires and is widely used in various fields, such as: in the electronics field, it has good processability, light transmittance, air permeability, capillary porous structure, mainly acts on VC heat conduction, and also effectively blocks the propagation of electromagnetic waves, protecting electronic equipment from electromagnetic interference; in the field of filtration, mainly based on its mesh size and filtration accuracy, it meets high-precision liquid filtration, air filtration, etc. with different filtration requirements to improve its filtration efficiency and selectivity; in addition to the above fields, copper wire mesh has also been widely used in the fields of energy, electrical equipment, etc. However, the existing copper wire mesh has the problem of poor corrosion resistance and thermal conductivity of copper wire, which limits the further application of copper wire mesh.
[0003] Therefore, it is necessary to obtain a copper wire mesh that is corrosion-resistant and has high thermal conductivity in order to expand the application field of the copper wire mesh and promote the continuous development of research on the performance of the copper wire mesh. Summary of the invention
[0004] The invention provides a corrosion-resistant heat-conducting copper wire mesh and a preparation method thereof, which solves the problem of poor corrosion resistance and heat conductivity of the copper wire mesh in the related art.
[0005] The technical solution of the present invention is as follows: The invention provides a corrosion-resistant heat-conducting copper wire mesh. The copper wires of the copper wire mesh are composed of the following components in mass percentage: Zn 25%-30%, Ni 1%-2%, Mg 0.5%-0.8%, Al 0.5%-1.5%, Ti 0.6%-1.2%, Pr 0.08%-0.12%, Nd 0.04%-0.1%, and the balance is Cu and inevitable impurities.
[0006] As a further technical solution, the copper wire of the copper wire mesh is composed of the following components in mass percentage: Zn 25%~30%, Ni 1%~2%, Mg 0.5%~0.8%, Al 0.5%~1.5%, Ti 0.6%~1.2%, Pr 0.08%~0.12%, Nd 0.04%~0.1%, and the balance is Cu and unavoidable impurities, and 0.82%≤Ti+Pr-Nd≤1.13%.
[0007] In the present invention, by adding Ti, Pr and Nd elements to the copper wire, when the mass percentage relationship of the three elements satisfies 0.82%≤Ti+Pr-Nd≤1.13%, the corrosion resistance of the copper wire mesh is further improved.
[0008] The present invention also provides a method for preparing the corrosion-resistant heat-conducting copper wire mesh, comprising the following steps: S1. Smelting, refining and casting raw materials according to the components of the copper wire to obtain a copper billet; S2, rolling, first drawing, annealing, second drawing, and passivation of the copper billet to obtain copper wire; S3, weaving the copper wires to obtain a copper wire mesh.
[0009] As a further technical solution, the diameter of the copper wire is 0.025~8mm.
[0010] As a further technical solution, the weaving method includes plain weave or twill weave; the thickness of the copper wire mesh is 0.05~20mm.
[0011] As a further technical solution, the passivation temperature is 50-55°C and the time is 10-15 minutes; the annealing temperature is 400-550°C.
[0012] As a further technical solution, the passivation solution during passivation includes the following components in parts by weight: 80-100 parts of water, 25-35 parts of emulsifying dispersant, 0.2-1.2 parts of wetting agent, 1-2 parts of chelating agent, 3-6 parts of 2-mercaptobenzothiazole, 1-3 parts of benzotriazole, 2-8 parts of mercaptoazole compound, 20-25 parts of alcohol solvent, 1-2 parts of film-forming agent, and 0.5-1.5 parts of metal salt.
[0013] In the present invention, 2-mercaptobenzothiazole, benzotriazole and mercaptoazole compounds are compounded and prepared with other components to obtain a passivation solution, and then the copper wire is passivated to further improve the corrosion resistance of the copper wire mesh.
[0014] As a further technical solution, the preparation method of the passivation solution includes the following steps: mixing 2-mercaptobenzothiazole, benzotriazole, and a mercaptoazole compound with an alcohol solvent, adding the remaining components and continuing to mix to obtain the passivation solution.
[0015] As a further technical solution, the mercaptoazole compound includes one or two of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 5-mercapto-1H-tetrazolyl-1-acetic acid.
[0016] As a further technical solution, when the mercaptoazole compound is 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 5-mercapto-1H-tetrazolyl-1-acetic acid, the mass ratio of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 5-mercapto-1H-tetrazolyl-1-acetic acid is 4:1~4.
[0017] In the present invention, the components of the passivation solution are compounded with 2-mercaptobenzothiazole, benzotriazole and a mercaptoazole compound, and the mercaptoazole compound is 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 5-mercapto-1H-tetrazolyl-1-acetic acid in a mass ratio of 4:1-4. After the copper wire is passivated, the corrosion resistance of the copper wire mesh is further improved.
[0018] As a further technical solution, the metal salt includes one or more of sodium tungstate, lanthanum phosphate, and sodium silicate; The chelating agent includes one or more of malic acid, phytic acid, and ethylenediaminetetraacetic acid; The emulsifying dispersant includes fatty alcohol polyoxyethylene ether; The wetting agent includes one or two of sodium lauryl sulfate and sodium lauryl sulfonate; The film-forming agent includes one or more of polyvinyl pyrrolidone, polyethylene glycol, and polyvinyl alcohol.
[0019] The working principle and beneficial effects of the present invention are: In the present invention, elements such as Zn, Ni, Mg, Al, Ti, Pr, Nd, and Cu are used as components of the copper wire in the copper wire mesh. The addition of Ti, Pr, and Nd elements significantly improves the corrosion resistance of the copper wire mesh, and the prepared copper wire mesh also has excellent thermal conductivity. DETAILED DESCRIPTION
[0020] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0021] Example 1 The copper wire of the copper wire mesh is composed of the following components in mass percentage: Zn 25%, Ni 1%, Mg 0.5%, Al 0.5%, Ti 0.6%, Pr 0.08%, Nd 0.04%, and the balance is Cu and inevitable impurities; The preparation method of the corrosion-resistant heat-conducting copper wire mesh comprises the following steps: S1. Smelting, refining and casting raw materials according to the components of the copper wire to obtain copper billets; S2, rolling, drawing, annealing the copper billet at 400°C, drawing, annealing again, and passivating at 50°C for 15 minutes to obtain a copper wire with a diameter of 0.025 mm; S3, weaving the copper wire to obtain a copper wire mesh with a thickness of 0.05 mm; The passivation solution during passivation includes the following components in parts by weight: 80 parts of water, 25 parts of dodecyl alcohol polyoxyethylene ether, 0.2 parts of sodium dodecyl sulfonate, 1 part of malic acid, 3 parts of 2-mercaptobenzothiazole, 20 parts of 70% ethanol by volume, 1 part of polyvinyl pyrrolidone (model K90), 0.1 parts of sodium tungstate, and 0.4 parts of sodium silicate; The preparation method of the passivation solution comprises the following steps: mixing 2-mercaptobenzothiazole with 70% by volume ethanol, adding the remaining components and continuing to mix to obtain the passivation solution.
[0022] Example 2 The copper wire of the copper wire mesh is composed of the following components in mass percentage: Zn 30%, Ni 2%, Mg 0.8%, Al 1.5%, Ti 1.2%, Pr 0.12%, Nd 0.1%, and the balance is Cu and inevitable impurities; The preparation method of the corrosion-resistant heat-conducting copper wire mesh comprises the following steps: S1. Smelting, refining and casting raw materials according to the components of the copper wire to obtain copper billets; S2, rolling, drawing, annealing the copper billet at 550°C, and passivating at 55°C for 10 min to obtain a copper wire with a diameter of 8 mm; S3, weaving the copper wire to obtain a copper wire mesh with a thickness of 20 mm; The passivation solution during passivation includes the following components in parts by weight: 100 parts of water, 35 parts of dodecyl alcohol polyoxyethylene ether, 1.2 parts of sodium dodecyl sulfonate, 1 part of malic acid, 1 part of phytic acid, 6 parts of 2-mercaptobenzothiazole, 25 parts of 70% ethanol by volume, 2 parts of polyvinyl alcohol (weight average molecular weight 30,000), and 1.5 parts of sodium tungstate; The preparation method of the passivation solution comprises the following steps: mixing 2-mercaptobenzothiazole with 70% by volume ethanol, adding the remaining components and continuing to mix to obtain the passivation solution.
[0023] Example 3 The copper wire of the copper wire mesh is composed of the following components in mass percentage: Zn 30%, Ni 2%, Mg 0.8%, Al 1.5%, Ti 1.2%, Pr 0.12%, Nd 0.1%, and the balance is Cu and inevitable impurities; The preparation method of the corrosion-resistant heat-conducting copper wire mesh comprises the following steps: S1. Smelting, refining and casting raw materials according to the components of the copper wire to obtain copper billets; S2, rolling, drawing, annealing at 550°C, drawing, and passivating at 55°C for 10 min to obtain a copper wire with a diameter of 1 mm; S3, weaving the copper wires to obtain a copper wire mesh with a thickness of 2.5 mm; The passivation solution during passivation includes the following components in parts by weight: 90 parts of water, 20 parts of dodecyl alcohol polyoxyethylene ether, 0.8 parts of sodium dodecyl sulfonate, 1.5 parts of malic acid, 5 parts of 2-mercaptobenzothiazole, 22 parts of 70% ethanol by volume, 1 part of polyvinyl pyrrolidone (model K90), and 1 part of sodium tungstate; The preparation method of the passivation solution comprises the following steps: mixing 2-mercaptobenzothiazole with 70% by volume ethanol, adding the remaining components and continuing to mix to obtain the passivation solution.
[0024] Example 4 The only difference between this embodiment and embodiment 3 is that the copper wire of the copper wire mesh consists of the following components in mass percentage: Zn 30%, Ni 2%, Mg 0.8%, Al 1.5%, Ti 1.1%, Pr 0.09%, Nd 0.06%, and the balance is Cu and inevitable impurities.
[0025] Example 5 The only difference between this embodiment and embodiment 3 is that the copper wire of the copper wire mesh consists of the following components in mass percentage: Zn 30%, Ni 2%, Mg 0.8%, Al 1.5%, Ti 0.8%, Pr 0.1%, Nd 0.08%, and the balance is Cu and inevitable impurities.
[0026] Example 6 The difference between this embodiment and embodiment 5 is that 2-mercaptobenzothiazole is replaced by benzotriazole.
[0027] Example 7 The only difference between this example and Example 5 is that 2-mercaptobenzothiazole is replaced by 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid.
[0028] Example 8 The difference between this embodiment and embodiment 5 is that the passivation solution during passivation includes the following components in parts by weight: 90 parts of water, 20 parts of dodecyl alcohol polyoxyethylene ether, 0.8 parts of sodium dodecyl sulfonate, 1.5 parts of malic acid, 5 parts of 2-mercaptobenzothiazole, 1 part of benzotriazole, 2 parts of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid, 22 parts of ethanol with a volume fraction of 70%, 1 part of polyvinyl pyrrolidone (model K90), and 1 part of sodium tungstate; The preparation method of the passivation solution comprises the following steps: mixing 2-mercaptobenzothiazole, benzotriazole, 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 70% by volume ethanol, adding the remaining components and continuing to mix to obtain the passivation solution.
[0029] Example 9 The difference between this embodiment and embodiment 5 is that the passivation solution during passivation includes the following components in parts by weight: 90 parts of water, 20 parts of dodecyl alcohol polyoxyethylene ether, 0.8 parts of sodium dodecyl sulfonate, 1.5 parts of malic acid, 5 parts of 2-mercaptobenzothiazole, 3 parts of benzotriazole, 8 parts of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid, 22 parts of ethanol with a volume fraction of 70%, 1 part of polyvinyl pyrrolidone (model K90), and 1 part of sodium tungstate; The preparation method of the passivation solution comprises the following steps: mixing 2-mercaptobenzothiazole, benzotriazole, 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 70% by volume ethanol, adding the remaining components and continuing to mix to obtain the passivation solution.
[0030] Example 10 The difference between this example and Example 9 is that one sixth of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid is replaced with 5-mercapto-1H-tetrazolyl-1-acetic acid; The preparation method of the passivation solution comprises the following steps: mixing 2-mercaptobenzothiazole, benzotriazole, 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid, 5-mercapto-1H-tetrazolyl-1-acetic acid and 70% by volume ethanol, adding the remaining components and continuing to mix to obtain the passivation solution.
[0031] Embodiment 11 The only difference between this example and Example 10 is that five ninths of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid is replaced with 5-mercapto-1H-tetrazolyl-1-acetic acid.
[0032] Example 12 The only difference between this example and Example 10 is that one fifth of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid is replaced with 5-mercapto-1H-tetrazolyl-1-acetic acid.
[0033] Embodiment 13 The only difference between this example and Example 10 is that half of the 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid is replaced with 5-mercapto-1H-tetrazolyl-1-acetic acid.
[0034] Embodiment 14 The only difference between this embodiment and embodiment 3 is that the copper wire of the copper wire mesh consists of the following components in mass percentage: Zn 25%, Ni 1%, Mg 0.5%, Al 0.5%, Ti 0.6%, Pr 0.08%, Nd 0.04%, and the balance is Cu and inevitable impurities.
[0035] Comparative Example 1 The only difference between this comparative example and Example 3 is that the copper wire of the copper wire mesh consists of the following components in mass percentage: Zn 30%, Ni 2%, Mg 0.8%, Al 1.5%, Ti 1.2%, Pr 0.12%, and the balance is Cu and inevitable impurities.
[0036] Comparative Example 2 The only difference between this comparative example and Example 3 is that the copper wire of the copper wire mesh consists of the following components in mass percentage: Zn 30%, Ni 2%, Mg 0.8%, Al 1.5%, Ti 1.2%, Nd 0.1%, and the balance is Cu and inevitable impurities.
[0037] Comparative Example 3 The only difference between this comparative example and Example 3 is that the copper wire of the copper wire mesh consists of the following components in mass percentage: Zn 30%, Ni 2%, Mg 0.8%, Al 1.5%, Pr 0.12%, Nd 0.1%, and the balance is Cu and inevitable impurities.
[0038] The thermal conductivity of the copper wire meshes prepared in Examples 1 to 3 and Comparative Examples 1 to 3 was tested using a portable intelligent thermal conductivity tester; The copper wires prepared in Examples 1 to 14 and Comparative Examples 1 to 3 were respectively tested for corrosion resistance: Corrosion rate test method: Under the test conditions of a flow rate of 2 m / s and a sand content of 300 mg / L, the thickness loss of the sample after immersion for 1 month was calculated, and the annual thickness loss was deduced.
[0039] The results are shown in Tables 1~2 below.
[0040] Table 1 Thermal conductivity test results
[0041] Table 2 Corrosion resistance test results
[0042] Compared with Comparative Examples 1 to 3, the corrosion rate of the copper wires prepared in Examples 1 to 14 is lower and the thermal conductivity of the copper wire mesh is higher, indicating that the addition of Ti, Pr, and Nd elements significantly improves the corrosion resistance of the copper wire mesh, and the prepared copper wire mesh also has excellent thermal conductivity.
[0043] Compared with Example 3 and Example 14, the corrosion rate of the copper wire prepared in Examples 4 to 5 is lower, indicating that by adding Ti, Pr, and Nd elements to the copper wire, when the mass percentage relationship of the three satisfies 0.82%≤Ti+Pr-Nd≤1.13%, the corrosion resistance of the copper wire mesh is further improved.
[0044] Compared with Examples 5 to 7, the corrosion rate of the copper wire prepared in Examples 8 to 9 is lower, indicating that after 2-mercaptobenzothiazole, benzotriazole, and mercaptoazole compounds are compounded with other components to prepare a passivation solution, the copper wire is passivated, which further improves the corrosion resistance of the copper wire mesh.
[0045] Compared with embodiments 9 to 11, the corrosion rate of the copper wire obtained in embodiments 12 to 13 is lower, indicating that the components of the passivation solution are compounded with 2-mercaptobenzothiazole, benzotriazole, and a mercaptoazole compound, and the mercaptoazole compound uses 5-mercapto-1,2,3,4-tetrazole-1-methanesulfonic acid and 5-mercapto-1H-tetrazole-1-acetic acid in a mass ratio of 4:1 to 4. After the copper wire is passivated, the corrosion resistance of the copper wire mesh is further improved.
[0046] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A corrosion-resistant thermally conductive copper wire mesh, characterized in that: The copper wire of the copper wire mesh is composed of the following components in mass percentage: Zn 25%~30%, Ni 1%~2%, Mg 0.5%~0.8%, Al 0.5%~1.5%, Ti 0.6%~1.2%, Pr 0.08%~0.12%, Nd0.04%~0.1%, and the balance is Cu and inevitable impurities.
2. The corrosion-resistant thermally conductive copper wire mesh according to claim 1, characterized in that: The copper wire of the copper wire mesh is composed of the following components in mass percentage: Zn 25%~30%, Ni 1%~2%, Mg 0.5%~0.8%, Al 0.5%~1.5%, Ti 0.6%~1.2%, Pr 0.08%~0.12%, Nd 0.04%~0.1%, the balance is Cu and unavoidable impurities, and 0.82%≤Ti+Pr-Nd≤1.13%.
3. The method for preparing a corrosion-resistant thermally conductive copper wire mesh according to any one of claims 1 to 2, characterized in that: The following steps are involved: S1. Smelting, refining and casting raw materials according to the components of the copper wire to obtain a copper billet; S2, rolling, first drawing, annealing, second drawing, and passivation of the copper billet to obtain copper wire; S3, weaving the copper wires to obtain a copper wire mesh.
4. The method for preparing a corrosion-resistant thermally conductive copper wire mesh according to claim 3, characterized in that: The diameter of the copper wire is 0.025-8 mm.
5. The method for preparing a corrosion-resistant thermally conductive copper wire mesh according to claim 3, characterized in that: The weaving method includes plain weave or twill weave; the thickness of the copper wire mesh is 0.05~20mm.
6. The method for preparing a corrosion-resistant thermally conductive copper wire mesh according to claim 3, characterized in that: The passivation temperature is 50-55°C and the time is 10-15 minutes; the annealing temperature is 400-550°C.
7. The method for preparing a corrosion-resistant thermally conductive copper wire mesh according to claim 3, characterized in that: The passivation solution during passivation comprises the following components in parts by weight: 80-100 parts of water, 25-35 parts of emulsifying dispersant, 0.2-1.2 parts of wetting agent, 1-2 parts of chelating agent, 3-6 parts of 2-mercaptobenzothiazole, 1-3 parts of benzotriazole, 2-8 parts of mercaptoazole compound, 20-25 parts of alcohol solvent, 1-2 parts of film-forming agent and 0.5-1.5 parts of metal salt.
8. The method for preparing a corrosion-resistant thermally conductive copper wire mesh according to claim 7, characterized in that: The mercapto-nitroazole compound includes one or two of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 5-mercapto-1H-tetrazolyl-1-acetic acid.
9. The method for preparing a corrosion-resistant thermally conductive copper wire mesh according to claim 8, characterized in that: When the mercaptoazole compound is 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 5-mercapto-1H-tetrazolyl-1-acetic acid, the mass ratio of 5-mercapto-1,2,3,4-tetrazolyl-1-methanesulfonic acid and 5-mercapto-1H-tetrazolyl-1-acetic acid is 4:1~4.
10. The method for preparing a corrosion-resistant thermally conductive copper wire mesh according to claim 7, characterized in that: The metal salt includes one or more of sodium tungstate, lanthanum phosphate, and sodium silicate; The chelating agent includes one or more of malic acid, phytic acid, and ethylenediaminetetraacetic acid; The emulsifying dispersant includes fatty alcohol polyoxyethylene ether; The wetting agent includes one or two of sodium lauryl sulfate and sodium lauryl sulfonate; The film-forming agent includes one or more of polyvinyl pyrrolidone, polyethylene glycol, and polyvinyl alcohol.