Circuit board coating process and vacuum coating machine

By using positively charged argon ions to accelerate impact on the target surface in the vacuum coating process, the problem of poor uniformity of the coating of complex-shaped circuit boards in the prior art is solved, and a higher quality and uniform coating effect is achieved.

CN119465058AInactive Publication Date: 2025-02-18SHANGHAI XUNHONG COMPUTER TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510058652.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-15
Publication Date
2025-02-18
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

When the existing vacuum evaporation process deals with circuit boards of larger or complex shapes, the uniformity of the coating is affected, especially for circuit boards with three-dimensional structures. The evaporated material propagates along a straight path, making it difficult to cover the non-direct-view area, resulting in the coating. Inadequate thickness affects the uniformity of the overall coating effect.

Method used

Positively charged argon ions accelerate the impact on the target surface under the action of an electric field, knock out the atoms or molecules on the target surface, and move the released particles along an irregular path, thereby covering the circuit with complex shapes more evenly and deposited to form a thin film.

Benefits of technology

Improve the quality and uniformity of the circuit board coating, ensure that all areas of complex-shaped circuit boards are evenly coated, and extend the service life of the circuit board.

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Abstract

The invention discloses a circuit board coating process, and relates to the technical field of circuit board processing. Comprising the following steps that a cleaned circuit board base material is transferred into a vacuum chamber, and the vacuum chamber is pre-vacuumized after transferring is finished; introducing argon, switching on a magnetron sputtering power supply, and ionizing the argon into positively charged argon ions and free electrons; accelerating the positively charged argon ions to move towards the surface of the target material with negative voltage under the action of the electric field, and impacting the surface of the target material at a high speed to knock out atoms or molecules on the surface of the target material; and the hit-out particles fly to the surface of the circuit board and are deposited on the circuit board to form a thin film. According to the method, the argon ions with positive electricity are driven by the electric field to impact the surface of the target material in an accelerated manner, atoms or molecules on the surface of the target material are hit out, and released particles move along irregular paths, so that a circuit board base material with a complex shape can be more uniformly covered, and the quality and uniformity of circuit board coating are improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a circuit board coating process and a vacuum coating machine. Background Art

[0002] Vacuum coating process is widely used in many fields such as semiconductor, optics, decoration, tools and medical treatment. According to different deposition technologies, it is divided into physical vapor deposition and chemical vapor deposition. Among physical vapor deposition, vacuum evaporation is widely used in circuit board coating process because of its wide application range and multiple functions. Vacuum evaporation heats the coating material to an evaporation state in a high vacuum environment, and after evaporation, it is deposited on the circuit board in a straight line, and then condenses on the circuit board to form a thin film, thereby completing the coating of the circuit board. Although this can achieve the coating of the circuit board, when processing large or complex-shaped circuit boards, the uniformity of the coating will be affected. Especially for circuit boards with three-dimensional structures, since the evaporated material only propagates along a straight path, it is difficult to cover the non-direct view area, resulting in insufficient coating thickness in these areas, thereby affecting the uniformity of the overall coating effect and the subsequent use of the circuit board. Summary of the invention

[0003] In view of the problems existing in the above coating process when coating a circuit board, the present invention provides a circuit board coating process and a vacuum coating machine.

[0004] The technical solution of the present invention is: a circuit board coating process, the circuit board coating process is based on a vacuum coating machine, and the circuit board coating process includes the following steps: S1: Perform preliminary cleaning on the circuit board substrate, using negative ion airflow at a flow rate of 1.4m / s to blow dust on the circuit board substrate for more than 5 minutes to ensure the removal efficiency of dust on it; S2: Perform secondary soot blowing on the circuit board substrate after preliminary cleaning, using clean gas to blow soot on the circuit board substrate at a flow rate of 1.7 m / s for 2 minutes or more; S3: After the secondary cleaning, the circuit board substrate is transferred to the vacuum chamber. After the transfer is completed, the vacuum chamber is pre-evacuated until the vacuum degree reaches 6×10 -3 Pa; S4: heating the circuit board substrate at a temperature of 100°C-300°C; S5: Introduce argon gas and control the vacuum degree at 2×10 -1 Pa~5×10 -1 Pa, turn on the magnetron sputtering power supply and control the voltage at 300V-600V to ionize the argon gas into positively charged argon ions and free electrons; S6: The positively charged argon ions are accelerated to move toward the target surface with negative voltage under the action of the electric field, and hit the target surface at high speed, knocking out atoms or molecules on the target surface; S7: The ejected particles fly to the surface of the circuit board and deposit on it, gradually forming a uniform film; S8: After the coating is completed, turn off the power, restore the atmospheric pressure, take out the coated circuit board, and measure the thickness of the film layer.

[0005] A circuit board coating vacuum coating machine is also provided, which uses a circuit board coating process as described above, and the vacuum coating machine includes a shell, a sputtering coating system is arranged inside the shell, a connecting shaft and a connecting disk are rotatably connected inside the shell, a driving module for driving the connecting shaft to rotate is arranged inside the shell, the connecting disk is fixedly connected to the connecting shaft, the connecting disk is rotatably connected to a circumferentially distributed mounting block, the connecting disk is provided with a transmission module for driving the mounting block to rotate, the mounting block is detachably connected to a mounting frame, the mounting frame is provided with a mounting mechanism, the mounting mechanism is used to fix the circuit board to be coated, the mounting mechanism includes: two centrally symmetrically distributed fixing seats, the two fixing seats are both fixedly connected to the adjacent fixing frames, the fixing seats are provided with a first connecting assembly and a second connecting assembly, the fixing seats are provided with a centrally symmetrically distributed first clamping plate through the first connecting assembly thereon, the fixing seats are provided with a centrally symmetrically distributed second clamping plate through the second connecting assembly thereon, and a driving assembly is arranged inside the shell, the driving assembly is used to change the positions of all the first clamping plates and all the second clamping plates.

[0006] Further, the first connecting component includes first drive shafts that are centrally symmetrically distributed, and the first drive shafts that are centrally symmetrically distributed are all rotatably connected to adjacent fixed seats, and the first drive shafts are rotatably connected to the mounting frame, and the fixed seat is provided with a first transmission box for driving the first drive shafts centrally symmetrically distributed thereon to rotate synchronously, and the first drive shaft is provided with a first connecting block, and the first clamping plates that are centrally symmetrically distributed are respectively arranged on the side of the adjacent first connecting block away from the adjacent first drive shaft.

[0007] Furthermore, the second connecting component includes a second driving shaft with a central symmetrical distribution, and the second driving shafts with a central symmetrical distribution are all rotatably connected to the adjacent fixed seats. The first driving shaft and the second driving shaft on the same fixed seat are not in the same horizontal plane. The second driving shaft is rotatably connected to the mounting frame. The fixed seat is provided with a second transmission box for driving the second driving shafts with a central symmetrical distribution thereon to rotate synchronously. The second driving shaft is provided with a second connecting block, and the second clamping plates with a central symmetrical distribution are respectively arranged on the side of the adjacent second connecting block away from the adjacent second driving shaft.

[0008] Furthermore, the driving assembly includes an electric push rod, which is fixed to the inside of the outer shell, and a moving ring is fixed to the telescopic end of the electric push rod. A connecting ring is rotatably connected to the outer side of the moving ring, and the connecting ring is provided with circumferentially distributed connecting holes. A first moving shell is slidably connected to one side of the mounting frame, and one of the second driving shafts distributed symmetrically with the center is fixed to a first gear located in an adjacent first moving shell, and a first rack meshing with the first gear therein is fixed to the first moving shell.

[0009] Furthermore, the driving assembly also includes a second movable shell, which is slidably connected to the other side of the mounting frame, and one of the first driving shafts distributed symmetrically is fixedly connected to a second gear located in an adjacent second movable shell, and the second movable shell is fixedly connected to a second rack meshing with the second gear therein, and a transfer assembly is arranged in the mounting block, and the transfer assembly is used to drive the first movable shell and the second movable shell to move.

[0010] Further, the transfer assembly includes a first L-shaped rod, the first L-shaped rod is fixedly connected to one side of the first movable shell, the first L-shaped rod is provided with a third rack, the second movable shell is fixedly connected to a second L-shaped rod on one side close to the third rack, the second L-shaped rod is provided with a fourth rack, a connecting piece is provided on the mounting block, the connecting piece on the mounting block is slidably connected to the fourth rack and the third rack, and the fourth rack slides in the adjacent connecting hole.

[0011] Furthermore, the transfer assembly also includes a third gear, and a connecting seat is installed on the side of the mounting block close to the adjacent fourth rack. The third gear is rotatably connected to the connecting seat on the adjacent mounting block, and the third gear is meshed with the adjacent fourth rack and the adjacent third rack. The connecting ring is provided with an auxiliary fixing assembly, and the auxiliary fixing assembly is used to guide the first clamping plate and the second clamping plate.

[0012] Furthermore, it also includes a delay component that is evenly distributed in the circumferential direction, and the delay component is arranged on the adjacent mounting block. The delay component is used to delay the movement of the adjacent first L-shaped rod and the adjacent second L-shaped rod. The delay component includes symmetrically distributed elastic telescopic rods, and the symmetrically distributed elastic telescopic rods are all fixed to the side of the adjacent mounting block close to the adjacent third gear. The telescopic ends of the elastic telescopic rods are fixed to a limiting block, and the limiting block is provided with two upper and lower inclined surfaces. The limiting block is used to limit the adjacent first L-shaped rod or the adjacent second L-shaped rod, and tension springs are fixed between the first L-shaped rod and the adjacent third rack and between the second L-shaped rod and the adjacent fourth rack.

[0013] Furthermore, the auxiliary fixing mechanism includes torsion springs distributed in a matrix, the torsion springs distributed in the matrix are respectively fixed to the adjacent first drive shaft or the second drive shaft, and the first connecting block and the second connecting block are respectively fixed to the adjacent torsion springs, the first connecting block and the second connecting block are both slidably connected to a moving rod, the first clamping plate and the second clamping plate are respectively fixed to the adjacent moving rod, the moving rod is hinged with a telescopic connecting rod, and the first drive shaft and the second drive shaft are respectively fixed to the adjacent telescopic connecting rod.

[0014] Compared with the prior art, the present invention has at least the following beneficial effects: the present invention accelerates positively charged argon ions driven by an electric field to impact the surface of the target material, knocks out atoms or molecules on the surface of the target material, and causes the released particles to move along an irregular path, thereby more evenly covering a circuit board substrate with a complex shape, and finally depositing thereon to form a thin film, thereby improving the quality and uniformity of the circuit board coating.

[0015] The circuit board is fixed alternately by the first clamping plate and the second clamping plate to change the fixing position of the circuit board, ensuring that all areas of the circuit board can be evenly coated during the coating process, thereby improving the uniformity of the circuit board coating and ensuring the high quality of the circuit board and the reliability of subsequent use.

[0016] The first clamping plate will be separated from the circuit board only after the second clamping plate completes fixing the circuit board, ensuring that the circuit board is always fixed on the mounting frame when the working states of the first clamping plate and the second clamping plate are replaced, thereby preventing the circuit board from moving and affecting the subsequent coating process and the uniformity of the coating thereon.

[0017] By changing the relative positions of the first clamping plate and the second clamping plate in a manner combining rotation and sliding, the first clamping plate and the second clamping plate will not block the circuit board after being separated from the circuit board, thereby increasing the uniformity of the circuit board coating and preventing the first clamping plate and the second clamping plate from colliding with the circuit board during movement, thereby maintaining the integrity of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a three-dimensional structural schematic diagram of the connection plate and the mounting block of the present invention; Figure 3 It is a three-dimensional structural cross-sectional view of the connection disk of the present invention; Figure 4 It is a three-dimensional structural schematic diagram of the mounting block and the mounting frame of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the fixing seat and the first clamping plate of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the fixing seat and the first driving shaft of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the first driving shaft and the second driving shaft of the present invention; Figure 8 is a schematic diagram of the three-dimensional structure of the first gear and the first rack of the present invention; Fig. 9 It is a schematic diagram of the three-dimensional structure of the second moving housing and the second gear of the present invention; Fig.10 It is a schematic diagram of the three-dimensional structure of the first L-shaped rod and the second L-shaped rod of the present invention; Fig.11 It is a schematic diagram of the three-dimensional structure of the first clamping plate and the moving rod of the present invention; Fig.12 It is a three-dimensional structural cross-sectional view of the torsion spring and the telescopic connecting rod of the present invention.

[0019] Wherein: 1-housing, 2-connecting shaft, 3-connecting plate, 4-mounting block, 5-mounting frame, 7-fixed seat, 9-first clamping plate, 10-second clamping plate, 11-first driving shaft, 12-first connecting block, 13-second driving shaft, 14-second connecting block, 15-electric push rod, 16-moving ring, 17-connecting ring, 171-connecting hole, 18-first moving shell, 19-first gear, 20-first rack, 21-second moving shell, 22-second gear, 23-second rack, 24-first L-shaped rod, 25-third rack, 26-second L-shaped rod, 27-fourth rack, 28-third gear, 31-tension spring, 32-elastic telescopic rod, 33-limiting block, 34-torsion spring, 35-moving rod, 36-telescopic connecting rod. DETAILED DESCRIPTION

[0020] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0021] Embodiment 1: A circuit board coating process, the circuit board coating process is based on a vacuum coating machine, and the circuit board coating process includes the following steps: S1: Perform preliminary cleaning on the circuit board substrate, using negative ion airflow at a flow rate of 1.4m / s to blow dust on the circuit board substrate for more than 5 minutes to ensure the removal efficiency of dust on it; S2: Perform secondary soot blowing on the circuit board substrate after preliminary cleaning, using clean gas to blow soot on the circuit board substrate at a flow rate of 1.7 m / s for 2 minutes or more; S3: After the secondary cleaning, the circuit board substrate is transferred to the vacuum chamber. After the transfer is completed, the vacuum chamber is pre-evacuated until the vacuum degree reaches 6×10 -3 Pa; S4: heating the circuit board substrate at a temperature of 100°C-300°C; S5: Introduce argon gas and control the vacuum degree at 2×10 -1 Pa~5×10 -1 Pa, turn on the magnetron sputtering power supply and control the voltage at 300V-600V to ionize the argon gas into positively charged argon ions and free electrons; S6: The positively charged argon ions are accelerated to move toward the target surface with negative voltage under the action of the electric field, and hit the target surface at high speed, knocking out atoms or molecules on the target surface; S7: The ejected particles fly to the surface of the circuit board and deposit on it, gradually forming a uniform film; S8: After the coating is completed, turn off the power, restore the atmospheric pressure, take out the coated circuit board, and measure the thickness of the film layer.

[0022] Embodiment 2: Based on Embodiment 1, a circuit board coating vacuum coating machine is provided, which applies the circuit board coating process as described above. Figure 1-Figure 5As shown, the vacuum coating machine includes a shell 1, a sputtering coating system is arranged inside the shell 1, a connecting shaft 2 and a connecting disk 3 are rotatably connected inside the shell 1, a driving module for driving the connecting shaft 2 to rotate is arranged inside the shell 1, the connecting disk 3 is fixedly connected to the connecting shaft 2, the connecting disk 3 is rotatably connected to a circumferentially distributed mounting block 4, a transmission module for driving the mounting block 4 to rotate is arranged on the connecting disk 3, the mounting block 4 is detachably connected to a mounting frame 5, the mounting frame 5 is provided with a mounting mechanism, the mounting mechanism is used to fix the circuit board to be coated, the mounting mechanism includes: two centrally symmetrically distributed fixing seats 7, the two fixing seats 7 are both fixedly connected to adjacent mounting frames 5, the fixing seats 7 are provided with a first connecting assembly and a second connecting assembly, the fixing seats 7 are provided with two centrally symmetrically distributed first clamping plates 9 through the first connecting assembly thereon, the fixing seats 7 are provided with two centrally symmetrically distributed second clamping plates 10 through the second connecting assembly thereon, a driving assembly is arranged inside the shell 1, the driving assembly is used to change the positions of all first clamping plates 9 and all second clamping plates 10.

[0023] In the above scheme, the sputtering coating system is an existing device, which is located on the right side of the shell 1. The sputtering coating system coats the circuit board by sputtering coating; the driving module is an existing device, which can be selected as a combination of a motor and a reducer; the specific number of mounting blocks 4 can be selected by the staff, and one is shown as an example in the figure and the text. In actual use, in order to ensure that the force on the connecting plate 3 is uniform, the mounting blocks 4 should be set to at least two with central symmetrical distribution; the transmission module is shown in the figure by taking two meshing gears as an example, one of which is fixed to the shell 1 through a connecting piece, and the connecting shaft 2 passes through the gear on the shell 1, and the other gear is fixed to the adjacent mounting block 4; each mounting frame 5 has a plurality of mounting blocks 4, each of which ... The specific number of the mounting mechanism can also be specifically selected by the staff during use, and one is shown in the figure and the text as an example; the two adjacent first clamping plates 9 and the two adjacent second clamping plates 10 on different fixing seats 7 in the same mounting mechanism are all centrally symmetrically distributed, and the two first clamping plates 9 on the same fixing seat 7 are set as a group, and the two second clamping plates 10 are set as a group. Initially, the two groups of first clamping plates 9 located on the same mounting mechanism jointly fix the circuit board, that is, the first clamping plate 9 in the figure is in a vertical position when it is in a working state, and the first clamping plate 9 and the second clamping plate 10 are both made of elastic deformable material, which is used to convert the hard extrusion of the circuit board into flexible extrusion to avoid the circuit board from being damaged by extrusion.

[0024] When it is necessary to use the device to coat the circuit board, the staff will place the pre-treated circuit board between the two fixing seats 7, and fix the circuit board to be coated between the two fixing seats 7 through the mounting mechanism. Then the staff will close the shell 1, and use the external exhaust device to extract the gas in the shell 1, so that the shell 1 is in a vacuum negative pressure state. After the vacuum degree in the shell 1 reaches the preset value, the staff will start the electrode coating system to perform sputtering coating on the circuit board, and at the same time start the driving module, which drives the connecting shaft 2 to rotate, and the connecting shaft 2 drives the connecting disk 3 and the mounting block 4 to rotate synchronously. The transmission module drives the mounting block 4 to rotate while rotating circumferentially with the connecting disk 3, and during the coating process, controls the driving component to alternately change the working states of the two groups of first clamping plates 9 and the two groups of second clamping plates 10, thereby making the two groups of first clamping plates 9 and the two groups of second clamping plates 10 alternately fix the circuit board to change the fixing position of the circuit board, ensuring that all areas of the circuit board can be evenly coated during the coating process, avoiding the problem of some areas not being coated due to obstruction, thereby improving the uniformity of the coating of the circuit board and ensuring the high quality of the circuit board and the reliability of subsequent use.

[0025] After the circuit board is coated using the device, the staff shuts down the device and uses the existing device to restore the air pressure in the shell 1 to atmospheric pressure, then opens the shell 1 and removes the coated circuit board, and then continues to coat the remaining circuit boards that need to be coated according to the above operation.

[0026] like Figure 5-Figure 8 As shown, the first connecting assembly includes a first driving shaft 11 with a central symmetrical distribution, and the first driving shafts 11 with a central symmetrical distribution are all rotatably connected to the adjacent fixing seats 7, and the first driving shafts 11 are rotatably connected to the mounting frame 5, and the fixing seat 7 is provided with a first transmission box for driving the first driving shafts 11 with a central symmetrical distribution thereon to rotate synchronously, and the first driving shaft 11 is provided with a first connecting block 12, and the first clamping plates 9 with a central symmetrical distribution are respectively arranged on the side of the adjacent first connecting block 12 away from the adjacent first driving shaft 11, and the second connecting assembly includes a second driving shaft 13 with a central symmetrical distribution, and the second driving shaft 13 with a central symmetrical distribution is provided. The moving shafts 13 are all rotatably connected to the adjacent fixed seats 7. The first drive shaft 11 and the second drive shaft 13 on the same fixed seat 7 are not on the same horizontal plane, so that the first drive shaft 11 and the second drive shaft 13 can respectively drive other parts connected thereto to rotate normally. The second drive shaft 13 is rotatably connected to the mounting frame 5. The fixed seat 7 is provided with a second transmission box for driving the second drive shaft 13 centrally symmetrically distributed thereon to rotate synchronously. The second drive shaft 13 is provided with a second connecting block 14. The second clamping plates 10 centrally symmetrically distributed are respectively arranged on the side of the adjacent second connecting block 14 away from the adjacent second drive shaft 13.

[0027] In the above scheme, the first transmission box and the second transmission box are both gear boxes; the first transmission box on the fixed seat 7 is located on the opposite sides of the two first drive shafts 11 thereon, and the two first drive shafts 11 on the same fixed seat 7 are respectively connected to the two output ends of the first transmission box on the fixed seat 7, and the rotation directions of the two output ends of the first transmission box on the fixed seat 7 are opposite; the second transmission box on the fixed seat 7 is located on the opposite sides of the two second drive shafts 13 thereon, and the two second drive shafts 13 on the same fixed seat 7 are respectively connected to the two output ends of the second transmission box on the fixed seat 7, and the rotation directions of the two output ends of the second transmission box on the fixed seat 7 are opposite.

[0028] like Figure 2-Figure 10 As shown, the driving component includes an electric push rod 15, which is fixed to the inside of the shell 1, and a moving ring 16 is fixed to the telescopic end of the electric push rod 15. The outer side of the moving ring 16 is rotatably connected to a connecting ring 17, and the connecting ring 17 is provided with circumferentially distributed connecting holes 171. A first moving shell 18 is slidably connected to one side of the mounting frame 5, and one of the second driving shafts 13 distributed centrally and symmetrically is fixedly connected to a first gear 19 located in an adjacent first moving shell 18, and a first rack 20 meshing with the first gear 19 in the first moving shell 18 is fixedly connected therein. The driving component also includes a second moving shell 21, which is slidably connected to the other side of the mounting frame 5, and one of the first driving shafts 11 distributed centrally and symmetrically is fixedly connected to a second gear 22 located in an adjacent second moving shell 21, and a second rack 23 meshing with the second gear 22 in the second moving shell 21 is fixedly connected therein. A transfer component is provided in the mounting block 4, and the transfer component is used to drive the first moving shell 18 and the second moving shell 21 to move.

[0029] In the above scheme, the specific number of connecting holes 171 is the same as the specific number of mounting blocks 4, the first movable shell 18 is located on the right side of the mounting frame 5, and the first gear 19 is located on the right second drive shaft 13 of the two second drive shafts 13 on the same fixed seat 7; the specific number of first racks 20 in the first movable shell 18 on the same mounting frame 5 is the same as the specific number of first gears 19 on the same mounting frame 5, and two are used as examples in the figure and the text; the second movable shell 21 is located on the left side of the mounting frame 5, and the second gear 22 is located on the left first drive shaft 11 of the two first drive shafts 11 on the same fixed seat 7; the specific number of second racks 23 in the second movable shell 21 on the same mounting frame 5 is the same as the specific number of second gears 22 on the same mounting frame 5, and two are used as examples in the figure and the text; the teeth on the first rack 20 and the second rack 23 are both facing the front.

[0030] like Figure 3 and Fig.10As shown, the transfer assembly includes a first L-shaped rod 24, which is fixed to one side of the first movable shell 18, and the first L-shaped rod 24 is provided with a third rack 25. A second L-shaped rod 26 is fixed to the side of the second movable shell 21 close to the third rack 25, and the second L-shaped rod 26 is provided with a fourth rack 27. A connecting member is provided on the mounting block 4, and the connecting member on the mounting block 4 is slidably connected to the fourth rack 27 and the third rack 25. The fourth rack 27 slides in an adjacent connecting hole 171. The transfer assembly also includes a third gear 28. A connecting seat is installed on one side of the mounting block 4 close to the adjacent fourth rack 27. The third gear 28 is rotatably connected to the connecting seat on the adjacent mounting block 4, and the third gear 28 is meshed with the adjacent fourth rack 27 and the adjacent third rack 25. The connecting ring 17 is provided with an auxiliary fixing assembly, and the auxiliary fixing assembly is used to guide the first clamping plate 9 and the second clamping plate 10.

[0031] In the above scheme, the fourth rack 27 and the third rack 25 are both located above the mounting block 4, and the teeth on the two are located on the side where the two are close to each other. The third gear 28 is also located above the mounting block 4, and the third gear 28 is located between the fourth rack 27 and the third rack 25, that is, when the third rack 25 moves downward, the fourth rack 27 moves upward driven by the third gear 28, and during the rotation of the mounting block 4, the mounting block 4 drives the fourth rack 27 thereon to rotate synchronously along the adjacent connecting hole 171.

[0032] In the process of fixing the circuit board, the staff controls the electric push rod 15, so that the telescopic end of the electric push rod 15 drives the moving ring 16 to move upward, and the moving ring 16 drives the fourth rack 27 to move upward synchronously through the connecting ring 17, so that the fourth rack 27 drives the second moving shell 21 to move upward synchronously through the second L-shaped rod 26, so that the second moving shell 21 drives the two second racks 23 thereon to move upward synchronously, and at the same time, the two second racks 23 drive the adjacent second gears 22 to rotate counterclockwise during the movement, and the two second gears 22 drive the adjacent first drive shafts 11 (the two first drive shafts 11 on the left side) to rotate counterclockwise (with the first gears 22 rotating counterclockwise). Figure 4The perspective from right to left in the figure is the reference perspective), the two first driving shafts 11 on the left are respectively driven by the adjacent first transmission boxes on the adjacent fixed seat 7, so that the two first driving shafts 11 on the right rotate clockwise, and the four first driving shafts 11 respectively drive the first connecting blocks 12 thereon to rotate synchronously, and at the same time, the first connecting blocks 12 drive the first clamping plates 9 thereon to rotate synchronously, and the two groups of first clamping plates 9 are converted from a vertical state to a horizontal state. Subsequently, after the staff puts the circuit board to be coated at the specified position, the staff controls the second movable shell 21 to move downward, thereby driving the two groups of first clamping plates 9 to rotate in the opposite direction, that is, to convert from a horizontal state to a vertical state, that is, the two groups of first clamping plates 9 clamp and fix the circuit board to be coated, and at the same time, the mounting frame 5 limits the left and right sides of the circuit board to avoid displacement of the circuit board during the coating process, thereby ensuring the uniformity of the circuit board coating.

[0033] In the process of the second movable shell 21 moving upward, the second movable shell 21 drives the second L-shaped rod 26 thereon to move upward synchronously, and the second L-shaped rod 26 drives the fourth rack 27 to move upward synchronously. In the process of the fourth rack 27 moving upward, the third rack 25 is driven by the third gear 28 to move downward synchronously, and the third rack 25 drives the first movable shell 18 to move downward synchronously through the transmission of the first L-shaped rod 24. At the same time, the first movable shell 18 drives the two first racks 20 thereon to move downward, and the two first racks 20 respectively drive the adjacent first gears 19 to rotate, and the first gear 19 drives the adjacent second drive shaft 13 to rotate synchronously during the rotation process ( The two second drive shafts 13 on the right side rotate clockwise), and then the two second drive shafts 13 on the right side respectively drive the two second drive shafts 13 on the left side to rotate synchronously (counterclockwise) under the action of the adjacent second transmission boxes on the adjacent fixed seat 7, driving the two groups of second clamping plates 10 to convert from a horizontal state to a vertical state, until the rotation angle of the two groups of first clamping plates 9 is the same as the rotation angle of the two groups of second clamping plates 10. The staff stops moving the second movable shell 21, and after placing the circuit board to be coated at the specified position, the staff controls the telescopic end of the electric push rod 15 to drive the second movable shell 21 to move downward, thereby resetting the two groups of first clamping plates 9 and the two groups of second clamping plates 10 to their initial positions.

[0034] When it is necessary to switch from fixing the circuit board by the two groups of first clamping plates 9 to fixing the circuit board by the two groups of second clamping plates 10, the staff starts the electric push rod 15 again, so that the telescopic end of the electric push rod 15 drives the movable ring 16 to move upward, and the movable ring 16 drives the fourth rack 27 to move upward synchronously through the connecting ring 17, so that the fourth rack 27 drives the second movable shell 21 to move upward synchronously through the second L-shaped rod 26, so as to change the position of the two groups of first clamping plates 9 (convert from a vertical state to a horizontal state). The specific process will not be described in detail, and you can refer to the above.

[0035] Until the two groups of second clamping plates 10 are rotated to a vertical state, the two groups of first clamping plates 9 are rotated to a horizontal state, and the telescopic end of the electric push rod 15 moves upward to the extreme position, and then the staff shuts down the electric push rod 15 to maintain the two groups of second clamping plates 10 and the two groups of first clamping plates 9 in this position, and in the subsequent process of coating the circuit board, the electric push rod 15 is intermittently controlled to make the two groups of second clamping plates 10 and the two groups of first clamping plates 9 alternately fix the circuit board.

[0036] Embodiment 3: Based on embodiment 2, Fig.10 As shown, it also includes a circumferentially uniformly distributed delay component, which is arranged on the adjacent mounting block 4. The delay component is used to delay the movement of the adjacent first L-shaped rod 24 and the adjacent second L-shaped rod 26. The delay component includes two elastic telescopic rods 32 symmetrically distributed on the left and right. The two elastic telescopic rods 32 are both fixedly connected to the upper side of the adjacent mounting block 4. The telescopic ends of the elastic telescopic rods 32 are fixedly connected to the limiting blocks 33. The limiting blocks 33 are provided with upper and lower inclined surfaces. The limiting blocks 33 are used to limit the adjacent first L-shaped rod 24 or the adjacent second L-shaped rod 26. Tension springs 31 are fixedly connected between the first L-shaped rod 24 and the adjacent third rack 25 and between the second L-shaped rod 26 and the adjacent fourth rack 27.

[0037] In the above scheme, the vertical parts of the first L-shaped rod 24 and the second L-shaped rod 26 are both located at the lower side of their horizontal parts. Initially, the telescopic end of the elastic telescopic rod 32 is in an extended state, the elastic telescopic rod 32 is located on the upper side of the adjacent mounting block 4, the telescopic end of the elastic telescopic rod 32 faces the front side, and the two inclined surfaces on the limit block 33 are both located at the front side thereof. The limit block 33 is squeezed by the adjacent first L-shaped rod 24 or the adjacent second L-shaped rod 26 and moves backward. The angle between the inclined surface on the upper side of the limit block 33 and the vertical surface is smaller than the angle between the inclined surface on the lower side and the horizontal surface, which is used to increase the resistance of the first L-shaped rod 24 or the second L-shaped rod 26 to move upward, and reduce the resistance of the two when they move downward.

[0038] When the telescopic end of the above-mentioned electric push rod 15 drives the fourth rack 27 to move upward, the limit block 33 on the left side limits the movement of the second L-shaped rod 26, so that the fourth rack 27 stretches the tension spring 31 on the left side during the upward movement. Until the tension spring 31 is stretched to the limit state, the fourth rack 27 drives the second L-shaped rod 26 to move upward through the adjacent tension spring 31. At the same time, the second L-shaped rod 26 squeezes the lower inclined surface of the left limit block 33, so that the left limit block 33 is squeezed and moves backward, and the left elastic telescopic rod 32 is squeezed and stored until the left limit block 33 moves backward to the limit position, that is, the left elastic telescopic rod 32 is squeezed to the limit state, the left limit block 33 no longer limits the second L-shaped rod 26. At this time, the tension spring 31 on the left side drives the second L-shaped rod 26 to move upward, realizing the delayed upward movement of the second L-shaped rod 26, and at the same time, the left limit block 33 is reset forward under the action of the adjacent elastic telescopic rod 32.

[0039] During the upward movement of the fourth rack 27, the third rack 25 moves downward synchronously and squeezes the tension spring 31 on the right, thereby squeezing the first L-shaped rod 24, causing the first L-shaped rod 24 to move downward. During the downward movement, the first L-shaped rod 24 squeezes the inclined surface on the upper side of the right limit block 33, causing the right limit block 33 to move backward and compressing the elastic telescopic rod 32 on the right to store force.

[0040] Until the first L-shaped rod 24 moves downward to contact the intersection of the two inclined surfaces of the right limit block 33, the right limit block 33 moves backward to the limit position, and when the upper side of the first L-shaped rod 24 moves downward to the lower side of the intersection of the two inclined surfaces of the right limit block 33, the extrusion force on the right limit block 33 gradually decreases, and then the right limit block 33 gradually moves forward driven by the right elastic telescopic rod 32, until the first L-shaped rod 24 moves downward to the limit position, and the limit block 33 resets forward to the initial position.

[0041] In the process of the first L-shaped rod 24 moving downward from the intersection of the two inclined surfaces of the right limit block 33 to the extreme position, the tension spring 31 on the left is gradually stretched to the extreme position, and when the first L-shaped rod 24 moves downward to the extreme position, the limit block 33 on the left moves backward to the extreme position synchronously, that is, at this time the second L-shaped rod 26 moves upward to contact the intersection of the two inclined surfaces of the left limit block 33, so the tension spring 31 on the left begins to drive the second L-shaped rod 26 to move upward, and then drives the second movable shell 21 to move upward.

[0042] When the first L-shaped rod 24 moves downward to the extreme position, the first movable shell 18 moves downward to the extreme position synchronously. At this time, the two groups of second clamping plates 10 are in a vertical state (the specific process can be referred to above), so that the two groups of first clamping plates 9 will be separated from the circuit board only after the two groups of second clamping plates 10 complete the fixation of the circuit board, ensuring that when the working states of the two groups of first clamping plates 9 and the two groups of second clamping plates 10 are replaced, the circuit board is always fixed on the mounting frame 5 to avoid the movement of the circuit board, which affects the subsequent coating process and the uniformity of the coating thereon. The process of switching from fixing the circuit board by the two groups of second clamping plates 10 to fixing the circuit board by the two groups of first clamping plates 9 is opposite to the above, and no detailed description is made for this.

[0043] Embodiment 4: Based on embodiment 3, Fig.11 and Fig.12 As shown, the auxiliary fixing mechanism includes a matrix-distributed torsion spring 34, the matrix-distributed torsion spring 34 is respectively fixed to the adjacent first drive shaft 11 or the second drive shaft 13, and the first connecting block 12 and the second connecting block 14 are respectively fixed to the adjacent torsion spring 34, the first connecting block 12 and the second connecting block 14 are both slidably connected with a moving rod 35, the first clamping plate 9 and the second clamping plate 10 are respectively fixed to the adjacent moving rod 35, the moving rod 35 is hinged with a telescopic connecting rod 36, the first drive shaft 11 and the second drive shaft 13 are respectively fixed to the adjacent telescopic connecting rod 36.

[0044] In the above scheme, the specific number of the auxiliary fixing mechanism is the same as the specific number of the fixing seat 7. The figure and the text both take two as an example. The telescopic connecting rod 36 is in a stretched state at the beginning, the torsion spring 34 on the first drive shaft 11 is in a stored force state at the beginning, and the torsion spring 34 on the second drive shaft 13 is in a non-stored force state at the beginning.

[0045] In the process of moving the second movable shell 21 upward, when the second movable shell 21 drives the two adjacent second gears 22 and the two first drive shafts 11 to rotate through the two second racks 23 thereon, the following is described by taking the movement process of the first drive shaft 11 on the lower right side as an example: The rotation of the first drive shaft 11 gradually reduces the torque of the adjacent torsion spring 34. At the same time, the first drive shaft 11 drives the moving rod 35 thereon to move synchronously, and the telescopic connecting rod 36 drives the adjacent moving rod 35 to move synchronously to the right (with Fig.12The main viewing angle in the figure is the reference viewing angle), and then the moving rod 35 drives the adjacent first clamping plate 9 to move synchronously, so that the first clamping plate 9 is separated from the circuit board, until the torsion spring 34 returns to the unforced state, and the first driving shaft 11 drives the adjacent first connecting block 12 to rotate synchronously (rotate the first connecting block 12 from a vertical state to an inclined state) through the torsion spring 34, and the rest of the movement process of the first driving shaft 11 can refer to the above, so as to avoid the lower side of the first clamping plate 9 from colliding with the circuit board when the two groups of first clamping plates 9 are transformed from a vertical state to a horizontal state, thereby ensuring the integrity of the circuit board.

[0046] After the circuit board is placed, the second movable shell 21 is reset. The following description is still based on the reverse movement of the lower right first driving shaft 11 as an example: The first driving shaft 11 drives the adjacent first connecting block 12 to rotate synchronously through the transmission of the torsion spring 34 thereon, until the first connecting block 12 rotates from the inclined state to the vertical state, the second movable shell 21 has not been reset to the initial position, and during the process of the second movable shell 21 continuing to reset, the first driving shaft 11 drives the telescopic connecting rod 36 thereon to continue to rotate, thereby causing the adjacent torsion spring 34 to twist and store force, and at the same time, the telescopic connecting rod 36 drives the adjacent moving rod 35 and the adjacent first clamping plate 9 to move synchronously to the left (with Fig.12 The main viewing angle in the figure is the reference viewing angle), until the first clamping plate 9 moves to the left and contacts the circuit board, it is blocked by the circuit board and cannot move further. At this time, the moving rod 35 has not moved to the limit position. Therefore, the first clamping plate 9 is deformed by the reverse force of the circuit board and the extrusion force of the telescopic connecting rod 36, and the deformation amount of the first clamping plate 9 is determined by the thickness of the circuit board, thereby increasing the extrusion force applied to the circuit board and improving the stability of the circuit board during the coating process. At the same time, it is ensured that the two sets of first clamping plates 9 can fix circuit boards of different thicknesses, thereby improving the scope of application of the device.

[0047] The moving process of the second clamping plate 10 will not be described in detail, and reference may be made to the above.

[0048] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board coating process, characterized in that: The circuit board coating process is based on a vacuum coating machine, and the circuit board coating process includes the following steps: S1: Perform preliminary cleaning on the circuit board substrate, using negative ion airflow at a flow rate of 1.4m / s to blow dust on the circuit board substrate for more than 5 minutes to ensure the removal efficiency of dust on it; S2: Perform secondary soot blowing on the circuit board substrate after preliminary cleaning, using clean gas to blow soot on the circuit board substrate at a flow rate of 1.7 m / s for 2 minutes or more; S3: After the secondary cleaning, the circuit board substrate is transferred to the vacuum chamber. After the transfer is completed, the vacuum chamber is pre-evacuated until the vacuum degree reaches 6×10 -3 Pa; S4: heating the circuit board substrate at a temperature of 100°C-300°C; S5: Introduce argon gas and control the vacuum degree at 2×10 -1 Pa~5×10 -1 Pa, turn on the magnetron sputtering power supply and control the voltage at 300V-600V to ionize the argon gas into positively charged argon ions and free electrons; S6: The positively charged argon ions are accelerated to move toward the target surface with negative voltage under the action of the electric field, and hit the target surface at high speed, knocking out atoms or molecules on the target surface; S7: The ejected particles fly to the surface of the circuit board and deposit on it, gradually forming a uniform film; S8: After the coating is completed, turn off the power, restore the atmospheric pressure, take out the coated circuit board, and measure the thickness of the film layer.

2. A circuit board coating vacuum coating machine, applying the circuit board coating process as claimed in claim 1, the vacuum coating machine comprising a housing (1), a sputtering coating system being arranged inside the housing (1), a connecting shaft (2) and a connecting disk (3) being rotatably connected inside the housing (1), a driving module for driving the connecting shaft (2) to rotate being arranged inside the housing (1), the connecting disk (3) being fixedly connected to the connecting shaft (2), the connecting disk (3) being rotatably connected to circumferentially distributed mounting blocks (4), a transmission module for driving the mounting block (4) to rotate being arranged on the connecting disk (3), the mounting block (4) being detachably connected to a mounting frame (5), the mounting frame (5) being provided with a mounting The mounting mechanism is used to fix the circuit board to be coated, and the mounting mechanism comprises: two fixing seats (7) distributed symmetrically in the center, the two fixing seats (7) are fixedly connected to the adjacent mounting frame (5), the fixing seat (7) is provided with a first connecting component and a second connecting component, the fixing seat (7) is provided with a first clamping plate (9) distributed symmetrically in the center through the first connecting component thereon, and the fixing seat (7) is provided with a second clamping plate (10) distributed symmetrically in the center through the second connecting component thereon, and a driving component is provided inside the housing (1), and the driving component is used to change the positions of all the first clamping plates (9) and all the second clamping plates (10).

3. The circuit board coating vacuum coating machine according to claim 2, characterized in that: The first connecting assembly comprises first drive shafts (11) which are centrally symmetrically distributed, the first drive shafts (11) which are centrally symmetrically distributed are all rotatably connected to adjacent fixed seats (7), and the first drive shafts (11) are rotatably connected to the mounting frame (5), the fixed seat (7) is provided with a first transmission box for driving the first drive shafts (11) which are centrally symmetrically distributed thereon to rotate synchronously, the first drive shaft (11) is provided with a first connecting block (12), and the first clamping plates (9) which are centrally symmetrically distributed are respectively arranged on a side of an adjacent first connecting block (12) away from an adjacent first drive shaft (11).

4. The circuit board coating vacuum coating machine according to claim 3, characterized in that: The second connecting assembly comprises second drive shafts (13) which are centrally symmetrically distributed. The second drive shafts (13) which are centrally symmetrically distributed are all rotatably connected to adjacent fixed seats (7). The first drive shaft (11) and the second drive shaft (13) on the same fixed seat (7) are not located on the same horizontal plane. The second drive shaft (13) is rotatably connected to the mounting frame (5). The fixed seat (7) is provided with a second transmission box for driving the second drive shafts (13) which are centrally symmetrically distributed thereon to rotate synchronously. The second drive shaft (13) is provided with a second connecting block (14). The second clamping plates (10) which are centrally symmetrically distributed are respectively provided on a side of an adjacent second connecting block (14) away from an adjacent second drive shaft (13).

5. The circuit board coating vacuum coating machine according to claim 4, characterized in that: The drive assembly comprises an electric push rod (15), the electric push rod (15) is fixedly connected to the inside of the housing (1), the telescopic end of the electric push rod (15) is fixedly connected to a moving ring (16), the outer side of the moving ring (16) is rotatably connected to a connecting ring (17), the connecting ring (17) is provided with circumferentially distributed connecting holes (171), one side of the mounting frame (5) is slidably connected to a first moving shell (18), one of the second driving shafts (13) distributed centrally is fixedly connected to a first gear (19) located in an adjacent first moving shell (18), and the first moving shell (18) is fixedly connected to a first rack (20) meshing with the first gear (19) therein.

6. The circuit board coating vacuum coating machine according to claim 5, characterized in that: The driving assembly further comprises a second movable shell (21), the second movable shell (21) being slidably connected to the other side of the mounting frame (5), one of the first driving shafts (11) being centrally symmetrically distributed is fixedly connected to a second gear (22) located in an adjacent second movable shell (21), the second movable shell (21) is fixedly connected to a second rack (23) meshing with the second gear (22) therein, and a transfer assembly is arranged in the mounting block (4), the transfer assembly being used to drive the first movable shell (18) and the second movable shell (21) to move.

7. The circuit board coating vacuum coating machine according to claim 6, characterized in that: The transfer assembly comprises a first L-shaped rod (24), the first L-shaped rod (24) being fixedly connected to one side of the first movable shell (18), the first L-shaped rod (24) being provided with a third rack (25), a second L-shaped rod (26) being fixedly connected to one side of the second movable shell (21) close to the third rack (25), the second L-shaped rod (26) being provided with a fourth rack (27), a connecting piece being provided on the mounting block (4), the connecting piece on the mounting block (4) being slidably connected to both the fourth rack (27) and the third rack (25), and the fourth rack (27) sliding in the adjacent connecting hole (171).

8. The circuit board coating vacuum coating machine according to claim 7, characterized in that: The transfer assembly also includes a third gear (28); a connecting seat is installed on one side of the mounting block (4) close to the adjacent fourth rack (27); the third gear (28) is rotatably connected to the connecting seat on the adjacent mounting block (4); the third gear (28) is meshed with the adjacent fourth rack (27) and the adjacent third rack (25); the connecting ring (17) is provided with an auxiliary fixing assembly, and the auxiliary fixing assembly is used to guide the first clamping plate (9) and the second clamping plate (10).

9. The circuit board coating vacuum coating machine according to claim 8, characterized in that: The invention also comprises a delay component evenly distributed in the circumferential direction, the delay component being arranged on the adjacent mounting block (4), the delay component being used to delay the movement of the adjacent first L-shaped rod (24) and the adjacent second L-shaped rod (26), the delay component comprising symmetrically distributed elastic telescopic rods (32), the symmetrically distributed elastic telescopic rods (32) being fixedly connected to a side of the adjacent mounting block (4) close to the adjacent third gear (28), the telescopic ends of the elastic telescopic rods (32) being fixedly connected to a limiting block (33), the limiting block (33) being provided with two upper and lower inclined surfaces, the limiting block (33) being used to limit the adjacent first L-shaped rod (24) or the adjacent second L-shaped rod (26), and a tension spring (31) being fixedly connected between the first L-shaped rod (24) and the adjacent third rack (25) and between the second L-shaped rod (26) and the adjacent fourth rack (27).

10. The circuit board coating vacuum coating machine according to claim 9, characterized in that: The auxiliary fixing mechanism comprises torsion springs (34) distributed in a matrix, the torsion springs (34) distributed in the matrix are respectively fixedly connected to the adjacent first drive shaft (11) or the second drive shaft (13), and the first connecting block (12) and the second connecting block (14) are respectively fixedly connected to the adjacent torsion springs (34), the first connecting block (12) and the second connecting block (14) are both slidably connected to a moving rod (35), the first clamping plate (9) and the second clamping plate (10) are respectively fixedly connected to the adjacent moving rod (35), the moving rod (35) is hinged with a telescopic connecting rod (36), and the first drive shaft (11) and the second drive shaft (13) are respectively fixedly connected to the adjacent telescopic connecting rod (36).

Citation Information

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