Non-contact substation infrared thermal imaging monitoring device and method

Abstract

The invention discloses a non-contact substation infrared thermal imaging monitoring device and method.The non-contact substation infrared thermal imaging monitoring device comprises an infrared imaging assembly, a battery assembly and a communication assembly, the infrared imaging assembly is movably connected with the battery assembly through a double-U-shaped support, and the battery assembly is detachably fixed to equipment of a substation; the infrared imaging assembly is arranged opposite to equipment of the transformer substation; a power supply management module of the battery assembly is in signal connection with the infrared imaging assembly, and the power supply management module controls power supply of the battery assembly to the infrared imaging assembly based on state monitoring of the infrared imaging assembly; and the communication assembly is in signal connection with the infrared imaging assembly, processes the received infrared image sent by the infrared imaging assembly, and stores and / or transmits the processed infrared image. The infrared imaging assembly provided by the invention is adjustable, is not in contact with the substation equipment, and realizes real-time temperature monitoring of the substation equipment under the requirements of low power consumption and low bandwidth in combination with power supply management and data processing.

Description

Technical Field

[0001] The invention belongs to the technical field of infrared imaging, and in particular relates to a non-contact infrared thermal imaging monitoring device and method for a substation. Background Art

[0002] In recent years, the continuous expansion of the scale of power grid equipment has put forward higher requirements for the monitoring and diagnosis of the heating status of substation-related equipment. When measuring the temperature of high-temperature equipment in substations, traditional contact wireless temperature sensing technology is an important temperature monitoring method. This technology mainly obtains the data of the temperature sensor that is in physical contact with the object being measured, and then transmits the temperature data measured by the temperature sensor to the receiver through wireless signal transmission, and processes the temperature data on the receiver to achieve temperature monitoring.

[0003] For example, patent CN103453999A provides a substation equipment temperature monitoring system based on a self-energy wireless temperature sensor, including a self-energy wireless temperature sensor, a temperature collection terminal, a temperature monitoring center and a dispatching center; the self-energy wireless temperature sensor transmits the monitored temperature of the equipment in the substation to the temperature collection terminal; the temperature collection terminal processes the data and transmits it to the temperature monitoring center and the dispatching center in turn; the self-power supply mode is realized through the self-energy wireless temperature sensor, and the temperature of the substation cable joints, knife contacts, high-voltage switch cabinet contacts or copper busbar connection points and other equipment is monitored in real time, which can realize automatic early warning and avoid the phenomenon that the temperature rise of the hot spots of the substation equipment is too high, and even causes burning and causing accidents, thereby saving a lot of manpower and reducing the accident rate. It is of great significance to realize unmanned substation and build smart substation.

[0004] However, this prior art method of integrating contact sensors has expensive equipment costs and requires power outages for maintenance, which brings inconvenience to the operation and maintenance of power grid equipment, is time-consuming and labor-intensive, and has high maintenance difficulties and costs. In addition, the integrated contact temperature sensor consumes large power and cannot achieve real-time monitoring and data transmission, making it difficult to detect heating defects in substation equipment in a timely manner.

[0005] Therefore, how to set up a non-contact infrared thermal imaging monitoring device to obtain real-time, continuous and reliable temperature monitoring data of substation equipment to improve the safety and operation efficiency of power grid operation is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0006] In view of the defects existing in the above-mentioned prior art, the present invention provides a non-contact infrared thermal imaging monitoring device and method for substations. The infrared thermal imaging monitoring device for substations specifically includes: an integrated infrared imaging component, a battery component and a communication component. The infrared imaging component is movably connected to the battery component through a double U-shaped bracket, the battery component is detachably fixed to the equipment of the substation, and the infrared imaging component is arranged relative to the equipment of the substation; the battery component includes a power supply management module, the power supply management module is connected to the infrared imaging component by signal, and the power supply management module is used to control the power supply of the battery component to the infrared imaging component based on the status monitoring of the infrared imaging component; the communication component is connected to the infrared imaging component by signal, and is used to process the infrared image sent by the infrared imaging component, and store and / or transmit the processed infrared image. The infrared imaging component provided by the present invention is adjustable and non-contact with the substation equipment. Combined with power supply management and data processing, it realizes real-time temperature monitoring of substation equipment under low power consumption and low bandwidth requirements.

[0007] In a first aspect, the present invention provides a non-contact infrared thermal imaging monitoring device for a substation, specifically comprising: an integrated infrared imaging component, a battery component and a communication component, the infrared imaging component is movably connected to the battery component through a double U-shaped bracket, the battery component is detachably fixed to the equipment of the substation, and the infrared imaging component is arranged relative to the equipment of the substation;

[0008] The battery assembly includes a power supply management module, which is connected to the infrared imaging assembly signal, and the power supply management module is used to control the power supply of the battery assembly to the infrared imaging assembly based on the state monitoring of the infrared imaging assembly;

[0009] The communication component is connected to the infrared imaging component signal, and is used to process the infrared image sent by the infrared imaging component, and store and / or transmit the processed infrared image.

[0010] Furthermore, the infrared imaging assembly includes a first housing, the first housing is square, and the lower end surface of the first housing is fixed to the double U-shaped bracket;

[0011] In the direction away from the equipment of the substation, the infrared imaging assembly further includes a filter, a photosensitive element, a resistor matrix and a convergence circuit module which are arranged in sequence in the first housing;

[0012] The convergence circuit module includes an analog-to-digital conversion submodule and an addressing scanning circuit. The analog-to-digital conversion submodule is used to convert the analog signal generated by the resistor matrix into a digital signal. The addressing scanning circuit is used to select the lines of the resistor matrix in rows and columns to determine the pixel rows and columns corresponding to the generated infrared image.

[0013] Furthermore, the double U-shaped bracket includes an upper bracket and a lower bracket, both of which are U-shaped brackets, the upper bracket and the lower bracket are arranged opposite to each other, the lower end surface of the first shell is fixed to the end surface of the upper bracket, and the end surface of the lower bracket is fixed to the battery assembly;

[0014] The upper bracket has a first circular hole and a second circular hole arranged from top to bottom on its side, and the lower bracket has a first through hole and a second through hole on its side, the first through hole corresponds to the first circular hole, the first pin passes through the first through hole and the first circular hole, the second through hole corresponds to the second circular hole, and the second pin passes through the second through hole and the second circular hole;

[0015] The second through hole is in a semicircular ring shape, and as the second pin rotates in the second through hole, the upper bracket and the infrared imaging component rotate.

[0016] Furthermore, a third through hole group is provided on the end face of the lower bracket, and the third through hole group is in a semicircular shape. A third pin group is provided on the battery assembly, and the third pin group passes through the third through hole group. The lower bracket, the upper bracket and the infrared imaging assembly can achieve relative position adjustment with the equipment of the substation by moving along the third through hole group.

[0017] Furthermore, the state of the infrared imaging component includes a scanning frequency and / or a resolution, and the battery component also includes a storage battery.

[0018] Furthermore, the power supply management module is used to control the power supply of the battery assembly to the infrared imaging assembly based on the status monitoring of the infrared imaging assembly, specifically including:

[0019] The power supply management module obtains the status data of the infrared imaging component in real time;

[0020] The real-time power requirement of the infrared imaging component is determined by the proportional coefficient between the preset status data and the power requirement, which is specifically expressed as:

[0021]

[0022] Among them, P cur is the real-time power requirement of the infrared imaging component, κ is the proportionality coefficient between the state data and the power requirement, R cur is the real-time status data of the infrared imaging component, N0 is the local noise of the status data of the infrared imaging component, and N cur Real-time noise for receiving status data for the power management module;

[0023] Based on the real-time power demand of the infrared imaging component and the constraints of the battery component capacity configuration, the power output of the battery component is adjusted;

[0024] Among them, the constraints of battery component capacity configuration are specifically expressed as:

[0025]

[0026] C is the battery pack capacity, P max is the maximum required power of the infrared imaging component, T is the backup time of the battery component, V is the output voltage of the battery component, η is the inverter efficiency of the battery component, and K is the discharge efficiency of the battery component.

[0027] Further, the infrared image sent by the received infrared imaging component is processed, and the processed infrared image is stored and / or transmitted, specifically including:

[0028] Extract pixel information of infrared images to form a data matrix associated with temperature information;

[0029] The data matrix is ​​segmented to obtain a target temperature data set group, and the target temperature data set group is stored and / or transmitted.

[0030] Furthermore, pixel information of the infrared image is extracted to form a data matrix associated with the temperature information, specifically including:

[0031] Get the gray value of each pixel in the infrared image;

[0032] Based on the preset gray value and temperature information correspondence rule, initial temperature information data is given;

[0033] The initial temperature information data is trimmed to form a data matrix associated with the temperature information;

[0034] The preset corresponding rule between the gray value and the temperature information is specifically expressed as follows:

[0035]

[0036] T t,0 is the initial temperature information data of pixel t in the infrared image, G t is the gray value of pixel t in the infrared image, a and b are the first calibration parameter and the second calibration parameter respectively, ω r ,ω g ,ω b are the weights of the red, green and blue channels respectively, V t,r 、V t,g 、V t,b are the element values ​​of the red, green and blue channels of pixel point t in the infrared image;

[0037] The initial temperature information data is trimmed, which is specifically expressed as follows:

[0038] T t =max[T 0,min ,min(T t，0 , T 0,max)]

[0039] T t is the temperature correlation data of pixel t in the infrared image, max and min are the maximum and minimum functions respectively, T 0,min is the minimum reasonable value of the temperature-related data interval, T 0,max is the maximum reasonable value of the temperature-related data interval.

[0040] Furthermore, the data matrix is ​​segmented, which is specifically expressed as follows:

[0041]

[0042] Among them, M T is the data matrix, is the first data matrix, is the second data matrix, A is the first target temperature data set, B is the second target temperature data set, A and B form a target temperature data set group, T i,j is the data in the i-th row and j-th column of the data matrix, A l is the lth target temperature data in A, B l is the lth target temperature data in B.

[0043] In a second aspect, the present invention further provides a non-contact substation infrared thermal imaging monitoring method, using the non-contact substation infrared thermal imaging monitoring device as described above, specifically comprising the following steps:

[0044] The battery components are detachably fixed to the substation equipment;

[0045] Adjust the angle of the infrared imaging component through the double U-shaped bracket;

[0046] Starting the power supply management module to control the power supply of the battery component to the infrared imaging component based on the status monitoring of the infrared imaging component;

[0047] The infrared imaging component collects infrared signals from the equipment in the substation and forms an infrared image;

[0048] The communication component receives and processes the infrared image sent by the infrared imaging component, and stores and / or transmits the processed infrared image.

[0049] The present invention provides a non-contact substation infrared thermal imaging monitoring device and method, which at least have the following beneficial effects:

[0050] (1) The infrared imaging component provided by the present invention is adjustable and non-contact with the substation equipment. It combines power supply management and data processing to achieve real-time temperature monitoring of substation equipment with low power consumption and low bandwidth requirements.

[0051] (2) Based on the double U-shaped bracket, the infrared imaging component can achieve an adjustable angle relative to the substation equipment. Combined with the micro-optical elements manufactured by MEMS technology, the access range of infrared light is expanded, allowing the infrared imaging component to effectively capture the thermal radiation information of the substation equipment within a wider viewing angle.

[0052] (3) During non-monitoring periods, the infrared imaging component enters a low-power sleep mode, retaining only basic communication and wake-up functions. When receiving a monitoring instruction or a preset condition triggers, the infrared imaging component enters a working state. As the status data (scanning frequency and / or resolution) changes, the power output of the battery component is adjusted, which can further extend the service life of the infrared thermal imaging monitoring device.

[0053] (4) After the data matrix is ​​segmented, the position of the corresponding data is re-determined to form a target temperature data set group corresponding to the original data matrix. The data of the target temperature data set group are stored or transmitted separately, which can reduce the bandwidth requirements for infrared temperature data storage and transmission, and can also ensure the accuracy and real-time performance of data transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A schematic diagram of the structure of a non-contact infrared thermal imaging monitoring device for a substation provided by the present invention;

[0055] Figure 2 A schematic diagram of the structure of an infrared thermal imaging assembly according to an embodiment of the present invention;

[0056] Figure 3 A schematic diagram of a flow chart of a power supply management module of a certain embodiment provided by the present invention;

[0057] Figure 4 A schematic diagram of a flow chart of a communication component of a certain embodiment provided by the present invention;

[0058] Figure 5 A schematic diagram of a process of forming a data matrix according to an embodiment of the present invention;

[0059] Figure 6 A schematic flow chart of a non-contact infrared thermal imaging monitoring method for a substation provided by the present invention.

[0060] Description of reference numerals:

[0061] 1-infrared imaging component, 11-first shell, 111-lower end surface of the first shell, 12-filter, 13-photosensitive element, 14-resistance matrix, 15-convergence circuit module, 2-battery assembly, 3-double U-shaped bracket, 301-first pin, 302-second pin, 303-third pin group, 31-upper bracket, 311-upper bracket end surface, 312-upper bracket side, 3121-first circular hole, 3122-second circular hole, 32-lower bracket, 321-lower bracket end surface, 3211-third through hole group, 322-lower bracket side, 3221-first through hole, 3222-second through hole. DETAILED DESCRIPTION

[0062] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0063] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two.

[0064] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0065] The contact wireless temperature sensing technology currently used in substation equipment has problems such as high equipment cost and energy consumption, time-consuming and labor-intensive maintenance, difficulty in maintenance, and high maintenance cost. In addition, the integrated contact temperature sensor has high power consumption and cannot be monitored and transmitted in real time.

[0066] In order to solve the above problems, a non-contact and wiring-free substation infrared thermal imaging monitoring device is designed. It needs to be able to continuously and real-time monitor the temperature changes of the substation's power equipment, timely warn of overheating, and effectively track the heating defects of existing equipment, thereby significantly improving the safety and operation efficiency of the power grid.

[0067] For the large amount of data collected by wireless temperature measurement sensors, data processing and data analysis technologies can be used to reduce the bandwidth required for infrared thermal imaging data transmission, and achieve real-time monitoring and data transmission, which helps to arrange maintenance plans in a timely manner and reduce unnecessary downtime and maintenance costs.

[0068] For non-contact infrared thermal imaging equipment, high-precision temperature measurement can be achieved by using a thermopile array, and a bracket structure can be set to achieve an adjustable angle relative to the equipment in the substation. For the transmission technology of infrared thermal imaging data, low-power wireless networks can be realized through LORA communication technology, and infrared thermal imaging data can be uploaded to the monitoring platform (for example, the Internet of Things platform, etc.). It provides real-time, continuous, and reliable data support for the monitoring of power grid equipment, and also provides data support for the intelligent analysis and early warning of the monitoring platform.

[0069] like Figure 1 As shown, the present invention provides a non-contact infrared thermal imaging monitoring device for a substation, specifically comprising: an integrated infrared imaging component 1, a battery component 2 and a communication component, the infrared imaging component 1 is movably connected to the battery component 2 through a double U-shaped bracket 3, the battery component 2 is detachably fixed to the equipment of the substation, and the infrared imaging component 1 is arranged relative to the equipment of the substation;

[0070] The battery assembly 2 includes a power supply management module, which is signal-connected to the infrared imaging assembly 1. The power supply management module is used to control the power supply of the battery assembly 2 to the infrared imaging assembly 1 based on the status monitoring of the infrared imaging assembly 1.

[0071] The communication component is connected to the infrared imaging component 1 by signals, and is used to process the infrared image sent by the infrared imaging component 1, and store and / or transmit the processed infrared image.

[0072] The integrated infrared imaging components, battery components and communication components can realize non-contact and wiring-free wireless passive substation infrared thermal imaging monitoring, as well as real-time data processing and data transmission.

[0073] The high temperature monitoring of the equipment in each substation is realized by removably fixing the battery assembly to the equipment of the substation to be monitored. For the infrared imaging assembly, a movable connection with an adjustable angle with the battery assembly is established through a double U-shaped bracket, which can not only maintain a long distance and non-contact with the substation equipment (the relative distance between the infrared imaging assembly and the substation equipment is approximately between 50cm and 10m), but also meet the requirements of high sensitivity and accurate temperature measurement.

[0074] The power supply management module in the battery assembly supplies energy according to the working status of the infrared imaging assembly, achieving low power consumption of the infrared thermal imaging monitoring device as a whole. The communication assembly processes the infrared image sent by the infrared imaging assembly. The processed infrared image has a small bandwidth requirement and high transmission efficiency, which can meet the transmission requirements of real-time temperature monitoring data of substation equipment.

[0075] like Figure 1 and Figure 2 As shown, the infrared imaging assembly 1 includes a first housing 11, the first housing 11 is square, and the lower end surface 111 of the first housing is fixed to the double U-shaped bracket 3;

[0076] In the direction away from the equipment of the substation, the infrared imaging assembly 1 further includes a filter 12, a photosensitive element 13, a resistor matrix 14 and a convergence circuit module 15 which are arranged in sequence in the first housing 11;

[0077] The convergence circuit module 15 includes an analog-to-digital conversion submodule and an addressing scanning circuit. The analog-to-digital conversion submodule is used to convert the analog signal generated by the resistor matrix into a digital signal. The addressing scanning circuit is used to select the lines of the resistor matrix in rows and columns to determine the pixel rows and columns corresponding to the generated infrared image.

[0078] The infrared imaging component adopts the infrared imaging temperature measurement principle of silicon-based micro-mechanical technology, collects light through filters and photosensitive elements, and then converts the light-collected data into resistance data through the resistor matrix. The resistance data of each part is converted into analog-to-digital data in the convergence circuit module to form an infrared image.

[0079] The corresponding optical elements in the infrared imaging component are prepared using MEMS technology. Miniature optical elements such as micro lenses and filters can finely adjust and filter infrared light, enhancing the sensitivity of the infrared imaging component to infrared light in specific bands, thereby further improving the accuracy and stability of infrared temperature measurement.

[0080] The convergence circuit module can convert the analog signal generated by the resistor matrix into a digital signal, and realize the correspondence between the line of the row selection and column selection resistor matrix and the infrared image pixel, form an infrared image, and send it to the communication component for processing the infrared image. The specific component composition and connection relationship of the analog-to-digital conversion submodule and the addressing scanning circuit are not specifically limited here, and it is sufficient to realize the corresponding functions.

[0081] The double U-shaped bracket 3 includes an upper bracket 31 and a lower bracket 32, both of which are U-shaped brackets. The upper bracket 31 and the lower bracket 32 ​​are arranged opposite to each other. The lower end surface 111 of the first shell is fixed to the upper bracket end surface 311, and the lower bracket end surface 321 is fixed to the battery assembly 2.

[0082] The upper bracket side surface 312 is provided with a first circular hole 3121 and a second circular hole 3122 arranged from top to bottom, and the lower bracket side surface 322 is provided with a first through hole 3221 and a second through hole 3222, the first through hole 3221 corresponds to the first circular hole 3121, the first pin 301 passes through the first through hole 3221 and the first circular hole 3121, the second through hole 3222 corresponds to the second circular hole 3122, and the second pin 302 passes through the second through hole 3222 and the second circular hole 3122;

[0083] The second through hole 3222 is in a semicircular ring shape, and as the second pin 302 rotates in the second through hole 3222, the upper bracket 31 and the infrared imaging assembly 1 rotate;

[0084] A third through hole group 3211 is also provided on the end face 321 of the lower bracket. The third through hole group 3211 is in a semicircular shape. A third pin group 303 is provided on the battery assembly 2. The third pin group 303 passes through the third through hole group 3211. The lower bracket 32, the upper bracket 31 and the infrared imaging assembly 1 can achieve relative position adjustment with the equipment of the substation by moving along the third through hole group 3211.

[0085] Based on the double U-shaped bracket, the infrared imaging component can achieve adjustable angle relative to the substation equipment. Combined with the micro-optical elements manufactured by MEMS technology, the access range of infrared light is expanded, allowing the infrared imaging component to effectively capture the thermal radiation information of the substation equipment within a wider viewing angle.

[0086] The infrared imaging component and the battery component are regulated and controlled through the power supply management module. The power supply management module monitors the working status of the infrared imaging component in real time, where the status of the infrared imaging component includes the scanning frequency and / or resolution, and dynamically adjusts the power supply according to the actual needs of the infrared imaging component. The infrared imaging component and the battery component are compactly integrated into one by adopting a modular integration method, which is easy to carry and deploy on the corresponding substation equipment.

[0087] The battery assembly also includes a storage battery, and the capacity configuration of the storage battery needs to be accurately calculated and determined by the working current, standby current, and expected usage time of the infrared imaging assembly. In this way, the configured storage battery can not only meet the functional requirements of the infrared imaging assembly, but also avoid unnecessary energy waste.

[0088] like Figure 3 As shown, the power supply management module is used to control the power supply of the battery component to the infrared imaging component based on the status monitoring of the infrared imaging component, specifically including:

[0089] The power supply management module obtains the status data of the infrared imaging component in real time. The status data of the infrared imaging component obtained at this time may be the scanning frequency or the resolution;

[0090] The real-time power requirement of the infrared imaging component is determined by the proportional coefficient between the preset status data and the power requirement, which is specifically expressed as:

[0091]

[0092] Among them, P cur is the real-time power requirement of the infrared imaging component, κ is the proportionality coefficient between the state data and the power requirement, R cur is the real-time status data of the infrared imaging component, N0 is the local noise of the status data of the infrared imaging component, and N cur The power supply management module receives real-time noise of status data; the proportionality coefficient κ between the status data and the power demand can be calculated and analyzed in advance through historical data, and the proportionality coefficient value or value curve or value trend obtained by the calculation and analysis is arranged in the power supply management module.

[0093] Based on the real-time power demand of the infrared imaging component and the constraints of the battery component capacity configuration, the power output of the battery component is adjusted;

[0094] Among them, the constraints of battery component capacity configuration are specifically expressed as:

[0095]

[0096] C is the battery pack capacity, P max is the maximum required power of the infrared imaging component, T is the backup time of the battery component, V is the output voltage of the battery component, η is the inverter efficiency of the battery component, and K is the discharge efficiency of the battery component. The maximum required power of the infrared imaging component can be determined in advance according to different application scenarios.

[0097] If the infrared imaging component is in a low activity period at this time, the scanning frequency and resolution of the status data are relatively low. According to the low scanning frequency and resolution, a relatively low power output of the battery component is set to reduce energy consumption. That is, during the non-monitoring period, the infrared imaging component enters a low-power sleep mode, retaining only basic communication and wake-up functions. When receiving a monitoring instruction or a preset condition trigger, the infrared imaging component enters a working state. As the status data (scanning frequency and / or resolution) changes, the power output of the battery component is adjusted, which can further extend the service life of the infrared thermal imaging monitoring device.

[0098] like Figure 4 As shown, the infrared image sent by the received infrared imaging component is processed, and the processed infrared image is stored and / or transmitted, specifically including:

[0099] Extract pixel information of infrared images to form a data matrix associated with temperature information;

[0100] The data matrix is ​​segmented to obtain a target temperature data set group, and the target temperature data set group is stored and / or transmitted.

[0101] Specifically, if Figure 5 As shown, the pixel information of the infrared image is extracted to form a data matrix associated with the temperature information, specifically including:

[0102] Get the gray value of each pixel in the infrared image;

[0103] Based on the preset gray value and temperature information correspondence rule, initial temperature information data is given;

[0104] The initial temperature information data is clipped to form a data matrix associated with the temperature information; the clipped temperature information data is aggregated to form a data matrix associated with the temperature information.

[0105] The preset corresponding rule between the gray value and the temperature information is specifically expressed as follows:

[0106]

[0107] T t,0 is the initial temperature information data of pixel t in the infrared image, G t is the gray value of pixel t in the infrared image, a and b are the first calibration parameter and the second calibration parameter respectively, ω r ,ω g ,ω b are the weights of the red, green and blue channels respectively, V t,r 、V t,g 、V t,b are the element values ​​of the red, green and blue channels of pixel t in the infrared image respectively; the first calibration parameter a and the second calibration parameter b can be pre-calculated and analyzed through historical data. Similarly, the weights ω of the red, green and blue channels are r ,ω g ,ω b Also needs to be set in advance. For example, in a typical application scenario, the weights of the red, green, and blue channels are r ,ω g ,ω b The values ​​are set to 0.299, 0.587, and 0.114 respectively.

[0108] After obtaining the initial temperature information data, the initial temperature information data is clipped to adjust the initial temperature information data to a reasonable range, which is specifically expressed as follows:

[0109] T t =max[T0,min ,min(T t,0 , T 0,max )]

[0110] T t is the temperature correlation data of pixel t in the infrared image, max and min are the maximum and minimum functions respectively, T 0,min is the minimum reasonable value of the temperature-related data interval, T 0,max The minimum reasonable value of the temperature-related data interval and the maximum reasonable value of the temperature-related data interval can be preset, for example, 0°C and 100°C, respectively, or other temperature values, which are not further limited here.

[0111] In order to ensure the real-time and accurate transmission of infrared temperature data under low bandwidth requirements, it is necessary to process the acquired data matrix. Specifically, the data matrix is ​​segmented, which is specifically expressed as:

[0112]

[0113] Among them, M T is the data matrix, is the first data matrix, is the second data matrix, A is the first target temperature data set, B is the second target temperature data set, A and B form a target temperature data set group, T i,j is the data in the i-th row and j-th column of the data matrix, A l is the lth target temperature data in A, B l is the lth target temperature data in B.

[0114] After the data matrix is ​​segmented, the position of the corresponding data is re-determined to form a target temperature data set group corresponding to the original data matrix. The data of the target temperature data set group are stored or transmitted separately, which can reduce the bandwidth requirements for infrared temperature data storage and transmission, and can also ensure the accuracy and real-time performance of data transmission.

[0115] like Figure 6 As shown, the present invention also provides a non-contact substation infrared thermal imaging monitoring method, using the non-contact substation infrared thermal imaging monitoring device as described above, specifically comprising the following steps:

[0116] The battery components are detachably fixed to the substation equipment;

[0117] Adjust the angle of the infrared imaging component through the double U-shaped bracket;

[0118] Starting the power supply management module to control the power supply of the battery component to the infrared imaging component based on the status monitoring of the infrared imaging component;

[0119] The infrared imaging component collects infrared signals from the equipment in the substation and forms an infrared image;

[0120] The communication component receives and processes the infrared image sent by the infrared imaging component, and stores and / or transmits the processed infrared image.

[0121] The present invention provides a non-contact substation infrared thermal imaging monitoring device and method, which at least have the following beneficial effects:

[0122] (1) The infrared imaging component provided by the present invention is adjustable and non-contact with the substation equipment. It combines power supply management and data processing to achieve real-time temperature monitoring of substation equipment with low power consumption and low bandwidth requirements.

[0123] (2) Based on the double U-shaped bracket, the infrared imaging component can achieve an adjustable angle relative to the substation equipment. Combined with the micro-optical elements manufactured by MEMS technology, the access range of infrared light is expanded, allowing the infrared imaging component to effectively capture the thermal radiation information of the substation equipment within a wider viewing angle.

[0124] (3) During non-monitoring periods, the infrared imaging component enters a low-power sleep mode, retaining only basic communication and wake-up functions. When receiving a monitoring instruction or a preset condition triggers, the infrared imaging component enters a working state. As the status data (scanning frequency and / or resolution) changes, the power output of the battery component is adjusted, which can further extend the service life of the infrared thermal imaging monitoring device.

[0125] (4) After the data matrix is ​​segmented, the position of the corresponding data is re-determined to form a target temperature data set group corresponding to the original data matrix. The data of the target temperature data set group are stored or transmitted separately, which can reduce the bandwidth requirements for infrared temperature data storage and transmission, and can also ensure the accuracy and real-time performance of data transmission.

[0126] Although preferred embodiments of the present invention have been described, additional changes and modifications may be made to these embodiments by those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A non-contact infrared thermal imaging monitoring device for a substation, characterized in that: Specifically include: Integrated infrared imaging components, battery components and communication components. The infrared imaging components are movably connected to the battery components through double U-shaped brackets. The battery components are detachably fixed to the substation equipment. The infrared imaging components are arranged relative to the substation equipment. The battery assembly includes a power supply management module, which is connected to the infrared imaging assembly signal, and the power supply management module is used to control the power supply of the battery assembly to the infrared imaging assembly based on the state monitoring of the infrared imaging assembly; The communication component is connected to the infrared imaging component signal, and is used to process the infrared image sent by the infrared imaging component, and store and / or transmit the processed infrared image.

2. The non-contact infrared thermal imaging monitoring device for substations as claimed in claim 1, characterized in that: The infrared imaging assembly comprises a first housing, the first housing is square, and the lower end surface of the first housing is fixed to a double U-shaped bracket; In the direction away from the equipment of the substation, the infrared imaging assembly further includes a filter, a photosensitive element, a resistor matrix and a convergence circuit module which are arranged in sequence in the first housing; The convergence circuit module includes an analog-to-digital conversion submodule and an addressing scanning circuit. The analog-to-digital conversion submodule is used to convert the analog signal generated by the resistor matrix into a digital signal. The addressing scanning circuit is used to select the lines of the resistor matrix in rows and columns to determine the pixel rows and columns corresponding to the generated infrared image.

3. The non-contact infrared thermal imaging monitoring device for substations as claimed in claim 2, characterized in that: The double U-shaped bracket includes an upper bracket and a lower bracket, both of which are U-shaped brackets. The upper bracket and the lower bracket are arranged opposite to each other. The lower end surface of the first shell is fixed to the end surface of the upper bracket, and the end surface of the lower bracket is fixed to the battery assembly. The upper bracket has a first circular hole and a second circular hole arranged from top to bottom on its side, and the lower bracket has a first through hole and a second through hole on its side, the first through hole corresponds to the first circular hole, the first pin passes through the first through hole and the first circular hole, the second through hole corresponds to the second circular hole, and the second pin passes through the second through hole and the second circular hole; The second through hole is in a semicircular ring shape, and as the second pin rotates in the second through hole, the upper bracket and the infrared imaging component rotate.

4. The non-contact infrared thermal imaging monitoring device for substations as claimed in claim 3, characterized in that: A third through hole group is also arranged on the end face of the lower bracket, and the third through hole group is in a semicircular shape. A third pin group is arranged on the battery assembly, and the third pin group passes through the third through hole group. The lower bracket, the upper bracket and the infrared imaging assembly can realize relative position adjustment with the equipment of the substation by moving along the third through hole group.

5. The non-contact infrared thermal imaging monitoring device for substations as claimed in claim 1, characterized in that: The state of the infrared imaging component includes scanning frequency and / or resolution, and the battery component also includes a storage battery.

6. The non-contact infrared thermal imaging monitoring device for substations as claimed in claim 5, characterized in that: The power supply management module is used to control the power supply of the battery assembly to the infrared imaging assembly based on the status monitoring of the infrared imaging assembly, specifically including: The power supply management module obtains the status data of the infrared imaging component in real time; The real-time power requirement of the infrared imaging component is determined by the proportional coefficient between the preset status data and the power requirement, which is specifically expressed as: Among them, P cur is the real-time power requirement of the infrared imaging component, κ is the proportionality coefficient between the state data and the power requirement, R cur is the real-time status data of the infrared imaging component, N0 is the local noise of the status data of the infrared imaging component, and N cur Real-time noise for receiving status data for the power management module; Based on the real-time power demand of the infrared imaging component and the constraints of the battery component capacity configuration, the power output of the battery component is adjusted; Among them, the constraints of battery component capacity configuration are specifically expressed as: C is the battery pack capacity, P max is the maximum required power of the infrared imaging component, T is the backup time of the battery component, V is the output voltage of the battery component, η is the inverter efficiency of the battery component, and K is the discharge efficiency of the battery component.

7. The non-contact infrared thermal imaging monitoring device for substations as claimed in claim 2, characterized in that: Processing the infrared image sent by the received infrared imaging component, and storing and / or transmitting the processed infrared image, specifically including: Extract pixel information of infrared images to form a data matrix associated with temperature information; The data matrix is ​​segmented to obtain a target temperature data set group, and the target temperature data set group is stored and / or transmitted.

8. The non-contact infrared thermal imaging monitoring device for substations as claimed in claim 7, characterized in that: Extract pixel information of infrared images to form a data matrix associated with temperature information, including: Get the gray value of each pixel in the infrared image; Based on the preset gray value and temperature information correspondence rule, initial temperature information data is given; The initial temperature information data is trimmed to form a data matrix associated with the temperature information: The preset corresponding rule between the gray value and the temperature information is specifically expressed as follows: T t，0 is the initial temperature information data of pixel t in the infrared image, G t is the gray value of pixel t in the infrared image, a and b are the first calibration parameter and the second calibration parameter respectively, ω r ,ω g ,ω b are the weights of the red, green and blue channels respectively, V t，r 、V t，g 、V t，b are the element values ​​of the red, green and blue channels of pixel point t in the infrared image; The initial temperature information data is trimmed, which is specifically expressed as follows: T t =max[T 0，min ,min(T t，0 ,T 0，max )] T t is the temperature correlation data of pixel t in the infrared image, max and min are the maximum and minimum functions respectively, T 0，min is the minimum reasonable value of the temperature-related data interval, T 0，max is the maximum reasonable value of the temperature-related data interval.

9. The non-contact infrared thermal imaging monitoring device for substations as claimed in claim 7, characterized in that: The data matrix is ​​segmented, which is specifically expressed as: Among them, M T is the data matrix, is the first data matrix, is the second data matrix, A is the first target temperature data set, B is the second target temperature data set, A and B form a target temperature data set group, T i,j is the data in the i-th row and j-th column of the data matrix, A l is the lth target temperature data in A, B l is the lth target temperature data in B.

10. A non-contact infrared thermal imaging monitoring method for a substation, characterized in that: The non-contact infrared thermal imaging monitoring device for a substation as claimed in any one of claims 1 to 9 specifically comprises the following steps: The battery components are detachably fixed to the substation equipment; Adjust the angle of the infrared imaging component through the double U-shaped bracket; Starting the power supply management module to control the power supply of the battery component to the infrared imaging component based on the status monitoring of the infrared imaging component; The infrared imaging component collects infrared signals from the equipment in the substation and forms an infrared image; The communication component receives and processes the infrared image sent by the infrared imaging component, and stores and / or transmits the processed infrared image.

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