Chip plastic packaging device and method for integrated circuit production

Abstract

The invention belongs to the technical field of chip processing, and particularly relates to a chip plastic packaging device and method for integrated circuit production. Comprising a processing table, and the processing table is provided with a force applying and pressure continuing mechanism used for plastic packaging of a chip. The force applying and pressure continuing mechanism comprises a fixed die, and the bottom of the fixed die is connected to the top of the machining table through a bolt. A U-shaped base is further installed on the machining table, and an opening of the U-shaped base faces the top of the machining table. A telescopic air cylinder is installed on the U-shaped base through a bolt, and the output end of the telescopic air cylinder faces the top of the machining table and is further provided with an H-shaped square plate. Impurities or dust and the like adhered to the fixed mold and the movable mold can be cleaned through the gas-making cavity cleaning unit, manual operation of workers is not needed in the cleaning process, and meanwhile the problems that chips are incomplete and bubbles are generated in the plastic packaging process due to the fact that impurities in the fixed mold and the movable mold are not completely cleaned due to negligence in the process are solved. The plastic packaging effect of the device is improved, and the working intensity of workers is further reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and in particular relates to a chip plastic packaging device and method for integrated circuit production. Background Art

[0002] As the core carrier of integrated circuits, chips play a vital role. In order to protect chips from external impact, scratches and wear, prevent erosion by dust, moisture and chemicals, ensure electrical insulation, and facilitate installation and use, chips usually need to be plastic-sealed. Plastic sealing provides multi-faceted protection for chips to ensure that they work stably and reliably in different environments.

[0003] After the chip is sealed, the inside of the mold cavity of the mold used for sealing needs to be cleaned to prevent residual sealing material residues and other impurities generated by high temperature in the mold cavity from affecting the subsequent chip sealing quality. Existing chip sealing devices mostly rely on staff to manually control an air blow gun to clean the residual residues in the mold cavity when in use. This not only increases the workload of the staff, but also the slightest negligence during the cleaning process will cause problems such as incomplete chip sealing and bubble generation, further reducing the sealing effect and efficiency of the device, making the device more limited when used. Summary of the invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a chip plastic packaging device and method for integrated circuit production, which effectively solves the problems in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a chip encapsulation device for integrated circuit production, comprising a processing table, on which a force-applying and continuous-pressing mechanism for encapsulating the chip is provided; the force-applying and continuous-pressing mechanism comprises a fixed mold, the bottom of which is connected to the top of the processing table by bolts; a U-shaped base is also installed on the processing table, and the opening of the U-shaped base faces the top of the processing table; a telescopic cylinder is installed on the U-shaped base by bolts, the output end of the telescopic cylinder faces the top of the processing table and an H-shaped square plate is also installed, and the opposite sides of the U-shaped base are located in the hollow area of ​​the H-shaped square plate; a guide T-plate is symmetrically installed on both sides of the H-shaped square plate close to the opposite sides of the U-shaped base, and an air-making and cavity-clearing unit is provided on the guide T-plate, and the air-making and cavity-clearing unit is used to clean impurities adhered to the mold cavity in the fixed mold; L-shaped racks are also installed on the opposite sides of the two guide T-plates, and the end points of the L-shaped racks face the processing table.

[0006] Preferably, a guide cylinder is symmetrically installed on one side of the guide T-plate away from the processing table, and the end of the guide cylinder away from the fixed mold passes through the top of the U-shaped base, and the guide cylinder and the top of the U-shaped base are slidably matched; the end of the guide cylinder away from the processing table is connected to a guide limit plate; two groups of limit sliding columns are symmetrically installed on one side of the H-shaped square plate away from the top of the U-shaped base, and the number of limit sliding columns in one group is two, and the two groups of limit sliding columns are relatively arranged on both sides of the U-shaped base.

[0007] Preferably, the two groups of limit slides are both connected with a pressure square plate, and the pressure square plate is slidably matched with the limit slide; the end of the limit slide away from the H-shaped square plate is connected to the limit circular plate; the top of the processing table is also penetrated by a limit circular groove, which is located on the moving path of the limit circular plate and has the same size; a limit spring is sleeved on the limit slide, one end of the limit spring is fixedly connected to the H-shaped square plate, and the other end is fixedly connected to the top of the pressure square plate; the bottom of the pressure square plate is also connected to a movable mold by bolts, and the working surfaces of the movable mold and the fixed mold are relatively arranged.

[0008] Preferably, the gas-making and cavity-clearing unit includes an auxiliary slot, which is arranged through one of the two opposite sides of the U-shaped base; a fixed pulley is rotatably arranged in the auxiliary slot; a winding roller is provided at the outer wall of the U-shaped base close to the auxiliary slot, and auxiliary rotating shafts are installed on both sides of the winding roller, and an auxiliary substrate is installed on the auxiliary rotating shaft, and the auxiliary substrate is arranged on the U-shaped base; a clockwork spring is installed on the auxiliary rotating shaft, and the end points of the clockwork spring are arranged on the auxiliary substrate.

[0009] Preferably, a locking square seat is fixedly installed on one of the guide T-plates near the auxiliary slot, and a cable is connected to the locking square seat, and the end of the cable away from the locking square seat passes around the fixed pulley and is wound around the winding roller; the end of the auxiliary shaft away from the winding roller is connected to a rotating turntable, and displacement columns are installed on the opposite back surfaces of the two rotating turntables, and a displacement cross block is slidably connected to the displacement column, and two displacement square columns are symmetrically connected to the side of the displacement cross block, and the two displacement square columns are slidably connected to a displacement base plate, and the displacement base plate is arranged on a U-shaped base.

[0010] Preferably, a blocking and encryption component is also provided on the processing table; the blocking and encryption component includes two driving gears, and the two driving gears are symmetrical on both sides of the top of the processing table; the driving gears are located on the moving path of the L-shaped rack, and the two are meshed with each other; the opposite back surfaces of the two driving gears are meshed and connected with driving racks, and the opposite back surfaces of the two driving racks are symmetrically connected with two driving square plates, and the two driving square plates are commonly connected with a driving square column, and a driving substrate is slidably connected to the driving square column, and the driving substrate is arranged on a U-shaped base; a driving spring is sleeved on the driving square column, one end of the driving spring is connected to the driving square plate, and the other end is connected to the driving substrate.

[0011] Preferably, the bottom ends of the two driving racks are commonly connected to a U-shaped square rod, displacement L plates are installed on both sides of the U-shaped square rod, the end points of the displacement L plates pass through the processing table and are connected to a linkage base plate, and the displacement L plate and the processing table are slidably matched; the two linkage base plates are commonly connected to a rectangular frame, and a sealing rubber pad is provided on the inner wall of the rectangular frame, and the sealing rubber pad has the same size as the fixed mold and the movable mold; the connection between the fixed mold and the movable mold is located on the moving path of the sealing rubber pad; the driving gear is arranged on the U-shaped base; the rectangular frame is sleeved on the fixed mold.

[0012] Preferably, an extended square rod is installed at the bottom of the displacement cross block, and a displacement slider is installed on the end point of the extended square rod; the top of the processing table is symmetrically provided with displacement slide grooves with the U-shaped base as the symmetry axis, and the displacement slide grooves are slidably matched with the displacement slider; the opposite sides of the two displacement sliders are installed with rotating shafts, and rotating gears are installed on the rotating shafts, and the rotating gears are meshingly connected with a retaining rack, and the retaining rack is arranged on the top of the processing table; a large pulley is installed at the end of the rotating shaft away from the displacement slider, and a transmission belt is connected to the large pulley, and a small pulley is connected to the transmission belt, and the transmission belt is slidably matched with the small pulley and the large pulley; a transmission shaft is installed on the small pulley, and the transmission shaft passes through the displacement slider and is connected to a plurality of fan blades.

[0013] Preferably, one of the retaining racks is arranged on the top wall of the rotating gear, and the other retaining rack is arranged on the bottom wall of the rotating gear; the notches of the two retaining racks are both facing the rotating gear; two groups of L-shaped connecting blocks are symmetrically installed on both sides of the top of the processing table, and the number of L-shaped connecting blocks in one group is two; the opposite surfaces of the two displacement sliders are provided with storage boxes, and the opening of the storage box faces the fixed mold; the end of the transmission shaft away from the small pulley and a plurality of fan blades are both located in the storage box; a filter is provided in the storage box, and the filter is located in front of the fan blades; the two L-shaped connecting blocks are both facing the storage box; a pressure round wheel is installed on the L-shaped connecting block, and the pressure round wheel is located on the moving path of the sensor provided on the side wall of the storage box.

[0014] The present invention also provides a chip plastic packaging method for integrated circuit production, comprising the following steps: S1. Place the objects to be plastic-sealed in the movable mold and the fixed mold and start the telescopic cylinder so that its output end drives the H-shaped square plate to move; S2. The H-shaped square plate drives the pressure square plate to move under the action of the limit slide column and the limit spring, so that the movable mold on it moves toward the fixed mold; S3, when the movable mold contacts the fixed mold after continuous movement, the fit between the two forms a closed cavity; S4. The material required for plastic encapsulation is squeezed into the closed cavity, and a hard packaging shell is formed after solidification, thereby completing the plastic encapsulation operation of the chip.

[0015] Compared with the prior art, the present invention has the following beneficial effects: (1) The large pulley drives the small pulley to rotate through the transmission belt. Since the size of the large pulley as the power source is larger than that of the small pulley, the rotation speed of the small pulley is higher than that of the large pulley, so that the small pulley rotates quickly, and drives a number of fan blades to rotate quickly through the transmission shaft, so that it rotates quickly in the storage box, so that wind force is generated at the opening of the storage box, and the wind force acts on the fixed mold. It is worth mentioning that at this time, the fixed mold and the movable mold are still on the way to mold closing, so that the above wind force can clean the impurities or dust adhering to the fixed mold and the movable mold, so that the cleaning process does not need to be manually performed by the staff, and avoids negligence in the process that causes the impurities inside the fixed mold and the movable mold to be not completely cleaned, resulting in incomplete chips and bubbles during plastic sealing. The plastic sealing effect of the device is improved, the work intensity of the staff is further reduced, and the plastic sealing efficiency of the device is also improved, which further reduces the limitations of the device during use; (2) The two driving racks move upward synchronously, thereby jointly driving the U-shaped square rod to move upward, so that the two displacement L plates on both sides of the U-shaped square rod move upward, thereby driving the rectangular frame to move upward, so that the U-shaped square rod moves to the upper limit position of the fixed mold. At this time, the fixed mold has been fitted with the movable mold, so that the sealing gasket on the inner wall of the rectangular frame moves to the connection between the fixed mold and the movable mold and fits, thereby further limiting the connection between the fixed mold and the movable mold, avoiding the gap between the fixed mold and the movable mold when the device is plastic-sealing the chip, resulting in burrs on the plastic-sealed shell, and avoiding the leakage of the plastic-sealing material causing defects in the packaging appearance, thereby improving the quality of the chip plastic-sealing and further reducing the limitations of the device during use; at the same time, when the device completes the chip plastic-sealing, the plastic-sealing material and burrs leaked from the edges of the fixed mold and the movable mold can be cleaned by resetting the rectangular frame, thereby improving the use effect of the device; (3) The opening of the material storage box at one displacement slider generates a blowing force, which can blow away the impurities adhered to the fixed mold and the movable mold from the fixed mold and the movable mold, and the opening of the material storage box at the other displacement slider generates a suction force, which can suck the impurities blown away from the material storage box on the opposite side into the material storage box, so as to collect these impurities, thereby avoiding the impurities being blown everywhere and making it difficult to clean up, affecting the work intensity of the staff, avoiding the cleaning of the staff while ensuring the cleanliness of the working environment of the device; conversely, when the two displacement sliders are reset and moved synchronously, the wind forces presented at the openings of the two material storage boxes are also set in the opposite direction, so as to continuously clean the impurities adhered to the fixed mold and the movable mold, thereby improving the use effect of the device; (4) Start the telescopic cylinder so that its output end drives the H-shaped square plate to move, so that the H-shaped square plate drives the pressure square plate to move under the action of the limit slide column and the limit spring, so that the movable mold on it moves toward the fixed mold, so that the two fit together to complete the mold closing operation, and a closed cavity is formed between the two. This cavity provides a spatial basis for chip plastic sealing, and the preheated liquid plastic sealing material is injected into this closed cavity under a certain pressure through the gate. The plastic sealing material will flow in the cavity and fill the space around the chip and the lead frame. After solidification, a hard packaging shell is formed to complete the chip plastic sealing operation; It is worth mentioning that when the H-shaped square plate moves with the movable mold, the guide T-plate on the H-shaped square plate moves relative to the top limit of the U-shaped base through the guide cylinder, limiting the movement of the movable mold, avoiding the movable mold from shaking during movement and causing dislocation, improving the stability of the movable mold during movement, and improving the accuracy of the docking of the movable mold with the fixed mold when closing the mold, thereby improving the chip plastic sealing effect of the device; (5) After the fixed mold and the movable mold are attached, the H-shaped square plate continues to move, so that the two material storage boxes continue to operate, and the harmful gases generated by the device during the chip encapsulation are collected and filtered through the filter for discharge, so as to avoid the device generating a large amount of harmful gases when encapsulating the chip and accumulating around to endanger the physical and mental health of the operator, and at the same time improve the environmental performance of the device when in use; at the same time, when the device is completed after encapsulation, the H-shaped square plate is reset and moved, so that the two material storage boxes continue to operate on both sides of the fixed mold and the movable mold, which can not only purify the harmful gases and hot air generated during demolding after encapsulation, but also reduce the temperature of the chip after encapsulation, accelerate the cooling speed of the package shell, and increase its curing speed, thereby improving the encapsulation efficiency and effect of the device and further reducing the limitations of the device when in use; (6) Continue to operate the telescopic cylinder to move the H-shaped square plate. Since the movable mold on the pressure square plate can no longer move, the H-shaped square plate moves within the upper limit of several limit slides, so that the limit spring is in a buffering state, thereby strengthening the connection strength between the movable mold and the fixed mold, and avoiding the gap between the two due to insufficient contact strength. The gap between the two will cause the plastic sealing material to flow out, causing the device to fail to seal the chip. The continuous movement of the H-shaped square plate is used to continuously increase the connection strength between the movable mold and the fixed mold to avoid the above phenomenon, thereby reducing the limitations of the device during use and making the device more effective in sealing the chip. The sealing of the sheet during plastic sealing is guaranteed, which improves the use effect of the device; at the same time, when the H-shaped square plate is continuously moving, the limit sliding column on the H-shaped square plate is continuously moved within the upper limit of the pressure square plate, so that the limit spring is continuously in a buffer state, and while the movable mold continuously applies pressure to the fixed mold, the limit sliding column is gradually moved into the limit circular groove, thereby further limiting the movement of the H-shaped square plate, avoiding the phenomenon of misalignment of the H-shaped square plate during movement, resulting in uneven pressure on the movable mold and gaps elsewhere, further improving the plastic sealing effect of the device and the stability of the H-shaped square plate and the movable mold during movement; (7) When the displacement slider is moving to the end quickly, the rotating gear and the retaining rack are no longer engaged, and are in a buffer period, and the sensor on the side wall of the storage box contacts the pressure wheel, indicating that the storage box is moving to the end quickly, so that the valve (not shown in the figure) at the opening on the bottom surface of the storage box that generates suction is opened. Since there is no suction in the storage box at this time, the impurities absorbed by the storage box fall into the opening on the bottom surface of the storage box, so that these impurities can be collected. At the same time, the valve setting is closed to avoid impurities flying around during the conversion between suction and blowing. When the storage box at this location is reset and moved, the rotating gear resumes its engagement with the retaining rack, so that the storage box that generates suction is converted into blowing. This reciprocating process can continuously clean the fixed mold and the movable mold, reducing the limitations of the device during use, thereby improving the plastic sealing effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0017] In the attached picture: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the movable mold structure of the present invention; Figure 3 It is a schematic diagram of the rectangular frame structure of the present invention; Figure 4 It is a schematic diagram of the structure of the retaining rack of the present invention; Figure 5 This is a schematic diagram of the H-shaped square plate structure of the present invention; Figure 6 It is a schematic diagram of the displacement column structure of the present invention; Figure 7 It is a cross-sectional view of a material storage box of the present invention; Figure 8 This is a schematic diagram of the U-shaped base structure of the present invention; Fig. 9 This is a schematic diagram of the displacement cross block structure of the present invention; In the figure: 1, processing table; 2, fixed mold; 3, U-shaped base; 4, telescopic cylinder; 5, H-shaped square plate; 6, guide T-plate; 7, L-shaped rack; 8, guide cylinder; 9, guide limit plate; 10, limit sliding column; 11, pressure square plate; 12, limit circular plate; 13, limit circular groove; 14, limit spring; 15, movable mold; 16, auxiliary notch; 17, fixed pulley; 18, winding roller; 19, auxiliary rotating shaft; 20, auxiliary base plate; 21, spring spring; 22, locking square seat; 23, cable; 24, rotating turntable; 25, displacement column; 26, displacement horizontal block; 27, displacement square column; 28. Displacement base plate; 29. ​​Driving gear; 30. Driving rack; 31. Driving square plate; 32. Driving square column; 33. Driving base plate; 34. Driving spring; 35. U-shaped square rod; 36. Displacement L plate; 37. Linkage base plate; 38. Rectangular frame; 39. Sealing pad; 40. Extended square rod; 41. Displacement slider; 42. Displacement slide; 43. Rotating shaft; 44. Rotating gear; 45. Retaining rack; 46. Large pulley; 47. Transmission belt; 48. Small pulley; 49. Transmission shaft; 50. Fan blades; 51. L-shaped connecting block; 52. Storage box; 53. Pressure round wheel. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0019] Example, by Figures 1 to 9The present invention includes a processing table 1, on which a force-applying and continuous-pressing mechanism for plastic-sealing a chip is provided; the force-applying and continuous-pressing mechanism includes a fixed mold 2, the bottom of which is connected to the top of the processing table 1 by bolts; a U-shaped base 3 is also installed on the processing table 1, and the opening of the U-shaped base 3 faces the top of the processing table 1; a telescopic cylinder 4 is installed on the U-shaped base 3 by bolts, and the output end of the telescopic cylinder 4 faces the top of the processing table 1 and is also installed with an H-shaped square plate 5, and the opposite side of the U-shaped base 3 In the hollow area of ​​the H-shaped square plate 5; a guide T-plate 6 is symmetrically installed on both sides of the H-shaped square plate 5 on the opposite side of the U-shaped base 3, and a gas-making and cavity-clearing unit is provided on the guide T-plate 6, and the gas-making and cavity-clearing unit is used to clean the impurities adhered to the mold cavity in the fixed mold 2; L-shaped racks 7 are also installed on the opposite sides of the two guide T-plates 6, and the end of the L-shaped rack 7 faces the processing table 1; a guide cylinder 8 is symmetrically installed on the side of the guide T-plate 6 away from the processing table 1, and the end of the guide cylinder 8 away from the fixed mold 2 penetrates the U-shaped base The top of the seat 3, the guide cylinder 8 and the top of the U-shaped base 3 are slidably matched; the end of the guide cylinder 8 away from the processing table 1 is connected to a guide limit plate 9; the side of the H-shaped square plate 5 away from the top of the U-shaped base 3 is symmetrically installed with two groups of limit slides 10, the number of a group of limit slides 10 is two, and the two groups of limit slides 10 are relatively arranged on both sides of the U-shaped base 3; the two groups of limit slides 10 are connected through a pressure square plate 11, and the pressure square plate 11 is slidably matched with the limit slide 10; the limit slide 1 0 is connected to a limiting circular plate 12 at one end away from the H-shaped square plate 5; a limiting circular groove 13 is also provided on the top of the processing table 1, and the limiting circular groove 13 is located on the moving path of the limiting circular plate 12 and the two have the same size; a limiting spring 14 is sleeved on the limiting sliding column 10, one end of the limiting spring 14 is fixedly connected to the H-shaped square plate 5, and the other end is fixedly connected to the top of the pressure square plate 11; the bottom of the pressure square plate 11 is also connected to a movable mold 15 by bolts, and the movable mold 15 and the working surface of the fixed mold 2 are arranged opposite to each other; The required plastic encapsulation materials and chips are placed in the movable mold 15 and the fixed mold 2, and the telescopic cylinder 4 is started to drive the H-shaped square plate 5 to move at its output end, so that the H-shaped square plate 5 drives the pressure square plate 11 to move under the action of the limit slide 10 and the limit spring 14, so that the movable mold 15 on it moves toward the fixed mold 2, so that the two are fitted to complete the mold closing operation, and a closed cavity is formed between the two. This cavity provides a spatial basis for chip plastic encapsulation, and the preheated liquid plastic encapsulation material is injected into this closed cavity under a certain pressure through the gate. The plastic encapsulation material will flow in the cavity and fill the space around the chip and the lead frame. After solidification, A hard packaging shell is formed to complete the plastic sealing operation of the chip; it is worth mentioning that when the H-shaped square plate 5 moves with the movable mold 15, the guide T-plate 6 on the H-shaped square plate 5 moves relative to the top limit of the U-shaped base 3 through the guide cylinder 8, and the movement of the movable mold 15 is limited, so that the movable mold 15 is prevented from shaking during movement and causing dislocation, and the stability of the movable mold 15 during movement is improved, so that the accuracy of the docking of the movable mold 15 with the fixed mold 2 is improved, and the plastic sealing effect of the device on the chip is improved; it is worth mentioning that after the movable mold 15 has been docked with the fixed mold 2, the telescopic cylinder 4 is continued to be operated to make the H-shaped square plate 5 continue to move Since the movable mold 15 on the pressure square plate 11 can no longer move, the H-shaped square plate 5 is moved within the upper limit of the plurality of limit slides 10, so that the limit spring 14 is in a buffering state, thereby strengthening the connection strength between the movable mold 15 and the fixed mold 2, and avoiding the gap between the two due to insufficient contact strength. The gap between the two when connected will cause the plastic sealing material to flow out, causing the device to fail in the plastic sealing operation of the chip. The continuous movement of the H-shaped square plate 5 is used to continuously increase the connection strength between the movable mold 15 and the fixed mold 2 to avoid the above phenomenon, reduce the limitations of the device when in use, and ensure the sealing of the device when plastic sealing the chip. , which improves the use effect of the device; at the same time, when the H-shaped square plate 5 continues to move, the limiting slide post 10 on the H-shaped square plate 5 continues to move within the upper limit of the pressure square plate 11, so that the limiting spring 14 is continuously in a buffer state, and while the movable mold 15 continues to apply pressure to the fixed mold 2, the limiting slide post 10 gradually moves into the limiting circular groove 13, thereby further limiting the movement of the H-shaped square plate 5, avoiding the phenomenon of misalignment of the H-shaped square plate 5 during movement, resulting in uneven pressure applied to the movable mold 15 and gaps elsewhere, further improving the plastic sealing effect of the device and the stability of the H-shaped square plate 5 and the movable mold 15 during movement.

[0020] The gas-making and cavity-clearing unit of the present embodiment includes an auxiliary slot 16, which is arranged through one of the two opposite sides of the U-shaped base 3; a fixed pulley 17 is rotatably arranged in the auxiliary slot 16; a winding roller 18 is arranged at the outer wall of the U-shaped base 3 near the auxiliary slot 16, and auxiliary rotating shafts 19 are installed on both sides of the winding roller 18, and auxiliary rotating shafts 19 are installed on the auxiliary rotating shafts 19. An auxiliary substrate 20 is arranged on the U-shaped base 3; a clockwork spring 21 is installed on the auxiliary rotating shaft 19, and the end point of the clockwork spring 21 is arranged on the auxiliary substrate 20; a locking square seat 22 is also fixedly installed on one of the guide T-plates 6 near the auxiliary slot 16, and a cable 23 is connected to the locking square seat 22, and the cable 23 is away from One end of the locking square seat 22 is wound around the fixed pulley 17 and connected with the winding roller 18; the end of the auxiliary rotating shaft 19 away from the winding roller 18 is connected to a rotating turntable 24, and displacement columns 25 are installed on the opposite backs of the two rotating turntables 24, and a displacement cross block 26 is slidably connected to the displacement column 25, and two displacement square columns 27 are symmetrically connected to the side of the displacement cross block 26, and the two displacement square columns 27 are slidably connected to a displacement base plate 28, and the displacement base plate 28 is arranged on the U-shaped base 3; an extended square rod 40 is installed at the bottom of the displacement cross block 26, and a displacement slider 41 is installed at the end of the extended square rod 40; the top of the processing table 1 is symmetrically provided with a displacement slide groove 42 with the U-shaped base 3 as the symmetry axis, and the displacement slide groove 42 and the displacement slider 4 1 sliding fit; the opposite sides of the two displacement sliders 41 are both equipped with a rotating shaft 43, a rotating gear 44 is installed on the rotating shaft 43, and the rotating gear 44 is meshed with a retaining rack 45, and the retaining rack 45 is arranged on the top of the processing table 1; a large pulley 46 is installed on the end of the rotating shaft 43 away from the displacement slider 41, and a transmission belt 47 is connected to the large pulley 46, and a small pulley 48 is connected to the transmission belt 47, and the transmission belt 47 is slidably matched with the small pulley 48 and the large pulley 46; a transmission shaft 49 is installed on the small pulley 48, and the transmission shaft 49 passes through the displacement slider 41 and is connected to a plurality of fan blades 50; one of the retaining racks 45 is arranged on the top wall of the rotating gear 44, and the other of the retaining racks 45 is arranged on the top wall of the rotating gear 44. Placed on the bottom wall of the rotating gear 44; the notches of the two retaining racks 45 are both facing the rotating gear 44; two groups of L-shaped coupling blocks 51 are symmetrically installed on both sides of the top of the processing table 1, and the number of each group of L-shaped coupling blocks 51 is two; the opposite surfaces of the two displacement sliders 41 are provided with storage boxes 52, and the opening of the storage box 52 faces the fixed mold 2; the end of the transmission shaft 49 away from the small pulley 48 and a plurality of fan blades 50 are all located in the storage box 52; a filter is provided in the storage box 52, and the filter is located in front of the fan blades 50; the two L-shaped coupling blocks 51 are both facing the storage box 52; a pressure round wheel 53 is installed on the L-shaped coupling block 51, and the pressure round wheel 53 is located on the moving path of the sensor provided on the side wall of the storage box 52; When the device is plastic-sealing the chip, the H-shaped square plate 5 moves, so that the locking square seat 22 on it moves synchronously, and the winding roller 18 is driven to rotate under the action of the cable 23 and the fixed pulley 17, so that the auxiliary rotating shaft 19 on it drives the rotating turntable 24 to rotate, and at the same time, the spring spring 21 on the auxiliary rotating shaft 19 is in a buffer state, so that when it is reset, it can drive the winding roller 18 to rotate and reset the winding; at the same time, the displacement column 25 moves with the rotation of the rotating turntable 24, so that the displacement column 25 is in the displacement cross block 26 reciprocates, so that the displacement square column 27 on the displacement cross block 26 reciprocates on the displacement base plate 28, so that the reciprocating displacement cross block 26 drives the displacement slider 41 to reciprocate through the extended square rod 40, so that it reciprocates in the displacement slide groove 42; when the two displacement sliders 41 move away from the rotating turntable 24, the rotating gear 44 on the displacement slider 41 moves along the retaining rack 45, so that the rotating gear 44 rotates as the displacement slider 41 moves, thereby driving the large pulley 4 6 rotates, so that it drives the small pulley 48 to rotate through the transmission belt 47. Since the size of the large pulley 46 of the power source is larger than the small pulley 48, the speed of the small pulley 48 is higher than that of the large pulley 46, so that the small pulley 48 rotates quickly, and drives a plurality of fan blades 50 to rotate quickly through the transmission shaft 49, so that it rotates quickly in the storage box 52, so that wind force is generated at the opening of the storage box 52, and the wind force acts on the fixed mold 2. It is worth mentioning that at this time, the fixed mold 2 and the movable mold 15 are still on the way of mold closing, so that the above-mentioned wind force can clean up the impurities or dust adhered to the fixed mold 2 and the movable mold 15, so that the cleaning process does not need to be manually performed by the staff, and at the same time avoids the negligence in the process that causes the impurities inside the fixed mold 2 and the movable mold 15 to be not completely cleaned, resulting in incomplete chips during plastic sealing, bubbles, and other problems, thereby improving the plastic sealing effect of the device, further reducing the work intensity of the staff, and improving the plastic sealing efficiency of the device, further reducing the limitations of the device when in use; It is worth mentioning that since one retaining rack 45 is located on the top wall of the rotating gear 44 and the other retaining rack 45 is located on the bottom wall of the rotating gear 44, the rotating gear 44 at one displacement slider 41 rotates forwardly and the rotating gear 44 at the other displacement slider 41 rotates reversely, so that the two displacement sliders 41 make the two rotating gears 44 rotate in opposite directions when they move synchronously, so that the opening of the storage box 52 at one displacement slider 41 generates a blowing force, so that the impurities adhered to the fixed mold 2 and the movable mold 15 can be blown away from the fixed mold 2 and the movable mold 15, and the opening of the storage box 52 at the other displacement slider 41 generates a suction force, so that the impurities blown away from the storage box 52 on the opposite side can be sucked into the storage box 52, so that these impurities can be collected, so as to avoid the above-mentioned impurities being blown everywhere, making it difficult to clean and affecting the work intensity of the staff, and avoiding the staff from cleaning while ensuring the cleanliness of the working environment of the device; on the contrary, when the two displacement sliders 41 are reset and moved synchronously, the wind force presented at the openings of the two storage boxes 52 is also opposite. The device is used to continuously clean the impurities adhered to the fixed mold 2 and the movable mold 15, thereby improving the use effect of the device; it is worth mentioning that when the displacement slider 41 is moving to the end quickly, the rotating gear 44 and the retaining rack 45 are no longer engaged, and are in a buffer period, and the sensor on the side wall of the storage box 52 is in contact with the pressure round wheel 53, indicating that the storage box 52 is moving to the end quickly, so that the valve (not shown in the figure) at the opening on the bottom surface of the storage box 52 that generates suction is opened, because at this time there is no suction in the storage box 52 , so that the impurities absorbed inside the material storage box 52 fall into the opening on the bottom surface of the material storage box 52, so that these impurities can be collected, and the valve setting is closed at the same time to prevent the impurities from flying around during the conversion between suction and blowing forces. When the material storage box 52 at this location is reset and moved, the rotating gear 44 resumes the meshing with the retaining rack 45, so that the material storage box 52 generating suction force is converted into blowing force, and the fixed mold 2 and the movable mold 15 can be cleaned continuously in this reciprocating manner, which reduces the limitations of the device during use, thereby improving the plastic sealing effect of the device; It is worth mentioning that after the fixed mold 2 and the movable mold 15 are fitted, the H-shaped square plate 5 continues to move, so that the two storage boxes 52 continue to operate, and collect the harmful gases generated by the device during the chip sealing process, and filter and discharge them through the filter, so as to avoid the device generating a large amount of harmful gases when the chip is sealed and accumulating around, causing harm to the physical and mental health of the operator, and at the same time improve the environmental protection performance of the device when in use; at the same time, when the device is sealed, the H-shaped square plate 5 is reset and moved, so that the two storage boxes 52 continue to operate on both sides of the fixed mold 2 and the movable mold 15, which can not only purify the harmful gases and hot air generated during demolding after the sealing is completed, but also reduce the temperature of the chip after the sealing is completed, accelerate the cooling speed of the packaging shell, and improve its curing molding speed, thereby improving the sealing efficiency and effect of the device, and further reducing the limitations of the device when in use.

[0021] The processing table 1 of the present embodiment is also provided with a blocking encryption component; the blocking encryption component includes two driving gears 29, and the two driving gears 29 are symmetrically arranged on both sides of the top of the processing table 1; the driving gears 29 are located on the moving path of the L-shaped rack 7, and the two are meshed with each other; the opposite back surfaces of the two driving gears 29 are meshedly connected with driving racks 30, and the opposite back surfaces of the two driving racks 30 are symmetrically connected with two driving square plates 31, and the two driving square plates 31 are commonly connected with a driving square column 32, and a driving substrate 33 is slidably connected to the driving square column 32, and the driving substrate 33 is arranged on the U-shaped base 3; a driving spring 34 is sleeved on the driving square column 32, and one end of the driving spring 34 is connected to the driving The two driving racks 30 are connected to a U-shaped square rod 35 at their bottom ends, and a displacement L plate 36 is installed on both sides of the U-shaped square rod 35. The end points of the displacement L plate 36 pass through the processing table 1 and are connected to a linkage substrate 37. The displacement L plate 36 and the processing table 1 are slidably matched. The two linkage substrates 37 are connected to a rectangular frame 38. A sealing rubber pad 39 is provided on the inner wall of the rectangular frame 38. The sealing rubber pad 39 has the same size as the fixed mold 2 and the movable mold 15. The connection between the fixed mold 2 and the movable mold 15 is located on the moving path of the sealing rubber pad 39. The driving gear 29 is arranged on the U-shaped base 3. The rectangular frame 38 is sleeved on the fixed mold 2. When the H-shaped square plate 5 moves downward, the L-shaped rack 7 is synchronously driven to move, so that after the movable mold 15 on the H-shaped square plate 5 moves to fit with the fixed mold 2, the H-shaped square plate 5 continues to move downward, and the L-shaped rack 7 on it continues to move downward to mesh with the driving gear 29, thereby driving the driving gear 29 to rotate, so that the meshing driving rack 30 moves, and the driving square column 32 moves on the driving base plate 33 to the upper limit, so that the driving spring 34 is in a buffering state, so that it is easy to drive the driving rack 30 to reset and move when it is reset; it is worth mentioning that the two driving racks 30 are synchronously moved upward, thereby jointly driving the U-shaped square rod 35 to move upward, so that the two displacement L plates 36 on both sides of the rectangular frame 38 are moved upward, so that The fixed mold 2 moves to the upper limit, and at this time the fixed mold 2 has been fitted with the movable mold 15, so that the sealing pad 39 on the inner wall of the rectangular frame 38 moves to the connection between the fixed mold 2 and the movable mold 15 and fits, thereby further limiting the connection between the fixed mold 2 and the movable mold 15, avoiding the presence of a gap between the fixed mold 2 and the movable mold 15 when the device is plastic-sealing the chip, resulting in burrs on the plastic-sealed shell, and at the same time avoiding the leakage of the plastic sealing material causing defects in the packaging appearance, thereby improving the quality of the chip plastic sealing and further reducing the limitations of the device during use; at the same time, when the device completes the plastic sealing of the chip, the plastic sealing material and burrs leaked from the edges of the fixed mold 2 and the movable mold 15 can be cleaned through the reset movement of the rectangular frame 38, thereby improving the use effect of the device.

[0022] The present invention also provides a chip plastic packaging method for integrated circuit production, comprising the following steps: S1, place the object to be plastic-sealed in the movable mold 15 and the fixed mold 2 and start the telescopic cylinder 4 so that its output end drives the H-shaped square plate 5 to move; S2, the H-shaped square plate 5 drives the pressure square plate 11 to move under the action of the limit slide 10 and the limit spring 14, so that the movable mold 15 on it moves toward the fixed mold 2; S3, when the movable mold 15 contacts the fixed mold 2 after continuous movement, the fit between the two forms a closed cavity; S4. The material required for plastic encapsulation is squeezed into the closed cavity, and a hard packaging shell is formed after solidification, thereby completing the plastic encapsulation operation of the chip.

[0023] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip encapsulation device for integrated circuit production, comprising a processing table (1), characterized in that: The processing table (1) is provided with a force-applying and pressure-continuing mechanism for plastic-sealing the chip; the force-applying and pressure-continuing mechanism comprises a fixed mold (2), the bottom of which is connected to the top of the processing table (1) by bolts; a U-shaped base (3) is also installed on the processing table (1), the opening of the U-shaped base (3) faces the top of the processing table (1); a telescopic cylinder (4) is installed on the U-shaped base (3) by bolts, the output end of the telescopic cylinder (4) faces the top of the processing table (1) and is also installed The H-shaped square plate (5) and the opposite side of the U-shaped base (3) are located in the hollow area of ​​the H-shaped square plate (5); a guide T-plate (6) is symmetrically installed on both sides of the H-shaped square plate (5) close to the opposite side of the U-shaped base (3), and an air-generating and cavity-clearing unit is provided on the guide T-plate (6), and the air-generating and cavity-clearing unit is used to clean impurities adhered to the inner mold cavity of the fixed mold (2); L-shaped racks (7) are also installed on the opposite sides of the two guide T-plates (6), and the end points of the L-shaped racks (7) face the processing table (1).

2. The chip plastic packaging device for integrated circuit production according to claim 1, characterized in that: A guide cylinder (8) is symmetrically mounted on one side of the guide T-plate (6) away from the processing table (1); one end of the guide cylinder (8) away from the fixed mold (2) penetrates the top of the U-shaped base (3); the guide cylinder (8) and the top of the U-shaped base (3) are slidably matched; one end of the guide cylinder (8) away from the processing table (1) is connected to a guide limit plate (9); and two groups of limit sliding columns (10) are symmetrically mounted on one side of the H-shaped square plate (5) away from the top of the U-shaped base (3); the number of each group of limit sliding columns (10) is two, and the two groups of limit sliding columns (10) are arranged on two sides of the U-shaped base (3) opposite to each other.

3. The chip plastic packaging device for integrated circuit production according to claim 2, characterized in that: The two groups of limit slides (10) are both connected through a pressure square plate (11), and the pressure square plate (11) and the limit slide (10) are slidably matched; the end of the limit slide (10) away from the H-shaped square plate (5) is connected to the limit circular plate (12); the top of the processing table (1) is also provided with a limit circular groove (13), the limit circular groove (13) is located on the moving path of the limit circular plate (12) and the two have the same size; the limit slide (10) is sleeved with a limit spring (14), one end of the limit spring (14) is fixedly connected to the H-shaped square plate (5), and the other end is fixedly connected to the top of the pressure square plate (11); the bottom of the pressure square plate (11) is also connected to a movable mold (15) by bolts, and the working surfaces of the movable mold (15) and the fixed mold (2) are arranged opposite to each other.

4. The chip plastic packaging device for integrated circuit production according to claim 1, characterized in that: The gas-generating and cavity-clearing unit comprises an auxiliary notch (16), the auxiliary notch (16) being arranged through one of two opposite sides of the U-shaped base (3); a fixed pulley (17) being rotatably arranged in the auxiliary notch (16); a winding roller (18) being arranged at an outer wall of the U-shaped base (3) near the auxiliary notch (16), an auxiliary rotating shaft (19) being mounted on both sides of the winding roller (18), an auxiliary substrate (20) being mounted on the auxiliary rotating shaft (19), and the auxiliary substrate (20) being arranged on the U-shaped base (3); a spring (21) being mounted on the auxiliary rotating shaft (19), and an end point of the spring (21) being arranged on the auxiliary substrate (20).

5. The chip plastic packaging device for integrated circuit production according to claim 4, characterized in that: A locking square seat (22) is fixedly mounted on one of the guide T-plates (6) near the auxiliary notch (16), and a cable (23) is connected to the locking square seat (22). One end of the cable (23) away from the locking square seat (22) passes around the fixed pulley (17) and is wound around the winding roller (18). One end of the auxiliary rotating shaft (19) away from the winding roller (18) is connected to a rotating turntable (24). Displacement columns (25) are mounted on opposite sides of the two rotating turntables (24). A displacement cross block (26) is slidably connected to the displacement column (25). Two displacement square columns (27) are symmetrically connected to the side of the displacement cross block (26). The two displacement square columns (27) are slidably connected to a displacement base plate (28). The displacement base plate (28) is arranged on the U-shaped base (3).

6. The chip plastic packaging device for integrated circuit production according to claim 1, characterized in that: The processing table (1) is also provided with a blocking encryption component; the blocking encryption component comprises two driving gears (29), the two driving gears (29) are symmetrically arranged on both sides of the top of the processing table (1); the driving gears (29) are located on the moving path of the L-shaped rack (7), and the two are meshed with each other; the opposite back surfaces of the two driving gears (29) are meshedly connected with driving racks (30), the opposite back surfaces of the two driving racks (30) are symmetrically connected with two driving square plates (31), the two driving square plates (31) are commonly connected with a driving square column (32), the driving square column (32) is slidably connected with a driving base plate (33), and the driving base plate (33) is arranged on the U-shaped base (3); the driving square column (32) is sleeved with a driving spring (34), one end of the driving spring (34) is connected to the driving square plate (31), and the other end is connected to the driving base plate (33).

7. The chip plastic packaging device for integrated circuit production according to claim 6, characterized in that: The bottom ends of the two driving racks (30) are commonly connected to a U-shaped square rod (35), and displacement L plates (36) are installed on both sides of the U-shaped square rod (35). The end points of the displacement L plates (36) pass through the processing table (1) and are connected to a linkage base plate (37). The displacement L plates (36) and the processing table (1) are slidably matched. The two linkage base plates (37) are commonly connected to a rectangular frame (38), and a sealing rubber pad (39) is provided on the inner wall of the rectangular frame (38). The sealing rubber pad (39) has the same size as the fixed mold (2) and the movable mold (15). The connection between the fixed mold (2) and the movable mold (15) is located on the moving path of the sealing rubber pad (39). The driving gear (29) is arranged on the U-shaped base (3); and the rectangular frame (38) is sleeved on the fixed mold (2).

8. The chip plastic packaging device for integrated circuit production according to claim 5, characterized in that: An extended square rod (40) is installed at the bottom of the displacement cross block (26), and a displacement slider (41) is installed on the end point of the extended square rod (40); a displacement slide groove (42) is symmetrically arranged on the top of the processing table (1) with the U-shaped base (3) as the symmetry axis, and the displacement slide groove (42) and the displacement slider (41) are slidably matched; a rotating shaft (43) is installed on the opposite back surface of the two displacement sliders (41), and a rotating gear (44) is installed on the rotating shaft (43), and the rotating gear (44) is meshedly connected with a retaining rack (45) , a retaining rack (45) is arranged on the top of the processing table (1); a large pulley (46) is installed at one end of the rotating shaft (43) away from the displacement slider (41), the large pulley (46) is connected to a transmission belt (47), the transmission belt (47) is connected to a small pulley (48), the transmission belt (47) and the small pulley (48) and the large pulley (46) are slidably matched; a transmission shaft (49) is installed on the small pulley (48), and the transmission shaft (49) passes through the displacement slider (41) and is connected to a plurality of fan blades (50).

9. The chip plastic packaging device for integrated circuit production according to claim 8, characterized in that: One of the retaining racks (45) is arranged on the top wall of the rotating gear (44), and the other retaining rack (45) is arranged on the bottom wall of the rotating gear (44); the notches of the two retaining racks (45) are both facing the rotating gear (44); two groups of L-shaped connecting blocks (51) are symmetrically installed on both sides of the top of the processing table (1), and the number of each group of L-shaped connecting blocks (51) is two; the opposite surfaces of the two displacement sliders (41) are each provided with a material storage box (52), and the material storage box (52) The opening faces the fixed mold (2); one end of the transmission shaft (49) away from the small pulley (48) and a plurality of fan blades (50) are located in the material storage box (52); a filter is provided in the material storage box (52), and the filter is located in front of the fan blades (50); the two L-shaped connecting blocks (51) both face the material storage box (52); a pressure round wheel (53) is installed on the L-shaped connecting block (51), and the pressure round wheel (53) is located on the moving path of a sensor provided on the side wall of the material storage box (52).

10. A method for plastic packaging of integrated circuit chips, using the integrated circuit chip plastic packaging device as claimed in claim 1, characterized in that: Includes steps: S1, placing the object to be plastic-sealed in the movable mold (15) and the fixed mold (2) and starting the telescopic cylinder (4) so ​​that its output end drives the H-shaped square plate (5) to move; S2, the H-shaped square plate (5) drives the pressure square plate (11) to move under the action of the limit slide (10) and the limit spring (14), so that the movable mold (15) on it moves toward the fixed mold (2); S3, when the movable mold (15) contacts the fixed mold (2) after continuous movement, the two are fitted together to form a closed cavity; S4. The material required for plastic encapsulation is squeezed into the closed cavity, and a hard packaging shell is formed after solidification, thereby completing the plastic encapsulation operation of the chip.

Images