Calibration jig

Abstract

The invention relates to a calibration jig which is used for silicon wafer clamping calibration and comprises a to-be-measured body, the to-be-measured body is configured to replace measurement of parameters of silicon wafers of the same size, and the shape of the to-be-measured body is consistent with that of a preset silicon wafer; a plurality of stress sensors are uniformly arranged on the periphery of the to-be-measured main body and are used for measuring the clamping force and the clamping position. The invention provides a calibration jig which is used for calibrating relevant parameters of silicon wafer clamping, for example, the clamping force and the clamping position for clamping a silicon wafer can be calibrated, and compared with manual calibration only based on experience of workers, the efficiency is improved, and the calibration precision is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor product manufacturing, and in particular to a calibration fixture for clamping a silicon wafer. Background Art

[0002] At present, in silicon wafer processing, it is often necessary to clamp the silicon wafer and drive it to rotate for cleaning and etching. In some cases, it is also necessary to rotate at high speed, with a speed of up to 2000r / min, which places high demands on the clamping of the silicon wafer. In addition, the clamping position and clamping force are also crucial. These parameters directly affect the stability of the silicon wafer processing process and the removal effect of surface particles.

[0003] Currently known clamping methods include non-alternating 4-point clamping, non-alternating 6-point clamping, and alternating 6-point clamping. Since the clamping devices are consumable spare parts, they involve replacement of consumables and abnormal maintenance and replacement. After replacement, the staff will calibrate the clamping position, the horizontality of the silicon wafer clamping, and the clamping force based on their experience. In addition, the calibration of different parameters requires different calibration and measuring fixtures. The steps are cumbersome, time-consuming and labor-intensive, and the calibration quality cannot be guaranteed, which has a great impact on production capacity and process quality. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a calibration fixture for calibrating silicon wafer clamping, which solves the problem of low efficiency and low quality of manual calibration of silicon wafer clamping.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present invention is: a calibration fixture for calibrating the clamping of a silicon wafer, comprising a subject to be measured, the subject to be measured is configured to replace the measurement of parameters of a silicon wafer of the same size, and the shape of the subject to be measured is consistent with the shape of a preset silicon wafer;

[0006] A plurality of stress sensors are evenly arranged around the body to be tested to measure the clamping force and the clamping position.

[0007] Optionally, the stress sensor is a resistive or capacitive sensor.

[0008] Optionally, the stress sensor is a resistive sensor, and the stress sensor includes a resistive strain film or a resistive strain gauge.

[0009] Optionally, the outer peripheral surface of the subject to be measured is covered with a circle of elastic material layer, and the stress sensor is arranged on the outer side of the elastic material layer.

[0010] Optionally, the subject to be measured is circular, and the arrangement positions of the plurality of stress sensors are intersection positions of an inscribed polygon of the subject to be measured and an outer peripheral surface of the subject to be measured.

[0011] Optionally, it also includes a digital display dual-axis horizontal measurement structure, the subject to be measured includes an outer ring and an inner ring arranged concentrically, the stress sensor is arranged on the outer ring, and the digital display dual-axis horizontal measurement structure is arranged on the inner ring for measuring the horizontality of the subject to be measured.

[0012] Optionally, a hollow structure is provided between the outer ring and the inner ring.

[0013] Optionally, the hollow structure is annular, and a connecting rod is provided between the outer ring and the inner ring.

[0014] Optionally, a display screen is provided on the outer ring for displaying parameter information including the clamping force and clamping position sensed by the stress sensor.

[0015] Optionally, the subject to be tested is made of non-metallic composite material.

[0016] The beneficial effects of the present invention are as follows: the present invention provides a calibration fixture for calibrating relevant parameters of silicon wafer clamping, such as calibrating the clamping force and clamping position of the silicon wafer, which improves efficiency and calibration accuracy compared to manual calibration based solely on the experience of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram showing a calibration jig in an embodiment of the present invention;

[0018] Figure 2 A schematic diagram showing a calibration jig in an embodiment of the present invention;

[0019] Figure 3 A schematic diagram showing a calibration fixture in an embodiment of the present invention. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0021] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0022] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0023] Since the clamping devices are all consumable spare parts, they involve replacement of consumables and abnormal maintenance and replacement. After replacement, the clamping performance of the clamping device needs to be calibrated, such as clamping force, clamping position, etc. At present, it is generally calibrated manually, and the calibration of different parameters requires different calibration and measurement fixtures. The steps are cumbersome, time-consuming and labor-intensive, and the calibration quality cannot be guaranteed, which has a great impact on production capacity and process quality.

[0024] refer to Figure 1-Figure 3 In order to solve the above problems, the present embodiment provides a calibration fixture, which uses silicon wafer clamping for calibration, and improves calibration efficiency and calibration quality compared with manual calibration.

[0025] Specifically, this embodiment provides a calibration fixture for calibrating silicon wafer clamping, comprising a subject to be measured 1, wherein the subject to be measured 1 is configured to replace the measurement of parameters of a silicon wafer of the same size, and the shape of the subject to be measured 1 is consistent with the shape of a preset silicon wafer;

[0026] A plurality of stress sensors 10 are evenly arranged around the tested body 1 to measure the clamping force and the clamping position.

[0027] The calibration fixture of this embodiment provides a subject 1 to be tested, and the shape of the subject 1 to be tested is consistent with the shape of the silicon wafer to be calibrated. For example, if the silicon wafer to be calibrated is round, then the subject 1 to be tested is round. The size of the subject 1 to be tested is the same as the size of the silicon wafer to be calibrated to ensure the accuracy of the calibration result. For example, if the diameter to be calibrated is 8 inches, then the diameter of the subject 1 to be tested is 8 inches. Of course, the size of the silicon wafer to be calibrated can be set according to actual needs. For example, if the size of the silicon wafer to be calibrated is 12 inches, it is sufficient to set the size of the subject 1 to be tested according to the size of the silicon wafer to be calibrated to ensure the accuracy of the calibration result.

[0028] In this embodiment, the subject to be measured 1 is used to replace the actual silicon wafer for clamping calibration, which can not only meet the calibration requirements, but also avoid damage to the silicon wafer during the calibration process, avoid waste of resources, and reduce calibration costs.

[0029] In an exemplary embodiment, the stress sensor 10 is a resistive or capacitive sensor.

[0030] In an exemplary embodiment, the stress sensor 10 is a resistive sensor, and the stress sensor 10 includes a resistive strain film or a resistive strain gauge.

[0031] It should be noted that the stress sensor 10 is a sensitive device that converts the clamping force on the tested object into an electrical signal through stress changes. When the clamping force of the tested body 1 changes, the resistance strain film or the resistance strain gauge is deformed, so that the resistance of the resistance strain film or the resistance strain gauge changes. The clamping force can be obtained by the change in resistance value. And the clamping position is obtained according to the position of the stress sensor 10 where the resistance changes.

[0032] It should be noted that multiple stress sensors 10 are evenly arranged around the subject 1 to be tested. The multiple stress sensors 10 can be marked in advance, and a corresponding relationship table is set for the positions of the multiple stress sensors 10, so that when the stress sensor 10 sends a signal of electronic change, the position of the stress sensor 10 can be confirmed.

[0033] It should be noted that the stress sensors 10 are arranged at preset positions around the measured body 1, and there are gaps between adjacent stress sensors 10. The above preset positions can be predetermined clamping positions. As the measured body 1 is clamped and subjected to force, multiple stress sensors 10 all produce changes in resistance, which means that the clamping position is correct. If there are stress sensors 10 that do not produce changes in resistance, the clamping force is insufficient, or the clamping position deviates. At this time, the force applied to the corresponding stress sensor 10 can be increased, that is, the clamping force is increased, so as to determine whether the resistance of the corresponding stress sensor 10 changes. If the resistance of the corresponding stress sensor 10 changes, it is determined that the clamping position is correct. If the resistance of the corresponding stress sensor 10 still does not change, it is determined that the clamping position deviates and needs to be adjusted.

[0034] It should be noted that, corresponding to different clamping methods (the clamping methods here only correspond to the different clamping points, such as 4-point clamping, 6-point clamping, etc., Figure 2 As shown, the number of stress sensors 10 set corresponding to 4-point clamping and 5-point clamping is different, and the positions of the stress sensors 10 set corresponding to different clamping methods are also different.

[0035] For different clamping methods, only one group of stress sensors can be set around the subject 1 to be tested, and the group of stress sensors includes at least two stress sensors 10 to realize the calibration of the clamping of the silicon wafer, that is, one subject 1 to be tested corresponds to only one clamping method.

[0036] For different clamping methods, multiple groups of stress sensors can be arranged around the subject to be tested 1, each group of stress sensors includes at least two stress sensors 10, and each group of stress sensors corresponds to one clamping method. In this way, one subject to be tested 1 can be calibrated in multiple clamping methods, thus expanding the scope of application.

[0037] In some embodiments, in order to calibrate the clamping of the clamping device with different clamping modes, multiple groups of stress sensors may be arranged around the subject to be measured 1, for example, a first group of stress sensors may be arranged at first preset positions around the subject to be measured 1, and a second group of stress sensors may be arranged at second preset positions around the subject to be measured 1. The first group of stress sensors may correspond to 4-point clamping, and four stress sensors 10 corresponding to 4-point clamping may be arranged at the first preset positions to achieve calibration of the corresponding clamping parameters for the 4-point clamping. The second group of stress sensors may correspond to 6-point clamping, and six stress sensors 10 corresponding to 6-point clamping may be arranged at the second preset positions to achieve calibration of the corresponding clamping parameters for the 6-point clamping.

[0038] It should be noted that, in an embodiment where only multiple groups of stress sensors are arranged around the subject 1 to be measured, the arrangement positions of the stress sensors 10 in different groups of stress sensors may not overlap at all, and the arrangement positions of the stress sensors 10 in different groups of stress sensors may also partially overlap, that is, there are common stress sensors 10 in different groups of stress sensors.

[0039] In an exemplary embodiment, multiple installation positions are set around the subject to be tested 1, and the stress sensor 10 is detachably set on the installation position of the subject to be tested 1, so that different numbers of stress sensors 10 can be installed corresponding to different clamping methods, or in other words, the stress sensor 10 can be installed at the corresponding installation position corresponding to different clamping methods.

[0040] It should be noted that the number of the stress sensors 10 can be set according to actual needs and is not limited here.

[0041] In an exemplary embodiment, the subject to be measured 1 is circular, and the arrangement positions of the plurality of stress sensors 10 are vertices of an inscribed polygon of the subject to be measured 1 .

[0042] In some embodiments, the subject to be measured 1 is circular, and the clamping method corresponding to the clamping calibration is 4-point clamping, then 4 stress sensors 10 are correspondingly arranged around the subject to be measured 1, and the arrangement positions of the 4 stress sensors 10 enclose the inscribed quadrilateral of the subject to be measured 1, reference Figure 2 .

[0043] In some embodiments, the subject to be measured 1 is circular, and the clamping method corresponding to the clamping calibration is six-point clamping, then six stress sensors 10 are correspondingly arranged around the subject to be measured 1, and the arrangement positions of the six stress sensors 10 together form an inscribed hexagon of the subject to be measured 1.

[0044] In an exemplary embodiment, the subject to be measured 1 is circular, and the arrangement positions of the plurality of stress sensors 10 may also be the tangent points between the circumscribed polygon of the subject to be measured 1 and the outer peripheral surface of the subject to be measured 1.

[0045] In some embodiments, the subject to be measured 1 is circular, and the clamping method corresponding to the clamping calibration is four-point clamping, then four stress sensors 10 are correspondingly set around the subject to be measured 1, and the setting positions of the four stress sensors 10 together form an circumscribed quadrilateral of the subject to be measured 1.

[0046] In some embodiments, the subject to be measured 1 is circular, and the clamping method corresponding to the clamping calibration is six-point clamping, then six stress sensors 10 are correspondingly arranged around the subject to be measured 1, and the arrangement positions of the six stress sensors 10 together form an circumscribed quadrilateral of the subject to be measured 1.

[0047] In an exemplary embodiment, the outer circumference of the subject to be measured 1 is covered with a circle of elastic material layer 11 , and the stress sensor 10 is arranged on the outer side of the elastic material layer 11 .

[0048] The elastic material layer 11 is an insulating material. For example, the material of the elastic material layer 11 may be rubber, but the present invention is not limited thereto.

[0049] The setting of the elastic material layer 11 allows the elastic material layer 11 to deform under the force when the subject 1 to be measured is clamped and subjected to force, and the stress sensor 10 arranged on the elastic material layer 11 is deformed, thereby generating a change in resistance, so as to measure the clamping force and sense whether the clamping position deviates.

[0050] In an exemplary embodiment, in the radial direction of the subject to be measured 1, the thickness of the elastic material layer 11 is 0.3-0.6 mm, but the present invention is not limited thereto.

[0051] In some embodiments, in the radial direction of the subject to be measured 1, the thickness of the elastic material layer 11 is 0.5 mm.

[0052] In an exemplary embodiment, the elastic material layer 11 is bonded to the outer peripheral surface of the subject to be tested 1 by adhesive.

[0053] In an exemplary embodiment, the elastic material layer 11 may include an annular body, and a U-shaped groove is provided on the inner side of the annular body. The edge of the body to be tested 1 can be inserted into the U-shaped groove so that the elastic material layer 11 is wrapped around the edge of the body to be tested 1.

[0054] In an exemplary embodiment, the elastic material layer 11 is connected to the test subject 1 in a detachable manner, and the stress sensor 10 is arranged on the elastic material layer 11. In this way, if calibration corresponding to different clamping methods is required, the elastic material layer 11 with different stress sensors 10 can be replaced.

[0055] In an exemplary embodiment, a display screen 12 is provided on the subject to be measured 1 to intuitively display the value of the force sensed by the stress sensor 10 .

[0056] In an exemplary embodiment, the display screen 12 may be annular, and the display screen 12 is arranged concentrically with the subject to be measured 1 to avoid affecting the horizontality of the subject to be measured 1.

[0057] When the display screen 12 is annular, a plurality of display areas can be set along the circumferential direction of the display screen 12, and the plurality of display areas are set in one-to-one correspondence with the positions of the plurality of stress sensors 10, so that the change in resistance of each stress sensor 10 can be obtained more intuitively, and the clamping force of each clamping position can be obtained more intuitively.

[0058] In an exemplary embodiment, the calibration fixture includes a processing unit for obtaining the clamping force according to the signal of the stress sensor 10 .

[0059] In some embodiments, a signal amplification unit is included between the processing unit and the stress sensor 10. The signal amplification unit may include a signal amplification circuit, and the signal is amplified by the amplification circuit, and then transmitted to the subsequent processing unit. The processing unit includes an A / D converter and a controller, and finally the wireless transmission module sends the signal to the wireless receiving module through the wireless communication antenna. The wireless receiving module sends the received data to the host computer through the USB communication protocol for data analysis and processing.

[0060] In an exemplary embodiment, the calibration fixture also includes a digital dual-axis horizontal measurement structure 13, the subject 1 to be measured includes an outer ring and an inner ring arranged concentrically, the stress sensor 10 is arranged on the outer ring, and the digital dual-axis horizontal measurement structure 13 is arranged on the inner ring for measuring the horizontality of the subject 1 to be measured.

[0061] The calibration fixture provided in this embodiment integrates the calibration of clamping force, clamping position and clamping horizontality, thereby improving calibration efficiency.

[0062] It should be noted that the digital dual-axis level measurement structure 13 uses a digital display instrument (such as a digital level) to simultaneously measure the levelness in two directions (such as two perpendicular directions, which may both be radial directions of the measured subject 1).

[0063] The digital display dual-axis horizontal measurement structure 13 adopts digital display technology, which can display the measurement results in real time, reduce human reading errors, and improve the accuracy and efficiency of measurement.

[0064] In an exemplary embodiment, the display screen 12 is disposed on the outer ring.

[0065] In an exemplary embodiment, an annular partition wall is provided inside the test body 1 to divide the outer circle and the inner circle.

[0066] In an exemplary embodiment, the radial direction of the measured body 1 includes a first area and a second area, the first area is arranged away from the center of the measured body 1, the first area is concave to form a first groove, and the first groove is used to accommodate the display screen 12. The second area is concave to form a second groove, and the second groove is used to accommodate the digital display dual-axis horizontal measurement structure 13.

[0067] In an exemplary embodiment, a hollow structure is provided between the outer ring and the inner ring.

[0068] The hollow structure can reduce weight and facilitate the placement and removal of the subject 1 to be tested.

[0069] In an exemplary embodiment, the hollow structure is annular, and a connecting rod 14 is provided between the outer ring and the inner ring.

[0070] In an exemplary embodiment, the subject to be tested 1 is made of non-metallic composite material.

[0071] In an exemplary embodiment, the thickness of the subject to be tested 1 is 0.5-1.5 mm, but not limited thereto.

[0072] In an exemplary embodiment, the thickness of the subject to be measured 1 is 1 mm.

[0073] This embodiment also provides a calibration method for performing silicon wafer clamping calibration using the calibration fixture, which specifically includes:

[0074] Clamping the subject to be tested 1;

[0075] Obtaining a resistance change of the stress sensor 10;

[0076] Obtaining parameter signals including clamping force and clamping position according to the signal transmitted by the stress sensor 10;

[0077] The horizontality of the measured object 1 is obtained through the digital display dual-axis horizontal measurement structure 13.

[0078] The calibration fixture supports wireless interconnection and can collect and record calibration data through a dedicated PC software program. It analyzes the real-time optimal parameters through an algorithm and outputs guidance suggestions, such as: ① clamping position deviation value (inscribed rectangle diagram); ② clamping force data; ③ horizontality data (X&Y dual axes). Targeted adjustments can be made based on the displayed real-time data and guidance suggestions, greatly improving work efficiency.

[0079] There are a few points to note:

[0080] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0081] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0082] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0083] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A calibration fixture for calibrating silicon wafer clamping, characterized in that: The device comprises a subject to be measured, wherein the subject to be measured is configured to replace the measurement of parameters of a silicon wafer of the same size, and the shape of the subject to be measured is consistent with the shape of a preset silicon wafer; A plurality of stress sensors are evenly arranged around the body to be tested to measure the clamping force and the clamping position.

2. The calibration jig according to claim 1, characterized in that: The outer peripheral surface of the subject to be measured is covered with a circle of elastic material layer, and the stress sensor is arranged on the outer side of the elastic material layer.

3. The calibration jig according to claim 1, characterized in that: The subject to be measured is circular, and the arrangement positions of the plurality of stress sensors are intersection positions of an inscribed polygon of the subject to be measured and an outer peripheral surface of the subject to be measured.

4. The calibration jig according to claim 1, characterized in that: It also includes a digital display dual-axis horizontal measurement structure, the subject to be measured includes an outer ring and an inner ring arranged concentrically, the stress sensor is arranged on the outer ring, and the digital display dual-axis horizontal measurement structure is arranged on the inner ring for measuring the horizontality of the subject to be measured.

5. The calibration jig according to claim 4, characterized in that: A hollow structure is arranged between the outer ring and the inner ring.

6. The calibration jig according to claim 5, characterized in that: The hollow structure is annular, and a connecting rod is arranged between the outer ring and the inner ring.

7. The calibration jig according to claim 4, characterized in that: A display screen is arranged on the outer ring for displaying parameter information including the clamping force and the clamping position sensed by the stress sensor.

8. The calibration jig according to claim 1, characterized in that: The subject to be tested is made of non-metallic composite material.

9. The calibration jig according to claim 1, characterized in that: The stress sensor is a resistive or capacitive sensor.

10. The calibration jig according to claim 9, characterized in that: The stress sensor is a resistive sensor, and the stress sensor includes a resistive strain film or a resistive strain gauge.

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