Chip manufacturing process stress control system and method

Abstract

The invention relates to the technical field of stress detection, in particular to a chip manufacturing process stress control system and method.The chip manufacturing process stress control system comprises a base, a stress detection device, a scanning objective table, a main conveying belt, an inductive switch, a transfer mechanism, a positioning mechanism, a transfer conveying belt and a recovery conveying belt; the chip is transported to the side surface of the stress detection device, and the transfer mechanism is used for transferring the chip to the scanning objective table; the positioning mechanism is used for positioning the chip to enable the chip to be located at the central position of the scanning objective table, then the stress detection device is used for carrying out stress detection on the chip, and after detection is finished, the chip is selectively transferred to the transfer conveying belt or the recovery conveying belt according to whether the chip reaches the standard or not. And the efficiency is improved, so that the problems of manpower waste and low detection efficiency of the existing stress detection equipment are solved.

Description

Technical Field

[0001] The present invention relates to the field of stress detection technology, and in particular to a chip manufacturing process stress control system and method. Background Art

[0002] During the chip manufacturing and packaging process, due to the differences in thermal expansion coefficients, severe thermal stress will be generated inside the chip as the ambient temperature changes or even the system itself is activated. Thermal stress will not only cause cracking of brittle silicon-based chips, but will also affect their electrical properties due to the piezoresistive effect of silicon materials. Therefore, it is necessary to detect and control the stress during production.

[0003] The existing patent discloses an integrated chip stress detection device (CN207487859U), which includes an upper optical path device, a lower optical path device and a controller, wherein the upper optical path device includes an upper optical path integration box and an upper optical path optomechanical component, wherein the upper optical path optomechanical component includes an image collector fixed in the upper optical path integration box, a rotating table located in the middle of the image collector and a driver connected to the rotating table; the lower optical path device includes a lower optical path integration box, a lower optical path optomechanical component and a lifting column, wherein the lower optical path optomechanical component includes a stage connected to the lower optical path integration box and a light source emitter installed in the lower optical path integration box, a motor-driven height adjustment plate is slidably connected to one side of the lifting column, the upper optical path integration box is installed on the height adjustment plate, and the controller is respectively connected to the driving motors of the height adjustment plate and the stage; the accuracy of the equipment detection is ensured by using the corresponding software for precise control.

[0004] However, the device requires manual placement of the chip, resulting in waste of manpower and low detection efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a chip manufacturing process stress control system and method, aiming to solve the problems of waste of manpower and low detection efficiency of existing stress detection equipment.

[0006] To achieve the above-mentioned objectives, in a first aspect, the present invention provides a chip manufacturing process stress control system, comprising a base, a stress detection device, a scanning stage, a main conveyor belt, an induction switch, a transfer mechanism, a positioning mechanism, a transfer conveyor belt and a recovery conveyor belt, wherein the stress detection device is arranged on the base; the scanning stage is arranged on the stress detection device; the main conveyor belt is arranged at the front end of the stress detection device; the induction switch is arranged on the side of the main conveyor belt; the transfer mechanism is arranged on the side of the main conveyor belt, for transferring the chip to the scanning stage; the positioning mechanism is arranged on both sides of the scanning stage, for positioning the chip; the transfer conveyor belt is arranged on the side of the scanning stage; and the recovery conveyor belt is arranged on the side of the scanning stage away from the transfer conveyor belt.

[0007] Wherein, the transfer mechanism includes a mounting frame, a first electric push rod, a clamping plate, an adjusting motor, a bidirectional lead screw and two transfer plates, the mounting frame is fixed on one side of the base; the first electric push rod is fixed on the side of the mounting frame; the clamping plate is fixed on the output end of the first electric push rod; the adjusting motor is fixed on the side of the clamping plate; the bidirectional lead screw is fixed on the output end of the adjusting motor and is rotatably connected to the clamping plate; the two transfer plates are threadedly connected to the bidirectional lead screw and are slidably connected to the clamping plate.

[0008] Wherein, the transfer mechanism further includes two pressure sensors, and the two pressure sensors are arranged in the two transfer plates.

[0009] Wherein, the positioning mechanism includes a fixed plate, two positioning frames, two second electric push rods and two positioning plates, the fixed plate is fixed on the side of the scanning stage away from the main conveyor belt; the two positioning frames are fixed on both sides of the base; the two second electric push rods are fixed in the two positioning frames; and the two positioning plates are fixed at the output ends of the two second electric push rods.

[0010] Wherein, the positioning mechanism further includes two soft rubber pads, and the two soft rubber pads are fixed on the two positioning plates.

[0011] Wherein, the chip manufacturing process stress control system further includes an infrared sensor, and the infrared sensor is arranged on a side of the scanning stage close to the fixed plate.

[0012] On the other hand, a chip manufacturing process stress control method adopts the chip manufacturing process stress control system described above, including: detecting the chip position and transferring it to a scanning stage through a transfer mechanism; positioning the chip on the scanning stage by a positioning mechanism; scanning and detecting the chip by a stress detection device; and transferring the chip to a transfer conveyor belt or a recovery conveyor belt according to the scanning result.

[0013] The present invention discloses a chip manufacturing process stress control system, wherein the base provides support for the entire device, the stress detection device is provided with an upper optical path device, a lower optical path device, an image collector, etc., to realize automatic image acquisition and calculation, and measure chip stress, the scanning stage is used to place the chip, the main conveyor belt is used to connect the previous process, and transport the chip to the side of the stress detection device, the induction switch is in the same plane as the scanning stage, and is used to sense the chip position and control the main conveyor belt to stop moving; the transfer mechanism is used to transfer the chip to the scanning stage; the positioning mechanism is used to position the chip so that it is at the center of the scanning stage, and then the stress detection device performs stress detection on the chip, and after the detection is completed, the chip is transferred to the transfer conveyor belt or the recycling conveyor belt according to whether it meets the standard, and the qualified chip is transported to the next process through the transfer conveyor belt, and the chip is packaged, and the unqualified chip is recycled to the previous process through the recycling conveyor belt; the present invention realizes assembly line chip stress detection through the cooperation of multiple conveyor belts, reduces manual operation, and greatly improves efficiency, thereby solving the problems of manpower waste and low detection efficiency of existing stress detection equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0015] Figure 1 It is a schematic structural diagram of a chip manufacturing process stress control system according to the first embodiment of the present invention.

[0016] Figure 2 It is a top view of a chip manufacturing process stress control system according to the first embodiment of the present invention.

[0017] Figure 3 It is a cross-sectional view of a stress control system for a chip manufacturing process according to the first embodiment of the present invention.

[0018] Figure 4 It is a flow chart of a stress control method in a chip manufacturing process according to the second embodiment of the present invention.

[0019] Figure 5 It is a schematic structural diagram of a chip manufacturing process stress control system according to the third embodiment of the present invention.

[0020] Figure 6 A chip manufacturing process stress control system according to the third embodiment of the present invention Figure 5 A partial enlargement of detail A.

[0021] 101-base, 102-stress detection device, 103-scanning stage, 104-main conveyor belt, 105-induction switch, 106-transfer conveyor belt, 107-recovery conveyor belt, 108-mounting frame, 109-first electric push rod, 110-clamping plate, 111-adjusting motor, 112-bidirectional lead screw, 113-transfer plate, 114-pressure sensor, 115-fixed plate, 116-positioning frame, 117-second electric push rod, 118-positioning plate, 119-soft rubber pad, 120-infrared sensor, 201-third electric push rod, 202-rubber head, 203-rotating arm. DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0023] For the first embodiment, please refer to Figure 1 to Figure 3 , Figure 1 It is a schematic structural diagram of a chip manufacturing process stress control system according to the first embodiment of the present invention; Figure 2 is a top view of a chip manufacturing process stress control system according to a first embodiment of the present invention; Figure 3 It is a cross-sectional view of a stress control system for a chip manufacturing process according to the first embodiment of the present invention.

[0024] The present invention provides a chip manufacturing process stress control system: comprising a base 101, a stress detection device 102, a scanning stage 103, a main conveyor belt 104, an induction switch 105, a transfer mechanism, a positioning mechanism, a transfer conveyor belt 106, a recovery conveyor belt 107 and an infrared sensor 120, wherein the transfer mechanism comprises a mounting frame 108, a first electric push rod 109, a clamping plate 110, an adjustment motor 111, a bidirectional lead screw 112, two transfer plates 113 and two pressure sensors 114, and the positioning mechanism comprises a fixing plate 115, two positioning frames 116, two second electric push rods 117, two positioning plates 118 and two soft rubber pads 119.

[0025] The above-mentioned solution solves the problems of waste of manpower and low detection efficiency of existing stress detection equipment. It can be understood that the above-mentioned solution can realize assembly-line chip stress detection through the cooperation of multiple conveyor belts, reduce manual operations, and greatly improve efficiency.

[0026] In this embodiment, the stress detection device 102 is arranged on the base 101; the scanning stage 103 is arranged on the stress detection device 102; the main conveyor belt 104 is arranged at the front end of the stress detection device 102; the induction switch 105 is arranged on the side of the main conveyor belt 104; the transfer mechanism is arranged on the side of the main conveyor belt 104, for transferring the chip to the scanning stage 103; the positioning mechanism is arranged on both sides of the scanning stage 103, for positioning the chip; the transfer conveyor belt 106 is arranged on the side of the scanning stage 103; the recovery conveyor belt 107 is arranged on the side of the scanning stage 103 away from the transfer conveyor belt 106; the base 101 provides support for the entire device, the stress detection device 102 is provided with an upper optical path device, a lower optical path device, an image collector, etc., to realize automatic image acquisition and calculation, and measure chip stress, the scanning stage 103 is used to place the chip, the main The conveyor belt 104 is used to connect the previous process and transport the chip to the side of the stress detection device 102. The induction switch 105 is in the same plane as the scanning stage 103 and is used to sense the chip position and control the main conveyor belt 104 to stop moving; the transfer mechanism is used to transfer the chip to the scanning stage 103; the positioning mechanism is used to position the chip so that it is at the center of the scanning stage 103, and then the stress detection device 102 performs stress detection on the chip. After the detection, it is selected to be transferred to the transfer conveyor belt 106 or the recovery conveyor belt 107 according to whether it meets the standards. The qualified chips are transported to the next process through the transfer conveyor belt 106 to be packaged, and the unqualified chips are recycled to the previous process through the recovery conveyor belt 107; the present invention realizes assembly line chip stress detection through the cooperation of multiple conveyor belts, reduces manual operation, and greatly improves efficiency, thereby solving the problems of manpower waste and low detection efficiency of existing stress detection equipment.

[0027] The mounting frame 108 is fixed to one side of the base 101; the first electric push rod 109 is fixed to the side of the mounting frame 108; the clamping plate 110 is fixed to the output end of the first electric push rod 109; the adjusting motor 111 is fixed to the side of the clamping plate 110; the bidirectional lead screw 112 is fixed to the output end of the adjusting motor 111 and is rotatably connected to the clamping plate 110; the two transfer plates 113 are threadedly connected to the bidirectional lead screw 112 and are slidably connected to the clamping plate 110; the mounting frame 108 is used to mount The first electric push rod 109 is installed, and the clamping plate 110 is fixed to the output end of the first electric push rod 109. The clamping plate 110 is used to install the adjusting motor 111 and the bidirectional lead screw 112. The adjusting motor 111 drives the bidirectional lead screw to rotate, thereby adjusting the distance between the two transfer plates 113. The two transfer plates 113 make reciprocating linear motion under the restriction of the clamping plate 110. When the distance between them is reduced, they can clamp the two sides of the chip. At this time, the first electric push rod 109 is extended to deliver the chip to the scanning stage 103.

[0028] Secondly, the two pressure sensors 114 are arranged in the two transfer plates 113; the pressure sensors 114 are used to determine whether the two transfer plates 113 clamp the chip, and control the regulating motor 111 to stop after a certain pressure is reached.

[0029] Again, the fixed plate 115 is fixed on the side of the scanning stage 103 away from the main conveyor belt 104; the two positioning frames 116 are fixed on both sides of the base 101; the two second electric push rods 117 are fixed in the two positioning frames 116; the two positioning plates 118 are fixed at the output ends of the two second electric push rods 117; the fixed plate 115 is used to position the transferred chip to move it to the specified position, the two positioning frames 116 are used to install the two second electric push rods 117, and the two second electric push rods 117 are used to control the two positioning plates 118 to push out, clamp the chip from the left and right sides, so that it is in the center of the scanning stage 103; at the same time, when the stress detection result comes out, the two positioning plates 118 are used in combination to transfer the chip to the transfer conveyor belt 106 or the recovery conveyor belt 107, thereby achieving the effect of automatic unloading.

[0030] Then, the two soft rubber pads 119 are fixed on the two positioning plates 118 ; the two soft rubber pads 119 are used to soften the positioning plates 118 to avoid squeezing and damaging the chip during the transfer process.

[0031] Finally, the infrared sensor 120 is disposed on one side of the scanning stage 103 close to the fixing plate 115 ; the infrared sensor 120 is used to sense whether the chip moves to a specified position when the first electric push rod 109 is pushed out.

[0032] During use, the base 101 provides support for the entire device. The stress detection device 102 is provided with an upper optical path device, a lower optical path device, an image collector, etc., to automatically collect images and perform calculations to measure chip stress. The scanning stage 103 is used to place chips. The main conveyor belt 104 is used to connect to the previous process and transport the chips to the side of the stress detection device 102. The induction switch 105 is in the same plane as the scanning stage 103 and is used to sense the chip position and control the main conveyor belt 104 to stop moving; the transfer mechanism is used to transfer the chip to the scanning stage 103; the positioning mechanism is used to position the chip so that it is on the scanning stage 103, and then the stress detection device 102 performs stress detection on the chip. After the detection, it is selected to be transferred to the transfer conveyor belt 106 or the recovery conveyor belt 107 according to whether it meets the standard. The qualified chips are transported to the next process through the transfer conveyor belt 106 and packaged. The unqualified chips are recycled to the previous process through the recovery conveyor belt 107; the mounting frame 108 is used to install the first electric push rod 109, and the output end of the first electric push rod 109 is fixed with the clamping plate 110, and the clamping plate 110 is used to install the adjusting motor 111 and the bidirectional screw 112. The adjusting motor 111 drives the bidirectional screw to rotate, thereby adjusting the two rotating shafts. The two transfer plates 113 make reciprocating linear motion under the restriction of the clamping plate 110. When the distance between them is reduced, they can clamp the two sides of the chip. At this time, the first electric push rod 109 extends to send the chip to the scanning stage 103; the pressure sensor 114 is used to determine whether the two transfer plates 113 clamp the chip, and control the adjustment motor 111 to stop after reaching a certain pressure; the fixed plate 115 is used to position the transferred chip to move it to the specified position, and the two positioning frames 116 are used to install the two second electric push rods 117, and the two second electric push rods 117 are used to control the two positioning plates 118 to push out and clamp the chip from the left and right sides. Hold the chip so that it is at the center of the scanning stage 103; at the same time, when the stress detection result comes out, the two positioning plates 118 are used in combination to transfer the chip to the transfer conveyor belt 106 or the recovery conveyor belt 107 to achieve the effect of automatic unloading; the two soft rubber pads 119 are used to soften the positioning plates 118 to avoid squeezing and damaging the chip during the transfer process; the infrared sensor 120 is used to sense whether the chip moves to the specified position when the first electric push rod 109 is pushed out; the present invention realizes assembly line chip stress detection through the cooperation of multiple conveyor belts, reduces manual operation, and greatly improves efficiency, thereby solving the problems of manpower waste and low detection efficiency of existing stress detection equipment.

[0033] For the second embodiment, please refer to Figure 4 , Figure 4 It is a flow chart of a stress control method in a chip manufacturing process according to the second embodiment of the present invention.

[0034] Based on the first embodiment, a chip manufacturing process stress control method of the present invention adopts the chip manufacturing process stress control system described above, including: S1: detecting the chip position and transferring it to the scanning stage 103 through a transfer mechanism; this step is used to realize the automatic placement of the chip on the scanning stage 103.

[0035] S2: The positioning mechanism positions the chip on the scanning stage 103; this step realizes the positioning of the chip, making its detection more accurate.

[0036] S3: The stress detection device 102 performs scanning detection on the chip; this step is a specific scanning of the chip.

[0037] S4: According to the scanning result, the chip is transferred to the transfer conveyor belt 106 or the recovery conveyor belt 107; the transfer conveyor belt 106 or the recovery conveyor belt 107 is arranged on both sides of the scanning stage 103, and the transfer can be achieved by the positioning mechanism.

[0038] For the third embodiment, please refer to Figure 5 and Figure 6 , Figure 5 is a schematic structural diagram of a chip manufacturing process stress control system according to a third embodiment of the present invention; Figure 6 A chip manufacturing process stress control system according to the third embodiment of the present invention Figure 5 A partial enlargement of detail A.

[0039] On the basis of the second embodiment, a chip manufacturing process stress control system and method of the present invention further includes a plurality of third electric push rods 201 , a plurality of rubber heads 202 and a plurality of rotating arms 203 .

[0040] A plurality of the third electric push rods 201 are arranged in the scanning stage 103; a plurality of the rubber heads 202 are arranged at the output end of the third electric push rods 201; the third electric push rods 201 are arranged vertically, and when they are extended, they can support the chip through the rubber heads 202 to avoid damaging the components on the chip, and can also facilitate the positioning plate 118 to clamp it again and transfer it.

[0041] The rotating arm 203 is rotatably arranged at the output end of the third electric push rod 201; the rubber head 202 has a chamfer and is fixed on the rotating arm 203. The rotating arm 203 provides the rubber head 202 with a rotating ability. When the third electric push rod 201 is pushed out, the chamfer of the rubber head 202 can enable it to avoid the components on the chip and rest against the chip plate to achieve more stable support.

[0042] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A chip manufacturing process stress control system, characterized in that: It includes a base, a stress detection device, a scanning stage, a main conveyor belt, an induction switch, a transfer mechanism, a positioning mechanism, a transfer conveyor belt and a recovery conveyor belt, wherein the stress detection device is arranged on the base; the scanning stage is arranged on the stress detection device; the main conveyor belt is arranged at the front end of the stress detection device; the induction switch is arranged on the side of the main conveyor belt; the transfer mechanism is arranged on the side of the main conveyor belt, and is used to transfer the chip to the scanning stage; the positioning mechanism is arranged on both sides of the scanning stage, and is used to position the chip; the transfer conveyor belt is arranged on the side of the scanning stage; and the recovery conveyor belt is arranged on the side of the scanning stage away from the transfer conveyor belt.

2. A chip manufacturing process stress control system as claimed in claim 1, characterized in that: The transfer mechanism includes a mounting frame, a first electric push rod, a clamping plate, an adjusting motor, a bidirectional lead screw and two transfer plates. The mounting frame is fixed on one side of the base; the first electric push rod is fixed on the side of the mounting frame; the clamping plate is fixed on the output end of the first electric push rod; the adjusting motor is fixed on the side of the clamping plate; the bidirectional lead screw is fixed on the output end of the adjusting motor and is rotatably connected to the clamping plate; the two transfer plates are threadedly connected to the bidirectional lead screw and are slidably connected to the clamping plate.

3. A chip manufacturing process stress control system as claimed in claim 2, characterized in that: The transfer mechanism further includes two pressure sensors, and the two pressure sensors are arranged in the two transfer plates.

4. A chip manufacturing process stress control system as claimed in claim 3, characterized in that: The positioning mechanism includes a fixed plate, two positioning frames, two second electric push rods and two positioning plates, wherein the fixed plate is fixed to the side of the scanning stage away from the main conveyor belt; the two positioning frames are fixed on both sides of the base; the two second electric push rods are fixed in the two positioning frames; and the two positioning plates are fixed to the output ends of the two second electric push rods.

5. A chip manufacturing process stress control system as claimed in claim 4, characterized in that: The positioning mechanism also includes two soft rubber pads, and the two soft rubber pads are fixed on the two positioning plates.

6. A chip manufacturing process stress control system as claimed in claim 5, characterized in that: The chip manufacturing process stress control system also includes an infrared sensor, which is arranged on a side of the scanning stage close to the fixed plate.

7. A chip manufacturing process stress control method, using a chip manufacturing process stress control system as claimed in any one of claims 1 to 6, It is characterized in that It includes: detecting the position of the chip and transferring it to the scanning stage through a transfer mechanism; The positioning mechanism positions the chip on the scanning stage; The stress detection device performs scanning detection on the chip; Depending on the scan results, the chips are transferred to a transfer conveyor or a recovery conveyor.

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