Intelligent power module semiconductor packaging core-pulling mechanism

Abstract

The invention discloses an intelligent power module semiconductor packaging core-pulling mechanism, and relates to the technical field of core-pulling molding, the intelligent power module semiconductor packaging core-pulling mechanism comprises a base plate and a mold, and the top end of the mold is provided with a placing groove and an ejection unit; a mounting unit and a moving unit. Through the arrangement of the ejection unit, the core-pulling cross rod slides in the sliding groove to push the core-pulling push plate to move upwards, and the core-pulling ejector rod moves to eject the intelligent power module out; after the traditional plastic packaging and glue filling, the whole product packaging can be completed without adding a secondary glue dispensing process, so that the production efficiency is greatly improved; moreover, the reliability of a one-time glue pouring structure is higher than that of a product with two-time glue pouring, two resin materials are adopted for two-time glue pouring, and in order to save the cost of investment on secondary dispensing equipment and secondary dispensing resin consumables in a packaging factory, the packaging cost is greatly saved due to a one-time core-pulling forming process, and the market competitiveness of the product is improved.

Description

Technical Field

[0001] The invention relates to the technical field of core pulling molding, in particular to a core pulling mechanism for semiconductor packaging of an intelligent power module. Background Art

[0002] Intelligent power module is a powerful integrated circuit module that can be used to control and drive high-power electronic devices, such as AC motor drives, frequency converters, inverters, etc. It is a highly integrated semiconductor device, usually including multiple functional modules such as power switches, drive circuits, protection circuits and control circuits. It is widely used in digital signal processing, network communication and image processing. The module can effectively achieve high-speed data transmission, solve signal jitter problems, and improve system reliability and stability. The basic structure of the intelligent power module includes multiple IGBT devices, drive circuits, protection circuits and heat dissipation structures. These components work together to enable the intelligent power module to play a key role in complex power applications.

[0003] When producing intelligent power modules, a core pulling plastic sealing molding process is required in the plastic sealing process. After the traditional plastic sealing glue pouring, a secondary glue dispensing process needs to be added to complete the packaging of the entire product, which reduces the production efficiency. Therefore, an intelligent power module semiconductor packaging core pulling mechanism is provided. Summary of the invention

[0004] The purpose of the present invention is to provide an intelligent power module semiconductor packaging core pulling mechanism to solve the problem that after the traditional plastic encapsulation and glue pouring, a secondary glue dispensing process needs to be added to complete the packaging of the entire product, which reduces the production efficiency.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a core pulling mechanism for semiconductor packaging of intelligent power module, comprising a backing plate and a mold, the top of the mold is provided with a placement groove, the intelligent power module in the placement groove is ejected by an ejection unit, the ejection unit comprises a slide rail, the top of the backing plate is provided with a slide rail, a core pulling push plate is provided above the slide rail, the mold is located above the core pulling push plate, the top of the core pulling push plate is fixedly connected with a core pulling push rod, the bottom end of the inner wall of the placement groove is provided with a core pulling push rod for the core pulling push plate, and the core pulling push rod is provided at the bottom end of the inner wall of the placement groove. The circular hole for the core-pulling push rod to slide, a pulley is installed at the bottom end of the inner wall of the slide rail, the inner wall of the slide rail is slidably connected to the core-pulling cross bar, the bottom end of the core-pulling push plate is provided with a slide groove for the core-pulling cross bar to slide, a semicircular block is fixedly connected to the top end of the inner wall of the slide groove, a protrusion is fixedly connected to the top end of the core-pulling cross bar, and one end of the core-pulling cross bar is fixedly connected to a pull rod; the slide rail, the core-pulling push plate and the mold are installed by an installation unit, and the core-pulling cross bar is driven to move by a moving unit.

[0006] As a further scheme of the present invention: the mounting unit includes a mounting groove, the mounting groove is opened at the top of the pad, the inner wall of the mounting groove is provided with a fixing groove, the two sides of the slide rail are fixedly connected with mounting seats, the top of the mounting seat is fixedly connected with a connecting rod, the two sides of the core pulling push plate are fixedly connected with a connecting frame, the two sides of the mold are fixedly connected with a connecting seat, the inner wall of the connecting seat is provided with a vertical groove, the inner wall of the vertical groove is fixedly connected with a clamping block, the mounting seat and the connecting rod are internally slidably connected with a fixed frame, the outer wall of the fixed frame is provided with a clamping groove, the outer wall of the mounting seat is rotatably connected with a rotating block, and one end of the rotating block is fixedly connected with a first threaded rod running through the fixed frame.

[0007] As a further solution of the present invention: the moving unit includes an annular groove, the annular groove is opened at one end of the pull rod, the top end of the pad is located between the two pull rods and has a displacement groove, the inner wall of the displacement groove is slidably connected to a displacement seat, a motor is installed at one end of the pad, the output end of the motor is connected to a second threaded rod, the second threaded rod runs through the displacement seat, the interior of the displacement seat is symmetrically slidably connected to an insertion block extending from the displacement seat, a first spring is connected between the insertion block and the displacement seat, and one end of the insertion block is rotatably connected There is a connecting rod, one end of which is rotatably connected to a lower pressure block, and the lower pressure block is slidably connected to the inside of the displacement seat and extends to the top of the displacement seat, one side outer wall of the core-pulling cross bar is fixedly connected to a positioning plate, the top of the pad is located between the two positioning plates and is fixedly connected to a fixed seat, the top of the fixed seat is fixedly connected to a vertical plate, the outer wall of the vertical plate is slidably connected to a lower pressure frame, and the two sides of the lower pressure frame are fixedly connected to limiting frames, the inside of the vertical plate is symmetrically slidably connected to an L-shaped block extending from the vertical plate, and a second spring is connected between the two L-shaped blocks.

[0008] As a further solution of the present invention: the inner wall of the installation groove fits with the outer wall of the installation seat, and the inner wall of the fixing groove fits with the bottom outer wall of the fixing frame.

[0009] As a further solution of the present invention: a first threaded hole is formed on an outer wall of the fixing frame, and the first threaded hole matches the first threaded rod.

[0010] As a further solution of the present invention: the inner wall of the connecting frame is in contact with the outer wall of the connecting rod, and the inner wall of the connecting seat is in contact with the outer wall of the connecting rod.

[0011] As a further solution of the present invention: the top outer wall of the fixing frame is in contact with the inner wall of the vertical groove, and the inner wall of the clamping groove is in contact with the outer wall of the clamping block.

[0012] As a further solution of the present invention: a square groove is formed at the top of the lower pressing frame, the inner wall of the square groove is fitted with the outer wall of the vertical plate, and the inner wall of the limiting frame is fitted with the outer wall of the positioning plate.

[0013] As a further solution of the present invention: an outer wall of one end of the insert block is in contact with an inner wall of the annular groove.

[0014] As a further solution of the present invention: the outer wall of the bottom of the displacement seat is in contact with the inner wall of the displacement groove, and a second threaded hole is formed on the outer wall of the displacement seat, and the second threaded hole matches the second threaded rod.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. By setting the ejection unit, the core-pulling cross bar slides in the slide slot, pushing the core-pulling push plate to move upward, and the core-pulling ejector bar is displaced to eject the intelligent power module; after the traditional plastic encapsulation, there is no need to add a secondary dispensing process to complete the entire product packaging, which not only greatly improves the production efficiency; but also the reliability of the product with one-time glue pouring is higher than that of the product with two-time glue pouring because the two-time glue pouring uses two kinds of resin materials, and in order to save the packaging factory from investing in secondary dispensing equipment and secondary dispensing resin consumables, the one-time core-pulling molding process greatly saves the packaging cost and improves the product market competitiveness; 2. By setting up the installation unit, during installation, the installation seat is inserted into the installation groove, the connecting frame and the connecting seat slide on the outer wall of the connecting rod, and the core-pulling cross bar is connected to the slide rail and the slide groove. At this time, the height of the mold can be adjusted, and then the rotating block is rotated to drive the fixed frame to move. The fixed frame is displaced and inserted into the fixed groove to fix the installation seat. At the same time, the clamping block is engaged into the clamping groove to fix the position of the mold, which is convenient for installing the slide rail, the core-pulling push plate and the mold. The height of the mold can be adjusted to meet the molds with different depths of placement grooves, ensuring that the top of the core-pulling ejector rod is located at the bottom of the inner wall of the placement groove; 3. By setting a moving unit, when the core-pulling cross bar is moved, the lower pressure frame is pushed to reset, the limit frame is separated from the positioning plate, and the fixation of the core-pulling cross bar is cancelled. At the same time, the plug block is engaged into the annular groove by the elastic force of the first spring, and the motor drives the displacement seat to slide. The displacement of the displacement seat drives the pull rod to move through the plug block, and the displacement of the pull rod drives the core-pulling cross bar to move, which is convenient for moving the core-pulling cross bar. When plastic sealing and glue pouring are performed, the position of the core-pulling cross bar is fixed to prevent the core-pulling cross bar from moving during plastic sealing and glue pouring, which affects the effect of plastic sealing and glue pouring. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the installation of the core-pulling cross bar of the present invention; Figure 3 It is a partial cross-sectional view of the slide rail and the core-pulling push plate of the present invention; Figure 4 It is a schematic diagram of the installation of the mounting base of the present invention; Figure 5 It is a structural schematic diagram of the installation slot of the present invention; Figure 6 It is a schematic diagram of the installation of the connecting socket of the present invention; Figure 7 is a cross-sectional view of the connecting seat of the present invention; Figure 8 is a cross-sectional view of the mounting seat and the connecting rod of the present invention; Fig. 9 It is a schematic diagram of the installation of the displacement seat of the present invention; Fig.10 is a cross-sectional view of the displacement seat of the present invention; Fig.11 It is a cross-sectional view of a vertical plate of the present invention.

[0017] In the figure: 1, pad; 2, mold; 3, placement groove; 4, ejector unit; 401, slide rail; 402, core-pulling push plate; 403, core-pulling ejector rod; 404, round hole; 405, pulley; 406, core-pulling cross bar; 407, convex block; 408, slide groove; 409, semicircular block; 410, pull rod; 5, installation unit; 501, installation groove; 502, fixing groove; 503, installation seat; 504, connecting rod; 505, connecting frame; 506, connecting seat; 507, vertical groove; 508, card Block; 509, fixed frame; 510, slot; 511, rotating block; 512, first threaded rod; 6, moving unit; 601, annular groove; 602, displacement groove; 603, displacement seat; 604, motor; 605, second threaded rod; 606, plug-in block; 607, first spring; 608, connecting rod; 609, pressing block; 610, positioning plate; 611, fixed seat; 612, vertical plate; 613, pressing frame; 614, limiting frame; 615, L-shaped block; 616, second spring. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following is an explanation of an embodiment of the present invention based on the overall structure of the present invention.

[0020] See also Figures 1 to 11 In an embodiment of the present invention, a core pulling mechanism for semiconductor packaging of an intelligent power module includes a backing plate 1 and a mold 2. A placement groove 3 is provided at the top of the mold 2. The intelligent power module in the placement groove 3 is ejected by an ejection unit 4. The ejection unit 4 includes a slide rail 401. The slide rail 401 is installed at the top of the backing plate 1. A core pulling push plate 402 is provided above the slide rail 401. The mold 2 is located above the core pulling push plate 402. A core pulling push rod 403 is fixedly connected to the top of the core pulling push plate 402. A round hole 403 is provided at the bottom of the inner wall of the placement groove 3 for the core pulling push rod 403 to slide. 4. A pulley 405 is installed at the bottom end of the inner wall of the slide rail 401, and a core-pulling cross bar 406 is slidably connected to the inner wall of the slide rail 401. A slide groove 408 for sliding the core-pulling cross bar 406 is provided at the bottom end of the core-pulling push plate 402. A semicircular block 409 is fixedly connected to the top end of the inner wall of the slide groove 408. A protrusion 407 is fixedly connected to the top end of the core-pulling cross bar 406. A pull rod 410 is fixedly connected to one end of the core-pulling cross bar 406. The slide rail 401, the core-pulling push plate 402 and the mold 2 are installed by the installation unit 5, and the core-pulling cross bar 406 is driven to move by the moving unit 6.

[0021] In this embodiment: the core pulling cross bar 406 is located between the slide rail 401 and the core pulling push plate 402, the core pulling cross bar 406 is slidably connected in the slide groove 408, and the semicircular block 409 is not in contact with the protrusion 407, the top end of the core pulling ejector rod 403 is located at the bottom end of the inner wall of the placement groove 3, the intelligent power module is placed in the placement groove 3 for plastic sealing and glue pouring operation, after completion, the core pulling cross bar 406 is driven to move by the moving unit 6, the core pulling cross bar 406 slides in the slide groove 408, drives the protrusion 407 to contact the semicircular block 409, pushes the semicircular block 409 and the core pulling push plate 402 to move upward, the displacement of the core pulling push plate 402 drives the core pulling ejector rod 403 to move, and the displacement of the core pulling ejector rod 403 ejects the intelligent power module; After the traditional plastic encapsulation and glue pouring, there is no need to add a secondary glue dispensing process to complete the entire product packaging, which not only greatly improves the production efficiency; but also the reliability of the product with one glue pouring structure is higher than that with two glue pouring because the two glue pourings are two kinds of resin materials, and in order to save the packaging factory to invest in secondary glue dispensing equipment and secondary glue dispensing resin consumables costs, the one-time core pulling molding process greatly saves packaging costs and improves product market competitiveness.

[0022] Please refer to Figures 4 to 8 The mounting unit 5 includes a mounting groove 501, which is opened at the top of the pad 1, and a fixing groove 502 is opened on the inner wall of the mounting groove 501. Mounting seats 503 are fixedly connected on both sides of the slide rail 401, and a connecting rod 504 is fixedly connected to the top of the mounting seat 503. Connecting frames 505 are fixedly connected on both sides of the core pulling push plate 402, and connecting seats 506 are fixedly connected on both sides of the mold 2. A vertical groove 507 is opened on the inner wall of the connecting seat 506, and a clamping block 508 is fixedly connected to the inner wall of the vertical groove 507. A fixing frame 509 is slidably connected to the inside of the mounting seat 503 and the connecting rod 504, and a clamping groove 510 is opened on the outer wall of the fixing frame 509. The outer wall of the mounting seat 503 is rotatably connected to a rotating block 511, and one end of the rotating block 511 is fixedly connected to a first threaded rod 512 that runs through the fixing frame 509.

[0023] In this embodiment: during installation, the mounting seat 503 is inserted into the mounting groove 501, the slide rail 401 is fitted with the top of the pad 1, and then the core-pulling push plate 402 and the mold 2 are placed on the top of the slide rail 401 in turn, the connecting frame 505 and the connecting seat 506 slide on the outer wall of the connecting rod 504, and the core-pulling cross bar 406 is connected to the slide rail 401 and the slide groove 408. At this time, the height of the mold 2 can be adjusted to ensure that the top of the core-pulling push rod 403 is located at the bottom end of the inner wall of the placement groove 3, and then the rotating block 511 is rotated, and the rotation of the rotating block 511 drives the first threaded rod 512 to rotate, and the first The threaded rod 512 rotates to drive the fixed frame 509 to move, and the fixed frame 509 is moved and inserted into the fixed groove 502 to fix the mounting seat 503, thereby fixing the position of the slide rail 401. At the same time, the fixed frame 509 is moved into the vertical groove 507, and the clamping block 508 is engaged into the clamping groove 510 to fix the position of the mold 2, which is convenient for installing the slide rail 401, the core pulling push plate 402 and the mold 2, and the height of the mold 2 can be adjusted to meet the needs of molds 2 with placement grooves 3 of different depths, ensuring that the top end of the core pulling push rod 403 is located at the bottom end of the inner wall of the placement groove 3.

[0024] Please refer to Figures 9 to 11 The moving unit 6 includes an annular groove 601, which is provided at one end of the pull rod 410. A displacement groove 602 is provided at the top of the pad 1 between the two pull rods 410. A displacement seat 603 is slidably connected to the inner wall of the displacement groove 602. A motor 604 is installed at one end of the pad 1. A second threaded rod 605 is connected to the output end of the motor 604. The second threaded rod 605 runs through the displacement seat 603. An insert block 606 extending from the displacement seat 603 is symmetrically slidably connected inside the displacement seat 603. A first spring 607 is connected between the insert block 606 and the displacement seat 603. A connecting rod 608 is rotatably connected to one end of the insert block 606. The connecting rod 60 One end of 8 is rotatably connected to a lower pressure block 609, and the lower pressure block 609 is slidably connected to the inside of the displacement seat 603 and extends to the top of the displacement seat 603. The outer wall of one side of the core-pulling cross bar 406 is fixedly connected to a positioning plate 610, and the top of the pad 1 is located between the two positioning plates 610 and is fixedly connected to a fixed seat 611, and the top of the fixed seat 611 is fixedly connected to a vertical plate 612, and the outer wall of the vertical plate 612 is slidably connected to a lower pressure frame 613, and both sides of the lower pressure frame 613 are fixedly connected to a limiting frame 614, and the interior of the vertical plate 612 is symmetrically slidably connected to an L-shaped block 615 extending from the vertical plate 612, and a second spring 616 is connected between the two L-shaped blocks 615.

[0025] In this embodiment: when plastic encapsulation and glue pouring are performed, the L-shaped block 615 is pushed to move, which causes the second spring 616 to be squeezed. After the L-shaped block 615 is separated, the lower pressing frame 613 is pushed downward, and the lower pressing frame 613 moves downward to drive the limit frame 614 to move and engage with the positioning plate 610, thereby fixing the position of the core-pulling cross bar 406 to prevent the core-pulling cross bar 406 from moving during plastic encapsulation and glue pouring, thereby affecting the effect of plastic encapsulation and glue pouring. At the same time, the displacement of the lower pressing frame 613 drives the lower pressing block 609 to move downward, and the displacement of the lower pressing block 609 drives the plug-in block 606 to move out of the annular groove 601 through the connecting rod 608, thereby causing the first spring 607 to be squeezed. When the core pulling cross bar 406 is moved, the lower pressure frame 613 is pushed to reset, and then the L-shaped block 615 is displaced to the bottom end of the lower pressure frame 613 by the elastic force of the second spring 616 to support the lower pressure frame 613, and the limit frame 614 is separated from the positioning plate 610, and the fixation of the core pulling cross bar 406 is cancelled. At the same time, the insert block 606 is engaged into the annular groove 601 by the elastic force of the first spring 607, and the motor 604 is started. The operation of the motor 604 drives the second threaded rod 605 to rotate, and the rotation of the second threaded rod 605 drives the displacement seat 603 to slide in the displacement groove 602. The displacement of the displacement seat 603 drives the pull rod 410 to move through the insert block 606, and the displacement of the pull rod 410 drives the core pulling cross bar 406 to move, so as to facilitate the movement operation of the core pulling cross bar 406.

[0026] Please refer to Figures 4 to 8 The inner wall of the mounting groove 501 is in contact with the outer wall of the mounting seat 503 , and the inner wall of the fixing groove 502 is in contact with the bottom outer wall of the fixing frame 509 .

[0027] In this embodiment, the mounting seat 503 is inserted into the mounting groove 501 , and the fixing frame 509 is displaced and inserted into the fixing groove 502 to fix the mounting seat 503 .

[0028] Please refer to Figures 4 to 8 A first threaded hole is formed on the outer wall of the fixing frame 509 , and the first threaded hole matches the first threaded rod 512 .

[0029] In this embodiment, the rotating block 511 is rotated, the rotating block 511 drives the first threaded rod 512 to rotate, and the first threaded rod 512 drives the fixing frame 509 to move.

[0030] Please refer to Figures 4 to 8 The inner wall of the connecting frame 505 fits with the outer wall of the connecting rod 504 , and the inner wall of the connecting seat 506 fits with the outer wall of the connecting rod 504 .

[0031] In this embodiment: the connecting frame 505 and the connecting seat 506 move along the connecting rod 504, so as to limit the moving direction of the core pulling push plate 402 and the mold 2.

[0032] Please refer to Figures 4 to 8 The top outer wall of the fixing frame 509 fits with the inner wall of the vertical groove 507 , and the inner wall of the card slot 510 fits with the outer wall of the card block 508 .

[0033] In this embodiment, the fixing frame 509 is displaced into the vertical groove 507 , and the clamping block 508 is clamped into the clamping groove 510 , thereby fixing the position of the mold 2 .

[0034] Please refer to Figures 9 to 11 A square groove is formed at the top of the lower pressing frame 613 , the inner wall of the square groove is in contact with the outer wall of the vertical plate 612 , and the inner wall of the limiting frame 614 is in contact with the outer wall of the positioning plate 610 .

[0035] In this embodiment: the L-shaped block 615 is pushed to move, causing compression on the second spring 616. After the L-shaped block 615 is separated, the lower pressure frame 613 is pushed downward. The lower pressure frame 613 moves downward to drive the limit frame 614 to move and engage with the positioning plate 610 to fix the position of the core pulling cross bar 406.

[0036] Please refer to Figures 9 to 11 The outer wall of one end of the plug block 606 fits with the inner wall of the annular groove 601 , the bottom outer wall of the displacement seat 603 fits with the inner wall of the displacement groove 602 , and a second threaded hole is opened on the outer wall of the displacement seat 603 , and the second threaded hole matches the second threaded rod 605 .

[0037] In this embodiment: the insert block 606 is engaged into the annular groove 601 under the elastic force of the first spring 607, the motor 604 is started, the motor 604 drives the second threaded rod 605 to rotate, the second threaded rod 605 rotates to drive the displacement seat 603 to slide in the displacement groove 602, and the displacement seat 603 is displaced by driving the pull rod 410 to displace through the insert block 606.

[0038] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A core pulling mechanism for semiconductor packaging of an intelligent power module, comprising a backing plate (1) and a mold (2), wherein a placement groove (3) is provided at the top of the mold (2), and the characteristics are: The intelligent power module in the placement groove (3) is ejected through an ejection unit (4), the ejection unit (4) comprising a slide rail (401), the top end of the pad (1) being provided with a slide rail (401), a core pulling push plate (402) being provided above the slide rail (401), the mold (2) being located above the core pulling push plate (402), the top end of the core pulling push plate (402) being fixedly connected with a core pulling push rod (403), a circular hole (404) for the core pulling push rod (403) to slide is provided at the bottom end of the inner wall of the placement groove (3), a pulley (405) is provided at the bottom end of the inner wall of the slide rail (401), and the slide rail ( The inner wall of the core pulling cross bar (401) is slidably connected to a core pulling cross bar (406), the bottom end of the core pulling push plate (402) is provided with a slide groove (408) for the core pulling cross bar (406) to slide, the top end of the inner wall of the slide groove (408) is fixedly connected to a semicircular block (409), the top end of the core pulling cross bar (406) is fixedly connected to a protrusion (407), and one end of the core pulling cross bar (406) is fixedly connected to a pull rod (410); the slide rail (401), the core pulling push plate (402) and the mold (2) are installed by means of an installation unit (5), and the core pulling cross bar (406) is moved by means of a moving unit (6).

2. The core pulling mechanism for semiconductor packaging of an intelligent power module according to claim 1, characterized in that: The mounting unit (5) comprises a mounting groove (501), the mounting groove (501) is provided at the top of the pad (1), the inner wall of the mounting groove (501) is provided with a fixing groove (502), the two sides of the slide rail (401) are fixedly connected with mounting seats (503), the top of the mounting seat (503) is fixedly connected with a connecting rod (504), the two sides of the core pulling push plate (402) are fixedly connected with connecting frames (505), the two sides of the mold (2) are fixedly connected with connecting seats (506), the connecting A vertical groove (507) is formed on the inner wall of the receiving seat (506); a clamping block (508) is fixedly connected to the inner wall of the vertical groove (507); a fixing frame (509) is slidably connected to the inside of the mounting seat (503) and the connecting rod (504); a clamping groove (510) is formed on the outer wall of the fixing frame (509); a rotating block (511) is rotatably connected to the outer wall of the mounting seat (503); and one end of the rotating block (511) is fixedly connected to a first threaded rod (512) that passes through the fixing frame (509).

3. The core pulling mechanism for semiconductor packaging of an intelligent power module according to claim 2, characterized in that: The moving unit (6) comprises an annular groove (601), wherein the annular groove (601) is provided at one end of the pull rod (410), a displacement groove (602) is provided at the top end of the pad (1) between the two pull rods (410), a displacement seat (603) is slidably connected to the inner wall of the displacement groove (602), a motor (604) is installed at one end of the pad (1), a second threaded rod (605) is connected to the output end of the motor (604), the second threaded rod (605) passes through the displacement seat (603), an insert block (606) extending from the displacement seat (603) is symmetrically slidably connected inside the displacement seat (603), a first spring (607) is connected between the insert block (606) and the displacement seat (603), and one end of the insert block (606) is rotatably connected to a connecting rod (608), One end of the connecting rod (608) is rotatably connected to a lower pressing block (609), and the lower pressing block (609) is slidably connected to the inside of the displacement seat (603) and extends to the top of the displacement seat (603). A positioning plate (610) is fixedly connected to an outer wall of one side of the core-pulling cross bar (406). The top of the pad (1) is located between the two positioning plates (610) and is fixedly connected to a fixed seat (611). The top of the fixed seat (611) is fixedly connected to a vertical plate (612). The outer wall of the vertical plate (612) is slidably connected to a lower pressing frame (613). Both sides of the lower pressing frame (613) are fixedly connected to limiting frames (614). The inside of the vertical plate (612) is symmetrically slidably connected to an L-shaped block (615) extending from the vertical plate (612), and a second spring (616) is connected between the two L-shaped blocks (615).

4. The core pulling mechanism for semiconductor packaging of an intelligent power module according to claim 2, characterized in that: The inner wall of the installation groove (501) fits with the outer wall of the installation seat (503), and the inner wall of the fixing groove (502) fits with the outer wall of the bottom of the fixing frame (509).

5. The core pulling mechanism for semiconductor packaging of an intelligent power module according to claim 2, characterized in that: The outer wall of the fixing frame (509) is provided with a first threaded hole, and the first threaded hole matches the first threaded rod (512).

6. The core pulling mechanism for semiconductor packaging of an intelligent power module according to claim 2, characterized in that: The inner wall of the connecting frame (505) fits in with the outer wall of the connecting rod (504), and the inner wall of the connecting seat (506) fits in with the outer wall of the connecting rod (504).

7. The core pulling mechanism for semiconductor packaging of an intelligent power module according to claim 2, characterized in that: The top outer wall of the fixing frame (509) fits with the inner wall of the vertical groove (507), and the inner wall of the clamping groove (510) fits with the outer wall of the clamping block (508).

8. The core pulling mechanism for semiconductor packaging of an intelligent power module according to claim 3, characterized in that: A square groove is formed at the top of the lower pressing frame (613), the inner wall of the square groove is in contact with the outer wall of the vertical plate (612), and the inner wall of the limiting frame (614) is in contact with the outer wall of the positioning plate (610).

9. The core pulling mechanism for semiconductor packaging of an intelligent power module according to claim 3, characterized in that: An outer wall at one end of the insert block (606) fits into an inner wall of the annular groove (601).

10. The core pulling mechanism for semiconductor packaging of intelligent power module according to claim 3, characterized in that: The bottom outer wall of the displacement seat (603) fits with the inner wall of the displacement groove (602), and a second threaded hole is formed on the outer wall of the displacement seat (603), and the second threaded hole matches the second threaded rod (605).

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