Wafer chuck mechanism with lifting and rotating functions

Abstract

The invention belongs to the technical field of semiconductor processing, and relates to a wafer chuck mechanism with lifting and rotating functions, which comprises a carrying base movably connected to a carrying connecting plate; a lifting platform is connected to the carrying base in a sliding mode. The lifting platform further comprises a lifting supporting column which is rotationally connected to the lifting platform. The upper portion of the lifting supporting column movably penetrates through the carrying base. The lower end of the lifting supporting column is connected with the rotating unit, and the upper end of the lifting supporting column is connected with the vacuum suction cup unit. The middle of the lifting supporting column is rotationally connected to the carrying base. A vacuum shaft mounting plate is movably arranged at the upper part of the lifting support column in a penetrating manner; a vacuum hollow shaft is connected to the vacuum shaft mounting plate; the carrying base is connected with a vacuum shaft lifting unit. After the structure is adopted, the beneficial effects are that the wafer chuck can move left and right, lift up and down and rotate by 360 degrees, and wafers can be better applied to different working procedures.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a wafer chuck mechanism with lifting and rotating functions. Background Art

[0002] With the advancement of semiconductor technology, the requirements for product performance are getting higher and higher, and new packaging processes are constantly emerging. When the wafer comes out of the wafer manufacturing plant, the thickness is relatively thick. Due to the requirements for the package size, the wafer will be thinned during packaging to adapt to a smaller package size. In order to protect the circuit layer of the wafer when the wafer is thinned, a film will be attached to the circuit layer of the wafer to protect the wafer from scratches and contamination during thinning and grinding. After the wafer is thinned, this protective film needs to be removed, and the wafer must not be damaged during removal.

[0003] The wafer must be fixed before film removal. The existing wafer chuck can only be raised and lowered, but cannot be moved left and right or rotated 360 degrees, and cannot be applied to more processing procedures. Therefore, it is necessary to make improvements. Summary of the invention

[0004] In order to solve the above problems in the prior art, the present invention provides a wafer chuck mechanism with lifting and rotating functions.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] As one aspect of the present invention, a wafer chuck mechanism with lifting and rotating functions is provided, which comprises: a transport base, the transport base is movably connected to a transport connecting plate; a lifting platform is slidably connected to the transport base;

[0007] It also includes a lifting support column, which is rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the handling base; the lower end of the lifting support column is connected to the rotating unit, and the upper end of the lifting support column is connected to a vacuum suction cup unit for adsorbing wafers; the middle part of the lifting support column is rotatably connected to the handling base, and the lifting support column can rotate relative to the handling base;

[0008] A vacuum shaft mounting plate is movably provided on the upper part of the lifting support column, and at least one vacuum hollow shaft is connected to the vacuum shaft mounting plate, and a channel is provided in the vacuum hollow shaft; one end of the vacuum hollow shaft is connected to the vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft is movably passed through the suction cup mounting block, the chuck mounting plate and the wafer chuck in sequence, and then connected to the vacuum suction cup;

[0009] The transport base is connected with a vacuum shaft lifting unit for driving the vacuum shaft mounting plate to rise and fall.

[0010] As an option, the transport base is connected with a lifting guide rail, the lifting guide rail is connected with a lifting slider, and the lifting platform is connected to the lifting slider; the lifting platform is lifted up and down on the transport base; a lifting screw is rotatably connected to the transport base, and both ends of the lifting screw are rotatably connected to the transport base through bearing seats; a lifting nut is threadedly connected to the lifting screw, and the lifting platform is connected to the lifting nut; one end of the lifting screw is connected to a lifting driven wheel, the transport base is connected to a lifting motor, the movable end of the lifting motor is connected to a lifting driving wheel, and a lifting synchronous belt is connected between the lifting driving wheel and the lifting driven wheel;

[0011] The rotating unit comprises a rotating motor arranged on the lifting platform, the movable end of the rotating motor is connected to a rotating driving wheel, the lower end of the lifting support column is connected to a rotating driven wheel, and the rotating driving wheel and the rotating driven wheel are connected through a rotating synchronous belt.

[0012] Optionally, the vacuum suction cup unit includes a suction cup mounting block connected to the upper end of the lifting support column, the suction cup mounting block is connected to a chuck mounting plate, the chuck mounting plate is connected to a wafer chuck; an adsorption layer is connected to the surface of the wafer chuck.

[0013] As an option, the adsorption layer is made of a porous ceramic material.

[0014] Optionally, a heating groove is provided at the bottom of the chuck mounting plate, a heating ring is connected in the heating groove, and a heating ring baffle is provided at the bottom of the chuck mounting plate, which presses and fixes the heating ring.

[0015] Optionally, a stop ring for limiting the position of the vacuum shaft mounting plate is provided on the lifting support column.

[0016] Optionally, a mounting bushing is also included, wherein the mounting bushing is connected to the suction cup mounting block, and the vacuum hollow shaft movably passes through the mounting bushing.

[0017] Optionally, the vacuum shaft lifting unit includes a vacuum shaft lifting portion arranged on a handling base; a movable end of the vacuum shaft lifting portion is connected to a vacuum shaft lifting block, and the vacuum shaft lifting block is located below a vacuum shaft mounting plate.

[0018] As an option, a transport guide rail is provided on the transport connecting plate, a transport slider is slidably connected to the transport guide rail, and the transport base is connected to the transport slider; the transport base can move relative to the transport connecting plate through the cooperation between the transport slider and the transport guide rail; a transport screw is rotatably connected to the transport connecting plate, and both ends of the transport screw are rotatably connected to the transport connecting plate through transport bearing seats; one end of the transport screw is connected to the movable end of the transport motor provided on the transport connecting plate, a transport nut is threadedly connected to the transport screw, and the transport base is connected to the transport nut.

[0019] Optionally, the axial direction of the transport screw is parallel to the moving direction of the transport guide rail.

[0020] The beneficial effects of the wafer chuck mechanism with lifting and rotating functions of the present invention are specifically embodied in the following aspects: 1. The wafer chuck can move left and right, lift up and down, and rotate 360°, so that the wafer can be better used in different processes. 2. The adsorption layer of the wafer chuck is made of porous ceramic material, which can better adsorb the wafer, increase the adsorption force, and can also effectively prevent the wafer from warping and improve the flatness of the wafer. 3. There is a heating ring under the wafer chuck, which can heat the wafer film, making the film soft, so that it is easier to peel off from the wafer surface, thereby improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings in the specification, which constitute a part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0022] Figure 1 It is a structural stereogram of a wafer chuck mechanism with lifting and rotating functions of the present invention;

[0023] Figure 2 It is a bottom view of the structure of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0024] Figure 3 It is a structural front view of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0025] Figure 4 It is a structural side view of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0026] Figure 5 It is a rear view of the structure of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0027] Figure 6 It is a structural cross-sectional view of a wafer chuck mechanism with lifting and rotating functions of the present invention;

[0028] Figure 7It is a structural cross-sectional view of the vacuum suction cup unit of the present invention;

[0029] Figure 8 It is a structural cross-sectional view of the vacuum shaft lifting unit of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] An embodiment of the present application provides a wafer chuck mechanism with lifting and rotating functions, such as Figure 1-Figure 8 As shown, it comprises: a transport base 41, the transport base 41 is connected to a transport connecting plate 42; a transport guide rail 43 is provided on the transport connecting plate 42, a transport slider 44 is slidably connected to the transport guide rail 43, and the transport base 41 is connected to the transport slider 44; the transport base 41 can move relative to the transport connecting plate 42 through the cooperation of the transport slider 44 and the transport guide rail 43; a transport screw 45 is rotatably connected to the transport connecting plate 42, and the axial direction of the transport screw 45 is parallel to the moving direction of the transport guide rail 43; both ends of the transport screw 45 They are rotatably connected to the transport connecting plate 42 through the transport bearing seat 46 respectively; one end of the transport screw 45 is connected to the movable end of the transport motor 47 provided on the transport connecting plate 42, and a transport nut 48 is threadedly connected to the transport screw 45, and the transport base 41 is connected to the transport nut 48. When the transport motor 47 works, it drives the transport screw 45 to rotate relative to the transport connecting plate 42, so that the transport nut 48 moves on the transport screw 45, thereby realizing the transport base 41 connected to the transport nut 48 to move on the transport connecting plate 42;

[0032] The transport base 41 is slidably connected with a lifting platform 49, the transport base 41 is connected with a lifting guide rail 410, the lifting guide rail 410 is connected with a lifting slider 411, and the lifting platform 49 is connected to the lifting slider 411; the lifting platform 49 is lifted up and down on the transport base 41 by the cooperation between the lifting guide rail 410 and the lifting slider 411; the transport base 41 is rotatably connected with a lifting screw rod 412, and the two ends of the lifting screw rod 412 are rotatably connected to the transport base 41 through bearing seats; the lifting screw rod 412 is threadedly connected with a lifting nut member 413, and the lifting platform 49 is connected to the lifting nut member 413 One end of the lifting screw rod 412 is connected to a lifting driven wheel 414, and a lifting motor 415 is connected to the transport base 41, and a lifting driving wheel 416 is connected to the movable end of the lifting motor 415, and a lifting synchronous belt 417 is connected between the lifting driving wheel 416 and the lifting driven wheel 414. When the lifting motor 415 works, it drives the lifting driving wheel 416 to rotate, and the lifting driving wheel 416 drives the lifting driven wheel 414 to work synchronously through the lifting synchronous belt 417, and the lifting driven wheel 414 drives the lifting screw rod 412 to rotate, and the lifting screw rod 412 drives the lifting nut 413 to move, thereby realizing the lifting platform 49 to be lifted up and down relative to the transport base 41;

[0033] It also includes a lifting support column 418, which is rotatably connected to the lifting platform 49; the upper part of the lifting support column 418 moves through the handling base 41; the lower end of the lifting support column 418 is connected to the rotating unit 419, and the upper end of the lifting support column 418 is connected to a vacuum suction cup unit 420 for adsorbing wafers; the middle part of the lifting support column 418 is rotatably connected to the handling base 41 through a bearing, and the lifting support column 418 can rotate relative to the handling base 41;

[0034] The rotating unit 419 includes a rotating motor 421 disposed on the lifting platform 49, the movable end of the rotating motor 421 is connected to a rotating driving wheel 422, the lower end of the lifting support column 418 is connected to a rotating driven wheel 423, and the rotating driving wheel 422 and the rotating driven wheel 423 are connected via a rotating synchronous belt 424; the rotating motor 421 works to drive the rotating driving wheel 422 to rotate, and the rotating driving wheel 422 drives the rotating driven wheel 423 to work via the rotating synchronous belt 424, thereby realizing the lifting support column 418 to rotate relative to the transport base 41;

[0035] like Figure 7As shown, the vacuum suction cup unit 420 includes a suction cup mounting block 425 connected to the upper end of the lifting support column 418, the suction cup mounting block 425 is connected to a chuck mounting plate 426, and the chuck mounting plate 426 is connected to a wafer chuck 427; an adsorption layer 428 is connected to the surface of the wafer chuck 427, and the adsorption layer 428 is made of a porous ceramic material, and the porous ceramic material has densely distributed pores, which can better adsorb the wafer and increase the adsorption force;

[0036] A heating groove is provided at the bottom of the chuck mounting plate 426, a heating ring 429 is connected to the heating groove, a heating ring baffle 430 is provided at the bottom of the chuck mounting plate 426, and the heating ring baffle 430 presses and fixes the heating ring 429; after the wafer is heated by the heating ring 429, it is more convenient to tear the wafer film;

[0037] A vacuum shaft mounting plate 431 is movably provided on the upper part of the lifting support column 418, and at least one vacuum hollow shaft 432 is connected to the vacuum shaft mounting plate 431, and a channel is provided in the vacuum hollow shaft 432; one end of the vacuum hollow shaft 432 is connected to the vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft 432 is movably passed through the suction cup mounting block 425, the chuck mounting plate 426 and the wafer chuck 427 in sequence, and then connected to a vacuum suction cup 433, and the suction port of the vacuum suction cup 433 is slightly higher than the surface of the wafer chuck 427, so as to facilitate the suction of the wafer; a stop ring 434 for limiting the vacuum shaft mounting plate 431 is provided on the lifting support column 418 to prevent the vacuum shaft mounting plate 431 from falling onto the moving base 41;

[0038] It also includes a mounting bushing 435, which is connected to the suction cup mounting block 425, and the vacuum hollow shaft 432 moves through the mounting bushing 435, and the mounting bushing 435 protects the vacuum hollow shaft 432, making the vacuum hollow shaft 432 more stable during the lifting process;

[0039] The transfer base 41 is connected to a vacuum shaft lifting unit 436 for driving the vacuum shaft mounting plate 431 to move up and down. Figure 8 As shown, the vacuum shaft lifting unit 436 includes a vacuum shaft lifting part 437 arranged on the conveying base 41, and the vacuum shaft lifting part 437 is a motor or a cylinder, which will not be repeated; the movable end of the vacuum shaft lifting part 437 is connected to a vacuum shaft lifting block 438, and the vacuum shaft lifting block 438 is located below the vacuum shaft mounting plate 431. The vacuum shaft lifting part 437 moves to drive the vacuum shaft lifting block 438 to rise or fall, thereby making the vacuum hollow shaft 432 rise or return to the initial position relative to the wafer chuck 427; the vacuum suction cup 433 is driven by the vacuum shaft lifting unit 436 to remove the sucked wafer from the wafer chuck 427, so as to facilitate subsequent operations.

[0040] The transport robot unit transports the wafer to the wafer chuck 427 to adsorb the wafer and perform film tearing.

[0041] The wafer chuck mechanism with lifting and rotating functions of the present application has the following beneficial effects: 1. The wafer chuck can move left and right, lift up and down, and rotate 360°, so that the wafer can be better used in different processes. 2. The adsorption layer of the wafer chuck is made of porous ceramic material, which can better adsorb the wafer, increase the adsorption force, and effectively prevent the wafer from warping and improve the flatness of the wafer. 3. There is a heating ring under the wafer chuck, which can heat the wafer film, making the film soft, so that it is easier to peel off from the wafer surface, thereby improving processing efficiency.

[0042] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0043] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0044] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0045] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0046] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. A wafer chuck mechanism with lifting and rotating functions, characterized in that: It includes: A transport base, the transport base is movably connected to the transport connecting plate; a lifting platform is slidably connected to the transport base; It also includes a lifting support column, which is rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the handling base; the lower end of the lifting support column is connected to the rotating unit, and the upper end of the lifting support column is connected to a vacuum suction cup unit for adsorbing wafers; the middle part of the lifting support column is rotatably connected to the handling base, and the lifting support column can rotate relative to the handling base; A vacuum shaft mounting plate is movably provided on the upper part of the lifting support column, and at least one vacuum hollow shaft is connected to the vacuum shaft mounting plate, and a channel is provided in the vacuum hollow shaft; one end of the vacuum hollow shaft is connected to the vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft is movably passed through the suction cup mounting block, the chuck mounting plate and the wafer chuck in sequence, and then connected to the vacuum suction cup; The transport base is connected with a vacuum shaft lifting unit for driving the vacuum shaft mounting plate to rise and fall.

2. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: The transport base is connected with a lifting guide rail, the lifting guide rail is connected with a lifting slider, and the lifting platform is connected to the lifting slider; the lifting platform is lifted up and down on the transport base; a lifting screw is rotatably connected to the transport base, and both ends of the lifting screw are rotatably connected to the transport base through bearing seats; a lifting nut is threadedly connected to the lifting screw, and the lifting platform is connected to the lifting nut; one end of the lifting screw is connected to a lifting driven wheel, the transport base is connected with a lifting motor, the movable end of the lifting motor is connected to a lifting driving wheel, and a lifting synchronous belt is connected between the lifting driving wheel and the lifting driven wheel; The rotating unit comprises a rotating motor arranged on the lifting platform, the movable end of the rotating motor is connected to a rotating driving wheel, the lower end of the lifting support column is connected to a rotating driven wheel, and the rotating driving wheel and the rotating driven wheel are connected through a rotating synchronous belt.

3. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 2, characterized in that: The vacuum suction cup unit comprises a suction cup mounting block connected to the upper end of the lifting support column, the suction cup mounting block is connected to a chuck mounting plate, the chuck mounting plate is connected to a wafer chuck; and an adsorption layer is connected to the surface of the wafer chuck.

4. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 3, characterized in that: The adsorption layer is made of porous ceramic material.

5. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 3, characterized in that: A heating groove is provided at the bottom of the chuck mounting plate, a heating ring is connected in the heating groove, and a heating ring baffle is provided at the bottom of the chuck mounting plate, which presses and fixes the heating ring.

6. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: The lifting support column is provided with a stop ring for limiting the position of the vacuum shaft mounting plate.

7. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: It also includes a mounting bushing, which is connected to the suction cup mounting block, and the vacuum hollow shaft movably passes through the mounting bushing.

8. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: The vacuum shaft lifting unit comprises a vacuum shaft lifting part arranged on a handling base; a movable end of the vacuum shaft lifting part is connected with a vacuum shaft lifting block, and the vacuum shaft lifting block is located below a vacuum shaft mounting plate.

9. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: The transport connecting plate is provided with a transport guide rail, and a transport slider is slidably connected to the transport guide rail, and the transport base is connected to the transport slider; the transport base can move relative to the transport connecting plate through the cooperation of the transport slider and the transport guide rail; a transport screw is rotatably connected to the transport connecting plate, and both ends of the transport screw are rotatably connected to the transport connecting plate through a transport bearing seat; one end of the transport screw is connected to the movable end of the transport motor provided on the transport connecting plate, a transport nut is threadedly connected to the transport screw, and the transport base is connected to the transport nut.

10. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 9, characterized in that: The axial direction of the conveying lead screw is parallel to the moving direction of the conveying guide rail.

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