Laser drilling machine for PCB machining

Abstract

The invention discloses a laser drilling machine for PCB machining. The laser drilling machine comprises a PCB suction device. The PCB suction device comprises a plurality of suction nozzles, each suction nozzle comprises an adapter tube and a suction cup arranged at the tail end of the adapter tube, and a partition plate is fixedly arranged on the inner wall of each suction cup and divides the inner space of each suction cup into a negative pressure area close to the adapter tube side and an adsorption area away from the adapter tube side. A plurality of through holes communicated with the negative pressure area and the adsorption area are formed in the partition plate at intervals. According to the laser drilling machine for PCB machining, on the premise that the diameter of the adapter is not reduced, it is guaranteed that the suction nozzle can provide enough negative pressure, the laser drilling machine is suitable for PCBs of various sizes and specifications, and the problem that the PCBs deform due to the suction nozzle can be effectively solved.

Description

Technical Field

[0001] The invention belongs to the technical field of printed circuit board processing equipment, and specifically relates to a laser drilling machine for PCB board processing. Background Art

[0002] Laser drilling is the main processing method for micro-vias in PCB boards. The laser energy generated by the laser drilling machine ablates the material to be processed to form a blind hole shape with a semi-enclosed space, preparing for the subsequent process of small hole metallization to connect the adjacent two layers of circuits.

[0003] The board suction device is one of the main components of the laser drilling machine, which is used to absorb and transfer PCB boards. The main component of the board suction device is a suction nozzle, which includes an adapter and a suction cup arranged at the end of the adapter. The conventional suction nozzle has a fixed position diameter of 15mm, and can only be installed with a large suction nozzle with an inner diameter of 13mm, which leads to problems such as deformation of the PCB board, abnormal blind hole shape, and offset holes when making a PCB board with a thickness of 0.5mm. In order to solve this problem, the related technology CN203045162U discloses a suction nozzle group adapter, a board suction device, a board collecting machine, a board throwing machine and a laser drilling machine, which reduces the adapter diameter of the suction nozzle, and solves the problem of plate deformation caused by the suction nozzle to a certain extent. However, there is also a problem that the diameter of the adapter is too small and the negative pressure adsorption force that can be generated is reduced, making the laser drilling machine unsuitable for processing PCB boards with a larger area.

[0004] Therefore, there can be a new solution to the problem of sheet deformation caused by the suction nozzle during the suction process. Summary of the invention

[0005] The object of the present invention is to provide a laser drilling machine for PCB board processing which has good adaptability to the size of the PCB board to be processed and is not prone to causing deformation of the board.

[0006] The present invention provides a laser drilling machine for PCB board processing, and the specific technical solutions provided are as follows:

[0007] A laser drilling machine for PCB board processing includes a PCB board suction device; the PCB board suction device includes a plurality of suction nozzles, the suction nozzles include a transfer tube and a suction cup arranged at the end of the transfer tube, a partition plate is fixedly arranged on the inner wall of the suction cup, and the partition plate divides the internal space of the suction cup into a negative pressure area close to the transfer tube side and an adsorption area away from the transfer tube side; the partition plate is provided with a plurality of through holes connecting the negative pressure area and the adsorption area at intervals.

[0008] By adopting the above technical solution, the suction nozzle can provide sufficient negative pressure without reducing the diameter of the transfer tube, which is suitable for PCB boards of various sizes. When the suction nozzle is used to suck thinner PCB boards, the presence of the partition plate limits the possibility of the board sinking into the inside of the large-diameter suction cup and the suction cup itself deforming. At the same time, the setting of several through holes can divide the inner cavity of the suction cup into several small negative pressure cavities, which makes the force on the PCB board more uniform and is less likely to cause deformation of the PCB board due to the suction nozzle.

[0009] Furthermore, the through hole is in the shape of a square, a regular hexagon or a regular triangle.

[0010] Furthermore, the partition plate and the suction cup are integrally formed.

[0011] Furthermore, at least two partition plates are provided, and the shapes of the through holes of adjacent partition plates are the same or different.

[0012] Furthermore, the diameter of the through hole gradually increases from the rotating tube toward the suction cup opening.

[0013] Furthermore, the partition plate is a flat plate or an arc-shaped plate that bulges toward the side away from the transfer tube. The arc-shaped partition plate has better anti-deformation ability and is more conducive to exerting its function of inhibiting plate deformation.

[0014] Furthermore, the diameter of the end of the suction cup that contacts the PCB plate is 4-10 mm.

[0015] Furthermore, the suction cup includes an integrally formed cylindrical section, a conical section and a connecting section, and the adapter tube is connected to the connecting section of the suction cup; the conical section is located between the cylindrical section and the connecting section, and the inner diameter of the conical section gradually increases from the connecting section to the cylindrical section; the partition plates are all arranged in the conical section of the suction cup.

[0016] Furthermore, the length of the cylindrical section is 1 / 10 to 1 / 4 of the length of the conical section. "Length" refers to the length of the "cylindrical section / conical section / connecting section" in the direction of the central axis of the suction cup.

[0017] Furthermore, a pleated skirt is provided at the periphery of the opening of the suction cup, which is beneficial to reducing the impact when sucking the plate and plays a protective role on the plate.

[0018] Furthermore, an end of the adapter tube away from the suction cup is provided with an external thread, so that the suction nozzle can be easily installed.

[0019] Furthermore, a convex ring is provided on the outer wall of one end of the adapter tube connected to the connection section of the suction cup, and a locking nut is threadedly connected to the adapter tube; the connection section of the suction cup is sleeved on the adapter tube and located between the locking nut and the convex ring. In this way, the connection reliability between the suction cup and the adapter tube can be increased, and it is not easy to leak or cause the suction cup to loosen.

[0020] Furthermore, a supporting component located in the inner space of the suction cup is fixedly provided between the transfer tube and the partition plate, which further increases the anti-deformation ability of the partition plate itself and helps it to play a role in suppressing plate deformation.

[0021] Furthermore, the support component includes a connection ring threadedly connected to the adapter tube and a plurality of support rods, one end of the support rod is fixed to the connection ring and the other end extends to the partition plate; the end of the support rod away from the connection ring is fixed to the partition plate or abuts against the partition plate. This type of support component can provide sufficient support force for the partition plate, increase its anti-deformation ability, and facilitate its function of inhibiting plate deformation.

[0022] Furthermore, the end of the support rod is fixed to the partition plate, and the partition plate and the suction cup are detachably arranged.

[0023] Furthermore, the connecting ring forms a convex ring on the outer wall of the connecting tube that abuts against the connecting section of the suction cup.

[0024] The present invention has the following beneficial effects:

[0025] 1. The present invention sets a partition plate with through holes evenly distributed on the inner side of the suction cup, and uses the partition plate to divide the internal space of the suction cup into a number of smaller air cavities, which can provide uniform adsorption force. At the same time, due to the existence of the partition plate, the concave deformation of the thinner PCB board can be suppressed. Under the premise of not reducing the diameter of the transfer tube and significantly reducing the adsorption force, the deformation of the adsorbed board can be suppressed, so that the laser drilling machine is suitable for micro-guide hole processing of PCB boards of various thicknesses and area specifications;

[0026] 2. The present invention further arranges a supporting component between the partition plate and the transfer tube, which further improves the anti-deformation ability of the suction cup itself, and can effectively suppress the deformation of the adsorbed plate without reducing the adsorption force. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of a laser drilling machine for PCB board processing in Example 1;

[0028] Figure 2 It is a structural schematic diagram of the plate suction device (partial structure) in Example 1;

[0029] Figure 3 for Figure 2 A magnified view of part A;

[0030] Figure 4 Schematic diagram of the structure of the nozzle in Example 1 (front view);

[0031] Figure 5 is a cross-sectional view of the nozzle in Example 1;

[0032] Figure 6 for Figure 5 A magnified view of part B;

[0033] Figure 7 Schematic diagram of the structure of the nozzle in Example 1 (viewed from above);

[0034] Figure 8 is a cross-sectional view of the suction cup and the partition plate in Example 2;

[0035] Fig. 9 is a cross-sectional view of the nozzle in Example 3;

[0036] Fig.10 for Fig. 9 Enlarged view of part C;

[0037] Fig.11 is a cross-sectional view of the suction cup and the partition plate in Example 4;

[0038] Fig.12 is a schematic diagram of the structure of the partition plate in Example 5;

[0039] Fig.13 This is a cross-sectional view of the partition plate in Example 5.

[0040] Description of reference numerals:

[0041] 1. Laser drilling room; 2. Automatic board placement room; 21. Automatic board placement trolley; 3. Automatic board collection room; 31. Automatic board collection trolley; 4. PCB board suction device; 41. Base plate; 42. Vacuum generator; 5. Suction nozzle; 51. Adapter tube; 511. Convex ring; 512. Locking nut; 52. Suction cup; 521. Cylindrical section; 522. Conical section; 523. Connecting section; 524. Negative pressure area; 525. Adsorption area; 526. Pleated skirt; 53. Partition plate; 531. Through hole; 54. Support component; 541. Connecting ring; 542. Support rod. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0043] A laser drilling machine for PCB board processing, refer to Figure 1, which includes an automatic board placing chamber 2, a laser drilling chamber 1 and an automatic board collecting chamber 3 which are arranged in sequence. An automatic board placing vehicle 21 is arranged below the automatic board placing chamber 2, and a PCB board suction device 4 (not shown in the figure) is arranged inside. The automatic board placing vehicle 21 is used to provide the PCB board to be processed, and the PCB board suction device 4 is used to absorb the PCB board to be processed and transfer it to the laser drilling chamber 1; inside the laser drilling chamber 1, the light beam emitted by the drilling machine etches micro-guide holes on the surface of the PCB board; an automatic board collecting vehicle 31 is arranged below the automatic board collecting chamber 3, and a PCB board suction device 4 (not shown in the figure) is also arranged inside. The PCB after the micro-guide hole processing in the laser drilling chamber 1 is sucked by the PCB board suction device 4 and transferred to the automatic board collecting vehicle 31.

[0044] Reference Figure 2 and Figure 3 , the PCB board suction device 4 includes a vacuum generator 42 (not shown in the figure), a base plate 41 and a plurality of suction nozzles 5 installed on the base plate 41. The vacuum generator 42 is used to provide negative pressure to generate suction; the base plate 41 is used to install the suction nozzles 5, which can be moved under the action of a moving mechanism (not shown in the figure) to transfer the position of the PCB board; the suction nozzles 5 are arranged in a rectangular array on the base plate 41, and each suction nozzle 5 is connected to the vacuum generator 42 through a pipeline (not shown in the figure). The suction nozzle 5 includes a transfer tube 51 and a suction cup 52 connected to the transfer tube 51; the transfer tube 51 is provided with an external thread at one end away from the suction cup 52, and is threadedly connected to the base plate 41 through the external thread. The principles of how to realize micro-guide hole processing, how to place the board, how to collect the board, and how to drive the PCB board suction device 4 to move and transfer the board through the moving mechanism of the laser drilling machine are all well known to those skilled in the art, and the structure / construction to realize the relevant principles is also well known, which does not involve the solution of the technical problem of the present invention and will not be repeated here.

[0045] In order to solve the problem of plate deformation when sucking the plate, the present invention focuses on improving the suction nozzle 5 of the PCB board suction device 4. The improved points of the present invention are further explained in combination with various embodiments.

[0046] [Example 1]

[0047] Reference Figure 4 and Figure 5 The suction nozzle 5 includes a transfer tube 51 and a suction cup 52. The suction cup 52 is made of a rubber material, such as silicone rubber, and has a certain elastic deformation ability. The suction cup 52 includes a cylindrical section 521, a conical section 522 and a connecting section 523, the apertures of which decrease successively. The cylindrical section 521 is used to contact the plate to be adsorbed, and its aperture is 4-10mm, which can be selected according to actual processing needs; the length of the cylindrical section is 1 / 10 to 1 / 4 of the length of the conical section. In this embodiment, the length of the cylindrical section is 1 / 4 of the length of the conical section; the conical caliber gradually increases from the connecting section 523 to the cylindrical section 521, forming an inverted funnel shape.

[0048] Reference Figure 5 and Figure 6 The connecting section 523 is in the shape of a circular tube, and its inner hole includes two stepped sections, and the inner diameter of the part close to the tapered section 522 is larger than the inner diameter of the part away from the tapered section 522. A convex ring 511 is provided on the outer wall of one end of the transfer tube 51 close to the tapered section 522, and the connecting section 523 of the suction cup 52 is sleeved on the transfer tube 51, and the convex ring 511 is clamped into the part where the inner diameter of the connecting section 523 of the suction cup 52 changes; a locking nut 512 is threadedly connected on the transfer tube 51, and the connecting section 523 of the suction cup 52 is clamped and installed between the locking nut 512 and the convex ring 511, so that the suction cup 52 and the transfer tube 51 can be firmly connected, and it is not easy to loosen or leak.

[0049] Reference Figure 5 and Figure 7 A partition plate 53 is integrally formed in the conical section 522 of the suction cup 52, and the partition plate 53 is arranged perpendicular to the central axis of the transfer tube 51. The partition plate 53 is circular, and its periphery is fixedly connected to the inner wall of the suction cup 52, dividing the inner space of the suction cup 52 into a negative pressure area 524 close to the transfer tube 51 side and an adsorption area 525 away from the transfer tube 51 side.

[0050] Reference Figure 5 and Figure 7 In this embodiment, the partition plate 53 is evenly distributed with a number of through holes 531 in the shape of a regular hexagon, and the through holes 531 connect the negative pressure area 524 and the adsorption area 525 of the suction cup 52. The partition plate 53 with evenly distributed through holes 531 divides the internal space of the suction cup 52 into a number of smaller independent air cavities, and the negative effect of reducing the overall adsorption force of the suction cup 52 is not obvious. On the one hand, it can support the suction cup 52 itself, inhibit the excessive deformation of the suction cup 52, and ensure that there is sufficient adsorption force when adsorbing the PCB board; on the other hand, the existence of the partition plate 53 can inhibit the concave deformation of the thinner PCB board to a certain extent, which is conducive to inhibiting the deformation of the PCB board when adsorbing the plate, and is suitable for the processing of PCB boards of various thicknesses and area specifications.

[0051] In other embodiments, two or more partition plates 53 may be arranged in parallel; the shape of the through hole 531 may be circular, square, triangular, etc.; and, while ensuring that the negative pressure area 524 and the adsorption area 525 are connected, the shapes of the through holes 531 on two adjacent layers of partition plates 53 may be the same or different.

[0052] [Example 2]

[0053] Reference Figure 8 This embodiment is based on the embodiment 1, and the difference is that the diameter of the through hole 531 gradually increases toward the opening side of the suction cup 52.

[0054] [Example 3]

[0055] Reference Fig. 9 and Fig.10 This embodiment is based on the embodiment 1, and the difference is that in order to give full play to the role of the partition plate 53 in suppressing the deformation of the adsorption plate, a supporting component 54 is further provided between the transfer tube 51 and the partition plate 53 in this embodiment.

[0056] Reference Fig. 9 and Fig.10 The supporting member 54 includes a connecting ring 541 and a plurality of supporting rods 542 fixed to the connecting ring 541. The connecting ring 541 is threadedly connected to the transfer tube 51; the partition plate 53 and the suction cup 52 are detachably arranged, and the end of the supporting rod 542 away from the connecting ring 541 is fixed to the partition plate 53; the periphery of the partition plate 53 is in airtight contact with the inner wall of the suction cup 52. In this way, the suction cup 52 and the partition plate 53 can be processed and assembled more conveniently. If necessary, the suction cup 52 and the partition plate 53 can also be bonded / welded to form an integrated structure after assembly.

[0057] In other embodiments, the convex ring 511 may be replaced by a connecting ring 541. That is, the convex ring 511 is not provided on the transfer tube 51, and the connecting section 523 of the suction cup 52 is securely installed by means of the locking nut 512 and the connecting ring 541. The locking nut 512 and the connecting ring 541 are both threadedly connected to the transfer tube 51, and the connecting section 523 of the suction cup 52 is sandwiched between the two, so as to prevent loosening and air leakage.

[0058] [Example 4]

[0059] Reference Fig.11 This embodiment is based on the embodiment 3, and the difference is that the partition plate 53 is a spherical arc panel, which protrudes toward the opening side of the suction cup 52. Compared with the flat partition plate 53, this type of arc panel has better anti-deformation ability and is more conducive to its role in suppressing the deformation of the adsorption plate.

[0060] At the same time, in order to reduce the impact on the PCB board, a pleated skirt 526 is also provided at the opening of the suction cup 52.

[0061] [Example 5]

[0062] Reference Fig.12 and Fig.13 This embodiment is based on the embodiment 3, and the difference is that the partition plate 53 is in the shape of a disk, which is wavy from the center to the outside, forming a number of concentric annular ridges, and its cross section is wavy. Compared with the curved panel, the partition plate 53 of this shape has better anti-deformation ability, which is more conducive to its role in suppressing the deformation of the adsorption plate.

[0063] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A laser drilling machine for PCB board processing, comprising a PCB board suction device (4); the PCB board suction device (4) comprises a plurality of suction nozzles (5), the suction nozzles (5) comprise a transfer tube (51) and a suction cup (52) arranged at the end of the transfer tube (51), characterized in that: A partition plate (53) is fixedly arranged on the inner wall of the suction cup (52), and the partition plate (53) divides the internal space of the suction cup (52) into a negative pressure area (524) close to the transfer tube (51) and an adsorption area (525) away from the transfer tube (51); a plurality of through holes (531) are arranged at intervals on the partition plate (53) to connect the negative pressure area (524) and the adsorption area (525).

2. The laser drilling machine for PCB board processing according to claim 1, characterized in that: The through hole (531) is in the shape of a circle, a square, a regular hexagon or a regular triangle.

3. The laser drilling machine for PCB board processing according to claim 1, characterized in that: The partition plate (53) and the suction cup (52) are integrally formed.

4. The laser drilling machine for PCB board processing according to any one of claims 1 to 3, characterized in that: At least two partition plates (53) are arranged in parallel, and the shapes of the through holes (531) on adjacent partition plates (53) are the same or different.

5. The laser drilling machine for PCB board processing according to any one of claims 1 to 3, characterized in that: The diameter of the end of the suction cup (52) that contacts the PCB plate is 4-10 mm.

6. The laser drilling machine for PCB board processing according to any one of claims 1 to 3, characterized in that: Furthermore, the suction cup (52) comprises an integrally formed cylindrical section (521), a conical section (522) and a connecting section (523); the adapter tube (51) is connected to the connecting section (523) of the suction cup (52); the conical section (522) is located between the cylindrical section (521) and the connecting section (523), and the inner diameter of the conical section (522) gradually increases from the connecting section (523) to the cylindrical section (521); and the partition plates (53) are all arranged on the conical section (522) of the suction cup (52).

7. The laser drilling machine for PCB board processing according to any one of claims 1 to 3, characterized in that: An end of the transfer tube (51) away from the suction cup (52) is provided with an external thread.

8. The laser drilling machine for PCB board processing according to any one of claims 1 to 3, characterized in that: The PCB board suction device (4) comprises a vacuum generator (42) and a base plate (41), and a plurality of suction nozzles (5) are mounted on the base plate (41), and the suction nozzles (5) are connected to the vacuum generator (42).

9. The laser drilling machine for PCB board processing according to any one of claims 1 to 3, characterized in that: A supporting component (54) located in the inner space of the suction cup (52) is fixedly arranged between the transfer tube (51) and the partition plate (53).

10. The laser drilling machine for PCB board processing according to claim 9, characterized in that: The support component (54) comprises a connecting ring (541) threadedly connected to the transfer tube (51) and a plurality of supporting rods (542); one end of the supporting rod (542) is fixed to the connecting ring (541) and the other end extends to the partition plate (53); one end of the supporting rod (542) away from the connecting ring (541) is fixed to the partition plate (53) or abuts against the partition plate (53).

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